CN115228864A - Cleaning disc for spin-coating waste liquid collecting cup and spin-coating device - Google Patents
Cleaning disc for spin-coating waste liquid collecting cup and spin-coating device Download PDFInfo
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- CN115228864A CN115228864A CN202211076533.9A CN202211076533A CN115228864A CN 115228864 A CN115228864 A CN 115228864A CN 202211076533 A CN202211076533 A CN 202211076533A CN 115228864 A CN115228864 A CN 115228864A
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- spin
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- waste liquid
- collecting cup
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- 239000007788 liquid Substances 0.000 title claims abstract description 275
- 238000004140 cleaning Methods 0.000 title claims abstract description 198
- 239000002699 waste material Substances 0.000 title claims abstract description 153
- 238000004528 spin coating Methods 0.000 title claims abstract description 131
- 238000005507 spraying Methods 0.000 claims abstract description 9
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 239000000872 buffer Substances 0.000 claims description 31
- 239000007921 spray Substances 0.000 claims description 25
- 230000000903 blocking effect Effects 0.000 claims description 21
- 239000003292 glue Substances 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 8
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 4
- 238000005406 washing Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 33
- 230000000694 effects Effects 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000003139 buffering effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a spin-coating waste liquid collecting cup cleaning disc and a spin-coating device, wherein a wafer bearing seat and a cleaning liquid spraying seat arranged on the peripheral side of the wafer bearing seat are arranged in a spin-coating waste liquid collecting cup; spin coating waste liquid collection cup washs dish includes: the cleaning disc base is arranged on the wafer bearing seat and covers the top surface of the wafer bearing seat; keep off liquid subassembly, keep off liquid subassembly and center on wasing a set base, keep off and be provided with the dashpot on the liquid subassembly, the dashpot setting is in the one side that is close to the washing liquid and spouts the seat, and the dashpot sets up around wasing a set base, keeps off the liquid subassembly and sets up the liquid outlet of intercommunication dashpot, and the liquid outlet is towards spin coating waste liquid collection cup. The invention effectively solves the problem that redundant photoresist and developing solution splash into the spin-coating waste liquid collecting cup in the spin-coating process and are inconvenient to clean.
Description
Technical Field
The invention relates to the field of wafers in the semiconductor industry, in particular to a spin-coating waste liquid collecting cup cleaning disc and a spin-coating device.
Background
Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, which is a basic material for manufacturing chips. With the development of wafer manufacturing technology in the semiconductor industry, the circuit structure of the chip tends to be complex, and the difficulty of processing the chip also gradually increases.
In the spin coating process of the wafer, the wafer is placed on the bearing seat to rotate, and the photoresist and the developing solution inevitably splash to the surface of the spin coating waste liquid collecting cup. When the rotating speed of a motor of the bearing seat is changed due to different process requirements, redundant photoresist or developing solution splashes out of a fan-shaped circumference in the spin-coating process, so that a spin-coating waste liquid collecting cup at the top is polluted, and if the cleaning is not timely, the pollution of a wafer is caused; and the dirt splashed on the inner side of the spin-coating waste liquid collecting cup is inconvenient to clean.
Disclosure of Invention
Therefore, the embodiment of the invention provides a cleaning disc for a spin-coating waste liquid collecting cup and a spin-coating device, which effectively solve the problem that redundant photoresist and developing solution splash into the spin-coating waste liquid collecting cup in a spin-coating process and are inconvenient to clean.
On one hand, the embodiment of the invention provides a cleaning disc for a spin-coating waste liquid collecting cup, wherein a wafer bearing seat and a cleaning liquid spraying seat arranged on the peripheral side of the wafer bearing seat are arranged in the spin-coating waste liquid collecting cup, and before the spin-coating waste liquid collecting cup is cleaned, the wafer is replaced by the cleaning disc for the spin-coating waste liquid collecting cup and the cleaning disc is arranged on the wafer bearing seat; spin coating waste liquid collection cup washs dish includes: the cleaning disc base is arranged on the wafer bearing seat and covers the top surface of the wafer bearing seat; keep off the liquid subassembly, keep off the liquid subassembly and center on wash a set base, be provided with the dashpot on keeping off the liquid subassembly, the dashpot sets up and is being close to one side that the cleaning solution spouts the seat, just the dashpot centers on wash a set base setting, it has seted up the intercommunication to keep off the liquid subassembly the liquid outlet of dashpot, the liquid outlet orientation the inner wall of cup is collected to the spin coating waste liquid.
Compared with the prior art, the technical effect achieved after the technical scheme is adopted is as follows: after being blocked by the spin-coating waste liquid collecting cup cleaning disc, cleaning liquid sprayed by the cleaning liquid spray seat cannot be sprayed out of the top of the spin-coating waste liquid collecting cup, but can be guided to the side face of the spin-coating waste liquid collecting cup cleaning disc, so that the inner wall of the spin-coating waste liquid collecting cup is cleaned; when the spin-coating waste liquid collecting cup is internally provided with a plurality of layers of shells, the cleaning liquid sprayed by the cleaning liquid spraying seat is turned by the cleaning disc of the spin-coating waste liquid collecting cup, so that the cleaning liquid can be prevented from being blocked by the plurality of layers of shells; the buffer tank can buffer the cleaning liquid, so that the cleaning liquid sprayed out of the cleaning liquid spray seat can not contact the spin-coating waste liquid collecting cup in a concentrated water column state, and the cleaning liquid can be sprayed out according to the shape of the liquid outlet, so that the effect of uniformly cleaning the inner wall of the spin-coating waste liquid collecting cup is achieved; through spin coating waste liquid collecting cup washs the dish and realizes right the washing of spin coating waste liquid collecting cup inner wall, before wasing spin coating waste liquid collecting cup need not to dismantle, therefore the cleaning process is more convenient.
Further, the liquid blocking assembly comprises: a first baffle plate; the connecting plate is connected with the first baffle and the cleaning disc base; the second baffle is arranged on the first baffle and is positioned on one side far away from the connecting plate; the buffer groove is formed among the second baffle, the first baffle and the connecting plate.
The technical effect achieved after the technical scheme is adopted is as follows: the first baffle is used for preventing cleaning liquid from being sprayed out of the top of the spin-coating waste liquid collecting cup; the second baffle enables the cleaning liquid to generate reflux to a certain degree, the amount of the cleaning liquid entering the liquid outlet is increased, the cleaning liquid is prevented from splashing through the first baffle and directly contacting the lower side part of the spin-coating waste liquid collecting cup, and the spin-coating waste liquid collecting cup cannot be effectively cleaned; the cleaning liquid flows along the connecting plate, the first baffle and the second baffle to realize buffering.
Further, the liquid blocking assembly further comprises: the guide plate is arranged on one side, away from the liquid blocking groove, of the first baffle; the guide plate is inclined relative to the first baffle plate, and the liquid outlet is positioned between the guide plate and the first baffle plate.
The technical effect achieved after the technical scheme is adopted is as follows: the guide plate is inclined, so that the liquid outlet faces the inner wall of the spin-coating waste liquid collecting cup, and cleaning liquid is prevented from being sprayed out of the top of the spin-coating waste liquid collecting cup; a flat liquid outlet is formed between the guide plate and the first baffle, and the cleaning liquid forms a fan-shaped water curtain from the liquid outlet jet outlet, so that the inner wall of the spin-coating waste liquid collecting cup can be uniformly cleaned.
Furthermore, a plurality of deflectors circumference distribute in first baffle keeps away from keep off the one side of cistern, form a plurality of the liquid outlet.
The technical effect achieved after the technical scheme is adopted is as follows: the inner wall of the spin-coating waste liquid collecting cup can be comprehensively cleaned through the plurality of liquid outlets; the direction of liquid outlet can with the inner wall of spin-coating waste liquid collection cup is perpendicular, and the washing liquid contacts perpendicularly the inner wall of spin-coating waste liquid collection cup, and the impact force is bigger, and the cleaning performance is better.
Furthermore, the second baffle is inclined relative to the first baffle, and one end of the second baffle, which is far away from the first baffle, is close to the cleaning solution spraying seat.
The technical effect achieved after the technical scheme is adopted is as follows: the second baffle plate has a buffering effect on the cleaning liquid sprayed out of the cleaning liquid spray seat, one part of the cleaning liquid is sprayed out of the liquid outlet and used for cleaning the inner wall of the spin-coating waste liquid collecting cup, and the other part of the cleaning liquid flows downwards along the second baffle plate and used for cleaning the rest of the multilayer shells in the spin-coating waste liquid collecting cup.
Furthermore, the distance between one end of the connecting plate connected with the first baffle and the central axis of the cleaning disc of the spin-coating waste liquid collecting cup is L1, the distance between one end of the connecting plate connected with the base of the cleaning disc and the central axis of the cleaning disc of the spin-coating waste liquid collecting cup is L2, wherein L1 is larger than L2.
The technical effect achieved after the technical scheme is adopted is as follows: the connecting plate can guide cleaning liquid into the buffer tank; the connecting plate and the cleaning disc base are formed with a groove at one side far away from the wafer bearing seat, so that the weight of the cleaning disc of the spin-coating waste liquid collecting cup can be reduced, the cleaning disc of the spin-coating waste liquid collecting cup is convenient to clamp and carry, and the cleaning disc is placed in the spin-coating waste liquid collecting cup.
On the other hand, an embodiment of the present invention further provides a spin coating apparatus, including the spin-coating waste liquid collecting cup cleaning disk provided in any of the above embodiments, the spin coating apparatus further includes: the spin-coating waste liquid collecting cup is internally provided with a glue homogenizing cavity; the wafer bearing seat is arranged in the glue homogenizing cavity and is used for bearing the cleaning disc of the spin-coating waste liquid collecting cup; the cleaning solution spraying seat is arranged on the peripheral side of the wafer bearing seat and faces the buffer tank.
The technical effect achieved after the technical scheme is adopted is as follows: the spin coating device replaces the wafer on the wafer bearing seat with the spin coating waste liquid collecting cup cleaning disc, the cleaning liquid spraying seat is opened, the cleaning liquid is buffered through the buffer groove, and the inner wall of the spin coating waste liquid collecting cup is cleaned through the liquid outlet.
Further, the spin coating waste liquid collecting cup further comprises: a first opening capable of receiving the spin-on waste collection cup cleaning tray; and the position of the liquid outlet, which corresponds to the inner wall of the spin-coating waste liquid collecting cup, is lower than the edge of the first opening.
The technical effect achieved after the technical scheme is adopted is as follows: the first opening is convenient for the spin-coating waste liquid collecting cup cleaning disc to be filled in, and the liquid outlet can guide cleaning liquid to avoid the cleaning liquid to be sprayed out from the first opening.
Further, the spin coating apparatus further includes: the second shell is positioned in the spin-coating waste liquid collecting cup, and forms a second opening surrounding the wafer bearing seat; wherein a liquid drainage channel is formed between the spin-coating waste liquid collecting cup and the second shell.
The technical effect achieved after the technical scheme is adopted is as follows: the cleaning solution is guided by a cleaning disc of the spin-coating waste liquid collecting cup, so that the second shell is bypassed, and the spin-coating waste liquid collecting cup is cleaned; meanwhile, a part of cleaning solution slides into the upper surface of the second shell along the buffer groove, so that the upper surface of the second shell is cleaned; the cleaning liquid after cleaning the spin-coating waste liquid collecting cup and the second housing may be discharged from the liquid discharge passage.
Further, the spin-coating waste liquid collecting cup cleaning disc is arranged between the first opening and the second opening; wherein the diameter of the cleaning disc of the spin-coating waste liquid collecting cup is larger than that of the second opening.
The technical effect achieved after the technical scheme is adopted is as follows: and the cleaning liquid flows to the upper surface of the second shell along the second baffle after being guided by the buffer groove, and does not flow back to the space where the cleaning liquid spray seat is located.
In summary, the above embodiments of the present application may have one or more of the following advantages or beneficial effects: i) Cleaning liquid sprayed out of the cleaning liquid spray seat is blocked by the spin-coating waste liquid collecting cup cleaning disc, and then is not sprayed out of the first opening at the top of the spin-coating waste liquid collecting cup, but can be guided to the side surface of the spin-coating waste liquid collecting cup cleaning disc, so that the inner wall of the spin-coating waste liquid collecting cup is cleaned; ii) the cleaning liquid sprayed by the cleaning liquid spray seat is turned by the buffer groove and the liquid outlet, so that the cleaning liquid can be prevented from being blocked by the second shell; iii) The buffer tank can buffer the cleaning liquid, so that the cleaning liquid sprayed by the cleaning liquid spray seat can not contact the spin-coating waste liquid collecting cup in a concentrated water column state, and the cleaning liquid can be sprayed out according to a flat liquid outlet formed between the guide plate and the first baffle plate to form a fan-shaped water curtain, so that the effect of uniformly cleaning the inner wall of the spin-coating waste liquid collecting cup is achieved; iv) a part of the cleaning liquid is sprayed out from the liquid outlet and used for cleaning the inner wall of the spin-coating waste liquid collecting cup, and the other part of the cleaning liquid flows downwards along the second baffle and is used for cleaning the upper surface of the second shell; v) the inner wall of the spin-coating waste liquid collecting cup is cleaned through the spin-coating waste liquid collecting cup cleaning disc, and the spin-coating waste liquid collecting cup does not need to be detached before cleaning, so that the cleaning process is more convenient.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural view of a cleaning disk for a spin-on waste collection cup according to a first embodiment of the present invention.
FIG. 2 is a schematic view of another aspect of the spin-on waste collection cup cleaning tray of FIG. 1.
Fig. 3 isbase:Sub>A sectional view taken alongbase:Sub>A-base:Sub>A in fig. 2.
Fig. 4 is a schematic structural diagram of a spin coating apparatus according to a second embodiment of the present invention.
FIG. 5 is a schematic view of the spin coating apparatus shown in FIG. 4 from another perspective.
Fig. 6 is a sectional view taken along the line B-B in fig. 5.
Description of the main element symbols:
100 is a spin-coating waste liquid collecting cup cleaning disc; 110 is a cleaning disc base; 120 is a liquid blocking component; 121 is a buffer groove; 122 is a liquid outlet; 123 is a first baffle plate; 124 is a connecting plate; 125 is a second baffle; 126 is a guide plate; 200 is a spin coating device; 210 is a spin coating waste liquid collecting cup; 211 is a first opening; 212 is a first liquid blocking rib; 220 is a wafer carrier; 230 is a cleaning solution spray seat; 240 is a second housing; 241 is a second opening; 242 is a liquid discharge channel; 243 is a ring-shaped limiting piece; 244 is a second dam bar; 250 is a liquid discharge base; 251 is a liquid discharge groove; 252 is a second support; 260 is a back spray plate; 261 is a first support.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
[ first embodiment ] A
Referring to fig. 1 to 6, a cleaning disc 100 for a spin-on waste collection cup according to a first embodiment of the present invention includes a wafer holder 220 and a cleaning solution sprayer 230 disposed around the wafer holder 220, the wafer holder 220 is replaced by the spin-on waste collection cup 100 before the spin-on waste collection cup 210 is cleaned; the spin-on waste liquid collecting cup cleaning tray 100 includes: a cleaning tray base 110, wherein the cleaning tray base 110 is arranged on the wafer bearing seat 220 and covers the top surface of the wafer bearing seat 220; the liquid blocking component 120, the liquid blocking component 120 surrounds the cleaning disc base 110, a buffer groove 121 is disposed on the liquid blocking component 120, the buffer groove 121 is disposed on one side close to the cleaning liquid spray seat 230, the buffer groove 121 surrounds the cleaning disc base 110, a liquid outlet 122 communicating with the buffer groove 121 is disposed on the liquid blocking component 120, and the liquid outlet 122 faces the inner wall of the spin-coating waste liquid collecting cup 210.
In this embodiment, the cleaning solution sprayed from the cleaning solution spray base 230 is blocked by the spin-on waste collection cup cleaning tray 100, and then is not sprayed from the top of the spin-on waste collection cup 210, but is guided to the side of the spin-on waste collection cup cleaning tray 100, so as to clean the inner wall of the spin-on waste collection cup 210; when the spin-on waste liquid collecting cup 210 is provided with a plurality of layers of shells, the cleaning liquid sprayed by the cleaning liquid spray seat 230 is turned by the spin-on waste liquid collecting cup cleaning disc 100, so that the cleaning liquid can be prevented from being blocked by the plurality of layers of shells; the buffer tank 121 can buffer the cleaning solution, so that the cleaning solution sprayed from the cleaning solution spray base 230 does not contact the spin-on waste liquid collecting cup 210 in a concentrated water column state, and the cleaning solution can be sprayed out according to the shape of the liquid outlet 122, thereby achieving the effect of uniformly cleaning the inner wall of the spin-on waste liquid collecting cup 210; the inner wall of the spin-coating waste liquid collecting cup 210 is cleaned by the spin-coating waste liquid collecting cup cleaning disc 100, and the spin-coating waste liquid collecting cup 210 does not need to be detached before cleaning, so that the cleaning process is more convenient.
In a particular embodiment, the liquid baffle assembly 120 includes, for example: a first baffle 123; the connecting plate 124, the connecting plate 124 connects the first baffle 123 and the wash tray base 110; the second baffle 125, the second baffle 125 is disposed on the first baffle 123 and is located at a side far from the connecting plate 124; the buffer groove 121 is formed between the second barrier 125, the first barrier 123, and the connection plate 124. Wherein, the first baffle 123 is used for preventing the cleaning liquid from being sprayed out from the top of the sprayed spin-coating waste liquid collecting cup 210; the second baffle 125 enables the cleaning solution to flow back to a certain degree, so that the amount of the cleaning solution entering the liquid outlet 122 is increased, and the cleaning solution is prevented from splashing through the first baffle 123 to directly contact the lower part of the spin-coating waste liquid collecting cup 210, so that the spin-coating waste liquid collecting cup 210 cannot be effectively cleaned; the cleaning liquid flows along the connection plate 124, the first barrier 123 and the second barrier 125 to achieve buffering.
Preferably, the first baffle 123 may be horizontally disposed, so as to increase the width of the buffer tank 121, so that the buffer tank 121 can buffer more cleaning solution, increase the amount of the cleaning solution guided from the solution outlet 122 to the inner wall of the spin-on waste liquid collecting cup 210, and improve the cleaning effect.
Preferably, the liquid outlet 122 may be circular or square, and is not limited herein.
In a particular embodiment, the liquid stop assembly 120 further comprises, for example: the guide plate 126 is arranged on one side, away from the liquid blocking groove, of the first baffle plate 123; wherein the guiding plate 126 is inclined relative to the first baffle 123, and the liquid outlet 122 is located between the guiding plate 126 and the first baffle 123, so that the liquid outlet 122 faces the inner wall of the spin-coating waste liquid collecting cup 210, and the cleaning liquid is prevented from being sprayed out from the top of the spin-coating waste liquid collecting cup 210; a flat liquid outlet 122 is formed between the guide plate 126 and the first baffle 123, and a fan-shaped water curtain is formed by the cleaning liquid from the outlet 122, so that the inner wall of the spin-coating waste liquid collecting cup 210 can be cleaned uniformly.
Preferably, the connection between the guide plate 126 and the first blocking plate 123 can be hinged or screwed, so as to adjust the angle between the guide plate 126 and the first blocking plate 123, and lock at any angle, thereby changing the spraying direction of the cleaning liquid from the liquid outlet 122.
In a specific embodiment, a plurality of guiding plates 126 are circumferentially distributed on a side of the first baffle 123 away from the liquid blocking groove to form a plurality of liquid outlets 122. One end of each guide plate 126, which is close to the center of the spin-on waste liquid collecting cup cleaning disc 100, is connected to the first baffle 123, so that the cleaning liquid sprayed from the plurality of liquid outlets 122 is radially outwardly dispersed, and the inner wall of the spin-on waste liquid collecting cup 210 is completely cleaned; moreover, the direction of the liquid outlet 122 can be perpendicular to the inner wall of the spin-on waste liquid collecting cup 210, and the cleaning liquid vertically contacts the inner wall of the spin-on waste liquid collecting cup 210, so that the impact force is larger, and the cleaning effect is better.
In a specific embodiment, the second shutter plate 125 is inclined with respect to the first shutter plate 123, and an end of the second shutter plate 125 remote from the first shutter plate 123 is close to the cleaning liquid spray base 230. The second baffle 125 buffers the cleaning solution sprayed from the cleaning solution spray base 230, a portion of the cleaning solution is sprayed from the liquid outlet 122 to clean the inner wall of the spin-on waste liquid collecting cup 210, and another portion of the cleaning solution flows downward along the second baffle 125 to clean the remaining multi-layer shells in the spin-on waste liquid collecting cup 210.
In a specific embodiment, the end of the connecting plate 124 connected to the first baffle 123 is located at a distance L1 from the central axis of the spin-on waste collection cup cleaning tray 100, and the end of the connecting plate 124 connected to the cleaning tray base 110 is located at a distance L2 from the central axis of the spin-on waste collection cup cleaning tray 100, where L1 > L2, so that the connecting plate 124 can guide the cleaning liquid into the buffer tank 121.
Preferably, the connecting plate 124 and the cleaning tray base 110 are formed with a groove on a side away from the wafer carrier 220, so that the weight of the spin-on waste collection cup cleaning tray 100 can be reduced, the spin-on waste collection cup cleaning tray 100 can be held and carried conveniently, and the spin-on waste collection cup can be placed in the spin-on waste collection cup 210.
[ second embodiment ]
Referring to fig. 3 to 6, a spin coating apparatus 200 according to a second embodiment of the present invention includes the spin coating waste liquid collecting cup cleaning tray 100 according to any of the embodiments, and the spin coating apparatus 200 further includes: the spin-coating waste liquid collecting cup 210 is provided with a glue homogenizing cavity inside; the wafer bearing seat 220 is arranged in the glue homogenizing cavity and used for bearing the spin-coating waste liquid collecting cup cleaning disc 100; the cleaning solution nozzle 230 is disposed around the wafer susceptor 220, and the cleaning solution nozzle 230 faces the buffer tank 121.
It should be noted that, the spin coating apparatus 200 replaces the wafer on the wafer carrier 220 with the spin coating waste liquid collecting cup cleaning tray 100, and fixes the spin coating waste liquid collecting cup cleaning tray 100 on the wafer carrier 220 in a vacuum adsorption or electrostatic adsorption manner, at this time, the cleaning liquid spray base 230 is opened, the cleaning liquid is buffered by the buffer tank 121, and the inner wall of the spin coating waste liquid collecting cup 210 is cleaned by the liquid outlet 122.
In a specific embodiment, the spin-on waste collection cup 210 further comprises, for example: a first opening 211, the first opening 211 being capable of accommodating the spin-on waste collecting cup cleaning tray 100; the outlet 122 is located at a position corresponding to the inner wall of the spin-on waste collecting cup 210, lower than the first opening 211. The first opening 211 facilitates the loading of the spin-on waste collecting cup cleaning tray 100, and the liquid outlet 122 can guide the cleaning liquid to prevent the cleaning liquid from being ejected from the first opening 211.
Preferably, the spin-on waste liquid collecting cup 210 further comprises a first liquid blocking rib 212, the first liquid blocking rib 212 surrounds the first opening 211 and faces the glue homogenizing cavity, and the first liquid blocking rib 212 is used for blocking the cleaning liquid on the inner wall of the spin-on waste liquid collecting cup 210 from splashing to the upper side of the spin-on waste liquid collecting cup cleaning disc 100, so that the upper side of the spin-on waste liquid collecting cup cleaning disc 100 is polluted.
In a specific embodiment, the spin coating apparatus 200 further comprises, for example: a second housing 240, the second housing 240 being located in the spin-on waste collecting cup 210, the second housing 240 forming a second opening 241 surrounding the wafer carrier 220. Wherein the cleaning solution is guided by the spin-on waste collection cup cleaning tray 100, thereby bypassing the second housing 240 and cleaning the spin-on waste collection cup 210; meanwhile, a part of the cleaning solution slides into the upper surface of the second housing 240 along the buffer tank 121, so that the upper surface of the second housing 240 is cleaned.
Preferably, the spin-on waste collection cup cleaning tray 100 is disposed between the first opening 211 and the second opening 241; wherein the diameter of the spin-on waste collection cup cleaning disk 100 is larger than the diameter of the second opening 241. The cleaning solution is guided by the buffer tank 121 and flows along the second baffle 125 to the upper surface of the second housing 240, without flowing back to the space where the cleaning solution nozzle 230 is located.
Preferably, the second housing 240 further comprises a second liquid blocking rib 244, for example, the second liquid blocking rib 244 is convexly disposed around the second opening 241 and faces the spin-on waste collecting cup cleaning tray 100, and the second liquid blocking rib 244 is used for further preventing the cleaning liquid guided to the second housing 240 by the buffer tank 121 from entering the space where the cleaning liquid spray base 230 is located from the second opening 241.
Preferably, a drain passage 242 is formed between the spin-on waste collection cup 210 and the second housing 240, wherein the cleaning liquid after cleaning the spin-on waste collection cup 210 and the second housing 240 can be drained from the drain passage 242.
In a specific embodiment, the spin coating apparatus 200 further comprises, for example: the liquid discharge base 250 is provided with a liquid discharge groove 251, the top of the liquid discharge base 250 is sleeved outside the spin-coating waste liquid collecting cup 210, so that the cleaning liquid flowing down from the inner wall of the spin-coating waste liquid collecting cup 210 can completely enter the liquid discharge groove 251.
Preferably, the second housing 240 extends into the drain groove 251 so that the drain passage 242 communicates with the drain groove 251. The drainage base 250 further includes at least one drainage tube, which is communicated with the drainage groove 251 and is used for guiding out the cleaning liquid collected by the drainage groove 251. For example, the drainage pipes are located on two opposite sides of the drainage groove 251, and may be disposed along the circumferential direction of the drainage groove 251; the bottom surface of the drain groove 251 is inclined downward on the side near the drain pipe to facilitate the drainage of the cleaning solution.
Preferably, the spin coating apparatus 200 further includes, for example: the back spray plate 260, the back spray plate 260 is used for installing the cleaning solution spray seat 230, and the center of the back spray plate 260 is provided with a driving through hole for passing through the wafer bearing seat 220. Wherein, the periphery of the back spray plate 260 is surrounded by a first supporting member 261, the inner side of the liquid discharge base 250 is surrounded by a second supporting member 252, and the second supporting member 252 is matched with the top surface and the side surface of the first supporting member 261, so as to realize the rapid assembly of the liquid discharge base 250 and the back spray plate 260.
Further, two annular limiting members 243 are concentrically disposed at the bottom of the second housing 240, wherein the second housing 240 is disposed on the second supporting member 252, and the two annular limiting members 243 are clamped on the inner side and the outer side of the second supporting member 252, so as to achieve positioning and rapid assembly of the second housing 240.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A cleaning disc for a spin-coating waste liquid collecting cup is characterized in that a wafer bearing seat and a cleaning liquid spraying seat arranged on the peripheral side of the wafer bearing seat are arranged in the spin-coating waste liquid collecting cup, and before cleaning, the spin-coating waste liquid collecting cup replaces a wafer and is arranged on the wafer bearing seat;
spin coating waste liquid collection cup washs dish includes:
the cleaning disc base is arranged on the wafer bearing seat and covers the top surface of the wafer bearing seat;
keep off the liquid subassembly, it centers on to keep off the liquid subassembly wash a set base, it is provided with the dashpot on the liquid subassembly to keep off, the dashpot sets up and is being close to wash one side of liquid spray seat, just the dashpot centers on wash a set base setting, it has seted up the intercommunication to keep off the liquid subassembly the liquid outlet of dashpot, the liquid outlet orientation the inner wall of cup is collected to the spin coating waste liquid.
2. The spin-on waste collection cup cleaning disk of claim 1, wherein the liquid barrier assembly comprises:
a first baffle plate;
the connecting plate is connected with the first baffle and the cleaning disc base;
the second baffle is arranged on the first baffle and is positioned on one side far away from the connecting plate;
wherein the buffer slot is formed among the second baffle, the first baffle and the connecting plate.
3. The spin-on waste collection cup cleaning disk of claim 2, wherein the liquid stop assembly further comprises:
the guide plate is arranged on one side, away from the liquid blocking groove, of the first baffle;
the guide plate is inclined relative to the first baffle plate, and the liquid outlet is positioned between the guide plate and the first baffle plate.
4. The spin-on waste liquid collecting cup cleaning disk as claimed in claim 3, wherein a plurality of guiding plates are circumferentially disposed on a side of the first baffle plate away from the liquid retaining groove to form a plurality of liquid outlets.
5. The spin-on effluent collecting cup cleaning disk of claim 2 wherein said second baffle is inclined with respect to said first baffle and an end of said second baffle remote from said first baffle is proximate to said cleaning solution spray base.
6. The cleaning disc of claim 2, wherein the end of the connecting plate connected to the first baffle is at a distance L1 from the central axis of the cleaning disc, and the end of the connecting plate connected to the base of the cleaning disc is at a distance L2 from the central axis of the cleaning disc, where L1 > L2.
7. A spin coating apparatus comprising the spin-coating waste liquid collecting cup cleaning tray according to any one of claims 1 to 6, the spin coating apparatus further comprising:
the spin-coating waste liquid collecting cup is internally provided with a glue homogenizing cavity;
the wafer bearing seat is arranged in the glue homogenizing cavity and is used for bearing the spin-coating waste liquid collecting cup cleaning disc;
the cleaning solution spraying seat is arranged on the peripheral side of the wafer bearing seat and faces the buffer tank.
8. The spin coating apparatus of claim 7, wherein the spin coating waste collection cup further comprises:
a first opening capable of receiving the spin-on waste collection cup cleaning tray;
wherein, the position of the liquid outlet corresponding to the inner wall of the spin-coating waste liquid collecting cup is lower than the first opening.
9. The spin-coating apparatus of claim 8, further comprising:
the second shell is positioned in the spin-coating waste liquid collecting cup, and forms a second opening surrounding the wafer bearing seat;
wherein a drainage channel is formed between the spin-on waste liquid collecting cup and the second housing.
10. The spin coating apparatus of claim 9, wherein the spin-coating waste collection cup cleaning tray is disposed between the first opening and the second opening;
the diameter of the cleaning disc of the spin-coating waste liquid collecting cup is larger than that of the second opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211076533.9A CN115228864B (en) | 2022-09-05 | 2022-09-05 | Spin-coating waste liquid collecting cup cleaning disc and spin-coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211076533.9A CN115228864B (en) | 2022-09-05 | 2022-09-05 | Spin-coating waste liquid collecting cup cleaning disc and spin-coating device |
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| Publication Number | Publication Date |
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| CN115228864A true CN115228864A (en) | 2022-10-25 |
| CN115228864B CN115228864B (en) | 2024-08-30 |
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| CN202211076533.9A Active CN115228864B (en) | 2022-09-05 | 2022-09-05 | Spin-coating waste liquid collecting cup cleaning disc and spin-coating device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117153740A (en) * | 2023-10-31 | 2023-12-01 | 宁波润华全芯微电子设备有限公司 | Wafer processing device |
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| US20160288175A1 (en) * | 2013-11-20 | 2016-10-06 | Nilfisk A/S | Cleaning device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117153740B (en) * | 2023-10-31 | 2024-02-09 | 宁波润华全芯微电子设备有限公司 | Wafer processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115228864B (en) | 2024-08-30 |
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