CN115326358A - High and low temperature tracking error testing device and method for optical device and computer storage medium - Google Patents
High and low temperature tracking error testing device and method for optical device and computer storage medium Download PDFInfo
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- CN115326358A CN115326358A CN202211246268.4A CN202211246268A CN115326358A CN 115326358 A CN115326358 A CN 115326358A CN 202211246268 A CN202211246268 A CN 202211246268A CN 115326358 A CN115326358 A CN 115326358A
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- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/30—Testing of optical devices, constituted by fibre optics or optical waveguides
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- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
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- G01M11/02—Testing optical properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
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Abstract
The application discloses a high and low temperature tracking error testing device and method for an optical device and a computer storage medium, the device comprises: the heat conduction cushion blocks are arranged in a covering space formed by the upper cover plate and the lower cover plate, and each heat conduction cushion block is provided with a groove for placing a device to be measured; the temperature equalizing plate is attached to the heat conducting cushion blocks and arranged between the heat conducting cushion blocks and the lower cover plate; the semiconductor refrigerator is attached to the temperature-uniforming plate and arranged between the temperature-uniforming plate and the lower cover plate; and the water cooling plate is attached to the semiconductor refrigerator and arranged between the semiconductor refrigerator and the lower cover plate. The embodiment of the application sets up the heat conduction cushion that is used for holding the optical device through the upper cover plate with the lid that laps down and form in closing the space to rise the temperature to the heat conduction cushion through the samming board, make the rise and fall of optical device warm faster, improved the efficiency of the TE test of optical device, and the samming board can reduce the difference in temperature between the different heat conduction cushions, improve the degree of accuracy that optical device tested in batches.
Description
Technical Field
The application relates to the technical field of optical devices, in particular to a device and a method for testing high and low temperature tracking errors of an optical device and a computer storage medium.
Background
TE (Tracking Error) is a ratio of power output by an optical fiber connecting an optical device under two different temperature conditions and a condition that the backlight of the optical device is consistent. The tracking error is an important index for measuring the stability of the output power of the optical device under different temperature conditions. The tracking error of the optical device is therefore an indicator that the optical device manufacturer has to test.
Most of the TE tests of the existing optical devices are realized by high-temperature and low-temperature boxes, and the defects are that the temperature rise and fall process is slow, and one test is 1 hour, so the TE test efficiency of the existing optical devices is low.
Disclosure of Invention
The embodiment of the application provides a device and a method for testing high and low temperature tracking errors of an optical device and a computer storage medium, and aims to improve the TE testing efficiency of the optical device.
In one aspect, the present application provides an optical device high and low temperature tracking error testing apparatus, the apparatus includes:
the workbench comprises an upper cover plate and a lower cover plate, and the upper cover plate is covered with the lower cover plate;
the heat conduction cushion blocks are arranged in a covering space formed by the upper cover plate and the lower cover plate, each heat conduction cushion block is provided with a groove for placing a device to be tested, each groove comprises an opening for accommodating a power supply connector and an optical fiber connector, and the power supply connectors are used for supplying power to the device to be tested;
the temperature equalizing plate is arranged between the heat conduction cushion blocks and the lower cover plate and is attached to the heat conduction cushion blocks;
the semiconductor refrigerator is arranged between the temperature-uniforming plate and the lower cover plate and is attached to the temperature-uniforming plate;
and the water cooling plate is arranged between the semiconductor refrigerator and the lower cover plate and is attached to the semiconductor refrigerator, and the water cooling plate is respectively connected with the water inlet pipe and the water outlet pipe to form a water cooling circulation loop.
In some embodiments, the apparatus further comprises:
the first temperature sensor is attached to the temperature-equalizing plate and used for detecting the temperature of the temperature-equalizing plate;
and the semiconductor refrigerator is connected with a semiconductor refrigerator temperature controller, and the semiconductor refrigerator temperature controller is connected with the first temperature sensor and used for adjusting the working current of the semiconductor refrigerator according to the temperature detected by the first temperature sensor and the target temperature required to be reached by the optical device to be detected.
In some embodiments, the apparatus further comprises:
and the heating plate is attached to the water cooling plate and used for heating the water cooling plate.
In some embodiments, the apparatus further comprises:
the second temperature sensor is attached to the water cooling plate and used for detecting the temperature of the water cooling plate;
and the heating sheet is also used for stopping heating the water cooling plate when the temperature detected by the second temperature sensor is greater than the temperature threshold value.
On the other hand, an embodiment of the present application provides a method for testing high and low temperature tracking errors of an optical device, which is applied to any one of the above-mentioned apparatuses for testing high and low temperature tracking errors of an optical device, and the method includes:
acquiring a target temperature to be reached by a device to be measured;
when the temperature detected by the first temperature sensor is lower than the target temperature, controlling the surface, attached to the temperature-uniforming plate, in the semiconductor refrigerator to heat until the temperature detected by the first temperature sensor is equal to the target temperature;
when the temperature detected by the first temperature sensor is equal to the target temperature, acquiring the output power of an optical fiber connected with the optical device to be detected;
and determining the tracking error of the optical device to be detected according to the output power of the optical fiber connected with the optical device to be detected.
In some embodiments, the method further comprises:
and when the temperature detected by the first temperature sensor is lower than the target temperature, controlling the water cooling plate to stop water cooling circulation, and controlling the heating sheet to heat the water cooling plate.
In some embodiments, the controlling the water-cooling plate to stop performing the water-cooling cycle and the heating sheet to heat the water-cooling plate when the temperature detected by the first temperature sensor is less than the target temperature includes:
when the temperature detected by the first temperature sensor is lower than the target temperature, acquiring a temperature difference value between the target temperature and the temperature detected by the first temperature sensor;
determining the heating rate of the device to be measured according to the temperature difference;
and when the temperature rise rate is smaller than the preset rate, controlling the water cooling plate to stop water cooling circulation, and controlling the heating sheet to heat the water cooling plate.
In some embodiments, after determining the temperature increase rate of the device to be measured according to the temperature difference, the method further includes:
and when the temperature rise rate is greater than or equal to the preset rate, controlling the water cooling plate to perform water cooling circulation.
In some embodiments, after acquiring the target temperature that needs to be reached by the device to be measured, the method further includes:
when the temperature detected by the first temperature sensor is higher than the target temperature, controlling the surface, attached to the temperature equalizing plate, of the semiconductor refrigerator to refrigerate, and controlling the water cooling plate to perform water cooling circulation until the temperature detected by the first temperature sensor is equal to the target temperature;
when the surface, attached to the temperature equalizing plate, of the semiconductor refrigerator is controlled to refrigerate, the working current of the semiconductor refrigerator is adjusted according to the temperature difference between the temperature detected by the first temperature sensor and the target temperature required to be reached by the optical device to be detected.
In another aspect, the present application further provides a computer-readable storage medium, on which a computer program is stored, where the computer program is loaded by a processor to execute the steps in the method for testing the tracking error of the optical device in high and low temperatures.
The embodiment of the application provides a device and a method for testing high and low temperature tracking errors of an optical device and a computer storage medium, wherein the device comprises: the workbench comprises an upper cover plate and a lower cover plate, and the upper cover plate is covered with the lower cover plate; the heat conduction cushion blocks are arranged in a covering space formed by the upper cover plate and the lower cover plate, each heat conduction cushion block is provided with a groove for placing a device to be tested, each groove comprises an opening for accommodating a power supply connector and an optical fiber connector, and the power supply connectors are used for supplying power to the device to be tested; the temperature equalizing plate is arranged between the heat conduction cushion blocks and the lower cover plate and is attached to the heat conduction cushion blocks; the semiconductor refrigerator is arranged between the temperature-uniforming plate and the lower cover plate and is attached to the temperature-uniforming plate; and the water cooling plate is arranged between the semiconductor refrigerator and the lower cover plate and is attached to the semiconductor refrigerator, and the water cooling plate is respectively connected with the water inlet pipe and the water outlet pipe to form a water cooling circulation loop. This application embodiment closes the space through the lid that upper cover plate and lower apron formed in, sets up the heat conduction cushion that is used for holding optical device to heat conduction cushion goes up and down the temperature through the temperature equalizing board, compare in going up and down the temperature through high low-temperature cabinet, can make the temperature rise and fall of optical device faster, improved the efficiency of the TE test of optical device, and the temperature difference between the different heat conduction cushion can be reduced to the temperature equalizing board, the degree of accuracy of optical device batch test is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is an overall structural diagram of an optical device high and low temperature tracking error testing apparatus provided in an embodiment of the present application;
fig. 2 is a schematic view of a structure included in a covering space formed by an upper cover plate and a lower cover plate provided in an embodiment of the present application;
fig. 3 is an exploded view of a structure included in a covering space formed by an upper cover plate and a lower cover plate provided in the embodiment of the present application;
fig. 4 is a schematic control relationship diagram of each structure in the optical device high and low temperature tracking error testing apparatus provided in the embodiment of the present application;
FIG. 5 is a schematic flowchart of a method for testing high and low temperature tracking errors of an optical device according to an embodiment of the present disclosure;
fig. 6 is a schematic terminal structure diagram of an embodiment of a computer device provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered limiting of the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the application. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present application may be practiced without these specific details. In other instances, well-known structures and processes are not set forth in detail in order to avoid obscuring the description of the present application with unnecessary detail. Thus, the present application is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
It should be noted that, since the method in the embodiment of the present application is executed in a computer device, processing objects of each computer device all exist in the form of data or information, for example, time, which is substantially time information, and it is understood that, in the subsequent embodiments, if size, number, position, and the like are mentioned, corresponding data exist so as to be processed by the computer device, and details are not described herein.
The embodiments of the present application provide an apparatus and a method for testing high and low temperature tracking errors of an optical device, and a computer storage medium, which are described in detail below.
Referring to fig. 1 to 4, the optical device high and low temperature tracking error testing apparatus includes: the device comprises a control box 1, a workbench 2, a plurality of heat conducting cushion blocks 205, a temperature equalizing plate 210, a semiconductor Cooler 211 (TEC), and a water cooling plate 209.
The control box 1 includes a main control board 101 and a power supply interface.
Workstation 2 sets up in 1 top of control box, and workstation 2 includes upper cover plate 201 and lower cover plate 202, and lower cover plate 202 includes bottom surface plate and side board, and upper cover plate 201 is used for covering with lower cover plate 202, sets up through the cooperation between upper cover plate 201, side board and the bottom surface plate, forms the lid and closes the space. When the optical device high and low temperature tracking error testing device operates, dry gas is filled into the covering space, so that condensation or frosting in the covering space under a low temperature environment is avoided, and the safety of the optical device high and low temperature tracking error testing device is improved.
A plurality of heat conduction pads 205 are disposed in the covering space formed by the upper cover plate 201 and the lower cover plate 202, in fig. 1 to 4, a case of 4 heat conduction pads 205 is illustrated, and the 4 heat conduction pads 205 are sequentially arranged at the same horizontal height. Each heat conduction pad 205 has a groove for placing the to-be-tested optical device 206, that is, one to-be-tested optical device 206 can be placed in the groove of one heat conduction pad 205, and a plurality of heat conduction pads 205 can realize batch testing of a plurality of to-be-tested optical devices 206. The recess includes openings for receiving a power supply connector 207 and a fiber connector 208, the power supply connector 207 is used for connecting the optical device under test 206 to a power supply interface in the control box 1, so as to supply power to the optical device under test 206 through the control box 1. The optical fiber connector 208 is used to connect the optical device 206 to be tested to the optical fiber, and the output end of the optical fiber is connected to a tester of the output power of the optical fiber, so as to test the output power of the optical fiber connected to the optical device 206 to be tested by the tester.
The temperature equalizing plate 210 is disposed between the heat conducting pads 205 and the lower cover plate 202, and is attached to the plurality of heat conducting pads 205, that is, the upper surface of the temperature equalizing plate 210 is attached to the lower surfaces of the plurality of heat conducting pads 205, respectively. Because the heat in the uniform temperature plate 210 is conducted on a two-dimensional surface, the temperature at each position on the upper surface of the uniform temperature plate 210 is basically the same, so that the temperature difference between the heat conduction cushion blocks 205 is reduced, and through testing, the uniform temperature plate 210 can control the temperature difference between different heat conduction cushion blocks 205 within 0.5 ℃, so that when a plurality of optical devices to be tested are subjected to high and low temperature tracking error testing simultaneously, the temperature difference between the optical devices to be tested in different heat conduction cushion blocks 205 is smaller, and the accuracy of batch testing of the optical devices is improved.
The semiconductor refrigerator 211 is disposed between the temperature-uniforming plate 210 and the lower cover plate 202, and is attached to the temperature-uniforming plate 210, that is, the upper surface of the semiconductor refrigerator 211 is attached to the lower surface of the temperature-uniforming plate 210. When the semiconductor cooler 211 is operated, the lower surface is used for cooling if the upper surface is used for heating, and the lower surface is used for heating if the upper surface is used for cooling.
The water cooling plate 209 is disposed between the semiconductor cooler 211 and the lower cover plate 202, and is attached to the semiconductor cooler 211, that is, the upper surface of the water cooling plate 209 is attached to the lower surface of the semiconductor cooler 211. The water cooling plate 209 is respectively connected with the water inlet pipe 203 and the water outlet pipe 204, the other end of the water inlet pipe 203 is communicated with the water cooling machine 3, the other end of the water outlet pipe 204 is also communicated with the water cooling machine 3, and a water cooling circulation loop is formed by the cooperation of the water cooling plate 209, the water outlet pipe 204, the water cooling machine 3 and the water inlet pipe 203. After the water cooling machine 3 is started, water in the water cooling plate 209 circularly flows along the water cooling circulation loop, and water cooling circulation is realized. As shown in fig. 4, the water cooler 3 is further connected to a main control board 101, and the main control board 101 is used for controlling the opening and closing of the water cooler 3.
In some embodiments, the optical device high and low temperature tracking error testing apparatus further includes a first temperature sensor 214. The first temperature sensor 214 is attached to the vapor chamber 210 and used for detecting the temperature of the vapor chamber 210 in real time, and the first temperature sensor 214 can be attached to the upper surface of the vapor chamber 210.
The semiconductor refrigerator 211 is connected with a semiconductor refrigerator temperature controller 102, and the semiconductor refrigerator temperature controller 102 is connected with a first temperature sensor 214 and used for adjusting the working current of the semiconductor refrigerator 211 according to the temperature detected by the first temperature sensor 214 and the target temperature to be reached by the optical device 206 to be detected. As shown in fig. 4, the semiconductor cooler temperature controller 102 is further connected to the main control board 101, and the main control board 101 is further configured to control the semiconductor cooler temperature controller 102 according to the temperature detected by the first temperature sensor 214 and the target temperature that needs to be reached by the optical device 206 to be measured, so as to adjust the operating current of the semiconductor cooler 211 through the semiconductor cooler temperature controller 102, so that the upper surface of the semiconductor cooler 211 is cooled or heated, and when the operating current of the semiconductor cooler 211 changes, the power for cooling or heating the upper surface of the semiconductor cooler 211 is also changed accordingly.
In some embodiments, the optical device high and low temperature tracking error testing apparatus further includes a heating plate 212. The heating sheet 212 is attached to the water-cooling plate 209 and used for heating the water-cooling plate 209. As shown in fig. 4, the heating sheet 212 is connected to the main control board 101, and the main control board 101 is further configured to control the heating sheet 212 to start or stop heating. It should be noted that, when the heating plate 212 heats the water cooling plate 209, the water cooler 3 is in a closed state to prevent the water cooling circulation in the water cooling plate 209 from taking away and dissipating heat generated by the heating plate 212. By heating the heating plate 212, the temperature difference between the upper surface and the lower surface of the semiconductor cooler 211 can be reduced, and the service life of the semiconductor cooler 211 can be improved.
In some embodiments, the optical device high and low temperature tracking error testing apparatus further includes a second temperature sensor 213. The second temperature sensor 213 is attached to the water cooling plate 209 for detecting the temperature of the water cooling plate 209. As shown in fig. 4, the second temperature sensor 213 is connected to the main control board 101, and the main control board 101 is further configured to control the heating sheet 212 to stop heating the water cooling plate 209 when the temperature detected by the second temperature sensor 213 is greater than the temperature threshold, so as to avoid the temperature of the water cooling plate 209 from being too high, and implement high temperature protection of the optical device high and low temperature tracking error testing apparatus.
In the technical scheme disclosed in this embodiment, the heat conduction pad 205 for accommodating the optical device is arranged in the covering space formed by the upper cover plate 201 and the lower cover plate 202, and the temperature of the heat conduction pad 205 is increased and decreased by the temperature equalizing plate 210, so that the temperature of the optical device is increased and decreased more quickly, rapid temperature change in a range of-40 ℃ to 85 ℃ can be realized, the TE test efficiency of the optical device is improved, the temperature difference between different heat conduction pads 205 can be reduced by the temperature equalizing plate 210, and the accuracy of batch test of the optical device is improved. And for going up and down the temperature through high low-temperature box, the high low temperature tracking error testing arrangement of optical device of this embodiment is compacter structurally, and it is also more convenient to operate.
Referring to fig. 5, in an embodiment, a method for testing high and low temperature tracking errors of an optical device is applied to any one apparatus for testing high and low temperature tracking errors of an optical device, and includes:
501. acquiring a target temperature to be reached by a device to be measured;
in this embodiment, the device to be measured is first placed in the groove of the heat conducting pad, the power supply connector and the optical fiber connector are respectively connected to the device to be measured, the upper cover plate and the lower cover plate are covered, and a covering space formed by the upper cover plate and the lower cover plate is filled with dry gas. Because the tracking error is the ratio of the output power of the optical fiber connected with the optical device under the conditions of two different temperatures and consistent backlight of the optical device, the temperatures under the temperature conditions can be sequentially used as target temperatures to be reached by the optical device to be tested respectively so as to sequentially test the output power of the optical fiber connected with the optical device to be tested under the temperature conditions.
In some embodiments, for a batch test scenario of multiple optical devices to be tested, each optical device to be tested may be placed in a groove of a corresponding heat conducting pad, and then output powers of optical fibers connecting different optical devices to be tested under the same temperature condition (i.e., under the same target temperature) are simultaneously tested, so as to obtain tracking errors of different optical devices to be tested.
502. When the temperature detected by the first temperature sensor is lower than the target temperature, controlling the surface, attached to the temperature equalizing plate, of the semiconductor refrigerator to heat until the temperature detected by the first temperature sensor is equal to the target temperature;
in this embodiment, when the temperature detected by the first temperature sensor is lower than the target temperature, it is determined that the vapor chamber needs to be heated, and therefore, the surface of the semiconductor cooler attached to the vapor chamber (i.e., the upper surface of the semiconductor cooler) is controlled to heat, generate heat, and transmit the heat to the vapor chamber. The temperature equalizing plate then transfers the heat uniformly to each heat conducting cushion block, thereby increasing the temperature of the optical device to be measured in the groove of each heat conducting cushion block. And when the temperature detected by the first temperature sensor is equal to the target temperature, controlling the surface, attached to the temperature equalizing plate, of the semiconductor refrigerator to stop heating.
In some embodiments, when the difference between the actual temperature of the optical device to be measured and the target temperature is large, the temperature-rising rate of the optical device to be measured is still low, and the optical device to be measured still needs a long time to reach the target temperature, so as to increase the temperature-rising rate of the optical device to be measured, when the temperature detected by the first temperature sensor is lower than the target temperature, the water-cooling plate is controlled to stop performing the water-cooling cycle, and the heating sheet is controlled to heat the water-cooling plate. Thus, when the heating sheet heats the water cooling plate, the surface of the semiconductor refrigerator, which is attached to the water cooling plate, has higher ambient temperature during refrigeration, so that the refrigeration efficiency of the surface of the semiconductor refrigerator, which is attached to the water cooling plate, is improved. Because the semiconductor refrigerator transfers the heat of the cold end to the hot end, the heating efficiency of the surface, which is attached to the temperature-uniforming plate, in the semiconductor refrigerator is higher, and the heating rate of the temperature-uniforming plate and the optical device to be tested is improved. In addition, the temperature difference between the upper surface and the lower surface of the semiconductor refrigerator can be reduced, and the service life of the semiconductor refrigerator is prolonged.
In some embodiments, when the temperature detected by the first temperature sensor is less than the target temperature, controlling the water-cooling plate to stop performing the water-cooling cycle, and controlling the heating sheet to heat the water-cooling plate may include: when the temperature detected by the first temperature sensor is lower than the target temperature, acquiring a temperature difference value between the target temperature and the temperature detected by the first temperature sensor; determining the heating rate of the device to be measured according to the temperature difference, wherein the heating rate is in positive correlation with the temperature difference; and when the heating rate is less than the preset rate, judging that the heating rate of the optical device to be detected is low, and controlling the water-cooling plate to stop water-cooling circulation and controlling the heating sheet to heat the water-cooling plate. In some embodiments, determining the temperature increase rate of the device under test based on the temperature difference may include: and directly taking the temperature difference value as the heating rate of the optical device to be measured. In some embodiments, when the temperature rising rate is greater than or equal to the preset rate, the water cooling plate may be controlled to perform a water cooling cycle, and the heating plate may be controlled to stop heating, so as to avoid an excessive temperature of the water cooling plate. In some embodiments, when the temperature rising rate is less than the preset rate, controlling the heating sheet to heat the water-cooled plate may include: when the temperature rise rate is smaller than the preset rate, determining the target operation power of the heating sheet based on the temperature rise rate, and controlling the heating sheet to heat the water cooling plate by using the target operation power, namely controlling the operation power of the heating sheet as the target operation power, wherein the target operation power is in negative correlation with the temperature rise rate, so that the temperature rise rate is increased when the temperature rise rate is smaller, and the phenomenon that the temperature of the to-be-measured optical device is over-heated due to the fact that the temperature rises too fast when the temperature rise rate is larger is avoided.
In some embodiments, when the heating plate heats the water-cooling plate, it is determined whether the temperature detected by the second temperature sensor is greater than a temperature threshold, and if the temperature detected by the second temperature sensor is greater than the temperature threshold, the semiconductor refrigerator is controlled to be turned off, the heating plate is controlled to stop heating, and the water-cooling plate is controlled to perform a water-cooling cycle, so as to dissipate heat of the optical device high and low temperature tracking error testing apparatus, so as to avoid an excessively high temperature of the water-cooling plate, and achieve high temperature protection of the optical device high and low temperature tracking error testing apparatus.
In some embodiments, when the temperature detected by the first temperature sensor is higher than the target temperature, it is determined that the temperature equalization plate needs to be cooled, and therefore, the surface attached to the temperature equalization plate in the semiconductor cooler is controlled to cool, and heat is absorbed from the temperature equalization plate. The surface of the semiconductor refrigerator, which is attached to the temperature equalizing plate, transfers the absorbed heat to the surface of the semiconductor refrigerator, which is attached to the water cooling plate. The water cooling circulation is carried out by controlling the water cooling plate so as to take away and dissipate heat transferred to the surface, attached to the water cooling plate, of the semiconductor refrigerator. And when the temperature detected by the first temperature sensor is equal to the target temperature, controlling the surface attached to the temperature equalizing plate in the semiconductor refrigerator to stop refrigerating. When the surface attached to the temperature equalizing plate in the semiconductor refrigerator is controlled to refrigerate, the working current of the semiconductor refrigerator is adjusted according to the temperature difference between the temperature detected by the first temperature sensor and the target temperature to be reached by the optical device to be detected, so that the temperature detected by the first temperature sensor is gradually reduced to reach the target temperature.
503. When the temperature detected by the first temperature sensor is equal to the target temperature, acquiring the output power of an optical fiber connected with the optical device to be detected;
504. and determining the tracking error of the optical device to be measured according to the output power of the optical fiber connected with the optical device to be measured.
In this embodiment, when the temperature detected by the first temperature sensor is equal to the target temperature, the output power of the optical fiber connected to the optical device to be measured is measured by the optical fiber output power tester, and then the temperature at the next temperature is used as the target temperature to be reached by the optical device to be measured, so as to obtain the corresponding output power. And after the output power of the optical fiber connected with the optical device to be tested under different temperature conditions is obtained, calculating the ratio of the output power under different temperatures to obtain the tracking error of the optical device to be tested. And aiming at batch test scenes of a plurality of optical devices to be tested, the tracking error of each optical device to be tested can be obtained.
In the technical scheme disclosed in this embodiment, through in the space is closed with the lid that laps down and form at the upper cover plate, set up the heat conduction cushion that is used for holding optical device to heat conduction cushion through the samming board, make the rise and fall of optical device warm faster, improved the efficiency of the TE test of optical device, and the samming board can reduce the difference in temperature between the different heat conduction cushions, improve the degree of accuracy that optical device tested in batches.
The embodiment of the application also provides computer equipment, which integrates the control box provided by the embodiment of the application. As shown in fig. 6, it shows a schematic structural diagram of a computer device according to an embodiment of the present application, specifically:
the computer device may include components such as a processor 601 of one or more processing cores, memory 602 of one or more computer-readable storage media, a power supply 603, and an input unit 604. Those skilled in the art will appreciate that the computer device configuration shown in fig. 6 is not intended to constitute a limitation of computer devices, and may include more or fewer components than shown, or some components may be combined, or a different arrangement of components. Wherein:
the processor 601 is a control center of the computer device, connects various parts of the whole computer device by using various interfaces and lines, and performs various functions of the computer device and processes data by running or executing software programs and/or modules stored in the memory 602 and calling data stored in the memory 602, thereby monitoring the computer device as a whole. Alternatively, processor 601 may include one or more processing cores; preferably, the processor 601 may integrate an application processor, which mainly handles operating systems, user interfaces, application programs, etc., and a modem processor, which mainly handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 601.
The memory 602 may be used to store software programs and modules, and the processor 601 executes various functional applications and data processing by operating the software programs and modules stored in the memory 602. The memory 602 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required by at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may store data created according to use of the computer device, and the like. Further, the memory 602 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device. Accordingly, the memory 602 may also include a memory controller to provide the processor 601 with access to the memory 602.
The computer device further comprises a power supply 603 for supplying power to the various components, and preferably, the power supply 603 is logically connected to the processor 601 via a power management system, so that functions of managing charging, discharging, and power consumption are realized via the power management system. The power supply 603 may also include any component including one or more dc or ac power sources, recharging systems, power failure detection circuitry, power converters or inverters, power status indicators, and the like.
The computer device may further include an input unit 604, and the input unit 604 may be used to receive input numeric or character information and generate signal inputs related to user settings and function control.
Although not shown, the computer device may further include a display unit and the like, which are not described in detail herein. Specifically, in this embodiment, the processor 601 in the computer device loads the executable file corresponding to the process of one or more application programs into the memory 602 according to the following instructions, and the processor 601 runs the application programs stored in the memory 602, thereby implementing various functions as follows:
acquiring a target temperature to be reached by a device to be measured;
when the temperature detected by the first temperature sensor is lower than the target temperature, controlling the surface, attached to the temperature equalizing plate, of the semiconductor refrigerator to heat until the temperature detected by the first temperature sensor is equal to the target temperature;
when the temperature detected by the first temperature sensor is equal to the target temperature, acquiring the output power of an optical fiber connected with the optical device to be detected;
and determining the tracking error of the optical device to be detected according to the output power of the optical fiber connected with the optical device to be detected.
It will be understood by those skilled in the art that all or part of the steps of the methods of the above embodiments may be performed by instructions, or by instructions controlling associated hardware, which may be stored in a computer-readable storage medium and loaded and executed by a processor.
To this end, an embodiment of the present application provides a computer-readable storage medium, which may include: read Only Memory (ROM), random Access Memory (RAM), magnetic or optical disks, and the like. The computer program is loaded by a processor to execute the steps of any one of the methods for testing the tracking error of the optical device according to the embodiments of the present application. For example, the computer program may be loaded by a processor to perform the steps of:
acquiring a target temperature to be reached by a device to be measured;
when the temperature detected by the first temperature sensor is lower than the target temperature, controlling the surface, attached to the temperature-uniforming plate, in the semiconductor refrigerator to heat until the temperature detected by the first temperature sensor is equal to the target temperature;
when the temperature detected by the first temperature sensor is equal to the target temperature, acquiring the output power of an optical fiber connected with the optical device to be detected;
and determining the tracking error of the optical device to be detected according to the output power of the optical fiber connected with the optical device to be detected.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, which are not described herein again.
In a specific implementation, each unit or structure may be implemented as an independent entity, or may be combined arbitrarily to be implemented as one or several entities, and the specific implementation of each unit or structure may refer to the foregoing method embodiment, which is not described herein again.
The above operations can be implemented in the foregoing embodiments, and are not described in detail herein.
The device, the method and the computer storage medium for testing the high and low temperature tracking error of the optical device provided by the embodiment of the present application are introduced in detail, and a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. An optical device high and low temperature tracking error testing device, characterized in that the device comprises:
the workbench comprises an upper cover plate and a lower cover plate, and the upper cover plate is used for covering the lower cover plate;
the heat conduction cushion blocks are arranged in a covering space formed by the upper cover plate and the lower cover plate, each heat conduction cushion block is provided with a groove for placing a device to be tested, each groove comprises an opening for accommodating a power supply connector and an optical fiber connector, and the power supply connectors are used for supplying power to the device to be tested;
the temperature equalizing plate is arranged between the heat conduction cushion blocks and the lower cover plate and is attached to the heat conduction cushion blocks;
the semiconductor refrigerator is arranged between the temperature-uniforming plate and the lower cover plate and is attached to the temperature-uniforming plate;
and the water cooling plate is arranged between the semiconductor refrigerator and the lower cover plate and is attached to the semiconductor refrigerator, and the water cooling plate is respectively connected with the water inlet pipe and the water outlet pipe to form a water cooling circulation loop.
2. The optical device high and low temperature tracking error testing apparatus as claimed in claim 1, wherein said apparatus further comprises:
the first temperature sensor is attached to the temperature-equalizing plate and used for detecting the temperature of the temperature-equalizing plate;
and the semiconductor refrigerator is connected with a semiconductor refrigerator temperature controller, and the semiconductor refrigerator temperature controller is connected with the first temperature sensor and used for adjusting the working current of the semiconductor refrigerator according to the temperature detected by the first temperature sensor and the target temperature required to be reached by the optical device to be detected.
3. The optical device high and low temperature tracking error testing apparatus of claim 1, further comprising:
and the heating sheet is attached to the water cooling plate and used for heating the water cooling plate.
4. The optical device high and low temperature tracking error testing apparatus as claimed in claim 3, wherein said apparatus further comprises:
the second temperature sensor is attached to the water cooling plate and used for detecting the temperature of the water cooling plate;
and the heating sheet is also used for stopping heating the water cooling plate when the temperature detected by the second temperature sensor is greater than the temperature threshold value.
5. An optical device high and low temperature tracking error testing method, applied to the optical device high and low temperature tracking error testing apparatus according to any one of claims 2 to 4, the method comprising:
acquiring a target temperature to be reached by a device to be measured;
when the temperature detected by the first temperature sensor is lower than the target temperature, controlling the surface, attached to the temperature-uniforming plate, in the semiconductor refrigerator to heat until the temperature detected by the first temperature sensor is equal to the target temperature;
when the temperature detected by the first temperature sensor is equal to the target temperature, acquiring the output power of an optical fiber connected with the optical device to be detected;
and determining the tracking error of the optical device to be detected according to the output power of the optical fiber connected with the optical device to be detected.
6. The method for testing high and low temperature tracking error of an optical device according to claim 5, further comprising:
and when the temperature detected by the first temperature sensor is lower than the target temperature, controlling the water cooling plate to stop water cooling circulation and controlling the heating sheet to heat the water cooling plate.
7. The method for testing the high and low temperature tracking error of the optical device according to claim 6, wherein when the temperature detected by the first temperature sensor is lower than the target temperature, the step of controlling the water-cooling plate to stop performing the water-cooling cycle and controlling the heating sheet to heat the water-cooling plate comprises the steps of:
when the temperature detected by the first temperature sensor is lower than the target temperature, acquiring a temperature difference value between the target temperature and the temperature detected by the first temperature sensor;
determining the heating rate of the device to be measured according to the temperature difference;
and when the temperature rise rate is smaller than the preset rate, controlling the water cooling plate to stop water cooling circulation, and controlling the heating sheet to heat the water cooling plate.
8. The method for testing high and low temperature tracking error of optical device as claimed in claim 7, wherein after determining the temperature-increasing rate of the optical device to be tested according to the temperature difference, the method further comprises:
and when the temperature rise rate is greater than or equal to the preset rate, controlling the water cooling plate to perform water cooling circulation.
9. The method for testing the high and low temperature tracking error of the optical device as claimed in claim 5, further comprising, after obtaining the target temperature to be reached by the optical device, the steps of:
when the temperature detected by the first temperature sensor is higher than the target temperature, controlling the surface of the semiconductor refrigerator, which is attached to the temperature-uniforming plate, to refrigerate, and controlling the water cooling plate to perform water cooling circulation until the temperature detected by the first temperature sensor is equal to the target temperature;
when the surface, attached to the temperature equalizing plate, of the semiconductor refrigerator is controlled to refrigerate, the working current of the semiconductor refrigerator is adjusted according to the temperature difference between the temperature detected by the first temperature sensor and the target temperature required to be reached by the optical device to be detected.
10. A computer readable storage medium, having a computer program stored thereon, the computer program being loaded by a processor to perform the steps of the method for testing high and low temperature tracking error of an optical device according to any of claims 5 to 9.
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| CN202211246268.4A CN115326358A (en) | 2022-10-12 | 2022-10-12 | High and low temperature tracking error testing device and method for optical device and computer storage medium |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109084A (en) * | 1991-10-18 | 1993-04-30 | Matsushita Electric Ind Co Ltd | Optical information recording medium, information recording and erasing method, and tracking error signal detecting device |
| CN105514318A (en) * | 2016-02-01 | 2016-04-20 | 上海鹰峰电子科技有限公司 | Compound superconducting flat heat pipe water cooling system for battery pack |
| CN208014863U (en) * | 2018-03-15 | 2018-10-26 | 郑州比克电池有限公司 | A kind of pure electric automobile battery pack with heating and heat sinking function |
| CN110174247A (en) * | 2019-05-29 | 2019-08-27 | 深圳市亚派光电器件有限公司 | Optical device test device |
| CN110191521A (en) * | 2019-05-20 | 2019-08-30 | 苏州安靠电源有限公司 | A kind of water-cooled plate with heating function |
| CN209766844U (en) * | 2019-03-18 | 2019-12-10 | 昂纳信息技术（深圳）有限公司 | A temperature control device and system for laser radar light source |
| CN209964058U (en) * | 2019-08-06 | 2020-01-17 | 无锡市德科立光电子技术有限公司 | High and low temperature tracking error testing device for optical device |
-
2022
- 2022-10-12 CN CN202211246268.4A patent/CN115326358A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109084A (en) * | 1991-10-18 | 1993-04-30 | Matsushita Electric Ind Co Ltd | Optical information recording medium, information recording and erasing method, and tracking error signal detecting device |
| CN105514318A (en) * | 2016-02-01 | 2016-04-20 | 上海鹰峰电子科技有限公司 | Compound superconducting flat heat pipe water cooling system for battery pack |
| CN208014863U (en) * | 2018-03-15 | 2018-10-26 | 郑州比克电池有限公司 | A kind of pure electric automobile battery pack with heating and heat sinking function |
| CN209766844U (en) * | 2019-03-18 | 2019-12-10 | 昂纳信息技术（深圳）有限公司 | A temperature control device and system for laser radar light source |
| CN110191521A (en) * | 2019-05-20 | 2019-08-30 | 苏州安靠电源有限公司 | A kind of water-cooled plate with heating function |
| CN110174247A (en) * | 2019-05-29 | 2019-08-27 | 深圳市亚派光电器件有限公司 | Optical device test device |
| CN209964058U (en) * | 2019-08-06 | 2020-01-17 | 无锡市德科立光电子技术有限公司 | High and low temperature tracking error testing device for optical device |
Non-Patent Citations (1)
| Title |
|---|
| 郑皓宇: "复合吸附剂制备工艺及吸附性能优化实验研究", 《中国优秀硕士学位论文全文数据库》 * |
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Application publication date: 20221111 |