CN115223967A

CN115223967A - Jet cooling device, chip assembly and electronic equipment

Info

Publication number: CN115223967A
Application number: CN202110430118.8A
Authority: CN
Inventors: 王超; 尼古拉·弗拉基米罗维奇·梅森; 坂本仁; 林辉
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-04-21
Filing date: 2021-04-21
Publication date: 2022-10-21
Also published as: WO2022222870A1

Abstract

The present application discloses a jet cooling device, a chip assembly and electronic equipment. The jet cooling device includes a top cover, a jet plate and at least one support. The top cover is provided with a accommodating cavity and a liquid inlet pipe. The jet plate is accommodated in the accommodating cavity, and movably connected with the top cover, the jet plate includes a first surface and a second surface opposite to each other and a jet hole penetrating the first surface and the second surface, at least one support is fixed on the second surface of the jet plate for abutting against the second surface of the jet plate Hold the chip. The cooling medium is shot to the surface of the chip through the jet plate to cool the chip and dissipate heat. When the jet cooling device is installed with the chip, since the jet plate is movably connected to the top cover, while the top cover is fixedly connected to the substrate, the jet plate has a degree of freedom of movement relative to the top cover, which can adapt to the tolerance caused by the warping of the chip , so that the abutting surface of at least one support piece abuts against the chip, so as to effectively control the jet height between the jet plate and the chip, so as to achieve a better cooling effect.

Description

Jet cooling device, chip assembly and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of chip cooling, in particular to a jet cooling device, a chip assembly and electronic equipment.

Background

With the development of chip technology, electronic devices with high-power chips are widely used in various fields, and the existing technology generally adopts jet flow impact cooling technology to dissipate heat of the high-power chips. However, the structure of the traditional jet cooling device is relatively fixed, when the traditional jet cooling device is fixed with an electronic device, the chip is easy to generate warping deformation so as to cause the tolerance of the corresponding electronic device, the traditional jet cooling device cannot be effectively matched with the electronic device, the jet height corresponding to the surface of the chip cannot be adjusted, the corresponding jet height is difficult to accurately control in an ideal height range, and the chip cannot be effectively cooled.

Disclosure of Invention

The application provides a efflux cooling device, chip subassembly and electronic equipment, efflux cooling device is when carrying out efflux impingement cooling to the chip, can the produced tolerance of effective adaptation electron device to the efflux that control chip surface corresponds is highly at ideal high within range, thereby effectively dispels the heat to the chip.

In a first aspect, the present application provides a jet cooling device for cooling a chip fixed on a substrate, the jet cooling device comprising a top cap, a jet plate, and at least one support member, the top cap having an accommodating cavity and a liquid inlet pipe for fixedly connecting to the substrate; the jet flow plate is accommodated in the accommodating cavity and is movably connected to the top cover, the jet flow plate comprises a first surface and a second surface which are back to back, and is provided with a jet flow hole which penetrates through the first surface and the second surface, a liquid separation cavity is formed by enclosing the first surface and the top cover, the space of one side, away from the first surface, of the second surface is a jet flow space, and the jet flow hole is used for communicating the liquid separation cavity and the jet flow space; at least one supporting piece is fixedly connected to the second surface, each supporting piece comprises a supporting surface departing from the second surface, and the supporting surfaces are used for supporting the chips.

The application provides a efflux cooling device is used for cooling off the chip in the electron device, the electron device includes the base plate and fixes the chip on the base plate, when installing efflux cooling device and electron device, because efflux board swing joint in top cap, in top cap and base plate fixed connection, efflux board has certain degree of freedom of movement for the top cap, can adapt the produced tolerance of electron device, make at least one support piece support to hold in the chip, thereby effectively control the efflux height between efflux board and the chip, in order to reach the efflux impingement cooling effect of preferred.

In one embodiment, the flow jet plate and the top cover are in clearance fit to realize movable connection between the flow jet plate and the top cover. Wherein, clearance fit refers to: the jet flow plate is arranged in the accommodating cavity and is not directly connected with the top cover, the jet flow plate and the top cover form a fit with a gap (including the gap being equal to zero, namely a contact state) between the surface of the jet flow plate and the surface of the top cover, and relative movement between the jet flow plate and the top cover can be realized under the action of external force (such as the gravity of the jet flow plate or the supporting force of a chip). Under the structure, the jet flow plate has the freedom of movement, so that the tolerance generated by the electronic device can be effectively accommodated. In a specific embodiment, a gap larger than zero exists between the jet flow plate and the top cover, and the jet flow plate is movably connected with the top cover in a relative spacing (or smooth contact) mode, so that the jet flow plate can move relative to the top cover.

In one embodiment, the jet flow plate can be relative in the first direction the top cap activity, the jet flow plate includes the lateral surface, the top cap is including the laminating the internal surface of lateral surface, the orientation of first surface does the first direction, the orientation of lateral surface with form the contained angle between the first direction. Wherein, the first direction is defined as the orientation direction of the first surface, and the contained angle between the orientation of lateral surface and the first direction is 90 or nearly 90, under above-mentioned structure, the efflux board is also can be moved in first direction relative to the top cap to the tolerance adaptation that produces to corresponding electron device.

In one embodiment, the jet plate and the top cover are matched through a sliding connection structure to realize movable connection between the jet plate and the top cover. The existence of sliding connection structure for through the mode swing joint that slides between streamer and the top cap, and the relative movement process between the two is more stable.

In one embodiment, the jet plate comprises an outer side surface, the top cover comprises an inner surface opposite to the outer side surface, the first surface is oriented in a first direction, and an included angle is formed between the orientation of the outer side surface and the first direction; the outer side surface is provided with a first sliding part, the inner surface is provided with a second sliding part, the first sliding part and the second sliding part form the sliding connection structure, and the first sliding part and the second sliding part extend along the first direction, so that the jet flow plate can move relative to the top cover in the first direction. Under the structure, the jet plate and the top cover can perform relative movement in the first direction in a sliding connection manner so as to meet corresponding requirements.

In one embodiment, the flow plate is elastically connected to the top cover, and the flow plate is elastically acted by an elastic force to enable the abutting surface to abut against the chip. The jet flow plate is subjected to elastic acting force deviating from the first direction, so that the at least one support is abutted against the chip and forms abutting force with the chip, the at least one support is kept in a close-fitting state with the chip, the spacing distance between the jet flow plate and the chip is effectively controlled, the jet flow height of the cooling medium between the jet flow plate and the chip is in an ideal height range, and the chip can be effectively cooled.

In one embodiment, an elastic member is disposed between the jet plate and the top cover, the elastic member provides an elastic force to the jet plate in a direction away from a first direction, and the first surface is oriented in the first direction. When the jet flow plate moves relatively along the first direction, the jet flow plate extrudes or stretches the elastic piece, and the elastic piece elastically deforms to provide elastic acting force deviating from the first direction for the jet flow plate, so that the at least one supporting piece is abutted against the chip. It should be noted that the existence of the elastic member can also effectively accommodate the tolerance generated due to insufficient machining precision or chip warping deformation, so as to improve the tolerance capability of the jet flow cooling device.

In one embodiment, the elastic element is disposed on a side of the jet plate facing away from the at least one support element. When the jet flow plate moves along the first direction under the supporting force from the chip, the elastic piece is extruded by the jet flow plate to be compressed and deformed, and the elastic piece provides elastic thrust to the jet flow plate so that the jet flow plate drives at least one supporting piece to be tightly attached to the chip.

In one embodiment, the elastic member is disposed on a side of the jet plate facing the at least one support member. The jet flow plate is fixedly connected with the elastic piece, when the jet flow plate moves along the first direction under the supporting force from the chip, the elastic piece is stretched by the jet flow plate so as to enable the elastic piece to be stretched and deformed, and the elastic piece provides elastic tensile force for the jet flow plate so as to enable the jet flow plate to drive the at least one supporting piece to be tightly attached to the chip.

In one embodiment, the number of the elastic members is plural, at least one of the elastic members is disposed on a side of the jet plate facing away from the at least one support member, and at least one of the elastic members is disposed on a side of the jet plate facing toward the at least one support member. When the quantity of elastic component is a plurality of, and locate the both sides of jet flow board respectively, even the elastic component of a certain side leads to the elasticity inefficacy because of structural damage or other reasons, the elastic component of opposite side still can provide the elastic force who deviates from first direction to the jet flow board for jet flow cooling device satisfies corresponding functional requirement, has improved jet flow cooling device's fault-tolerance.

In one embodiment, the elastic member is an elastic sealing ring, and the elastic member closes a gap between the jet plate and the top cover. The elastic sealing ring can seal the gap between the jet flow plate and the top cover while realizing the elastic function, so that the cooling medium cannot flow out from the gap between the jet flow plate and the top cover, and the cooling medium is completely discharged from the jet flow hole to be jetted to the surface of the chip, thereby ensuring that the chip achieves a better heat dissipation effect. It should be understood that the elastic member may also be any other structure having both elastic and sealing functions, including but not limited to an elastic sealing ring, and the kind of the elastic member is not specifically limited herein.

In one embodiment, the elastic member includes an elastic portion for providing an elastic force to the jet plate and a sealing portion for closing a gap between the jet plate and the top cover. The elastic part is used for providing elastic acting force for the jet plate, the sealing part is used for sealing a gap between the jet plate and the top cover, and the elastic part and the sealing part are combined together to form the elastic part, so that the elastic part has the functions of elasticity and sealing. In a specific embodiment, the elastic portion is a spring, the sealing portion is an annular flexible sleeve, and the spring is accommodated in the annular flexible sleeve to form an elastic member with a sealing function. The two ends of the spring are respectively connected with the jet flow plate and the top cover, and when the jet flow plate moves along a first direction, the spring provides elastic acting force deviating from the first direction for the jet flow plate; the annular flexible sleeve can be deformed and is in a compression state between the jet flow plate and the top cover to seal a gap between the jet flow plate and the top cover, but the annular flexible sleeve cannot provide effective elastic acting force for the jet flow plate because the annular flexible sleeve does not have enough rigidity and has weaker resilience. Therefore, the annular flexible sleeve and the spring are combined to form an elastic member having both elastic and sealing functions.

In one embodiment, a sealing member is further disposed between the flow jet plate and the top cover, the sealing member is spaced from the elastic member, and the sealing member is configured to close a gap between the elastic member and the top cover. The sealing element is arranged between the jet plate and the top cover and is arranged at intervals with the elastic element to seal the gap between the jet plate and the top cover, thereby having the sealing function. In one particular embodiment, the seal is an "O" ring. A groove is formed in the contact position of the jet plate and the top cover, and an O-shaped ring is in interference fit in the groove to abut against the jet plate and the top cover, so that a gap between the jet plate and the top cover is sealed, and the sealing effect is achieved. It should be understood that the sealing member may be any other structure having a sealing function, and the structure of the sealing member is not particularly limited.

In one embodiment, the jet cooling device further includes a limiting member connected to the top cover, the limiting member includes a limiting surface facing the liquid distribution chamber, a movable space is formed between the limiting surface and the top cover, and the jet plate is limited in the movable space. The movable space is a part of the accommodating cavity, and the limiting piece is used for limiting the jet flow plate in the movable space so as to prevent the jet flow plate from being separated from the top cover. In the process that the jet flow plate moves towards the outside of the movable space, the jet flow plate moves to be in contact with the limiting surface and stops moving, so that the jet flow plate is blocked by the limiting part. The limiting part enables an integral structure to be formed between the top cover and the jet flow plate, and the structural stability of the jet flow cooling device is improved. It should be noted that the structure of the limiting member is various, and for example, the limiting member is a boss protruding from the inner wall of the top cover; or, the limiting piece is of an annular plate-shaped structure and is fixedly connected to the top cover. The structure of the stopper is not specifically limited.

In one embodiment, the second surface is further provided with a nozzle in a protruding manner, and the nozzle is positioned in the jet space; the nozzle is provided with a jet flow channel, and the jet flow channel is communicated with the jet flow hole. And the cooling medium sequentially passes through the jet hole and the jet channel to be jetted on the chip, so that the heat of the chip is dissipated. It will be appreciated that the presence of the nozzles allows more precise impingement of the cooling medium onto the heat generating portions of the die, thereby achieving more efficient cooling and heat dissipation.

In one embodiment, the nozzle includes an end surface far away from the second surface, and a peripheral surface connecting the second surface and the end surface, the jet flow channel penetrates through the end surface, a spacing space is formed between the peripheral surfaces of every two adjacent nozzles, and the cooling medium can be accommodated in the spacing space after being ejected from the end surface through the jet flow channel. It will be appreciated that the cooling medium is emitted from the fluidic channel to form a jet, which is at a relatively low temperature before it comes into contact with the chip. After the jet stream impinges on the chip surface, the cooling medium is dispersed on the chip surface and exchanges heat with the chip, thereby forming a reflux stream having a relatively high temperature. It should be noted that, if the backflow with a higher temperature contacts the jet with a lower temperature in a large area, the flow of the backflow may affect the jetting accuracy of the jet, and may easily cause the temperature of the jet to increase, which is not favorable for cooling and dissipating heat of the chip. In the present embodiment, due to the existence of the space, the jet emitted from the end surface is spaced apart from the backflow contained in the space, so that the jet is not interfered by the backflow, and the jet can keep a lower temperature and accurately impact the heating portion of the chip, thereby effectively improving the heat dissipation effect of the chip.

In one embodiment, the number of the fluidic holes is multiple, and a plurality of the fluidic hole arrays are distributed in a first area and a second area of the second surface, the second area surrounds the first area, the first area corresponds to a middle area of the chip, and the second area corresponds to an edge area of the chip; the heat generating portion of the chip is mainly an area where the plurality of dies are located, wherein a middle area where the die having the logic operation function is located is a main heat generating portion, and an edge area where the die having the memory function is located is a next-level heat generating portion. Correspondingly, the second surface of the jet plate can be divided into a first area and a second area, the first area corresponds to the middle area of the chip, and the second area surrounds the first area to correspond to the edge area of the chip. The plurality of jet hole arrays are distributed in the first area and the second area, and the cooling medium is jetted to the heating part of the chip through the jet holes so as to achieve a better heat dissipation effect.

The first area is internally provided with a plurality of nozzles, and the jet flow channels of the plurality of nozzles are communicated with the plurality of jet flow holes in the first area in a one-to-one correspondence manner. In order to reduce the process cost and the processing difficulty, the nozzles can be arranged in the first area, namely the nozzles are communicated with the jet holes in the first area in a one-to-one correspondence manner, so that the middle area mainly heated on the chip can be effectively cooled, and the corresponding cooling effect is achieved.

In one embodiment, a plurality of the nozzles are also arranged in the second region, and the jet channels of the plurality of the nozzles are communicated with the plurality of the jet holes in the first region and the second region in a one-to-one correspondence manner. And meanwhile, a plurality of nozzles are arranged in the first area and the second area, so that the heat generating part of the chip can be more comprehensively radiated, and the cooling and radiating effects on the chip can be further improved.

In one embodiment, the jet height of the cooling medium between the jet plate and the chip is less than or equal to 500 μm; wherein the first surface is oriented in the first direction, and the jet height is a height between an initial position where the cooling medium is ejected from the jet plate and a final position where the cooling medium is ejected onto the chip in the first direction. When the jet height of the cooling medium is greater than 500 μm, the cooling medium is prone to side flow in the process of jetting, that is, part of the cooling medium cannot be accurately jetted to the position corresponding to the surface of the chip, so that the chip is subjected to less impact of the cooling medium at the position, and effective heat dissipation cannot be achieved; when the jet height of the cooling medium is less than or equal to 500 micrometers, the cooling medium can be accurately and intensively impacted to the corresponding position of the surface of the chip, so that the bypass flow of the cooling medium is effectively avoided, and the heat dissipation effect of the chip assembly is improved.

In one embodiment, the jet height is equal to the dimension of the at least one support in the first direction; a dimension of the at least one support in the first direction is less than or equal to 500 μm. When the jet flow plate is not provided with the nozzles, the jet height of the cooling medium between the jet flow plate and the chip is equal to the spacing distance between the port of the jet hole on the second surface and the surface of the chip. And at least one supporting piece is fixedly connected to the second surface, and the abutting surface of the at least one supporting piece, which is far away from the second surface, abuts against the chip. Thus, the cooling medium is sprayed at the same height between the spray plate and the chip as the at least one support is dimensioned in the first direction. When the dimension of the at least one support in the first direction is less than or equal to 500 μm, the jet height of the cooling medium between the jet plate and the chip may meet the respective requirement.

In one embodiment, a nozzle is further protruded from the second surface, the nozzle is located in the jet space, the nozzle is provided with a jet channel, the jet channel is communicated with the jet hole, and the at least one support member is spaced from the nozzle; the dimension of the at least one support is greater than the dimension of the nozzle in the first direction, and the jet height is equal to the difference in the dimensions of the at least one support and the nozzle in the first direction, the difference in dimensions being less than or equal to 500 μm. When the nozzle is arranged on the second surface of the jet flow plate, the jet flow height of the cooling medium between the jet flow plate and the chip is equal to the spacing distance between the end surface of the nozzle and the surface of the chip. And at least one supporting piece is fixedly connected to the second surface, and the abutting surface of the at least one supporting piece, which is far away from the second surface, abuts against the chip. Thus, the height of the cooling medium jet between the jet plate and the chip is equivalent to the difference in the dimensions of the at least one support and the nozzle in the first direction. When the size difference between the at least one support and the nozzle along the first direction is less than or equal to 500 μm, the jet height of the cooling medium between the jet plate and the chip can meet the corresponding requirement.

In one embodiment, the at least one support is distributed within the second region. For a chip warped in the shape of a "crying face", i.e. the middle area of the chip is warped in a direction away from the substrate, the edge area of the chip is further away from the jet cooling device than the middle area. The at least one supporting piece can be distributed in the second area, and the abutting surface of the at least one supporting piece abuts against the edge area of the chip or the waterproof part around the edge area. In a particular embodiment, at least one support is provided on the jet plate at each of the four corners of the second surface.

In one embodiment, the top cover comprises a plurality of accommodating cavities, the accommodating cavities are arranged at intervals, and each accommodating cavity accommodates one jet plate; the first surface of each jet plate and the top cover enclose to form one liquid distribution cavity. The jet flow cooling device provided by the embodiment can be used for cooling and radiating the wafer level chip, each jet flow plate corresponds to a part of the surface area of the wafer level chip, and the cooling medium is jetted to the corresponding area of the chip from the liquid separation cavity through the corresponding jet flow plate so as to cool and radiate the chip in the area. It should be understood that, when the wafer-level chip is divided into a plurality of regions for respective heat dissipation, the difference in height between the surfaces of the chip formed by warpage deformation in each region is small, and because at least one support is disposed on the jet flow plate corresponding to each region, and the abutting surface of at least one support abuts against the surface of the chip in the corresponding region, the jet flow height between the surface of the chip in the corresponding region and the corresponding jet flow plate can meet the corresponding requirement, that is, less than or equal to the maximum effective jet flow height, so that the chip can be effectively dissipated in each region, and the wafer-level chip can be effectively dissipated as a whole.

In one embodiment, the top cap still is equipped with the feed liquor chamber, the feed liquor chamber is located the feed liquor pipeline is with a plurality of divide between the sap cavity, the feed liquor chamber is used for the intercommunication the feed liquor pipeline with divide the sap cavity. The cooling medium enters the liquid inlet cavity through the liquid inlet pipeline and is uniformly distributed to each liquid distribution cavity through the liquid inlet cavity, and the cooling medium in each liquid distribution cavity is uniformly distributed to each jet hole, so that the cooling medium is uniformly jetted to the surface of the chip, and a better heat dissipation effect is achieved.

In a second aspect, the present application provides a chip assembly, which includes a chip, a substrate and the jet cooling device of any one of the embodiments of the first aspect, wherein the chip and the jet cooling device are both connected to the substrate, and the jet cooling device and the substrate enclose to form a liquid outlet cavity, and the chip is accommodated in the liquid outlet cavity; wherein the first surface of the jet plate faces a first direction; the chip is opposite to the jet hole and is abutted against the abutting surface of the at least one supporting piece. The chip is any type of chip that needs cooling, and the type of chip is not specifically limited herein. It should be noted that the surface of the chip should be subjected to waterproof treatment by using an epoxy resin filling process, a surface sputtering process or any other process meeting the corresponding functional requirements, so as to prevent the chip from being damaged by water entering the chip and prevent the corresponding circuit from being damaged by water vapor penetrating through the chip. In one embodiment, the substrate is further fixed with a stiffener, and the stiffener is arranged on the periphery of the chip. The presence of the ribs effectively limits the deformation of the substrate, and the ribs are made of a material having a high structural strength, and for example, the ribs may be made of stainless steel or copper, and the material of the ribs is not specifically limited herein.

The application provides a chip subassembly through installing the efflux cooling device that this application provided for the chip subassembly still possesses the radiating effect of preferred when realizing corresponding function, and the temperature of chip subassembly at the during operation is lower, thereby can support long-term operation reliability and increase of service life.

In a third aspect, the present application provides an electronic device, which includes a circuit board and the chip assembly of the second aspect, wherein the chip assembly is fixedly connected to the circuit board. It should be understood that the variety of the electronic device may be various, and the electronic device may be, for example, a server, a switch, or any other network device, and the variety of the electronic device is not specifically limited herein.

The application provides an electronic equipment, through installing the chip subassembly that this application embodiment provided, can realize the normal operating of corresponding function, and because the chip subassembly that this application embodiment provided has the radiating effect of preferred, this electronic equipment can maintain lower temperature at the during operation to can support long-term operation reliability and increase of service life.

Drawings

Fig. 1 is a perspective view of an electronic device provided in an embodiment of the present application;

fig. 2 is a perspective view of a chip assembly in the electronic device of fig. 1;

FIG. 3 isbase:Sub>A schematic cross-sectional view of the chip assembly of FIG. 2 taken along line A-A;

FIG. 4 is a schematic view of a combination structure of a chip and a substrate in the chip assembly shown in FIG. 2;

FIG. 5 is an exploded view of the combined structure of the jet cooling device and the substrate in the chip assembly of FIG. 2;

FIG. 6 is a perspective view of a jet cooling device in one embodiment;

FIG. 7 is an exploded view of the jet cooling device of FIG. 6 from another perspective;

FIG. 8 is a schematic cross-sectional view of the jet cooling device of FIG. 6 taken at B-B;

FIG. 9 is a schematic cross-sectional view of a top cover of the jet cooling device of FIG. 6;

FIG. 10 is a perspective view of a jet plate in the jet cooling device of FIG. 6;

FIG. 11 is a schematic cross-sectional view of the jet plate of FIG. 10 taken at C-C;

FIG. 12 is a perspective view of a jet plate in another embodiment;

FIG. 13 is a schematic cross-sectional view of the jet plate of FIG. 12 taken at D-D;

FIG. 14 is a schematic cross-sectional view of a jet cooling device incorporating the jet plate of FIG. 12;

FIG. 15 is a schematic sectional view of a jet cooling device in another embodiment;

FIG. 16 is a schematic sectional view of a jet cooling device in another embodiment;

FIG. 17 is an exploded view of the jet cooling device of FIG. 16;

FIG. 18 is a schematic sectional view of a jet cooling device in another embodiment;

FIG. 19 is a schematic cross-sectional view of a jet cooling device in another embodiment;

FIG. 20 is a partial schematic view of a spring according to one embodiment;

FIG. 21 is a schematic sectional view of a jet cooling device in another embodiment;

FIG. 22 is a perspective view of the fluidic plate and at least one support in another embodiment, from another perspective;

FIG. 23 is a cross-sectional view of the jet cooling device with the jet plate and at least one support member of FIG. 22 installed;

FIG. 24 is a perspective view of another embodiment of a fluidic plate and at least one support from another perspective;

FIG. 25 is a cross-sectional view of the jet cooling device with the jet plate and at least one support member of FIG. 24 installed;

FIG. 26 is a schematic bottom view of an embodiment of a fluidic plate and at least one support;

FIG. 27 is a schematic view of a heat sink for dissipating heat from a warped chip using the current plate and at least one support member shown in FIG. 26;

FIG. 28 is a schematic bottom view of another embodiment of a fluidic plate and at least one support;

FIG. 29 is a schematic diagram of a heat sink for a warped chip using the fluidic plate of FIG. 28 and at least one support member;

FIG. 30 is a schematic sectional view of a jet cooling device in another embodiment.

Detailed Description

The embodiments of the present application will be described below with reference to the drawings.

Referring to fig. 1, fig. 1 is a perspective view of an electronic device according to an embodiment of the present disclosure. The electronic device 9000 includes a housing 2000, and a chip assembly 1000 and a circuit board 3000 disposed in the housing 2000, wherein the chip assembly 1000 is fixedly connected to the circuit board 3000 to implement corresponding functions, and the housing 2000 is configured to accommodate the chip assembly 1000 and the circuit board 3000 to encapsulate and protect the chip assembly 1000 and the circuit board 3000. It should be understood that the electronic device 9000 can be various types, and for example, the electronic device 9000 can be a server, a switch or any other network device, and the type of the electronic device 9000 is not specifically limited herein.

The electronic equipment 9000 that this application embodiment provided can realize the normal operating of corresponding function through installing the chip subassembly 1000 that this application embodiment provided, and because the chip subassembly 1000 that this application embodiment provided has the radiating effect of preferred, this electronic equipment 9000 can maintain lower temperature at the during operation to can support long-term operation reliability and increase of service life.

Referring to fig. 2 and 3 together, fig. 2 is a perspective view of a chip assembly in the electronic device shown in fig. 1; FIG. 3 isbase:Sub>A schematic cross-sectional view of the chip assembly of FIG. 2 taken along line A-A. The chip assembly 1000 includes a chip 200, a substrate 300, and a jet cooling device 100 provided by the embodiments of the present application. The chip 200 and the jet cooling device 100 are both connected to the substrate 300, a liquid outlet cavity 101 is formed by enclosing the jet cooling device 100 and the substrate 300, the liquid outlet cavity 101 is used for accommodating the chip 200 to package the chip 200, and a cooling medium is jetted to the surface of the chip 200 through the jet cooling device 100 to perform jet impact cooling on the chip 200.

It should be noted that the above-mentioned jet impingement cooling refers to: the cooling medium is vertically (or at a certain inclination angle) impacted to the surface of the object to be cooled through a circular or narrow-slit nozzle under the action of pressure difference, so that the directly impacted area generates a strong heat exchange effect. In the embodiment of the present application, the object to be cooled is a chip 200, the circular or slit-shaped nozzle is a corresponding structure in the jet cooling device 100, and the cooling medium is any liquid, gas or gas-liquid mixture with heat conductivity. It should be understood that there are various types of cooling media, as long as the respective heat conduction functions can be satisfied, and the present application will be described by taking water as an example of the cooling medium.

The chip assembly 1000 provided by the embodiment of the application is provided with the jet flow cooling device 100 through installation, so that the chip assembly 1000 has a good heat dissipation effect when realizing corresponding functions, the temperature of the chip assembly 1000 during working is low, and long-term operation reliability and service life can be supported.

Referring to fig. 2 to 4, fig. 4 is a schematic view of a combination structure of a chip and a substrate in the chip assembly shown in fig. 2;

the chip 200 is any type of chip 200 that requires cooling, and the type of the chip 200 is not particularly limited. It should be noted that the surface of the chip 200 should be subjected to waterproof treatment by using an epoxy resin filling process, a surface sputtering process, or any other process that meets the corresponding functional requirements, so as to prevent the chip 200 from being damaged due to water entering the chip 200, and prevent the corresponding circuit from being damaged due to water vapor penetrating the chip 200.

In a specific embodiment, the chip 200 includes a plurality of dies with different functions, and for example, the chip 200 may include a die with a memory function and a die with a logic operation function. Among them, the bare chip having a logic operation function generally has a large amount of heat generation during operation, and is provided in the middle region 2001 of the chip 200; the memory-function die generates relatively little heat during operation and is usually provided in the edge area 2002 of the chip 200. It should be noted that a waterproof portion (not shown) may be further disposed around the bare die of the chip 200, and the waterproof portion is used for blocking permeation of liquid water or water vapor. In a specific embodiment, the waterproof portion is made of an epoxy resin material.

As shown in fig. 4, the chip 200 is fixed to the substrate 300, and the connection between the chip 200 and the substrate 300 is various, and for example, the chip 200 may be fixed to the substrate 300 by soldering or gluing. In one embodiment, the substrate 300 is further fixed with a stiffener 400, and the stiffener 400 is disposed on the periphery of the chip 200. The reinforcing bar 400 is made of a material having high structural strength, and for example, the reinforcing bar 400 may be made of stainless steel or copper, and the material of the reinforcing bar 400 is not specifically limited.

It should be understood that the presence of the ribs 400 can effectively limit the deformation of the substrate 300. The stiffener 400 is fixedly connected to the substrate 300, and when the substrate 300 deforms, the stiffener 400 has high structural strength, so that the stiffener 400 can maintain the original shape to apply a fixing stress to the substrate 300 to resist the deformation stress generated by the substrate 300, limit the deformation of the substrate 300, and maintain the original shape, thereby effectively improving the structural stability of the chip assembly 1000. The connection method between the rib 400 and the substrate 300 is also various, and the connection method therebetween is not specifically limited. In order to seal the substrate 300 and the reinforcing ribs 400, an epoxy resin material may be filled between the substrate 300 and the reinforcing ribs 400 to achieve a waterproof function.

Referring to fig. 3 and 5, fig. 5 is an exploded view of the combined structure of the jet cooling device and the substrate of the chip assembly shown in fig. 2. The jet cooling device 100 is also fixedly connected to the substrate 300 and located on the same side of the substrate 300 as the chip 200, and a liquid outlet cavity 101 is defined between the jet cooling device 100 and the substrate 300 for accommodating the chip 200. It should be understood that there are many ways to connect the jet cooling device 100 and the substrate 300, as long as the corresponding sealing and fixing functions can be achieved, and the connection way between the two is not specifically limited. In a specific embodiment, a stiffener 400 is further fixed to the substrate 300, the jet cooling device 100 is fixed to the stiffener 400, and the substrate 300, the stiffener 400, and the jet cooling device 100 together enclose a liquid outlet cavity 101 to package the chip 200. It should be understood that there are various ways to fix the jet cooling device 100 and the reinforcing bar 400, and for example, the jet cooling device 100 and the reinforcing bar 400 may be fixed by applying a sealant therebetween; alternatively, the annular seal 410 may be provided between the jet cooling device 100 and the reinforcing rib 400 to seal and fix the two.

Referring to fig. 6 to 8, fig. 6 is a perspective view of a jet cooling device according to an embodiment; FIG. 7 is an exploded view of the jet cooling device of FIG. 6 from another perspective; fig. 8 is a schematic cross-sectional view of the jet cooling device of fig. 6 taken at B-B. The jet cooling device 100 comprises a top cover 10, a jet plate 20 and at least one support 30, wherein the top cover 10 is provided with an accommodating cavity 102, the jet plate 20 is accommodated in the accommodating cavity 102 and movably connected with the top cover 10, a liquid separating cavity 106 is formed between the jet plate 20 and the top cover 10 in a surrounding manner, the liquid separating cavity 106 is a part of the accommodating cavity, and a cooling medium is jetted from the liquid separating cavity 106 to the surface of the chip 200 through the jet plate 20 so as to cool and dissipate heat of the chip 200; at least one support 30 is fixed to the flow plate 20 for supporting the chip 200. It should be noted that at least one supporting member 30 means that the number of the supporting members 30 is at least one, and may be more than one. It should be understood that when the jet cooling device 100 is mounted with the chip 200 fixed on the substrate 300, the top cover 10 is fixedly connected with the substrate 300, and since the jet plate 20 is movably connected to the top cover 10, the jet plate 20 has a certain degree of freedom of movement relative to the top cover 10, which can effectively adapt to the tolerance of the chip 200 caused by the warpage deformation, so that the at least one support 30 abuts against the chip 200, thereby controlling the jet height of the cooling medium between the jet plate 20 and the chip 200 within a desired height range, so as to achieve a better jet impingement cooling effect.

Wherein, the height of the jet flow between the jet flow plate 20 and the chip 200 refers to the distance between the cooling medium ejected from the jet flow plate 20 and rushing to the surface of the chip 200; the ideal height range refers to greater than zero and less than or equal to the maximum effective jet height. It should be noted that, when the jet height of the cooling medium is greater than the maximum effective jet height, the cooling medium is prone to generate a bypass flow during the flushing process, that is, part of the cooling medium cannot be accurately flushed to the position corresponding to the surface of the chip 200, so that the chip 200 at the position is subjected to a smaller amount of impact of the cooling medium, and thus effective heat dissipation cannot be obtained; when the jet height of the cooling medium is smaller than or equal to the maximum effective jet height, that is, the jet height is within the ideal height range, the cooling medium can be more intensively jetted to the position corresponding to the surface of the chip 200, so that a better heat dissipation effect is achieved.

It should be understood that when each component in the jet cooling device 100 is machined, the machining precision requirement of each component is high, and it is required to ensure that the machining tolerance of each component is kept within a certain range, so that the overall tolerance of the jet cooling device 100 is within a reasonable range, and thus the jet height of the cooling medium between the jet plate 20 and the chip 200 can meet the corresponding requirement. For the jet cooling device 100 provided by the embodiment, due to the movable connection between the jet plate 20 and the top cover 10, the jet plate 20 has a certain degree of freedom of movement in the accommodating cavity 102, so that the tolerance between the components can be automatically adapted, the jet cooling device 100 has a strong tolerance capability, and the requirement on the machining precision of each component is effectively reduced.

It should also be appreciated that the present embodiment also provides a jet cooling device 100 that can effectively dissipate heat from a warped chip 200. When the cooling device cools and dissipates the heat of the warped chip 200, the flow plate 20 is movably connected to the top cap 10, and the flow plate 20 has a certain degree of freedom of movement relative to the top cap 10, so that while the top cap 10 is fixedly connected to the substrate 300, the warped portion of the chip 200 can abut against the at least one support 30 and provide a supporting force to the at least one support 30, so that the at least one support 30 and the flow plate 20 move correspondingly together, and the jet cooling device 100 can effectively accommodate the tolerance of the chip 200 caused by the warping deformation and perform automatic adaptation. And at least one support 30 is abutted against the surface of the chip 200, so that the jet height of the cooling medium between the jet plate 20 and the warped chip 200 can also be controlled within a desired height range, and a better jet impact cooling effect can be achieved.

Referring to fig. 7 to 9, fig. 9 is a cross-sectional view of a top cover of the jet cooling device shown in fig. 6. The top cover 10 is provided with an accommodating cavity 102 and a liquid inlet pipeline 103, and the liquid inlet pipeline 103 is used for communicating the accommodating cavity 102 with the outside of the jet cooling device 100, so that a cooling medium can be introduced into the accommodating cavity 102 through the liquid inlet pipeline 103. The top cover 10 is further connected with a limiting member 40, the limiting member 40 includes a limiting surface 41 facing the accommodating cavity 102, a movable space 107 is formed between the limiting surface 41 and the top cover 10, and the jet flow plate 20 is limited in the movable space 107. It should be understood that the active space 107 is a part of the receiving cavity 102, and the retaining member 40 is used to retain the fluidic plate 20 within the active space 107 to prevent the fluidic plate 20 from being removed from the top cover 10. In the process of moving the jet plate 20 out of the movable space 107, the jet plate 20 moves to contact the stopper surface 41 and stops moving, and is stopped by the stopper 40. The existence of the limiting member 40 enables the top cover 10 and the jet flow plate 20 to form an integral structure, thereby improving the structural stability of the jet flow cooling device 100. It should be noted that, the structure of the limiting member 40 is various, and for example, the limiting member 40 is a boss protruding from the inner wall of the top cover 10; alternatively, the limiting member 40 is an annular plate-shaped structure (as shown in fig. 7), and the limiting member 40 is fixed to the top cover 10. The structure of the stopper 40 is not specifically limited.

In one embodiment, the top cover 10 is further provided with a liquid outlet pipe 104, and the liquid outlet pipe 104 is used for communicating the liquid outlet cavity 101 with the outside. After the cooling medium is subjected to jet impingement cooling on the chip 200 through the jet plate 20, the cooling medium is likely to accumulate in the liquid outlet cavity 101, so that the subsequent jet impingement cooling process is affected. Therefore, the liquid outlet pipe 104 is arranged on the top cover 10, and the liquid outlet pipe 104 communicates the liquid outlet cavity 101 with the outside of the chip assembly 1000, so that the cooling medium accumulated in the liquid outlet cavity 101 can be effectively discharged to the outside of the chip assembly 1000, the circulating flow of the cooling medium is realized, and the chips 200 in the chip assembly 1000 can be continuously and effectively cooled.

The top cover 10 may be made of various materials as long as it has a certain structural strength. Furthermore, the manufacturing process of the top cover 10 may be various, for example, a machining process or an injection molding process may be adopted, and these manufacturing processes are simple and facilitate mass production of the top cover 10. The material of the top cover 10 and the corresponding manufacturing process are not particularly limited.

Referring to fig. 8, 10 and 11 together, fig. 10 is a perspective view of a jet plate in the jet cooling device of fig. 6; fig. 11 is a schematic cross-sectional view of the jet plate of fig. 10 taken at C-C. The jet plate 20 includes a first surface 201 and a second surface 202 opposite to each other, and is provided with a jet hole 203 penetrating the first surface 201 and the second surface 202. The first surface 201 of the jet plate 20 and the top cover 10 enclose a ingredient liquid chamber 106 (as shown in fig. 8), and the space on the side of the second surface 202 facing away from the first surface 201 is a jet space 108. Wherein, the liquid separating cavity 106 is a part of the accommodating cavity 102, the jet space 108 is a part of the liquid outlet cavity 101, and the jet hole 203 is used for communicating the liquid separating cavity 106 and the jet space 108. The cooling medium is introduced into the liquid separation chamber 106 through the liquid inlet pipe 103 and enters the jet space 108 through the jet hole 203 so as to be jetted to the surface of the chip 200, so that the chip 200 is subjected to jet impingement cooling.

It should be understood that the first surface 201 is oriented in the first direction d, the at least one support 30 is fixed on the second surface 202 of the flow plate 20, when the jet cooling device 100 is mounted on the chip 200, the at least one support 30 abuts against the surface of the chip 200, the chip 200 provides a supporting force to the at least one support 30 along the first direction d, so that the at least one support 30 drives the flow plate 20 to move along the first direction d to adapt to the tolerance generated by the chip 200, and since the at least one support 30 abuts between the flow plate 20 and the chip 200, the height of the jet between the flow plate 20 and the chip 200 is related to the size of the at least one support 30, so that the height of the jet between the flow plate 20 and the chip 200 can be effectively controlled to meet the corresponding requirement by adjusting the size of the at least one support 30.

It should be noted that, when the definition of jet impingement cooling is given above, the circular or slit nozzle mentioned above can be regarded as the jet hole 203 in the embodiment of the present application. In this embodiment, the jet height is equivalent to the separation distance between the port of the jet hole 203 and the surface of the chip 200. When the spacing distance between the port of the jet hole 203 and the surface of the chip 200 is too large, the jet height is greater than the maximum effective jet height, so that a better heat dissipation effect cannot be achieved; when the spacing distance between the port of the jet hole 203 and the surface of the chip 200 is small, the jet height is smaller than or equal to the maximum effective jet height, that is, the jet height is within the ideal height range, so that a better heat dissipation effect can be achieved.

In one specific embodiment, the maximum effective jet height is 500 μm, i.e., a desirable height range is 0-500 μm. When the height of the jet flow between the chip 200 and the jet flow plate 20 is within the above-mentioned ideal height range, the cooling medium ejected from the jet flow hole 203 can be accurately and intensively ejected to the corresponding position on the surface of the chip 200, so as to effectively avoid the bypass flow of the cooling medium, thereby improving the heat dissipation effect of the chip assembly 1000. It should be understood that the spacing distance between the port of the fluidic hole 203 and the surface of the chip 200 should be greater than 0 to avoid clogging of the fluidic hole 203. It should be noted that the maximum effective jet height may be different for different use cases, and the value of the maximum effective jet height is not specifically limited herein.

Referring to Table 1, table 1 shows the jet impact simulation analysis of chips at different jet heightsAnalysis parameters and analysis results. Wherein, the analysis conditions of the simulation analysis are as follows: the power density of the chip 200 is 200W/cm ² The jet holes 203 are arranged in a 16 × 16 array, the flow rate of the cooling medium is 3L/min, and the temperature of the cooling medium is 45 ℃. In table 1 below, analysis group one, analysis group two, and analysis group three are test groups at different jet heights, respectively.

TABLE 1 analysis parameters and analysis results for jet impact simulation analysis of chips at different jet heights

Parameter(s)	Analysis group one	Analysis group two	Analysis group III
				Jet height (mm)	1.5	0.5	0.3
Maximum chip temperature (. Degree. C.)	219.3	91.16	85.98

As can be seen from table 1, the smaller the jet height between the chip 200 and the jet plate 20, the lower the maximum temperature of the chip 200, i.e., the better the heat dissipation effect of the chip 200, and when the jet height is less than or equal to 500 μm, the temperature of the chip 200 can be lowered to a suitable temperature range.

Referring to fig. 12 to 13, fig. 12 is a perspective view of a jet plate according to another embodiment; fig. 13 is a schematic cross-sectional view of the jet plate of fig. 12 taken at D-D. In one embodiment, the jet flow plate 20 includes a main body portion 21 and a connecting portion 22, the main body portion 21 includes a first surface 201 and a second surface 202 opposite to each other, the connecting portion 22 is fixedly connected to the first surface 201, the connecting portion 22 includes an inner side surface 221, a top surface 222 and an outer side surface 223 connected in sequence, and the first surface 201, the inner side surface 221, the top surface 222 and the top cover 10 enclose the sub-liquid chamber 106. It should be understood that the presence of the connecting portion 22, which makes the jet plate 20 itself groove-shaped, is beneficial for receiving the cooling medium, so that the cooling medium is uniformly distributed to and guided out of each jet hole 203. In addition, the connection portion 22 can be more stably matched and connected with the top cover 10, and the structural stability of the jet cooling device 100 is improved.

The material of which the jet plate 20 is made may be various, as long as it has a certain structural strength. In addition, the manufacturing process of the jet plate 20 may be various, for example, a machining process, an injection Molding process, or a Metal Injection Molding (MIM) process may be adopted, and these manufacturing processes are simple and facilitate mass production of the jet plate 20. The material of the jet plate 20 and the corresponding manufacturing process are not specifically limited.

Referring to fig. 14 and 15 together, fig. 14 is a schematic cross-sectional view of a jet cooling device incorporating the jet plate of fig. 12;

FIG. 15 is a schematic sectional view of a jet cooling device in another embodiment. It should be understood that there are various ways to movably connect the jet plate 20 and the top cover 10, as long as the jet plate 20 can be relatively moved along the first direction d, and the movable connection between the jet plate 20 and the top cover 10 is not specifically limited herein.

In one embodiment, the fluidic plate 20 is a clearance fit with the top cover 10 to provide a flexible connection therebetween. Wherein, clearance fit refers to: the jet plate 20 is not directly connected to the top cover 10 in the receiving cavity 102, and the jet plate 20 and the top cover 10 are engaged with each other through a gap (including a gap equal to zero, i.e., a contact state) formed between a surface of the jet plate 20 and a surface of the top cover 10, and a relative movement between the two is realized by an external force (e.g., a gravity of the jet plate 20 or a supporting force of the chip 200). With the above structure, the fluidic plate 20 has freedom of movement, thereby effectively accommodating tolerances generated by the electronic device.

Illustratively, as shown in fig. 8, there is a gap greater than zero between the fluidic plate 20 and the top cover 10, the fluidic plate 20 is movably connected with the top cover 10 in a relative spacing manner, and the fluidic plate 20 can move in a first direction d relative to the top cover 10;

illustratively, as shown in fig. 14, the top cover 10 includes an inner surface 110 opposite to an outer side surface 223, the inner surface 110 is attached to the outer side surface 223 (i.e., the gap is equal to zero), and the outer side surface 223 is oriented at an angle with respect to the first direction d, wherein the angle is 90 °. It should be understood that, in process design and production, the angle between the outer side surface 223 and the first direction d may be close to 90 °, but not 90 °, due to the limitation of error or process level, and the error of the angle caused by the process should be acceptable to those skilled in the art, and the angle should not affect the achievement of the purpose of the embodiments of the present application. Based on this, the fluidic plate 20 is also movable in the first direction d relative to the top cover 10 under the above-described configuration.

In one embodiment, the fluidic plate 20 and the top cover 10 are coupled by a sliding connection structure to achieve a flexible connection therebetween.

Exemplarily, as shown in fig. 15, a first sliding member 51 is disposed on an outer side 223 of the fluidic plate 20, a second sliding member 52 is disposed on an inner surface 110 of the top cover 10, the first sliding member 51 and the second sliding member 52 form a sliding connection structure, the first sliding member 51 and the second sliding member 52 cooperate to enable the fluidic plate 20 to be slidably connected with the top cover 10, and the first sliding member 51 and the second sliding member 52 extend along a first direction d, so that the fluidic plate 20 can move relative to the top cover 10 in the first direction d. In a specific embodiment, the first sliding member 51 is a sliding block, and the second sliding member 52 is a sliding rail.

It should be noted that the movable connection manner between the jet flow plate 20 and the top cover 10 includes, but is not limited to, the above, and may also be any movable connection manner that meets the corresponding functional requirements, which is not described herein again.

Referring to fig. 16 and 17 together, fig. 16 is a schematic cross-sectional view of a jet cooling device in another embodiment; fig. 17 is an exploded view of the fluidic cooling device shown in fig. 16. In one embodiment, the fluidic plate 20 is elastically connected to the top cover 10, and the fluidic plate 20 is elastically urged to hold the at least one supporting member 30 against the chip 200. It should be understood that the fluidic plate 20 is subjected to an elastic force in a direction away from the first direction d to enable the at least one support 30 to abut against the chip 200 and form a supporting force with the chip 200, and the at least one support 30 and the chip 200 are kept in a close contact state, so that a separation distance between the fluidic plate 20 and the chip 200 is effectively controlled, a height of the cooling medium jet therebetween is within a desired height range, and the chip 200 can effectively dissipate heat.

Illustratively, the contact portion of the fluidic plate 20 and the top cover 10 along the first direction d may be made of an elastic material, so that when the fluidic plate 20 and the top cover 10 are in contact, the contact portion of the fluidic plate 20 is elastically deformed, and the fluidic plate 20 is elastically acted by a force away from the first direction d, so as to tightly attach the at least one support 30 to the chip 200.

Illustratively, the contact portion of the top cover 10 and the fluidic plate 20 along the first direction d may also be made of an elastic material, so that when the fluidic plate 20 is in contact with the top cover 10, the contact portion of the top cover 10 is elastically deformed, and the fluidic plate 20 is elastically acted by a force away from the first direction d, so as to tightly attach the at least one support 30 to the chip 200.

As shown in fig. 16 and 17, for example, an elastic member 60 is disposed between the fluidic plate 20 and the top cover 10, and the elastic member 60 provides an elastic force to the fluidic plate 20 in the first direction d. When the fluidic plate 20 moves relatively along the first direction d, the fluidic plate 20 presses or stretches the elastic member 60, and the elastic member 60 deforms elastically to provide an elastic force to the fluidic plate 20, so that the at least one support 30 abuts against the chip 200. It should be noted that the presence of the elastic member 60 can also effectively accommodate tolerances due to insufficient machining precision or due to warpage of the chip 200, so as to improve the tolerance capability of the jet cooling device 100.

Referring to fig. 16, 18 and 19 together, fig. 18 is a schematic cross-sectional view of a jet cooling device in another embodiment;

FIG. 19 is a schematic sectional view of a jet cooling device in another embodiment. It should be understood that the distribution position of the elastic member 60 between the fluidic plate 20 and the top cover 10 can be varied, as long as the fluidic plate 20 can be provided with an elastic force away from the first direction d, so that the at least one support 30 abuts against the chip 200, and the distribution position of the elastic member 60 is not specifically limited herein.

For example, as shown in fig. 16, the elastic member 60 is disposed on a side of the fluidic plate 20 away from the support member 30, when the fluidic plate 20 is moved in the first direction d by the supporting force from the chip 200, the fluidic plate 20 presses the elastic member 60 to compress the elastic member 60, and the elastic member 60 provides an elastic thrust to the fluidic plate 20, so that the fluidic plate 20 drives at least one support member 30 to be tightly attached to the chip 200;

for example, as shown in fig. 18, the elastic member 60 is disposed on a side of the fluidic plate 20 facing the support 30, the fluidic plate 20 is fixedly connected to the elastic member 60, when the fluidic plate 20 is moved in the first direction d by the supporting force from the chip 200, the fluidic plate 20 stretches the elastic member 60 to generate a stretching deformation of the elastic member 60, and the elastic member 60 provides an elastic pulling force to the fluidic plate 20, so that the fluidic plate 20 brings at least one support 30 to be attached to the chip 200;

for example, as shown in fig. 19, the number of the elastic members 60 is plural, at least one elastic member 60 is disposed on a side of the flow plate 20 facing away from the support 30, at least one elastic member 60 is disposed on a side of the flow plate 20 facing the support 30, when the flow plate 20 is moved along the first direction d by the supporting force from the chip 200, the flow plate 20 presses the elastic member 60 away from the at least one support 30 and stretches the elastic member 60 near the at least one support 30, the elastic members 60 provide an elastic force to the flow plate 20 together, and the direction of the elastic force is away from the first direction d, so that the flow plate 20 drives the at least one support 30 to be attached to the chip 200. It should be understood that, when the number of the elastic members 60 is plural and the elastic members 60 are respectively disposed on two sides of the jet plate 20, even if the elastic member 60 on one side fails due to structural damage or other reasons, the elastic member 60 on the other side can still provide an elastic force to the jet plate 20 away from the first direction d, so that the jet cooling device 100 meets the corresponding functional requirements, and the fault tolerance of the jet cooling device 100 is improved.

It should be noted that the jet cooling device 100 is used for cooling and dissipating heat from the chip 200, and in general, the size of the jet cooling device 100 is small, the requirement on the machining precision is high, when there is a machining error, a gap is likely to exist between the jet plate 20 and the top cover 10 in the jet cooling device 100, and a part of the cooling medium is likely to be discharged from the liquid separation chamber 106 through the gap between the two, so that the flow rate of the cooling medium that is jetted to the chip 200 through the jet hole 203 is reduced, which is not favorable for effectively dissipating heat from the chip 200.

In a specific embodiment, the elastic member 60 is an elastic sealing ring (as shown in fig. 17) having a sealing function, and the elastic sealing ring can seal the gap between the jet plate 20 and the top cover 10 while achieving the elastic function, so that the cooling medium cannot flow out from the gap between the jet plate 20 and the top cover 10, and the cooling medium is completely discharged from the jet holes 203 to be jetted onto the surface of the chip 200, thereby achieving a better heat dissipation effect of the chip 200. It should be understood that the elastic member 60 may also be any other structure having both elastic and sealing functions, including but not limited to an elastic sealing ring, and the type of the elastic member 60 is not specifically limited herein.

Referring to fig. 20, fig. 20 is a partial structural schematic view of an elastic member according to an embodiment. In one embodiment, the elastic member 60 includes an elastic portion 61 and a sealing portion 62. The elastic portion 61 is used for providing an elastic force to the jet plate 20, the sealing portion 62 is used for closing a gap between the jet plate 20 and the top cover 10, and the elastic portion 61 and the sealing portion 62 are combined together to form the elastic member 60, so that the elastic member 60 has both elastic and sealing functions. In a specific embodiment, the elastic portion 61 is a spring, and the sealing portion 62 is an annular flexible sleeve, and the spring is accommodated in the annular flexible sleeve to form the elastic member 60 with a sealing function. The two ends of the spring are respectively connected to the jet plate 20 and the top cover 10, and when the jet plate 20 moves along the first direction d, the spring provides an elastic acting force to the jet plate 20, which is deviated from the first direction d; the annular flexible sleeve can deform, and is in a compressed state between the jet flow plate 20 and the top cover 10 to close the gap between the jet flow plate 20 and the top cover 10, but because the annular flexible sleeve does not have enough rigidity, the resilience is weak, and effective elastic acting force cannot be provided for the jet flow plate 20. Therefore, the annular flexible sleeve and the spring are combined to form the elastic member 60 having both elastic and sealing functions.

Referring also to fig. 21, fig. 21 is a cross-sectional view of another embodiment of a jet cooling device. In one embodiment, a sealing member 70 is further disposed between the fluidic plate 20 and the top cover 10, and the sealing member 70 is spaced apart from the elastic member 60. The elastic member 60 only needs to have an elastic function, and does not need to have an additional sealing function. In one embodiment, the resilient member 60 is a spring disposed between the flow plate 20 and the top cover 10 to provide a resilient force to the flow plate 20 in a direction away from the first direction d.

The sealing member 70 is disposed between the flow plate 20 and the top cover 10 and spaced apart from the elastic member 60 to close a gap between the flow plate 20 and the top cover 10, thereby performing a sealing function. In one particular embodiment, the seal 70 is an "O" ring. Grooves are formed on the outer side 223 of the jet plate 20 or the inner surface 110 of the top cover 10, and the "O" ring is in interference fit in the grooves to support the jet plate 20 and the top cover 10, so as to seal the gap between the jet plate 20 and the top cover 10, thereby achieving a sealing effect. It should be understood that the sealing member 70 may be any other structure having a sealing function, and the structure of the sealing member 70 is not particularly limited.

Referring to fig. 22 and 23, fig. 22 is a perspective view of another embodiment of the fluidic plate and at least one support member from another perspective; FIG. 23 is a cross-sectional view of a jet cooling device incorporating the jet plate and at least one support of FIG. 22. In one embodiment, the second surface 202 of the fluidic plate 20 further comprises a nozzle 23, and the nozzle 23 is located in the fluidic space 108 between the fluidic plate 20 and the chip 200. The nozzle 23 is penetrated with a jet channel 231, the jet channel 231 is communicated with the jet hole 203, and the cooling medium passes through the jet hole 203 and the jet channel 231 in sequence to be jetted on the chip 200, so that the heat of the chip 200 is dissipated. It will be appreciated that the presence of the nozzle 23 allows the cooling medium to be more precisely impinged onto the heat generating portions of the chip 200, thereby achieving more efficient cooling and heat dissipation.

In a specific embodiment, a plurality of fluidic channels 231 extend through one nozzle 23, and each of the plurality of fluidic channels 231 is in communication with one of the fluidic holes 203. It should be understood that when the plurality of nozzles 23 are spaced apart by a greater distance, a plurality of fluidic channels 231 may be disposed within each nozzle 23, and the presence of the plurality of fluidic channels 231 may provide more uniform and dense jet impingement cooling of the chip 200.

The nozzle 23 comprises an end surface 232 far away from the second surface 202 and a peripheral surface 233 connecting the second surface 202 and the end surface 232, the jet flow channel 231 penetrates through the end surface 232 of the nozzle 23, and a spacing space 234 is formed between the peripheral surfaces 233 of every two adjacent nozzles 23. In this embodiment, the jet height is equivalent to the separation distance between the end face 232 of the nozzle 23 and the surface of the chip 200. The cooling medium is ejected from the end surface 232 through the jet flow channel 231, and after heat exchange with the chip 200, the cooling medium can be accommodated in the space 234 and discharged from the space 234 through the liquid outlet pipe 104. It should be appreciated that the cooling medium is emitted from the fluidic channel 231 to form a jet, which is at a relatively low temperature before contacting the chip 200. After the jet impinges on the surface of the chip 200, the cooling medium is dispersed at the surface of the chip 200 and exchanges heat with the chip 200, thereby forming a reflow having a relatively high temperature. It should be noted that, if the backflow with a higher temperature contacts the jet with a lower temperature in a large area, the flow of the backflow may affect the jetting accuracy of the jet, and may easily cause the temperature of the jet to increase, which is not favorable for cooling the chip 200. In the embodiment, due to the existence of the spacing space 234, the jet emitted from the end surface 232 is spaced from the backflow contained in the spacing space 234, so that the jet is not interfered by the backflow, and can be kept at a lower temperature to accurately impinge on the heating portion of the chip 200, thereby effectively improving the heat dissipation effect on the chip 200.

It should be noted that in the jet cooling device 100 provided in the embodiment of the present application, the jet hole 203 on the jet plate 20 is usually plural to correspond to a heat generating portion on the chip 200. As can be seen from the above description, the heat generating portion of the chip 200 is mainly the area where the plurality of dies are located, wherein the middle area 2001 where the die with the logic operation function is located is the main heat generating portion, and the edge area 2002 where the die with the memory function is located is the next-level heat generating portion. Correspondingly, the second surface 202 of the fluidic board 20 may be divided into a first region 2021 and a second region 2022, the first region 2021 corresponding to the middle region 2001 of the chip 200, and the second region 2022 surrounding the first region 2021 to correspond to the edge region 2002 of the chip 200. The plurality of jet holes 203 are distributed in the first region 2021 and the second region 2022 in an array, and the cooling medium is jetted to the heat generating portion of the chip 200 through the jet holes 203, so as to achieve a better heat dissipation effect.

Based on this, a plurality of nozzles 23 may be disposed in the first region 2021 and the second region 2022, and the jet channels 231 of the plurality of nozzles 23 are in one-to-one correspondence with the plurality of jet holes 203 located in the first region 2021 and the second region 2022, so as to further improve the cooling and heat dissipation effects on the chip 200.

Referring to fig. 24 and 25 together, fig. 24 is a perspective view of another embodiment of the fluidic plate and at least one support member from another perspective; FIG. 25 is a cross-sectional view of a jet cooling device incorporating the jet plate and at least one support of FIG. 24. In one embodiment, in order to reduce the process cost and the processing difficulty, the nozzles 23 may be disposed in the first region 2021 only, that is, the nozzles 23 are correspondingly communicated with the jet holes 203 in the first region 2021 one by one, so that the middle region 2001, which mainly generates heat, on the chip 200 can be effectively cooled, and a corresponding cooling effect can be achieved.

It should be noted that, in some specific structures, if the main heat generating portion of the chip 200 is located in the edge area 2002, the nozzles 23 may also be disposed only in the second area 2022, that is, the nozzles 23 are only in one-to-one correspondence with the jet holes 203 in the second area 2022, so that the edge area 2002 on the chip 200, which mainly generates heat, can be effectively cooled, and a corresponding cooling effect can be achieved.

Referring to fig. 26 and 27 together, fig. 26 is a schematic bottom view of an embodiment of a fluidic plate and at least one support;

fig. 27 is a schematic view of the heat dissipation of the warped chip using the current plate and at least one support shown in fig. 26. At least one support 30 is fixedly connected to the second surface 202 of the fluidic plate 20, and each support 30 includes a supporting surface 301 facing away from the second surface 202, and the supporting surface 301 is used for supporting the chip 200, so that a fluidic space 108 is formed between the second surface 202 and the chip 200. In a specific embodiment, the supporting member 30 is a column, one end of the column-shaped supporting member 30 is fixed to the second surface 202 of the current plate 20, and the end surface 232 of the other end is a supporting surface 301, and the supporting surface 301 is supported on the chip 200. In this embodiment, the material of the support 30 may be the same as the material of the fluidic plate 20, i.e., the material of the support 30 is a metallic material or a non-metallic material with certain structural strength, and in a specific embodiment, the material of the support 30 is copper. It should be noted that the material of the supporting member 30 may be various, as long as the corresponding functional requirements can be met, and the material of the supporting member 30 is not specifically limited herein. In another specific embodiment, the at least one supporting member 30 includes a first magnet and a second magnet with the same polarity, the first magnet is fixedly connected to the second surface 202, an end surface 232 of the second magnet far from the first magnet is a supporting surface 301, the supporting surface 301 is supported on the chip 200, and the at least one supporting member 30 is supported between the fluidic plate 20 and the chip 200 in a magnetic suspension manner due to the magnetic repulsion between the first magnet and the second magnet. It should be understood that the structure of the supporting member 30 includes, but is not limited to, the above, and may be any other structure satisfying the corresponding functional requirements, and the structure of the supporting member 30 is not specifically limited herein.

It should be noted that, a split structure may be provided between the support 30 and the jet flow plate 20, and the support 30 may be fixedly connected with the jet flow plate 20 by welding, gluing or any other connection method, where the connection method between the support 30 and the jet flow plate 20 is not specifically limited; the support member 30 and the jet flow plate 20 can be integrated, the support member 30 and the jet flow plate 20 can be integrally formed by the same manufacturing process, and when the support member 30 and the jet flow plate 20 are integrated, the structure is stable, so that the structural stability of the jet flow cooling device 100 is effectively improved.

When the jet cooling device 100 is mounted on the chip 200, the top cover 10 is fixedly connected with the base plate 300, the chip 200 on the base plate 300 is in contact with the abutting surface 301 of the at least one support 30, and provides a supporting force in the first direction d for the abutting surface 301, and the at least one support 30 is acted by the supporting force to drive the jet plate 20 to move in the first direction d, so that the jet height between the jet plate 20 and the chip 200 is related to the size of the at least one support 30 in the first direction d.

It should be understood that when nozzle 23 is not disposed on fluidic plate 20, the height of the jet of cooling medium between fluidic plate 20 and chip 200 is equivalent to the separation distance between the port of fluidic hole 203 on second surface 202 and the surface of chip 200. Since the at least one supporting member 30 is fixed to the second surface 202, and the abutting surface 301 of the at least one supporting member 30 away from the second surface 202 abuts against the chip 200. Thus, the cooling medium is sprayed at the same height between the spray plate 20 and the chip 200 as the at least one support 30 is dimensioned in the first direction d. When the dimension of the at least one support 30 in the first direction d is smaller than or equal to the maximum effective jet height, the jet height of the cooling medium between the jet plate 20 and the chip 200 may meet the corresponding requirement. It should also be appreciated that when the nozzle 23 is disposed on the second surface 202 of the fluidic plate 20, the height of the cooling medium jet between the fluidic plate 20 and the chip 200 is equivalent to the separation distance between the end face 232 of the nozzle 23 and the surface of the chip 200. Since the at least one supporting member 30 is fixed to the second surface 202, and the abutting surface 301 of the at least one supporting member 30 away from the second surface 202 abuts against the chip 200. Thus, the height of the jet of cooling medium between the jet plate 20 and the chip 200 is equivalent to the difference in the dimensions of the at least one support 30 and the nozzle 23 in the first direction d. When the difference in the dimensions of the at least one support 30 and the nozzle 23 in the first direction d is smaller than or equal to the maximum effective jet height, the jet height of the cooling medium between the jet plate 20 and the chip 200 can meet the corresponding requirement.

It should also be understood that, when the jet cooling device 100 provided in the embodiment of the present application and the warped chip 200 are mounted, the warped portion of the chip 200 can also provide a supporting force in the first direction d to the abutting surface 301 in contact with the warped chip 200, so that the at least one support 30 drives the jet plate 20 to move accordingly, so that the jet height between the surface of the warped chip 200 and the jet plate 20 is also less than or equal to the maximum effective jet height, thereby obtaining effective heat dissipation.

As shown in fig. 26 and 27, in the case of the chip 200 warped in the shape of a "crying face", that is, the middle region 2001 of the chip 200 is warped in a direction away from the substrate 300, and the edge region 2002 of the chip 200 is further away from the jet cooling device 100 than the middle region 2001. At least one supporting element 30 may be distributed in the second region 2022, and the abutting surface 301 of the at least one supporting element 30 abuts against the edge region 2002 of the chip 200 or the waterproof portion around the edge region 2002. In a specific embodiment, the at least one support 30 is distributed on the fluidic plate 20 at four corners of the second surface 202.

Under the above structure, since the jet height between the jet plate 20 and the chip 200 is related to the dimension of the at least one support 30 along the first direction d, the jet height of the chip 200 between the warped edge area 2002 and the jet plate 20 is equal to the dimension of the at least one support 30 along the first direction d, i.e. less than or equal to the maximum effective jet height, so as to effectively dissipate heat from the edge area 2002 of the chip 200; the middle region 2001 of the chip 200 is closer to the fluidic plate 20 than the edge region 2002, so that the fluidic height of the chip 200 between the middle region 2001 and the fluidic plate 20 is likewise smaller than the maximum effective fluidic height, so that the middle region 2001 of the chip 200 is also effectively cooled.

Referring to fig. 28 and 29 together, fig. 28 is a schematic bottom view of another embodiment of a fluidic plate and at least one support; fig. 29 is a schematic diagram of a heat dissipation method for a warped chip using the fluidic plate shown in fig. 28 and at least one support member. As shown in fig. 28 and 29, for the chip 200 warped in a "smile" shape, i.e., the edge area 2002 of the chip 200 is warped in a direction away from the substrate 300, the edge area 2002 of the chip 200 is closer to the jet cooling device 100 than the middle area 2001. The at least one supporting element 30 may be distributed in the first region 2021, and the abutting surface 301 of the at least one supporting element 30 abuts against the middle region 2001 of the chip 200. In a specific embodiment, the at least one support 30 is distributed on the fluidic plate 20 in a central position on the second surface 202.

Under the above structure, since the jet height between the jet plate 20 and the chip 200 is related to the dimension of the at least one support 30 along the first direction d, the jet height of the chip 200 between the middle region 2001 and the jet plate 20 is equal to the dimension of the at least one support 30 along the first direction d, i.e. less than or equal to the maximum effective jet height, so as to effectively dissipate heat from the middle region 2001 of the chip 200; the edge region 2002 of the chip 200 is closer to the fluidic plate 20 than the middle region 2001, and therefore the fluidic height of the chip 200 between the edge region 2002 and the fluidic plate 20 is also less than the maximum effective fluidic height, so that the edge region 2002 of the chip 200 is also effectively dissipated.

It should be understood that, for different warped chips 200, the supports 30 may be distributed at different positions on the fluidic board 20, so that the height of the jet between the warped chip 200 and the fluidic board 20 satisfies the corresponding requirement, i.e. is less than or equal to the maximum effective jet height, so as to effectively dissipate heat from the warped chip 200, and the distribution positions of the supports 30 are not specifically defined herein.

Referring to fig. 30, fig. 30 is a schematic cross-sectional view of a jet cooling device in another embodiment. For the wafer-level chip 200, the chip 200 has a large size, and the height difference of the whole surface formed by the warpage deformation is large, so that when the chip is cooled by using the jet flow cooling device 100, it is difficult to make the jet flow height between each position on the surface of the chip 200 and the jet flow plate 20 meet the corresponding requirement.

The embodiment of the present application further provides a jet cooling device 100, where the jet cooling device 100 is different from the jet cooling device 100 provided in the above embodiment in that: the top cover 10 of the jet cooling device 100 includes a plurality of accommodating cavities 102, the plurality of accommodating cavities 102 are spaced apart from each other and are all communicated with the liquid inlet pipe 103, each accommodating cavity 102 accommodates one jet plate 20, and a first surface 201 of each jet plate 20 and the top cover 10 enclose to form a liquid distribution cavity 106. When the jet cooling device 100 provided in this embodiment is used to cool and dissipate heat of the wafer-level chip 200, each jet plate 20 corresponds to a portion of the surface area of the wafer-level chip 200, and the cooling medium is jetted from the liquid separation chamber 106 to the corresponding area of the chip 200 through the corresponding jet plate 20, so as to cool and dissipate heat of the chip 200 in the area. It should be understood that, when the wafer-level chip 200 is divided into a plurality of regions for respective heat dissipation, the difference in height between the surfaces of the chip 200 in each region due to warpage deformation is small, and because at least one supporting member 30 is disposed on the jet plate 20 corresponding to each region, and the abutting surface 301 of at least one supporting member 30 abuts against the surface of the chip 200 in the corresponding region, the jet height between the surface of the chip 200 in the corresponding region and the corresponding jet plate 20 can satisfy the corresponding requirement, that is, less than or equal to the maximum effective jet height, so that the chip 200 can be effectively dissipated in each region, and the wafer-level chip 200 can be effectively dissipated as a whole.

In one embodiment, the top cover 10 of the jet cooling device 100 is further provided with a liquid inlet cavity 105, and the liquid inlet cavity 105 is disposed between the liquid inlet pipeline 103 and the plurality of liquid distribution cavities 106 for communicating the liquid inlet pipeline 103 with the plurality of liquid distribution cavities 106. It should be understood that when the jet cooling device 100 provided by the present embodiment is used to cool and dissipate heat of the wafer-level chip 200, the cooling medium enters the liquid inlet chamber 105 through the liquid inlet pipe 103 and is uniformly distributed to each liquid distribution chamber 106 through the liquid inlet chamber 105, and the cooling medium in each liquid distribution chamber 106 is uniformly distributed to each jet hole 203, so that the cooling medium is uniformly sprayed onto the surface of the chip 200, thereby achieving a better heat dissipation effect.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application; the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A jet cooling device for cooling a chip fixed on a substrate, wherein the jet cooling device comprises:

The top cover is provided with a accommodating cavity and a liquid inlet pipe for fixed connection with the base plate;

a jet plate, accommodated in the accommodating cavity and movably connected to the top cover, the jet plate includes a first surface and a second surface opposite to each other, and is provided with a penetration through the first surface and the second surface The jet hole is formed between the first surface and the top cover to form a liquid separation chamber, the space on the side of the second surface away from the first surface is a jet space, and the jet hole is used to communicate with all the separation chamber and the jet space; and

At least one support member is fixedly connected to the second surface, and each support member includes a bearing surface facing away from the second surface, and the bearing surface is used to abut the chip.

2 . The jet cooling device according to claim 1 , wherein the jet plate and the top cover are in clearance fit to realize the movable connection between the two. 3 .

3 . The jet cooling device according to claim 2 , wherein the jet plate can move relative to the top cover in the first direction, the jet plate includes an outer side surface, and the top cover includes a fitting surface. 4 . On the inner surface of the outer side surface, the orientation of the first surface is the first direction, and an angle is formed between the orientation of the outer side surface and the first direction.

4 . The jet cooling device according to claim 1 , wherein the jet plate and the top cover cooperate with each other through a sliding connection structure, so as to realize the movable connection between the two. 5 .

5 . The jet cooling device according to claim 4 , wherein the jet plate includes an outer side surface, the top cover includes an inner surface opposite to the outer side surface, and the first surface is oriented toward the first surface. 6 . direction, an angle is formed between the orientation of the outer side surface and the first direction;

The outer surface is provided with a first sliding piece, the inner surface is provided with a second sliding piece, the first sliding piece and the second sliding piece constitute the sliding connection structure, and the first sliding piece The member and the second sliding member extend along the first direction to enable the jet plate to move relative to the top cover in the first direction.

6 . The jet cooling device according to claim 1 , wherein the jet plate is elastically connected to the top cover, and the jet plate is subjected to an elastic force, so that the abutting surface abuts the chip. 7 .

7 . The jet cooling device according to claim 6 , wherein an elastic member is provided between the jet plate and the top cover, and the elastic member provides an elastic effect on the jet plate away from the first direction. 8 . force, the orientation of the first surface is the first direction.

8 . The jet cooling device according to claim 7 , wherein the elastic member is provided on a side of the jet plate facing away from the at least one support member. 9 .

9 . The jet cooling device according to claim 7 , wherein the elastic member is provided on a side of the jet plate facing the at least one support member. 10 .

10 . The jet cooling device according to claim 7 , wherein the number of the elastic members is plural, and at least one of the elastic members is provided on the side of the jet plate away from the at least one support member, 10 . At least one of the elastic members is disposed on the side of the jet plate facing the at least one support member.

11 . The jet cooling device according to claim 7 , wherein the elastic member is an elastic sealing ring, and the elastic member closes the gap between the jet plate and the top cover. 12 .

12. The jet cooling device according to claim 7, wherein the elastic member comprises an elastic part and a sealing part, the elastic part is used for providing elastic force to the jet plate, and the sealing part is used for Close the gap between the jet plate and the top cover.

13 . The jet cooling device according to claim 7 , wherein a sealing member is further provided between the jet plate and the top cover, the sealing member and the elastic member are spaced apart, and the sealing member is 13 . Used to close the gap between the elastic piece and the top cover.

14. The jet cooling device according to claim 1, characterized in that, the jet cooling device further comprises a limiting member, the limiting member is connected to the top cover, and the limiting member includes a position facing the branch A limit surface of the liquid chamber, a movable space is formed between the limit surface and the top cover, and the jet plate is limited in the movable space.

15 . The jet cooling device according to claim 1 , wherein a nozzle is further protruded from the second surface, and the nozzle is located in the jet space; 15 .

The nozzle is provided with a jet channel, and the jet channel communicates with the jet hole.

16. The jet cooling device according to claim 15, wherein the nozzle comprises an end face away from the second surface, and a peripheral surface connecting the second surface and the end face, the jet passage passing through On the end face, an interval space is formed between the peripheral faces of every two adjacent nozzles, and the cooling medium can be accommodated in the interval space after being ejected from the end face through the jet channel.

17 . The jet cooling device according to claim 15 , wherein the number of the jet holes is plural, and the plurality of the jet hole arrays are distributed in the first area and the second area of the second surface, 17 . The second area surrounds the first area, the first area corresponds to the middle area of the chip, and the second area corresponds to the edge area of the chip;

A plurality of the nozzles are arranged in the first area, and the jet channels of the plurality of nozzles are in one-to-one correspondence with the plurality of the jet holes located in the first area.

18. The jet cooling device according to claim 15, wherein a plurality of the nozzles are also provided in the second area, and the plurality of jet channels of the nozzles are connected with the nozzles located in the first area and the second area. The plurality of jet holes in the second region are connected in one-to-one correspondence.

19. The jet cooling device according to claim 1, wherein the jet height of the cooling medium between the jet plate and the chip is less than or equal to 500 μm;

Wherein, the orientation of the first surface is the first direction, and along the first direction, the jet height is the initial position where the cooling medium is ejected from the jet plate, and the jet reaches the chip. The height between the final positions on .

20. The jet cooling device of claim 19, wherein the jet height is equal to the dimension of the at least one support along the first direction;

The dimension of the at least one support along the first direction is less than or equal to 500 μm.

21 . The jet cooling device according to claim 19 , wherein a nozzle is further protruded from the second surface, the nozzle is located in the jet space, the nozzle is provided with a jet channel, and the jet The channel is communicated with the jet hole, and the support member and the nozzle are arranged at intervals;

In the first direction, the size of the at least one support is larger than the size of the nozzle, and the jet height is equal to the size difference between the at least one support and the nozzle in the first direction value, the size difference is less than or equal to 500 μm.

22. The jet cooling device of claim 17, wherein the at least one support is distributed within the second region.

23. The jet cooling device according to any one of claims 1-22, wherein the top cover comprises a plurality of the accommodating cavities, and the plurality of the accommodating cavities are arranged at intervals, and each of the accommodating cavities Each of them accommodates one of the jet plates;

The first surface of each jet plate is enclosed with the top cover to form one of the liquid separation chambers.

24 . The jet cooling device according to claim 23 , wherein the top cover is further provided with a liquid inlet cavity, and the liquid inlet cavity is provided between the liquid inlet pipeline and the plurality of the liquid separation chambers. 25 . , the liquid inlet chamber is used to communicate the liquid inlet pipe and the liquid separation chamber.

25. A chip assembly, characterized by comprising a chip, a substrate and the jet cooling device according to any one of claims 1-24, wherein the chip and the jet cooling device are both connected to the substrate, and the The jet cooling device is enclosed with the substrate to form a liquid outlet cavity, and the chip is accommodated in the liquid outlet cavity;

Wherein, the orientation of the first surface of the jet plate is the first direction; the chip is facing the jet hole and abuts against the abutting surface of the at least one support member.

26. An electronic device, characterized in that the electronic device comprises a circuit board and the chip assembly according to claim 25, the chip assembly being fixed to the circuit board.