CN115334857A - Vapor chamber, electronic apparatus, and method of manufacturing vapor chamber - Google Patents

Abstract

The present application discloses a vapor chamber, an electronic device and a method for manufacturing a vapor chamber, wherein the vapor chamber includes: a first plate body; a second plate body, the first plate body and the second plate body enclose a cavity chamber, the second plate body is an aluminum-plastic film; the capillary structure is located in the chamber and is arranged on the first plate body; wherein, the second plate body includes a plurality of alternately connected arched parts and fitting parts, The part is arranged in close contact with the capillary structure, and the arched part and the capillary structure are spaced apart to form a steam channel.

Description

Vapor chamber, electronic device, and method for manufacturing the chamber

technical field

The application belongs to the technical field of electronic equipment, and in particular relates to a soaking plate, an electronic equipment and a manufacturing method of a soaking plate.

Background technique

As an efficient heat transfer device, vapor chamber is widely used in electronic equipment. The vapor chamber is generally composed of upper and lower shell plates, capillary core and working medium. The upper and lower shell plates are connected together, and the inside of the chamber is evacuated and then sealed. According to the principle of gas-liquid equilibrium, the boiling point of the working medium decreases under low pressure, and it is easy to boil and evaporate when heated; the capillary core has the characteristic of water absorption by using the principle of capillary phenomenon. The principle of heat conduction is: one end of the vapor chamber is the heat source end, and the other end is the condensation end. The working medium at the heat source end is heated and evaporated. The steam flows to the condensation end under the action of pressure difference and then condenses into liquid. The liquid is under the capillary action of the capillary core. It flows back to the heat source end again, so that the heat from the heat source end is transferred to the other end continuously. Due to the efficient heat transfer effect of the vapor chamber, it can replace a large-area heat dissipation film in some scenarios to improve the heat dissipation capacity of the system.

However, in the related art, the vapor chamber has a problem of high quality, and when applied to electronic equipment, it will cause the electronic equipment to be too heavy, which is not in line with the development trend of thinner and lighter electronic equipment.

Contents of the invention

The purpose of the present application is to provide a vapor chamber and electronic equipment, which solves the problem in the prior art that the high mass of the vapor chamber is not conducive to the light and thin design of the electronic equipment.

In order to solve the above-mentioned technical problems, the application is implemented as follows:

In the first aspect, the embodiment of the present application proposes a vapor chamber, including: a vapor chamber, including: a first plate body; a second plate body, the first plate body and the second plate body enclose a cavity, and the second plate body The plate body is an aluminum-plastic film; the capillary structure is located in the chamber and is arranged on the first plate body; wherein, the second plate body includes a plurality of alternately connected arched parts and bonding parts, and the bonding part and the capillary structure The parts are fitted together, and the arched part and the capillary structure part are arranged at intervals to form a steam channel.

In a second aspect, an embodiment of the present application provides an electronic device, including: the vapor chamber as in the first aspect.

In the third aspect, the embodiment of the present application proposes a method for manufacturing a vapor chamber, which is used for the vapor chamber in the first aspect. The method for manufacturing the vapor chamber includes: placing the capillary structure on the On the first area: the second plate is placed on the side of the capillary structure away from the first plate, and the bonding part is placed in contact with the capillary structure, and the arched part and the capillary structure are arranged at intervals to form a steam channel ; heating the first plate body and the second plate body to a first preset temperature, and pressing the second area of the first plate body and the second area of the second plate body.

In the embodiment of the present application, the vapor chamber includes a first plate body, a second plate body and a capillary structure. The first plate body and the second plate body enclose a chamber, and the capillary structure is located in the chamber. Wherein, the second plate body is an aluminum-plastic film plate body. Compared with the vapor chamber in the related art, the density of the second plate body of the present application is much lower, so that the weight of the vapor chamber can be significantly reduced, so that the electronic equipment using the vapor chamber can be lightened.

Description of drawings

The above and/or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a cross-sectional view of a partial structure of a first plate according to an embodiment of the present application;

Fig. 2 is a cross-sectional view of the vapor chamber according to the first embodiment of the present application;

3 is a cross-sectional view of a first plate body and a first capillary member according to the first embodiment of the present application;

4 is a cross-sectional view of a first plate body, a first capillary and a second capillary according to the first embodiment of the present application;

5 is a cross-sectional view of the first plate body, the first capillary member, the second capillary member and the second plate body according to the first embodiment of the present application;

6 is a cross-sectional view of the first plate body, the first capillary member, the second capillary member, the second plate body, the first mold and the second mold according to the first embodiment of the present application;

7 is a cross-sectional view of a vapor chamber according to a second embodiment of the present application;

Fig. 8 is a cross-sectional view of a first plate body and a capillary structure according to a second embodiment of the present application;

Fig. 9 is a cross-sectional view of the first plate body, the second plate body and the capillary structure according to the second embodiment of the present application;

10 is a cross-sectional view of the first plate body, the second plate body, the capillary structure, the first mold and the second mold according to the second embodiment of the present application;

Fig. 11 is a schematic structural view of the third mold, the fourth mold and the second plate body in the first state according to the second embodiment of the present application;

Fig. 12 is a schematic structural view of the third mold, the fourth mold and the second plate in the second state according to the second embodiment of the present application;

Fig. 13 is a schematic structural diagram of a second board body according to the second embodiment of the present application;

Fig. 14 is a cross-sectional view of a vapor chamber according to a third embodiment of the present application;

Fig. 15 is a cross-sectional view of a first plate body and a capillary structure according to a third embodiment of the present application;

Fig. 16 is a cross-sectional view of the first plate body, the second plate body and the capillary structure according to the third embodiment of the present application;

17 is a cross-sectional view of the first plate body, the second plate body, the capillary structure, the first mold and the second mold according to the third embodiment of the present application;

18 is a cross-sectional view of the fifth mold, the sixth mold and the second plate body in the first state according to the third embodiment of the present application;

Fig. 19 is a cross-sectional view of the fifth mold, the sixth mold and the second plate body in the second state according to the third embodiment of the present application;

Fig. 20 is a schematic structural diagram of a second plate body according to a third embodiment of the present application;

Fig. 21 is a cross-sectional view of a vapor chamber according to a fourth embodiment of the present application;

Fig. 22 is a schematic flowchart of a manufacturing method of a vapor chamber according to an embodiment of the present application.

Reference signs:

The corresponding relationship between the reference numerals and the part names in Fig. 1 to Fig. 21 is:

100 vapor chamber, 110 first plate body, 120 second plate body, 122 arched part, 124 fitting part, 130 chamber, 140 capillary structure, 142 first capillary part, 144 second capillary part, 150 steam Channel, 160 Nylon Layer, 170 Polymer Layer, 180 Aluminum Foil Layer, 210 First Zone, 220 Second Zone, 230 Third Capillary, 300 First Die, 400 Second Die, 700 Third Die, 800 Fourth Die , 1100 for the fifth mold, 1200 for the sixth mold.

Detailed ways

Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

The features of the terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of these features. In the description of the present application, unless otherwise specified, "plurality" means two or more. In addition, "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally means that the related objects are an "or" relationship.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, rather than indicating or implying the referred device or element Must be in a particular orientation, constructed, and operate in a particular orientation, and thus should not be construed as limiting of the application.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.

The vapor chamber 100 , the electronic device and the manufacturing method of the vapor chamber 100 according to the embodiment of the present application will be described below with reference to FIGS. 1 to 22 .

As shown in Fig. 1, Fig. 2, Fig. 7 and Fig. 14, the vapor chamber 100 according to some embodiments of the present application includes: a first plate body 110; a second plate body 120, the first plate body 110 and the second plate body The body 120 encloses the cavity 130, and the second plate body 120 is an aluminum-plastic film; the capillary structure 140 is located in the cavity 130 and is arranged on the first plate body 110; wherein, the second plate body 120 includes a plurality of alternating The connected arched portion 122 and the fitting portion 124 , the fitting portion 124 is disposed in contact with the capillary structure 140 , and the arched portion 122 and the capillary structure 140 are arranged at intervals to form a steam channel 150 .

In this embodiment, the vapor chamber 100 includes a first plate body 110 , a second plate body 120 and a capillary structure 140 . The first plate body 110 and the second plate body 120 enclose a chamber 130 , and the capillary structure 140 is located in the chamber 130 .

Specifically, by setting the structure of the second board body 120, the second board body 120 is made of an aluminum-plastic film. In the related art, the density of the vapor chamber 100 is 8.9 g/cm ³ , and the density of the aluminum-plastic film is not higher than 2.5 g/cm ³ , that is, the second plate body 120 of the present application is The density of the vapor chamber 100 is much lower, so that the weight of the vapor chamber 100 can be significantly reduced, and an effective and reliable structural support can be provided for realizing the lightness of the electronic equipment using the vapor chamber 100 .

It can be understood that the chamber 130 enclosed by the first plate body 110 and the second plate body 120 is a closed chamber 130 . The first plate body 110 is the plate body on the side of the heat source, and the second plate body 120 is the plate body on the side away from the heat source. According to the principle of gas-liquid equilibrium, the boiling point of the working medium decreases under low pressure, and it is easy to boil and evaporate when heated. The capillary structure 140 has water-absorbing properties by utilizing the principle of capillary phenomenon. The first plate body 110 is the heat source end, and the second plate body 120 is the condensation end. The working medium at the heat source end is heated and evaporated. After the steam flows to the condensation end under the action of the pressure difference, it releases heat and condenses into a liquid. The liquid is in the capillary structure 140 Under the action of capillary, it flows back to the heat source end, so that the heat from the heat source end is transferred to the condensation end continuously in a cycle.

In addition, since the arched portion 122 and the capillary structure 140 are arranged at intervals to form a steam channel 150, each steam channel 150 communicates with the chamber 130, and the steam channel 150 has the function of supplying steam to flow to the condensing end. to the guiding role.

Specifically, since each steam channel 150 is in communication with the chamber 130 , that is, any two steam channels 150 are in communication, this setting can ensure the contact area between the steam and the condensing end, which is beneficial to improve the working efficiency of the vapor chamber 100 .

At the same time, the second plate body 120 includes a plurality of alternately connected arched portions 122 and bonding portions 124 , which will enhance the structural strength of the second plate body 120 and avoid deformation of the vapor chamber 100 .

In some embodiments, as shown in Figure 14, Figure 16, Figure 17 and Figure 20, the second plate body 120 includes a nylon layer 160, an aluminum foil layer 180 and a polymer layer 170 stacked in sequence; the polymer layer 170 includes multiple There are two cylindrical protrusions arranged at intervals, the cylindrical protrusions form the bonding part 124, the side of the cylindrical protrusions away from the aluminum foil layer 180 is attached to the capillary structure 140, and steam is formed between two adjacent cylindrical protrusions. Channel 150.

In this embodiment, the second plate body 120 at least includes a nylon layer 160 , a polymer layer 170 and an aluminum foil layer 180 , and the aluminum foil layer 180 is located between the nylon layer 160 and the polymer layer 170 . And the polymer layer 170 is disposed toward the capillary structure 140 .

Due to the presence of the nylon layer 160 , the second plate body 120 will not be deformed during processing, and it will also protect the aluminum foil layer 180 .

The aluminum foil layer 180 is the skeleton layer of the second plate body 120, which can prevent water in the external environment from penetrating into the vapor chamber 100. In addition, the aluminum foil layer 180 will react with oxygen in the air at room temperature to form The dense oxide film prevents water vapor from penetrating, ensuring the safety and reliability of the vapor chamber 100 .

The polymer layer 170 will melt at a certain temperature and is viscous, and the polymer layer 170 can melt and stick together under the action of heating, so as to achieve the purpose of connecting the first plate body 110 and the second plate body 120 . It is understood that the polymer layer 170 is capable of curing the bond under the effect of cooling. In addition, the polymer layer 170 can effectively prevent air, moisture, etc. from contacting the aluminum foil layer 180 to avoid oxidation and corrosion of the aluminum foil layer 180 .

The polymer layer 170 melts at a certain temperature and is viscous, and the polymer layer 170 can melt and stick together under the action of heating. It can be understood that the polymer layer 170 can be solidified and bonded under the action of cooling. In addition, the polymer layer 170 can effectively prevent air, moisture, etc. from contacting the aluminum foil layer 180 to avoid oxidation and corrosion of the aluminum foil layer 180 .

Specifically, the polymer layer 170 includes a polypropylene layer.

Wherein, the capillary structure 140 is configured to absorb the liquid through the capillary principle, so the liquid in the chamber 130 will produce a flow effect by the capillary action, that is to say, the liquid is easy to flow along the capillary structure 140 to realize the absorption of the capillary structure 140. liquid.

Specifically, the capillary structure 140 is a porous structure, and/or the capillary structure 140 is a mesh structure. That is, micro-channels are formed inside the capillary structure 140, and the liquid will produce a flow effect when subjected to capillary action, that is, the liquid can rapidly diffuse and flow along the porous structure and/or network structure, thereby realizing the capillary structure 140 to absorb liquid. Purpose.

Specifically, the capillary structure 140 includes any one or a combination of the following: copper mesh, copper powder, copper wire, etc., which are not listed here.

Specifically, the density of the nylon layer 160 is greater than or equal to 1 g/cm ³ and less than or equal to 1.5 g/cm ³ , for example, the density of the nylon layer 160 includes 1.1 g/cm ³ , 1.2 g/cm ³ , 1.3 g/cm ³ and 1.4g/cm ³ and so on, not listed here.

Specifically, the density of the aluminum foil layer 180 is greater than or equal to 2.5g/cm ³ and less than or equal to 3g/cm ³ , for example, the density of the aluminum foil layer 180 includes 2.6g/cm ³ , 2.7g/cm ³ , 2.8g/cm ³ and 2.9g/cm ³ and so on, not listed here.

Specifically, the density of the polymer layer 170 is greater than or equal to 0.8 g/cm ³ and less than or equal to 1.5 g/cm ³ , for example, the density of the polymer layer 170 includes 0.9 g/cm ³ , 1 g/cm ³ , and 1.1 g/cm 3 . ³ and 1.2g/cm ³ etc., not listed here.

Specifically, as shown in FIG. 18 and FIG. 19, the second plate body 120 is placed between the fifth mold 1100 and the sixth mold 1200, the second plate body 120 is heated, and the polymer layer 170 of the second plate body 120 is It is in a slightly molten state at a certain temperature. At this time, the polymer layer 170 of the second plate body 120 is hot-pressed using the fifth mold 1100 and the sixth mold 1200, so that the polymer layer 170 can be constructed into a plurality of cylindrical protrusions, A plurality of cylindrical protrusions can play a supporting role, while retaining a certain thickness of the polymer layer 170 to isolate the internal working medium of the vapor chamber 100 from the aluminum foil layer 180 to ensure the reliability of the vapor chamber 100 .

The polymer layer 170 includes a plurality of cylindrical protrusions arranged at intervals, the cylindrical protrusions form the bonding portion 124, and the side of the cylindrical protrusions away from the aluminum foil layer 180 is bonded to the capillary structure 140, A steam channel 150 is formed between two adjacent cylindrical protrusions. This setting utilizes the self-structure of the second plate body 120, while ensuring the formation of a part of the wall surface of the chamber 130, it can avoid the situation that additional devices are put in to define a plurality of steam channels 150, and the rational use of the second plate body 120 The structure simplifies the assembling process of the vapor chamber 100, which is beneficial to improving the assembling efficiency of the product, thereby reducing the production cost of the product. At the same time, this arrangement can ensure the matching dimensions of the plurality of protrusions, and thus can ensure the matching dimensions of the plurality of steam channels 150 .

Specifically, the second plate body 120 is placed between the fifth mold 1100 and the sixth mold 1200, and the first region 210 of the second plate body 120 is hot-pressed using the fifth mold 1100 and the sixth mold 1200, that is, , by heating the second plate body 120 to a second preset temperature and compression-molding the second plate body 120 so that the polymer layer 170 of the second plate body 120 forms a plurality of columnar protrusions.

Wherein, the shape of the protrusion includes but is not limited to a column, and may also be a rectangle, a sphere, a special shape, etc., which are not listed here. Alien refers to irregularly shaped structures.

In some embodiments, as shown in FIG. 2 , FIG. 3 , FIG. 4 , FIG. 5 and FIG. 6 , the capillary structure 140 includes a first capillary member 142 and a plurality of second capillary members 144, and the first capillary member 142 includes opposite The first end surface and the second end surface are provided, the first end surface of the first capillary member 142 faces the first plate body 110, and a plurality of second capillary members 144 are arranged at intervals on the second end surface of the first capillary member 142, and the second capillary member 144 is attached to the bonding portion 124 .

In this embodiment, the capillary structure 140 includes a first capillary 142 and a plurality of second capillary 144 . The first capillary piece 142 includes a first end surface and a second end surface, and the first end surface and the second end surface are oppositely disposed along the thickness direction of the first capillary piece 142 . A plurality of second capillary pieces 144 are arranged at intervals, and each second capillary piece 144 is stacked between the first capillary piece 142 and the second plate body 120, and each second capillary piece 144 is attached to the bonding portion 124, and any Two adjacent second capillary pieces 144 , the first capillary piece 142 and the second plate body 120 enclose a steam channel 150 , which can ensure the reliability and effectiveness of the formation of the steam channel 150 .

It can be understood that the capillary structure 140 includes a first capillary 142 and a plurality of second capillary 144 , and the first capillary 142 acts as a main capillary structure to absorb liquid over the entire surface. A plurality of second capillary pieces 144 are stacked on the first capillary piece 142, and each second capillary piece 144 abuts against the second plate body 120, that is, the plurality of second capillary pieces 144 play a role in supporting the second plate body 120 At the same time, it also has the effect of enhancing the liquid absorption of the vapor chamber 100 . Specifically, an additional microporous structure will be formed at the contact of the first capillary 142 and the second capillary 144, so that the liquid absorption area is increased compared to the separate arrangement of the first capillary 142 and the second capillary 144, Can enhance the liquid absorption effect.

That is to say, the first capillary member 142 cooperates with the plurality of second capillary members 144 to enhance the capillary action and enhance the liquid absorption effect.

The second plate body 120 formed by the aluminum-plastic film can ensure the high insulation of the formed chamber 130 and can ensure the vacuum environment in the chamber 130 .

In this embodiment, the shape of the second capillary 144 is a strip structure, and there is a gap between the end of the strip structure and the cavity wall of the chamber 130, so that each steam passage 150 can be guaranteed to communicate with the chamber 130 effectiveness and feasibility.

In some other embodiments, the shape of the second capillary member 144 is a block structure or a special-shaped structure, etc., which are not listed here. Wherein, the heteromorphic structure refers to a structure with an irregular shape.

Wherein, the second capillary member 144 is configured to absorb liquid through the capillary principle, so the liquid in the chamber 130 will produce a flow effect by capillary action, that is to say, the liquid easily flows along the second capillary member 144 to realize the second capillary flow. Member 144 picks up liquid.

Specifically, the second capillary 144 is a porous structure, and/or the second capillary 144 is a mesh structure. That is, micro-channels are formed inside the second capillary member 144, and the liquid will have a flow effect when subjected to capillary action. liquid purpose.

Specifically, the second capillary 144 includes any one or combination of the following: copper mesh, copper powder, copper wire, etc., which are not listed here.

In some embodiments, as shown in FIG. 21 , the capillary structure member 140 further includes: a plurality of third capillary members 230, the plurality of third capillary members 230 are arranged at intervals on the first end surface of the first capillary member 142, and the third The capillary 230 is attached to the first plate body 110 .

In this embodiment, the capillary structure 140 further includes a plurality of third capillary parts 230, each third capillary part 230 abuts between the first capillary part 142 and the first plate body 110, and the plurality of third capillary parts 230 plays a role of supporting the first capillary member 142 , and the plurality of third capillary members 230 also has the function of enhancing the liquid absorption of the vapor chamber 100 . Specifically, an additional microporous structure will be formed at the contact of the third capillary 230 and the first capillary 142, so that the liquid absorption area is increased compared with the separate arrangement of the third capillary 230 and the first capillary 142, Can enhance the liquid absorption effect.

That is to say, the first capillary member 142 cooperates with the plurality of third capillary members 230 to enhance the capillary action and enhance the liquid absorption effect.

In addition, the capillary structure further includes a plurality of second capillary elements 144 stacked between the capillary structure element 140 and the second plate body 120 .

In some embodiments, as shown in FIG. 7 and FIG. 13 , a part of the second plate body 120 is bent and arranged to form a wave structure. An arched portion 122 is formed.

In this embodiment, the structure of the second plate body 120 is further defined such that a part of the second plate body 120 is bent to form a wave structure, and the wave structure forms a plurality of bonding portions 124 and a plurality of arched portions 122 . That is to say, by defining the shape of a part of the second plate body 120 , the curved portion of the second plate body 120 is formed with a plurality of fitting parts 124 and a plurality of arched parts 122 , which are arranged to ensure that the fitting parts 124 In addition to the effectiveness and feasibility of fitting the capillary structure and forming the steam channel 150, the structural strength of the second plate body 120 can be enhanced, the deformation of the vapor chamber 100 can be avoided, and the weight of the second plate body 120 can be reduced. , which in turn is beneficial to reduce the weight of the vapor chamber 100 .

Specifically, a part of the second plate body 120 is stamped to form a corrugated structure, and this setting can ensure the matched dimensions of the plurality of fitting portions 124 and the plurality of arched portions 122 , and thus the matching dimensions of the plurality of steam channels 150 . This structural arrangement simplifies the assembly and subsequent disassembly process of the vapor chamber 100 because the assembly process of the arched part 122 and the bonding part 124 is omitted, which is conducive to improving the efficiency of assembly and disassembly, thereby reducing production and maintenance costs. . In addition, the bonding portion 124 and the raised portion 122 are integrally formed on the second plate body 120 so as to ensure the dimensional accuracy requirements of the molding of the product.

Specifically, as shown in FIGS. 11 and 12 , the second plate body 120 is placed between the third mold 700 and the fourth mold 800 , and the second plate body 120 is stamped using the third mold 700 and the fourth mold 800 , stamping the first region 210 of the second plate body 120 to form a wave structure, and the wave structure is formed with a plurality of bonding portions 124 and a plurality of arched portions 122 .

In some embodiments, as shown in FIG. 2, FIG. 6 and FIG. The peripheral side; the first area 210 of the first plate 110 and the first area 210 of the second plate 120 are separated, and the second area 220 of the first plate 110 and the second area 220 of the second plate 120 are attached , the first area 210 of the first plate body 110 and the first area 210 of the second plate body 120 form the cavity wall of the cavity 130 .

In this embodiment, the first board 110 includes a first area 210 and a second area 220 , the second board 120 includes a first area 210 and a second area 220 , the first area 210 and the second area of the first board 110 The first area 210 of the two boards 120 is separated, and the second area 220 of the first board 110 and the second area 220 of the second board 120 are attached. That is, the first area 210 of the first plate 110 and the first area 210 of the second plate 120 enclose the cavity 130 , the second area 220 of the first plate 110 and the second area of the second plate 120 220 is fitly connected to ensure the airtightness of the formed chamber 130.

Specifically, the first region 210 of the second plate body 120 is configured as a wave structure.

Specifically, the portion of the polymer layer 170 corresponding to the first region 210 forms a plurality of columnar protrusions.

Specifically, the capillary structure 140 is placed on the first region 210 of the first plate 110, and then the second plate 120 is placed on the side of the capillary structure 140 away from the first plate 110, and then the assembled The whole is placed between the first mold 300 and the second mold 400, and the edge regions of the first plate body 110 and the second plate body 120 are heat-press sealed using the first mold 300 and the second mold 400, that is, by The way of heating the first plate body 110 and the second plate body 120, and pressing the second area 220 of the first plate body 110 and the second area 220 of the second plate body 120, so that the first plate body 110 and the second plate body The body 120 is assembled together.

Specifically, the first plate body 110 is an aluminum-plastic film.

The electronic device according to some further embodiments of the present application includes: the vapor chamber 100 according to any of the above embodiments.

The electronic device according to the embodiment of the present application includes the vapor chamber 100 of the above embodiment, and thus has all the beneficial effects of the above vapor chamber 100 , which will not be stated here.

Specifically, the electronic device may be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also called an AR device), a virtual reality device (also called a VR device ) and handheld game consoles, etc.

The embodiment of the present application provides a method for manufacturing a vapor chamber, as shown in FIG. 22 , the method for manufacturing a vapor chamber includes:

Step 2202, placing the capillary structure on the first area of the first board;

Step 2204, placing the second plate on the side of the capillary structure away from the first plate, and adhering the bonding part to the capillary structure, and setting the arched part and the capillary structure at intervals to form a steam channel;

Step 2206, heating the first board body and the second board body to a first preset temperature, and pressing the second area of the first board body and the second area of the second board body.

In this embodiment, as shown in Figure 3, Figure 5, Figure 6, Figure 8, Figure 9, Figure 10, Figure 15, Figure 16 and Figure 17, the capillary structure is placed in the first region of the first plate , and then place the second plate on the side of the capillary structure away from the first plate, and then place the assembled whole between the first mold and the second mold, and use the first mold and the second mold to make the second plate The edge regions of the first plate and the second plate are thermocompression sealed, that is, by heating the first plate and the second plate, and pressing the second area of the first plate and the second plate the second area, so that the first board and the second board are assembled together.

Since the second plate body is an aluminum-plastic film plate. In the related art, the density of the chamber body is 8.9g/cm ³ , and the density of the aluminum-plastic film board is not higher than 2.5g/cm ³ , that is, the second board body of the present application is The density of the vapor chamber is greatly reduced, which will significantly reduce the weight of the vapor chamber, and provide effective and reliable structural support for the realization of light weight electronic equipment using the vapor chamber.

Specifically, the manufacturing method of the vapor chamber is used to manufacture the vapor chamber of any of the above embodiments.

Specifically, the first preset temperature is greater than or equal to 170°C and less than or equal to 200°C. For example, the first preset temperature includes 175° C., 180° C., 185° C., 190° C. or 195° C., etc., which are not listed here.

In some embodiments, as shown in FIG. 4 , the step of placing the capillary structure on the first region of the first plate specifically includes: placing the first capillary of the capillary structure on the first plate, And make the first end surface of the first capillary member face the first plate body; a plurality of second capillary members of the capillary structure are arranged at intervals on the second end surface of the first capillary member.

In this embodiment, a plurality of second capillary parts of the capillary structure are stacked on the first capillary part, each second capillary part abuts between the second plate body and the first capillary part, and any two adjacent capillary parts A steam channel is enclosed by the second capillary, the first capillary and the second plate, which can ensure the reliability and effectiveness of the steam channel forming.

It can be understood that, the capillary structure includes a first capillary and a plurality of second capillary, and the first capillary serves as a main capillary structure and acts as a liquid absorber on the entire surface. A plurality of second capillary parts are stacked on the first capillary part, and each second capillary part abuts against the second plate body, that is, the plurality of second capillary parts supports the second plate body while also reinforcing Vapor absorbs liquid. Specifically, an additional microporous structure will be formed at the contact of the first capillary and the second capillary, so that the liquid absorption area is increased compared with the separated arrangement of the first capillary and the second capillary, and the liquid absorption can be enhanced. Effect.

That is to say, the first capillary part cooperates with the plurality of second capillary parts to enhance capillary action and enhance liquid absorption.

The first plate body and the second plate body formed by the aluminum-plastic film can ensure the high insulation of the formed chamber, and can ensure the vacuum environment in the chamber.

In some embodiments, the step of placing the capillary structure on the first region of the first plate further includes: arranging a plurality of third capillary members of the capillary structure at intervals on the first end surface of the first capillary and between the first board.

In this embodiment, a plurality of third capillary members of the capillary structure are arranged at intervals between the first end surface of the first capillary member and the first plate body, and the plurality of third capillary members play a role in supporting the first capillary member. function, the multiple third capillary members also have the function of enhancing the liquid absorption of the vapor chamber. Specifically, an additional microporous structure will be formed at the contact between the third capillary and the first capillary, so that the liquid absorption area is increased compared with the separation between the third capillary and the first capillary, and the liquid absorption can be enhanced. Effect.

That is to say, the first capillary part cooperates with the plurality of third capillary parts to enhance the capillary action and enhance the liquid absorption effect.

In addition, the capillary structure further includes a plurality of second capillary elements stacked between the capillary structure element and the second plate body.

In some embodiments, before the step of placing the second plate on the side of the capillary structure away from the first plate, the method further includes: stamping the first region of the second plate to form a wave structure.

In this embodiment, the second plate body is placed between the third die and the fourth die, the second plate body is punched by using the third die and the fourth die, and the first region of the second plate body is punched to form Wavy structure. That is to say, the shape of the second plate body is changed by stamping, so that the first area of the second plate body is formed with a plurality of arched parts and a plurality of bonding parts, which are arranged to ensure that the bonding parts are bonded to the capillary structure. While setting and forming the effectiveness and feasibility of the steam channel, it can enhance the structural strength of the second plate body, avoid deformation of the vapor chamber, and help reduce the weight of the second plate body, which in turn is beneficial to reduce the vapor chamber. weight.

Specifically, the first region of the second plate body is stamped to form a corrugated structure, and this setting can ensure the matching dimensions of the multiple bonding portions and the multiple arched portions, and thus can ensure the matching dimensions of the multiple steam channels. This structural arrangement simplifies the assembly and subsequent disassembly process of the vapor chamber because the assembly process of the arched part and the bonding part is omitted, which is beneficial to improve the efficiency of assembly and disassembly, thereby reducing production and maintenance costs. In addition, the bonding portion and the raised portion are integrally formed on the second plate body to ensure the dimensional accuracy requirements of the molding of the product.

In some embodiments, before the step of placing the second plate on the side of the capillary structure away from the first plate, further comprising: heating the second plate to a second preset temperature, and compression molding the second plate , so that the polymer layer of the second plate forms a plurality of columnar protrusions arranged at intervals.

In this embodiment, the second plate body is placed between the fifth mold and the sixth mold, and the first region of the second plate body is hot-pressed by using the fifth mold and the sixth mold, that is, by heating the first The second plate body is brought to a second preset temperature, and the second plate body is compression-molded, so that the polymer layer of the second plate body forms a plurality of columnar protrusions arranged at intervals, and each columnar protrusion is in contact with the capillary structure. Lean, that is, the top of each cylindrical protrusion abuts against the capillary structure. The second plate not only has the function of forming a part of the cavity wall of the cavity, but also can abut against the capillary structure to meet the requirement of forming multiple steam channels. This step can avoid the situation that additional devices are used to define multiple steam channels, rationally utilizes the structure of the second plate body, simplifies the manufacturing process of the vapor chamber, and further reduces the production cost of the product.

It can be understood that when the second plate is heated, the polymer layer of the second plate is in a slightly fused state at a certain temperature. At this time, the fifth mold and the sixth mold are used to heat press the polymer layer of the second plate , the polymer layer can be constructed into multiple cylindrical protrusions, which can play a supporting role, while retaining a certain thickness of the polymer layer to isolate the working fluid inside the vapor chamber from the aluminum foil layer. To ensure the reliability of the vapor chamber.

Specifically, the second preset temperature is greater than or equal to 170°C and less than or equal to 200°C. For example, the second preset temperature includes 175° C., 180° C., 185° C., 190° C. or 195° C., etc., which are not listed here.

In the description of this specification, references to the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific examples," or "some examples" are intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present application. The scope of the application is defined by the claims and their equivalents.

Claims (10)

1. A vapor chamber, characterized in that it comprises: first board; The second plate body, the first plate body and the second plate body enclose a cavity, and the second plate body is an aluminum-plastic film; a capillary structure located in the chamber and provided on the first plate; Wherein, the second plate body includes a plurality of alternately connected arched parts and fitting parts, the fitting parts are arranged in contact with the capillary structure, and the arched parts and the capillary structure are arranged at intervals to form steam channels. 2. The vapor chamber according to claim 1, wherein the second plate body comprises a nylon layer, an aluminum foil layer and a polymer layer stacked in sequence; The polymer layer includes a plurality of columnar protrusions arranged at intervals, the columnar protrusions form the bonding portion, and the side of the columnar protrusions away from the aluminum foil layer is attached to the capillary structure. Together, the steam channel is formed between two adjacent cylindrical protrusions. 3. The vapor chamber according to claim 1, wherein the capillary structure comprises a first capillary and a plurality of second capillaries, and the first capillary comprises a first end surface and a first end surface oppositely arranged. Two end surfaces, the first end surface of the first capillary member faces the first plate body, the plurality of second capillary members are arranged at intervals on the second end surface of the first capillary member, and the second capillary member is connected to the second end surface of the first capillary member. The bonding portion is configured to be bonded. 4. The vapor chamber according to claim 3, wherein the capillary structure further comprises: A plurality of third capillary pieces are arranged at intervals on the first end surface of the first capillary piece, and the third capillary pieces are arranged in close contact with the first board body. 5. The vapor chamber according to claim 1, characterized in that, a part of the second plate body is bent to form a wave structure, the trough of the second plate body forms the bonding portion, the The arched portion is formed at the crest of the second plate body. 6. The vapor chamber according to claim 1, wherein the first plate body and the second plate body both comprise a first area and a second area, and the second area is located at the second the perimeter of the area; The first area of the first plate is separated from the first area of the second plate, the second area of the first plate is separated from the first area of the second plate The two regions are bonded together, and the first region of the first board and the first region of the second board form a cavity wall of the chamber. 7. The vapor chamber according to claim 1, wherein the first plate body is made of aluminum-plastic film. 8. An electronic device, characterized in that it comprises: A vapor chamber as claimed in any one of claims 1 to 7. 9. A method for manufacturing a vapor chamber, for manufacturing the vapor chamber according to any one of claims 1 to 8, characterized in that, the method for manufacturing a vapor chamber comprises: placing the capillary structure on the first region of the first plate; The second plate is placed on the side of the capillary structure away from the first plate, and the bonding part is placed in contact with the capillary structure, and the arched part and the The capillary structural members are arranged at intervals to form steam channels; heating the first plate body and the second plate body to a first preset temperature, and pressing the second area of the first plate body and the second area of the second plate body. 10. The method for manufacturing a vapor chamber according to claim 9, wherein the step of placing the capillary structure on the first region of the first plate body specifically comprises: placing the first capillary of the capillary structure on the first plate, and making the first end surface of the first capillary face the first plate; A plurality of second capillaries of the capillary structure are arranged at intervals on the second end surface of the first capillary.

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