CN115175545A - Low thermal resistance phase change radiator - Google Patents
Low thermal resistance phase change radiator Download PDFInfo
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- CN115175545A CN115175545A CN202210997716.8A CN202210997716A CN115175545A CN 115175545 A CN115175545 A CN 115175545A CN 202210997716 A CN202210997716 A CN 202210997716A CN 115175545 A CN115175545 A CN 115175545A
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- 239000007788 liquid Substances 0.000 claims abstract description 77
- 230000017525 heat dissipation Effects 0.000 claims abstract description 72
- 238000009833 condensation Methods 0.000 claims abstract description 47
- 230000005494 condensation Effects 0.000 claims abstract description 47
- 238000007789 sealing Methods 0.000 claims description 11
- 239000004519 grease Substances 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 7
- 238000012546 transfer Methods 0.000 abstract description 7
- 238000009835 boiling Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
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- 230000007704 transition Effects 0.000 description 11
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- 238000010521 absorption reaction Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
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- 230000005484 gravity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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Abstract
The application discloses a low-thermal resistance phase-change radiator, which comprises a shell unit and a radiating unit, wherein one end of the shell unit is used for contacting a target electronic device, the other end of the shell unit is provided with the radiating unit, and the radiating unit penetrates through the shell unit; the heat dissipation unit comprises a condensation area positioned in the bearing cavity inside the shell unit and a heat dissipation area positioned outside the shell unit, and the condensation area and the heat dissipation area are integrally formed, so that liquid-cooled phase-change heat dissipation of a target electronic device can be realized by using phase-change liquid with a lower boiling point in the bearing cavity; compared with a structure that a radiating unit is welded on a shell unit, the low-thermal-resistance phase-change radiator can greatly reduce thermal resistance in the radiating process, improves heat transfer efficiency, further improves radiating efficiency, solves the technical problem that the existing liquid-cooling phase-change radiator is still low in radiating efficiency, can be compatible with target electronic devices with different power densities, and is simple in structure, strong in adaptability and low in cost.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a low-thermal-resistance phase-change heat radiator.
Background
With the development of technology, electronic devices gradually develop to high performance and high integration, which results in the continuous increase of heat flux density of the electronic devices, thereby placing higher requirements on heat dissipation of the electronic devices.
Because the traditional air-cooled heat dissipation can not meet the heat dissipation requirements, the existing electronic device gradually adopts a liquid-cooled phase-change heat dissipation technology, namely, cooling liquid with low boiling point is adopted as a phase-change working medium, the phase-change working medium is changed into a gaseous state from a liquid state after the heat source end absorbs heat, the gaseous phase-change working medium is changed into a liquid state after the heat is released from the heat dissipation end and flows back to the heat source end, and the liquid-cooled phase-change heat dissipation is realized through the reciprocating circulation.
However, the conventional method of increasing the area of the heat dissipation fins has a limited effect on improving the heat dissipation efficiency, and the heat dissipation efficiency of the liquid-cooled phase change heat sink is still low.
Disclosure of Invention
In view of at least one aspect of the above technical problems, an embodiment of the present application provides a low thermal resistance phase change heat sink, which utilizes a heat dissipation unit penetrating through a housing unit to directly contact a phase change liquid inside a bearing cavity, and improves heat transfer efficiency by reducing thermal resistance, thereby improving heat dissipation efficiency.
The embodiment of the application provides a low thermal resistance phase transition radiator, low thermal resistance phase transition radiator includes:
the electronic device comprises a shell unit, a first positioning unit and a second positioning unit, wherein the shell unit is internally provided with a bearing cavity extending along a first direction, and a first end of the shell unit along the first direction is used for contacting a target electronic device;
the heat dissipation unit is arranged at the second end of the shell unit along the first direction;
the bearing cavity is used for bearing phase change liquid;
the heat dissipation unit penetrates through the shell unit and comprises a condensation area positioned in the bearing cavity and a heat dissipation area positioned outside the shell unit, and the condensation area and the heat dissipation area are integrally formed;
so that the low thermal resistance phase change heat sink dissipates heat from the target electronic device.
In one embodiment, the housing unit includes a bearing housing and a sealing cover arranged up and down along the first direction, the bearing housing is provided with an opening, the sealing cover is used for sealing the bearing housing, and the outer bottom surface of the bearing housing is used for contacting the target electronic device.
In one embodiment, a thermally conductive silicone grease is coated between the outer bottom surface and the target electronic device.
In one embodiment, the heat dissipating unit includes a heat sink extending divergently along a plane perpendicular to the first direction, the heat sink including the condensing region and the heat dissipating region formed integrally.
In an embodiment, the condensation zone is provided with a return tip towards the phase change liquid.
In an embodiment, the heat dissipation area comprises a plurality of heat dissipation arms arranged circumferentially with respect to the first direction.
In one embodiment, the heat dissipating unit includes a plurality of the heat dissipating fins, and the plurality of the heat dissipating fins are stacked in the first direction.
In one embodiment, the low thermal resistance phase change heat spreader further comprises:
the liquid return unit is arranged in the bearing cavity;
the first end of the liquid return unit along the first direction is connected with the condensation area, and the second end of the liquid return unit along the first direction extends into the phase change liquid.
In one embodiment, the liquid return unit comprises a wick, and the wick is made of a capillary porous material.
In one embodiment, the liquid return unit comprises a wick extending along the first direction;
the condensation zone includes a plurality of clamping arms that extend in a radial direction of the first direction, the plurality of clamping arms being circumferentially arranged relative to the first direction such that the plurality of clamping arms clamp the wick.
In one embodiment, the outer diameter of the clamping arm tapers from an end proximate the heat sink region to an end proximate the wick.
In one embodiment, the load-bearing chamber is in a negative pressure state.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
the embodiment of the application provides a low-thermal resistance phase-change radiator, which comprises a shell unit and a radiating unit, wherein one end of the shell unit is used for contacting a target electronic device, the other end of the shell unit is provided with the radiating unit, and the radiating unit penetrates through the shell unit; that is, the radiating unit is including the condensation zone that is located the inside bearing cavity of housing element and the radiating area that is located the housing element outside, and condensation zone and radiating area integrated into one piece, like this, utilize to arrange the lower phase transition liquid of bearing intracavity boiling point in and can realize the liquid cooling phase transition heat dissipation to target electron device.
That is to say, in the low thermal resistance phase change heat sink of this embodiment, the liquid phase change liquid absorbs heat from the target electronic device at one end of the housing unit at first, the liquid phase change liquid is heated and boiled rapidly to become gaseous, the gaseous phase change working medium can directly release heat on the surface of the condensation area of the heat dissipation unit and condense back to liquid, and then the liquid phase change liquid is returned to by gravity; it can be understood that, because gaseous phase change working medium can direct contact condensation zone, and inside condensation zone and outside radiating area integrated into one piece, gaseous phase change working medium can directly conduct to the radiating area and dispel the heat at the heat of condensation zone release, compare the structure of welding radiating element on housing unit, the low thermal resistance phase change radiator of this embodiment can reduce the thermal resistance in the radiating process greatly, heat transfer efficiency has been improved, and then radiating efficiency has been improved, the technical problem that current liquid cooling phase change radiator radiating efficiency is still lower has been solved, can compatible different power density's target electronic device, moreover, the steam generator is simple in structure, high adaptability, and low cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic cross-sectional structural diagram of a phase change heat sink with low thermal resistance according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a phase change heat sink with low thermal resistance according to an embodiment of the present application.
Fig. 3 is a schematic structural view of the condensation zone provided with the backflow tip in the embodiment of the present application.
Fig. 4 is a schematic structural diagram of a plurality of heat dissipation fins stacked in the embodiment of the present application.
Fig. 5 is a schematic structural diagram of the liquid returning unit in the embodiment of the present application.
Fig. 6 is an assembly structure diagram of fig. 5.
Wherein, the reference numbers:
10-housing unit, 11-bearing chamber, 12-bearing housing, 13-sealing cover,
20-radiating unit, 21-condensing zone, 22-radiating zone, 23-radiating fin, 24-reflux tip, 25-radiating arm, 26-clamping arm,
30-a liquid returning unit for returning liquid,
40-phase-change liquid, namely,
50-heat-conducting silicone grease,
60-the target electronic device(s) of the electronic device,
x-a first direction.
Detailed Description
For better understanding of the technical solutions described above, the following will describe in detail the exemplary embodiments of the present application with reference to the attached drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all embodiments of the present application, and it should be understood that the present application is not limited by the exemplary embodiments described herein.
With the progress of modernization, the electronic device industry gradually develops towards high performance and high integration, such as high-power LEDs, 5G chips and the like, the heat dissipation problem is more prominent due to the ultrahigh heat flux density, and the product performance and reliability can be greatly reduced if the heat dissipation problem of the chips cannot be effectively solved.
At present, the heat of a chip is dissipated by adopting a heat pipe radiator in the traditional mode in the industry, but the heat of the chip is required to be firstly transferred to the radiator through the heat pipe in the mode, the radiator and the heat pipe are usually connected by welding, and the heat resistance of a welding part is large, so that the heat transfer efficiency is low, and the heat dissipation efficiency is reduced.
In view of the above situation, the embodiments of the present application provide a low thermal resistance phase change heat sink, where the heat dissipation unit penetrates through the housing unit, so that the gaseous phase change working medium inside the housing unit can directly release heat on the heat dissipation unit without conduction through the housing unit, thereby reducing thermal resistance in the heat dissipation process and improving heat transfer efficiency.
Fig. 1 is a schematic sectional structure diagram of a low thermal resistance phase change heat sink, and fig. 2 is a schematic external structure diagram of a low thermal resistance phase change heat sink, first combining fig. 1 and fig. 2, the low thermal resistance phase change heat sink includes a housing unit 10 and a heat dissipation unit 20, a load-bearing cavity 11 extending along a first direction X is provided inside the housing unit 10, and a first end of the housing unit 10 along the first direction X is used for contacting a target electronic device 60; the heat dissipating unit 20 is disposed at a second end of the housing unit 10 along the first direction X; wherein, the bearing cavity 11 is used for bearing the phase-change liquid 40; the heat dissipation unit 20 penetrates through the housing unit 10, the heat dissipation unit 20 comprises a condensation area 21 located in the bearing cavity 11 and a heat dissipation area 22 located outside the housing unit 10, and the condensation area 21 and the heat dissipation area 22 are integrally formed; such that the low thermal resistance phase change heat sink dissipates heat from the target electronic device 60.
In this embodiment, the bearing cavity inside the housing unit extends along a first direction, for example, a vertical direction, the bottom end of the housing unit is used for contacting a target electronic device, and the top end of the housing unit is provided with a heat dissipation unit; the heat dissipation unit penetrates through the shell unit, namely, a condensation area of the heat dissipation unit is located in the bearing cavity, a heat dissipation area of the heat dissipation unit is located outside the shell unit, and the condensation area and the heat dissipation area are integrally formed, so that the low-thermal-resistance phase change heat radiator achieves liquid cooling phase change heat dissipation of a target electronic device.
Combine fig. 1, can understand, the bottom and the target electron device contact of housing unit, arrange the phase change liquid that bears the weight of the chamber in and absorb the heat from the target electron device, along with heat accumulation, the phase change liquid is heated and boils rapidly and becomes the gaseous state, and gaseous phase change working medium contacts the condensation zone and releases the heat condensation and becomes liquid, and liquid phase change working medium recycles gravity and flows back to in the phase change liquid of below, accomplishes the phase change circulation process to the realization is to the heat dissipation of target electron device.
In the process, the internal condensation area and the external heat dissipation area are integrally formed, so that after the gaseous phase-change working medium releases heat in the condensation area, the heat can be directly conducted to the heat dissipation area through the condensation area, and the heat dissipation area is subjected to external air cooling or natural convection heat dissipation.
Or, because the heat dissipation unit runs through the shell unit, the gaseous phase change working medium in the shell unit can directly contact the heat dissipation unit and release heat, compared with a structure that the heat dissipation unit is welded outside the shell unit, the thermal resistance that the heat is conducted to the heat dissipation unit through the shell unit is omitted, the heat transfer efficiency is improved, and the heat dissipation efficiency is further improved.
Can understand, this casing unit should adopt materials such as metal, makes things convenient for target electron device's heat-conduction, and inside bearing cavity should be sealed setting to prevent the loss of phase transition liquid, this phase transition liquid can be the phase transition material of low boiling, confirms the volume of filling according to actual need.
The embodiment of the application provides a low-thermal resistance phase-change radiator, which comprises a shell unit and a radiating unit, wherein one end of the shell unit is used for contacting a target electronic device, the other end of the shell unit is provided with the radiating unit, and the radiating unit penetrates through the shell unit; that is, the radiating unit includes the condensation zone that is located the inside bearing chamber of housing unit and is located the outside radiating area of housing unit, and condensation zone and radiating area integrated into one piece like this, utilize to arrange the lower phase transition liquid of bearing intracavity boiling point in and can realize the liquid cooling phase transition heat dissipation to target electronic device.
That is to say, in the low thermal resistance phase change heat sink of this embodiment, the liquid phase change liquid absorbs heat from the target electronic device at one end of the housing unit at first, the liquid phase change liquid is heated and boiled rapidly to become gaseous, the gaseous phase change working medium can release heat directly on the surface of the condensation area of the heat dissipation unit and condense back to liquid, and then flow back to the liquid phase change liquid by gravity; it can be understood that, because gaseous phase change working medium can direct contact condensation zone, and inside condensation zone and outside radiating area integrated into one piece, gaseous phase change working medium can directly conduct to the radiating area and dispel the heat at the heat of condensation zone release, compare the structure of welding radiating element on housing unit, the low thermal resistance phase change radiator of this embodiment can reduce the thermal resistance in the radiating process greatly, heat transfer efficiency has been improved, and then radiating efficiency has been improved, the technical problem that current liquid cooling phase change radiator radiating efficiency is still lower has been solved, can compatible different power density's target electronic device, moreover, the steam generator is simple in structure, high adaptability, and low cost.
In one possible embodiment, referring to fig. 6, the housing unit 10 includes a bearing housing 12 and a sealing cover 13 arranged up and down along the first direction X, the bearing housing 12 is provided with an opening, the sealing cover 13 is used for sealing the bearing housing 12, and the outer bottom surface of the bearing housing 12 is used for contacting the target electronic device 60.
Wherein, bear the casing and can be upper end opening setting, upper end opening and sealed lid are connected fixedly for dismantling, and the radiating element is in being close to sealed lid department level and runs through and bear the casing, and convenient for use is changed inside phase transition liquid and the volume of filling of phase transition liquid etc. according to actual need like this.
Of course, the upper opening and the sealing cover can be fixed by welding.
In one embodiment, a thermal grease 50 is coated between the outer bottom surface and the target electronic device 60, and the thermal grease 50 is used to fill the gap between the target electronic device 60 and the carrying case 12, so as to reduce the thermal resistance.
In a possible embodiment, the heat dissipating unit 20 comprises a heat sink 23, the heat sink 23 extending divergently along a plane perpendicular to the first direction X, the heat sink 23 comprising a condensation area 21 and a heat dissipating area 22 which are integrally formed.
That is, the heat sink includes a condensation area and a heat dissipation area which are integrally formed, and the heat sink extends in a circumferential direction with respect to the housing unit, for example, in a horizontal direction, so that a heat dissipation area outside the housing unit is increased, and heat dissipation efficiency is improved.
Specifically, referring to fig. 2 or fig. 6, the heat dissipation area 22 includes a plurality of vertically extending heat dissipation arms 25, and the plurality of heat dissipation arms 25 are circumferentially arranged with respect to the first direction X, so as to further increase the heat dissipation area.
In one embodiment, and with reference to fig. 3, the condensation zone 21 is provided with a recirculation tip 24 directed towards the phase change liquid 40, so as to facilitate the collection of the condensed phase change liquid and its recirculation into the phase change liquid below.
In one embodiment, the heat dissipating unit 20 includes a plurality of heat dissipating fins 23, and the plurality of heat dissipating fins 23 are stacked along the first direction X.
In this embodiment, referring to fig. 4, a plurality of heat dissipation fins are stacked along a first direction, and referring to fig. 6, the condensation area of each heat dissipation fin may be an unsealed structure, so that a gaseous phase-change working medium can pass through the condensation area, thereby increasing the areas of the condensation area inside the bearing cavity and the heat dissipation area outside the housing unit, and improving the heat dissipation efficiency.
In a possible embodiment, the low thermal resistance phase-change heat sink further includes a liquid returning unit 30, where the liquid returning unit 30 is disposed in the bearing cavity 11; a first end of the liquid returning unit 30 along the first direction X is connected to the condensing region 21, and a second end of the liquid returning unit 30 along the first direction X extends into the phase change liquid 40.
That is, the present embodiment connects the condensation area and the phase-change liquid through the liquid return unit, and the liquid return unit provides a carrier for the phase-change liquid to flow back after the phase-change liquid is condensed from above, and increases the flow back speed.
Specifically, the liquid return unit comprises a liquid absorption core, and the liquid absorption core is made of capillary porous materials; on one hand, the liquid absorption core is used as a carrier for the backflow of the phase change liquid, so that the phase change liquid with lower temperature after being condensed at the upper part flows back along the surface of the liquid absorption core; on the other hand, the liquid absorption core made of the capillary porous material can absorb the phase change liquid with lower temperature through the capillary action, so that the circulation speed is increased.
In a possible embodiment, the liquid return unit 30 comprises a liquid return pipe extending along the first direction X; the condensation zone includes a plurality of clamp arms extending in a radial direction of the first direction, the plurality of clamp arms being circumferentially arranged relative to the first direction such that the plurality of clamp arms clamp the return tube.
Referring to fig. 6, in one aspect, as mentioned above, the liquid returning unit may be a wick, for example; on the other hand, the condensation zone 21 comprises a plurality of gripper arms 26, wherein the gripper arms 26 extend in a radial direction of the first direction X, and the plurality of gripper arms 26 are arranged in a circumferential direction with respect to the first direction X; it will be appreciated that a plurality of clamping arms 26 thus clamp and secure the wick.
Specifically, the outer diameter of the clamping arm is gradually reduced from one end close to the heat dissipation area to one end close to the liquid absorption core; can understand, this grip arm external diameter is close to the one end of radiating area relatively thicker, can make the more effective condensation of condensation zone like this to the grip arm external diameter is close to the one end of imbibition core and is dwindled little that occupies space gradually, makes being located the condensation zone that gaseous phase change working medium can be more, promotes whole condensation and returns liquid effect.
In a possible embodiment, the bearing cavity is in a negative pressure state, the negative pressure intensity can be determined according to actual needs, and the negative pressure state inside the bearing cavity can further reduce the boiling point of the phase-change liquid.
The basic principles of the present application have been described above with reference to specific embodiments, but it should be noted that advantages, effects, etc. mentioned in the present application are only examples and are not limiting, and the advantages, effects, etc. must not be considered to be possessed by various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is merely for purposes of example and explanation and is not intended to be limiting, as the present application is not limited to the specific details set forth.
The block diagrams of devices, apparatuses, systems referred to in this application are only given as illustrative examples and are not intended to require or imply that the connections, arrangements, configurations, etc. must be made in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably herein. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".
It should also be noted that in the devices, apparatuses, and methods of the present application, the components or steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.
The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of exemplary aspects and embodiments have been discussed above, those of skill in the art will recognize that certain variations, modifications, alterations, additions and sub-combinations thereof are encompassed within the scope of the invention.
Claims (12)
1. A low thermal resistance phase change heat sink, comprising:
the electronic device comprises a shell unit, a first positioning unit and a second positioning unit, wherein the shell unit is internally provided with a bearing cavity extending along a first direction, and a first end of the shell unit along the first direction is used for contacting a target electronic device;
the heat dissipation unit is arranged at the second end of the shell unit along the first direction;
the bearing cavity is used for bearing phase change liquid;
the heat dissipation unit penetrates through the shell unit and comprises a condensation area positioned in the bearing cavity and a heat dissipation area positioned outside the shell unit, and the condensation area and the heat dissipation area are integrally formed;
so that the low thermal resistance phase change heat sink dissipates heat from the target electronic device.
2. The low thermal resistance phase change heat sink as claimed in claim 1, wherein the housing unit comprises a carrying housing and a sealing cover arranged up and down along the first direction, the carrying housing is provided with an opening, the sealing cover is used for sealing the carrying housing, and the outer bottom surface of the carrying housing is used for contacting the target electronic device.
3. The low thermal resistance phase change heat spreader of claim 2, wherein a thermally conductive silicone grease is applied between the outer bottom surface and the target electronic device.
4. The low thermal resistance phase change heat sink of claim 1, wherein the heat dissipating unit comprises fins extending divergently along a plane perpendicular to the first direction, the fins comprising the condensing region and the heat dissipating region integrally formed.
5. A low thermal resistance phase change heat sink according to claim 4, wherein the condensation zone is provided with a backflow tip toward the phase change liquid.
6. The low thermal resistance phase change heat sink of claim 4, wherein the heat dissipating region comprises a plurality of heat dissipating arms arranged circumferentially with respect to the first direction.
7. The low thermal resistance phase change heat sink as claimed in claim 4, wherein the heat dissipating unit comprises a plurality of the heat dissipating fins, the plurality of the heat dissipating fins being stacked in the first direction.
8. The low thermal resistance phase change heat sink of claim 1, further comprising:
the liquid return unit is arranged in the bearing cavity;
the first end of the liquid return unit along the first direction is connected with the condensation area, and the second end of the liquid return unit along the first direction extends into the phase change liquid.
9. The low thermal resistance phase change heat sink of claim 8, wherein the liquid return element comprises a wick, the wick being formed of a capillary porous material.
10. The low thermal resistance phase change heat sink of claim 8,
the liquid return unit comprises a liquid suction core extending along the first direction;
the condensation zone includes a plurality of clamping arms that extend in a radial direction of the first direction, the plurality of clamping arms being circumferentially arranged relative to the first direction such that the plurality of clamping arms clamp the wick.
11. The low thermal resistance phase change heat sink of claim 10, wherein the outer diameter of the clamping arms tapers from an end proximate the heat dissipation region to an end proximate the wick.
12. The low thermal resistance phase change heat sink of claim 1, wherein the load-bearing cavity is under-pressure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210997716.8A CN115175545A (en) | 2022-08-19 | 2022-08-19 | Low thermal resistance phase change radiator |
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| CN202210997716.8A CN115175545A (en) | 2022-08-19 | 2022-08-19 | Low thermal resistance phase change radiator |
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| CN201038143Y (en) * | 2006-11-23 | 2008-03-19 | 番禺得意精密电子工业有限公司 | Radiator |
| US20120111538A1 (en) * | 2010-11-09 | 2012-05-10 | Wang Ching-Tu | Heat dissipation structure |
| CN103429061A (en) * | 2013-09-04 | 2013-12-04 | 中山佳一电子技术有限公司 | Fasting heat pipe radiator |
| WO2015147431A1 (en) * | 2014-03-28 | 2015-10-01 | 인텔렉추얼디스커버리 주식회사 | Radiation structure and light-emitting device including same |
| CN110021570A (en) * | 2019-04-10 | 2019-07-16 | 嘉龙(平潭)科技有限公司 | The three-dimensional long-range radiating module of phase change |
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