CN115224554A - Signal switching device, method and test system - Google Patents

Abstract

A signal switching device, method and test system are provided. The signal switching device includes: a first terminal group, used for connecting with a testing device; a second terminal group, used for connecting with a tested module; a conversion module, respectively connected with the first terminal group and the second terminal group, and the conversion module uses It adjusts the mapping relationship between the terminals in the first terminal group and the second terminal group, and converts the level of the signal transmitted between the first terminal group and the second terminal group. In the embodiment of the present application, by adjusting the mapping relationship between the terminals in the first terminal group and the second terminal group, and converting the level of the signal transmitted between the first terminal group and the second terminal group, the module under test can be connected to the The matching of the interface mapping relationship of the test device and the conversion of the signal level of the interface help to improve the versatility of the signal switching device.

Description

A signal switching device, method and test system

technical field

The present application relates to the technical field of testing, and more particularly, to a signal switching device, method and testing system.

Background technique

In the process of product development and production, test equipment is usually used to test the function and performance of each module to ensure the performance of the product. However, due to different manufacturers and other reasons, the definition of the same module interface under test is not uniform. In addition, with the development of semiconductor technology, the level types of the interface of the module under test are increasing. The interface level of the module under test may not match the signal level of the test device.

SUMMARY OF THE INVENTION

The present application provides a signal switching device, method and testing system. Various aspects involved in the embodiments of the present application will be introduced below.

In a first aspect, a signal switching device is provided. The signal switching device includes: a first terminal group, used for connecting with a testing device; a second terminal group, used for connecting with a tested module; a conversion module, respectively connected with the first terminal group and the second terminal group, and the conversion module uses It adjusts the mapping relationship between the terminals in the first terminal group and the second terminal group, and converts the level of the signal transmitted between the first terminal group and the second terminal group.

In a second aspect, a signal switching method is provided. The signal transfer method is applied to a signal transfer device, the signal transfer device includes a first terminal group, a second terminal group and a conversion module, the first terminal group is used for connecting with the test device, and the second terminal group is used for connecting with the module under test connected, the method is performed by the conversion module, and the signal transfer method includes: adjusting the mapping relationship between the terminals in the first terminal group and the second terminal group; flat to convert.

In a third aspect, a testing system is provided. The testing system includes a testing device and the signal switching device according to the first aspect.

In the embodiment of the present application, by adjusting the mapping relationship between the terminals in the first terminal group and the second terminal group, and converting the level of the signal transmitted between the first terminal group and the second terminal group, the module under test can be connected to the The matching of the interface mapping relationship of the test device and the conversion of the signal level of the interface help to improve the versatility of the signal switching device.

Description of drawings

FIG. 1 is a schematic structural diagram of a signal switching device according to an embodiment of the present application.

FIG. 2 is a schematic structural diagram of another signal switching device according to an embodiment of the present application.

FIG. 3 is a schematic structural diagram of another signal switching device provided by an embodiment of the present application.

FIG. 4 is a schematic circuit diagram of the signal switching device in FIG. 3 .

FIG. 5 is a working principle diagram of the s1S1 unit in the MOS transistor array supporting the level conversion in FIG. 4 .

FIG. 6 is a schematic structural diagram of still another signal switching device provided by an embodiment of the present application.

FIG. 7 is a schematic structural diagram of a testing system provided by an embodiment of the present application.

FIG. 8 is a schematic flowchart of a signal switching method provided by an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments.

With the development of technology, products are becoming more and more modular. Therefore, a product may consist of multiple modules. In the process of product development and production, the function and performance test of each module is usually carried out first, and then the product assembly and debugging are carried out to ensure the performance of the product.

In order to facilitate testing, a corresponding testing device can be built for each module. Among them, the test device may have a test interface, which is convenient for connecting and disconnecting with the module under test.

Due to the different manufacturers of the tested modules and other reasons, the definitions of the same type of tested module interfaces are not uniform. For example, the interface of the module under test is composed of 32 terminals, but the signals transmitted by the terminals with the same serial number may be different. As an example, mobile phone products generally include camera modules, display modules, and the like. With the continuous emergence of new camera modules and display modules, the interface between the camera module and the test device, and the definition of the interface pins (Pin) between the display module and the test device may be different. Therefore, the test device cannot directly test the camera module and the display screen module.

In addition, with the development of semiconductor technology, the level types of the interface of the module under test are increasing. The interface level of the test device is fixed, so the interface level of the module under test may be inconsistent with the signal level of the test device. For example, the interface level of the test device is 1.8V, the interface level of some modules under test is 1.8V, and the interface level of other modules under test is 1.5V. Therefore, the test device can directly test the module under test whose interface level is 1.8V, but cannot test the module under test whose interface level is 1.5V.

In view of the above two situations, the test of the module under test is usually supported by making a flexible printed circuit (Flexible Printed Circuit, FPC) adapter board or a new test device. However, the FPC adapter board and the new test device can only adapt to one defined interface or one interface level, and cannot adapt to multiple defined interfaces and/or multiple interface levels. At this time, it may be necessary to continuously invest manpower and material resources in the design of the adapter board or the test device, thereby affecting the production cycle of the product or the development progress of the project.

In order to solve the above problem, an embodiment of the present application provides a signal switching device. The device can realize the matching of the interface mapping relationship between the tested module and the test device and the conversion of the signal level of the interface at the same time, which helps to improve the versatility of the signal switching device.

FIG. 1 is a schematic structural diagram of a signal switching device according to an embodiment of the present application. The signal switching device 100 is used for switching the signal between the module under test and the testing device. The position of the signal switching device 100 can be flexibly set according to the usage requirements. As an implementation manner, the signal switching device 100 and the testing device may be provided on the same hardware main body.

Referring to FIG. 1 , the signal switching device 100 includes a first terminal group 110 , a conversion module 120 and a second terminal group 130 .

The first terminal group 110 can be connected with the testing device to realize various functions. For example, the first terminal group 110 may be used to receive signals from the testing device, and may also be used to transmit signals sent by the module under test to the testing device.

The first terminal group 110 may include a plurality of terminals. The number of multiple terminals may be determined by the number of terminals in the interface of the module under test. For example, the number of multiple terminals can be the same as the number of terminals in the interface of the module under test. For another example, the number of multiple terminals may be greater than the number of terminals in the interface of the module under test.

The first terminal group 110 may be composed of one or more interfaces. In some embodiments, the number of interfaces of the first terminal group 110 may be determined by the interfaces of the testing device. For example, if the number of interfaces of the testing device is two, the number of interfaces of the first terminal group 110 may be two. For another example, if the number of interfaces of the testing device is one, the number of interfaces of the first terminal group 110 may be one.

In some implementations, the type of interface of the first terminal group 110 may be determined by the interface type of the test device. For example, the interface type of the test device is a pin header, and the interface type of the first terminal group 110 may be a matching female header. For another example, the interface type of the testing device is a socket of a certain type of connector, and the interface type of the first terminal group 110 may be a plug of a certain type of connector that matches it.

The second terminal group 130 can be connected with the module under test to realize various functions. For example, the second terminal group 130 can receive the signal of the module under test, and can also transmit the signal sent by the testing device to the module under test. For another example, the second terminal group 130 can provide the required power for the module under test.

The second terminal group 130 may include a plurality of terminals. The number of multiple terminals may be determined by the number of terminals in the interface of the module under test. As an implementation manner, the number of multiple terminals may be the same as the number of terminals in the interface of the module under test.

The same number of terminals in the second terminal group 130 may be implemented by different types of interfaces. In some embodiments, the interface type of the second terminal group 130 may be set according to the interface type of the module under test. For example, if the module under test is a camera assembly, and the interface of the camera assembly is a board-to-board (BTB) connector soldered on a flexible circuit board, the interface of the second terminal group 130 can be configured to be connected to the BTB adapter matching interface. For another example, if the interface of the module under test is an insert in the pin connector, the interface of the second terminal group 130 may be set as a connector matching the pin connector.

The conversion module 120 may be connected with the first terminal group 110 and the second terminal group 130, respectively. The conversion module 120 may adjust the mapping relationship of the plurality of terminals in the first terminal group 110 and the second terminal group 130 . In some embodiments, the terminals of the module under test and the testing device are in one-to-one correspondence according to the pin sequence of the interface, and the conversion module 120 can control the terminals in the first terminal group 110 and the second terminal group 130 to conduct in sequence. In other embodiments, the pin definitions of the terminals of the module under test and the test device are not uniform, and the conversion module 120 may adjust the first terminal group 110 and The mapping relationship of the terminals in the second terminal group 130 . That is, the conversion module 120 can adjust the mapping relationship of the terminals in the first terminal group 110 and the second terminal group 130 to one-to-one correspondence of terminals transmitting the same signal according to the definitions of the terminals of the module under test and the testing device. For example, the first terminal in the first terminal group 110 and the third terminal in the second terminal group 130 are terminals that transmit the same signal, and the conversion module 120 may convert the first terminal and the second terminal group in the first terminal group 110 The third terminal in 130 is connected, and the signal of the third terminal in the second terminal group 130 can also be controlled to be consistent with the signal in the first terminal in the first terminal group 110 in real time.

Meanwhile, the conversion module 120 may convert the levels of signals transmitted by the plurality of terminals in the first terminal group 110 and the second terminal group 130 . That is to say, the conversion module 120 can convert the signals received by the first terminal group 110 into signals of the first preset level, and can also convert the signals received by the second terminal group 130 into signals of the second preset level. Signal. For example, the first preset level may be the same as the signal level of the test device. For another example, the second preset level may be the same as the signal level of the module under test.

In the embodiment of the present application, by adjusting the mapping relationship between the terminals in the first terminal group and the second terminal group, and converting the level of the signal transmitted between the first terminal group and the second terminal group, the module under test can be connected to the The matching of the interface mapping relationship of the test device and the conversion of the signal level of the interface help to improve the versatility of the signal transfer device, thereby saving the design time of the transfer board or the test device. Further, it is helpful to shorten the production cycle of the product or speed up the development progress of the project.

During the test process, the signal switching device can not only communicate with the module under test, but also supply power to the module under test. However, due to different manufacturers and other reasons, the power supply voltage of the tested module is not the same. In order to solve this problem, the embodiment of the present application provides another signal switching device. FIG. 2 is a schematic structural diagram of another signal switching device according to an embodiment of the present application.

Referring to FIG. 2 , the signal switching device 200 includes a first terminal group 210 , a conversion module 220 , a second terminal group 230 , a power module 240 and a control module 250 . The first terminal group 210 may be the first terminal group 110 in FIG. 1 , the conversion module 220 may be the conversion module 120 in FIG. 1 , and the second terminal group 230 may be the second terminal group 130 in FIG. 1 . It is not repeated here. The working process of the signal switching device 200 provided by the embodiment of the present application will be described in detail below with reference to the power module 240 and the control module 250 .

The power module 240 may be connected with the second terminal group 230 . In some implementations, the power module 240 may also be connected to the first terminal group 210 . For example, the first terminal group 210 includes an interface to which the power module 240 can be connected. For another example, the first terminal group 210 includes two or more interfaces, and the power module 240 may be connected to one of the interfaces.

The power supply module 240 may have a plurality of power supplies with different voltages. As an implementation, the power supply module 240 may include multiple power supplies with different voltages. For example, a plurality of power supply modules with different voltages are integrated in the power supply module 240 . As another implementation manner, the power supply module 240 may be connected to multiple power supplies with different voltages, so that the multiple power supplies provide the power supply module 240 with multiple voltages. For example, the power supply module 240 and a plurality of power supplies with different voltages may be provided in the same hardware and connected through a line. For another example, the power supply module 240 and a plurality of power supplies with different voltages may be provided on different hardware and connected through connecting wires.

The voltages of the multiple power sources connected to the power source module 240 may be determined according to the test modules matched with the test device. For example, when the test device is used for testing display screen components, the voltages of the multiple power sources may be common supply voltages for various display screen components. For another example, the testing device can be used to test both the display screen assembly and the camera assembly, and the voltages of the multiple power sources may include common power supply voltages for multiple display screen assemblies and common power supply voltages for multiple camera assemblies.

In some implementations, the voltages of the multiple power supplies connected to the power supply module 240 may also include commonly used signal levels. For example, the voltages of the multiple power supplies may include signal levels commonly used in the module under test. As another example, the plurality of supply voltages may include signal levels commonly used in test equipment.

The power module 240 may also be connected to the control module 250 . The control module 250 may control the power supply module 240 to select a power supply matching the module under test from a plurality of power supplies to supply power to the module under test. In some embodiments, the power supply voltage of the module under test is 5V, and the control module 250 may control the power supply with a voltage of 5V to supply power to the module under test. For example, if the power supply voltage of the module under test is 5V, and the power supply terminal of the module under test corresponds to the mth terminal in the second terminal group 230 , the control module 250 can control the power supply with a voltage of 5V and the mth terminal in the second terminal group 230 The circuit between the terminals conducts to supply power to the module under test.

In some implementations, the control module 250 may also control the conversion module 220 . For example, the control module 250 may control the conversion module 220 to adjust the mapping relationship between the second terminal group 210 and the first terminal group 230 . For another example, the control module 250 may control the conversion module 220 to convert the signal level transmitted between the second terminal group 210 and the first terminal group 230 .

FIG. 3 is a schematic structural diagram of another signal switching device provided by an embodiment of the present application.

Referring to FIG. 3 , the signal switching device 300 is connected to the testing device 380 and the module under test 390 . The signal switching device 300 includes a first terminal group 310 , a conversion module 320 , a second terminal group 330 , a power module 340 , a control module 350 , a storage module 360 and a communication module 370 .

The first terminal group 310 may be connected to the testing device 380 . In some implementations, the first terminal group 310 can transmit signals of other components to the testing device, and can also transmit signals of the testing device to other components. For example, the other components may be the conversion module 320 or the power module 340 .

The first terminal group 310 may include a plurality of terminals so as to be connected with other components to realize signal transmission. As an implementation manner, the first terminal group 310 may include a signal terminal group 311 and a power terminal group 312 . As an example, the signal terminal group 311 may be connected to the conversion module 320 . The power terminal group may be connected to the power module 340 . As another example, the signal terminal group 311 and the power terminal group 312 may be implemented by the same hardware interface, or may be implemented by two hardware interfaces.

The second terminal group 330 may be connected to the module under test 390 . The second terminal group 330 can transmit signals of other components to the module under test, and can also transmit signals of the device under test to other components. For example, the other components may be the conversion module 320 or the power module 340 .

The conversion module 320 may be connected to the signal terminal group 311 and the second terminal group 330 respectively. In some implementations, the conversion module 320 can adjust the mapping relationship between the second terminal group 330 and the signal terminal group 311 , and can also convert the levels of the signals transmitted by the terminals in the second terminal group 330 and the signal terminal group 311 . .

As an implementation manner, the conversion module 320 may be composed of a hardware circuit and a control part. As another implementation manner, the conversion module 320 may be composed of a hardware circuit and controlled by an external control module. For example, the conversion module 320 is composed of a switch circuit array supporting level conversion. As another example, the conversion module may be controlled by the control module 350 . As an example, the conversion module 320 may be a switch circuit array composed of metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET) supporting level conversion. As another example, the control module 350 may be composed of the controller 351 and the driving module 352 . Among them, the driving module 352 can be used to drive the switches in the switch circuit array.

In some implementations, the control module 350 may also control the power module 340 . The power supply module 340 may have a plurality of power supplies with different voltages. As an implementation manner, the power supply module 340 may be connected to multiple power supplies with different voltages. For example, the power module 340 may be connected to the power terminal group 312, and the power terminal group 312 may be connected to a plurality of power sources with different voltages. As an example, the multiple power sources with different voltages may be multiple power sources in the testing device 380 , and the power module 340 is connected to the multiple power sources in the testing device 380 through the power terminal group 312 .

The control module 350 may control the power supply module 340 to select a power supply matching the module under test 390 from a plurality of power supplies to supply power to the module under test 390 . As an example, the power module 340 is composed of a switch circuit array, and the control module 350 can determine the switch between the power supply matching the module under test 390 and the terminal of the second terminal 330 that supplies power to the module under test 390, and control the switch to conduct The test module 390 is generally powered.

The control module 350 can control the conversion module 320 and the power module 340 in various ways. For example, the pin definition and working level of the module under test currently to be tested are input into the control module 350 , and the control module 350 can output the control strategy to the conversion module 320 and the power supply module 340 . For another example, the control module 350 can obtain corresponding information from a pre-stored control list according to the type of the currently tested module to be tested, generate a control strategy, and output the control strategy to the conversion module 320 and the power module 340 .

In some implementations, the control list can be generated based on the type of module under test. The control list may be pre-stored in the storage device. For example, the control list may be stored in the memory of the control module 350 . As another example, the control list may be stored in a separate storage module 360 .

In other implementations, the pre-stored control list may be added, deleted or modified according to the change of the type of the module under test. Instructions may be sent through the communication module 370 for adding, deleting or modifying the control list.

The embodiments of the present application will be described in more detail below with reference to specific examples. It should be noted that those skilled in the art can obviously make various equivalent modifications or changes based on the given examples, and such modifications or changes also fall within the scope of the embodiments of the present application.

FIG. 4 is a schematic circuit diagram of the signal switching device in FIG. 3 .

Referring to FIG. 4 , the circuit 400 includes a signal terminal group 311 , a power terminal group 312 , a conversion module 420 , a second terminal group 330 , a power module 440 and a control module 450 (not shown in FIG. 4 ).

The conversion module 420 may be composed of a MOS transistor array supporting level conversion. The conversion module 420 can adjust the mapping relationship between the signal terminal group 311 and the terminals in the second terminal group 330 according to the mapping relationship between the testing device and the terminals of the module under test. For example, the interface definitions of the test device and the module under test are unified, that is to say, the terminals are in one-to-one correspondence in sequence. As an example, the s1 terminal in the signal terminal group 311 corresponds to the S1 terminal of the second terminal group 330 , the conversion module 420 controls the MOS transistor s1S1 to conduct, and the s1 terminal in the signal terminal group 311 corresponds to the S1 terminal of the second terminal group 330 Connected. For another example, the interface definitions of the test device and the module under test are not uniform. As an example, the s1 terminal in the signal terminal group 311 corresponds to the S2 terminal of the second terminal group 330 , the conversion module 420 controls the MOS transistor s1S2 to conduct, and the s1 terminal in the signal terminal group 311 corresponds to the S2 terminal of the second terminal group 330 Connected.

The conversion module 420 can also convert the signal level transmitted between the signal terminal group 311 and the second terminal group 330 while adjusting the mapping relationship between the signal terminal group 311 and the terminals in the second terminal group 330 . FIG. 5 is a working principle diagram of the s1S1 unit in the MOS transistor array supporting the level conversion in FIG. 4 . The working principle of the circuit in Fig. 5 is described in detail later.

Referring back to FIG. 4 , the power module 440 may be composed of an array of MOS transistors. The power module 440 can supply power to the module under test by controlling the conduction of the MOS transistor between the power supply matching the module under test and the terminals of the second terminal group 330 for supplying power to the module under test. For example, the Sn-1 terminal in the second terminal group 330 is the power supply terminal of the module under test, and the power supply voltage of the module under test is VCC1. Then, the power supply module 440 can control the conduction of the MOS transistors between the Sn-1 terminal in the second terminal group 330 and the VCC1 in the multiple power supplies, so as to provide the power supply VVC1 for the module under test.

The voltages of the plurality of power supplies in the power supply module 440 may also include supply voltages in the conversion module 420 . For example, the power supply voltages in the switch circuit array unit of the conversion module 420 include VIO1 and VIO2, and the voltages of the multiple power supplies of the power supply module may include VIO1 and VIO2, which can expand the power supply module 440 on the basis of hardly increasing the cost. number of power supplies.

Referring to FIG. 5 , taking the unit where the MOS transistor s1S1 is located as an example, the principle of converting the signal level transmitted between the signal terminal group 311 and the second terminal group 330 by the conversion module 420 is introduced. Wherein, s1 is connected to the test device, S1 is connected to the module under test, VIO1 is the level of the transmission signal of the test device, and VIO2 is the level of the transmission signal of the device under test. s1 and S1 are the terminals for the test device and the device under test to transmit the same signal.

The MOS transistors in the conversion module 420 can be controlled by the control module 450 . As an implementation manner, the control module 450 may be composed of a driving circuit 552 and a controller 551 . For example, the controller 551 can control the working state of the driving circuit 552 according to the target on-off state of the MOS transistor. As an example, the driving circuit 552 is connected to the gate of the MOS transistor. When the target state of the MOS transistor is turned on, the controller 551 can control the driving circuit 552 to output a high level. When the target state of the MOS transistor is OFF, the controller 551 can control the driving circuit 552 to output a low level.

In some embodiments, the conversion module 420 may convert the signal level of the module under test to the signal level of the test device. For example, when the S1 input signal is at a high level, the MOS transistor s1S1 is turned off, and s1 outputs a high level VIO1 through the pull-up resistor R11. For another example, when the S1 input signal is at a low level, the MOS transistor s1S1 is turned on, and s1 is pulled to a low level.

In other embodiments, the conversion module 420 can convert the signal level of the test device to the signal level of the module under test. For example, when the s1 input signal is at a high level, the MOS transistor s1S1 is turned off, and S1 outputs a high level VIO2 through the pull-up resistor R12. For another example, when the s1 input signal is at a low level, the diode inside the MOS transistor s1S1 is turned on, and S1 is pulled to a low level.

It should be noted that the value of the resistor R11 can be selected according to the current range of the interface of the testing device. Resistor R12 can be valued according to the current range of the interface of the module under test. Referring to FIG. 4 , as an implementation manner, the values of R11 to Rn1 may be the same. As another implementation manner, the values of R12 to Rn2 may be the same.

FIG. 6 is a schematic structural diagram of still another signal switching device provided by an embodiment of the present application. The above describes how to realize signal transfer and level conversion between the test device and the corresponding terminals of the module under test. 6, the method of generating the signal of the corresponding terminal of the test device according to the signal of the module under test, or the method of generating the signal of the corresponding terminal of the module under test according to the signal of the test device, will be introduced.

Referring to FIG. 6 , the signal switching device 600 includes a first terminal group 610 , a switching module 620 and a second terminal group 630 .

The switching module 620 may be implemented by a programmable controller. For example, the conversion module 620 may be a complex programmable logic device or a field programmable gate array.

A programmable controller can have multiple input and output units (Banks). Among them, the Bank in the programmable controller includes at least two Banks that support different power domains. For example, the power domain supported by Bank1 is VIO1, and the power domain supported by Bank2 is VIO2. That is to say, the signal level of the input/output (Input/Ouput, I/O) interface in Bank1 is VIO1, and the signal level of the I/O interface in Bank2 is VIO2.

As an implementation manner, the first terminal group 610 can be connected to the I/O port in Bank1 of the conversion module 620 , and the second terminal group 630 can be connected to the I/O port in Bank2 of the conversion module 620 . As an example, the conversion module 620 may collect the logic levels of the signals of the first terminal group 610, and control the corresponding terminals in the second terminal group 630 to output signals of the same logic level according to the collection result. For example, the s1 terminal in the first terminal group 610 and the S3 terminal in the second terminal group 630 transmit the same signal, and the logic level of the collected input signal of the s1 terminal in the first terminal group 610 is a high level. The conversion module 620 can control the S3 terminal in the second terminal group 630 to output a logic level high.

As another example, the conversion module 620 can automatically implement level conversion of the signals transmitted by the first terminal group 610 and the second terminal group 630 . For example, the power supply voltage of the power domain VDDIO1 of Bank1 is VIO1, and the power supply voltage of the power domain VDDIO2 of Bank2 is VIO2. Because the port voltage of Bank1 is the same as that of the test device, both are VIO1. Therefore, the signal of the test device can be directly input to the conversion module 620 through Bank1. The port voltage of Bank2 is the same as the port voltage of the tested module, both are VIO2. Therefore, the voltage of the port output high level in Bank2 is VIO2, which matches the level of the module under test.

FIG. 7 is a schematic structural diagram of a testing system provided by an embodiment of the present application. Referring to FIG. 7 , the testing system 700 includes a testing device 710 and a signal switching device 720 as described above.

The apparatus embodiments of the present application are described in detail above with reference to FIG. 1 to FIG. 7 , and the method embodiments of the present application are described in detail below with reference to FIG. 8 . It should be understood that the descriptions of the method embodiments correspond to the descriptions of the apparatus embodiments. Therefore, for the parts not described in detail, reference may be made to the foregoing apparatus embodiments.

FIG. 8 is a schematic flowchart of a signal switching method provided by an embodiment of the present application. The signal switching method 800 is applied to a signal switching device. The signal switching device includes a first terminal group, a second terminal group and a conversion module. The first terminal group is used for connecting with the test device, and the second terminal group is used for connecting with the tested module. The method is executed by the conversion module.

Referring to FIG. 8 , the signal switching method 800 includes step S810.

In step S810, the mapping relationship between the terminals in the first terminal group and the second terminal group is adjusted; and the level of the signal transmitted between the first terminal group and the second terminal group is converted.

Optionally, the signal switching method includes selecting a power supply matching the module under test from a plurality of power supplies to supply power to the module under test.

Optionally, the conversion module includes a metal-oxide-semiconductor field-effect transistor switch circuit array supporting level conversion.

Optionally, the conversion module is a complex programmable logic device or a field programmable gate array.

It should be understood that, in this embodiment of the present application, "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean that B is only determined according to A, and B may also be determined according to A and/or other information.

It should be understood that the term "and/or" in this document is only an association relationship to describe associated objects, indicating that there can be three kinds of relationships, for example, A and/or B, which can mean that A exists alone, and A and B exist at the same time , there are three cases of B alone. In addition, the character "/" in this document generally indicates that the related objects are an "or" relationship.

It should be understood that, in various embodiments of the present application, the size of the sequence numbers of the above-mentioned processes does not mean the sequence of execution, and the execution sequence of each process should be determined by its functions and internal logic, and should not be dealt with in the embodiments of the present application. implementation constitutes any limitation.

In the several embodiments provided in this application, it should be understood that the disclosed system, apparatus and method may be implemented in other manners. For example, the apparatus embodiments described above are only illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented. On the other hand, the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this embodiment.

In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.

In the above-mentioned embodiments, it may be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented in software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present application are generated. The computer may be a general purpose computer, special purpose computer, computer network, or other programmable device. The computer instructions may be stored in or transmitted from one computer readable storage medium to another computer readable storage medium, for example, the computer instructions may be downloaded from a website site, computer, server or data center Transmission to another website site, computer, server, or data center is by wire (eg, coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (eg, infrared, wireless, microwave, etc.). The computer-readable storage medium may be any available medium that can be read by a computer or a data storage device such as a server, a data center, etc. that includes one or more available media integrated. The available media may be magnetic media (eg, floppy disks, hard disks, magnetic tapes), optical media (eg, digital video discs (DVDs)), or semiconductor media (eg, solid state disks (SSDs)) )Wait.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited to this. should be covered within the scope of protection of this application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims (9)

1. A signal switching device, characterized in that, comprising: a first terminal group for connecting with the test device; The second terminal group is used to connect with the module under test; a conversion module, respectively connected to the first terminal group and the second terminal group, the conversion module is used for adjusting the mapping relationship between the first terminal group and the terminals in the second terminal group, and for the The level of the signal transmitted between the first terminal group and the second terminal group is converted. 2. The signal switching device according to claim 1, wherein the signal switching device further comprises: a power supply module connected to the second terminal group, the power supply module having a plurality of power supplies with different voltages; A control module, configured to select a power supply matching the module under test from the plurality of power supplies to supply power to the module under test. 3 . The signal switching device according to claim 1 , wherein the conversion module comprises a metal-oxide-semiconductor field-effect transistor switch circuit array supporting level conversion. 4 . 4 . The signal switching device according to claim 1 , wherein the conversion module is a complex programmable logic device or a field programmable gate array. 5 . 5. A signal switching method, characterized in that the method is applied to a signal switching device, the signal switching device comprising a first terminal group, a second terminal group and a conversion module, and the first terminal group uses in connection with the test device, the second terminal group is used for connection with the module under test, the method is executed by the conversion module, The method includes: adjusting the mapping relationship between the first terminal group and the terminals in the second terminal group; and The level of the signal transmitted between the first terminal group and the second terminal group is converted. 6. The method according to claim 5, wherein the method further comprises: A power supply matching the module under test is selected from a plurality of power supplies to supply power to the module under test. 7 . The method according to claim 5 , wherein the conversion module comprises a metal-oxide-semiconductor field-effect transistor switch circuit array supporting level conversion. 8 . 8. The method according to claim 5, wherein the conversion module is a complex programmable logic device or a field programmable gate array. 9. A test system, characterized in that the test system comprises a test device and the signal switching device according to any one of claims 1-4.

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