CN115194861A - Hot cutter - Google Patents

Abstract

The invention discloses a hot cutter which comprises a ring cutter assembly fixed at one end of a rotatable rotating arm, wherein the ring cutter assembly comprises a cutting cutter seat fixed on the rotating arm, a cutter seat is rotatably arranged on the cutting cutter seat, a heating device is fixed on the cutter seat and is used for heating a ring cutter on the cutter seat, the ring cutter can be heated by adopting the heating device to cut a BG film, and the BG film can be prevented from being folded due to the rotation of the cutter. The heated ring-cutting knife has better BG film effect.

Description

a hot knife

technical field

The invention relates to the technical field of wafer sticking, in particular to a thermal cutting knife.

Background technique

With the advancement of science and technology, smart wearables, smartphones and tablet computers are developing towards high-speed and large-capacity storage; volume is developing towards thinness. The direction of technological development requires the thinning of flash memory and memory controllers. Increasingly larger and thinner thicknesses make chipping more challenging in conventional processes when handling and dicing very thin wafers.

To meet the light-weight requirements of the chip, the processing method of cutting first and then thinning is adopted in the processing process; the specific operation is as follows: firstly, the wafer is forward-cut to the appropriate depth, and then the BG film is attached to the front of the wafer. The BG film can effectively protect The chips on the wafer surface are not damaged and protected from impurities during the thinning process.

Silicon carbide wafers have high hardness and cannot be cracked by film expansion. It needs to be suitable for equipment to be broken one by one along the wafer dicing path. The surface of the chip is sensitive to debris. A layer of BG film is attached to the surface of the wafer during the splitting process. , to prevent the cleaver of the splitting mechanism from directly contacting the wafer surface, and also to prevent the chips generated during the splitting from contaminating the chip. After the BG film is attached to the wafer, it is necessary to cut the BG film into a BG film that matches the size of the wafer. During the ring cutting, the rotation of the tool will cause wrinkles on the surface of the BG film.

SUMMARY OF THE INVENTION

In order to solve the problem that the BG film is wrinkled due to the rotation of the cutter when the wafer protective film is being cut, the present invention provides a thermal cutter.

The specific plans are as follows:

A hot cutting knife comprises a ring cutting knife assembly fixed on one end of a rotatable rotating arm, the ring cutting knife assembly comprising a cutting knife seat fixed on the rotating arm, a rotating knife seat on the cutting knife seat, and a heating device fixed on the knife seat, The heating device heats the ring cutter on the knife holder.

The heating device sequentially includes, along the length of the rotating arm, a heat insulation plate, an electric heating plate and a PTC heater fixed on the knife base, and a ring cutter is fixed between the heat conducting plate and the PTC heater; the electric heating plate passes through the wire to heat.

Wires set resistors in series.

The type of the resistor is Pt100.

The PTC heater is fixed on the heat conduction plate by fixing bolts, and the ring cutter is clamped.

The thermal cutting knife disclosed in the present invention can heat the ring cutting knife and cut the BG film by using a heating device, and can prevent the BG film from wrinkling due to the rotation of the knife. The heated ring cutter has better effect on the BG film.

Description of drawings

FIG. 1 is a schematic structural diagram of an automatic wafer laminator;

Figure 2 is a schematic structural diagram of a die assembly;

FIG. 3 is a schematic structural diagram 1 of the angle fixing assembly;

FIG. 4 is a schematic structural diagram 1 of the angle fixing assembly;

5 is a schematic structural diagram of a wafer transfer device;

6 is a schematic structural diagram of a wafer receiving mechanism;

Fig. 7 is the working state schematic diagram of the rotary cutting part;

Fig. 8 is the structural representation one of the rotary cutting part;

Fig. 9 is the structural representation two of the rotary cutting part;

FIG. 10 is a schematic structural diagram 1 of the ring cutter assembly;

Figure 11 is a second structural schematic diagram of the ring cutter assembly;

Figure 12 is a schematic structural diagram of a balance assembly;

FIG. 13 is a process diagram of cutting a BG film with a ring cutter.

In the figure: machine frame 1, vertical plate 11, film sticking platform 2, ring cutting groove 21, die assembly 3, die servo moving module 31, die holder 32, die roller 33, die cylinder 34, Die bracket 35, fixed angle assembly 4, fixed angle linear motor 41, fixed angle roller 42, rotary cutting member 5, ring cutter assembly 51, cutting blade holder 511, heating device 512, blade holder 5121, heat shield 5122 , electric heating plate 5123, PTC heater 5124, tension spring 513, angle adjustment bolt 514, ring cutter 515, balance assembly 52, balance support 521, balance spring 522, roller support 523, roller 524, long bolt 525, Rotary cutting seat 53, rotary drive motor 54, rotary arm 55, wafer receiving mechanism 6, lifting column 61, lifting plate 62, lifting cylinder 63, multi-functional manipulator 7, transfer manipulator 71, suction part 711, silo 8, wafer Circle 9, BG film 10.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the present invention. Obviously, the described embodiments are only a part of the implementation of the present invention, rather than the entire implementation. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to The scope of protection of the present invention.

As shown in FIG. 1-FIG. 13, a fully automatic wafer laminating machine is disclosed, including a machine frame 1 with a vertical plate 11 on the upper surface, a wafer lamination system, a multifunctional robot system with a multifunctional machine 7, and The silo 8, the wafer lamination system includes a lamination platform 2 arranged on the machine frame 1, a die assembly 3 located above the lamination platform 2, and a fixed angle component 4 arranged on the vertical plate 11. The fixed angle component 4 ensures When the die assembly 3 is laminating, the angle between the BG film 10 between the lamination roller 33 and the fixed angle roller 42 and the horizontal plane of the lamination platform 2 remains unchanged; The ring cutter assembly 51. Through the cooperation between the die assembly 3 and the fixed angle assembly 4, the BG film 10 is controlled to be in a flat state before the film is attached, and the BG film 10 and the lamination platform between the die roller 33 and the fixed angle roller 42 are maintained. The angle between 2 and the The knife 515 cuts the BG film 10 to prevent the BG film 10 from being wrinkled by the blade during the cutting process.

The compression mold assembly 3 includes a compression mold servo moving module 31, a compression mold support 32 is slidably connected to the compression mold servo moving module 41, and a height-adjustable lamination roller 33 is rotatably provided on the compression mold support 32. When the roller 33 moves down and comes into contact with the BG film 10, the die servo moving module 31 controls the die support 32 to move and stick the film in the running direction of the BG film 10. When sticking the film, the lamination roller 33 can be fixed by ensuring The angle roller 42 and the lamination roller 33 maintain a synchronous movement to achieve the purpose of keeping the angle between the BG film 10 and the film lamination platform 2 between the die roller 33 and the fixed angle roller 42 unchanged. The lamination roller 33 can pass through The fixed-angle linear motor controls the reciprocating movement, and also passes through the overhanging plate arranged on the die support 32. The length direction of the overhanging plate is consistent with the running direction of the film strip, and the overhanging plate is rotated to set the lamination roller 33.

In order to ensure that the angle between the BG film 10 and the film sticking platform 2 between the die roll 33 and the fixed angle roll 42 remains unchanged, the running direction of the fixed angle roll 42 can be perpendicular to the direction of the film sticking platform 2, and the fixed angle roll 42 rotates It is provided on the fixed angle linear motor 41 .

In order to ensure that the BG film 10 is evenly stressed when the die roller 33 presses the BG film 10, the set die support 32 is a door frame, and the film sticking platform 2 is located inside the door frame; both sides of the top of the door frame are provided with The compression mold cylinder 34, the telescopic rod of the compression mold cylinder 34 passes through the top of the door frame, and the end of the extension rod of the compression mold cylinder 34 is connected to the compression mold bracket 35, and the film roller 33 is rotatably connected to the compression mold bracket 35.

A rotary cutting part 5 is arranged on the multifunctional manipulator 7, and the rotary cutting part 5 comprises a rotary cutting seat 53 fixed on the multifunctional manipulator 7, a rotary driving motor 54 is fixed on the rotary cutting seat 53, and the output shaft of the rotary driving motor 54 is connected to rotate Arm 55, one end of the rotating arm 55 is provided with a ring cutter assembly 51, and the other end of the rotating arm is provided with a balance assembly 52; when the ring cutter assembly 51 is cutting, the ring cutting groove 21 needs to be set on the corresponding working surface. The working surface here refers to the filming platform 2. An adsorption area is set on the film lamination platform 2, a negative pressure cavity is set in the adsorption area, and a negative pressure source is set in the negative pressure cavity. 9 is placed inside the ring cutting groove 21, and the negative pressure source can adsorb the wafer 9 through the negative pressure hole, so as to avoid the position of the wafer 9 from being offset during cutting. The width of the ring cutting groove 21 is 5 mm, the depth of the ring cutting groove 21 is 0.2 mm, the material of the film mounting platform 2 is ceramic, and the inner diameter of the ring cutting groove 21 is 2 mm smaller than the outer diameter of the wafer 9 .

The ring cutter assembly 51 includes: a U-shaped cutter seat 511 arranged at the end of the rotating arm 55, a ring cutter 515 is arranged at the U-shaped opening, a heating device 512 is arranged adjacent to the ring cutter 515, and the heating device 512 cuts the ring The knife 515 is heated; the heating device 512 includes a knife seat 5121 arranged at the U-shaped opening, along the length direction of the rotating arm 55, the heat insulation plate 5122, the electric heating plate 5123 and the PTC heater 5124 are sequentially fixed outside the knife seat 5121, A ring cutter 515 is fixed between the electric heating plate 5123 and the PTC heater 5124; the electric heating plate 5123 is heated by wires.

In order to protect the circuit, there are resistors in series with the wires, and the resistor type used is Pt1000. The heating device 512 can heat the ring cutter 515, and use the heated ring cutter 515 to cut the BG film 10, so as to prevent the BG film 10 from being wrinkled by the blade during the cutting process.

The knife base 5121 is rotatably connected to the cutting knife base 511. The ring cutter assembly 51 also includes an angle adjustment mechanism and a reset mechanism. The angle adjustment mechanism makes the ring cutter assembly 51 rotate relative to the rotating arm 55, and the reset mechanism makes the ring cutter assembly 51 is rotated to fix the ring cutter 515 assembly. The angle adjustment mechanism includes a convex block arranged at the bottom of the cutting knife seat 511, and the angle adjusting bolt 514 is threadedly connected in the convex block; the movement of the end of the angle adjusting bolt 514 adjusts the angle of the ring cutter 515;

The reset mechanism is a tension spring 513, and the two ends of the tension spring 513 are respectively connected with the bottom of the cutting knife seat 511 and the knife seat 5121. The two ends of the tension spring are respectively connected with the bottom of the cutting blade holder and the blade holder, and the connection point between the tension spring and the blade holder 5121 is located on the same side of the hinge point between the ring cutter assembly 51 and the cutting blade holder 511 .

The reset mechanism is a compression spring. The two ends of the compression spring are respectively connected to the bottom of the cutting knife seat 511 and the knife seat 5121. The connection points of the compression spring and the knife seat 5121 are located on different sides of the hinge point between the ring knife assembly 51 and the cutting knife seat 511. .

The end of the angle adjustment bolt 514 is provided with a spherical nut, which can protect the knife seat 5121. The provided angle adjustment mechanism and reset mechanism can adjust the angle of the ring cutter 515, and can adjust the cutter head of the ring cutter 515. a protection.

An oblong hole is arranged on the rotating arm 55, the length direction of the oblong hole is consistent with the length direction of the rotating arm 55, the balance assembly 52 is fixed in the oblong hole by the positioning bolt, and the distance between the positioning bolt and the rotation center line is adjusted to ensure the circumcision The balance assembly 52 includes a balance support 521, the balance support 521 is connected to the roller support 523 through the balance spring 522, and the roller support 523 is rotatably arranged on the roller 524. Long bolts are provided on the balance support 523 , and the ends of the long bolts are in contact with the roller support 523 . The maximum distance of the upward movement of the roller support 523 can be limited, so as to avoid damaging the overall balance of the rotary cutting member 5 .

The multifunctional manipulator 7 is provided with a transfer manipulator 71; the film lamination platform 2 is provided with a wafer receiving mechanism 6, which is used to receive the wafers 9 conveyed by the multifunctional manipulator 7, and the wafer receiving mechanism 6 includes at least three lifting pillars 61 and the lamination platform 2,

The entire film-lamination platform 2 is an adsorption area, a negative pressure chamber is set in the adsorption area, and a negative pressure source is set in the negative pressure chamber. There is a sealed sliding connection between the platforms 2 .

The middle area of the adsorption zone where the lifting pillars 61 are located does not have the adsorption function, there is no sliding between the lifting pillars 61 and the film sticking platform 2, and the number of lifting pillars 61 is preferably 4;

A lift plate 62 is connected to the bottom of the lift column 2 , and the lift plate 62 is lifted and lowered by a lift cylinder 63 . The suction part 711 of the transfer robot 71 is U-shaped, and the lifting column 61 does not limit the suction part. The transfer manipulator 71, the lifting support 61 and the film sticking platform 2 constitute a wafer transfer device. The transfer manipulator 71 has a negative pressure adsorption mechanism to adsorb the wafers 9. The negative pressure adsorption mechanism includes a suction part with a cavity inside, and the suction part The negative pressure is generated internally by the negative pressure source, and the wafer 9 is adsorbed through the small holes on the surface of the suction part. The suction part 711 can be U-shaped, and the lifting column 61 will not limit the suction part. The suction part 711 may also be a suction cup.

The suction part 711 uses the negative pressure to suck the wafer 9 from the silo, and under the action of the multi-functional manipulator, it will be transported to the top of the lifting column 62. After the lifting column 62 is raised, the wafer 9 is placed on the lifting column 62, and then placed on the lifting column 62. Under the action of the lift cylinder 63, the wafer 9 is placed on the film lamination platform 2, and the wafer 9 is adsorbed by negative pressure. After the lamination is completed, under the action of the lift cylinder 63, the lift column 62 rises, and the transfer robot 71 picks up Wafer 9, and put it back into the silo. Using the wafer transfer device can avoid damage to the wafer 9 during the transfer process.

A wafer coating method, comprising the following steps:

Step 1: The wafer 9 in the silo 8 is taken out by the transfer manipulator 71 in the multifunctional manipulator 7, and under the action of the wafer receiving mechanism 6, the wafer 9 is placed on the lamination platform 2, and the lamination platform 2 is opposite to the wafer. Circle 9 performs adsorption.

Step 2: The BG film 10 is transported to the top of the wafer 9 through the composite film release system, and the BG film 10 is attached to the surface of the wafer 9 under the action of the die assembly 31 .

Step 3: The position of the wafer 9 is positioned by the visual positioning device in the multifunctional manipulator 7 , and the BG film 10 is cut by the rotating cutting part 5 .

Step 4: After the cutting of the BG film 10 is completed, the wafer 9 after filming is transferred to the transfer robot 71 through the wafer receiving mechanism 6 , and then the wafer 9 after the filming is transferred to the silo 8 .

Step 5: The cut BG film 10 is recycled by the residual material collection system.

In step 1, the wafer receiving mechanism 6 receives the wafer 9, including receiving the wafer 9 through the lifting column 61 that can rise and fall. After receiving the wafer 9, the lifting column 61 can be lowered below the film attaching platform. The generated negative pressure adsorbs the wafer 9 .

In step 2, the composite film release system transports the composite film from the film release air-expanded axial film sticking platform through the film release driven roller system, and before entering the film sticking platform 2, the composite film is divided into protective film and BG film 10, The protective film is recovered by the protective film take-up system; the BG film 10 is transported to the top of the film sticking platform.

The end of the film unwinding air expansion shaft is fixed with a film unwinding electromagnetic brake. The film unwinding electromagnetic brake and the tension control roller are electrically connected. The tension control roller detects the tension of the film tape and feeds back to the film unwinding electromagnetic brake to keep the composite film always stretched. The film release buffer roller is set between the film release driven rollers, and the film release buffer roller is in contact with the composite film by its own gravity.

In step 2, the die assembly 3 cooperates with the fixed angle component 4 when attaching the BG film 10 to the surface of the wafer 9; When approaching, it can move along the running direction of the mold under the action of the die moving servo module 31, and the position of the fixed angle roller 42 in the fixed angle assembly 4 will also change. The angle between the BG film 10 in between and the horizontal plane where the film sticking platform 2 is located remains unchanged.

In step 3, the rotary cutting member 5 includes a rotary cutting seat 53 fixed on the multifunctional manipulator 7, a rotary driving motor 54 is fixed on the rotary cutting seat 3, and the output shaft of the rotary driving motor 54 is connected to a rotary arm 55, and one end of the rotary arm 55 is connected. A ring cutter assembly 51 is provided, and a balance assembly 52 is provided at the other end of the rotating arm 55; when the ring cutter assembly 51 performs cutting, a ring cutting groove needs to be provided on the corresponding working surface.

The residual material collecting system includes the residual material air expansion shaft, the residual material driving roller, the residual material collecting roller system and the residual material buffering roller.

The end of the residual material air expansion shaft is fixed with a residual material electromagnetic brake. The residual material electromagnetic brake and the residual material tension control roller are electrically connected. The residual material tension control roller detects the tension of the film belt and feeds back to the receiving The residual material electromagnetic brake keeps the cut BG film 10 always tensioned; a residual material buffer roller is set between the residual material driven rollers, and the residual material buffer roller contacts the cut BG film 10 by its own gravity.

In step 5, the cut BG film 10 passes through the gap between the two locking plates of the locking device, and is subsequently cut and recovered by the residual material system; by controlling the opening and closing between the two locking plates, the cut The BG film 10 is fixed. Specifically, the lower locking plate is fixed on the vertical plate 11, and the upper locking plate controls the lifting and lowering of the upper locking plate through the locking cylinder, thereby controlling the closing between the two locking plates.

Through the cooperation between the die assembly 3 and the fixed angle assembly 4, the BG film 10 is controlled to be in a flat state before the film is attached, and the BG film 10 and the lamination platform between the die roller 33 and the fixed angle roller 42 are maintained. The angle between them remains unchanged, and the die roller 33 can exhaust the air under the BG film 10 to avoid wrinkles; when cutting the BG film 10, the hot-cut ring cutter assembly 51 is used, and the heated blade can be used to cut the BG film 10. The film 10 is cut to avoid wrinkles on the BG film 10 caused by the ring cutter 515 during the cutting process. Using the cooperation between the lifting support 61 and the transfer robot 71 can avoid damage to the wafer 9 during the transfer process. The cooperation between the ring cutter assembly 51 and the balance assembly 52 enables the ring cutter 515 to be in a balanced position during the film cutting process. The cooperation between the tension spring 513 and the angle adjustment bolt 514 enables the angle of the ring cutter 515 to be adjusted, so as to avoid damage to the cutter head portion of the ring cutter 515 during film cutting.

The technical means disclosed in the solution of the present invention are not limited to the technical means disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be pointed out that for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications are also regarded as the protection scope of the present invention.

Claims (5)

1. The utility model provides a hot cutter, its characterized in that, is including fixing the ring cutter subassembly in rotatable swinging boom one end, and the ring cutter subassembly rotates on fixing cutting blade holder, the cutting blade holder on the swinging boom and sets up the blade holder, fixes heating device on the blade holder, and heating device heats the ring cutter on the blade holder.

2. The hot cutting knife according to claim 1, wherein the heating device comprises, in order along the length direction of the rotary arm, a heat insulation plate fixed on the knife holder, an electric heating plate and a PTC heater, and a ring cutting knife is fixed between the heat insulation plate and the PTC heater; the electric heating plate is heated by electric wires.

3. A hot-cutting blade according to claim 2 wherein the electrical wires are provided in series with resistors.

4. A hot knife according to claim 3, in which the resistor is of the type Pt100.

5. A hot knife according to claim 2 in which the PTC heater is secured to the heat conducting plate by fixing bolts and clamps the ring knife.

Images