CN115206902B - Chip packaging structure and manufacturing method thereof - Google Patents

Abstract

The invention discloses a chip packaging structure and a manufacturing method thereof, including a substrate, at least one chip, a plurality of conductive joints and an epoxy resin film, the chip is arranged above the substrate through the conductive joints; and a barrier structure is also included In the partial area of the upper surface of the substrate outside the conductive joint, the barrier structure is configured to prevent the epoxy resin film from entering the inner area of the barrier structure; the epoxy resin film covers the upper surface and the side surface of the chip and the outer surface of the barrier structure, extending along the side surface of the chip and the outer surface of the barrier structure to the upper surface of the substrate, and a cavity is formed between the epoxy resin film, the chip, the substrate and the barrier structure. During the coating process, the barrier structure can effectively prevent the resin material overflowing from the epoxy resin film from entering the cavity area between the chip and the substrate, so as to prevent the conductive junction and the cavity area from being polluted.

Description

Chip package structure and manufacturing method thereof

technical field

The invention relates to the technical field of semiconductor packaging, in particular to a chip packaging structure and a manufacturing method thereof.

Background technique

As shown in Figure 1, it is an existing filter chip packaging structure, the functional surface of the chip 2 is flip-chip soldered on the substrate 1 through metal balls, and the entire surface of the epoxy resin film 4 covers the upper surface of the substrate 1 and the chip 2. The non-functional surface makes a cavity formed between the chip 2 and the substrate 1 and the epoxy resin film 4 .

However, the existing packaging structure has the following two problems: first, when the epoxy resin film 4 and the surface of the substrate 1 are pressed together, the overflowing resin in the epoxy resin film 4 is easy to enter the cavity and pollute the ball post and the effective area of the chip , reduce the performance of the filter product; second, due to the internal and external pressure difference of the packaging structure during the product operation, there is a risk that the epoxy resin film 4 on the side will be washed away.

Contents of the invention

The object of the present invention is to provide a chip packaging structure and its manufacturing method, so as to prevent the resin material overflowing from the epoxy resin film from entering the cavity area between the chip and the substrate, and prevent the conductive junction and the cavity area from being polluted.

In order to achieve one of the objectives of the above invention, an embodiment of the present invention provides a chip packaging structure, including a substrate, at least one chip, a plurality of conductive joints, and an epoxy resin film. The upper surface of the substrate is provided with a plurality of soldering regions. The chip is disposed above the substrate through the conductive joint, and the conductive joint is disposed corresponding to the welding area, wherein the chip packaging structure further includes a blocking structure, and the blocking structure is disposed on the A partial area of the upper surface of the substrate outside the conductive joint, the barrier structure is configured to prevent the epoxy resin film from entering the inner area of the barrier structure;

The epoxy resin film covers the upper surface and the side surface of the chip and the outer surface of the barrier structure, and extends along the side surface of the chip and the outer surface of the barrier structure to the upper surface of the substrate , a cavity is formed among the epoxy resin film, the chip, the substrate and the barrier structure.

As a further improvement in an embodiment of the present invention, the barrier structure surrounds the upper surface area of the substrate disposed outside the conductive joint.

As a further improvement in an embodiment of the present invention, the inner surface of the barrier structure does not exceed the edge area of the chip.

As a further improvement in an embodiment of the present invention, the blocking structure includes a blocking part and a drainage part, the blocking part is configured to prevent the epoxy resin film from entering the cavity, and the drainage part is configured It is used for draining the epoxy resin film away from the conductive joint.

As a further improvement in one embodiment of the present invention, the blocking structure is an L-shaped structure, the drainage part is arranged on the upper surface of the substrate, and the blocking part is close to one end of the conductive joint along the drainage part. protruding upward from the substrate.

As a further improvement in an embodiment of the present invention, a part of the upper surface of the substrate is recessed inward to form a groove, and the groove is disposed on a side of the barrier structure away from the conductive joint.

As a further improvement in an embodiment of the present invention, the inner surface of the groove is arranged on the same vertical line as the side of the blocking structure away from the conductive joint.

As a further improvement in an embodiment of the present invention, the groove surrounds the blocking structure.

As a further improvement in one embodiment of the present invention, the bottom of the groove is configured as a stepped structure, and the depth of the groove increases gradually toward a direction away from the blocking structure.

One embodiment of the present invention also provides a method for manufacturing a chip packaging structure, including the steps of:

A substrate is provided, the upper surface of the substrate is provided with a plurality of welding areas, and a blocking structure is provided at a part of the upper surface of the substrate outside the welding areas;

providing at least one chip, and disposing the chip above the substrate corresponding to the welding area through a conductive joint;

providing an epoxy resin film, extruding the epoxy resin film to cover the upper surface and the side surface of the chip and the outer surface of the barrier structure, and along the side surface of the chip and the barrier structure The outer surface of the outer surface extends to the upper surface of the substrate, and a cavity is formed among the epoxy resin film, the chip, the substrate and the blocking structure.

As a further improvement in one embodiment of the present invention, a substrate is provided, the upper surface of the substrate is provided with a plurality of welding areas, and a blocking structure is provided at a part of the upper surface of the substrate outside the welding areas, specifically include:

A blocking structure is provided on the upper surface of the substrate around the outer side of the welding area;

The blocking structure is arranged at least 30 μm apart from the nearest welding area, and the inner surface of the blocking structure does not exceed the edge area of the chip;

The height of the barrier structure is set not to exceed 1/2 of the height of the conductive joint.

As a further improvement in one embodiment of the present invention, a substrate is provided, the upper surface of the substrate is provided with a plurality of welding areas, and a blocking structure is provided at a part of the upper surface of the substrate outside the welding areas, specifically Also includes:

The blocking structure is set in an L-shaped structure, including a blocking portion and a draining portion, the draining portion is arranged on the upper surface of the substrate, and the blocking portion is moved toward the A protrusion is arranged above the substrate.

As a further improvement in one embodiment of the present invention, before the at least one chip is provided, further steps are included:

On the side of the barrier structure away from the conductive joint part, a groove is recessed inwardly at a part of the upper surface of the substrate.

As a further improvement in an embodiment of the present invention, on the side of the barrier structure away from the conductive joint part, a groove is formed inwardly recessed at a partial area of the upper surface of the substrate, which specifically includes:

The groove is arranged around the blocking structure, and the inner side of the groove is arranged on the same vertical line as the side of the blocking structure away from the conductive joint;

The bottom of the groove is formed into a stepped structure, and the depth of the groove gradually increases in a direction away from the blocking structure.

The beneficial effects of the present invention are: by setting a blocking structure on the upper surface of the substrate outside the conductive joint, and the blocking structure does not exceed the edge area of the chip, in the film coating process, the blocking structure can effectively block The resin material overflowed from the epoxy resin film enters the cavity area between the chip and the substrate, preventing contamination of the conductive junction and the cavity area.

Description of drawings

FIG. 1 is a schematic diagram of a chip package structure in a common technology.

FIG. 2 is a schematic flowchart of a manufacturing method of a chip packaging structure in an embodiment of the present invention.

3 to 7 are process steps diagrams of a method for manufacturing a corresponding chip packaging structure in an embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some, not all, embodiments of the present invention. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

For the convenience of description, terms representing relative positions in space are used herein for description, such as "upper", "lower", "rear", "front", etc., which are used to describe the relative position of one unit or feature shown in the drawings relative to another. A unit or feature relationship. Spatially relative terms may encompass different orientations of the device in use or operation other than the orientation shown in the figures. For example, if the device in the figures is turned over, elements described as "below" or "above" other elements or features would then be oriented "below" or "above" the other elements or features. Thus, the exemplary term "below" can encompass both a spatial orientation of below and above.

As shown in FIG. 7 , an embodiment of the present invention provides a chip packaging structure, including a substrate 1 , at least one chip 2 , a plurality of conductive joints 3 and an epoxy resin film 4 .

The substrate 1 has an upper surface and a lower surface opposite to the upper surface, and a plurality of welding areas 11 are disposed on the upper surface of the substrate 1 .

Exemplarily, in this embodiment, a chip 2 is provided, and the chip 2 is arranged on the upper surface of the substrate 1 and is electrically connected to the substrate 1. Specifically, the chip 2 has a functional surface provided with a pad and is opposite to the functional surface. The non-functional surface of the chip 2 is set facing the substrate 1, and is electrically connected to the substrate 1 through the pad. In other embodiments of the present invention, two or more chips may also be arranged on the upper surface of the substrate 1 to meet different requirements of products.

More specifically, the chip 2 is disposed above the substrate 1 through the conductive joint 3 , and the conductive joint 3 is disposed corresponding to the soldering area 11 on the upper surface of the substrate 1 and the pad on the functional surface of the chip 2 . In this embodiment, the conductive bonding portion 3 is a metal ball, and the metal ball may be a solder ball, a gold ball eutectic solder, or the like. The present invention does not limit the specific setting height of the metal ball post, which can be adjusted according to different requirements of the product or subsequent requirements for the height of the cavity formed by manufacturing.

Further, the chip packaging structure also includes a blocking structure 5, which is arranged on the upper surface part of the substrate 1 outside the conductive joint 3, and the blocking structure 5 is configured to prevent the epoxy resin film 4 from entering the blocking structure. The inner area of the component 5 , that is, prevents the entry of the epoxy resin film 4 into the area of the structural component 5 near the conductive joint 3 .

The epoxy resin film 4 covers the upper surface and the side surface of the chip 2 and the outer surface of the barrier structure 5, and extends to the upper surface of the substrate 1 along the side surface of the chip 2 and the outer surface of the barrier structure 5. The epoxy resin film 4 , the chip 2 , the substrate 1 and the barrier structure 5 form a cavity 6 . The epoxy resin film 4 will be in a hardened state after being baked under high temperature conditions, and will firmly bond the chip 2 and the substrate 1 together to form a cavity 6, which will protect the functional surface of the chip 2 to a certain extent. During the pressing process of the epoxy resin film 4 and the chip 2 and the substrate 1, the overflowing resin material of the epoxy resin film 4 is likely to pollute the conductive junction 3 and the cavity 6, so the barrier structure provided in the present invention 5 can well block the overflowing resin material of the epoxy resin film 4 and prevent it from polluting the conductive joint 3 and the cavity 6 .

Of course, in other embodiments of the present invention, a DAF (Die Attachment Film) film can also be used instead of the epoxy resin film 4, and the substrate 1 and the chip 2 can also be fixed and combined to form the cavity 6, and it can be baked under high temperature conditions. After being hardened, it can also fix and protect the packaging structure.

Specifically, the barrier structure 5 surrounds the upper surface area of the substrate 1 arranged outside the conductive joint 3, that is, the barrier structure 5 forms a square or ring structure around the outside of the conductive joint 3, or forms a structure of other shapes. , the present invention is not limited here, it only needs to ensure that the position of the blocking structure 5 is located outside the conductive joint 3 and does not exceed the edge area of the chip 2 .

More specifically, the inner side of the barrier structure 5 , that is, the side of the barrier structure 5 facing the conductive joint 3 is not set beyond the edge area of the chip 2 , further reducing the possibility of the epoxy resin film 4 entering the cavity 6 . At the same time, considering the machine precision of actually mounting the chip 2, the distance between the barrier structure 5 and its nearest conductive joint 3 is at least 30 μm, so as to prevent the machine from hitting the barrier structure 5 when the chip 2 is mounted in the manufacturing process of the packaging structure. Chip 2 causes damage.

In the best embodiment of the present invention, the upper surface of the blocking structure 5 is in contact with the lower surface of the chip 2, which can completely block the overflow of the resin material from the epoxy resin film 4 in the subsequent process from entering between the chip 2 and the substrate 1. cavity area. However, considering that in the actual manufacturing process, for example, the conductive joint 3 will be in a molten state during reflow soldering, it is difficult to ensure the height between the lower surface of the chip 2 and the upper surface of the substrate 1 in the final product formed. Poor stability, that is, it is difficult to determine the specific height of the blocking structure 5 in actual product production. If the height of the barrier structure 5 is set too high, the barrier structure 5 will easily damage the functional surface of the chip 2 when the conductive joint 3 melts in the reflow soldering process and the height of the chip 2 will be reduced. Therefore, in the specific embodiment of the present invention, The height of the barrier structure 5 is set not to exceed 1/2 of the height of the conductive joint 3 before reflow soldering. At the same time, the height of the blocking structure 5 cannot be set too low. If the height of the blocking structure 5 is set too low, it is difficult to ensure whether the blocking structure 5 can effectively prevent the resin material overflowing from the epoxy resin film 4 from entering the chip 2 and the chip 2. Cavity area between substrates 1. The present invention does not limit the specific setting value of the height of the blocking structure 5, it only needs to ensure that the upper surface of the blocking structure 5 in the subsequent process will not damage the functional surface of the chip 2, and at the same time effectively block the epoxy resin The effect of the overflowing resin material of the film 4 is enough.

Specifically, the blocking structure 5 includes a blocking portion 51 and a drainage portion 52, the blocking portion 51 is configured to prevent the epoxy resin film 4 from entering the cavity 6, and the drainage portion 52 is configured to drain away from the conductive bonding portion 3 Epoxy film4.

The blocking structure 5 is specifically an L-shaped structure, the drainage part 52 is arranged on the upper surface of the substrate 1, and the blocking part 51 protrudes toward the upper side of the substrate 1 along the drainage part 52 near the end of the conductive joint part 3, and the blocking part 51 is close to the conductive joint part. One side of 3 is not set beyond the edge area of chip 2. Specifically, the side surface of the drain part 52 away from the conductive joint 3 is aligned with the side surface of the chip 2, and the height of the protrusion of the barrier part 51 meets the above-mentioned specific height setting requirements for the barrier structure 5. For the barrier part 51 and the drain Other dimensions of the portion 52 are not limited in the present invention, and can be adjusted according to actual product design requirements. Certainly, in this embodiment, the epoxy resin film 4 covers a side of the barrier portion 51 away from the conductive bonding portion 3 , and extends along the side to the upper surface of the drain portion 52 and the upper surface of the substrate 1 .

Preferably, the blocking structure 5 is made of ink, and the manufacturing cost is relatively low. Of course, in other embodiments of the present invention, the barrier structure 5 may also be made of copper or other high temperature resistant materials.

Further, part of the upper surface of the substrate 1 is recessed inward to form a groove 12. The groove 12 is arranged on the side of the barrier structure 5 away from the conductive joint 3. Specifically, the groove 12 is arranged on the drain 52 away from the conductive joint. In the substrate on one side of 3, the epoxy resin film 4 can be extended and filled into the groove 12 through drainage part 52, so as to enhance the bonding force between the epoxy resin film 4 and the substrate 1, and improve product performance. The specific shape and size of the groove 12 are not limited in the present invention, and can be designed according to actual needs.

In a specific embodiment of the present invention, the inner side of the groove 12 and the side of the blocking structure 5 away from the conductive joint 3 are arranged on the same vertical line, that is, the inner side of the groove 12 and the drainage part 52 are far away from the conductive joint. One side of 3 is on the same vertical line. Specifically, the inner side of the groove 12 and the side of the drain 52 away from the conductive joint 3 are aligned with the side surface of the chip 2, and the epoxy resin film 4 passes through the drain 52. The upper surface directly extends to fill the inside of the groove 12 .

More specifically, the groove 12 forms a square or ring structure around the barrier structure 5 to further enhance the bonding force between the epoxy plastic film 4 and the substrate 1 . The present invention does not limit the specific shape, structure and size of the groove 12 , it only needs to ensure that the area surrounded by the blocking structure 5 falls completely within the area surrounded by the groove 12 .

In order to further enhance the bonding force between the epoxy plastic film 4 and the substrate 1, the bottom of the groove 12 is set as a stepped structure, and the depth of the groove 12 gradually increases toward the direction away from the blocking structure 5. Of course, in this embodiment There is no specific requirement on the number of steps of the step structure, the more the number of steps, the greater the friction between the epoxy resin film 4 and the inner surface of the groove 12, and the greater the bonding force between the epoxy resin film 4 and the substrate 1, so the step structure The number of steps can be designed and adjusted according to actual needs. Of course, in other embodiments of the present invention, the bottom of the groove 12 may also be wave-shaped or other shapes, or the depth of the groove 12 gradually decreases toward the direction away from the blocking structure 5 . All changes in the structure and size of the groove 12 based on this structure are within the protection scope of the present invention.

As shown in FIG. 2, an embodiment of the present invention also provides a method for manufacturing a chip packaging structure, including steps:

S1: A substrate is provided, the upper surface of the substrate is provided with a plurality of welding areas, and a blocking structure is arranged at a part of the upper surface of the substrate outside the welding areas.

S2: providing at least one chip, and disposing the chip on the substrate corresponding to the welding area through the conductive joint.

S3: Provide an epoxy resin film, extrude the epoxy resin film to cover the upper surface and side surface of the chip and the outer surface of the barrier structure, and extend along the side surface of the chip and the outer surface of the barrier structure to the upper surface of the substrate , A cavity is formed between the epoxy resin film, the chip, the substrate, and the barrier structure.

As shown in Figure 3, corresponding to step S1, a substrate 1 is provided, the upper surface of the substrate 1 is provided with a plurality of welding areas 11, and a blocking structure 5 is provided at a part of the upper surface of the substrate 1 outside the welding areas 11, specifically include:

The specific setting requirements of the barrier structure 5 are related to the difference of the chips to be mounted subsequently and the different manufacturing processes of the products. According to the specific size of the chip 2 required by the follow-up product, the specific position of the blocking structure 5 on the upper surface of the substrate 1 is set. Specifically, the blocking structure 5 is arranged at a part of the upper surface of the substrate 1 outside the welding area 11, and blocks The inner surface of the structural member 5 does not exceed the edge area of the chip 2 to be mounted subsequently.

Specifically, the blocking structure 5 surrounds the upper surface area of the substrate 1 outside the welding area 11, that is, the blocking structure 5 forms a square or ring structure around the outside of the welding area 11, or forms a structure of other shapes. The invention is not limited here, it only needs to ensure that the position of the blocking structure 5 is located outside the welding area 11, and the inner side of the blocking structure 5 does not exceed the edge area of the chip 2 to be mounted subsequently.

More specifically, considering the machine accuracy of actually mounting the chip 2 in the subsequent manufacturing process, the distance between the barrier structure 5 and its nearest welding area 11 is at least 30 μm, so as to prevent the machine from hitting the chip 2 during the packaging structure manufacturing process. Blocking the structural member 5 causes damage to the chip 2 .

In the best embodiment of the present invention, the upper surface of the set blocking structure 5 is in contact with the lower surface of the chip 2, which can completely block the resin material overflowing from the epoxy resin film 4 in the subsequent process from entering between the chip 2 and the substrate 1. the cavity area in between. However, considering that in the actual manufacturing process, for example, the conductive joint 3 provided in step S2 will be in a melted state during reflow soldering and other processes, it is difficult to ensure that the lower surface of the chip 2 and the substrate 1 are in the final product formed. The height difference between the upper surfaces is stable, that is, it is difficult to determine the specific height of the blocking structure 5 in actual product manufacturing. If the height of the barrier structure 5 is set too high, the barrier structure 5 will easily damage the functional surface of the chip 2 when the conductive joint 3 melts in the reflow soldering process and the height of the chip 2 will be reduced. Therefore, in the specific embodiment of the present invention, The height of the barrier structure 5 is set not to exceed 1/2 of the height of the conductive joint 3 before reflow soldering. At the same time, the height of the blocking structure 5 cannot be set too low. If the height of the blocking structure 5 is set too low, it is difficult to ensure whether the blocking structure 5 can effectively prevent the resin material overflowing from the epoxy resin film 4 from entering the chip 2 and the chip 2. Cavity area between substrates 1. The present invention does not limit the specific setting value of the height of the blocking structure 5, it only needs to ensure that the upper surface of the blocking structure 5 in the subsequent process will not damage the functional surface of the chip 2, and at the same time effectively block the epoxy resin The effect of the overflowing resin material of the film 4 is sufficient.

Specifically, continue referring to FIG. 3 , the set blocking structure 5 includes a blocking portion 51 and a drainage portion 52, the blocking portion 51 is configured to block the epoxy resin film 4 in step S3 from entering the cavity 6, and the drainage portion 52 is configured It is used to drain the epoxy resin film 4 in step S3 in a direction away from the conductive joint 3 .

The blocking structure 5 is specifically an L-shaped structure, and the drainage part 52 is arranged on the upper surface of the substrate 1. The blocking part 51 protrudes toward the upper side of the substrate 1 along the drainage part 52 near the end of the conductive joint part 3. Specifically, the drainage part 52 is kept away from One side of the conductive bonding part 3 is aligned with the side surface of the chip 2 to be mounted. The height of the protrusion of the blocking part 51 meets the above-mentioned specific height setting requirements for the blocking structure 5. For the blocking part 51 and the drainage part 52 Other size settings are not limited by the present invention, and can be adjusted according to actual product design requirements. Of course, in this embodiment, in step S3, the epoxy resin film 4 covers the side of the barrier part 51 away from the conductive bonding part 3, and extends along the side to the upper surface of the drain part 52 and the upper surface of the substrate 1. .

Preferably, the blocking structure 5 is made of ink, and the manufacturing cost is relatively low. Of course, in other embodiments of the present invention, the barrier structure 5 may also be made of copper or other high temperature resistant materials.

Further, before the step S2 , a step is further included: forming a groove 12 inwardly recessed at a partial area of the upper surface of the substrate 1 on the side of the barrier structure 5 away from the conductive joint 3 .

As shown in FIG. 4 , specifically, grooves 12 are formed on the part of the upper surface of the substrate on the side of the drainage part 52 away from the conductive joint part 3 by using a laser or a mask process. In step S3, the epoxy resin film 4 The drainage through the drainage part 52 can be extended and filled into the groove 12 to enhance the bonding force between the epoxy resin film 4 and the substrate 1 and improve product performance. The specific shape and size of the groove 12 are not limited in the present invention, and can be designed according to actual needs.

The groove 12 forms a square or ring structure around the blocking structure 5, and the inner surface of the groove 12 and the side of the blocking structure 5 away from the conductive joint 3 are arranged on the same vertical line, that is, the groove 12 and the side of the drainage part 52 away from the conductive joint 3 are on the same vertical line. Specifically, the inner side of the groove 12 and the side of the drainage part 52 away from the conductive joint 3 are on the same vertical line as the The side surfaces of the chip 2 are arranged in alignment, and the epoxy resin film 4 extends directly through the upper surface of the drainage part 52 to fill the inside of the groove 12 in step S3 . The present invention does not limit the specific shape, structure and size of the groove 12 , it only needs to ensure that the area surrounded by the blocking structure 5 falls completely within the area surrounded by the groove 12 .

In order to further enhance the bonding force between the epoxy plastic film 4 and the substrate 1, the bottom of the groove 12 is made into a stepped structure, and the depth of the groove 12 gradually increases toward the direction away from the blocking structure 5. Of course, in this embodiment In the method, there is no specific requirement on the number of steps of the formed step structure. The more the number of steps, the greater the friction between the epoxy resin film 4 and the inner surface of the groove 12, and the greater the bonding force between the epoxy resin film 4 and the substrate 1. , so the number of steps of the step structure can be designed and adjusted according to actual needs and machining accuracy. Of course, in other embodiments of the present invention, the bottom of the groove 12 can also be wave-shaped or other shapes, or the depth of the groove 12 gradually decreases in the direction away from the blocking structure 5, which can be determined according to the actual manufacturing process and processing. Accuracy specific adjustments.

As shown in Figure 5, in order to correspond to the manufacturing process steps in step S2, the corresponding conductive bonding part 3 is set on the functional surface of the chip 2, in this embodiment, the conductive bonding part 3 is set as a metal ball post, and the metal ball The pillars can be solder balls, gold ball eutectic solder, and the like. The present invention does not limit the specific setting height of the metal ball post, which can be adjusted according to different requirements of the product or subsequent requirements for the height of the cavity formed by manufacturing.

Further, the functional surface of the chip 2 faces the upper surface of the substrate 1 , and the conductive joint 3 on the functional surface of the chip 2 is correspondingly welded to the welding area 11 on the upper surface of the substrate 1 to form an electrical connection with the substrate 1 .

Further, after the chip 2 is mounted on the upper surface of the substrate 1, the reflow soldering process is performed. Since the conductive joint 3 will be in a melting state during the reflow soldering process, the cavity height of the previously formed cavity 6 is reduced, and the barrier structure The distance between the upper surface of the component 5 and the lower surface of the chip 2 decreases, as shown in FIG. 6 . In this embodiment, the height of the barrier structure 5 is set no more than 1/2 of the height of the conductive joint 3 before reflow soldering, so after the reflow process, the upper surface of the barrier structure 5 and the lower surface of the chip 2 There is still a certain gap between them, so as to ensure that the blocking structural member 5 will not cause damage to the functional surface of the chip 2, and at the same time effectively prevent the resin material overflowing from the epoxy resin film 4 in the subsequent plastic sealing process from entering the blocking structural member 5. Just inside.

As shown in Figure 7, corresponding to the manufacturing process step in step S4, the epoxy resin film 4 is extruded to make it cover the upper surface and side surface of the chip 2 and the outer surface of the barrier structure 5, and along the side surface of the chip 2 and the outer surface of the blocking structure 5. The outer surface of the barrier structure 5 extends to the upper surface of the substrate 1 , and a cavity 6 is formed between the epoxy resin film 4 , the chip 2 , the substrate 1 and the barrier structure 5 . Specifically, the epoxy resin film 4 is extruded to cover the barrier portion 51 away from a side of the conductive bonding portion 3 , and extend along the side to the upper surface of the drainage portion 52 , the groove 12 and the upper surface of the substrate 1 .

In other embodiments of the present invention, a DAF (Die Attachment Film) film can also be used instead of the epoxy resin film 4, which can also fix and combine the substrate 1 and the chip 2 to form a cavity 6, and it will be baked under high temperature conditions. In the hardened state, it can also fix and protect the packaging structure, and the final packaged product structure can effectively prevent the resin material overflowing from the epoxy plastic film 4 from entering the cavity area between the chip 2 and the substrate 1 to prevent pollution. The conductive joint 3 and the functional surface area of the chip 2 .

To sum up, in the present invention, a blocking structure is provided on the upper surface of the substrate outside the conductive joint, and the blocking structure does not exceed the edge area of the chip. In the coating process, the blocking structure can effectively block The resin material overflowed from the epoxy resin film enters the cavity area between the chip and the substrate, preventing contamination of the conductive junction and the cavity area. In addition, a groove is provided on the upper surface of the substrate facing inward, so that the epoxy plastic film can be extended and filled into the groove, the bonding force between the epoxy plastic film and the substrate is enhanced, the risk of the epoxy plastic film falling off is reduced, and the product is improved. performance.

It should be understood that although this description is described according to implementation modes, not each implementation mode only contains an independent technical solution, and this description in the description is only for clarity, and those skilled in the art should take the description as a whole, and each The technical solutions in the embodiments can also be properly combined to form other embodiments that can be understood by those skilled in the art.

The series of detailed descriptions listed above are only specific descriptions for feasible implementations of the present invention, and they are not intended to limit the protection scope of the present invention. Any equivalent implementation or implementation that does not depart from the technical spirit of the present invention All changes should be included within the protection scope of the present invention.

Claims (13)

1. A chip packaging structure, comprising a substrate, at least one chip, a plurality of conductive joints and an epoxy resin film, the upper surface of the substrate is provided with a plurality of welding areas, and the chip is arranged on the said conductive joint. Above the substrate, the conductive joint is arranged corresponding to the soldering area, and it is characterized in that the chip packaging structure further includes a blocking structure, and the blocking structure is arranged on the upper surface of the substrate outside the conductive joint a region, the barrier structure is configured to block the epoxy resin film from entering an inner region of the barrier structure; The distance between the barrier structure and its nearest conductive joint is at least 30 μm, and the height of the barrier structure is no more than 1/2 of the height of the conductive joint before reflow molding; The epoxy resin film covers the upper surface and the side surface of the chip and the outer surface of the barrier structure, and extends along the side surface of the chip and the outer surface of the barrier structure to the upper surface of the substrate , a cavity is formed among the epoxy resin film, the chip, the substrate and the barrier structure. 2 . The chip packaging structure according to claim 1 , wherein the barrier structure surrounds an upper surface area of the substrate disposed outside the conductive joint. 3 . 3 . The chip packaging structure according to claim 2 , wherein the inner surface of the barrier structure does not exceed the edge area of the chip. 4 . 4. The chip packaging structure according to claim 1, wherein the blocking structure comprises a blocking portion and a drainage portion, the blocking portion is configured to block the epoxy resin film from entering the cavity, The drainage part is configured to drain the epoxy resin film away from the conductive bonding part. 5. The chip packaging structure according to claim 4, wherein the blocking structure is an L-shaped structure, the drainage part is arranged on the upper surface of the substrate, and the blocking part is located along the drainage part near the One end of the conductive bonding part protrudes upward toward the substrate. 6 . The chip packaging structure according to claim 1 , wherein a portion of the upper surface of the substrate is recessed inwardly to form a groove, and the groove is disposed at a position where the barrier structure is away from the conductive joint. side. 7 . The chip packaging structure according to claim 6 , wherein an inner surface of the groove is disposed on the same vertical line as a side of the barrier structure away from the conductive joint. 8 . 8. The chip packaging structure according to claim 7, wherein the groove surrounds the barrier structure. 9 . The chip packaging structure according to claim 8 , wherein the bottom of the groove is configured as a stepped structure, and the depth of the groove increases gradually toward a direction away from the barrier structure. 10. A method for manufacturing a chip package structure, comprising the steps of: A substrate is provided, the upper surface of the substrate is provided with a plurality of welding areas, and a blocking structure is provided at a partial area of the upper surface of the substrate outside the welding areas, specifically including: A blocking structure is provided on the upper surface of the substrate around the outer side of the welding area; The blocking structure is arranged at least 30 μm apart from the nearest welding area, and the inner surface of the blocking structure does not exceed the edge area of the chip; Provide at least one chip, place the chip above the substrate corresponding to the welding area through the conductive joint, and set the height of the barrier structure to no more than 1/2 of the height of the conductive joint before reflow molding ; providing an epoxy resin film, extruding the epoxy resin film to cover the upper surface and the side surface of the chip and the outer surface of the barrier structure, and along the side surface of the chip and the barrier structure The outer surface of the outer surface extends to the upper surface of the substrate, and a cavity is formed among the epoxy resin film, the chip, the substrate and the blocking structure. 11. The method for manufacturing a chip package structure according to claim 10, wherein a substrate is provided, the upper surface of the substrate is provided with a plurality of welding areas, and the upper surface part of the substrate outside the welding areas At the place, a blocking structure is provided, which specifically includes: The blocking structure is set in an L-shaped structure, including a blocking portion and a draining portion, the draining portion is arranged on the upper surface of the substrate, and the blocking portion is moved toward the A protrusion is arranged above the substrate. 12. The manufacturing method of the chip packaging structure according to claim 10, characterized in that, before said providing at least one chip, further comprising the steps of: On the side of the barrier structure away from the conductive joint part, a groove is recessed inwardly at a part of the upper surface of the substrate. 13. The method for manufacturing a chip packaging structure according to claim 12, characterized in that, on the side of the barrier structure away from the conductive joint, an inward depression is formed on a partial area of the upper surface of the substrate A groove, specifically including: The groove is arranged around the blocking structure, and the inner side of the groove is arranged on the same vertical line as the side of the blocking structure away from the conductive joint; The bottom of the groove is formed into a stepped structure, and the depth of the groove gradually increases in a direction away from the blocking structure.

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