CN115315070A - Circuit boards, circuit board assemblies and electronic devices - Google Patents

Abstract

The application provides a circuit board, a circuit board assembly and an electronic device. The circuit board comprises a substrate, a first bonding pad and a second bonding pad; the first bonding pads and the second bonding pads are arranged at intervals along a first direction, the number of the first bonding pads is smaller than that of the second bonding pads, at least two second bonding pads are arranged at intervals along a second direction, and the second direction is different from the first direction; the first bonding pad comprises a first sub-disc provided with a concave part, the bottom end of the concave part is positioned in the first sub-disc, and the opening of the concave part faces the second bonding pad; and/or the second pad comprises a second subpad provided with a convex part, and the convex part is positioned at one side close to the first pad and extends towards the first pad. The circuit board has the advantages that through the structural optimization of the bonding pads, the fixing force can be increased on one side with less bonding pads, and/or the fixing force can be reduced on one side with more bonding pads, so that the force application of the bonding pads on the two sides is relatively balanced, and the reliable carrying of electronic devices on the circuit board is ensured.

Description

Circuit boards, circuit board assemblies and electronic devices

technical field

The present application relates to the field of electronic devices, in particular to a circuit board, a circuit board assembly and an electronic device.

Background technique

Electronic devices are usually soldered and mounted on a circuit board to form a circuit board assembly. Specifically, the pins of the electronic device correspond to the positions of the pads on the circuit board one by one, and then each pin is fixed and connected to the corresponding pads by welding.

For electronic devices of different specifications, the number and positions of pins are also different. For example, for some electronic devices with an odd number of pins, it is difficult to achieve a symmetrical arrangement of the pin positions. When this type of electronic device is mounted on a circuit board, it may cause uneven adhesion of the electronic device and frequent openings due to asymmetrical welding stress. Bad phenomenon of welding failure.

Contents of the invention

The present application provides a circuit board, a circuit board assembly, and an electronic device. By optimizing the structure of the pads on the circuit board, the holding effect of the circuit board on electronic devices is improved. The application specifically includes the following technical solutions:

In a first aspect, the present application provides a circuit board, including a substrate, and a first pad and a second pad carried on the same outer surface of the substrate; the first pad and the second pad are arranged at intervals along the first direction , and the number of the first pads is smaller than the number of the second pads, at least two second pads are arranged at intervals along the second direction, and the second direction is different from the first direction; the first pads include a first sub-pad, The first sub-disc is provided with a recess, the bottom of the recess is located in the first sub-disc, and the opening of the recess faces the second pad along the first direction; and/or, the second pad includes the second sub-disk, so The second sub-pad is provided with a protruding portion, and the protruding portion is located on a side close to the first pad and extends toward the first pad along the first direction.

Both the first pad and the second pad of the circuit board of the present application are located on the same outer surface of the substrate, and can be used to carry the same electronic device. Wherein, the first pads and the second pads are arranged at intervals along one direction, and the number of the first pads is relatively small. At least two second welding pads are also arranged at intervals along another direction. Thus, a structure in which the first pads and the second pads are arranged asymmetrically is formed.

The circuit board of the present application can be provided with a recessed part on the first sub-pad of the first pad, wherein the opening of the recessed part faces the direction of the second pad, and when the recessed part is soldered to the pins of the corresponding electronic device, it can produce a deviation from the first pad. The horizontal tension in the direction of the second pad increases the holding force of the circuit board to the electronic device on the side close to the first pad, so that the difference in holding force between the asymmetrically arranged pad structures is relatively reduced, which can be more It is good to prevent the unbalanced adhesion of electronic devices and the failure of frequent soldering;

The circuit board of the present application can also be provided with a protrusion on the second sub-disk of the second pad, and the shape of the protrusion is close to the first pad. At this time, when the protrusion is soldered to the pins of the corresponding electronic device, it can Generate horizontal tension toward the first pad, thereby reducing the holding force of the circuit board to the electronic device on the side close to the second pad, so that the difference in holding force between asymmetrically arranged pad structures is also relatively Shrinkage can also better prevent the unbalanced adhesion of electronic devices and frequent soldering failures.

In a possible implementation manner, the first direction is perpendicular to the second direction.

In a possible implementation manner, the concave part is an axisymmetric shape, and the symmetric axis of the concave part passes through the geometric center of the first sub-disc along the first direction.

In this implementation, the concave portion is set in an axisymmetric shape, and when the concave portion is welded to its corresponding stitch, it is ensured that the horizontal tension along the second direction is equal in magnitude and opposite in direction, so that the concave portion only provides tension along the first direction. The horizontal tension in the first direction avoids the phenomenon of asymmetric holding force in the second direction.

In a possible implementation manner, the shape of the recessed portion is a triangle, an arc, or a trapezoid.

In a possible implementation manner, the first sub-disc has a first width W1 along the first direction, the first sub-disk further includes a first side facing away from the second pad, and the bottom end of the recessed portion extends to the first side. The distance D1 satisfies the condition: 0.25W1≤D1≤0.5W1.

In a possible implementation manner, the first sub-disk has a first height H1 along the second direction, and the opening length L1 of the recess satisfies the condition: L1≥0.5H1.

In the above two implementations, the distance D1 between the bottom end of the recess and the first side, and the opening length L1 of the recess can both affect the area of the recess and at the same time affect the first sub-disk. structural strength. The limitation of the distance D1 and the opening length L1 can ensure that the horizontal tension formed by the concave part meets the preset requirements, and at the same time ensure the structural strength of the first sub-disk.

In a possible implementation manner, in the second direction, the first pad is flush with one second pad; or, the first pad is located between two second pads.

In this implementation manner, corresponding to different pin arrangement structures in electronic devices, the first pad may be flush with one second pad in the second direction, or may be located between two second pads. Both arrangements can form the effect that the difference in the holding force in the first direction is relatively reduced, so that better holding is formed between the circuit board and the electronic device.

In a possible implementation manner, in the second direction, the first pad is located between two second pads, and the distances between the first pad and the two second pads are respectively equal.

In this implementation, the two second pads are arranged symmetrically with respect to the central axis of the first pad, and the force on the first pad in the second direction is relatively balanced, which can avoid the formation of holding force in the second direction. difference.

In a possible implementation manner, the protrusion has an axisymmetric shape, and the axis of symmetry of the protrusion passes through the geometric center of the second sub-disc along the first direction.

In this implementation, the protruding part is set in an axisymmetric shape, and when the protruding part is welded to its corresponding pin, it is ensured that the horizontal tension along the second direction is equal in size and opposite in direction, so that the protruding part only provides The horizontal tension along the first direction avoids the phenomenon of asymmetric holding force in the second direction.

In a possible implementation manner, the shape of the protruding part is a triangle, an arc, or a trapezoid.

In a possible implementation manner, the second sub-disc further includes a main body, and in the first direction, the main body is located on the side of the protrusion away from the first pad, and the main body has a second width W2, and the protrusion The distance D2 from the tip to the main body satisfies the condition: 0.25W2≤D2≤0.5W2.

In a possible implementation manner, in the second direction, the second sub-disc has a second height H2, and the length L2 of the protrusion satisfies the condition: L2≥0.5H2.

In the above two implementations, the distance D2 from the protruding part to the main body and the length L2 of the protruding part can both affect the area of the protruding part, thereby affecting the holding force of the second sub-disk Change the size. The limitation of the distance D2 and the length L2 can ensure that the change of the horizontal tension formed by the protruding part meets the preset requirement.

In a possible implementation manner, the area of the first sub-pad is greater than or equal to the area of the second pad.

In this implementation, the area of the first sub-disk is larger, so that a larger contact surface can be formed between the first sub-disc and its corresponding pins, thereby increasing its surface tension, thereby further increasing the size of the first sub-disc. Conversely, the smaller the area of the second pad, the smaller the holding force on the side of the second pad is correspondingly, so that the difference in holding force on both sides is reduced.

In a possible implementation manner, the plurality of second pads are arranged in two rows along the first direction at intervals, and the number of second pads in each row is the same.

In this implementation manner, the plurality of second pads are arranged in two rows, and the number of second pads in each row is the same, so that the second pads are symmetrical to each other in the second direction, avoiding differences in holding force.

In a possible implementation manner, the second pad includes second sub-pads, and at least two second sub-pads are aligned along the second direction.

In a possible implementation manner, there are two second pads in each row, and one first pad.

In this implementation manner, four second pads and one first pad may correspond to the arrangement of pins of a five-pin filter.

In a possible implementation manner, the number of the second pads is three, the three second pads are arranged at intervals along the second direction, the number of the first pads is two, and the two first pads are also arranged at intervals along the second direction.

In a possible implementation manner, the distance between the two first pads is equal to the distance between the two second pads that are far apart among the three second pads.

In a second aspect, the present application provides a circuit board assembly, including an electronic device and the circuit board provided in the first aspect of the present application, and the electronic device is mounted on the circuit board through the first pad and the second pad of the circuit board.

The circuit board assembly provided in the second aspect of the present application adopts the circuit board provided in the first aspect of the present application, and its fixed connection with the electronic device is firmer, which can avoid the problems of unbalanced adhesion of the electronic device and frequent soldering failure. unpleasant sight.

In a possible implementation manner, the electronic device includes a first stitch, the first stitch is correspondingly connected to the first pad, and the first stitch covers at least 80% of the area of the recess in the first pad.

In this implementation manner, the coverage area between the first pin and the recessed part is set to be relatively large, which can ensure that the recessed part achieves a preset effect of increasing the holding force of the first pad.

In a third aspect, the present application provides an electronic device, including a casing, and the circuit board assembly provided in the second aspect of the application, and the circuit board assembly is disposed in the casing.

It can be understood that the electronic equipment provided in the third aspect of the application also has the effect of a more stable internal structure and avoiding open soldering of internal electronic devices because it includes the circuit board assembly provided in the second aspect of the application.

Description of drawings

In order to illustrate the technical solution of the present application more clearly, the accompanying drawings used in the implementation will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some implementations of the application. As far as the skilled person is concerned, other drawings can also be obtained based on these drawings on the premise of not paying creative work.

Figure 1 is a schematic diagram of the working scene of the electronic equipment of the present application;

Fig. 2 is a structural schematic diagram of a side view of a circuit board assembly;

FIG. 3 is a schematic diagram of an exploded structure of a circuit board assembly in the implementation shown in FIG. 2;

FIG. 4 is a structural schematic diagram of a side view of the electronic device when the circuit board is hidden in the implementation shown in FIG. 2;

FIG. 5 is a schematic plan view of a pad area on the circuit board when the electronic device is hidden in the implementation shown in FIG. 2;

FIG. 6 is a schematic plan view of the first pad in the implementation shown in FIG. 5;

FIG. 7 is a schematic plan view of the first pad in an implementation manner;

FIG. 8 is a schematic plan view of the first pad in an implementation manner;

FIG. 9 is a schematic plan view of the first pad in an implementation manner;

FIG. 10 is a schematic diagram of an exploded structure of a side view of a circuit board in an implementation manner;

FIG. 11 is a schematic plan view of the pad region in the implementation shown in FIG. 10;

FIG. 12 is a schematic plan view of the second sub-disk in the implementation shown in FIG. 10;

FIG. 13 is a schematic plan view of a second sub-disk in an implementation manner;

FIG. 14 is a schematic plan view of the second pad in an implementation manner;

FIG. 15 is a schematic plan view of the second pad in an implementation manner;

FIG. 16 is a schematic diagram of an exploded structure of a side view of a circuit board in an implementation manner;

FIG. 17 is a schematic plan view of the pad region in the implementation shown in FIG. 16;

FIG. 18 is a schematic diagram of an exploded structure of a circuit board viewed from one side in an implementation manner;

FIG. 19 is a schematic plan view of the pad region in the implementation shown in FIG. 18;

Fig. 20a is a schematic plan view of the first pad and the second pad in an implementation manner in the pad area;

Fig. 20b is a schematic plan view of the first pad and the second pad in the pad area in an implementation;

Fig. 20c is a schematic plan view of the first pad and the second pad in an implementation manner in the pad area;

Fig. 20d is a schematic plan view of the first pad and the second pad in an implementation manner in the pad area;

FIG. 21 is a schematic diagram of an exploded structure of a circuit board viewed from one side in an implementation manner;

FIG. 22 is a schematic plan view of the pad area in the implementation shown in FIG. 21;

Fig. 23a is a schematic plan view of a first pad and a second pad in an implementation manner in the pad area;

Fig. 23b is a schematic plan view of the first pad and the second pad in the pad area in an implementation;

Fig. 24 is a structural schematic view of a side view of the circuit board assembly in a comparative embodiment;

FIG. 25 is an analysis diagram of the holding force when the pad is connected to its corresponding pin in the implementation shown in FIG. 24;

Fig. 26 is an analysis diagram of the holding force generated when the first sub-disk proposed in this application is connected to its corresponding pin;

Fig. 27 is an analysis diagram of the holding force generated when the first sub-disc is connected to its corresponding pin in an implementation manner;

Fig. 28 is an analysis diagram of the holding force generated when the second sub-disk proposed in the present application is connected to its corresponding pin;

FIG. 29 is an analysis diagram of the holding force generated when the second sub-disc is connected to its corresponding pin in an implementation manner.

Detailed ways

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts fall within the scope of protection claimed in this application.

Please refer to FIG. 1 , which is a schematic diagram of a working scene of the electronic device 200 of the present application. As shown in FIG. 1 , an electronic device 200 of the present application includes a circuit board assembly 100 and a casing 201 . The circuit board assembly 100 is disposed inside the casing 201 and is used to realize preset functions of the electronic device 200, such as realizing data processing, data storage, signal sending and receiving, data collection, data output, and realization of specific mechanism actions through the electronic device 200.

The housing 201 is used to support and fix the circuit board assembly, and can form a protective effect on the circuit board assembly 100, such as preventing water vapor, impurities, dust, etc. in the external environment from corroding the circuit board assembly 100, so as to improve the use of the circuit board assembly 100 service life and working stability, thereby improving the use experience of the electronic device 200 of the present application.

It should be noted that, in the implementation shown in FIG. 1 , the electronic device 200 is a tablet. In other implementations of the present application, the electronic device 200 may also be a customer terminal device such as a computer, a smart home appliance, or a vehicle, or may be a customer premise equipment (Customer Premise Equipment, CPE) such as a router or a base station, or any other electronic device 200. In this embodiment of the present application, the type of the electronic device 200 is not specifically limited.

For ease of description, in subsequent embodiments of the present application, the electronic device 200 is taken as an example for illustration. Moreover, it can be understood that in the implementation shown in FIG. 1 , only the structures and positions of the housing 201 and the circuit board assembly 100 are introduced as examples, and do not represent the specific structures and positions of the housing 201 and the circuit board assembly 100. Location limited.

Please refer to FIG. 2 and FIG. 3 together. FIG. 2 is a schematic structural diagram of the circuit board assembly 100 viewed from one side, and FIG. 3 is a schematic diagram of an exploded structure of the circuit board assembly 100 in the implementation shown in FIG. 2 . The circuit board assembly 100 provided in the present application includes a circuit board 10 and an electronic device 20 , the circuit board 10 includes a substrate 11 and pads 12 , and the pads 12 protrude from the outer surface of the same side of the substrate 11 . The electronic device 20 is provided with pins 21, and the pins 21 are correspondingly connected to the pads 12, so that the electronic device 20 is mounted on the circuit board 10, and the electronic device can be turned on through the electrical conduction between the pins 21 and the pads 12. 20, so that the electronic device 20 can work normally and realize its function.

It can be understood that, in the implementation shown in FIG. 2 , the number of electronic devices 20 mounted on the circuit board 10 may be one or more, and the number and arrangement thereof may be adjusted according to actual needs. FIG. 2 only takes one electronic device 20 as an example for illustration, and does not limit the number of electronic devices 20 carried on the circuit board 10 of the present application to only one.

Wherein, the electronic device 20 can be a filter, a capacitor, a resistor, a chip and other electronic devices used to realize one or more preset functions of the above-mentioned electronic device 200, and each electronic device 20 mounted on the circuit board 10 One or more preset functions of the above-mentioned electronic device 200 can be realized through the interaction between them.

As shown in FIG. 3 , each electronic device 20 is provided with a plurality of pins 21 , and the number and arrangement position of each pin 21 can be different. In other words, the number and arrangement positions of the pins 21 provided on the electronic device 20 for realizing different functions can be adjusted according to actual needs.

Wherein, it should be noted that the number of pins 21 of the electronic device 20 can be an odd number value, for example, the number of pins 21 is 3, 5, 7 or other odd number values, and the number of pins 21 of an odd number can be arranged asymmetrically . In other implementations of the present application, the number of pins 21 of the electronic device 20 can also be an even number, for example, the number of pins 21 is 4, 6 or other even numbers, when the number of pins 21 of the electronic device 20 is double When counting, the pins 21 may also be arranged asymmetrically.

In the implementation shown in FIG. 3 of the present application, the position and structure of the electronic device 20 and the circuit board 10 are only introduced as examples, and do not represent the actual position arrangement and actual structure of the electronic device 20 and the circuit board 10 .

For example, in a possible implementation manner, please refer to FIG. 4 , which is a schematic structural diagram of a side view of the electronic device 20 when the circuit board 10 is hidden in the implementation manner shown in FIG. 2 . In the implementation shown in FIG. 4 , the electronic device 20 is a five-pin filter, and the five-pin filter, that is, the number of pins 21 provided for the filter is five.

As shown in FIG. 4 , the pins 21 of the electronic device 20 include a first pin 211 and a second pin 212 , the number of the first pin 211 is one, and the number of the second pin 212 is four. The second stitches 212 are arranged in two columns along the first direction 001 and arranged in two rows along the second direction 002. The first stitches 211 are arranged at intervals on one side of the second stitches 212 along the first direction 001, and along the The second direction 002 is between two rows of second stitches 212 .

In other words, in the implementation shown in FIG. 4 , the number of second stitches 212 is greater than the number of first stitches 211, and the first stitches 211 and second stitches 212 are arranged at intervals along the first direction 001, that is, the five-pin filter The pins 21 of the device form an asymmetric arrangement in the first direction 001.

Wherein, the first direction 001 and the second direction 002 are different. In the implementation shown in FIG. 4 , the first direction 001 and the second direction 002 are perpendicular to each other. It can be understood that FIG. 4 only uses the first direction 001 as an example of the direction in which the first stitches 211 and the second stitches 212 face each other. In other implementations of the present application, the first direction 001 and the second direction 002 The directions can also be exchanged, or the first direction 001 and the second direction 002 can also be other directions, which is not limited in this application.

Further, please continue to refer to FIG. 3 . As shown in FIG. 3 , corresponding to a plurality of electronic devices 20 , a plurality of pad areas A are provided on the substrate 11 , and each pad area A is provided corresponding to one electronic device 20 . Corresponding to the different numbers of pins 21 of the electronic device 20 , different numbers of pads 12 are provided in each pad area A. Each pin 21 of the electronic device 20 is correspondingly connected to a pad 12, so that the electronic device 20 is turned on through the connection between the pin 21 and the pad 12, and the electronic device 20 can work normally.

Wherein, the number and position of the pads 12 carried on the substrate 11 are set corresponding to the number and position of the pins 21 on each electronic device 20 . That is, corresponding to each electronic device 20 , the quantity and arrangement positions of the pads 12 in the pad area A on the substrate 11 correspond to the pins 21 of the corresponding electronic device 20 .

For example, in a possible implementation, as shown in FIG. 3 , when the number of pins 21 provided on the electronic device 20 is five, the number of pads 12 in the pad area A corresponding to the electronic device 20 Also for 5. Moreover, the arrangement position of the pads 12 in the pad region A corresponding to the electronic device 20 is the same as the arrangement position of the pins 21 of the electronic device 20 . In other words, there is a one-to-one correspondence between the pads 12 in the pad area A and the pins 21 of the corresponding electronic device 20, so that the electronic device 20 can be accurately and reliably mounted on the circuit board 10, thereby ensuring the operation of the electronic device 20. stability.

Please refer to FIG. 5 . FIG. 5 is a schematic plan view of a pad area A on the circuit board 10 when the electronic device 20 is hidden in the implementation shown in FIG. 2 . In the circuit board 10 proposed in this application, the pads 12 carried on the substrate 11 include a first pad 121 and a second pad 122, and the first pad 121 and the second pad 122 are spaced along the first direction 001. cloth, and the number of the first pads 121 is less than the number of the second pads 122 . At least two second pads 122 are arranged at intervals along the second direction 002 .

As shown in FIG. 5, by setting the first pads 121 and the second pads 122 to be arranged at intervals along the first direction 001, and the number of the first pads 121 is less than the number of the second pads 122, and setting at least two The two second pads 122 are arranged at intervals along the second direction 002 , and asymmetrically arranged pads 12 can be formed in the pad area A, which can correspond to the asymmetrically arranged pins 21 of the electronic device 20 .

For example, in a possible implementation, as shown in FIG. 5, the number and arrangement positions of the pads 12 in the pad area A correspond to the pins 21 in the five-pin filter in the implementation shown in FIG. The number and arrangement position settings.

Specifically, in the implementation shown in FIG. 5 , in the pad area A, there are five corresponding pins 21 of the five-pin filter, and the number of pads 12 in the pad area A is five. The five pads 12 are respectively one first pad 121 and four second pads 122 , and the first pads 121 and the second pads 122 are arranged at intervals along the first direction 001 . The four second pads 122 are arranged in two rows along the first direction 001 and arranged in two rows along the second direction 002 . The number of second pads 122 in each row is two, and the number of second pads 122 in each column is also two.

As shown in FIG. 5, one first pad 121 is located between two rows of second pads 122 along the second direction 002, and the first pad 121 is separated from the two rows of second pads 122 in the second direction 002. equal distance. That is, the distances between the two rows of second pads 122 and the axis of symmetry of the first pads 121 in the second direction 002 are equal.

In other words, the five pads 12 corresponding to the pad area A of the five-pin filter are arranged asymmetrically in the first direction 001 and arranged symmetrically in the second direction 002 . The pads 12 in the pad area A respectively form the multi-pad side composed of the second pad 122 and the few pad side composed of the first pad 121 in the first direction 001, and the first pad side in the multi-pad side The second pad 122 corresponds to the second pin 212 of the electronic device 20 , and the first pad 121 on the side with fewer pads corresponds to the first pin 211 of the electronic device 20 .

It can be understood that the second pads 122 are arranged in two rows at intervals along the first direction 001, and the number of second pads 122 in each row is the same, and a plurality of second pads 122 are arranged in two rows, and the second pads 122 in each row are arranged in two rows. The number of the two pads 122 is the same, so that the second pads 122 are symmetrical to each other in the second direction 002, avoiding the difference in holding force between the electronic device 20 and the circuit board 10 in the second direction 002, so as to improve the connection between the electronic device 20 and the circuit. The reliability of the connection between the boards 10 is improved, thereby improving the working stability of the electronic device 20 .

In the implementation shown in FIG. 5 , the first pad 121 and the second pad 122 are located on the same outer surface of the substrate 11 and can be used to carry the same electronic device 20 . Wherein, the first bonding pads 121 and the second bonding pads 122 are arranged at intervals along one direction, and the number of the first bonding pads 121 is less than that of the second bonding pads 122 . At least two second pads 122 are also arranged at intervals along another direction. Thus, a structure in which the first bonding pads 121 and the second bonding pads 122 are asymmetrically arranged corresponding to one electronic device 20 carried on the substrate 11 can further enable the asymmetrically arranged pins 21 on the corresponding electronic device 20 One-to-one correspondence, so that the pins 21 can be accurately connected to the pads 12 , improving the reliability of the circuit board 10 .

It should be noted that FIG. 5 is only an example of a possible arrangement and quantity of pads 12 in a pad area A, and does not limit a pad area A in the embodiment of the present application. The arrangement and quantity of the plurality of pads 12 are limited to this. In other implementation manners of the present application, the arrangement quantity and arrangement position of the pads 12 in the pad region A are different corresponding to the different numbers and arrangement positions of the pins 21 of the electronic device 20 . That is, corresponding to the different numbers and arrangement positions of the pins 21 of the electronic device 20 , the number and arrangement positions of the pads 12 carried on the substrate 11 are different. The number and arrangement positions of the pads 12 can be adjusted according to actual needs and settings.

Further, please refer to FIG. 6 , which is a schematic plan view of the first pad 121 in the implementation shown in FIG. 5 . As shown in FIG. 6 , the first pad 121 includes a first sub-pad 1211 , and the first sub-pad 1211 is provided with a concave portion 1212 . The recessed portion 1212 has an opening 1212a and a bottom end 1212b disposed opposite to each other along the first direction 001, and the opening 1212a faces the second pad 122 along the first direction 001, and the bottom end 1212b faces away from the second pad 122 along the first direction 001, and Located in the first sub-disk 1211.

And as shown in FIG. 6 , the first pad 121 is an axisymmetric structure, and its axis of symmetry extends along the first direction 001 . Both the concave portion 1212 and the first sub-pad 1211 are disposed symmetrically along the axis of symmetry of the first pad 121 , and the axis of symmetry of the first pad 121 is also the axis of symmetry of the concave portion 1212 and the first sub-pad 1211 .

Wherein, the concave portion 1212 is the area where no pad material is arranged on the first pad 121 , that is, the effect of forming an indentation or indentation on the first sub-pad 1211 .

By setting the recessed part 1212 on the first pad 121, and setting the opening 1212a of the recessed part 1212 toward the direction of the second pad 122, so that when the first pad 121 is soldered to the pin 21 of the corresponding electronic device 20, The first tension F1 away from the second pad 122 can be generated on the bottom end 1212 b of the recessed portion 1212 in the direction along the plane of the substrate 11 .

It can be understood that the first tension F1 has a first component force FR along the first direction 001 and a second component force FL along the second direction 002 . Since the concave portion 1212 is symmetrical along the first direction 001 , the second component force FL located on both sides of the symmetry axis of the first pad 121 is opposite in direction and equal in magnitude, thereby canceling each other out. The first component force FR is located on the same side of the concave portion 1212 , and the first component forces FR are equal in size and direction. The first component force FR is the horizontal tension F0 along the first direction 001 away from the second bonding pad 122 .

By making the recessed part 1212 form the second component force FL in the second direction 002 to cancel each other, it can ensure that when the electronic device 20 is connected to the circuit board 10, the holding force in the second direction 002 is balanced, and the electronic device 20 is guaranteed to be in the second direction 002. The connection in direction 002 is stable. The horizontal tension F0 away from the second pad 122 is formed in the first direction 001 by the recessed part 1212, which can improve the holding force of the electronic device 20 on the side with fewer pads, and further improve the connection reliability of the electronic device 20 on the side with fewer pads. .

That is to say, by providing the recessed portion 1212, the adsorption force when the first pad 121 is soldered to its corresponding pin 21 can be improved, and the difference in holding force brought about by the asymmetrically structured pad 12 in the pad area A can be offset. , and prevent the unstable connection between the electronic device 20 and the circuit board 10 due to the unbalanced holding force caused by the asymmetric arrangement of the first pads 121 and the second pads 122 in the first direction 001 .

By setting the concave portion 1212 on the first pad 121, and setting the concave portion 1212 to generate a horizontal tension F0 away from the direction of the second pad 122, thereby increasing the resistance of the circuit board 10 on the side close to the first pad 121. The holding force of the electronic device 20 makes the difference in the holding force between the pads 12 structures arranged asymmetrically in the first direction 001 relatively narrow, which can better prevent the electronic device 20 from being unbalanced in adhesion and frequently open soldering failure adverse phenomena.

Optionally, as shown in FIG. 6 , the concave portion 1212 has an axisymmetric shape, and a symmetric axis (not shown in the figure) of the concave portion 1212 passes through the geometric center of the first sub-disk 1211 along the first direction 001 .

Specifically, in the implementation shown in FIG. 6 , the first pad 121 has a rectangular structure, and the first pad 121 extends along the first direction 001 . Wherein, the intersection point of the diagonal lines of the first pad 121 is the geometric center of the first sub-pad 1211 .

The recessed portion 1212 is an isosceles triangle structure and distributed axially symmetrically along the first direction 001 . The axis of symmetry of the concave portion 1212 passes through the geometric center of the first sub-disc 1211 along the first direction 001 .

It can be understood that in this implementation manner, the recessed portion 1212 is set in an axisymmetric shape, and when the recessed portion 1212 is welded to its corresponding pin 21, it can ensure that the second component force FL along the second direction 002 is equal in size and direction. On the contrary, because the second component force FL generated by the recessed part 1212 is distributed symmetrically about the symmetry axis, they can cancel each other in the second direction 002, avoiding the phenomenon of asymmetric holding force in the second direction 002, so that the recessed part 1212 The horizontal tension F0 is only provided in the first direction 001 away from the second pad 122 .

Optionally, as shown in FIG. 6, the first sub-pad 1211 has a first width W1 along the first direction 001, and the first sub-pad 1211 also has a first side facing away from the second pad 122 in the first direction 001. 1211a.

In the implementation shown in FIG. 6 , the distance D1 from the bottom end 1212b of the recessed portion 1212 to the first side 1211a satisfies the condition: 0.25W1≤D1≤0.5W1.

It can be understood that the distance D1 between the bottom end 1212b of the recessed portion 1212 and the first side 1211a will affect the size of the recessed portion 1212, and further affect the distance between the first sub-pad 1211 and the second pad along the substrate 11. 122 for the size of the horizontal tension F0. That is, the size of the distance D1 will affect the structural strength of the first sub-pad 1211 , and affect the adsorption force and connection reliability between the first pad 121 and the corresponding pin 21 of the electronic device 20 .

In other words, by defining the relationship between the distance D1 between the bottom end 1212b of the concave portion 1212 and the first side 1211a and the first sub-disc 1211 having the first width W1 along the first direction 001, the horizontal tension generated by the concave portion 1212 can be defined. The magnitude of F0 is such that the magnitude of the horizontal tension F0 can meet the preset requirement of the adsorption force between the first pad 121 and its corresponding pin 21 .

Optionally, please refer to FIG. 7 , which is a schematic plan view of the first pad 121 in this implementation manner. As shown in FIG. 7 , the first sub-disk 1211 has a first height H1 along the second direction 002 , that is, the extension length of the first sub-disk 1211 in the second direction 002 . The opening 1212a of the recessed portion 1212 has a length L1 in the second direction 002, and the length L1 of the opening 1212a of the recessed portion 1212 satisfies the condition: L1≧0.5H1.

It can be understood that the opening 1212a of the recessed part 1212 has a length L1 in the second direction 002, which will affect the size of the recessed part 1212, and further affect the deviation of the first sub-pad 1211 from the second pad 122 along the substrate 11. The magnitude of the horizontal tension F0. That is, the size of L1 will affect the structural strength of the first sub-pad 1211 , and affect the adsorption force and connection reliability between the first pad 121 and the corresponding pin 21 of the electronic device 20 .

In the implementation shown in FIG. 6 and FIG. 7, the distance D1 between the bottom end 1212b of the recessed part 1212 and the first side 1211a, and the length L1 of the opening 1212a of the recessed part 1212 can both affect the length of the recessed part 1212. The size of the area can also affect the structural strength of the first sub-disc 1211. The limitation of the distance D1 and the opening length L1 can ensure that the horizontal tension F0 formed by the recessed portion 1212 meets a preset requirement, and at the same time ensure the structural strength of the first sub-disk 1211 .

Optionally, in a possible implementation manner, the first stitches 211 cover at least 80% of the area of the recessed portion 1212 in the first pad 121 .

Specifically, the first pin 211 of the electronic device 20 is correspondingly connected to the first pad 121, and when the first pin 211 is connected to the first pad 121, the projection of the first pin 211 on the substrate 11 at least covers, the first 80% of the projected area of the concave portion 1212 in the pad 121 on the substrate 11 .

It can be understood that, in this implementation, setting the first pin 211 to cover at least 80% of the area of the recessed portion 1212 can ensure the reliability of the connection between the recessed portion 1212 and the first pin 211, and increase the number of first pads The preset effect of the holding force between 121 and the first pin 211.

It should be noted that, in the implementation shown in FIG. 7 , only the recessed portion 1212 is an isosceles triangle for example illustration, and the shape and structure of the recessed portion 1212 is not limited to an isosceles triangle. In other implementations of the present application, the shape structure of the recessed portion 1212 may also include a shape limited to an equilateral triangle, an arc, or a trapezoid, or the shape structure of the recessed portion 1212 may also be a triangle, an arc, or a trapezoid A shape structure formed by a combination of one or more shapes.

For example, in a possible implementation manner, please refer to FIG. 8 , which is a schematic plan view of the first pad 121 in this implementation manner. In the implementation shown in FIG. 8 , the recessed portion 1212 of the first pad 121 is arc-shaped, that is, the shape of the bottom end 1212b of the recessed portion 1212 is arc-shaped, and its opening 1212a faces the first direction 001 toward the Two pads 122 are provided.

For example, in a possible implementation manner, please refer to FIG. 9 , which is a schematic plan view of the first pad 121 in this implementation manner. In the implementation shown in FIG. 9 , the concave portion 1212 of the first pad 121 is trapezoidal, and the axis of symmetry of the concave portion 1212 passes through the geometric center of the first sub-pad 1211 along the first direction 001 .

Please refer to FIG. 10 and FIG. 11 together. FIG. 10 is a schematic diagram of an exploded structure of a side view of the circuit board 10 in this implementation manner, and FIG. 11 is a schematic diagram of a planar structure of the pad area A in the implementation manner shown in FIG. 10 . In the implementation shown in FIG. 10 , the number of first pads 121 and the number of second pads 122 are the same as the number of first pads 121 and the number of second pads 122 in the embodiment shown in FIG. 3 , and the arrangement can also be the same.

In the implementation shown in FIG. 10 , the first pad 121 has a cuboid structure, the second pad 122 includes at least two second sub-pads 1221 , and the at least two second sub-pads 1221 are aligned along the second direction 002 .

As shown in FIG. 11 , the second pad 122 includes four second sub-pads 1221, and the four second sub-pads 1221 are respectively arranged in two rows along the first direction 001 and in two rows along the second direction 002. Arranged, and the number of second sub-discs 1221 in each row and column is equal.

Specifically, please refer to FIG. 12 , which is a schematic plan view of the second sub-disk 1221 in the implementation manner shown in FIG. 10 . As shown in FIG. 12 , each second sub-disc 1221 is provided with a protruding portion 12211 and a main body portion 12212 oppositely disposed along the first direction 001 . The protruding portion 12211 of each second sub-pad 1221 is located on a side close to the first bonding pad 121 along the first direction 001 , and extends toward the first bonding pad 121 along the first direction 001 . The main body portion 12212 is located on a side of the protruding portion 12211 away from the first pad 121 in the first direction 001 .

The second sub-disk 1221 is an axisymmetric structure, and its axis of symmetry extends along the first direction 001 . Both the protruding part 12211 and the main part 12212 are disposed symmetrically along the axis of symmetry of the second sub-disc 1221 , and the axis of symmetry of the second sub-disc 1221 is also the axis of symmetry of the protruding part 12211 and the main part 12212 .

It can be understood that the protruding portion 12211 extends and protrudes toward the first pad 121 along the first direction 001, so that the protruding portion 12211 of the second sub-pad 1221 protrudes when soldered to the pin 21 of the corresponding electronic device 20. The portion 12211 can generate a second tension F2 away from the main body portion 12212 in a direction along the plane of the substrate 11, the second tension F2 has a third component force FT extending along the first direction 001, and a fourth component force FT extending along the second direction 002. Force FS.

Since the protruding portion 12211 is symmetrical along the first direction 001 , the fourth component force FS located on both sides of the symmetric axis of the protruding portion 12211 is opposite in direction and equal in magnitude, thereby canceling each other out. The third component force FT is located on the same side of the protruding portion 12211, and the third component forces FT are equal in size and direction. The third component force FT is also the horizontal tension F0 in the direction of the first pad 121 along the first direction 001 .

In other words, the protruding portion 12211 generates a horizontal tension F0 toward the first pad 121, which will weaken the adsorption force of the second sub-pad 1221 on the corresponding pin 21, thereby reducing the pressure of the circuit board 10 when it is close to the second pad. The holding force of the electronic device 20 on the side of 122 is to reduce the holding force of the electronic device 20 on the side where the number of pads 12 is more arranged in the pad area A.

By providing the protrusions 12211 on each of the second sub-pads 1221, the holding force between the less number of first pads 121 and their corresponding first stitches 211 can be achieved between the asymmetrically arranged pads 12 structures. , and the holding force between the second pads 122 with a larger number and the corresponding second pins 212, the difference between the two is also relatively reduced, which can better prevent the adhesion of the electronic device 20 on the circuit board 10 Bad phenomenon of unbalanced and frequent welding failure.

Optionally, as shown in FIG. 12 , the protrusion 12211 has an axisymmetric shape, and the symmetry axis P of the protrusion 12211 passes through the geometric center of the second sub-disc 1221 along the first direction 001 . Specifically, the cross-sectional shape of the main body part 12212 along the plane direction of the substrate 11 is rectangular, and the intersection point of its diagonals is the geometric center of the main body part 12212 . The cross-sectional shape of the protruding portion 12211 in the plane direction of the substrate 11 is arc-shaped, and the symmetry axis P of the protruding portion 12211 is a diameter segment passing through the center of the arc along the first direction 001 .

It can be understood that in this implementation manner, the protruding portion 12211 is set in an axisymmetric shape, and when the protruding portion 12211 is welded to its corresponding pin 21, the magnitude of the fourth component force FS along the second direction 002 can be guaranteed Equal and opposite in direction, and then cancel each other, so that the protrusion 12211 only provides the fourth component force FS along the first direction 001, avoiding the phenomenon of asymmetric holding force in the second direction 002, and weakening the pad area A The holding force formed by the inner pad 12 on the multi-pad side to the pin 21.

Optionally, in a possible implementation manner, please refer to FIG. 12 , the main body portion 12212 has a second width W2 along the first direction 001, and the distance D2 from the top Q of the protruding portion 12211 to the main body portion 12212 satisfies Condition: 0.25W2≤D2≤0.5W2.

Specifically, as shown in FIG. 12 , the top end Q of the protruding portion 12211 is the end point of the protruding portion 12211 closest to the first pad 121 along the first direction 001 . Moreover, the top end Q is located on the symmetry axis P of the protrusion 12211 in the first direction 001 .

It can be understood that in this implementation manner, the distance D2 between the top Q of the protruding portion 12211 and the main body 12212 will affect the size of the protruding portion 12211, and further affect the distance between the second sub-disc 1221 and the edge of the substrate 11. The magnitude of the horizontal tension F0 towards the first pad 121 . That is, the size of the distance D2 will affect the structural strength of the distance D2, and affect the adsorption force and connection reliability between the second pad 122 and the corresponding pin 21 of the electronic device 20 .

Optionally, in a possible implementation manner, please refer to FIG. 13 , which is a schematic plan view of the second sub-disk 1221 in this implementation manner. As shown in FIG. 13 , in the second direction 002 , the main body portion 12212 of the second sub-disk 1221 has a second height H2, and the length L2 of the protruding portion 12211 satisfies the condition: L2≥0.5H2.

It can be understood that the second height H2 is the extension length of the main body portion 12212 of the second sub-disk 1221 in the second direction 002, and the length L2 is the extension length of the protrusion 12211 in the second direction 002, that is, The protruding portion 12211 is the length along the second direction 002 along the side of the main body portion 12212 along the first direction 001 .

In this implementation, the length L2 of the protruding portion 12211 in the second direction 002 affects the area size of the protruding portion 12211, and by defining the relationship between the second height H2 and the length L2, the protruding portion can be defined The size of the area of 12211 is to ensure that the horizontal tension F0 generated by the second sub-disk 1221 along the substrate 11 toward the first pad 121 can satisfy the connection preset between the second pad 122 and its corresponding pin 21 Requirements, that is, to be able to meet the connection reliability requirements between the circuit board 10 and the electronic device 20 .

In the implementation shown in FIG. 12 and FIG. 13 , the distance D2 from the top Q of the protruding part 12211 to the main body part 12212 and the length L2 of the protruding part 12211 can both affect the size of the protruding part 12211, This further affects the holding force of the second sub-disk 1221 on the corresponding pin 21 . By limiting the distance D2 and the length L2, the change of the horizontal tension F0 formed by the protruding part 12211 can be guaranteed to meet the preset requirement.

It should be noted that in the implementations shown in FIG. 12 and FIG. 13 , the cross-sectional shape of the protruding portion 12211 along the plane direction of the substrate 11 is arc-shaped as an example for exemplary introduction, which does not mean that The cross-sectional shape of the protruding portion 12211 in the implementation manner of the application in the direction along the plane of the substrate 11 is limited to an arc shape. In other implementations of the present application, the cross-sectional shape of the protruding portion 12211 along the plane direction of the substrate 11 can also be other shapes such as an arc, or it can also be but not limited to be along the first direction 001 toward the first The protruding shapes of the pads 121 such as triangles, trapezoids, and rectangles may also be one or a combination of shapes among triangles, arcs, trapezoids, and rectangles.

For example, in a possible implementation manner, please refer to FIG. 14 , which is a schematic plan view of the second pad 122 in this implementation manner. In the implementation shown in FIG. 14 , the cross-sectional shape of the protrusion 12211 of the second pad 122 along the plane direction of the substrate 11 is a triangle.

As shown in FIG. 14 , the protrusions 12211 are distributed symmetrically with respect to the axis of symmetry P extending in the first direction 001 . And the geometric center of the main body portion 12212 of the second pad 122 passes through the symmetry axis P of the protruding portion 12211 , so that the second pads 122 are distributed symmetrically with respect to the symmetry axis P.

For example, in a possible implementation manner, please refer to FIG. 15 , which is a schematic plan view of the second pad 122 in this implementation manner. In the implementation shown in FIG. 15 , the cross-sectional shape of the protruding portion 12211 of the second pad 122 along the plane direction of the substrate 11 is trapezoidal.

It should be noted that, in FIG. 10 , only the protruding part 12211 is provided for each second pad 122 as an example, and it does not mean that the second pad 122 in each implementation of the present application is provided with a protruding part 12211. Exit Department 12211. In other implementation manners of the present application, the number of protrusions 12211 can be adjusted according to actual needs.

For example, in a possible implementation, please refer to FIG. 16 and FIG. 17 together. FIG. 16 is a schematic diagram of an exploded structure of the circuit board 10 viewed from one side in this implementation, and FIG. 17 is a schematic diagram of the circuit board 10 shown in FIG. A schematic plan view of the pad area A. In the implementation shown in FIG. 16, two columns of second pads B are arranged at intervals along the first direction 001, and the number of second pads 122 in each column of second pads B is two. The two second pads 122 are arranged at intervals along the second direction 002.

Specifically, as shown in FIG. 17, the two columns of second pads B are respectively the first column of second pads B1 and the second column of second pads B2, and the first column of second pads B1 and the second column of second pads B1 respectively. The pads B2 are arranged at intervals along the first direction 001. Wherein, the two second pads 122 in the first row of second pads B1 are both second sub-pads 1221, that is, the two second pads 122 in the first row of second pads B1 are both set There is a protruding portion 12211 and a main body portion 12212 .

As shown in Figure 17, the two second sub-pads 1221 in the second pad B1 in the first row are provided with protrusions 12211, and the two second pads 122 in the second pad B2 in the second row are all provided with protrusions 12211. A protrusion 12211 is provided.

For example, in a possible implementation manner, the two second pads 122 in the second row of second pads B2 are both second sub-pads 1221, that is, the two second pads in the second row B2. Each second pad 122 is provided with a protrusion 12211 , and the two second pads 122 in the second pad B1 in the first row are not provided with a protrusion 12211 .

In a possible implementation manner, the area of the first sub-pad 1211 is greater than or equal to the area of the second pad 122 .

It can be understood that, in this implementation, the area of the first sub-pad 1211 is set to be larger than that of the second pad 122, so that a larger contact between the first sub-pad 1211 and its corresponding pin 21 can be formed. surface, and further increase the surface tension of the first sub-disc 1211, thereby further increasing the holding force of the first sub-disk 1211 side. On the contrary, setting the area of the second pad 122 is smaller than that of the first sub-pad 1211, which also reduces the holding force on the side of the second pad 122 accordingly, so that the side of the first sub-pad 1211 and the second sub-pad 1211 The holding force difference between the sides of the two pads 122 is reduced.

In other words, by setting and balancing the holding force difference between the first pad 121 side and the second pad 122 side of the electronic device 20, the area of the first sub-pad 1211 is improved compared to the area of the second pad 122. Larger, or the area of the second pad 122 is smaller than that of the first sub-pad 1211, so that when the electronic device 20 is arranged asymmetrically with the pins 21, the electronic device 20 is connected on the corresponding pad 12 , the difference in holding force between the side with many pads 12 and the side with few pads 12 is reduced, thereby improving the connection reliability and working stability between the electronic device 20 and the circuit board 10 .

It should be noted that, in the above implementations, the electronic device 20 is only taken as an example of a five-pin filter, and the possible realization of the first pad 121 and the second pad 122 in the pads 12 on the circuit board 10 It does not mean that the electronic device 20 proposed in this application is limited to a five-pin filter, nor does it mean that the number and arrangement of the first pads 121 and second pads 122 proposed in this application are only limited to this.

In other implementations of the present application, the arrangement of the five pins 21 of the five-pin filter can also be different from the arrangement in the above-mentioned embodiment, or the electronic device 20 can also have five pins 21 Other filters, or the electronic device 20 may also have other odd number of pins 21 , for example, the number of pins 21 of the electronic device 20 may be 3, 7 or other numerical values.

In other words, the present application does not limit the number and arrangement position of the pins 21 of the electronic device 20, and the number and arrangement of the pads 12 in the circuit board 10 correspond to the number and arrangement of the different pins 21 of the electronic device 20. The methods are different.

For example, in a possible implementation, please refer to FIG. 18 and FIG. 19 together. FIG. 18 is a schematic diagram of an exploded structure of the circuit board 10 viewed from one side in this implementation, and FIG. 19 is a schematic diagram of the implementation shown in FIG. A schematic plan view of the pad area A. In the implementation shown in FIG. 18 , the number of pins 21 of the electronic device 20 is five, the number of first pins 211 is two, and the number of second pins 212 is three. The first stitches 211 and the second stitches 212 are arranged at intervals along the first direction 001, the two first stitches 211 and the three second stitches 212 are arranged at intervals along the second direction 002, and in the second direction 002, one The first stitch 211 is aligned with one second stitch 212 .

The arrangement of the pads 12 in the pad area A corresponding to the electronic device 20 on the circuit board 10 corresponds to the arrangement of the pins 21 described above.

Specifically, as shown in FIG. 19, the number of first sub-discs 1211 corresponding to the first stitches 211 is 2, the number of second sub-discs 1221 corresponding to the second stitches 212 is 3, and the first sub-disks 1211 and the second sub-disk 1221 are arranged at intervals along the first direction 001 , and two first sub-discs 1211 and three second sub-discs 1221 are arranged at intervals along the second direction 002 . And in the second direction 002 , a first sub-panel 1211 is flush with a second sub-panel 1221 .

It should be noted that, FIG. 19 only uses an example in which all three second pads 122 are second sub-pads 1221 for illustration, and does not limit that all of the three second pads 122 must be second sub-pads 1221 . In other implementation manners of the present application, the two second pads 122 far apart among the three second pads 122 may also be the second sub-pads 1221 .

Optionally, in a possible implementation manner, please also refer to FIG. 19 . As shown in FIG. 19 , the distance between the two first pads 121 is equal to the distance between the two second pads 122 that are far apart among the three second pads 122 .

Optionally, in a possible implementation manner, please refer to FIGS. 20a to 20d together. FIG. 20a shows the first pad 121 and the second pad 122 in the pad area A in an implementation 20b is a schematic plan view of the first pad 121 and the second pad 122 in the pad area A in an implementation manner, and FIG. 20c is the first pad 121 and the second pad 122 in the pad area A. A schematic diagram of the planar structure of the second pad 122 in an implementation manner, and FIG. 20d is a schematic diagram of the plane structure of the first pad 121 and the second pad 122 in the pad area A in an implementation manner. In the implementations shown in Figures 20a to 20d, the number of the first sub-pads 1211 in the first pad 121 and the number of the second sub-pads 1221 in the second pad 122 can be adjusted according to actual needs to meet the requirements of soldering. Preset requirements for holding force between the pads 12 of the area A and their corresponding electronic devices 20 .

For example, in a possible implementation manner, please refer to FIG. 21 and FIG. 22 together. FIG. 21 is a schematic diagram of an exploded structure of the circuit board 10 viewed from one side in this implementation manner, and FIG. A schematic plan view of the pad area A. In the implementation shown in FIG. 21 , the number of pins 21 of the electronic device 20 is three, the number of first pins 211 is one, and the number of second pins 212 is two. The first stitches 211 and the second stitches 212 are arranged at intervals along the first direction 001, one first stitch 211 and two second stitches 212 are arranged at intervals along the second direction 002, and in the second direction 002, one The first stitch 211 is located between two second stitches 212 in the second direction 002 .

The arrangement of the pads 12 in the pad area A corresponding to the electronic device 20 on the circuit board 10 corresponds to the arrangement of the pins 21 described above.

Specifically, as shown in FIG. 22 , the number of the first sub-pad 1211 corresponding to the first pin 211 is one, the number of the second pad 122 corresponding to the second pin 212 is two, and the first sub-pad 1211 and the second pads 122 are arranged at intervals along the first direction 001 , and one first sub-pad 1211 and two second pads 122 are respectively arranged at intervals along the second direction 002 . And in the second direction 002 , one first pad 121 is located between two second pads 122 in the second direction 002 .

It can be understood that, corresponding to the arrangement structure of pins 21 in different electronic devices 20, the first pad 121 can be flush with one second pad 122 in the second direction 002, or can be located between two second pads 122 , both arrangements can form the effect that the difference in holding force in the first direction 001 is relatively reduced, so that better holding is formed between the circuit board 10 and the electronic device 20 .

Optionally, please refer to FIG. 23a and FIG. 23b together. FIG. 23a is a schematic plan view of the first pad 121 and the second pad 122 in the pad area A in an implementation manner, and FIG. 23b is a schematic diagram of the pad A schematic plan view of the first pad 121 and the second pad 122 in the region A in an implementation manner. In the implementation shown in FIG. 23a and FIG. 23b, the number of the first sub-pad 1211 in the first pad 121 and the number of the second sub-pad 1221 in the second pad 122 can be adjusted according to actual needs to meet the requirements of soldering. Preset requirements for holding force between the pads 12 of the area A and their corresponding electronic devices 20 .

Optionally, in a possible implementation manner, please also refer to FIG. 22 . As shown in FIG. 22 , in the second direction 002 , the first pad 121 is located between the two second pads 122 , and the distances between the first pad 121 and the two second pads 122 are equal.

It can be understood that, in this implementation, the two second pads 122 are arranged symmetrically with respect to the central axis of the first pad 121, and the stress on the first pad 121 in the second direction 002 is relatively balanced, which can avoid A difference in holding force is formed in the second direction 002 .

Please refer to FIG. 24 and FIG. 25 together. FIG. 24 is a schematic structural diagram of a side view of the circuit board assembly 100' in a comparative embodiment, and FIG. 25 is a connection between the pad 12' and its corresponding pin 21 in the implementation shown in FIG. 24. Analysis diagram of holding force. As shown in FIG. 24 , the electronic device 20 is usually soldered and mounted on the circuit board 10 ′ to form a circuit board assembly 100 ′. Specifically, the positions of the pins 21 of the electronic device 20 correspond to the positions of the pads 12 ′ on the circuit board 10 ′, and then each pin 21 is fixed and connected to the corresponding pads 12 ′ by welding.

For electronic devices 20 of different specifications, the number and positions of the pins 21 are also different. For example, some electronic devices 20 with an odd number of pins 21 are difficult to achieve a symmetrical arrangement of the pins 21. When this type of electronic device 20 is mounted on the circuit board 10', the electronic device 20 may be formed due to the asymmetry of the welding stress. Uneven adhesion, frequent open welding failures.

Specifically, as shown in FIG. 24, a plurality of pads 12' are provided on the substrate 11' of the circuit board 10', each pad 12' corresponds to a pin 21 respectively, and the shape and size of each pad 12' are consistent. In the implementation shown in FIG. 24 , each pad 12 ′ is rectangular along the plane direction of the substrate 11 ′, and its area is 5 mm ² .

As shown in FIG. 25 , when each pad 12 ′ of a rectangular structure is connected to its corresponding pin 21 , the maximum holding force of the connection between the pad 12 ′ and the pin 21 is 0.9512 MPa.

However, the number of pins 21 of the electronic device 20 is singular, and its arrangement structure is asymmetrical. Therefore, the pads 12 ′ corresponding to the asymmetrically arranged stitches 21 are also arranged asymmetrically.

The pads 12' corresponding to the electronic device 20 on the substrate 11' are arranged asymmetrically. When the electronic device 20 is connected to the circuit board 10', the holding pads 12' on the multi-pad side form the pins 21. The force is greater than the holding force formed by the pad 12' on the side with few pads to the pin 21, thus causing the unbalanced adhesion of the electronic device 20 and frequent soldering failures, reducing the connection reliability of the electronic device 20, and reducing The working stability of the electronic device 20.

Please refer to FIG. 26 . FIG. 26 is an analysis diagram of the holding force produced when the first sub-disc 1211 is connected to its corresponding pin 21 proposed in this application. In the circuit board 10 proposed in this application, a recessed part 1212 is provided on the first sub-disc 1211 of the first pad 121, wherein the opening 1212a of the recessed part 1212 faces the direction of the second pad 122, and the recessed part 1212 corresponds to it. When the pins 21 of the electronic device 20 are soldered, a horizontal tension away from the direction of the second pad 122 can be generated, thereby increasing the holding force of the circuit board 10 to the electronic device 20 on the side close to the first pad 121, making the asymmetric The difference in holding force between the arranged pads 12 structures is relatively small, which can better prevent the unbalanced adhesion of the electronic device 20 and the failure of frequent open soldering.

For example, in a possible implementation manner, as shown in FIG. 26 , the area of the first sub-disc 1211 in the circuit board 10 proposed by the present application is 5 mm ² , and when the first sub-disc 1211 is connected to its corresponding pin 21 , the maximum holding force connected between the two is 1.05MPa. Compared with the pad 12' of rectangular structure proposed in the comparative example shown in FIG. Holding force increased by 10.39%.

For example, in a possible embodiment, it is also possible to increase the area of the first sub-disc 1211 to increase the holding force between the first sub-disc 1211 and its corresponding pins 21 in the circuit board 10 of the present application, further improving The connection reliability between the circuit board 10 and the electronic device 20 of the present application is improved, and the working stability of the electronic device 20 is improved.

Specifically, please refer to FIG. 27 , which is an analysis diagram of the holding force generated when the first sub-disc 1211 is connected to its corresponding pin 21 in this implementation manner. In the first pad 121 in the implementation shown in FIG. 27 and the first pad 121 in the implementation shown in FIG. 25 , the concave portion 1212 has the same shape and size along the plane direction of the substrate 11 . The difference between the two is that the area of the first sub-disk 1211 in the implementation shown in FIG. 27 is reduced to 4.375 mm ² compared with the area of the first sub-disk 1211 in the embodiment shown in FIG. 25 .

As shown in Figure 27, when the area of the first sub-disk 1211 is reduced to 4.375mm ² and connected to its corresponding pin 21, the maximum holding force generated is 0.8793MPa, compared with the first sub-disk 1211 in the implementation shown in Figure 26 When the area of the sub-disk 1211 is reduced to 4.375 mm ² , in the implementation shown in FIG. 27 , the holding force generated by the first sub-disk 1211 is reduced by 13.08%. At the same time, compared with the pad 12' in the comparative embodiment shown in FIG. 25, the holding force generated by the first sub-pad 1211 in the implementation shown in FIG. 27 is reduced by 2.69%.

At the same time, the circuit board 10 of the present application can also set the protrusion 12211 on the second sub-disc 1221 of the second pad 122, and the shape of the protrusion 12211 is close to the first pad 121. At this time, the protrusion 12211 is in the When the pins 21 of the corresponding electronic device 20 are soldered, a horizontal tension towards the first pad 121 can be generated, thereby reducing the holding force of the circuit board 10 on the side close to the second pad 122 to the electronic device 20, so that The difference in holding force between the pads 12 arranged asymmetrically is also relatively reduced, which can also better prevent the electronic device 20 from unbalanced adhesion and frequent soldering failures.

For example, in a possible implementation manner, please refer to FIG. 28 . FIG. 28 is an analysis diagram of the holding force generated when the second sub-disc 1221 is connected to its corresponding pin 21 proposed in this application. As shown in Figure 28, the area of the second sub-disk 1221 in the circuit board 10 proposed by the present application is 5 mm ² , when the second sub-disc 1221 is connected to its corresponding pin 21, the maximum holding force between the two is 0.8977 MPa. Compared with the pad 12' of rectangular structure proposed in the comparative embodiment shown in FIG. The holding force of the film is reduced by 5.62%.

For example, in a possible embodiment, it is also possible to reduce the area of the second sub-disc 1221 to weaken the holding force between the second sub-disk 1221 and its corresponding pins 21 in the circuit board 10 of the present application, further making The difference in holding force between the pads 12 structures arranged asymmetrically is also relatively reduced.

Specifically, please refer to FIG. 29 , which is an analysis diagram of the holding force generated when the second sub-disc 1221 is connected to its corresponding pin 21 in this implementation manner. In the second sub-disc 1221 in the implementation shown in FIG. 29 and the second sub-disk 1221 in the implementation shown in FIG. 28 , the shape and size of the protrusion 12211 along the plane direction of the substrate 11 are consistent. The difference between the two is that the area of the second sub-disk 1221 in the implementation shown in FIG. 29 is reduced to 4.375 mm ² compared with the area of the second sub-disk 1221 in the embodiment shown in FIG. 28 .

As shown in Figure 29, when the area of the second sub-disc 1221 is reduced to 4.375mm ² and connected to its corresponding pin 21, the maximum holding force generated is 0.8793MPa, compared with the second sub-disc 1221 in the implementation shown in Figure 28 When the area of the sub-disk 1221 is reduced to 4.375 mm ² , in the implementation shown in FIG. 29 , the holding force generated by the second sub-disk 1221 is reduced by 1.94%. At the same time, compared with the pad 12' in the comparative embodiment shown in FIG. 25, the holding force generated by the second sub-pad 1221 in the implementation shown in FIG. 29 is reduced by 7.56%.

That is, by reducing the area of the second sub-pad 1221, the holding force between the second sub-pad 1221 and its corresponding stitches 21 can be further weakened, further making the differences in the holding force between the pads 12 structures arranged asymmetrically also relatively small.

The circuit board assembly 100 provided by the present application adopts the circuit board 10 provided by the present application, and its fixed connection with the electronic device 20 is firmer, which can avoid the undesirable phenomena of unbalanced adhesion of the electronic device 20 and frequent soldering failures. .

In other words, since the circuit board assembly 100 of the present application uses the circuit board 10 provided in the above embodiments, the circuit board assembly 100 of the present application has all the possible beneficial effects of the circuit board 10 .

Furthermore, the electronic device 200 provided by the present application, because it includes the circuit board assembly 100 provided by the present application, also has the effect of a more stable internal structure and avoiding the soldering of the internal electronic device 20 .

In other words, since the electronic device 200 of the present application uses the circuit board assembly 100 provided in the above embodiments, the electronic device 200 of the present application has all the possible beneficial effects of the circuit board assembly 100 .

Certainly, each of the above-mentioned implementation modes can be applied alone or in combination. The above description is a preferred implementation mode of the present application. Several improvements and modifications can also be made, and these improvements and modifications are also regarded as the protection scope of the present application.

Claims (15)

1. A circuit board is characterized by comprising a substrate, a first bonding pad and a second bonding pad, wherein the first bonding pad and the second bonding pad are borne on the same outer surface of the substrate;

the first pads and the second pads are arranged at intervals along a first direction, the number of the first pads is smaller than that of the second pads, at least two of the second pads are arranged at intervals along a second direction, and the second direction is different from the first direction;

the first bonding pad comprises a first subpad, the first subpad is provided with a sunken part, the bottom end of the sunken part is positioned in the first subpad, and the opening of the sunken part faces the second bonding pad along the first direction; and/or the second pad comprises a second subpad, the second subpad is provided with a protruding part, and the protruding part is positioned close to one side of the first pad and extends towards the first pad along the first direction.

2. The circuit board of claim 1, wherein the recess is axisymmetric in shape, and an axis of symmetry of the recess passes through a geometric center of the first subdisc in the first direction.

3. The circuit board according to claim 1 or 2, wherein the first subdisc has a first width W1 along the first direction, the first subdisc further comprises a first side facing away from the second pad, and a distance D1 from a bottom end of the recess to the first side satisfies a condition: d1 is more than or equal to 0.5W1 and less than or equal to 0.75W1.

4. The circuit board according to any one of claims 1 to 3, wherein the first subdisc has a first height H1 along the second direction, and an opening length L1 of the recess satisfies a condition: l1 is more than or equal to 0.5H1.

5. The circuit board of any of claims 1-4, wherein in the second direction, the first subdisc is flush with one of the second pads; or, the first sub-disc is positioned between two second bonding pads.

6. The circuit board of claim 5, wherein in the second direction, the first sub-pad is located between two of the second pads, and the first sub-pad is equidistant from the two second pads, respectively.

7. The circuit board according to any one of claims 1-6, wherein the protrusion is axisymmetric, and an axis of symmetry of the protrusion passes through a geometric center of the second subdisc in the first direction.

8. The circuit board according to any one of claims 1 to 7, wherein the second subdisc further comprises a main body portion, the main body portion is located on a side of the protruding portion facing away from the first pad in the first direction, the main body portion has a second width W2, and a distance D2 from a top end of the protruding portion to the main body portion satisfies a condition: d2 is more than or equal to 0.25W2 and less than or equal to 0.5W2.

9. The circuit board according to any one of claims 1 to 8, wherein in the second direction, the second subdisc has a second height H2, and a length L2 of the projection satisfies a condition: l2 is more than or equal to 0.5H2.

10. The circuit board of any of claims 1-9, wherein the area of the first subdisc is greater than or equal to the area of the second bonding pad.

11. The circuit board of any one of claims 1-10, wherein the second pads are spaced in two rows along the first direction, and the number of the second pads in each row is the same.

12. The circuit board of claim 11, wherein the number of the second pads in each row is two, and the number of the first pads is one.

13. The circuit board according to any one of claims 1 to 10, wherein the number of the second pads is three, three of the second pads are arranged at intervals in the second direction, the number of the first pads is two, and two of the first pads are also arranged at intervals in the second direction.

14. A circuit board assembly comprising an electronic device and a circuit board according to any one of claims 1 to 13, the electronic device being mounted on the circuit board via the first and second pads of the circuit board.

15. An electronic device comprising a housing, and the circuit board assembly of claim 14 disposed within the housing.

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