CN1151602C - electronic components - Google Patents

Abstract

In an electronic part, terminal electrodes and an insulating layer are formed on a case substrate, a piezoelectric element is mounted on the case substrate, and a metal cover is attached to the case substrate by an insulating adhesive. A protrusion is formed on the edge of the opening of the metal cover so that the protrusion extends from the edge of the opening. The protrusions are connected to the conductive paste layer formed to be electrically connected to the ground terminal electrode. Thereby, the metal cover is electrically connected to the terminal electrodes, and the metal cover is connected to the insulating layer through the insulating adhesive.

Description

electronic components

technical field

The present invention relates to an electronic part such as a piezoelectric resonator or a piezoelectric filter, and more particularly, the present invention relates to an electronic part in which electronic element units are accommodated in a package including a case substrate and conductive cover.

Background technique

The structure of the piezoelectric filter is such that a piezoelectric element is accommodated in a package composed of a case substrate and a conductive cover. Metal lids are often used as conductive lids to enclose the piezoelectric element and provide electromagnetic shielding.

An example of such an electronic component is disclosed in Japanese Patent Application Laid-Open Publication No. 9-307397. As shown in FIG. 6, in the electronic component disclosed in this patent publication, terminal electrodes 52, 53 and 54 are provided on a case substrate 51. As shown in FIG. In addition, an insulating layer 55 is provided on the case substrate 51 , however, the insulating layer 55 is shown separated from the case substrate 51 in FIG. 6 . The insulating layer 55 has a rectangular shape. Rectangular layers 56 and 57 (made of conductive paste) are located approximately in the middle of the longer sides of the insulating layer 55 .

The capacitor 58 is connected to the terminal electrodes 52 , 53 and 54 through circular layers 59 , 60 and 61 made of conductive paste so that the capacitor 58 is electrically connected to the terminal electrodes 52 , 53 and 54 . The piezoelectric resonator 62 is connected to the upper surface of the capacitor 58 through circular layers 63 and 64 made of conductive paste.

The capacitor 58 and the piezoelectric resonator 62 are mounted on the case substrate 51 by the method described above. In addition, a metal cover 65 is attached to the insulating layer 55 on the case substrate 51 by an insulating adhesive 66 and serves to encapsulate the capacitor 58 and the piezoelectric resonator 62 .

At the portions where the conductive paste layers 56 and 57 are provided, the insulating adhesive 66 moves from the lower side edge of the metal cover 65 to areas located on both sides thereof. As a result, the metal cap 65 is electrically connected to the conductive paste layers 56 and 57 .

The metal cover 65 encapsulates the capacitor 58 and the piezoelectric resonator 62 accommodated therein, and provides electromagnetic shielding for these electronic component units. In other words, the conductive paste layers 56 and 57 are provided across the insulating layer 55 so that the conductive paste layers 56 and 57 are electrically connected to the grounded terminal electrode 53 .

Thus, after the metal cover 65 is connected to the insulating layer 55 on the case substrate 51 by the insulating adhesive 66, the metal cover 65 is pressed onto the case substrate 51 before the insulating adhesive 66 hardens, so that the Metal cap 65 is in contact with conductive paste layers 56 and 57 . Through such processing, the metal cover 65 is electrically connected to the grounded terminal electrode 53 so that the metal cover 65 provides electromagnetic shielding.

However, the related prior art electronic parts have obvious disadvantages in that even when the opening edge surface of the metal cover 65 is flat, if the surface of the case substrate 51 is curved or uneven, the metal cover 65 and the terminal electrodes The electrical connection between 53 through the conductive paste layers 56 and 57 becomes insufficient.

Contents of the invention

In order to solve the above-mentioned problems, a preferred embodiment of the present invention provides an electronic component whose conductive cover is arranged to reliably provide electromagnetic shielding.

A preferred embodiment of the present invention provides an electronic component comprising a housing substrate having a ground electrode on its upper surface, an electronic component element mounted on the housing substrate, and a conductive conductor having an opening and an opening edge surrounding the opening. A cover, a conductive cover is attached to the upper surface of the case substrate by an insulating adhesive to encapsulate the electronic component unit. The protrusion is located at the edge of the opening such that the protrusion extends from the edge. The protrusion is connected to the ground electrode of the housing substrate through a conductive connecting material so that the conductive cover is electrically connected to the electrode.

Preferably, the opening edge of the conductive cover has a polygonal shape with a plurality of sides, and the protrusion is located on at least one side thereof. In this case, the protrusion is preferably located at a position corresponding to the ground electrode. Alternatively, the opening edge of the conductive cover has a polygonal shape with a plurality of sides, and an entire portion of at least one side defines the protrusion. In this case, the protrusion can be easily formed at the same time as the edge of the opening is formed.

Various types of electronic component units can be incorporated into the preferred embodiments of the present invention. In a specific preferred embodiment described below, a piezoelectric resonator element is incorporated into an electronic component. In this case, a piezoelectric resonant part is obtained which provides a good electromagnetic shielding effect by the conductive cover.

Preferably, a metal cover is used as the conductive cover. In this case, the protruding portion can be easily formed, so that the electronic component according to the preferred embodiment of the present invention can be easily produced.

Preferably, the electrodes are arranged on the housing substrate such that the electrodes extend onto the outer area of the conductive cover. In this case, the electronic components can be electrically connected to an external circuit through electrodes on the housing substrate. That is, it is possible to provide a chip-shaped electronic part which is excellent in electromagnetic shielding and capable of surface mounting.

In another preferred embodiment of the present invention, a method of manufacturing an electronic component includes the following steps: providing a casing substrate with a ground electrode on its upper surface, mounting the electronic component on the casing substrate, and arranging a The conductive cover on the edge of the opening forms a protrusion on the edge of the opening so that the protrusion extends from the edge of the opening to connect the conductive cover to the housing substrate so that the protrusion is electrically connected to the ground electrode.

Other features, elements and advantages of the present invention will be described in detail below with reference to preferred embodiments of the present invention and accompanying drawings.

Description of drawings

1 is an exploded perspective view of an electronic component according to a preferred embodiment of the present invention;

2A is a plan view of a piezoelectric element used in an electronic component according to a preferred embodiment of the present invention;

Fig. 2B is a bottom view of the piezoelectric element of Fig. 2A;

Figure 3 is a side view of a metal cover used as a conductive cover used in a preferred embodiment of the present invention;

Fig. 4 is a partial cross-sectional view for describing the effect of a protrusion formed on the metal cover;

Figure 5 is a side view of another preferred embodiment of the conductive cover used in the present invention;

Fig. 6 is an exploded perspective view of an electronic component in the related art.

Detailed ways

FIG. 1 is an exploded perspective view of an electronic component according to a preferred embodiment of the present invention. In the electronic component of this preferred embodiment, a substantially rectangular housing substrate 1 is used. The housing substrate 1 may preferably be made of an insulating material such as synthetic resin, or an insulating ceramic material such as alumina. Preferably, the terminal electrodes 2, 3, 4 and 5 are provided on the upper surface of the housing substrate 1. As shown in FIG. Note that among the terminal electrodes 2, 3, 4 and 5, the terminal electrode 3 is preferably grounded. Preferably, recessed portions 1a, 1b, and 1c are provided on one side surface of the housing substrate 1, and recessed portions 1d, 1e, and 1f are formed on the other side surface on the opposite side. Opposite end portions of the terminal electrodes 2 are arranged to extend to the recessed portions 1a and 1d, respectively. The opposite end portions of the terminal electrodes 3 are arranged to extend to the recessed portions 1b and 1e. The end portions of the terminal electrodes 4 and 5 are arranged to extend to the recessed portions 1f and 1c.

Since the terminal electrodes 2, 3, 4 and 5 are arranged to extend respectively to the recessed portions 1a to 1f, each of the terminal electrodes 2, 3, 4 and 5 can be electrically connected to an external circuit by making the external circuit connected to One of the recessed portions 1a to 1f. A preferably substantially rectangular insulating layer 6 is arranged on the housing substrate 1 . The insulating layer 6 is provided to prevent conduction between the terminal electrodes 2, 4 and 5 and the metal cover 7, which will be described below. There is no specific limitation on the material of the insulating layer 6, preferably, an insulating material such as epoxy resin or glass can be used.

Preferably, the paired piezoelectric elements 8 and 9 are mounted on the housing substrate 1 . The structure of the piezoelectric element will be described below with reference to FIGS. 2A and 2B. 2A and 2B are a plan view and a bottom view of the piezoelectric element 8, which show the electrode structure thereof. 2A and 2B, preferably, the piezoelectric element 8 comprises an elongated substantially rectangular piezoelectric substrate 10 . The piezoelectric substrate 10 is preferably made of a piezoelectric ceramic material such as lead zirconium titanate ceramic, or a piezoelectric single crystal such as quartz. When the piezoelectric substrate 10 is made of piezoelectric ceramics, the piezoelectric substrate 10 is preferably polarized in a direction parallel to the main surface of the substrate 10 .

First and second excitation electrodes 11 and 12 are provided on the upper surface of the piezoelectric substrate 10 with a predetermined gap therebetween. The common electrode 13 is provided on the lower surface of the piezoelectric substrate 10 so that the common electrode 13 faces the excitation electrodes 11 and 12 through the piezoelectric substrate 10 . The excitation electrodes 11 and 12 and the common electrode 13 constitute a first piezoelectric resonance section.

Similarly, the third and fourth excitation electrodes 14 and 15 are arranged on the upper surface of the piezoelectric substrate 10 with a predetermined gap therebetween, and a common electrode 16 is defined on the lower surface of the piezoelectric substrate 10. , so that the common electrode 16 faces the excitation electrodes 14 and 15 through the piezoelectric substrate 10 . The excitation electrodes 14 and 15 and the common electrode 16 constitute a second piezoelectric resonance section.

In addition, a capacitor electrode 17 is provided between the second and third excitation electrodes 12 and 14, and another capacitor electrode 18 is provided on the lower surface of the piezoelectric substrate 10.

The first excitation electrode 11 is electrically connected to a terminal electrode 19 provided along one end face of the piezoelectric substrate 10 . Similarly, the fourth excitation electrode 15 is electrically connected to the terminal electrode 20 provided along the other end face of the piezoelectric substrate 10 . Each of the terminal electrodes 19 and 20 is arranged to extend to the lower surface of the piezoelectric substrate 10 through the corresponding end surface. Note that piezoelectric element 9 preferably has the same structure as piezoelectric element 8 .

The electrical connection between the terminal electrodes 19 and 20 and the capacitor electrode 18 enables each of the piezoelectric elements 8 and 9 to function as a piezoelectric filter utilizing the thickness tangential vibration mode. In addition, a two-stage piezoelectric filter is produced by electrical connection between the terminal electrode 19 of the piezoelectric element 8 and the terminal electrode 19 of the piezoelectric element 9 . In using a two-stage piezoelectric filter, an input signal is applied to the terminal electrode 20 of the piezoelectric element 8, and the capacitor electrodes 18 of the piezoelectric elements 8 and 9 are grounded. Thus, an output signal can be obtained from the terminal electrode 20 of the piezoelectric element 9 .

Note that the piezoelectric elements 8 and 9 are electrically connected to the above-mentioned terminal electrodes 2 to 5 . Referring now to FIG. 1, the piezoelectric element 8 is preferably connected to the terminal electrodes 2, 3 and 4 through layers 21, 22 and 23 of conductive paste. More specifically, the portion extending the terminal electrode 19 to the lower surface of the piezoelectric substrate 10 is electrically connected to the terminal electrode 2 of the housing substrate 1 through the conductive paste layer 21 . The capacitor electrode 18 is electrically connected to the terminal electrode 3 of the case substrate 1 through the conductive paste layer 22 . Portions extending the terminal electrodes 20 to the lower surface of the piezoelectric substrate 10 are electrically connected to the terminal electrodes 4 of the case substrate 1 through the conductive paste layer 23 . Similarly, the piezoelectric element 9 is connected to the terminal electrodes 2 , 3 and 5 through the conductive paste layers 24 , 25 and 26 .

After the piezoelectric elements 8 and 9 are connected to the case substrate 1 through the conductive paste layers 21 to 26 , the conductive paste layers 27 and 28 are provided on the insulating layer 6 . The conductive paste layers 27 and 28 are preferably provided across the insulating layer 6 in order to establish electrical connection with the terminal electrodes 3 . In other words, both the inner and outer ends of the conductive paste layers 27 and 28 are electrically connected to the terminal electrodes 3 . Note that via holes may be provided in insulating layer 6 in order to establish electrical connection between conductive paste layers 27 and 28 and terminal electrodes 3 . When the metal cover 7 is connected to the housing substrate 1, the conductive paste layers 27 and 28 are first arranged on the insulating layer 6, and then the insulating adhesive 29 is applied to the opening edge of the metal cover 7, and then the metal cover 7 is connected. to the housing substrate 1. The opening edge of the metal cover 7 preferably has a polygonal shape with a plurality of sides. The part of the opening edge located on the longer sides 7a and 7b preferably protrudes downwards relative to the shorter sides 7c and 7d, thereby defining a bulge X according to a preferred embodiment of the invention. That is, as shown in the side view of FIG. 3, the middle portion of the longer side 7 preferably protrudes downward to provide the protrusion X. As shown in FIG. Note that in FIG. 3 , the protruding portion is described in an exaggerated manner, so that the protruding amount of the protruding portion X in FIG. 3 is larger than the actual protruding amount.

Due to the protrusion X, when the metal cover 7 is connected to the insulating layer 6 of the housing substrate 1 by insulating adhesive as shown in FIG. 1, as shown in FIG. 4, the protrusion X of the metal cover 7 is reliably contact with the conductive paste layer in a way so as to establish a reliable electrical connection between the metal cover 7 and the terminal electrode 3 .

As a result, even when the case substrate 1 is bent, or the insulating adhesive 29 is unevenly applied to the metal cover 7, due to the above-mentioned protrusion X of the metal cover 7, when the metal cover 7 is pressed against the insulating layer 6 , it reliably contacts the conductive paste layers 27 and 28, and this part is more easily and reliably contacted with the conductive paste layers 27 and 28 than other parts of the metal cover 7. Correspondingly, not only the mechanical connection between the metal cover 7 and the insulating layer 6 is reliably and safely realized, but also the electrical connection between the metal cover 7 and the terminal electrodes 3 is reliably and safely realized. Thereby, the metal cover 7 can provide electromagnetic shielding in a reliable manner.

In the above preferred embodiment, almost the entire part (but not all) of each longer side 7a and 7b of the opening edge of the metal cover 7 is protruded downward to provide the protrusion X. As shown in FIG. However, as shown in the side view of FIG. 5, the middle portion of each of the longer sides 7a and 7b may be partially protruded downward to provide a protruding portion X. As shown in FIG. Alternatively, an entire portion of each of the longer sides 7a and 7b may be protruded downward to provide the protruding portion X. As shown in FIG. In addition, the shape of the edge of the opening of the metal cover 7 is not limited to a substantially rectangular shape, and may be, for example, a pentagonal, circular, or other appropriate shape. Also, instead of the metal cover 7, a conductive cover made of ceramic material and covered with a conductive material may be used. Note that the position of the protrusion provided on the edge of the opening of the conductive cover can be appropriately determined in accordance with the position of the grounded terminal electrode on the case substrate, and the position of the conductive paste layer provided to be connected to the terminal electrode.

Although the present invention has been particularly shown and described with reference to the preferred embodiments of the present invention, those skilled in the art will understand that the above and other changes in form and details may be made without departing from the spirit and scope of the present invention. Change.

Claims (19)

1. An electronic component, characterized in that it comprises: a housing substrate having a ground electrode on its upper surface; an electronic component unit mounted on the housing substrate; a conductive cover with an open edge; a protrusion provided on the edge of the opening, the protrusion being configured to extend from the edge of the opening, wherein the opening edge of the conductive cover is connected to the upper surface of the housing substrate; and An insulative adhesive disposed on the open edge of the cover connects the open edge of the conductive cover to the upper surface of the housing substrate. 2. The electronic component according to claim 1, wherein the protrusion is in electrical contact with the ground electrode. 3. The electronic component of claim 2, further comprising a conductive material on the ground electrode, wherein the protrusion contacts the conductive material such that the protrusion is electrically connected to the ground electrode. 4. The electronic component as claimed in claim 1, wherein the opening edge of the conductive cover has a polygonal shape with a plurality of sides, wherein the protrusion is provided on at least one side. 5. The electronic component as claimed in claim 1, wherein the edge of the opening of the conductive cover is round. 6. The electronic component according to claim 4, wherein the protrusion is provided on the entire edge of the at least one side of the conductive cover. 7. The electronic component according to claim 1, wherein the electronic element unit is a piezoelectric resonator element. 8. The electronic component as claimed in claim 1, wherein the conductive cover is a metal cover. 9. The electronic component as claimed in claim 1, wherein the ground electrode extends beyond the conductive cover. 10. The electronic component according to claim 3, wherein the conductive material is a conductive paste layer. 11. The electronic component as claimed in claim 1, wherein the conductive cover is made of a ceramic material and coated with a conductive material. 12. An electronic component, characterized in that it comprises: a housing substrate having a ground electrode on its upper surface; Electronic component units mounted on housing substrates; A casing, the casing has an upper surface, a plurality of side walls extending from the upper surface and defining an opening, and at least one protrusion is arranged on the opening, so that the at least one protrusion extending from the opening portion, wherein the opening portion of the housing is connected to the upper surface of the housing substrate such that the at least one protruding portion is in electrical contact with the ground electrode; and An insulative adhesive disposed on the open edge of the cover connects the open edge of the conductive cover to the upper surface of the housing substrate. 13. The electronic component of claim 12, further comprising a conductive material on the ground electrode, wherein the protrusion contacts the conductive material such that the protrusion is electrically connected to the ground electrode. 14. The electronic component of claim 12, wherein the housing is a metal housing. 15. The electronic component according to claim 12, wherein the housing is made of a ceramic material and coated with a conductive material. 16. The electronic component according to claim 12, wherein the electronic element unit is a piezoelectric element unit. 17. A method of manufacturing an electronic component, comprising the steps of: providing a housing substrate having a ground electrode on an upper surface thereof; mounting electronic components on the housing substrate; Provide a conductive cover with an open edge; forming a protrusion on the edge of the opening such that the protrusion extends from the edge of the opening; connecting the conductive cover to the housing substrate so that the protrusion is in electrical contact with the ground electrode; An insulating adhesive is provided on the opening edge of the cover to connect the opening edge of the conductive cover to the upper surface of the housing substrate. 18. The method of manufacturing an electronic component as claimed in claim 17, wherein the step of providing the conductive cover further comprises forming the edge of the opening to have a plurality of sides. 19. The method of manufacturing an electronic component as claimed in claim 18, wherein the step of forming the protrusion further comprises forming the protrusion on at least one side of the edge of the opening.

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