CN115341161A - Copper-aluminum alloy target material and preparation method and application thereof - Google Patents
Copper-aluminum alloy target material and preparation method and application thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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Abstract
The invention provides a copper-aluminum alloy target material and a preparation method and application thereof.A copper-aluminum alloy target blank is sequentially subjected to preheating, three-dimensional forging, heat treatment, cold pressing, cold rolling and leveling to obtain a copper-aluminum alloy target material; the three-way forging comprises a first forging in the X-axis direction, a second forging in the Y-axis direction and a third forging in the Z-axis direction; any two directions of the X-axis direction, the Y-axis direction and the Z-axis direction are vertical to each other; the copper-aluminum alloy target and the preparation method thereof can prepare the high-strength copper-aluminum target, improve the coating uniformity and ensure that the sputtering rate is more than or equal to 5x10 ‑3 The high-strength high-speed sputtering target has high strength at a high sputtering rate of g/min, and the preparation method is simple to operate.
Description
Technical Field
The invention belongs to the technical field of target preparation, and particularly relates to a copper-aluminum alloy target and a preparation method and application thereof.
Background
The magnetron sputtering technology is one of the key technologies for preparing the film material, and the target material is the key material in the magnetron sputtering technology. The sputtering method mainly refers to a process of bombarding the surface of a target material by high-energy particles to enable atoms or molecules on the surface of the target material to be sprayed on the surface of the substrate to form a layer of compact film, and because the film material has higher requirements on the uniformity when being applied to the fields of semiconductor chips, flat panel displays and the like, the uniformity of an internal organization structure of the sputtering target material needs to be ensured at first, so that the uniformity of a coated film can be ensured, and different processes need to be selected according to different materials for processing and preparing the target material.
The sputtering target material is one of important raw materials in the preparation process of a semiconductor integrated circuit, mainly comprises Al, cu, ti, WTi, niV, niPt and the like, and is mainly used for preparing physical vapor deposition films of contacts, through holes, interconnecting wires, barrier layers, packaging and the like in the integrated circuit. In the sputtering process, the surface of the target material is bombarded by accelerated ions, so that atoms on the surface are deposited on the surface of the substrate. Copper is an excellent wiring material for integrated circuits because of its low resistivity and low dielectric constant. Copper targets are divided into high-purity copper targets and copper alloy targets, and the addition of the alloy can reduce electromigration, stress migration, corrosion and other undesirable effects.
The processing and preparation of the target material usually adopt processing modes such as forging, hot rolling, cold rolling and the like, and then the target material product meeting the requirements is prepared through heat treatment and necessary mechanical processing, but the traditional operation steps are difficult to effectively adjust the internal organization structure of the target material and control the uniformity of the grain size of the target material, so that the uniformity of a film during sputtering coating cannot be ensured, and therefore, a proper processing technology needs to be selected according to different target material materials.
CN113862627A discloses a copper target and a method for improving the internal structure thereof, the method comprises the following steps: providing a copper target blank; (1) cooling after primary forging; (2) sequentially carrying out primary heat treatment and secondary forging; (3) carrying out forging for three times and then cooling; (4) Sequentially carrying out secondary heat treatment, primary static pressure treatment, tertiary heat treatment and secondary static pressure treatment; (5) obtaining a copper target after rolling; repeating the step (2) for at least 3 rounds; the method solves the problem of internal defects of the copper target blank by optimizing the preparation process of the copper target, so that internal grains are sufficiently and uniformly refined, and the target and the performance are improved.
CN113061853A discloses a high-purity aluminum or aluminum alloy target material and a preparation method and application thereof, wherein the method comprises the following steps; sequentially carrying out forging, primary heat treatment, forging, secondary heat treatment and rolling on the aluminum or aluminum alloy target blank to obtain a high-purity aluminum or aluminum alloy target; the temperature of the primary heat treatment is 345-355 ℃; the temperature of the secondary heat treatment is 290-310 ℃. The method mainly adjusts the grain size of the target material by optimizing the heat treatment process, improves the uniformity of the target material, but does not improve the forging and rolling after the heat treatment.
In summary, for the preparation process of the copper-aluminum alloy target, the process steps are further improved according to the use requirements of the target, so as to optimize the internal structure thereof, improve the uniformity in the subsequent coating and ensure the strength of the target at a high sputtering rate.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a copper-aluminum alloy target material and a preparation method and application thereof, wherein a copper-aluminum alloy target material is obtained by sequentially carrying out preheating, three-way forging, heat treatment, cold pressing, cold rolling and leveling on a copper-aluminum target blank; the three-way forging comprises a first forging in the X-axis direction, a second forging in the Y-axis direction and a third forging in the Z-axis direction; any two directions of the X-axis direction, the Y-axis direction and the Z-axis direction are vertical to each other; the copper-aluminum alloy target and the preparation method thereof can prepare the high-strength copper-aluminum target, improve the coating uniformity and ensure that the sputtering rate is more than or equal to 5x10 -3 The alloy has higher strength at a high sputtering rate of g/min, and the preparation method is simple to operate.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a preparation method of a copper-aluminum alloy target, which comprises the following steps:
preheating, three-dimensional forging, heat treatment, cold pressing, cold rolling and leveling are sequentially carried out on the copper-aluminum target blank to obtain a copper-aluminum alloy target material;
wherein the three-way forging comprises a first forging in the X-axis direction, a second forging in the Y-axis direction and a third forging in the Z-axis direction; any two directions of the X-axis direction, the Y-axis direction and the Z-axis direction are mutually vertical.
The copper-aluminum alloy target and the preparation method thereof can prepare the high-strength copper-aluminum target, improve the coating uniformity and ensure that the sputtering rate is more than or equal to 5x10 -3 The high-strength high-speed sputtering target has high strength at a high sputtering rate of g/min, and the preparation method is simple to operate.
In a preferred embodiment of the present invention, the aluminum content of the copper-aluminum target blank is 0.1 to 3wt%, and may be, for example, 0.1wt%,0.2wt%,0.5wt%,0.8wt%,1wt%,1.3wt%,1.5wt%,1.7wt%,2wt%,2.2wt%,2.4wt%,2.7wt%,3wt%, etc., but the present invention is not limited to the recited values, and other values not recited in the above-mentioned range of values are also applicable.
Preferably, the temperature of the preheating is 750-850 deg.C, such as 750 deg.C, 760 deg.C, 770 deg.C, 780 deg.C, 790 deg.C, 800 deg.C, 810 deg.C, 820 deg.C, 830 deg.C, 840 deg.C, 850 deg.C, etc., but is not limited to the recited values, and other values not recited in the above range of values are also applicable.
Preferably, the preheating time is 5 to 30min, and may be, for example, 5min,10min,12min,15min,18min,20min,23min,25min,27min,30min, etc., but is not limited to the enumerated values, and other values not enumerated within the above-mentioned range of values are also applicable.
In a preferred embodiment of the present invention, the first forging temperature is 750 to 850 ℃, and may be 750 ℃,760 ℃,770 ℃,780 ℃,790 ℃,800 ℃,810 ℃,820 ℃,830 ℃,840 ℃,850 ℃ or the like, but is not limited to the above-mentioned values, and other values not listed in the above-mentioned range of values are also applicable.
Preferably, the first forging deformation is 40 to 60%, for example, 40%,42%,44%,46%,48%,50%,52%,54%,56%,58%,60%, etc., but is not limited to the recited values, and other values not recited in the above range of values are also applicable.
Preferably, the target blank after the first forging is drawn out to a length before the first forging in the X-axis direction before the second forging.
In a preferred embodiment of the present invention, the temperature of the second forging is 750 to 850 ℃, for example, 750 ℃,760 ℃,770 ℃,780 ℃,790 ℃,800 ℃,810 ℃,820 ℃,830 ℃,840 ℃,850 ℃ or the like, but the temperature is not limited to the above-mentioned values, and other values not listed in the above-mentioned range of values are also applicable.
Preferably, the second forging has a deformation of 40 to 60%, for example 40%,42%,44%,46%,48%,50%,52%,54%,56%,58%,60%, etc., but is not limited to the recited values, and other unrecited values within the above-mentioned range of values are also applicable.
Preferably, the target blank after the second forging is drawn out in the Y-axis direction to a length before the second forging before the third forging.
In a preferred embodiment of the present invention, the temperature of the third forging is 750 to 850 ℃, for example, 750 ℃,760 ℃,770 ℃,780 ℃,790 ℃,800 ℃,810 ℃,820 ℃,830 ℃,840 ℃,850 ℃ or the like, but is not limited to the above-mentioned values, and other values not listed in the above-mentioned range of values are also applicable.
Preferably, the third forging has a deformation of 40 to 60%, for example, 40%,42%,44%,46%,48%,50%,52%,54%,56%,58%,60%, etc., but is not limited to the recited values, and other unrecited values within the above-mentioned range of values are also applicable.
Preferably, the third forged target blank is drawn out to a length before the third forging in the Z-axis direction before the heat treatment.
In a preferred embodiment of the present invention, the forging ratio of the three-way forging is 1.5 to 2.5, and may be, for example, 1.5,1.6,1.7,1.8,1.9,2.0,2.1,2.2,2.3,2.4,2.5, but not limited to the above-mentioned values, and other values not listed in the above-mentioned range of values are also applicable.
Preferably, the three-way forging is performed 2 to 4 times, such as 2 times, 3 times, or 4 times.
In a preferred embodiment of the present invention, the heat treatment temperature is 300 to 400 ℃, for example, 300 ℃,310 ℃,320 ℃,330 ℃,340 ℃,350 ℃,360 ℃,370 ℃,380 ℃,390 ℃,400 ℃ and the like, but the heat treatment temperature is not limited to the recited values, and other values not recited in the above range are also applicable.
Preferably, the heat treatment time is 30-90min, such as 30min,33min,37min,40min,45min,50min,54min,58min,60min,62min,67min,80min,84min,86min,90min, etc., but not limited to the recited values, and other values not recited in the above range of values are equally applicable.
Preferably, cooling is performed after the heat treatment and before the cold pressing.
Preferably, the cooling means comprises water cooling.
In a preferred embodiment of the present invention, the cold pressing temperature is 10 to 30 ℃, for example, 10 ℃,12 ℃,14 ℃,16 ℃,18 ℃,20 ℃,22 ℃,24 ℃,26 ℃,28 ℃,30 ℃ and the like, but the cold pressing temperature is not limited to the recited values, and other values not recited in the above range of values are also applicable.
Preferably, the cold-pressed deformation is 30 to 50%, and may be, for example, 30%,31%,32%,33%,34%,35%,36%,37%,38%,39%,40%,42%,44%,46%,48%,50%, etc., but is not limited to the recited values, and other unrecited values within the above-mentioned range of values are also applicable.
Preferably, the cold rolling temperature is 10-30 ℃, for example, 10 ℃,12 ℃,14 ℃,16 ℃,18 ℃,20 ℃,22 ℃,24 ℃,26 ℃,28 ℃,30 ℃ and the like, but not limited to the recited values, and other values not recited in the above-mentioned range of values are also applicable.
Preferably, the cold rolling has a deformation of 60-85%, for example, 60%,62%,64%,66%,68%,70%,72%,74%,76%,78%,80%,82%,85%, etc., but is not limited to the recited values, and other values not recited in the above range are also applicable.
Preferably, the rolling reduction is 10 to 20mm per pass, and may be, for example, 10mm, 111mm, 12mm,13mm,14mm,15mm, 1112mm, 17mm,18mm,19mm,20mm, etc., but it is not limited to the above-mentioned values, and other values not specified in the above-mentioned range of values are also applicable.
Preferably, the flatness of the target blank after leveling is less than or equal to 0.5mm, and may be, for example, 0.5mm,0.4mm,0.3mm,0.2mm,0.1mm,0.05mm, etc., but it is not limited to the values listed above, and other values not listed above within the above-mentioned range of values are also applicable.
As a preferred technical scheme of the invention, the preparation method comprises the following steps:
preheating a copper-aluminum target blank with the aluminum content of 0.1-3wt% at 750-850 ℃ for 5-30min, and then carrying out 2-4 times of three-way forging, wherein the three-way forging comprises first forging in the X-axis direction, second forging in the Y-axis direction and third forging in the Z-axis direction, and any two directions of the X-axis direction, the Y-axis direction and the Z-axis direction are mutually vertical; controlling the forging ratio of the three-way forging to be 1.5-2.5; then, heat treatment is carried out for 30-90min at 300-400 ℃, cold pressing is carried out at 10-30 ℃ after water cooling, and the deformation of the cold pressing is controlled to be 30-50%; then, cold rolling is carried out at the temperature of 10-30 ℃, the reduction of each pass is 10-20mm during cold rolling, and the deformation of the cold rolling is controlled to be 60-85%; finally, leveling until the flatness of the target blank is less than or equal to 0.5mm, and machining to obtain the copper-aluminum alloy target material;
wherein the temperature of the first forging is 750-850 ℃, the deformation is 40-60%, and the target blank after the first forging is drawn to the length before the first forging along the X-axis direction; the temperature of the second forging is 750-850 ℃, the deformation is 40-60%, and the target blank after the second forging is drawn to the length before the second forging along the Y-axis direction; the temperature of the third forging is 750-850 ℃, the deformation is 40-60%, and the target blank after the third forging is drawn to the length before the third forging along the Y-axis direction.
In a second aspect, the invention provides a copper-aluminum alloy target material, which is obtained by the preparation method of the first aspect.
In a third aspect, the present invention provides an application of the copper-aluminum alloy target material of the second aspect, wherein the copper-aluminum alloy target material is used for sputtering coating.
The recitation of numerical ranges herein includes not only the above-recited numerical values, but also any numerical values between non-recited numerical ranges, and is not intended to be exhaustive or to limit the invention to the precise numerical values encompassed within the range for brevity and clarity.
Compared with the prior art, the invention has the following beneficial effects:
the copper-aluminum alloy target and the preparation method thereof obtain the high-strength copper-aluminum target, improve the coating uniformity and ensure that the sputtering rate is more than or equal to 5x10 -3 The high-strength high-speed sputtering material still has high strength at a high sputtering rate of g/min, and the preparation method is simple to operate.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitation of the present invention.
Example 1
The embodiment provides a copper-aluminum alloy target material and a preparation method thereof, wherein the preparation method comprises the following steps:
preheating a copper-aluminum target blank with the aluminum content of 1.2wt% for 20min at 800 ℃, and then carrying out three-way forging for 3 times, wherein the three-way forging comprises first forging in the X-axis direction, second forging in the Y-axis direction and third forging in the Z-axis direction, and any two directions of the X-axis direction, the Y-axis direction and the Z-axis direction are vertical to each other; controlling the forging ratio of the three-way forging to be 2; then, carrying out heat treatment at 350 ℃ for 60min, carrying out cold pressing at 30 ℃ after water cooling, and controlling the deformation of the cold pressing to be 40%; then, cold rolling is carried out at 30 ℃, during cold rolling, the reduction of each pass is 15mm, and the deformation of the cold rolling is controlled to be 75%; finally, leveling to 0.3mm flatness of the target blank, and machining to obtain the copper-aluminum alloy target material;
wherein the temperature of the first forging is 800 ℃, the deformation amount is 40%, and the target blank after the first forging is drawn to the length before the first forging along the X-axis direction; the temperature of the second forging is 800 ℃, the deformation is 40%, and the target blank after the second forging is drawn to the length before the second forging along the Y-axis direction; the temperature of the third forging was 800 ℃ and the deformation was 40%, and the target blank after the third forging was drawn out in the Y-axis direction to the length before the third forging.
Example 2
The embodiment provides a copper-aluminum alloy target material and a preparation method thereof, wherein the preparation method comprises the following steps:
preheating a copper-aluminum target blank with the aluminum content of 0.1wt% at 850 ℃ for 5min, and then carrying out three-way forging for 4 times, wherein the three-way forging comprises first forging in an X-axis direction, second forging in a Y-axis direction and third forging in a Z-axis direction, and any two directions of the X-axis direction, the Y-axis direction and the Z-axis direction are vertical to each other; controlling the forging ratio of the three-way forging to be 1.5; then, carrying out heat treatment at 300 ℃ for 90min, carrying out cold pressing at 10 ℃ after water cooling, and controlling the deformation of the cold pressing to be 30%; then, cold rolling is carried out at 10 ℃, the reduction of each pass is 10mm during cold rolling, and the deformation of the cold rolling is controlled to be 60%; finally, leveling to 0.5mm flatness of the target blank, and machining to obtain the copper-aluminum alloy target material;
wherein the temperature of the first forging is 850 ℃, the deformation is 50%, and the target blank after the first forging is drawn to the length before the first forging along the X-axis direction; the temperature of the second forging is 850 ℃, the deformation is 50%, and the target blank after the second forging is drawn to the length before the second forging along the Y-axis direction; the temperature of the third forging was 850 ℃, the deformation was 50%, and the target blank after the third forging was drawn out in the Y-axis direction to the length before the third forging.
Example 3
The embodiment provides a copper-aluminum alloy target material and a preparation method thereof, wherein the preparation method comprises the following steps:
preheating a copper-aluminum target blank with the aluminum content of 3wt% at 750 ℃ for 30min, and then carrying out three-way forging for 2 times, wherein the three-way forging comprises first forging in the X-axis direction, second forging in the Y-axis direction and third forging in the Z-axis direction, and any two directions of the X-axis direction, the Y-axis direction and the Z-axis direction are vertical to each other; controlling the forging ratio of the three-way forging to be 2.5; then, heat treatment is carried out for 30min at 400 ℃, cold pressing is carried out at 20 ℃ after water cooling, and the deformation of the cold pressing is controlled to be 50%; then, cold rolling is carried out at 20 ℃, the reduction of each pass is 20mm, and the deformation of the cold rolling is controlled to be 85%; finally, leveling to 0.5mm flatness of the target blank, and machining to obtain the copper-aluminum alloy target material;
wherein the temperature of the first forging is 750 ℃, the deformation is 60%, and the target blank after the first forging is drawn to the length before the first forging along the X-axis direction; the temperature of the second forging is 750 ℃, the deformation is 60%, and the target blank after the second forging is drawn to the length before the second forging along the Y-axis direction; the temperature of the third forging was 750 ℃ and the deformation was 60%, and the target blank after the third forging was drawn out in the Y-axis direction to the length before the third forging.
Comparative example 1
The present comparative example provides a copper-aluminum alloy target and a method for producing the same, which are different from the method of example 1 only in that: replacing three-way forging with one-way forging; that is, the unidirectional forging includes performing the first forging, the second forging, and the third forging in the same direction.
The performance of the copper-aluminum alloy target materials obtained in the above examples and comparative examples is tested by the following method:
strength: at a sputtering rate of 5x10 -3 Observing whether cracks are generated on the surface of the target material under the condition of g/min;
uniformity of the target material: the uniformity of the copper-aluminum alloy target is characterized by using a conductivity meter, the larger the conductivity fluctuation is, the worse the uniformity of the target is, the fluctuation generally exceeds +/-10%, the target tissue is considered to be non-uniform, and the fluctuation does not exceed +/-10%, the target tissue is considered to be uniform; testing the conductivity fluctuation of N targets, wherein the uniformity = (number of uniform targets/N) × 100%;
coating uniformity: at 5x10 -3 Sputtering at g/min for 10min, respectively at the center and edge of the filmSelecting 3 points, testing the thickness of the thin film of each point by a thickness tester, taking an average value, and calculating a standard deviation;
the results of the above tests are shown in Table 1.
TABLE 1
From table 1, the following points can be derived:
(1) As can be seen from examples 1-3, the copper-aluminum alloy target material obtained by the invention has high strength and sputtering rate of 5x10 -3 No cracks are generated on the surface of the target material under g/min, the uniformity of the target material is high and reaches more than 90 percent, and the coating uniformity is high;
(2) Comparing example 1 with comparative example 1, it can be seen that the strength of the obtained copper-aluminum alloy target material is reduced at a sputtering rate of 5x10 because comparative example 1 is not subjected to three-way forging -3 g/min, cracks are generated on the surface of the target material, the uniformity of the target material is reduced, and the uniformity of the coating film is reduced.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The preparation method of the copper-aluminum alloy target is characterized by comprising the following steps:
preheating, three-dimensional forging, heat treatment, cold pressing, cold rolling and leveling are sequentially carried out on the copper-aluminum target blank to obtain a copper-aluminum alloy target material;
wherein the three-way forging comprises a first forging in the X-axis direction, a second forging in the Y-axis direction and a third forging in the Z-axis direction; any two directions of the X-axis direction, the Y-axis direction and the Z-axis direction are mutually vertical.
2. The method as claimed in claim 1, wherein the copper aluminum target blank has an aluminum content of 0.1-3wt%;
preferably, the temperature of the preheating is 750-850 ℃;
preferably, the preheating time is 5-30min.
3. The production method according to claim 1 or 2, characterized in that the temperature of the first forging is 750 to 850 ℃;
preferably, the first forging has a deformation amount of 40 to 60%;
preferably, the target blank after the first forging is drawn out in the X-axis direction to a length before the first forging before the second forging.
4. The production method according to any one of claims 1 to 3, wherein the temperature of the second forging is 750 to 850 ℃;
preferably, the second forging has a deformation amount of 40 to 60%;
preferably, the second forged target blank is drawn out in the Y-axis direction to a length before the second forging before the third forging.
5. The production method according to any one of claims 1 to 4, characterized in that the temperature of the third forging is 750 to 850 ℃;
preferably, the third forging has a deformation amount of 40 to 60%;
preferably, the third forged target blank is drawn out in the Z-axis direction to a length before the third forging before the heat treatment.
6. The production method according to any one of claims 1 to 5, wherein the three-way forging has a forging ratio of 1.5 to 2.5;
preferably, the three-way forging is performed 2 to 4 times.
7. The method for producing a polycarbonate according to any one of claims 1 to 6, wherein the temperature of the heat treatment is 300 to 400 ℃;
preferably, the time of the heat treatment is 30-90min;
preferably, after said heat treatment, before said cold pressing, cooling is performed;
preferably, the cooling means comprises water cooling.
8. The method for preparing according to any one of claims 1 to 7, wherein the cold pressing temperature is 10 to 30 ℃;
preferably, the cold pressing has a deformation of 30-50%;
preferably, the temperature of the cold rolling is 10-30 ℃;
preferably, the deformation amount of the cold rolling is 60-85%;
preferably, the pressing amount of each pass in the cold rolling is 10-20mm;
preferably, the planeness of the leveled target blank is less than or equal to 0.5mm.
9. A copper-aluminum alloy target material, which is characterized by being prepared by the preparation method of any one of claims 1 to 8.
10. Use of the cu-al alloy target according to claim 9, wherein the cu-al alloy target is used for sputter coating.
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| CN117066419A (en) * | 2023-08-18 | 2023-11-17 | 宁波江丰电子材料股份有限公司 | Preparation method of copper target |
| CN117286466A (en) * | 2023-09-26 | 2023-12-26 | 宁波江丰电子材料股份有限公司 | Aluminum-silicon target material and preparation method thereof |
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