CN115283996B - Laser and multi-band vibration grinding and polishing coaxial composite processing system and processing method - Google Patents

Abstract

The invention discloses a laser and multi-band vibration polishing coaxial composite processing system and a processing method. The laser and multi-band vibration polishing coaxial composite processing system comprises: the device comprises a polishing unit, a laser processing unit, a cutting fluid supply unit, a vibration generation unit, a motion generation unit and a control unit, wherein the control unit is at least connected with a driving device of the polishing unit, a control module of the laser processing unit, the vibration generation unit and the motion generation unit and is at least used for regulating and controlling working states of the driving device of the polishing unit, the laser processing unit, the vibration generation unit and the motion generation unit. According to the laser and multi-band vibration polishing coaxial composite processing system provided by the embodiment of the invention, a workpiece can realize movement in an xy plane, and a hollow polishing tool can realize movement in a z-axis direction; and the inner coaxial laser can realize the motion independent of the hollow grinding and polishing tool, and can dynamically adjust the defocus parameter in the processing process.

Description

Laser and multi-band vibration grinding and polishing coaxial composite processing system and processing method

Technical field

The invention relates to a fiber laser, multi-band vibration and grinding composite processing method, in particular to a laser and multi-band vibration grinding and polishing coaxial composite processing system and processing method, which belongs to multi-energy field composite manufacturing and laser composite processing technology. field.

Background technique

At present, in processes such as mechanical processing of hard and brittle materials, ultrasonic processing, and water jet processing, due to the presence of contact force, surface/subsurface material damage is likely to occur on the processed surface. When processing large sizes, the processing rate cannot be too high, and the processing cycle is long. Tool wear and other phenomena; at the same time, there are certain constraints between workpiece stiffness, hard and brittle characteristics, lightweight, and high-efficiency processing. By reasonably regulating the vibration/grinding-polishing composite process parameters, high-quality machined surfaces can be achieved. Conventional laser processing of hard and brittle materials is non-contact processing, without the action of cutting force, and during the processing process, macro-micro mechanical movement and local high-speed galvanometer scanning can be combined to achieve high-speed processing. However, laser processing materials melt, re-condensate, and vaporize. After waiting, it is easy to produce irregular deposits on the processed surface, and when hard and brittle materials are heated, uneven thermal stress can easily lead to the generation of micro-cracks. There are certain process limits for accuracy and surface quality, and it is difficult to achieve conventional processing accuracy and surface roughness. The level of precision and ultra-precision processing; at the same time, when laser processing materials, when the power density reaches the material ablation threshold, the material will be ablated and removed. After the laser beam is focused by the lens, the power density is maximum at the beam waist, but the power density changes very little within a certain range in the axial direction, so there is a certain spatial range of processing energy domain, resulting in low processing resolution. Therefore, improving processing efficiency, processing quality, and processing accuracy, and ensuring the coordination and controllability between quality, efficiency, and accuracy are key issues and technical requirements for promoting precision processing of hard and brittle materials.

Contents of the invention

The main purpose of the present invention is to provide a laser and multi-band vibration grinding and polishing coaxial composite processing system and processing method, which is mainly used for efficient, high-precision and high-integrity processing of hard and brittle materials, and can also be extended to other alloys and metals. Precision processing of materials, thereby overcoming the deficiencies in the existing technology.

In order to achieve the foregoing invention objectives, the technical solutions adopted by the present invention include:

On the one hand, embodiments of the present invention provide a laser and multi-band vibration grinding and polishing coaxial composite processing system, including:

The grinding and polishing unit includes a hollow grinding and polishing tool. The hollow grinding and polishing tool is at least used for grinding and polishing the workpiece. The hollow grinding and polishing tool can rotate around its own axis and move along the z-axis of a three-dimensional coordinate system. The z-axis is parallel to the axis of the hollow grinding and polishing tool;

A laser processing unit is at least used to process the workpiece with a laser. The laser passes through the inner cavity of the hollow grinding and polishing tool and is coaxially arranged with the hollow grinding and polishing tool. The laser can be processed at the desired position. The hollow grinding and polishing tool is used for focusing on the surface in contact with the workpiece, and the laser can move freely along the z-axis direction independently of the hollow grinding and polishing tool to adjust the defocus amount;

A cutting fluid supply unit, at least used to provide cutting fluid to form a stable dynamic fluid flow at the periphery of the processing area of the workpiece, the cutting fluid flow passing through the inner cavity of the hollow grinding and polishing tool and being arranged around the laser;

A vibration generating unit, at least used to drive at least one of the hollow grinding and polishing tool and the workpiece to vibrate;

A motion generating unit, at least used to drive the hollow grinding and polishing tool and the workpiece to move relative to each other along the x-axis and/or y-axis in the three-dimensional coordinate system;

The control unit is connected to at least the driving device of the grinding and polishing unit, the control module of the laser processing unit, the vibration generating unit and the motion generating unit, and is at least used to regulate the driving device of the grinding and polishing unit, the laser processing unit, and the vibration generating unit. The working status of the unit and the movement generating unit.

Another aspect of the embodiment of the present invention also provides a laser and multi-band vibration grinding and polishing coaxial composite processing method, including:

Provide the laser and multi-band vibration grinding and polishing coaxial composite processing system;

The first operation of processing the workpiece with the laser and the second operation of processing the workpiece with the hollow grinding and polishing tool are performed simultaneously or step by step, and when performing the second operation, at least one of the hollow grinding and polishing tool and the workpiece is Vibrate until the workpiece is processed.

Compared with the existing technology, the advantages of the present invention include:

1) The hollow grinding and polishing tool of a laser and multi-band vibration grinding and polishing coaxial composite processing system provided by the embodiment of the present invention can realize the laser focus to be focused on the bottom plane of the hollow grinding and polishing tool through the laser, and the laser has axial movement The degree of freedom can realize the adjustment of the defocus amount; moreover, the adjustment of the laser defocus amount is independent of the z-axis movement of the hollow grinding and polishing tool. By adjusting the laser parameters, the material can be preprocessed and the material properties, status and processability can be improved. properties; or, you can also control the laser parameters to achieve milling, polishing and other effects on the material to achieve the formation of a higher quality surface; or, you can control the laser parameters to carry out selective and localized secondary repair of the vibration grinding and polishing surface of the workpiece. processing to further improve processing integrity.

2) In the laser and multi-band vibration grinding and polishing coaxial composite processing system provided by the embodiment of the present invention, the small space outside the laser transmission channel inside the hollow grinding and polishing tool can pass through the cutting fluid, thereby achieving cooling, chip removal, and Cooling and other functions.

3) The hollow grinding and polishing tool of a laser and multi-band vibration grinding and polishing coaxial composite processing system provided by the embodiment of the present invention can realize axial ultrasonic vibration, low-frequency vibration, medium-frequency vibration, etc. while rotating, further improving The processing effect and efficiency of the workpiece.

4) The embodiment of the present invention provides a laser and multi-band vibration grinding and polishing coaxial composite processing system. The workpiece can realize movement in the xy plane, and the hollow grinding and polishing tool can realize movement in the z-axis direction; and the inner coaxial laser can realize movement in the xy plane. It realizes the movement independent of the hollow grinding and polishing tool, and can dynamically adjust the defocus parameters during the processing.

5) A coaxial composite processing system and method of laser and multi-frequency vibration grinding and polishing provided by the embodiment of the present invention, by regulating the spatial attitude of the hollow grinding and polishing tool, planning the movement path of the vibration/grinding and polishing tool and the laser relative to the workpiece to be processed , using specific composite process methods, efficient, high-quality, and high-precision processing of three-dimensional complex curved surfaces can be achieved.

Description of drawings

Figure 1 is a schematic structural diagram of a laser and multi-band vibration grinding and polishing coaxial composite processing system provided in a typical implementation case of the present invention;

Figure 2 is an exploded view of the structure of a laser ultrasonic grinding device provided in a typical implementation case of the present invention;

Figure 3 is a schematic cross-sectional structural diagram of a laser ultrasonic grinding device provided in a typical implementation case of the present invention;

Figure 4 is a schematic process flow diagram of a laser processing and multi-band vibration grinding and polishing composite processing provided in a typical implementation case of the present invention.

Figure 5 is a process flow of laser modification and multi-band vibration grinding and polishing composite processing provided in a typical implementation case of the present invention.

Figure 6 is a schematic process flow diagram of a three-composite process of laser pretreatment, multi-band vibration grinding and polishing, and selective laser processing provided in a typical implementation case of the present invention.

Detailed ways

In view of the deficiencies in the prior art, the inventor of this case was able to propose the technical solution of the present invention after long-term research and extensive practice. The technical solution, its implementation process and principles will be further explained below.

On the one hand, embodiments of the present invention provide a laser and multi-band vibration grinding and polishing coaxial composite processing system, including:

The grinding and polishing unit includes a hollow grinding and polishing tool and a first driving device. The hollow grinding and polishing tool is at least used for grinding and polishing the workpiece. The hollow grinding and polishing tool can rotate around its own axis. The first driving device and The hollow grinding and polishing tool is driven and matched, and is at least used to drive the hollow grinding and polishing tool to move along the z-axis of a three-dimensional coordinate system, and the z-axis is parallel to the axis of the hollow grinding and polishing tool;

A laser processing unit is at least used to process the workpiece with a laser. The laser passes through the inner cavity of the hollow grinding and polishing tool and is coaxially arranged with the hollow grinding and polishing tool. The laser can be processed at the desired position. The hollow grinding and polishing tool is used for focusing on the surface in contact with the workpiece, and the laser can move freely along the z-axis direction independently of the hollow grinding and polishing tool to adjust the defocus amount;

A cutting fluid supply unit, at least used to provide cutting fluid to form a stable dynamic fluid flow at the periphery of the processing area of the workpiece, the cutting fluid flow passing through the inner cavity of the hollow grinding and polishing tool and being arranged around the laser;

A vibration generating unit, at least used to drive at least one of the hollow grinding and polishing tool and the workpiece to vibrate;

A motion generating unit, at least used to drive the hollow grinding and polishing tool and the workpiece to move relative to each other along the x-axis and/or y-axis in the three-dimensional coordinate system;

The control unit is connected to at least the driving device of the grinding and polishing unit, the control module of the laser processing unit, the vibration generating unit and the motion generating unit, and is at least used to regulate the driving device of the grinding and polishing unit, the laser processing unit, and the vibration generating unit. The working status of the unit and the movement generating unit.

In a specific embodiment, the hollow grinding and polishing tool includes: a spindle and a grinding tool head arranged coaxially. The grinding tool head is fixedly arranged at the first end of the spindle. The grinding tool head is in contact with the inside of the spindle. Both have a hollow inner cavity. The grinding tool head and the inner cavity inside the spindle are coaxially arranged and connected with each other to form a transmission channel for transmitting laser and cutting fluid. The spindle is formed with a transmission channel that communicates with the transmission channel. An inlet is formed on the grinding tool head, and an outlet connected to the transmission channel is formed on the grinding tool head.

In a specific embodiment, the grinding and polishing unit further includes a first driving device and a second driving device. The first driving device and the second driving device are respectively connected with the hollow grinding and polishing tool. The driving device is used to drive the hollow grinding and polishing tool to move along the z-axis of a three-dimensional coordinate system, and the second driving device is used to drive the hollow grinding and polishing tool to rotate around its own axis.

In a specific implementation, the second driving device is transmission connected with the main shaft and drives the main shaft to rotate around its own axis.

In a specific implementation, the transmission channel includes a laser transmission channel for laser transmission and a cutting fluid flow channel for cutting fluid transmission, and the cutting fluid flow channel is arranged around the laser transmission channel.

In a specific embodiment, the hollow grinding and polishing tool further includes: a spindle housing, at least a part of the spindle is packaged in the spindle housing, and the first end of the spindle extends from the spindle housing and Fixedly connected to the grinding tool head, the second driving device is provided between the spindle housing and the spindle. A bearing is also provided between the spindle and the spindle housing, and is rotated and matched through the bearing.

In a specific embodiment, the laser processing unit includes a laser and an optical path assembly. The laser is used to provide laser light for processing the workpiece. The optical path assembly is disposed on the optical path of the laser and is used at least for The laser is transmitted into the transmission channel inside the hollow grinding and polishing tool.

In a specific implementation, the optical path assembly includes a shaper, a beam expander, a reflector and a beam reducer that are sequentially arranged on the optical path of the laser, wherein the beam reducer is provided with the hollow grinding and polishing tool on, and corresponds to the entrance connected to the transmission channel.

In a specific implementation, the entrance of the transmission channel is provided at the second end of the main shaft.

In a specific implementation, the laser processing unit further includes a lens assembly and a lens assembly moving device,

The lens assembly is disposed in the transmission channel, and the lens assembly is disposed on the optical path of the laser, and is at least used to focus the laser on the surface where the hollow grinding and polishing tool contacts the workpiece,

The lens assembly moving device is in transmission cooperation with the lens assembly, and part of the lens assembly moving device is arranged outside the transmission channel. The lens assembly moving device is at least used to drive the lens assembly to move freely along the z-axis direction independently of the hollow grinding and polishing tool to adjust the defocus amount.

In a specific embodiment, the lens assembly is disposed in the inner cavity of the grinding tool head.

In a specific embodiment, the cutting fluid supply unit includes a cutting fluid supply device and a hydraulic device. The hydraulic device is provided on the hollow grinding and polishing tool. The hydraulic device is connected to the cutting fluid supply device, and It is at least used to raise the cutting fluid provided by the cutting fluid supply device to a predetermined pressure and then introduce it into the transmission channel in the hollow grinding and polishing tool.

In a specific embodiment, the hollow grinding and polishing tool and the cutting fluid supply unit are fixedly arranged on a support platform, and the first driving device is drivingly connected to the support platform and can drive the hollow grinding and polishing tool and the cutting fluid supply unit. The cutting fluid supply unit moves together along the z-axis of a three-dimensional coordinate system.

In a specific embodiment, the vibration generating unit includes an ultrasonic generator, an ultrasonic horn and a transducer, and the ultrasonic horn and transducer are fixedly connected to the grinding tool head.

In a specific embodiment, the ultrasonic horn, the transducer and the grinding tool head are coaxially arranged, and the hollow grinding and polishing tool can vibrate along its own axis driven by the vibration generating unit.

In a specific embodiment, the motion generating unit includes a third driving device and a fourth driving device. The third driving device is transmission connected with the hollow grinding and polishing tool or the workpiece, and is used to drive the hollow grinding and polishing tool. Or the workpiece moves along the x-axis direction in the three-dimensional coordinate system. The fourth driving device is transmission connected with the hollow grinding and polishing tool or the workpiece, and is used to drive the hollow grinding and polishing tool or the workpiece in the three-dimensional coordinate system. moves in the y-axis direction.

In a specific embodiment, the motion generating unit includes a processing platform, the processing platform is used to place the workpiece, and the third driving device and the fourth driving device are drivingly connected to the processing platform.

In a specific embodiment, the motion generating unit further includes a fifth driving device, the fifth driving device is transmission connected with the processing platform, and is at least used to drive the processing platform to rotate in the xy plane.

In a specific embodiment, the laser and multi-band vibration grinding and polishing coaxial composite processing system also includes: a gas protection unit, the gas protection unit is at least used to protect the contact between the hollow grinding and polishing tool and the workpiece. Protective gas is provided in the area.

Another aspect of the embodiment of the present invention also provides a laser and multi-band vibration grinding and polishing coaxial composite processing method, including:

Provide the laser and multi-band vibration grinding and polishing coaxial composite processing system;

The first operation of processing the workpiece with the laser and the second operation of processing the workpiece with the hollow grinding and polishing tool are performed simultaneously or step by step, and when performing the second operation, at least one of the hollow grinding and polishing tool and the workpiece is Vibrate until the workpiece is processed.

In a specific embodiment, the coaxial composite processing method of laser and multi-band vibration grinding and polishing also includes: in the process of performing the first operation, making the laser move freely along the z-axis direction independently of the hollow grinding and polishing tool, so as to Adjust the amount of defocus.

In a specific embodiment, the coaxial composite processing method of laser and multi-band vibration grinding and polishing also includes: during the process of performing the first operation and/or the second operation, the workpiece and the hollow grinding and polishing tool are moved along the x-axis At least one of the y-axis and the z-axis moves relative to each other and/or causes the workpiece to rotate around a rotation axis.

In a specific embodiment, the coaxial composite processing method of laser and multi-band vibration grinding and polishing also includes: dynamically covering the processing area of the workpiece with inert gas during the execution of the first operation and/or the second operation.

In a specific embodiment, the laser and multi-band vibration grinding and polishing coaxial composite processing method further includes: during the process of performing the first operation and/or the second operation, using cutting fluid to form a layer on the periphery of the processing area of the workpiece. Stable dynamic liquid flow.

The technical solution, its implementation process and principles will be further explained below with reference to the accompanying drawings and specific implementation cases. It should be noted that the fiber laser, rotary drive motor/cylinder, and linear drive motor used in the embodiment of the present invention /Cylinders, laser generators, shapers, laser beam expanders, laser beam reducers, lenses, bearings, hydraulic devices (systems), ultrasonic generators, transducers, ultrasonic horns, etc. are all available through commercial purchases existing devices/devices/components, those skilled in the art can select devices/devices/components of different sizes and models according to specific needs. The models of devices/devices/components in the embodiments of the present invention are different and do not correspond to the implementation of the present invention. In this example, the function of laser and multi-band vibration grinding and polishing coaxial composite processing system is realized.

Please refer to Figure 1, a laser and multi-band vibration grinding and polishing coaxial composite processing system, mainly used for processing hard and brittle materials, specifically including: grinding and polishing unit, laser processing unit, cutting fluid supply unit, vibration generation unit, A motion generating unit and a control unit. The control unit is respectively connected to the driving device of the grinding and polishing unit, the control module of the laser processing unit, the vibration generating unit and the motion generating unit.

In this embodiment, the grinding and polishing unit is at least used to grind and polish the workpiece with a hollow grinding and polishing tool, and the laser processing unit is at least used to perform laser processing (such as milling and milling) on the workpiece with a laser. ), the cutting fluid supply unit is at least used to provide cutting fluid to form a stable dynamic fluid flow around the processing area of the workpiece, and the vibration generating unit is at least used to drive at least one of the hollow grinding and polishing tools and the workpiece. One of them vibrates; the movement generating unit is at least used to drive the hollow grinding and polishing tool and the workpiece to move relative to each other along the x-axis and/or y-axis in the three-dimensional coordinate system; and the control unit is at least used to regulate the grinding and polishing tool. The working status of the unit's driving device, laser processing unit, vibration generating unit and motion generating unit.

In this embodiment, please refer to Figures 1-3. The grinding and polishing unit includes a hollow grinding and polishing tool, a first driving device and a second driving device 730. The hollow grinding and polishing tool is at least used to grind and polish the workpiece. processing, the first driving device and the second driving device 730 are respectively connected with the hollow grinding and polishing tool, the second driving device 730 is used to drive the hollow grinding and polishing tool to rotate around its own axis, the first The driving device is used to drive the hollow grinding and polishing tool to move along the z-axis of a three-dimensional coordinate system, and the z-axis is parallel to the axis of the hollow grinding and polishing tool.

In this embodiment, the hollow grinding and polishing tool includes a coaxially arranged main shaft 728 and a grinding tool head 701. The grinding tool head 701 is fixedly installed on the first end of the main shaft 728. The grinding tool head 701 Both the grinding tool head 701 and the main shaft 728 have a hollow inner cavity. The grinding tool head 701 is coaxially arranged with the inner cavity of the main shaft 728 and communicates with each other to form a transmission channel 725 for the transmission of laser and cutting fluid, wherein the main shaft 728 is formed with an inlet communicating with the transmission channel 725, and the grinding tool head 701 is formed with an outlet communicating with the transmission channel 725. The transmission channel 725 includes a laser transmission channel 722 for laser transmission and A cutting fluid flow channel for cutting fluid transmission. The cutting fluid flow channel is arranged around the laser transmission channel 722. Therefore, the transmission channel 725 can be understood as a composite transmission channel for cutting fluid and laser transmission; wherein, the third The two driving devices 730 are transmission connected with the main shaft 728 and can drive the main shaft 728 to rotate around its own axis.

In this embodiment, the hollow grinding and polishing tool further includes a spindle housing 715. At least a part of the spindle 728 is enclosed in the spindle housing 715 and rotates with the spindle housing 715. The third part of the spindle 728 is One end extends from the spindle housing 715 and is fixedly connected to the grinding tool head 701. The second end of the spindle 728 is exposed from the spindle housing 715 and is provided with an entrance to the transmission channel; The second driving device 730 is disposed between the spindle housing 715 and the spindle 728. For example, the second driving device 730 is fixedly disposed on the spindle housing 715. The driving of the second driving device 730 The shaft is fixedly connected to the main shaft 728 , and the first driving device is drivingly connected to the main shaft housing 715 .

In this embodiment, the first driving device is a linear driving device, such as a linear driving motor or a linear driving cylinder, and the second driving device 730 is a rotating driving device, such as a rotating driving motor or a rotating drive. Cylinder etc.

In this embodiment, the laser processing unit is at least used to process the workpiece with laser, and the laser provided by the laser processing unit is transmitted from the inner cavity of the hollow grinding and polishing tool (the interior of the hollow grinding and polishing tool). channel (mainly the laser transmission channel 722 part of the transmission channel) and is coaxially arranged with the hollow grinding and polishing tool, and the laser can be on the surface of the hollow grinding and polishing tool that is used to contact the workpiece. focusing, and the laser can move freely along the z-axis direction independently of the hollow grinding and polishing tool at least to adjust the defocus amount.

In this embodiment, the laser processing unit includes a laser 2 and an optical path assembly. The laser 2 is used to provide laser light for processing the workpiece. The optical path assembly is disposed on the optical path of the laser and uses at least In the transmission channel for transmitting the laser to the inside of the hollow grinding and polishing tool, for example, the laser 2 can be a fiber laser, etc., and the laser provided by the laser can be a fiber laser.

In this embodiment, the optical path assembly includes a shaper 3, a beam expander 4, a reflector 5 and a beam reducer 721 which are sequentially arranged on the optical path of the laser, wherein the beam reducer 721 is configured with the on the hollow grinding and polishing tool, and corresponds to the entrance connected to the transmission channel.

In this embodiment, the laser processing unit also includes a lens assembly 702 and a lens assembly moving device 729. The lens assembly 702 is disposed in the transmission channel, and the lens assembly 702 is disposed on the optical path of the laser. , and is at least used to focus the laser on the surface where the hollow grinding and polishing tool contacts the workpiece. The lens assembly moving device 729 is in transmission cooperation with the lens assembly 702, and part of the lens assembly moving device 729 is disposed on Outside the transmission channel, the lens assembly moving device 729 is at least used to drive the lens assembly 702 to move freely along the z-axis direction independently of the hollow grinding and polishing tool to adjust the defocus amount. As a preferred solution, The lens assembly 702 is disposed in the inner cavity of the grinding tool head 701 .

It should be noted that the lens assembly moving device 729 can adopt components/devices known to those skilled in the art, which are commercially available. The connection structure/mode and driving mode of the lens assembly moving device 729 and the lens assembly are also It is a method known to those skilled in the art, and the specific product model and structure of the lens assembly moving device 729 are not limited here.

In this embodiment, the laser processing unit further includes a control module 1. The control module 1 may be a laser controller. The control module is connected to the laser 2 and used to control the working state of the laser 2.

In this embodiment, the cutting fluid supply unit is at least used to provide cutting fluid to form a stable dynamic fluid flow around the processing area of the workpiece. The cutting fluid flow passes through the inner cavity of the hollow grinding and polishing tool and surrounds it. In the laser setting, specifically, the cutting fluid flow mainly passes through the cutting fluid flow channel of the transmission channel in the inner cavity of the hollow grinding and polishing tool.

In this embodiment, the cutting fluid supply unit includes a cutting fluid supply device 6 and a hydraulic device 723. The hydraulic device 723 is provided on the hollow grinding and polishing tool. The hydraulic device 723 and the cutting fluid supply device 6 and the main shaft 728, and is at least used to raise the cutting fluid provided by the cutting fluid supply device 6 to a predetermined pressure and then introduce it into the transmission channel in the hollow grinding and polishing tool (ie, the transmission channel in the main shaft 728).

In this embodiment, the cutting fluid supply device 6 of the hollow grinding and polishing tool and the cutting fluid supply unit is fixedly arranged on a support platform, and the first driving device is drivingly connected to the support platform and can drive the The hollow grinding and polishing tool and the cutting fluid supply unit move together along the z-axis of a three-dimensional coordinate system. For example, the cutting fluid supply device 6 may include a container for containing cutting fluid, and the container is connected to the cutting fluid through a pipeline. Hydraulic device 723 is connected.

In this embodiment, the first driving device can be fixedly arranged on a moving platform 8, and the supporting platform can flexibly cooperate with the moving platform 8 through guide rails, etc., or can be installed in the air. It is preferable that the supporting platform is connected to the moving platform 8. The moving platform 8 is movable through guide rails and the like.

In this embodiment, the vibration generating unit includes an ultrasonic generator 13, an ultrasonic horn 706 and a transducer 709. The ultrasonic horn 706 and the transducer 709 are fixedly connected to the grinding and polishing tool head. Specifically, Yes, the transducer 709 and the ultrasonic horn 706 can be coaxially sleeved on the grinding tool head 701, and the transducer, the ultrasonic horn and the grinding and polishing tool head can jointly form an ultrasonic knife, Its various parts can be fixed and clamped through some connecting structures.

In this embodiment, the ultrasonic horn 706 and the transducer 709 are coaxially arranged with the grinding tool head 701 and the spindle 728. The hollow grinding and polishing tool can be driven along its own axis by the vibration generating unit. Directional vibration, specifically, it can be ultrasonic vibration, low-frequency vibration, medium-frequency vibration, etc.

In this embodiment, the motion generating unit includes a third driving device and a fourth driving device. The third driving device is transmission connected with the hollow grinding and polishing tool or the workpiece, and is used to drive the hollow grinding and polishing tool or the workpiece. The workpiece moves along the x-axis direction in the three-dimensional coordinate system. The fourth driving device is transmission connected with the hollow grinding and polishing tool or the workpiece, and is used to drive the hollow grinding and polishing tool or the workpiece in the three-dimensional coordinate system. Move along the y-axis direction.

In this embodiment, the motion generating unit includes a processing platform for placing workpieces, and the third driving device and the fourth driving device are drivingly connected to the processing platform.

In this embodiment, the motion generating unit also includes an x-axis feeding platform 10 and a y-axis feeding platform 11. The x-axis feeding platform 10 is transmission connected with the third driving device and can move along the x-axis, so The y-axis feeding platform 11 is transmission connected with the fourth driving device and can move along the y-axis. For example, the x-axis feeding platform 10 is disposed on the y-axis feeding platform 11 and is connected with the y-axis feeding platform 11 . The platform 11 movablely cooperates, and the processing platform is arranged on the x-axis feeding platform 10. That is, the x-axis feeding platform 10 and the y-axis feeding platform 11 can be driven along the y axis by the fourth driving device. axis movement, as a preferred solution, the x-axis feeding platform 10 and the y-axis feeding platform 11 can cooperate through slide rails, etc., and the x-axis feeding platform 10 and the y-axis feeding platform 11 A motion decoupling device can also be installed in the space to realize motion decoupling. The specific structure and implementation method are not specifically limited.

In this embodiment, the motion generating unit further includes a fifth driving device, the fifth driving device is transmission connected with the processing platform, and is at least used to drive the processing platform to rotate in the xy plane, for example, The fifth driving device is used to drive the processing platform to rotate around the z-axis. For example, the fifth driving device can be fixedly arranged on the x-axis feeding platform 10 .

In this embodiment, the third driving device and the fourth driving device are both linear driving devices, such as linear driving motors or linear driving cylinders, etc., and the fifth driving device is a rotary driving device, such as a rotary driving device. Drive motor or rotary drive cylinder, etc.

In this embodiment, the control unit also includes a motion control and ultrasonic control platform 12, which is connected with the ultrasonic generator, the third driving device, the fourth driving device and the fifth driving device. Connected and used to control the working status of the ultrasonic generator, the third driving device, the fourth driving device and the fifth driving device.

It should be noted that the control unit can be a commercially available controller, and its supporting control software can also be commercially available. The specific type and model of the controller and the control software will not affect the function of the present invention. , the specific structure of the control unit is not limited here.

In this embodiment, the laser and multi-band vibration grinding and polishing coaxial composite processing system also includes a gas protection unit, which is at least used to provide gas to the contact area between the hollow grinding and polishing tool and the workpiece. Protective gas, the gas protection unit can be a gas supply device, etc., the gas supply device is also connected to the control unit, for example, the gas supply device can be a gas container with a gas switch valve, etc., the The gas may be an inert gas or the like.

Please refer to Figures 1, 2 and 3 again. Part of the laser processing unit, cutting fluid supply unit, and vibration generating unit can be integrated with the grinding and polishing unit to form a laser ultrasonic grinding device 7. Please refer to Figure 2 for details. As shown in Figure 3, the laser ultrasonic grinding device 7 includes a hollow grinding and polishing tool, a laser beam reducer 721, a hydraulic device 723, a second driving device 730, an ultrasonic horn 706, a transducer 709, a lens assembly 702, and a lens. Assembly movement device 729.

In this embodiment, the hollow grinding and polishing tool includes a spindle 728, a spindle housing 715, and a grinding tool head 701. The spindle 728 is coaxially disposed in the spindle housing 715. The first end of the spindle 728, The second ends respectively protrude or are exposed from the two ends of the spindle housing 715. The two ends of the spindle housing 715 are respectively fixed with first end caps 710 and second end caps 720. The first end caps 710, A receiving cavity is formed between the second end cover 720 and the spindle housing 715, and the second driving device 730 is disposed in the receiving cavity.

In this embodiment, a second positioning and fastening device 719 is also provided between the spindle housing 715 and the spindle 728. The second positioning and fastening device 719 is fixedly connected to the spindle housing 715. The second end The cover 720 is fixedly provided on the second positioning fastening device 719, the hydraulic device 723 is fixedly provided on the second end cover 720, and a third positioning fastening device 719 is provided between the second positioning fastening device 719 and the main shaft 728. A second bearing 727 is provided between a bearing 724, the first end cover 710 and the main shaft 728. The first bearing and the second bearing can realize the rotational fit between the main shaft and the main shaft housing. For example, the first bearing Both the second bearing and the second bearing can be angular contact ball bearings, etc.

In this embodiment, the second driving device 730 includes a stator 716, a rotor 717 and a motor cooling housing 718. The motor cooling housing 718 is fixedly connected to the spindle housing 715. The stator 716 and the rotor 717 are arranged on the motor. In the cooling housing 718 , the stator 716 is fixedly arranged on the motor cooling housing 718 , and the rotor 717 is fixedly connected to the main shaft 728 .

In this embodiment, a slip ring and a sleeve 726 are also provided between the main shaft 728 and the main shaft housing 715. The slip rings and sleeves 726 are arranged in sequence along the axial direction of the main shaft 728. The slip ring and The sleeve 726 is disposed in the area of the spindle 728 close to the grinding tool head 701. The stator 716 of the slip ring is fixedly connected to the spindle housing 715. The rotor 717 of the slip ring is fixedly connected to the spindle 728. The sleeve 716 is sleeved. on spindle 728.

In this embodiment, a second positioning and fastening device 712 is also provided between the spindle housing 715 and the slip ring. The second positioning and fastening device 712 is fixedly connected to the spindle housing 715. The slip ring is The stator 716 is fixedly connected to the second positioning and fastening device 712 .

In this embodiment, the transducer 709 is disposed in the inner cavity of the main shaft 728 and close to the first end of the main shaft 728 . The transducer 709 is connected to the inner cavity of the main shaft 728 via a sealing ring 711 . The transmission channel 725 is sealed and matched, and part of the ultrasonic horn 706 is disposed in the inner cavity of the main shaft 728 and fixedly matched with the main shaft 728 through the double-headed stud 708, and the ultrasonic horn 706 is also The spindle 728 is fixedly connected to the spindle 728 through threaded connectors such as screws 707. The spindle 728 is fixedly connected to the grinding tool head 701. The lens assembly 702 is disposed in the inner cavity of the grinding tool head 701 and is connected to the outside. The lens assembly moving device 703 is connected.

In this embodiment, the ultrasonic horn 706 and the transducer 709 are coaxially sleeved on the grinding tool head 701 , and the ultrasonic horn 706 passes through an elastic chuck 705 and a fastening nut 703 It is fixedly coupled to the grinding tool head 701, and a sealing gasket 704 is also provided between the fastening nut 703, the elastic chuck 705, and the ultrasonic horn 706.

Please refer to Figures 4 to 6. In a specific embodiment, the laser and multi-band vibration grinding and polishing coaxial compound processing system in Figures 1 to 3 is used to perform laser and multi-band vibration grinding and polishing coaxial compound processing. include:

Provide the laser and multi-band vibration grinding and polishing coaxial composite processing system;

The first operation of processing the workpiece with the laser and the second operation of processing the workpiece with the hollow grinding and polishing tool are performed simultaneously or step by step, and when performing the second operation, at least one of the hollow grinding and polishing tool and the workpiece is Vibrate until the workpiece is processed.

In this embodiment, the coaxial composite processing method of laser and multi-band vibration grinding and polishing also includes: in the process of performing the first operation, making the laser move freely along the z-axis direction independently of the hollow grinding and polishing tool to adjust Defocus amount.

In this embodiment, the coaxial composite processing method of laser and multi-band vibration grinding and polishing also includes: during the process of performing the first operation and/or the second operation, making the workpiece and the hollow grinding and polishing tool move along the x-axis, At least one of the y-axis and the z-axis moves relative to each other and/or causes the workpiece to rotate around a rotation axis.

In this embodiment, the coaxial composite processing method of laser and multi-band vibration grinding and polishing also includes: dynamically covering the processing area of the workpiece with an inert gas during the execution of the first operation and/or the second operation.

In this embodiment, the coaxial composite processing method of laser and multi-band vibration grinding and polishing also includes: during the process of performing the first operation and/or the second operation, using cutting fluid to form a stable structure on the periphery of the processing area of the workpiece. dynamic liquid flow.

The hollow grinding and polishing tool (such as a diamond tool) of a laser and multi-band vibration grinding and polishing coaxial composite processing system provided by an embodiment of the present invention can realize rotational motion in a high speed range.

The hollow grinding and polishing tool of the laser and multi-band vibration grinding and polishing coaxial composite processing system provided by the embodiment of the present invention can realize the laser focus on the bottom plane of the hollow grinding and polishing tool through the laser, and the laser has the freedom of axial movement , the defocus amount can be adjusted; moreover, the adjustment of the laser defocus amount is independent of the z-axis movement of the hollow grinding and polishing tool. By adjusting the laser parameters, the material can be preprocessed and the material properties, status and processability can be improved; Alternatively, you can also control the laser parameters to achieve milling, polishing and other effects on the material to achieve the formation of a higher quality surface; or, you can control the laser parameters to perform selective and localized secondary repair on the vibrating grinding and polishing surface of the workpiece. Further improve processing integrity.

In the laser and multi-band vibration grinding and polishing coaxial composite processing system provided by the embodiment of the present invention, the small space outside the laser transmission channel inside the hollow grinding and polishing tool can pass cutting fluid, thereby achieving cooling, chip removal, cooling, etc. during the processing process. Function.

The hollow grinding and polishing tool of the laser and multi-band vibration grinding and polishing coaxial composite processing system provided by the embodiment of the present invention can realize axial ultrasonic vibration, low frequency vibration, medium frequency vibration, etc. while rotating, further improving the accuracy of the workpiece. processing effect and efficiency.

The embodiment of the present invention provides a coaxial composite processing method of laser and multi-frequency vibration grinding and polishing. Inert gas protection can be introduced during the processing of the workpiece to achieve dynamic coverage of the workpiece processing area.

The embodiment of the present invention provides a laser and multi-band vibration grinding and polishing coaxial composite processing system. The workpiece can realize movement in the xy plane, and the hollow grinding and polishing tool can realize movement in the z-axis direction; and the inner coaxial laser can realize independent movement. Based on the movement of the hollow grinding and polishing tool, the defocus parameter during the processing can be dynamically adjusted.

The embodiment of the present invention provides a coaxial composite processing system of laser and multi-frequency vibration grinding and polishing. The laser beam focus formed by the optical fiber and the softening, heating, melting, removal and other processes of the workpiece material can effectively avoid the negative effects of the cutting fluid. ; The flow channel design of the cutting fluid flow can form a stable dynamic fluid flow around the processing point, and achieve dynamic optimization of the machined surface quality during the processing process.

In the coaxial composite processing method of laser and multi-frequency vibration grinding and polishing provided by the embodiment of the present invention, the function of the laser is to achieve ablation removal, milling, polishing and other effects on the workpiece material. In order to further improve the processing accuracy and quality, Using the secondary finishing process of the grinding and polishing tool head, high-quality and high-precision processing of the workpiece surface is achieved through the dual-composite process of "laser pretreatment of materials and compound vibration grinding and polishing"; or, fiber laser is used to achieve material pretreatment. Improve material properties, status, and processability, and provide an initial surface state for high-quality and high-precision processing of grinding and polishing tools through the dual-composite process of "laser pretreatment of materials, combined vibration grinding and polishing"; or, first, fiber laser pretreatment On the basis of processing the processed materials, grinding and polishing tools are used for high-quality and high-precision processing. For the processed surface, selective laser localization processing is used to achieve additional repair processing of surface micro-features. Through "laser pre-treatment of materials first, composite The three-composite process of vibration grinding and polishing, followed by secondary light preparation and area repair can further improve the integrity of the processed surface.

The embodiments of the present invention provide a coaxial composite processing system and method of laser and multi-frequency vibration grinding and polishing. By regulating the spatial posture of the hollow grinding and polishing tool, the movement path of the vibration/grinding and polishing tool and the laser relative to the workpiece is planned, using Specific composite process methods can achieve efficient, high-quality, and high-precision processing of three-dimensional complex curved surfaces.

It should be understood that the above embodiments are only to illustrate the technical concepts and characteristics of the present invention. Their purpose is to enable those familiar with the technology to understand the content of the present invention and implement it accordingly, and cannot limit the scope of protection of the present invention. All equivalent changes or modifications made based on the spirit of the present invention should be included in the protection scope of the present invention.

Claims (17)

1. The utility model provides a coaxial combined machining system is thrown to laser and multifrequency section vibration mill which characterized in that includes:

the grinding and polishing unit comprises a hollow grinding and polishing tool, a first driving device and a second driving device, wherein the hollow grinding and polishing tool is at least used for grinding and polishing a workpiece, the first driving device and the second driving device are respectively connected with the hollow grinding and polishing tool in a transmission way, the first driving device is used for driving the hollow grinding and polishing tool to move along a z-axis of a three-dimensional coordinate system, the second driving device is used for driving the hollow grinding and polishing tool to rotate around an axis of the second driving device, the z-axis is parallel to the axis of the hollow grinding and polishing tool, the hollow grinding and polishing tool comprises a spindle and a grinding tool head which are coaxially arranged, the grinding tool head is fixedly arranged at a first end of the spindle, the grinding tool head and the interior of the spindle are both provided with hollow inner cavities, the grinding tool head and the inner cavities of the spindle are coaxially arranged and are mutually communicated to form a transmission channel for transmitting laser and cutting fluid, an inlet communicated with the transmission channel is formed on the spindle, and an outlet communicated with the transmission channel is formed on the grinding tool head;

The laser processing unit is at least used for processing the workpiece by laser, the laser passes through the inner cavity of the hollow polishing tool and is coaxially arranged with the hollow polishing tool, the laser processing unit comprises a laser, an optical path component, a lens component and a lens component moving device, the laser is used for providing the laser for processing the workpiece, the optical path component is arranged on the optical path of the laser and is at least used for transmitting the laser into a transmission channel inside the hollow polishing tool, the lens component is arranged in the transmission channel and is arranged on the optical path of the laser and is at least used for focusing the laser on a surface of the hollow polishing tool, which is contacted with the workpiece, the lens component moving device is in transmission fit with the lens component, a part of the lens component moving device is arranged outside the transmission channel, and the lens component moving device is at least used for driving the lens component to freely move along the z-axis direction independently of the hollow polishing tool so as to adjust the defocusing amount;

a cutting fluid supply unit at least for supplying a cutting fluid to form a stable dynamic fluid flow around a periphery of a machining area of the workpiece, the cutting fluid flow passing through the hollow grinding and polishing tool inner cavity and being disposed around the laser;

The vibration generating unit is at least used for driving at least one of the hollow polishing tool and the workpiece to vibrate;

the motion generating unit is at least used for driving the hollow polishing tool and the workpiece to move relatively along the x axis and/or the y axis in the three-dimensional coordinate system;

the control unit is at least connected with the driving device of the polishing unit, the control module of the laser processing unit, the vibration generating unit and the motion generating unit and is at least used for regulating and controlling the working states of the driving device of the polishing unit, the laser processing unit, the vibration generating unit and the motion generating unit.

2. The laser and multi-band vibration polishing coaxial composite machining system according to claim 1, wherein: the second driving device is in transmission connection with the main shaft and drives the main shaft to rotate by taking the axis of the main shaft as a shaft.

3. The laser and multi-band vibration polishing coaxial composite machining system according to claim 1, wherein: the transmission channel comprises a laser transmission channel for laser transmission and a cutting fluid flow channel for cutting fluid transmission, and the cutting fluid flow channel is arranged around the laser transmission channel.

4. The laser and multi-band vibration polishing coaxial composite machining system according to claim 1, wherein: the hollow polishing tool further comprises: the main shaft shell, at least a part of main shaft is encapsulated in the main shaft shell, the first end of main shaft stretches out from in the main shaft shell and is fixedly connected with the grinding tool head, the second driving device is arranged between the main shaft shell and the main shaft, and the main shaft is also provided with a bearing between the main shaft and the main shaft shell and is in running fit with the bearing.

5. The laser and multi-band vibration polishing coaxial composite machining system according to claim 1, wherein: the light path component comprises a shaper, a beam expander, a reflecting mirror and a beam shrinking device which are sequentially arranged on the light path of the laser, wherein the beam shrinking device is arranged on the hollow polishing tool and corresponds to the entrance of the communication of the transmission channel.

6. The laser and multi-band vibration polishing coaxial composite machining system according to claim 5, wherein: the inlet of the transmission channel is arranged at the second end of the main shaft.

7. The laser and multi-band vibration polishing coaxial composite machining system according to claim 1, wherein: the lens assembly is disposed in an interior cavity of the grinding tool head.

8. The laser and multi-band vibration polishing coaxial composite machining system according to claim 1, wherein: the cutting fluid supply unit comprises a cutting fluid supply device and a hydraulic device, wherein the hydraulic device is arranged on the hollow grinding and polishing tool, and the hydraulic device is connected with the cutting fluid supply device and is at least used for lifting the cutting fluid provided by the cutting fluid supply device to a preset pressure and then guiding the cutting fluid into a transmission channel in the hollow grinding and polishing tool.

9. The laser and multi-band vibration polishing coaxial composite machining system according to claim 8, wherein: the hollow grinding and polishing tool and the cutting fluid supply unit are fixedly arranged on a supporting platform, and the first driving device is in transmission connection with the supporting platform and can drive the hollow grinding and polishing tool and the cutting fluid supply unit to move along the z-axis of a three-dimensional coordinate system together.

10. The laser and multi-band vibration polishing coaxial composite machining system according to claim 1, wherein: the vibration generating unit comprises an ultrasonic generator, an ultrasonic amplitude transformer and a transducer, and the ultrasonic amplitude transformer and the transducer are fixedly connected with the grinding tool head.

11. The laser and multi-band vibration polishing coaxial composite machining system according to claim 10, wherein: the ultrasonic amplitude transformer, the transducer and the grinding tool head are coaxially arranged, and the hollow grinding and polishing tool can vibrate along the axis direction of the hollow grinding and polishing tool under the driving of the vibration generating unit.

12. The laser and multi-band vibration polishing coaxial composite machining system according to claim 1, wherein: the motion generating unit comprises a third driving device and a fourth driving device, wherein the third driving device is in transmission connection with the hollow polishing tool or workpiece and is used for driving the hollow polishing tool or workpiece to move along the x-axis direction in the three-dimensional coordinate system, and the fourth driving device is in transmission connection with the hollow polishing tool or workpiece and is used for driving the hollow polishing tool or workpiece to move along the y-axis direction in the three-dimensional coordinate system.

13. The laser and multi-band vibration polishing coaxial composite machining system according to claim 12, wherein: the motion generating unit comprises a processing platform, the processing platform is used for placing a workpiece, and the third driving device and the fourth driving device are in transmission connection with the processing platform.

14. The laser and multi-band vibration polishing coaxial composite machining system according to claim 13, wherein: the motion generating unit further comprises a fifth driving device in driving connection with the processing platform and at least used for driving the processing platform to rotate in the xy plane.

15. The laser and multi-band vibration polishing coaxial composite machining system according to claim 1, further comprising: and the gas protection unit is at least used for providing protection gas for a contact area between the hollow polishing tool and the workpiece.

16. A laser and multi-band vibration grinding and polishing coaxial composite processing method is characterized by comprising the following steps:

providing the laser and multi-band vibration polishing coaxial composite processing system of any one of claims 1-15;

synchronously or stepwise performing a first operation of machining a workpiece with a laser and a second operation of machining a workpiece with a hollow grinding and polishing tool, and vibrating at least one of the hollow grinding and polishing tool and the workpiece until machining of the workpiece is completed while performing the second operation;

And in the process of executing the first operation, enabling the laser to freely move along the z-axis direction independently of the hollow polishing tool so as to adjust the defocus amount, enabling the workpiece and the hollow polishing tool to relatively move along at least one of the x-axis, the y-axis and the z-axis and/or enabling the workpiece to rotate around a rotation axis in the process of executing the first operation and/or the second operation, and enabling the cutting fluid to form stable dynamic liquid flow on the periphery of a processing area of the workpiece in the process of executing the first operation and/or the second operation.

17. The method of claim 16, further comprising: during execution of the first and/or second operations, the processing region of the workpiece is dynamically covered with an inert gas.