CN115283203B - Surface-mounted integrated circuit packaging equipment for planar array - Google Patents
Surface-mounted integrated circuit packaging equipment for planar array Download PDFInfo
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- CN115283203B CN115283203B CN202211219382.8A CN202211219382A CN115283203B CN 115283203 B CN115283203 B CN 115283203B CN 202211219382 A CN202211219382 A CN 202211219382A CN 115283203 B CN115283203 B CN 115283203B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/10—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed before the application
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/002—Pretreatement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a planar array surface-mounted integrated circuit packaging device, and relates to the technical field of integrated circuit packaging. According to the invention, the substrate to be packaged is placed in the groove of the operation plate, the integrated circuit chip is placed in the substrate, the cover plate is placed in the area limited by the clamping clamp and the operation plate, the movement control mechanism moves to enable the mold fixing mechanism to move to the position below the double-cylinder cleaning mechanism for cleaning, then the UV glue gun is controlled to move to apply UV glue dots at the set position of the substrate, after glue dropping is finished, the upper side surface of the cover plate is manually clamped in the clamping clamp of the substrate accessory in a turnover mode to be bonded with the upper side surface of the substrate, the movement control mechanism moves to enable the mold fixing mechanism to move to the position below the front-back moving mechanism to irradiate the UV glue dots, and solidification is realized, so that the dispensing packaging by using a traditional hot melt glue and heating and pressurizing mode is avoided, pungent smell is avoided, energy consumption is reduced, and green environmental protection is achieved.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to a planar array surface-mounted integrated circuit packaging device.
Background
The integrated circuit is a miniature electronic device or part, adopt certain craft, interconnect elements such as transistor, resistance, electric capacity and inductance that a circuit needs and routing together, make on a small or several small semiconductor wafers or medium substrates, then encapsulate in a tube, become the microstructure with necessary circuit function, the SMD integrated circuit of the planar array is one of them, the integrated circuit is various, common mobile phone processes integrated circuit, logic integrated circuit, phase-locked loop integrated circuit, etc. with radio frequency; their packaging forms are also very diverse.
In the prior art, as Chinese patent numbers are: CN102983086B "plane array paster type low energy consumption environment-friendly high-precision becomes circuit packaging mould", this type mould is by a plurality of lower moulds annotate the material pole by pressure board hydro-cylinder for the even material of annotating of power, make green epoxy flow through lower mould notes material piece and go up mould notes material piece and fill the new filling form in the mould cavity, the position of strict control feeding, the size of runner, the speed and the flow of feeding guarantee the completion of filling process. The problems of air accumulation, insufficient filling and large warping degree caused by poor flowability of green epoxy plastics of the existing die are solved. The problem of electric property failure such as layering or cracking caused by the influence of high viscosity of green epoxy plastic on mold stripping is solved through a stripping mechanism of the mold. Compared with the existing packaging mode die, the die has the advantages of realizing product diversification, improving stability and having special significance under the background of worldwide energy conservation and consumption reduction.
Although the technology solves the problems of insufficient filling and large warping degree after the integrated circuit is packaged, in practical application, in the packaging of the planar array surface mount integrated circuit, the upper and lower substrates and the integrated circuit are bonded and fixed by adopting glue dispensing mostly, the operation process of the glue dispensing is to drip hot melt adhesive on the part needing to be bonded, the separated integrated circuit parts are fixed by adopting a heating and pressurizing mode, the cleanliness of the part to be subjected to the glue dispensing before the glue dispensing is higher, dust and the like are adhered to the glue dispensing part, so that the glue dispensing part generates a cavity due to the dust, the bonding quality after the glue dispensing is affected, and in severe cases, the glue solution of the glue dispensing part fails, the bonding is unstable, and the packaging of the planar array surface mount integrated circuit is seriously affected;
the existing glue solution fixing mode is a mode of heating and pressurizing the glue applying part, in the heating process, the hot melt glue can generate pungent smell and volatilize small particle pollutants, the small particle pollutants not only cause dangerous environment pollution to human health, but also cause the reduction of the electric conductivity of the integrated circuit and the like when invading the integrated circuit to be packaged, and the packaging effect of the integrated circuit is influenced.
Disclosure of Invention
The invention aims to provide a planar array surface mount integrated circuit packaging device, which solves the problems that the packaging of the planar array surface mount integrated circuit proposed by the background technology adopts a glue dispensing mode mostly, the glue dispensing operation process is to drip hot melt glue on a part needing to be adhered, the separated integrated circuit parts are fixed by adopting a heating and pressurizing mode, the hot melt glue can generate pungent smell in the heating process, the smell is harmful to the health of a human body and can pollute the environment, and the energy consumption in the heating and pressurizing process is more.
In order to achieve the purpose, the invention provides the following technical scheme: a planar array surface-mount integrated circuit packaging device comprises an ultraviolet lamp, wherein a fixed frame is fixedly connected to the side surface of the ultraviolet lamp, a movement control mechanism is fixedly connected to the lower portion of the inner side of the fixed frame, a double-barrel cleaning mechanism is fixedly connected to the right end of the upper side of the movement control mechanism, the double-barrel cleaning mechanism comprises a cleaning assembly, the cleaning assembly comprises a sponge layer, a rubber layer is fixedly connected to the lower side of the sponge layer, an inner spring is fixedly connected to the lower side of the rubber layer, a shaft ring is fixedly connected to the other end of the inner spring, a central shaft is fixedly mounted in the middle of the shaft ring, four groups of array spring pieces are uniformly and fixedly connected to the outer surface of the shaft ring, a carbon fiber arc plate is fixedly connected to the outer surface of the carbon fiber arc plate, two side surfaces of the carbon fiber arc plate are in lap joint with two side surfaces of the rubber layer, a long shaft coupler is fixedly mounted at one end of the central shaft, an end cover is in threaded connection with the other end of the central shaft, a gear ring is in meshing connection with the middle of the outer surface of the long shaft coupler, a shaft coupler is fixedly mounted with a bearing a middle clamp with a long shaft, a screw bolt is mounted at the middle of the outer surface of the bearing a pulley, a carrier clamp plate is mounted at the middle of the inner side of the long shaft, a pulley is fixedly mounted on the shaft clamp, a pulley is mounted at the middle of the shaft clamp, a pulley fixedly mounted on the shaft, a pulley is mounted on the shaft clamp bolt is mounted on the shaft, the outer surface of the bearing b is fixedly connected with the inside of the middle plate, and a servo motor is fixedly installed at the side end of the outer surface of the coupler.
Preferably, the middle part of the upper side of the carrier plate is fixedly mounted with the lower side of the middle plate, the right part of the upper side of the carrier plate is fixedly mounted with a support plate, one side of the support plate is fixedly mounted with one side of the servo motor, the right part of the upper side of the carrier plate is fixedly connected with a hexagonal column, the upper side of the hexagonal column is fixedly connected with a connecting cover, and the left part of the lower side of the connecting cover is fixedly connected with the upper side of the middle plate.
Preferably, the shaft centers of the shaft coupler and the secondary pulley shaft are on the same horizontal plane, the shaft centers of the long shaft coupler and the pulley clamping wheel are on the same horizontal plane, and the outer surface of the right end of the shaft tube is in sliding connection with the inner part of the middle plate.
Preferably, the upper side of the movement control mechanism is fixedly connected with a mold fixing mechanism, the middle part of the side surface of the movement control mechanism is fixedly connected with a front-back movement mechanism, and the side surface of the front-back movement mechanism is fixedly connected with a lifting mechanism.
Preferably, the mobile control mechanism includes a left-right moving mechanism, the left-right moving mechanism includes a mobile station, a long belt is fixedly clamped at the middle of the lower side of the mobile station, a driven pulley a is movably clamped at the inner side of the left end of the long belt, a protection frame a is rotatably connected to the outer side of the driven pulley a, a carrier block is fixedly mounted at the lower side of the protection frame a, a limiting block is fixedly connected to the left end of the upper side of the carrier block, and a long sliding rail is fixedly connected to the upper side of the carrier block.
Preferably, the outer side of the long slide rail is slidably connected with the lower end of the mobile station, the inner side of the right end of the long belt is movably clamped with a driving belt pulley, a driving motor a is fixedly mounted in the middle of the driving belt pulley, the upper side of the driving motor a is fixedly connected with the lower side of the carrier block, and the right part of the upper side of the carrier block is fixedly connected with a supporting block.
Preferably, the upper side of the mobile station is fixedly connected with the lower side of the die fixing mechanism, the lower side of the left-right moving mechanism is fixedly connected with an aluminum alloy frame box, a control box is fixedly mounted on the bottom surface of an inner cavity of the aluminum alloy frame box, and an outer shell is fixedly connected to the outer side of the aluminum alloy frame box.
Preferably, mould fixed establishment includes integrated circuit chip, integrated circuit chip's outside joint has the base plate, the outside fixed joint of base plate has the operation panel, the downside fixedly connected with connecting plate of operation panel, the upside fixedly connected with screens of operation panel presss from both sides, the inboard joint of screens clamp has the apron, the downside of apron and the upside overlap joint of operation panel.
Preferably, back-and-forth movement mechanism includes outer frame, the inboard fixedly connected with diaphragm of outer frame, the right side of diaphragm is fixed with fender bracket c, the inside of diaphragm and the middle part that is located fender bracket c rotate and are connected with driven pulley c, driven pulley c's inboard activity joint has belt c, the inside activity joint of right-hand member of belt c has driving pulley c, driving pulley c's middle part fixed mounting has driving motor c, driving motor c's right side and the left side fixed connection of diaphragm, the right side fixedly connected with fixed rail of diaphragm, the outside slip joint of fixed rail has outer fixture block, belt c's upper strata fixed joint has the belt clamp, the right side fixedly connected with sidewise board of belt clamp, the left side of sidewise board and the right side fixed connection of outer fixture block.
Preferably, elevating system includes belt drive assembly, belt drive assembly with back-and-forth movement mechanism's structure is the same, belt drive assembly's the left side and the right side fixed connection of side direction board, belt drive assembly's right side fixedly connected with lifter plate, the right side fixedly connected with fixed module of lifter plate, fixed module's middle part fixed mounting has the UV to glue the rifle, belt drive assembly's outside fixedly connected with protective housing, the upside fixedly connected with rubber chain belt of protective housing, the other end of rubber chain belt and the upside left part fixed connection of outer frame.
Compared with the prior art, the system has the beneficial effects that:
1. according to the invention, before packaging and dispensing, a double-cylinder cleaning mechanism is arranged, so that the contact surface to be packaged is cleaned, the packaging quality is improved, the servo motor is started to work, the shaft coupler is driven to rotate, one cleaning component is driven to rotate and clean, the gear ring obtains power, the meshed long shaft coupler rotates, meanwhile, the long shaft coupler, the secondary belt wheel shaft and the belt clamping wheel are connected in a winding manner through the flexible belt, the long shaft coupler, the secondary belt wheel shaft and the belt clamping wheel are distributed in a triangular manner, the power of the long shaft coupler is transmitted to the secondary belt wheel shaft, another cleaning component is driven to rotate and clean, in the rotating and cleaning process of the cleaning components, the number of the bristles is large, the structure is slender, dust and impurities near corners are cleaned, the sponge layer cleans the surface, the dust and the impurities are cleaned, the dust and the impurities are removed from the surface of the package, meanwhile, the sponge layer and the bristles are relatively independent, the sponge layer is subjected to elastic deformation of the internal spring deformation, the elastic force acts on the rubber layer, the sponge layer tightly adheres to the cleaning surface, the cleaning effect is better, the bristles are subjected to the elastic deformation of the bending structure of the array spring, the carbon fiber board, the contact frequency of the brush is improved, and the environmental protection effect is improved, and the adhesion of the cleaning effect is further reduced.
2. According to the invention, a forward-backward moving mechanism is arranged, an updated dispensing mode in a packaging process is realized, green and environment-friendly packaging is carried out from two angles of materials and an operation process, a substrate to be packaged is placed in a groove of an operation plate, an integrated circuit chip is placed in the substrate, a cover plate is placed in an area limited by a clamping clamp and the operation plate, a moving control mechanism is controlled to move, a die fixing mechanism is made to move to the lower part of a double-cylinder cleaning mechanism, a contact surface of the cover plate, the integrated circuit chip and the substrate, which needs to be packaged, is cleaned, a UV glue gun is controlled to move to coat UV glue dots at a set position of the substrate, after glue dripping is finished, the upper side of the cover plate is manually clamped into the clamping clamp of a substrate accessory in an overturning manner and is adhered to the upper side of the substrate, the moving control mechanism is controlled to move, the die fixing mechanism is made to move to the lower part of the forward-backward moving mechanism to carry out ultraviolet irradiation on the substrate, solidification is realized, and accordingly, the packaging is avoided by using a traditional hot melt glue and a heating and pressurizing mode, irritation is avoided, energy consumption is reduced, and the green and environment-friendly dispensing is achieved.
3. According to the invention, by arranging the movement control mechanism, the front-back movement mechanism and the lifting mechanism, accurate positioning of the dispensing package is realized, the processes are connected quickly, the dispensing error rate is reduced, and the dispensing quality is improved.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the internal structure of the movement control mechanism of the present invention;
FIG. 3 is a schematic structural diagram of a left-right moving mechanism of the present invention;
FIG. 4 is an exploded view of the mold attachment mechanism of the present invention;
FIG. 5 is an exploded view of the lifting mechanism of the present invention;
FIG. 6 is an exploded view of the forward and backward movement mechanism of the present invention;
FIG. 7 is a schematic perspective view of a dual barrel cleaning mechanism of the present invention;
FIG. 8 is a rear side schematic view of the dual barrel cleaning mechanism of the present invention;
fig. 9 is a sectional view schematically showing the cleaning assembly of the present invention.
In the figure: 1. an ultraviolet lamp;
2. a fixed frame;
3. a movement control mechanism; 31. a housing; 32. a left-right moving mechanism; 321. a driven pulley a; 322. a limiting block; 323. a protection frame a; 324. a long belt; 325. a long slide rail; 326. a mobile station; 327. a drive pulley; 328. driving a motor a; 329. a support block; 3210. pellet block; 33. an aluminum alloy frame box; 34. a control box;
4. a mold fixing mechanism; 41. a cover plate; 42. an integrated circuit chip; 43. a substrate; 44. a clamping clip; 45. an operation panel; 46. a connecting plate;
5. a forward-backward movement mechanism; 51. an outer frame; 52. a transverse plate; 53. a driven pulley c; 54. a protection frame c; 55. a fixed rail; 56. a belt c; 57. a belt clip; 58. an outer clamping block; 59. a drive motor c; 510. a driving pulley c; 511. a lateral plate;
6. a lifting mechanism; 61. a belt drive assembly; 62. a lifting plate; 63. a fixed module; 64. a UV glue gun; 65. a rubber chain belt; 66. a protective shell;
7. a double-cylinder cleaning mechanism; 71. an end cap; 72. a cleaning assembly; 721. brushing; 722. a sponge layer; 723. a rubber layer; 724. a carbon fiber arc plate; 725. arraying the elastic sheets; 726. an inner spring; 727. a shaft ring; 728. a central shaft; 73. a carrier plate; 74. a middle plate; 75. a support plate; 76. a hexagonal column; 77. a connecting cover; 78. a servo motor; 79. a coupling; 710. a gear ring; 711. a bearing a; 712. a long coupler; 713. a secondary pulley shaft; 714. a bearing b; 715. a vertical plate; 716. a ductile band; 717. a belt clamping wheel; 718. an axle tube; 719. a long bolt.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to FIGS. 1-9: a planar array surface-mounted integrated circuit packaging device comprises an ultraviolet lamp 1, wherein a fixed frame 2 is fixedly connected to the side surface of the ultraviolet lamp 1, a mobile control mechanism 3 is fixedly connected to the lower portion of the inner side of the fixed frame 2, and a double-cylinder cleaning mechanism 7 is fixedly connected to the right end of the upper side of the mobile control mechanism 3;
according to the figure 1, the upper side of the mobile control mechanism 3 is fixedly connected with a mold fixing mechanism 4, the middle part of the side surface of the mobile control mechanism 3 is fixedly connected with a front-back moving mechanism 5, and the side surface of the front-back moving mechanism 5 is fixedly connected with a lifting mechanism 6; the movement control mechanism 3 drives the mold fixing mechanism 4 to move so as to perform different flow operations, and the forward and backward moving mechanism 5 and the lifting mechanism 6 move so that the UV glue gun 64 moves on the yz plane to perform quick positioning and dispensing.
According to the figures 7-9, the double-cylinder cleaning mechanism 7 comprises a cleaning component 72, the cleaning component 72 comprises a sponge layer 722, a rubber layer 723 is fixedly connected to the lower side of the sponge layer 722, an inner spring 726 is fixedly connected to the lower side of the rubber layer 723, a shaft ring 727 is fixedly connected to the other end of the inner spring 726, a central shaft 728 is fixedly installed in the middle of the shaft ring 727, four groups of array spring pieces 725 are uniformly and fixedly connected to the outer surface of the shaft ring 727, a carbon fiber arc plate 724 is fixedly connected to the outer side of the array spring pieces 725, bristles 721 are fixedly connected to the outer surface of the carbon fiber arc plate 724, two side faces of the carbon fiber arc plate 724 are lapped with two side faces of the rubber layer 723, a long coupler 712 is fixedly installed at one end of the central shaft 728, an end cap 71 is connected to the other end of the central shaft 728 through a thread, a gear ring 710 is engaged with the middle portion of the outer surface of the long coupler 712, the middle of the gear ring 710 is fixedly provided with a coupler 79, the middle of the outer surface of the coupler 79 is fixedly provided with a bearing a711, the outer surface of the bearing a711 is fixedly connected with a middle plate 74, the other end of the long coupler 712 is movably connected with a flexible belt 716, the inner side of the flexible belt 716 is slidably clamped with a clamping belt wheel 717, the middle of the clamping belt wheel 717 is fixedly provided with an axle tube 718, the middle of the axle tube 718 is in threaded connection with a long bolt 719, the outer surface side end of the long bolt 719 is in threaded connection with a vertical plate 715, the lower side of the vertical plate 715 is fixedly provided with a carrier plate 73, the inner side of the flexible belt 716 is slidably clamped with a secondary belt axle 713, the middle of the outer surface of the secondary belt axle 713 is fixedly provided with a bearing b714, the outer surface of the bearing b714 is fixedly connected with the inside of the middle plate 74, and the outer surface side end of the coupler 79 is fixedly provided with a servo motor 78;
before encapsulation dispensing, the servo motor 78 is started to work, the coupler 79 is driven to rotate, one cleaning component 72 is driven to rotate and clean, the gear ring 710 obtains power, the meshed long coupler 712 rotates, meanwhile, the long coupler 712, the secondary belt wheel shaft 713 and the clamping belt wheel 717 are connected in a surrounding mode through the flexible belt 716, the long coupler 712, the secondary belt wheel shaft 713 and the clamping belt wheel 717 are distributed in a triangular mode, the power of the long coupler 712 is transmitted to the secondary belt wheel shaft 713, the other cleaning component 72 is driven to rotate and clean, in the rotating and cleaning process of the cleaning component 72, the number of the bristles 721 is large, the structure is slender, dust and impurities near corners are cleaned, the sponge layer 722 wipes the surface, the dust and the impurities are cleaned from the surface of encapsulation, meanwhile, the sponge layer 722 and the bristles 721 are independent, the sponge layer 722 is deformed by the inner spring 726 to generate an elastic force effect, the elastic force acts on the rubber layer 723, the sponge layer 722 is tightly attached to the wiping surface, the wiping effect is better, the bristles are deformed by the elastic force of the array elastic sheet 725, the bending structure of the array 725 can generate the elastic force, the elastic sheet can generate a certain elastic force, the carbon fiber arc plate can generate a certain frequency of the encapsulation brush, the frequency of the encapsulation brush is reduced, the environment-friendly cleaning effect is improved, and the environmental protection adhesive cleaning effect is improved, and the range of the encapsulation cleaning effect is improved.
According to fig. 7, the middle part of the upper side of the carrier plate 73 is fixedly installed with the lower side of the middle plate 74, the right part of the upper side of the carrier plate 73 is fixedly installed with a support plate 75, one side of the support plate 75 is fixedly installed with one side of the servo motor 78, the right part of the upper side of the carrier plate 73 is fixedly connected with a hexagonal column 76, the upper side of the hexagonal column 76 is fixedly connected with a connecting cover 77, and the left part of the lower side of the connecting cover 77 is fixedly connected with the upper side of the middle plate 74; the carrier plate 73, the middle plate 74, the support plate 75, the hexagonal post 76 and the connecting cover 77 form a basic frame to provide carrier support for subsequent driving, and simultaneously, the cleaning assembly 72 is stably rotated to complete the cleaning work of the packaging surface.
According to fig. 8, the axle centers of the coupling 79 and the secondary pulley shaft 713 are on the same horizontal plane, the axle centers of the long coupling 712 and the belt clamping wheel 717 are on the same horizontal plane, and the outer surface of the right end of the shaft tube 718 is slidably connected inside the middle plate 74; the two cleaning assemblies 72 can rotate and clean in the same horizontal plane, and the shaft tube 718 can slide in the middle plate 74 under the adjustment of the long bolt 719, so that the shape of a triangle formed by the three is changed, the rotating speed of the two cleaning assemblies 72 can be controlled, and the cleaning effect can be adjusted according to actual conditions.
As shown in fig. 3, the movement control mechanism 3 includes a left-right movement mechanism 32, the left-right movement mechanism 32 includes a moving platform 326, a long belt 324 is fixedly clamped in the middle of the lower side of the moving platform 326, a driven pulley a321 is movably clamped in the inner side of the left end of the long belt 324, a protection frame a323 is rotatably connected to the outer side of the driven pulley a321, a carrier block 3210 is fixedly installed on the lower side of the protection frame a323, a limit block 322 is fixedly connected to the left end of the upper side of the carrier block 3210, and a long slide rail 325 is fixedly connected to the upper side of the carrier block 3210; the moving stage 326 is fixed to the long belt 324 on one side, and the forward and reverse rotation of the driving motor a328 moves the moving stage 326 to the left and right on the long slide rail 325, thereby controlling the movement of the mold fixing mechanism 4.
As shown in fig. 3, the outer side of the long slide rail 325 is slidably connected to the lower end of the moving platform 326, the inner side of the right end of the long belt 324 is movably clamped with a driving pulley 327, a driving motor a328 is fixedly installed in the middle of the driving pulley 327, the upper side of the driving motor a328 is fixedly connected to the lower side of the carrier block 3210, and the right side of the upper side of the carrier block 3210 is fixedly connected to a supporting block 329; the driving motor a328 is activated to rotate the driving pulley 327, and power is transmitted to the driven pulley a321 through the long belt 324, thereby forming a continuous movement.
As shown in fig. 2, the upper side of the mobile station 326 is fixedly connected with the lower side of the mold fixing mechanism 4, the lower side of the left-right moving mechanism 32 is fixedly connected with an aluminum alloy frame box 33, the bottom surface of the inner cavity of the aluminum alloy frame box 33 is fixedly provided with a control box 34, and the outer side of the aluminum alloy frame box 33 is fixedly connected with a shell 31; the outer shell 31 and the left-right moving mechanism 32 form a closed protection structure, and support is provided for the movement of the left-right moving mechanism 32.
As shown in fig. 4, the mold fixing mechanism 4 includes an integrated circuit chip 42, a substrate 43 is clamped on the outer side of the integrated circuit chip 42, an operation plate 45 is fixedly clamped on the outer side of the substrate 43, a connecting plate 46 is fixedly connected to the lower side of the operation plate 45, a clamping clamp 44 is fixedly connected to the upper side of the operation plate 45, a cover plate 41 is clamped on the inner side of the clamping clamp 44, and the lower side of the cover plate 41 is overlapped with the upper side of the operation plate 45; when packaging is performed, a substrate 43 to be packaged is placed in a groove of an operation plate 45, an integrated circuit chip 42 is placed in the substrate 43, a cover plate 41 is placed in an area limited by a clamping clamp 44 and the operation plate 45, the movement control mechanism 3 is controlled to move, the die fixing mechanism 4 is moved to the lower side of the double-cylinder cleaning mechanism 7, a contact surface required for packaging of the cover plate 41, the integrated circuit chip 42 and the substrate 43 is cleaned, then a UV glue gun 64 is controlled to move, UV glue is dispensed at a set position of the substrate 43, and after glue dispensing is finished, the upper side surface of the cover plate 41 is manually clamped into the clamping clamp 44 near the substrate 43 in an overturning mode to be adhered to the upper side surface of the substrate 43.
According to fig. 6, the front-back moving mechanism 5 comprises an outer frame 51, a transverse plate 52 is fixedly connected to the inner side of the outer frame 51, a protection frame c54 is fixed to the right side of the transverse plate 52, a driven pulley c53 is rotatably connected to the middle of the protection frame c54 inside the transverse plate 52, a belt c56 is movably clamped to the inner side of the driven pulley c53, a driving pulley c510 is movably clamped to the inner side of the right end of the belt c56, a driving motor c59 is fixedly installed at the middle of the driving pulley c510, the right side of the driving motor c59 is fixedly connected to the left side of the transverse plate 52, a fixed rail 55 is fixedly connected to the right side of the transverse plate 52, an outer clamping block 58 is slidably clamped to the outer side of the fixed rail 55, a belt clamp 57 is fixedly clamped to the upper layer of the belt c56, a lateral plate 511 is fixedly connected to the right side of the belt clamp 57, and the left side of the lateral plate 511 is fixedly connected to the right side of the outer clamping block 58; the driving motor c59 is started to work to drive the driving pulley c510 to rotate, power is transmitted in a belt system formed by the belt c56 and the driven pulley c53, the belt c56 drives the belt clamp 57 to move, and therefore the lateral plate 511 drives the belt transmission assembly 61 to move laterally under the limit of the outer clamping block 58.
As shown in fig. 5, the lifting mechanism 6 includes a belt transmission assembly 61, the belt transmission assembly 61 has the same structure as the front-back moving mechanism 5, the left side of the belt transmission assembly 61 is fixedly connected with the right side of the lateral plate 511, the right side of the belt transmission assembly 61 is fixedly connected with a lifting plate 62, the right side of the lifting plate 62 is fixedly connected with a fixing module 63, the middle part of the fixing module 63 is fixedly provided with a UV glue gun 64, the outer side of the belt transmission assembly 61 is fixedly connected with a protective shell 66, the upper side of the protective shell 66 is fixedly connected with a rubber chain belt 65, and the other end of the rubber chain belt 65 is fixedly connected with the upper left part of the outer frame 51; the structure of belt drive assembly 61 is the same with back-and-forth movement mechanism 5's structure, and the direction is the vertical relation, and belt drive assembly 61 lateral shifting's in-process drives lifter plate 62 oscilaltion, and fixed module 63 drives UV and glues rifle 64 and reciprocate, combines the side of belt drive assembly 61 to remove, and UV glues rifle 64 and removes on the yz plane, combines movement control mechanism 3, accomplishes the quick location of spatial position to improve the speed and the quality of gluing the encapsulation.
The use method and the working principle of the device are as follows: placing a substrate 43 to be packaged in a groove of an operating plate 45, placing an integrated circuit chip 42 in the substrate 43, placing a cover plate 41 in an area defined by a clamping clamp 44 and the operating plate 45, controlling a movement control mechanism 3 to move, moving a mold fixing mechanism 4 to the position below a double-cylinder cleaning mechanism 7, starting a servo motor 78 to operate, driving a coupler 79 to rotate, driving a cleaning component 72 to rotate for cleaning, obtaining power from a gear ring 710, rotating an engaged long coupler 712, meanwhile, the long coupler 712, a secondary belt wheel shaft 713 and a clamping belt wheel 717 are connected in a surrounding manner through a flexible belt 716, the three components are distributed in a triangular manner, the power of the long coupler 712 is transmitted to the secondary belt wheel shaft 713, thereby driving another cleaning component 72 to rotate for cleaning, in the rotating and cleaning process of the cleaning component 72, the number of bristles 721 is large, the structure is long, dust and impurities near some corners are cleaned, the sponge layer 722 wipes the surface to remove dust and impurities from the surface of the package, meanwhile, the sponge layer 722 and the bristles 721 are relatively independent, the sponge layer 722 is deformed by the inner spring 726 to generate elastic force, the elastic force acts on the rubber layer 723 to enable the sponge layer 722 to be tightly attached to the wiping surface, the wiping effect is better, the bristles 721 are deformed by the array spring sheet 725, the structure of the array spring sheet 725 and the elastic force generated by the array spring sheet enable the carbon fiber arc plate 724 to generate certain vibration, the frequency and the range of the brushing of the bristles 721 are improved, the cleaning effect is better, the driving motor a328 is started to enable the driving pulley 327 to rotate, the power is transmitted to the driven pulley a321 through the long belt 324, continuous movement is formed, the mobile platform 326 is fixed on the long belt 324 on one side, the forward and reverse rotation of the driving motor a328 drives the mobile platform 326 to move left and right on the long slide rail 325, the movement of the mold fixing mechanism 4 is controlled, the process is connected quickly, the driving motor c59 is started to work, the driving belt pulley c510 is driven to rotate, power is transmitted in a belt system formed by the belt c56 and the driven belt pulley c53, the belt c56 drives the belt clamp 57 to move, the lateral plate 511 drives the belt transmission assembly 61 to move laterally under the limit of the outer clamping block 58, the structure of the belt transmission assembly 61 is the same as that of the front-back moving mechanism 5, the direction of the belt transmission assembly 61 is vertical, the lifting plate 62 is driven to lift up and down in the lateral moving process of the belt transmission assembly 61, the fixing module 63 drives the UV glue gun 64 to move up and down, the UV glue gun 64 moves on the yz plane in combination with the lateral movement of the belt transmission assembly 61, the quick positioning and glue dispensing of the spatial position are completed by combining with the movement control mechanism 3, after the glue dripping is completed, the upper side of the cover plate 41 is manually clamped and connected into the clamping clamp 44 of the accessory of the substrate 43 in a turnover mode and is bonded with the upper side of the substrate 43, the movement control mechanism 3 is controlled, the movement of the mold fixing mechanism 4 is moved to move below the front-back moving mechanism 5, the mold fixing mechanism 4 is irradiated by ultraviolet rays, and cured.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (9)
1. The utility model provides a SMD integrated circuit packaging equipment of planar array, includes ultraviolet lamp (1), its characterized in that: a fixed frame (2) is fixedly connected to the side surface of the ultraviolet lamp (1), a movement control mechanism (3) is fixedly connected to the lower portion of the inner side of the fixed frame (2), and a double-barrel cleaning mechanism (7) is fixedly connected to the right end of the upper side of the movement control mechanism (3);
the upper side of the movement control mechanism (3) is fixedly connected with a mold fixing mechanism (4), the middle part of the side surface of the movement control mechanism (3) is fixedly connected with a front-back movement mechanism (5), and the side surface of the front-back movement mechanism (5) is fixedly connected with a lifting mechanism (6);
the double-barrel cleaning mechanism (7) comprises a cleaning component (72), the cleaning component (72) comprises a sponge layer (722), a rubber layer (723) is fixedly connected to the lower side of the sponge layer (722), an inner spring (726) is fixedly connected to the lower side of the rubber layer (723), a shaft ring (727) is fixedly connected to the other end of the inner spring (726), a central shaft (728) is fixedly installed in the middle of the shaft ring (727), four array spring pieces (725) are uniformly and fixedly connected to the outer surface of the shaft ring (727), a carbon fiber arc plate (724) is fixedly connected to the outer side of the array spring piece (725), bristles (721) are fixedly connected to the outer surface of the carbon fiber arc plate (724), two side faces of the carbon fiber arc plate (724) are lapped with two side faces of the rubber layer (723), a long coupler (712) is fixedly installed at one end of the central shaft (728), an end cover (71) is connected to the other end of the central shaft (728) in a threaded manner, a gear ring (710) is fixedly connected to the outer surface of the gear ring (710), a coupler (79 a) is fixedly installed at the middle of the gear ring (711), and a middle plate (711) is connected to a middle bearing (711) which is connected with a middle plate (711) and a middle plate (711) which is connected with a middle plate (711), the inboard slip joint of toughness area (716) has draw pulley (717), the middle part fixed mounting of draw pulley (717) has central siphon (718), the middle part threaded connection of central siphon (718) has long bolt (719), the surface side end threaded connection of long bolt (719) has riser (715), the downside fixed mounting of riser (715) has carrier plate (73), the inboard slip joint of toughness area (716) has sub-band shaft (713), the surface middle part fixed mounting of sub-band shaft (713) has bearing b (714), the inside fixed connection of the surface of bearing b (714) and medium plate (74), the surface side fixed mounting of shaft coupling (79) has servo motor (78).
2. The planar array surface mounted integrated circuit package device according to claim 1, wherein: carrier plate (73) upside middle part and the downside fixed mounting of medium plate (74), the upside right part fixed mounting of carrier plate (73) has backup pad (75), one side of backup pad (75) and one side fixed mounting of servo motor (78), the upside right part fixedly connected with hexagonal column (76) of carrier plate (73), the upside fixedly connected with of hexagonal column (76) connects lid (77), the downside left part of connecting lid (77) and the upside fixed connection of medium plate (74).
3. The planar array surface mounted integrated circuit package device according to claim 1, wherein: the shaft centers of the coupler (79) and the secondary belt wheel shaft (713) are on the same horizontal plane, the shaft centers of the long coupler (712) and the belt clamping wheel (717) are on the same horizontal plane, and the outer surface of the right end of the shaft tube (718) is connected with the inner portion of the middle plate (74) in a sliding mode.
4. The planar array surface mounted integrated circuit package device according to claim 1, wherein: the movable control mechanism (3) comprises a left-right moving mechanism (32), the left-right moving mechanism (32) comprises a moving platform (326), a long belt (324) is fixedly clamped in the middle of the lower side of the moving platform (326), a driven pulley a (321) is movably clamped in the inner side of the left end of the long belt (324), a protection frame a (323) is rotatably connected to the outer side of the driven pulley a (321), a carrier block (3210) is fixedly mounted on the lower side of the protection frame a (323), a limiting block (322) is fixedly connected to the left end of the upper side of the carrier block (3210), and a long sliding rail (325) is fixedly connected to the upper side of the carrier block (3210).
5. The land array mounted integrated circuit package device of claim 4, wherein: the outer side of the long sliding rail (325) is connected with the lower end of a mobile station (326) in a sliding mode, the inner side of the right end of the long belt (324) is movably connected with a driving belt pulley (327) in a clamping mode, the middle of the driving belt pulley (327) is fixedly provided with a driving motor a (328), the upper side of the driving motor a (328) is fixedly connected with the lower side of a carrier block (3210), and the right side of the upper side of the carrier block (3210) is fixedly connected with a supporting block (329).
6. The land array mounted integrated circuit package device of claim 4, wherein: the upside of mobile station (326) and the downside fixed connection of mould fixed establishment (4), the downside fixedly connected with aluminum alloy frame case (33) of moving mechanism (32) about, the inner chamber bottom surface fixed mounting of aluminum alloy frame case (33) has control box (34), the outside fixedly connected with shell (31) of aluminum alloy frame case (33).
7. The planar array surface mounted integrated circuit package device according to claim 1, wherein: mould fixed establishment (4) include integrated circuit chip (42), the outside joint of integrated circuit chip (42) has base plate (43), the outside fixed joint of base plate (43) has operation panel (45), downside fixedly connected with connecting plate (46) of operation panel (45), upside fixedly connected with screens of operation panel (45) presss from both sides (44), the inboard joint of screens clamp (44) has apron (41), the upside overlap joint of the downside of apron (41) and operation panel (45).
8. The planar array surface mounted integrated circuit package device according to claim 1, wherein: the front and back movement mechanism (5) comprises an outer frame (51), the inboard fixedly connected with diaphragm (52) of outer frame (51), the right side of diaphragm (52) is fixed with fender bracket c (54), the inside of diaphragm (52) just is located the middle part of fender bracket c (54) and rotates and is connected with driven pulley c (53), the inboard activity joint of driven pulley c (53) has belt c (56), the inside activity joint of right-hand member of belt c (56) has drive pulley c (510), the middle part fixed mounting of drive pulley c (510) has driving motor c (59), the right side of driving motor c (59) and the left side fixed connection of diaphragm (52), the right side fixedly connected with fixed rail (55) of diaphragm (52), the outside slip joint of fixed rail (55) has outer fixture block (58), the upper strata fixed joint of belt c (56) has belt clamp (57), the right side fixedly connected with side direction board (511) of belt clamp (57), the left side of side direction board (511) and the right side fixed connection of outer fixture block (58).
9. The planar array surface mount integrated circuit package device of claim 1, wherein: elevating system (6) include belt drive assembly (61), belt drive assembly (61) with the structure of back-and-forth movement mechanism (5) is the same, the left side of belt drive assembly (61) and the right side fixed connection of side direction board (511), right side fixedly connected with lifter plate (62) of belt drive assembly (61), the right side fixedly connected with fixed module (63) of lifter plate (62), the middle part fixed mounting of fixed module (63) has UV to glue rifle (64), the outside fixedly connected with protective housing (66) of belt drive assembly (61), the upside fixedly connected with rubber chain belt (65) of protective housing (66), the other end of rubber chain belt (65) and the upside left part fixed connection of outer frame (51).
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| CN202211219382.8A CN115283203B (en) | 2022-10-08 | 2022-10-08 | Surface-mounted integrated circuit packaging equipment for planar array |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983086A (en) * | 2012-12-14 | 2013-03-20 | 大连泰一精密模具有限公司 | Planar array paster-type low-energy-consumption environment-friendly high-precision packaging mould for integrated circuit |
| CN112871775A (en) * | 2021-01-12 | 2021-06-01 | 白钰涛 | Automatic cleaning device of hospital's stair railing |
| CN113237240A (en) * | 2021-05-13 | 2021-08-10 | 周茂山 | Automatic cleaning device for water storage tank of solar water heater |
| CN216174496U (en) * | 2021-09-30 | 2022-04-05 | 湖北睿臣装备技术有限公司 | Machine tool part oil stain wiping equipment for numerical control machine tool maintenance |
| CN114602841A (en) * | 2022-03-23 | 2022-06-10 | 深圳市海星电子有限公司 | Cleaning and maintaining device for integrated computer hardware |
| CN114749397A (en) * | 2022-06-14 | 2022-07-15 | 江苏和睿半导体科技有限公司 | Pretreatment equipment for semiconductor packaging and use method |
-
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- 2022-10-08 CN CN202211219382.8A patent/CN115283203B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983086A (en) * | 2012-12-14 | 2013-03-20 | 大连泰一精密模具有限公司 | Planar array paster-type low-energy-consumption environment-friendly high-precision packaging mould for integrated circuit |
| CN112871775A (en) * | 2021-01-12 | 2021-06-01 | 白钰涛 | Automatic cleaning device of hospital's stair railing |
| CN113237240A (en) * | 2021-05-13 | 2021-08-10 | 周茂山 | Automatic cleaning device for water storage tank of solar water heater |
| CN216174496U (en) * | 2021-09-30 | 2022-04-05 | 湖北睿臣装备技术有限公司 | Machine tool part oil stain wiping equipment for numerical control machine tool maintenance |
| CN114602841A (en) * | 2022-03-23 | 2022-06-10 | 深圳市海星电子有限公司 | Cleaning and maintaining device for integrated computer hardware |
| CN114749397A (en) * | 2022-06-14 | 2022-07-15 | 江苏和睿半导体科技有限公司 | Pretreatment equipment for semiconductor packaging and use method |
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