CN115232573B - High-temperature separable conductive adhesive and solar cell module - Google Patents
High-temperature separable conductive adhesive and solar cell module Download PDFInfo
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- CN115232573B CN115232573B CN202110441563.4A CN202110441563A CN115232573B CN 115232573 B CN115232573 B CN 115232573B CN 202110441563 A CN202110441563 A CN 202110441563A CN 115232573 B CN115232573 B CN 115232573B
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- conductive adhesive
- solar cell
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- adhesive
- acrylate
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- 239000000853 adhesive Substances 0.000 title claims abstract description 154
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 154
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 59
- 239000000203 mixture Substances 0.000 claims description 35
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 23
- 229920000570 polyether Polymers 0.000 claims description 23
- 229910019142 PO4 Inorganic materials 0.000 claims description 22
- 239000010452 phosphate Substances 0.000 claims description 22
- -1 (meth)acrylic acid alkoxyalkyl ester Chemical class 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 21
- 239000000178 monomer Substances 0.000 claims description 18
- 239000004814 polyurethane Substances 0.000 claims description 15
- 229920002635 polyurethane Polymers 0.000 claims description 15
- 235000012431 wafers Nutrition 0.000 claims description 14
- 125000002723 alicyclic group Chemical group 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000003999 initiator Substances 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 12
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 10
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- 150000003077 polyols Chemical class 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920005862 polyol Polymers 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000001976 improved effect Effects 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 150000003014 phosphoric acid esters Chemical class 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical compound CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- KQNZLOUWXSAZGD-UHFFFAOYSA-N benzylperoxymethylbenzene Chemical compound C=1C=CC=CC=1COOCC1=CC=CC=C1 KQNZLOUWXSAZGD-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000000937 dynamic scanning calorimetry Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical group 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- CLHPBURJMZXHFZ-UHFFFAOYSA-N (1,2,2-trimethylcyclohexyl) prop-2-enoate Chemical compound CC1(C)CCCCC1(C)OC(=O)C=C CLHPBURJMZXHFZ-UHFFFAOYSA-N 0.000 description 1
- LBHPSYROQDMVBS-UHFFFAOYSA-N (1-methylcyclohexyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(C)CCCCC1 LBHPSYROQDMVBS-UHFFFAOYSA-N 0.000 description 1
- CJCGDEYGAIPAEN-UHFFFAOYSA-N (1-methylcyclohexyl) prop-2-enoate Chemical compound C=CC(=O)OC1(C)CCCCC1 CJCGDEYGAIPAEN-UHFFFAOYSA-N 0.000 description 1
- 125000000229 (C1-C4)alkoxy group Chemical group 0.000 description 1
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- MAIJBENIIAUBBA-UHFFFAOYSA-N 1,1-diethoxyethyl prop-2-enoate Chemical compound CCOC(C)(OCC)OC(=O)C=C MAIJBENIIAUBBA-UHFFFAOYSA-N 0.000 description 1
- NDZOISQLWLWLEW-UHFFFAOYSA-N 1,2,3,4,4a,5,6,7,8,8a-decahydronaphthalen-1-ol Chemical compound C1CCCC2C(O)CCCC21 NDZOISQLWLWLEW-UHFFFAOYSA-N 0.000 description 1
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 1
- CQKJPUBLQQERIA-UHFFFAOYSA-N 1,6-diisocyanatohexane;2-(phenoxymethyl)oxirane;prop-2-enoic acid Chemical compound OC(=O)C=C.C1OC1COC1=CC=CC=C1.O=C=NCCCCCCN=C=O CQKJPUBLQQERIA-UHFFFAOYSA-N 0.000 description 1
- QDNXDIXAHFUZCV-UHFFFAOYSA-N 2,2-diethoxyethyl prop-2-enoate Chemical compound CCOC(OCC)COC(=O)C=C QDNXDIXAHFUZCV-UHFFFAOYSA-N 0.000 description 1
- VOFRZBBLONRUHY-KVVVOXFISA-N 2-(2-hydroxyethylamino)ethanol;2-[2-[2-[(z)-octadec-9-enoxy]ethoxy]ethoxy]ethyl dihydrogen phosphate Chemical compound OCCNCCO.CCCCCCCC\C=C/CCCCCCCCOCCOCCOCCOP(O)(O)=O VOFRZBBLONRUHY-KVVVOXFISA-N 0.000 description 1
- DKELNUBFYRNPMB-UHFFFAOYSA-N 2-decoxyethanol;phosphoric acid Chemical compound OP(O)(O)=O.CCCCCCCCCCOCCO DKELNUBFYRNPMB-UHFFFAOYSA-N 0.000 description 1
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 229920002884 Laureth 4 Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- GNULGOSSPWDTMD-UHFFFAOYSA-N NC(=O)OCC.C(CCCCCN=C=O)N=C=O.C(C=C)(=O)OCC(COC(C=C)=O)(COC(C=C)=O)CO Chemical compound NC(=O)OCC.C(CCCCCN=C=O)N=C=O.C(C=C)(=O)OCC(COC(C=C)=O)(COC(C=C)=O)CO GNULGOSSPWDTMD-UHFFFAOYSA-N 0.000 description 1
- RHPYPRAKWTXDFS-UHFFFAOYSA-N OC(=O)C=C.CCOC(N)=O.C1OC1COC1=CC=CC=C1.CC1=CC=C(N=C=O)C=C1N=C=O Chemical compound OC(=O)C=C.CCOC(N)=O.C1OC1COC1=CC=CC=C1.CC1=CC=C(N=C=O)C=C1N=C=O RHPYPRAKWTXDFS-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229940081733 cetearyl alcohol Drugs 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- RJLZSKYNYLYCNY-UHFFFAOYSA-N ethyl carbamate;isocyanic acid Chemical compound N=C=O.CCOC(N)=O RJLZSKYNYLYCNY-UHFFFAOYSA-N 0.000 description 1
- RBVLUTAXWVILBT-UHFFFAOYSA-N ethyl prop-2-eneperoxoate Chemical compound CCOOC(=O)C=C RBVLUTAXWVILBT-UHFFFAOYSA-N 0.000 description 1
- SFNALCNOMXIBKG-UHFFFAOYSA-N ethylene glycol monododecyl ether Chemical compound CCCCCCCCCCCCOCCO SFNALCNOMXIBKG-UHFFFAOYSA-N 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- ZUVCYFMOHFTGDM-UHFFFAOYSA-N hexadecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCOP(O)(O)=O ZUVCYFMOHFTGDM-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229940061515 laureth-4 Drugs 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- RMGVATURDVPNOZ-UHFFFAOYSA-M potassium;hexadecyl hydrogen phosphate Chemical compound [K+].CCCCCCCCCCCCCCCCOP(O)([O-])=O RMGVATURDVPNOZ-UHFFFAOYSA-M 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
- H10F19/906—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the materials of the structures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明涉及高温可分离的导电性粘接剂及太阳能电池模块，本发明提供再施工性优异的新型导电性粘接剂及利用其的太阳能电池模块，上述导电性粘接剂在太阳能电池模块中，特别是由于模块的各单元的分接线和电极的粘接而各单个单元的排列错误时，容易去除错误部分的粘接剂而能够进行再施工(REWORK)或者可以替换损坏的电池单元。
The present invention relates to a high-temperature separable conductive adhesive and a solar cell module. The present invention provides a novel conductive adhesive excellent in reworkability and a solar cell module utilizing the same. The conductive adhesive is used in a solar cell module. , especially when the individual units are arranged incorrectly due to the bonding of the tap lines and electrodes of each unit of the module, it is easy to remove the adhesive in the wrong part and allow rework (REWORK) or replace the damaged battery unit.
Description
技术领域Technical field
本发明涉及具有高温分离性(detachability，)而能够再施工的导电性粘接剂(conductive adhesive)及将其用于太阳能电池单元的电极与分接线/>的连接的太阳能电池模块。The present invention relates to high-temperature detachability (detachability, ) and can be re-applied (conductive adhesive) and its use in electrodes and tap wires of solar cell units/> of connected solar modules.
背景技术Background technique
在太阳能电池中，在制作太阳能电池时，在各太阳能电池单元的电极与分接线的连接中使用通过热而能够固化的导电性粘接剂(conductive adhesive)。In solar cells, when manufacturing the solar cells, a conductive adhesive that can be cured by heat is used to connect the electrodes of each solar cell unit to the tap wires.
通常，分接线通过将其一端与一个太阳能电池单元的表面电极连接，另一端与相邻的另一太阳能电池单元的背面电极连接，从而起到将各太阳能电池单元串联连接的作用。将上述电极与分接线连接时所使用的导电性粘接剂通常使用固化性导电性粘接剂，但是在施工后固化的情况下不能重复使用。Usually, one end of the tap line is connected to the surface electrode of one solar cell unit, and the other end is connected to the back electrode of another adjacent solar cell unit, thereby connecting the solar cell units in series. The conductive adhesive used when connecting the above-mentioned electrodes and the tap line is usually a curable conductive adhesive, but it cannot be reused if it is cured after construction.
因此，在制作太阳能电池模块时，在利用上述固化性导电性粘接剂连接的部分排列错误的情况下，则成为外观差且模块的效率降低的原因。此外，这些粘接使用固化性导电性粘接剂，因此，首先去除粘接是困难的，因而具有废弃太阳能电池模块本身或者以有缺陷的状态出售的问题。Therefore, when the parts connected by the curable conductive adhesive are arranged incorrectly when manufacturing the solar cell module, this may cause a poor appearance and reduce the efficiency of the module. In addition, since a curable conductive adhesive is used for these bondings, it is difficult to remove the bonding first. Therefore, there is a problem that the solar cell module itself is discarded or sold in a defective state.
另外，以瓦(Shingle)状制造时，要层叠数十张后确认输出，这时由于电池单元故障而发生细小裂纹或者层叠后单元间距不匹配时，制作的STRING(将电池单元15～21张制造成瓦状的中间体)或者模块需要废弃，但如果去除粘接剂后可以更换所需部分的电池单元，即，能够再施工的情况下，能够进行STRING、模块的部分修改，因此可以大幅减少损失费用。In addition, when manufacturing in the shape of a shingle, it is necessary to stack dozens of sheets to check the output. If fine cracks occur due to battery cell failure or the cell spacing does not match after stacking, the produced STRING (15 to 21 battery cells) Intermediate (made into a tile-like shape) or module needs to be discarded, but if the required part of the battery unit can be replaced after removing the adhesive, that is, if it can be re-constructed, partial modification of the STRING and module can be carried out, so it can be greatly improved. Reduce loss expenses.
发明内容Contents of the invention
本发明提供再施工性优异的新型导电性粘接剂及利用其的太阳能电池模块，上述导电性粘接剂在如上所述用导电性粘接剂粘接的太阳能电池模块的情况下，特别是由于模块的各单元的分接线和电极的粘接而各单元的排列错误时，容易去除错误部分的粘接剂而能够再施工(REWORK)或者可以替换损坏的太阳能电池的单元。The present invention provides a novel conductive adhesive excellent in reworkability and a solar cell module using the same. The conductive adhesive is particularly suitable for solar cell modules bonded with the conductive adhesive as described above. If the modules are arranged incorrectly due to the bonding of tap wires and electrodes of each unit of the module, it is easy to remove the adhesive in the wrong part and rework (REWORK) or replace the damaged solar cell unit.
即，本发明提供如下的粘接剂，该粘接剂将电极和分接线用固化型粘接剂连接时，即使排列不良地连接，并且粘接剂固化而连接，向固化的粘接剂加热时，分离性增加，从而可以容易地去除粘接剂。因此，本发明提供具有再施工(rework)特性的新型导电性粘接剂及利用其的太阳能电池模块，上述导电性粘接剂由于在排列错误的情况下也能够容易地去除粘接剂，因而可以对不良或有问题的部分进行再施工。That is, the present invention provides an adhesive that, when connecting an electrode and a tap line with a curable adhesive, even if the electrodes and tap lines are connected with poor alignment and the adhesive is cured to connect, heat is applied to the cured adhesive. When used, the separability increases so that the adhesive can be easily removed. Therefore, the present invention provides a novel conductive adhesive with rework characteristics and a solar cell module using the same. The conductive adhesive can be easily removed even if the arrangement is incorrect. Defect or problematic parts can be reworked.
本发明的粘接剂在固化而粘接后，在太阳能电池的使用温度下赋予强的粘接性，但只要加热则会显示容易去除粘接剂的分离性，因此提供能够再施工即具有再施工特性的新型粘接剂。此外，提供在加热而分离有缺陷的电池单元时不破坏粘接剂且在电池单元与粘接剂的界面或者电池单元与分接线的界面发生分离的新型粘接剂。本发明提供在150℃以上、优选在200℃以上、更优选在250℃下在3分钟内显示分离性的粘接剂，提供在太阳能电池工作的温度范围内没有分离性而牢固地粘接，但需要部分替换时通过加热增加分离性而能够进行再施工的具有新型功能的太阳能电池用粘接剂。After curing and bonding, the adhesive of the present invention imparts strong adhesiveness at the operating temperature of the solar cell, but exhibits detachability that makes it easy to remove the adhesive when heated. New adhesive with construction properties. In addition, a novel adhesive is provided that does not destroy the adhesive when a defective battery cell is separated by heating and causes separation at the interface between the battery cell and the adhesive or at the interface between the battery cell and the tap line. The present invention provides an adhesive that exhibits detachability within 3 minutes at temperatures above 150°C, preferably above 200°C, and more preferably at 250°C, and provides strong bonding without detachability within the operating temperature range of solar cells. However, when partial replacement is required, it is an adhesive for solar cells with new functions that can be re-applied by increasing the separability through heating.
另外，作为本发明的一个例子，提供再施工性优异的导电性粘接剂及利用其的太阳能电池模块，上述导电性粘接剂在250℃下在3分钟内增加粘接剂的分离性而容易去除，从而能够进行再施工或者可以重新调整排列而及时修改位置。In addition, as an example of the present invention, there is provided a conductive adhesive excellent in reworkability, which increases the separability of the adhesive within 3 minutes at 250° C., and a solar cell module using the same. It is easy to remove, so that it can be re-constructed or the arrangement can be rearranged and the position can be modified in time.
本发明提供太阳能电池用粘接剂及利用其的太阳能电池模块，已知通常太阳能电池模块在夏天升高至60至90℃左右，在使用根据本发明的导电性粘接剂的情况下，正常使用时完全不会产生分离性，会牢固地粘接，因此在太阳能电池的通常的使用中，在粘接性方面完全不会发生问题。The present invention provides an adhesive for solar cells and a solar cell module using the same. It is known that solar cell modules usually rise to about 60 to 90°C in summer. When the conductive adhesive according to the present invention is used, normal There is absolutely no separation during use and it is firmly adhered, so there will be no problem with adhesion during normal use of solar cells.
为了解决上述课题，本发明提供一种能够再施工(reworkable)的导电性粘接剂，是连接一个太阳能电池单元的表面电极和与上述一个太阳能电池单元相邻的另一个太阳能电池单元的背面电极的能够再施工(reworkable)的导电性粘接剂，上述导电性粘接剂具有在250℃下在3分钟内脱附的再施工(reworkable)特性。In order to solve the above problems, the present invention provides a reworkable conductive adhesive for connecting the surface electrode of one solar cell unit and the back electrode of another solar cell unit adjacent to the one solar cell unit. A reworkable conductive adhesive, which has a reworkable property of desorbing within 3 minutes at 250°C.
另外，上述能够再施工的导电性粘接剂的与初始焊带的粘接强度可以为≥1.0N。In addition, the bonding strength of the above-mentioned re-applicable conductive adhesive to the initial solder tape may be ≥1.0N.
另外，本发明的能够再施工的导电性粘接剂的晶片间的粘接强度可以为10kgf以上。In addition, the bonding strength between wafers of the re-applicable conductive adhesive of the present invention can be 10 kgf or more.
另外，本发明的能够再施工的导电性粘接剂的凝胶时间在90℃可以为25秒(sec)以下，此外，DSC发热温度可以为90℃以下。In addition, the gel time of the reworkable conductive adhesive of the present invention can be 25 seconds (sec) or less at 90°C, and the DSC heating temperature can be 90°C or less.
另外，本发明的能够再施工的导电性粘接剂在250℃下具有在3分钟内脱附的再施工特性，此外，可以是与初始焊带的粘接强度为1.0N以上、模块晶片间粘接强度为10kgf以上、凝胶时间在90℃为25秒以下、DSC发热温度可以为90℃以下的能够再施工的导电性粘接剂。In addition, the re-applicable conductive adhesive of the present invention has the re-appliability characteristic of being detached within 3 minutes at 250°C. In addition, the adhesive strength with the initial solder tape can be 1.0N or more, and the module wafer can be A conductive adhesive that can be re-applied with an adhesive strength of 10kgf or more, a gel time of 25 seconds or less at 90°C, and a DSC heating temperature of 90°C or less.
本发明的导电性粘接剂可以为包含(A)导电性颗粒和(B)导电性粘接组合物的导电性粘接剂，所述(B)导电性粘接组合物包含脂环族(甲基)丙烯酸酯、聚氨酯系(甲基)丙烯酸酯低聚物、聚醚系(甲基)丙烯酸酯低聚物、(甲基)丙烯酸烷氧基烷基酯、磷酸酯系酯和热引发剂。The conductive adhesive of the present invention may be a conductive adhesive containing (A) conductive particles and (B) a conductive adhesive composition containing an alicyclic (B) conductive adhesive composition. Meth)acrylates, polyurethane-based (meth)acrylate oligomers, polyether-based (meth)acrylate oligomers, (meth)acrylic acid alkoxyalkyl esters, phosphate esters and thermal initiation agent.
另外，本发明的导电性粘接剂可以为相对于(A)导电性颗粒100重量份，包含10至100重量份的(B)导电性粘接组合物的导电性粘接剂，所述(B)导电性粘接组合物包含脂环族(甲基)丙烯酸酯、聚氨酯系(甲基)丙烯酸酯低聚物、聚醚系(甲基)丙烯酸酯低聚物、(甲基)丙烯酸烷氧基烷基酯、磷酸酯系酯和热引发剂。In addition, the conductive adhesive of the present invention may be a conductive adhesive containing 10 to 100 parts by weight of the conductive adhesive composition (B) with respect to 100 parts by weight of the conductive particles (A). B) The conductive adhesive composition contains alicyclic (meth)acrylate, polyurethane-based (meth)acrylate oligomer, polyether-based (meth)acrylate oligomer, and (meth)acrylic acid alkane Oxyalkyl esters, phosphate esters and thermal initiators.
在本发明中，上述粘接组合物中的聚氨酯系(甲基)丙烯酸酯低聚物和聚醚系(甲基)丙烯酸酯低聚物的含量可以为40至80重量％。此外，可以单独使用上述聚氨酯系(甲基)丙烯酸酯低聚物，或者可以以2至10:1的重量比混合使用上述聚氨酯系(甲基)丙烯酸酯低聚物和聚醚系(甲基)丙烯酸酯低聚物。In the present invention, the content of the polyurethane-based (meth)acrylate oligomer and the polyether-based (meth)acrylate oligomer in the above-mentioned adhesive composition may be 40 to 80% by weight. In addition, the above-mentioned polyurethane-based (meth)acrylate oligomer may be used alone, or the above-mentioned polyurethane-based (meth)acrylate oligomer and polyether-based (meth)acrylate oligomer may be mixed and used in a weight ratio of 2 to 10:1. ) acrylate oligomer.
另外，在本发明中，在上述粘接组合物中可以包含脂环族(甲基)丙烯酸酯单体10至50重量％、烷氧基(甲基)丙烯酸酯单体1至20重量％、磷酸酯系酯0.05至3重量％、以及热引发剂0.05至5重量％。In addition, in the present invention, the above-mentioned adhesive composition may contain 10 to 50% by weight of alicyclic (meth)acrylate monomer, 1 to 20% by weight of alkoxy (meth)acrylate monomer, Phosphate ester 0.05 to 3% by weight, and thermal initiator 0.05 to 5% by weight.
另外，本发明可以提供一种太阳能电池模块，其中，一个太阳能电池单元的表面电极和与上述一个太阳能电池单元相邻的另一个太阳能电池单元的背面电极通过能够再施工的导电性粘接剂与分接线电连接，上述能够再施工的导电性粘接剂是在250℃在3分钟内脱附的能够再施工的导电性粘接剂。In addition, the present invention can provide a solar cell module in which the surface electrode of one solar cell and the back electrode of another solar cell adjacent to the one solar cell are connected to each other through a re-applicable conductive adhesive. The tap line is electrically connected, and the above-mentioned re-applicable conductive adhesive is a re-applicable conductive adhesive that desorbs within 3 minutes at 250°C.
另外，在本发明的太阳能电池模块中，用于本发明的太阳能电池模的能够再施工的导电性粘接剂是与初始焊带的粘接强度为≥1.0N、模块晶片间的粘接强度为10kgf以上、凝胶时间在90℃为25秒以下、DSC(Dynamic scanning calorimetry，差示扫描量热仪)最大发热峰的温度为90℃以下的导电性粘接剂。In addition, in the solar cell module of the present invention, the re-applicable conductive adhesive used in the solar cell mold of the present invention has an adhesion strength of ≥1.0N to the initial soldering tape and an adhesion strength between module wafers. It is a conductive adhesive that is 10kgf or more, has a gel time of 25 seconds or less at 90°C, and a DSC (Dynamic scanning calorimetry, differential scanning calorimeter) maximum heat peak temperature of 90°C or less.
另外，根据本发明的太阳能电池模块中，一个太阳能电池单元的表面和与上述一个太阳能电池单元相邻的另一个太阳能电池单元的背面电极可以通过上述导电性粘接剂与分接线电连接。In addition, in the solar cell module according to the present invention, the surface of one solar cell unit and the back electrode of another solar cell unit adjacent to the one solar cell unit may be electrically connected to the tap line through the conductive adhesive.
在采用根据本发明的导电性粘接剂的情况下，在150℃以上，优选在200℃以上的高温中，导电性粘接剂固化层容易分离而脱离。即，不会残留残渣，并且分离性增加而再施工性显著升高。When using the conductive adhesive according to the present invention, at a high temperature of 150° C. or higher, preferably 200° C. or higher, the conductive adhesive solidified layer is easily separated and detached. That is, no residue remains, the separability is increased, and the reworkability is significantly improved.
另外，即使太阳能电池模块的排列发生错误时，能够不将其废弃而再施工或者能够再修改排列，因此在制作太阳能电池模块时，可以赋予非常高的经济性和再施工性。In addition, even if an error occurs in the arrangement of the solar cell modules, they can be re-constructed without discarding them or the arrangement can be modified. Therefore, very high economical efficiency and re-construction efficiency can be provided when manufacturing the solar cell modules.
附图说明Description of the drawings
图1图示了测定晶片间粘接强度的方法。Figure 1 illustrates a method for measuring inter-wafer bonding strength.
具体实施方式Detailed ways
下面，根据实施例详细地说明本发明，但是其只是一个参考，本发明并不限定于此，可以实现多种形态。Hereinafter, the present invention will be described in detail based on the examples. However, these are only for reference. The present invention is not limited thereto and can be implemented in various forms.
另外，只要没有其他定义，所有技术用语和科学用语就具有与本领域技术人员通常所理解的意义相同的意义。在本发明中用于说明的用语只是为了有效地记述特定实施例，不是意图限定本发明。In addition, unless otherwise defined, all technical and scientific terms have the same meaning as commonly understood by those skilled in the art. The terms used for description in the present invention are only for effectively describing specific embodiments and are not intended to limit the present invention.
另外，在说明书和附上的权利要求书中所使用的单数形态只要在文中没有特别指示，可以包含复数形态。In addition, the singular form used in the specification and the appended claims may include the plural form unless otherwise specified in the context.
另外，当指出某一部分“包含/包括”某一构成要素时，只要没有特别相反的记载，则意味着可以进一步包含其它构成要素，而不是将其它构成要素排除。In addition, when it is stated that a certain part "includes/includes" a certain constituent element, it means that other constituent elements can be further included, rather than excluding other constituent elements, unless otherwise specified.
下面，对本发明的实施例具体地进行说明。Next, embodiments of the present invention will be described in detail.
首先，对用于将太阳能电池单元的表面电极或背面电极与分接线电连接的本发明的导电性粘接剂进行说明。First, the conductive adhesive of the present invention for electrically connecting the front surface electrode or the rear surface electrode of the solar cell unit to the tap line will be described.
本发明的导电性粘接剂为糊状，此外，可以为膜状，但并不限定于此。The conductive adhesive of the present invention is in a paste form and may be in a film form, but is not limited thereto.
本发明的导电性粘接剂的一个方式包含(A)导电性颗粒和(B)导电性粘接组合物，所述(B)导电性粘接组合物包含脂环族(甲基)丙烯酸酯、聚氨酯系(甲基)丙烯酸酯低聚物、聚醚系(甲基)丙烯酸酯低聚物、(甲基)丙烯酸烷氧基烷基酯、磷酸酯系酯和热引发剂。One embodiment of the conductive adhesive of the present invention contains (A) conductive particles and (B) a conductive adhesive composition containing an alicyclic (meth)acrylate. , polyurethane-based (meth)acrylate oligomers, polyether-based (meth)acrylate oligomers, (meth)acrylic acid alkoxyalkyl esters, phosphate esters and thermal initiators.
作为本发明的一个例子，通过提供如下的导电性粘接剂，从而可以完成本发明，相对于上述导电性颗粒100重量份，上述导电性粘接剂包含10至100重量份的导电性粘接组合物，该导电性粘接组合物包含脂环族(甲基)丙烯酸酯、聚氨酯系(甲基)丙烯酸酯低聚物、聚醚系(甲基)丙烯酸酯低聚物、(甲基)丙烯酸烷氧基烷基酯、磷酸酯系酯和热引发剂。As an example of the present invention, the present invention can be completed by providing a conductive adhesive containing 10 to 100 parts by weight of conductive adhesive relative to 100 parts by weight of the conductive particles. Composition, the conductive adhesive composition contains alicyclic (meth)acrylate, polyurethane-based (meth)acrylate oligomer, polyether-based (meth)acrylate oligomer, (meth) Alkoxyalkyl acrylates, phosphate esters and thermal initiators.
另外，在本发明中，关于上述低聚物的含量，在全部导电性粘接组合物(B)100重量份％中，包含40至80重量％时，对于作为本发明的目的的再施工性具有更优异的效果，即不残留残渣，并且在高温下完全去除，从而再施工性具有更优异的效果，因此更优选。In addition, in the present invention, when the content of the above-mentioned oligomer is 40 to 80% by weight in 100% by weight of the entire conductive adhesive composition (B), the reworkability as the object of the present invention will be improved. It has a more excellent effect, that is, no residue remains, and it is completely removed at high temperature, so it has a more excellent effect on reworkability, so it is more preferable.
另外，本发明的导电性粘接剂根据需要还可以包括无机填充剂、润滑剂、成膜剂、偶联剂、消泡剂、增粘剂和溶剂等，但并不限定于此。In addition, the conductive adhesive of the present invention may also include inorganic fillers, lubricants, film-forming agents, coupling agents, defoaming agents, thickeners, solvents, etc. as needed, but is not limited thereto.
在本发明中，作为导电性颗粒，例如，可以使用选自银、镍、金、铜等的金属颗粒中的1种或2种以上的导电性颗粒。上述颗粒可以为片状，可以为颗粒状，对于其形状没有特别限定。In the present invention, as the conductive particles, for example, one or more conductive particles selected from metal particles such as silver, nickel, gold, copper, etc. can be used. The above-mentioned particles may be in the form of flakes or granules, and their shape is not particularly limited.
在本发明中，上述导电性颗粒对其颗粒的大小没有特别限定，例如，在连接可靠性方面考虑，可以为0.01至30μm，但对于其颗粒的大小，尤其只要导电性、连接性充分，就没有限定。In the present invention, the particle size of the above-mentioned conductive particles is not particularly limited. For example, in terms of connection reliability, the particle size may be 0.01 to 30 μm. However, the particle size may be any size as long as the conductivity and connectivity are sufficient. There is no limit.
下面，对于本发明的上述粘接组合物的各成分具体地进行观察。Next, each component of the adhesive composition of the present invention will be specifically observed.
首先，对于本发明的包含聚氨酯系(甲基)丙烯酸酯低聚物和聚醚(甲基)丙烯酸酯低聚物的低聚物进行说明。First, the oligomer including the polyurethane-based (meth)acrylate oligomer and the polyether (meth)acrylate oligomer of the present invention will be described.
本发明通过包含上述2种低聚物的混合低聚物与脂环族(甲基)丙烯酸酯和磷酸酯系酯化合物，在低温下能够固化，在低温下固化而粘接强度高，但在高温下粘接强度降低而增加分离性，从而显著提高再粘接或再施工性。In the present invention, a mixed oligomer containing the above two types of oligomers, an alicyclic (meth)acrylate, and a phosphate ester compound can be cured at low temperatures, and the adhesive strength is high by curing at low temperatures. However, At high temperatures, bonding strength decreases and separation increases, thereby significantly improving rebonding or re-construction properties.
上述本发明的低聚物混合物在全部粘接组合物中可以为40至80重量％，不限定于此，但在上述范围内更有利于达到本发明的目的，因此可以优选。The above-mentioned oligomer mixture of the present invention may be 40 to 80% by weight in the entire adhesive composition, and is not limited thereto. However, the above range is more conducive to achieving the object of the present invention, so it is preferable.
本发明的聚氨酯系(甲基)丙烯酸酯低聚物具有固化性，可以是其末端由(甲基)丙烯酸酯构成且重均分子量为1000至30000g/mol的化合物，包含氨基甲酸酯键作为重复单元，通常具有柔软的物性。The polyurethane-based (meth)acrylate oligomer of the present invention has curability, may be a compound whose terminal is composed of (meth)acrylate and has a weight average molecular weight of 1,000 to 30,000 g/mol, and contains a urethane bond as Repeating units usually have soft physical properties.
本发明的聚氨酯系(甲基)丙烯酸酯低聚物可以通过将多元醇和多异氰酸酯进行反应而得到的异氰酸酯基末端氨基甲酸酯预聚物与在1分子中具有至少一个羟基的丙烯酸酯单体进行反应而得到。The polyurethane-based (meth)acrylate oligomer of the present invention can be obtained by using an isocyanate group-terminated urethane prepolymer obtained by reacting a polyol and a polyisocyanate and an acrylate monomer having at least one hydroxyl group per molecule. Obtained by reaction.
聚氨酯(甲基)丙烯酸酯低聚物具有各种种类，根据所使用的异氰酸酯的种类分为脂肪族氨基甲酸酯(甲基)丙烯酸酯和芳香族氨基甲酸酯(甲基)丙烯酸酯，不限定于任何一种，但在本发明中，为了本发明的再施工性，更优选使用通常具有2至20个官能团的脂肪族氨基甲酸酯(甲基)丙烯酸酯低聚物。There are various types of polyurethane (meth)acrylate oligomers, which are divided into aliphatic urethane (meth)acrylate and aromatic urethane (meth)acrylate according to the type of isocyanate used. It is not limited to any one, but in the present invention, for the reworkability of the present invention, it is more preferable to use an aliphatic urethane (meth)acrylate oligomer generally having 2 to 20 functional groups.
作为本发明的聚氨酯(甲基)丙烯酸酯低聚物的例子，可以举出季戊四醇三丙烯酸酯六亚甲基二异氰酸酯氨基甲酸酯低聚物、苯基缩水甘油醚丙烯酸酯六亚甲基二异氰酸酯氨基甲酸酯低聚物和苯基缩水甘油醚丙烯酸酯甲苯二异氰酸酯氨基甲酸酯低聚物等，但并不限定于此。本发明的聚氨酯(甲基)丙烯酸酯低聚物的商业化产品可以举出EB270、EB1290、EB9260、U451(SK Cytec)、SC2100(美源商社)等，但并不限定于此。Examples of the urethane (meth)acrylate oligomer of the present invention include pentaerythritol triacrylate hexamethylene diisocyanate urethane oligomer and phenyl glycidyl ether acrylate hexamethylene diisocyanate. Isocyanate urethane oligomer, phenyl glycidyl ether acrylate toluene diisocyanate urethane oligomer, etc., but are not limited thereto. Commercial products of the urethane (meth)acrylate oligomer of the present invention include, but are not limited to, EB270, EB1290, EB9260, U451 (SK Cytec), SC2100 (Miwon Corporation), and the like.
在本发明中，上述聚氨酯系(甲基)丙烯酸酯的含量在全部粘接剂组合物中可以使用30至80重量％，可以优选使用40至70重量％。使用该含量时，本发明的在高温下的再施工性更优异，因此优选。In the present invention, the content of the polyurethane-based (meth)acrylate in the entire adhesive composition can be 30 to 80% by weight, and preferably 40 to 70% by weight. When this content is used, the reworkability at high temperatures of the present invention is more excellent, so it is preferable.
然后，对于本发明的聚醚系(甲基)丙烯酸酯低聚物进行说明。Next, the polyether-based (meth)acrylate oligomer of the present invention will be described.
聚醚系(甲基)丙烯酸酯低聚物例如可以通过将聚醚多元醇的羟基利用(甲基)丙烯酸进行酯化而得到。具体而言，聚醚(甲基)丙烯酸酯低聚物的粘度为2000cps以下，例如，可以为10至2000cps，更具体而言，优选为1000cps以下。The polyether-based (meth)acrylate oligomer can be obtained, for example, by esterifying the hydroxyl group of a polyether polyol with (meth)acrylic acid. Specifically, the viscosity of the polyether (meth)acrylate oligomer is 2000 cps or less, for example, it can be 10 to 2000 cps, and more specifically, it is preferably 1000 cps or less.
聚醚系(甲基)丙烯酸酯低聚物可以使用将在1分子内具有1个以上、具体具有2个以上羟基的聚醚多元醇和具有与该羟基反应的官能团的(甲基)丙烯酸酯单体(包括(甲基)丙烯酸)进行反应而得到的物质。用于将这两个成分进行反应的配合比例(聚醚多元醇的羟基/(甲基)丙烯酸酯单体的官能团)具体为0.8至1.2，更具体地，可以为0.9至1.1。The polyether-type (meth)acrylate oligomer can use a polyether polyol having one or more, specifically two or more hydroxyl groups per molecule, and a (meth)acrylate monomer having a functional group that reacts with the hydroxyl group. A substance obtained by reacting with a substance (including (meth)acrylic acid). The mixing ratio (hydroxyl group of polyether polyol/functional group of (meth)acrylate monomer) for reacting these two components is specifically 0.8 to 1.2, and more specifically, it may be 0.9 to 1.1.
作为上述聚醚多元醇，例如，可以利用将乙二醇、二乙二醇、三乙二醇、丙二醇、三亚亚甲基二醇、1,3-丁二醇、1,4-丁二醇、1,6-己二醇、新戊二醇、甘油、三羟甲基乙烷、三羟甲基丙烷、山梨糖醇等具有至少2个活性氢原子的化合物的1种或2种以上基于通常的方法加成聚合而得到的物质。As the polyether polyol, for example, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, trimethylene glycol, 1,3-butanediol, and 1,4-butanediol can be used. , 1,6-hexanediol, neopentyl glycol, glycerol, trimethylolethane, trimethylolpropane, sorbitol and other compounds with at least 2 active hydrogen atoms based on one or more A substance obtained by addition polymerization by the usual method.
作为具有与聚醚多元醇的羟基进行反应的官能团的(甲基)丙烯酸酯单体，可以为上述含有羧基的(甲基)丙烯酸酯单体。在本发明中，作为上述单体，包含(甲基)丙烯酸时，更能提高再施工(rework)特性。这时，上述(甲基)丙烯酸是指将丙烯酸或甲基丙烯酸都包括在内的概念。The (meth)acrylate monomer having a functional group that reacts with the hydroxyl group of the polyether polyol may be the above-mentioned carboxyl group-containing (meth)acrylate monomer. In the present invention, when (meth)acrylic acid is included as the above-mentioned monomer, rework characteristics can be further improved. In this case, the above-mentioned (meth)acrylic acid refers to a concept including both acrylic acid and methacrylic acid.
在本发明中，使用(甲基)丙烯酸时，相对于全部单体，可以使用0.1至100重量％，具体而言，优选在0.1至30重量％的范围内使用，此时可以提高再施工特性，但并不限定于此。In the present invention, when (meth)acrylic acid is used, it can be used in an amount of 0.1 to 100% by weight based on the total monomers. Specifically, it is preferably used in a range of 0.1 to 30% by weight. In this case, the reworkability can be improved. , but is not limited to this.
本发明的上述聚醚多元醇(甲基)丙烯酸酯低聚物在粘接剂组合物中使用30重量％以下，具体而言，在1至30重量％的范围内使用，可以同时实现本发明的低温粘接性和高温分离性。The above-mentioned polyether polyol (meth)acrylate oligomer of the present invention can be used in the adhesive composition at 30% by weight or less, specifically in the range of 1 to 30% by weight, and the present invention can be achieved at the same time. Low temperature adhesion and high temperature separation.
对于本发明的上述脂环族(甲基)丙烯酸酯进行说明。The above-mentioned alicyclic (meth)acrylate of the present invention will be described.
作为脂环族单体的例子，可以包含丙烯酸环己酯、甲基丙烯酸环己酯、丙烯酸甲基环己酯、甲基丙烯酸甲基环己酯、丙烯酸三甲基环己酯、甲基丙烯酸三甲基环己酯、以及其他脂环族甲基丙烯酸酯和丙烯酸酯单体，例如，萘烷醇、(甲基)丙烯酸异冰片酯、氢化的双酚A和F的酯衍生物等，但并不限定于此。Examples of the alicyclic monomer include cyclohexyl acrylate, cyclohexyl methacrylate, methylcyclohexyl acrylate, methylcyclohexyl methacrylate, trimethylcyclohexyl acrylate, and methacrylic acid. Trimethylcyclohexyl, and other alicyclic methacrylate and acrylate monomers, such as decalinol, isobornyl (meth)acrylate, hydrogenated ester derivatives of bisphenol A and F, etc., But it is not limited to this.
上述脂环族(甲基)丙烯酸酯单体在全部粘接剂组合物100重量％中，使用10至50重量时，由于本发明的再施工性优异，因此优选，但不是必须限定于上述组成比。When the above-mentioned alicyclic (meth)acrylate monomer is used in 100% by weight of the entire adhesive composition, it is preferable because the reworkability of the present invention is excellent, but it is not necessarily limited to the above composition. Compare.
然后，对本发明的(甲基)丙烯酸烷氧基烷基酯单体进行说明。本发明的(甲基)丙烯酸烷氧基烷基酯单体起到进一步增进低温粘接性的作用，增加本发明的单体的混合性而起到提高低温粘接性以及促进高温分离性的作用。Next, the (meth)acrylic acid alkoxyalkyl ester monomer of the present invention will be described. The (meth)acrylic acid alkoxyalkyl ester monomer of the present invention further improves the low-temperature adhesiveness, increases the mixability of the monomer of the present invention, thereby improving the low-temperature adhesiveness and promoting high-temperature separation. effect.
在本发明中，(甲基)丙烯酸烷氧基烷基酯可以使用取代有一个或两个以上C1～C4的烷氧基的C1～C6的烷基(甲基)丙烯酸酯，起到防止丙烯酸酯的经时变化带来的粘接强度的增加、在高温下恒定地维持分离性的作用，因此优选。In the present invention, the alkoxyalkyl (meth)acrylate can be a C1-C6 alkyl (meth)acrylate substituted with one or more C1-C4 alkoxy groups to prevent acrylic acid The ester is preferred because it increases the bonding strength due to changes over time and maintains the separability at high temperatures.
作为具体例，可以举出丙烯酸乙氧基乙酯、丙烯酸二乙氧基乙酯等，但并不限定于此。Specific examples include, but are not limited to, ethoxyethyl acrylate, diethoxyethyl acrylate, and the like.
上述(甲基)丙烯酸烷氧基烷基酯单体在全部粘接组合物100重量％中使用1至20重量％时，能维持在上述高温时的分离性，即，能防止粘接强度随时间增加，因而更优选。When the above-mentioned (meth)acrylic acid alkoxyalkyl ester monomer is used in 100% by weight of the entire adhesive composition in an amount of 1 to 20% by weight, the separability at the above-mentioned high temperature can be maintained, that is, the adhesive strength can be prevented from decreasing. The time increases and is therefore more preferable.
然后，对本发明的磷酸酯系酯化合物进行说明。磷酸酯系酯化合物在导电性粘接剂组合物中诱导导电性颗粒的分散，为了粘接分接线与电极而涂覆导电性粘接剂时，可以维持粘接面的厚度的均匀性，诱导导电性颗粒的分散而能够实现均匀粘接，此外，可以进一步实现改善低温下的粘接强度以及在高温下去除导电性粘接剂粘接层时不残留残渣的效果。Next, the phosphate ester compound of the present invention will be described. The phosphate ester compound induces the dispersion of conductive particles in the conductive adhesive composition. When the conductive adhesive is applied to bond the tap line and the electrode, the uniformity of the thickness of the bonding surface can be maintained, inducing The dispersion of conductive particles enables uniform adhesion, and further improves the bonding strength at low temperatures and eliminates residue when removing the conductive adhesive bonding layer at high temperatures.
作为本发明的上述磷酸酯系酯化合物的具体例，在磷酸酯表面活性剂中，可以举出磷酸C8-10烷基乙酯、磷酸C9-15烷基酯、鲸蜡硬脂醇聚醚(Ceteareth)-2磷酸酯、鲸蜡硬脂醇聚醚-5磷酸酯、鲸蜡醇聚醚(Ceteth)-8磷酸酯、鲸蜡醇聚醚-10磷酸酯、磷酸十六烷基酯、C6-10链烷醇聚醚(Pareth)-4磷酸酯、C12-15链烷醇聚醚-2磷酸酯、C12-15链烷醇聚醚-3磷酸酯、DEA-鲸蜡硬脂醇聚醚-2磷酸酯、DEA-十六烷基磷酸钾、DEA-油醇聚醚-3磷酸酯、十六烷基磷酸钾、癸醇聚醚(Deceth)-4磷酸酯、癸醇聚醚-6磷酸酯和三(月桂醇聚醚-4)磷酸酯，但并不限定于此。Specific examples of the phosphate ester compound of the present invention include, among the phosphate surfactants, C8-10 alkyl ethyl phosphate, C9-15 alkyl phosphate, and cetearyl alcohol polyether ( Ceteareth)-2 phosphate, ceteareth-5 phosphate, ceteth-8 phosphate, ceteth-10 phosphate, cetyl phosphate, C6 -10 alkanol polyether (Pareth)-4 phosphate, C12-15 alkanol polyether-2 phosphate, C12-15 alkanol polyether-3 phosphate, DEA-cetearyl polyether -2 Phosphate, DEA-Potassium Cetyl Phosphate, DEA-Oleth-3 Phosphate, Potassium Cetyl Phosphate, Deceth-4 Phosphate, Deceth-6 Phosphate ester and tris(laureth-4) phosphate, but are not limited thereto.
上述磷酸酯系酯化合物在粘接组合物100重量％中，使用0.05至3重量时，更容易实现本发明的目的，因而进一步优选，但不是必须限定于此。When the phosphate ester compound is used in an amount of 0.05 to 3% by weight in 100% by weight of the adhesive composition, it is more preferable to achieve the object of the present invention, but it is not necessarily limited to this.
作为热引发剂，优选利用有机过氧化物。作为有机过氧化物，例如，可以举出叔丁基过氧新癸酸酯、过氧化苯甲酰、过氧化月桂酰、丁基过氧化物、苄基过氧化物、过氧化二月桂酰、二丁基过氧化物、苄基过氧化物、过氧化二碳酸酯等，更优选为低温引发剂。上述热引发剂在粘接组合物100重量％中可以采用0.05至5重量％，但并不限定于此。As the thermal initiator, organic peroxides are preferably used. Examples of organic peroxides include tert-butyl peroxyneodecanoate, benzoyl peroxide, lauroyl peroxide, butyl peroxide, benzyl peroxide, dilauroyl peroxide, Dibutyl peroxide, benzyl peroxide, peroxydicarbonate, etc. are more preferred as low-temperature initiators. The thermal initiator may be used in an amount of 0.05 to 5% by weight in 100% by weight of the adhesive composition, but is not limited thereto.
在本发明中，在特别需要时，相对于全部粘接剂组合物，作为有机溶剂，可以将甲苯、酮、醚、乙酸乙酯等的酯等以20wt％以内混合而添加。In the present invention, when particularly necessary, as an organic solvent, toluene, ketone, ether, ester such as ethyl acetate, etc. can be mixed and added in an amount within 20 wt% of the entire adhesive composition.
然后，对于利用导电性粘接剂的太阳能电池模块的制造方法进行说明。Next, a method of manufacturing a solar cell module using a conductive adhesive will be described.
导电性粘接剂的制造方法通常制造成糊状，但是另一方面可以制造成膜状而适用，在这里，对制造成糊状粘接剂而制造模块的方法进行说明。The conductive adhesive is usually produced in a paste form. However, it can be applied in a film form. Here, a method of producing a module by producing a paste form adhesive will be described.
本发明的导电性粘接剂是以上述组成成分，具体以上述组成成分与组成比进行混合而制造浆糊后，利用其涂覆在分接线和背面电极接触的部分并固化而制造。固化工序通常可以在120℃以内对在分接线和背面电极之间层叠的导电性粘接剂施加压力而接合。The conductive adhesive of the present invention is produced by mixing the above-mentioned composition components, specifically the above-mentioned composition components and composition ratios to prepare a paste, and then coating the paste on the contact portion between the tap line and the back electrode and curing it. In the curing process, the conductive adhesive laminated between the tap line and the back electrode can be bonded by applying pressure within 120° C. generally.
即，本发明的太阳能电池模块的制造方法是将一个太阳能电池单元的表面电极和与该太阳能电池单元相邻的另一个太阳能电池单元的背面电极通过导电性粘接材料用分接线电连接的太阳能电池的制造方法，将分接线通过本发明的导电性粘接剂配置在表面电极和背面电极上，加压而固化，从而制造模块。That is, the solar cell module manufacturing method of the present invention is a solar cell module in which the surface electrode of one solar cell unit and the back surface electrode of another solar cell unit adjacent to the solar cell unit are electrically connected with a tap line through a conductive adhesive material. In the method of manufacturing a battery, the tap wires are arranged on the front electrode and the back electrode through the conductive adhesive of the present invention, and are pressed and solidified to manufacture a module.
例举制作本发明的模块的一个例子，首先，在光电转换元件的表面涂覆Ag糊，通过煅烧形成指状电极和母线电极/> 在反面的分接线的连接部形成铝背面电极，从而制作太阳能电池单元。To give an example of making the module of the present invention, first, Ag paste is coated on the surface of the photoelectric conversion element and fired to form finger electrodes. and busbar electrode/> An aluminum back electrode is formed at the connection portion of the tap line on the reverse side, thereby producing a solar cell unit.
对上述太阳能电池单元的表面的母线电极和铝背面电极涂覆本发明的导电性粘接剂，在涂覆的粘接剂上部配置分接线，通过规定的压力进行固化，从而制作了将分接线与母线电极以及铝背面电极电连接，通过反复进行这样的过程，使复数个太阳能电池单元通过本发明的导电性粘接剂彼此连接，从而制造太阳能电池模块。The conductive adhesive of the present invention is applied to the bus bar electrode and the aluminum back electrode on the surface of the solar cell unit, and tap wires are arranged on top of the applied adhesive. The tap wires are cured under a prescribed pressure to produce tap wires. The bus bar electrode and the aluminum back electrode are electrically connected, and by repeating this process, a plurality of solar cells are connected to each other through the conductive adhesive of the present invention, thereby manufacturing a solar cell module.
通过使用上述本发明的导电性粘接剂，在连接电极与分接线时，排列不良地连接并固化的情况下，在加热的情况下，反而能够容易地去除粘接剂，从而可以再涂覆粘接剂而对模块再施工，即在高温下增加分离性而可以容易地去除粘接剂。因此，提供在排列错误的情况下能够再施工(rework)的新型导电性粘接剂及利用其的太阳能电池模模块。By using the above-mentioned conductive adhesive of the present invention, when the electrodes and tap lines are connected and cured in a poorly aligned manner, the adhesive can be easily removed by heating and can be recoated. The adhesive is re-applied to the module, which increases the separability at high temperatures and allows easy removal of the adhesive. Therefore, a novel conductive adhesive that can be reworked even if the arrangement is incorrect, and a solar cell module utilizing the same, are provided.
另外，本发明的上述再施工特性在150℃以上，具体而言，在200℃以上显示分离性，从而具有在太阳能电池工作的温度范围内不显示这样的分离性的效果。In addition, the above-mentioned reworkability of the present invention shows separability at 150° C. or higher, specifically, 200° C. or higher, and thus has the effect of not showing such separability within the temperature range in which the solar cell operates.
另外，根据本发明而制造的太阳能电池模块在250℃3分钟以内粘接剂增加分离性而能够容易地去除，从而提供能够再施工或者重新调整排列而及时修改位置的再施工性优异的导电性粘接剂及利用其的太阳能电池模块。更具体而言，优选在250℃2分钟内能够再施工。In addition, the solar cell module manufactured according to the present invention can be easily removed by increasing the separability of the adhesive within 3 minutes at 250° C., thereby providing excellent conductivity that can be re-constructed or re-arranged and the position can be modified in a timely manner. Adhesive and solar cell module using the same. More specifically, it is preferable that it can be re-applied within 2 minutes at 250°C.
已知通常太阳能电池模块在夏天升高至60至90℃左右，在使用根据本发明的导电性粘接剂的情况下，具有完全不发生正常使用时的问题的效果。It is known that the temperature of a solar cell module usually rises to about 60 to 90° C. in the summer, and when the conductive adhesive according to the present invention is used, there is an effect that no problem occurs during normal use at all.
下面，例举实施例来具体地说明本发明，但本发明并不限定于该实施例。The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples.
<再施工性特性><Reworkability Characteristics>
在太阳能硅晶片的背面Ag电极表面上，以长度5cm、线宽3mm、厚度40±5μm印刷后，在其上覆盖另一个太阳能硅晶片的背面电极部位，以10g的砝码按压后，利用热风或在IR干燥机中以150℃固化20秒而制作了评估用样品。将制作的晶片放置在250℃的加热板上，记录了附着的晶片掉落的时间(规格：3分钟以内)和掉落部位的现象。After printing on the back Ag electrode surface of the solar silicon wafer with a length of 5cm, a line width of 3mm, and a thickness of 40±5μm, cover it with the back electrode part of another solar silicon wafer, press it with a 10g weight, and use hot air Alternatively, the sample for evaluation was prepared by curing it in an IR dryer at 150°C for 20 seconds. The produced wafer was placed on a hot plate at 250°C, and the time for the attached wafer to fall (specification: within 3 minutes) and the phenomenon of the falling location were recorded.
<凝胶时间><gel time>
在加热板上，以85至95℃温度设定并实测后，将所制造的导电性粘接剂0.5g掉落后，用特氟龙棒搅拌的同时测定了凝胶化的初始时间和结束时间(规格：在90℃，25秒以内)。凝胶时间根据温度而变化，因此测定各温度凝胶时间，可以掌握根据温度的反应时间。After setting and measuring the temperature at 85 to 95°C on a hot plate, 0.5 g of the produced conductive adhesive was dropped, and the initial time and completion of gelation were measured while stirring with a Teflon rod. Time (specification: within 25 seconds at 90°C). The gel time changes depending on the temperature. Therefore, by measuring the gel time at each temperature, the reaction time according to the temperature can be grasped.
<晶片间粘接强度><Inter-wafer bonding strength>
在太阳能硅晶片的背面Ag电极表面上，以长度5cm、线宽3mm、厚度40±5μm印刷后，在其上覆盖另一个太阳能硅晶片的背面电极部位，以10g的砝码按压后，利用热风或在IR干燥机中以150℃固化20秒而制作了评估用样品。将制作的晶片使用万能试验机(UniversalTesting machine)(WL2100)设备以与图1相同的方向测定了粘接强度(规格：10kgf以上)。After printing on the back Ag electrode surface of the solar silicon wafer with a length of 5cm, a line width of 3mm, and a thickness of 40±5μm, cover it with the back electrode part of another solar silicon wafer, press it with a 10g weight, and use hot air Alternatively, the sample for evaluation was prepared by curing it in an IR dryer at 150°C for 20 seconds. The produced wafer was measured for adhesive strength (specification: 10kgf or more) using a Universal Testing machine (WL2100) in the same direction as Figure 1 .
<与焊带的初始粘接强度><Initial bonding strength to solder tape>
在太阳能硅晶片的背面Ag电极表面上，以长度5cm、线宽3mm、厚度40±5μm印刷后，在其上放置焊带(材质Sn:Pb＝6:4)后，施加100g以下的重量，同时在150℃实施2秒钟的固化。将固化的样品用Mecmesin公司的多功能测试仪(Multi tester)测定了强度(规格：1.0N以上)，观察在掉落的晶片上是否残留导电性粘接剂以及是否在焊带上粘有导电性粘接剂。After printing on the backside Ag electrode surface of the solar silicon wafer with a length of 5cm, a line width of 3mm, and a thickness of 40±5μm, a soldering ribbon (material Sn:Pb=6:4) is placed on it, and a weight of less than 100g is applied. At the same time, curing is performed at 150°C for 2 seconds. The strength of the cured sample was measured using Mecmesin's multi-function tester (specification: 1.0N or more), and it was observed whether there was any conductive adhesive remaining on the dropped wafer and whether there was any conductive adhesive on the soldering tape. Sexual adhesive.
<可用时间><Available times >
将制造的导电性粘接剂在常温(25±5℃)下放置后，测定初始、24小时和48小时后的粘度，评价了与初始相比粘度的变化率。After the produced conductive adhesive was left to stand at normal temperature (25±5°C), the viscosity was measured at the initial stage, 24 hours, and 48 hours later, and the change rate of the viscosity from the initial stage was evaluated.
<DSC发热温度><DSC heating temperature>
DSC(Dynamic scanning calorimetry,差示扫描量热仪)使用METTLER TOLEDO公司的823E进行测定。差示扫描量热仪测定了在恒定速度加热、冷却或维持等温时样品中所产生的热流。在分析盘上放置重量10±2mg的所制造的导电性粘接剂后，从常温到200℃以5℃/分钟的加热速度进行了分析。这时，导电性粘接剂进行放热反应的固化行为，测定最大发热峰的温度来比较各组成间的反应温度。DSC (Dynamic scanning calorimetry, differential scanning calorimeter) was measured using 823E of METTLER TOLEDO. Differential scanning calorimetry measures the heat flow produced in a sample when it is heated, cooled, or maintained isothermally at a constant rate. After placing a weight of 10±2 mg of the produced conductive adhesive on the analysis disk, analysis was performed at a heating rate of 5°C/min from normal temperature to 200°C. At this time, the conductive adhesive undergoes a curing behavior of exothermic reaction, and the temperature of the maximum heat peak is measured to compare the reaction temperatures between the various compositions.
[实施例和比较例][Examples and Comparative Examples]
利用下述表1的组成成分，除了导电性颗粒以外，将全部进行混合，在常温下充分地进行了均匀分散。然后，以表1的比例投入Ag糊剂(平均粒径6.3μm)，在常温充分搅拌后，进一步研磨而制造了均匀分散的糊剂。Using the composition components in Table 1 below, all the components except the conductive particles were mixed and fully dispersed at room temperature. Then, Ag paste (average particle size 6.3 μm) was put in at the ratio in Table 1, and after sufficient stirring at room temperature, the mixture was further ground to produce a uniformly dispersed paste.
利用上述导电性粘接剂测定了如下所述的物性并收录在表1中。The following physical properties were measured using the above-mentioned conductive adhesive and are listed in Table 1.
[表1][Table 1]
Ag糊剂颗粒平均粒径：6.3μmAverage particle size of Ag paste particles: 6.3μm
氨基甲酸酯低聚物：DJE-001(制造公司：美源化学品公司)Urethane oligomer: DJE-001 (manufacturing company: Meiyuan Chemical Company)
乙氧基丙烯酸酯：丙烯酸1,1-二乙氧基乙酯Ethoxyacrylate: 1,1-diethoxyethyl acrylate
聚醚丙烯酸酯：SC-9211(制造公司：美源化学品公司)Polyether acrylate: SC-9211 (Manufacturing company: Meiyuan Chemical Company)
磷酸酯：PM-21(制造公司：日本化药)Phosphate ester: PM-21 (manufacturing company: Nippon Kayaku)
热引发剂：叔丁基过氧新癸酸酯Thermal initiator: tert-butylperoxyneodecanoate
如上述表1中所示，在本发明的粘接剂的情况下，在250℃在3分钟内能够实现再施工，在再施工温度为230℃以上时在3分钟内显示非常优异的特性，与再施工作业性同时在粘接强度和凝胶时间等方面没有差异，在所有方面显示出优异的特性。As shown in Table 1 above, the adhesive of the present invention can be re-applied within 3 minutes at 250°C, and shows very excellent characteristics within 3 minutes when the re-apply temperature is 230°C or higher. There is no difference in adhesive strength, gel time, etc. as well as reworkability, and it shows excellent characteristics in all aspects.
如上所示，在本发明中，根据特定的事项与限定的实施例和附图进行了说明，但这只是为了有助于整体上本发明而提供的，本发明并不限定于上述实施例，只要是本领域技术人员，就能够基于这样的记载进行多种修改和变更。As mentioned above, the present invention has been described based on specific matters and limited embodiments and drawings. However, these are only provided to facilitate the present invention as a whole, and the present invention is not limited to the above-mentioned embodiments. Anyone skilled in the art can make various modifications and changes based on such description.
因此，本发明的思想并不限定于所说明的实施例，不仅本发明要求保护的范围，与本发明要求保护的范围均等或等价的变型全部属于本发明思想的范畴。Therefore, the idea of the present invention is not limited to the illustrated embodiments. Not only the scope of protection claimed by the invention, but also modifications that are equal or equivalent to the scope of protection claimed by the invention all belong to the scope of the idea of the invention.
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| WO2013061923A1 (en) * | 2011-10-28 | 2013-05-02 | デクセリアルズ株式会社 | Conductive adhesive, solar cell module, and method for manufacturing solar cell module |
| CN104087194A (en) * | 2006-04-26 | 2014-10-08 | 日立化成株式会社 | Adhesive tape and solar cell module using the same |
| CN104204019A (en) * | 2012-03-19 | 2014-12-10 | 汉高股份有限及两合公司 | Adhesive for solar battery back sheets |
| JP2015228457A (en) * | 2014-06-02 | 2015-12-17 | デクセリアルズ株式会社 | Conductive adhesive for solar cell, solar cell module, and manufacturing method of solar cell module |
| CN108676520A (en) * | 2011-09-06 | 2018-10-19 | 日立化成株式会社 | Anisotropically conducting adhesive, the application of adhesive composite and connector |
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| CN104087194A (en) * | 2006-04-26 | 2014-10-08 | 日立化成株式会社 | Adhesive tape and solar cell module using the same |
| CN108676520A (en) * | 2011-09-06 | 2018-10-19 | 日立化成株式会社 | Anisotropically conducting adhesive, the application of adhesive composite and connector |
| WO2013061923A1 (en) * | 2011-10-28 | 2013-05-02 | デクセリアルズ株式会社 | Conductive adhesive, solar cell module, and method for manufacturing solar cell module |
| CN104204019A (en) * | 2012-03-19 | 2014-12-10 | 汉高股份有限及两合公司 | Adhesive for solar battery back sheets |
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