CN115143869A - Sensor chip position checking device with electronic excitation and method - Google Patents

Abstract

The invention provides a sensor chip position checking device with electronic excitation and a method thereof, wherein the sensor chip position checking device with electronic excitation comprises: the device comprises a multi-angle electronic excitation module, an installation jig, a sensor power supply and load module, a phase acquisition and processing module, a chip position checking module and a power supply module. The multi-angle electronic excitation module is electrically connected with the chip position checking module; the mounting jig fixes the sensor at the position of the electronic excitation signal; the sensor power supply and load module is electrically connected with the sensor; the phase acquisition and processing module is respectively and electrically connected with the sensor and the chip position checking module; the power supply module is electrically connected with the sensor power supply and load module, the phase acquisition and processing module, the chip position checking module and the multi-angle electronic excitation module respectively. The device and the method do not need to physically cut the sensor, do not cause damage and waste, and have the advantages of simple, convenient and quick installation and detection of the sensor, low cost and high efficiency.

Description

A sensor chip position inspection device and method with electronic excitation

technical field

The invention belongs to the technical field of product detection and testing, and in particular relates to a sensor chip position inspection device and method with electronic excitation.

Background technique

Sensors, especially engine sensors, need to check the chip position during the design, production and verification process. Any offset or tilt of the chip will result in a shift in the phase angle of the sensor detection signal, resulting in reduced measurement accuracy. In the past, for the inspection of the internal chip position of the sensor, the conventional method was to use the physical cutting method, which must damage the sensor. After the inspection, the sensor was scrapped. This method greatly resulted in product waste, high inspection cost, complex method and slow inspection speed. Although the applicant is also researching and developing new dynamic inspection devices and methods, the sensors need to be disassembled and installed frequently to different installation positions, the inspection devices are relatively bulky, and there is still room for improvement in operation and efficiency.

SUMMARY OF THE INVENTION

In order to overcome the deficiencies in the prior art, the present invention provides a sensor chip position inspection device and method with electronic excitation, which is simple in operation, fast in speed, high in efficiency, small in volume, low in cost and does not destroy the sensor.

In order to achieve the above purpose, the present invention proposes a sensor chip position inspection device with electronic excitation, including: a multi-angle electronic excitation module, a mounting fixture, a sensor power supply and load module, a phase acquisition and processing module, a chip position inspection module, and a power supply. module; of which,

The multi-angle electronic excitation module is electrically connected to the chip position inspection module and provides multi-angle electronic excitation signals for the sensor to be measured;

The installation fixture fixes the sensor to be measured at the position of the electronic excitation signal;

The sensor power supply and load module is electrically connected to the sensor to be tested and provides power and workload for the sensor to be tested;

The phase acquisition and processing module is electrically connected to the sensor to be tested and the chip position checking module to collect and process the phase signal output by the sensor to be tested, and transmit the processed phase signal to the chip position check module;

The chip position inspection module includes a main control computer and a chip position inspection unit installed in the main control computer to receive the phase signal output by the phase acquisition and processing module, and measure and calculate the phase signal to determine the The chip position status in the sensor to be tested;

The power supply module is respectively electrically connected with the sensor to be tested power supply and load module, the phase acquisition and processing module, the chip position inspection module and the multi-angle electronic excitation module.

Preferably, the multi-angle electronic excitation module is composed of a coil system, and the coil system includes two sets of orthogonally arranged coil sets.

Preferably, the multi-angle electronic excitation module is composed of a coil system, and the coil system can generate two pairs of alternating magnetic fields in a total of four directions, providing electrons at four angles of 0°, 90°, 180° and 270°. excitation signal.

Preferably, the sensor to be measured is fixedly installed in the middle position where the two sets of coils of the multi-angle electronic excitation module are orthogonally arranged.

Preferably, the sensor power supply and load module includes a DC regulated power supply, a load resistor, a load capacitor and a custom load protection circuit.

Preferably, the phase acquisition and processing module includes a signal acquisition card and a signal conditioning circuit; wherein the signal acquisition card is connected to the sensor to be measured and used to collect the phase signal output by the sensor to be measured; the signal conditioning circuit is connected to the signal acquisition card Used to receive and dynamically analyze the phase signal to filter out spurs in the phase signal.

Preferably, the chip position inspection module measures and calculates the phase angle and phase angle difference of the phase signal, and compares the phase angle difference with a preset inspection threshold to determine whether the position of the chip is shifted or tilted.

Preferably, the chip position checking unit can set and schedule the multi-angle electronic excitation module, sensor power supply and load module, phase acquisition and processing module, and can measure and calculate the phase signal to determine the to-be-measured Chip position status within the sensor.

Preferably, the chip position checking unit measures and calculates the phase angle and the phase angle difference of the phase signal, and compares the phase angle difference with a preset checking threshold to determine whether the position of the chip is shifted or tilted.

Preferably, the chip position checking module further comprises an electronic excitation synchronization unit installed in the main control computer, the electronic excitation synchronization unit can receive instructions and configuration parameters of the chip position inspection unit to synchronize and calibrate the multi-angle electronic Electronic excitation signal for the excitation module.

Preferably, the chip position checking module further includes a result display screen and a result display light; the result display screen is used to display the intermediate information and result information output by the chip position check unit; the result display light is used to indicate whether the check is completed .

Preferably, the sensor to be tested is an engine sensor, and the engine sensor includes a crankshaft sensor or a camshaft sensor.

In order to achieve the above purpose, the present invention also proposes a method for checking the position of a sensor chip, comprising the following steps:

The sensor to be tested is fixedly installed at the position of the electronic excitation signal;

Start the sensor chip position inspection device with electronic excitation to start inspection;

The inspection is completed and the inspection result is displayed.

Preferably, it also includes the step of synchronizing and calibrating the multi-angle electronic excitation module by using the electronic excitation synchronization unit before starting the inspection.

Preferably, it also includes the step of setting parameters for each module of the sensor chip position inspection device with electronic excitation before starting the inspection.

Preferably, during the inspection process, the sensor to be tested generates alternating electronic excitation signals according to angles in sequence, and the phase signal output by the sensor to be tested is processed, measured and calculated to obtain the phase angle difference.

Preferably, it also includes the step of comparing the phase angle difference with a preset inspection threshold to determine whether the position of the sensor chip to be tested is shifted or tilted.

Preferably, the step of displaying the inspection result further includes displaying the phase angle, the phase angle difference and the inspection result, and at the same time, the result display light is on.

Compared with the prior art, the device and method for checking the position of the sensor chip with electronic excitation of the present invention judges whether the position of the chip is shifted or tilted by analyzing and processing the detection signal of the sensor, and the present invention does not require physical inspection of the sensor. Cutting will not cause damage and waste of the sensor, and the detection speed is fast, the efficiency is high, and the cost is low. In addition, the present invention excites the sensor with electronic signals through the multi-angle electronic excitation module, which greatly reduces the size of the inspection device and has low power consumption. The invention has a high degree of automation, through automatic configuration and automatic detection, the inspection method of the sensor is very simple, the operation method is easy to repeat, it is suitable for large-scale detection, and the efficiency is high.

Description of drawings

Fig. 1 is the structural block diagram of the sensor chip position inspection device with electronic excitation of the present invention;

2 is a schematic diagram of the assembly structure of the sensor and the multi-angle electronic excitation module;

FIG. 3 is a working flow chart of the sensor chip position inspection device with electronic excitation according to the present invention.

Detailed ways

The solution of the present invention will be further described below with reference to the accompanying drawings and preferred embodiments.

In the following description, numerous specific details are set forth in order to give those skilled in the art a more complete understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced without some of these specific details. Furthermore, it is to be understood that the invention is not limited to the specific embodiments described. Rather, the invention is contemplated to be practiced with any combination of the following features and elements, whether or not they relate to different embodiments. Accordingly, the following aspects, features, embodiments, and advantages are for illustration purposes only and should not be regarded as elements or limitations of the claims unless explicitly stated in the claims. In addition, if words indicating directions appear in this document, such as up and down, left and right, upper side, lower side, etc., they are only expressed according to the relative positions of the components in the current drawings for convenience of expression, and should not be construed as a limitation on the protection scope.

Referring to FIG. 1 , this embodiment proposes a sensor chip position inspection device with electronic excitation, wherein the type of sensor to be tested is preferably an engine sensor, such as a crankshaft sensor, a camshaft sensor, etc., of course, not limited to this, but also includes other Type sensors such as wheel speed sensors, rotational speed sensors, etc., can be inspected using this inspection device.

The above-mentioned sensor chip position inspection device with electronic excitation includes: a multi-angle electronic excitation module, an installation fixture, a sensor power supply and load module, a phase acquisition and processing module, a chip position inspection module, and the multi-angle electronic excitation module and sensor power supply respectively. And the power supply module that is electrically connected to the load module, the phase acquisition and processing module, and the chip position inspection module.

Multi-angle electronic excitation module: it is electrically connected to the chip position inspection module and provides static and multi-angle electronic excitation signals for the sensor to be tested. The multi-angle electronic excitation module is composed of a coil system, as shown in FIG. 2 , the coil system includes two sets of orthogonally arranged coil groups C1C3 and C2C4 . The coil system can generate two pairs of alternating magnetic fields in four directions under static conditions, and provide electronic excitation signals at four angles of 0°, 90°, 180° and 270°. For example, coil C1C3 generates a horizontal excitation signal from right to left to the sensor to be tested, that is, an electronic excitation signal in the direction of 0 degrees; similarly, coil C1C3 can also generate horizontal from left to right to the sensor to be tested, or coil C2C4 to the sensor to be tested. The sensor generates excitation signals in the vertical up-down or vertical down-up direction, that is, the electronic excitation signals corresponding to 180 degrees, 90 degrees and 270 degrees respectively; the electronic excitation signals in each direction are detected by the sensor to be tested and output accordingly phase signal. The multi-angle electronic excitation module is also capable of communicating with the chip position checking module and receiving control commands.

For example, the mounting jig is provided with mounting holes for mounting the sensor to be tested and fixing it at the position of the electronic excitation signal, so as to perform indirect detection of the chip position. As shown in FIG. 2 , the sensor to be tested is installed in the middle position where the two sets of coils are orthogonally arranged. When the chip in the sensor to be tested is offset, the center of the chip will be offset by a certain distance from the center of the sensor.

Sensor power supply and load module: It is electrically connected to the sensor to be tested and provides power and workload for the sensor to be tested, including DC regulated power supply, load resistance and load capacitance. In addition, the sensor power supply and load module can also include a custom load protection circuit, which is used to customize the overcurrent threshold for different types of sensors, and protect the load circuit including the above load resistance and load capacitance from overcurrent damage.

Phase acquisition and processing module: respectively electrically connected to the sensor to be tested and the chip position checking module, the phase acquisition and processing module includes a signal acquisition card and a signal conditioning circuit for collecting and processing phase signals output by the sensor to be tested. Among them, the signal acquisition card is connected to the sensor to be tested and collects the phase signal output by the sensor to be tested; the signal conditioning circuit is connected to the signal acquisition card and used to collect and dynamically analyze the phase signal according to the signal characteristics of the sensor to filter out the phase signal in the signal. glitches to improve the acquisition accuracy of phase signals.

Chip position checking module: used to receive the phase signal output by the phase acquisition and processing module, and measure and calculate the phase signal to determine the chip position state in the sensor to be tested. The chip position inspection module includes a main control computer, a chip position inspection unit installed in the main control computer, an electronic excitation synchronization unit, a result display screen, a result display lamp and an inspection switch. Among them, the chip position checking unit can set and schedule other modules. Moreover, the chip position checking unit can measure and calculate the phase angle and phase angle difference of the phase signal to be measured, and judge whether the position of the chip is shifted or tilted by comparing the phase angle difference with a preset checking threshold. For example, the chip position checking unit measures and calculates the phase signal output corresponding to the 0-degree direction to determine whether the chip position of the sensor is shifted or tilted in the 0-degree direction; similarly, in other angular directions, such as 90° , 180 and 270 degree directions are judged in turn, and finally determine whether the position of the chip in the sensor is offset or inclined.

The electronic excitation synchronization unit is used for synchronizing and calibrating the electronic excitation signal of the coil system in the multi-angle electronic excitation module after each startup, and can receive instructions and configuration parameters of the chip position inspection unit during the inspection process Used to control the coil system and provide a phase signal reference for the sensor. The result display screen is used to display the intermediate information and result information output by the chip position inspection unit, such as the signal phase angles, phase angle differences and inspection results corresponding to the four excitation directions. The result display light is used to indicate whether the inspection is completed, and at the same time, when the inspection result exceeds the preset threshold, the red light is on to give an alarm, and the green light is on if it does not exceed the preset threshold. The check switch is a start switch for starting the check program.

Power supply module: respectively electrically connected to the sensor power supply and load module, the phase acquisition and processing module, the chip position inspection module and the multi-angle electronic excitation module, and provides working power and leakage protection for the above modules .

Referring to Fig. 3, it is the working steps of the sensor chip position inspection device with electronic excitation of the present invention, including:

Start-up and electronic excitation synchronization: After the device is turned on, the electronic excitation synchronization unit synchronizes and calibrates the coil system in the multi-angle electronic excitation module.

Install the sensor: Install the sensor to be tested, such as the engine sensor. Use fixing parts such as bolts to fix the sensor to the fixed position of the installation jig, so that the sensor is located in the middle of the orthogonal arrangement of the two sets of coils.

Chip position check module setting: Set the parameters of the chip position check module, including: sensor type selection, current threshold setting, electronic excitation signal setting including excitation size and period, related settings including signal acquisition frequency and period, inspection Threshold setting. Wherein, the electronic excitation synchronization unit can receive the instruction of the chip position checking unit and the electronic excitation signal setting parameters, so as to synchronize the coil system in the multi-angle electronic excitation module.

The check switch is triggered: After the check switch is triggered, the check is started, and the chip position check module starts and schedules each functional module to start working.

Chip position inspection: to perform chip position inspection, the coil system of the multi-angle electronic excitation module generates alternating electronic excitation signals in turn according to the angle, the phase acquisition and processing module collects the phase signal output by the sensor and processes it, and the chip position inspection unit receives the phase acquisition and Process the phase signal output by the module, measure and calculate the phase angle and phase angle difference of the phase signal, and display the phase angle and phase angle difference in real time on the result display screen.

The chip position inspection is completed: After the chip position inspection is completed, the chip position inspection unit stores and analyzes the phase angles and phase angle differences of multiple measured angles of the aforementioned sensors, and compares the phase angle differences of the multiple measured angles with the preset inspection threshold. Compare, and then judge whether the position of the sensor chip is offset or tilted. The results display shows the phase angle, phase angle difference and inspection results. At the same time, the result display light is on, and when the inspection result exceeds the preset threshold, the red light is on for alarm, and the green light is on if it does not exceed the preset threshold.

End Inspection: End this round of inspection.

Although the present invention has been disclosed above with preferred embodiments, the present invention is not limited thereto. Any person skilled in the art, without departing from the spirit and scope of the present invention, makes various changes and modifications, all should be included in the protection scope of the present invention, so the protection scope of the present invention should be limited by the claims. allow.

Claims (18)

1. A sensor chip position inspection device with electronic excitation, characterized by comprising: the device comprises a multi-angle electronic excitation module, an installation jig, a sensor power supply and load module, a phase acquisition and processing module, a chip position checking module and a power supply module; wherein,

the multi-angle electronic excitation module is electrically connected with the chip position inspection module and provides multi-angle electronic excitation signals for the sensor to be tested;

the mounting jig fixes the sensor to be tested at the position of the electronic excitation signal;

the sensor power supply and load module is electrically connected with the sensor to be detected and provides a power supply and a working load for the sensor to be detected;

the phase acquisition and processing module is respectively and electrically connected with the sensor to be detected and the chip position inspection module so as to acquire and process a phase signal output by the sensor to be detected and transmit the processed phase signal to the chip position inspection module;

the chip position checking module comprises a main control computer and a chip position checking unit arranged on the main control computer, and is used for receiving the phase signal output by the phase acquisition and processing module, and measuring and calculating the phase signal to determine the chip position state in the sensor to be detected;

the power supply module is respectively electrically connected with the power supply and load module of the sensor to be tested, the phase acquisition and processing module, the chip position checking module and the multi-angle electronic excitation module.

2. The apparatus of claim 1, wherein the multi-angle electronic excitation module is composed of a coil system, and the coil system comprises two orthogonally arranged coil sets.

3. The apparatus for inspecting the position of a sensor chip with electronic excitation according to claim 1, wherein said multi-angle electronic excitation module is composed of a coil system capable of generating two pairs of four-directional alternating magnetic fields providing four-angle electronic excitation signals of 0 degrees, 90 degrees, 180 degrees and 270 degrees.

4. The apparatus for inspecting the position of a sensor chip with electronic excitation according to claim 1, wherein the sensor to be tested is fixedly installed at the middle position of the orthogonal arrangement of the two sets of coils of the multi-angle electronic excitation module.

5. The device of claim 1, wherein the sensor power and load module comprises a regulated dc power supply, a load resistor, a load capacitor, and a custom load protection circuit.

6. The apparatus of claim 1, wherein the phase acquisition and processing module comprises a signal acquisition card and a signal conditioning circuit; the signal acquisition card is connected with the sensor to be detected and is used for acquiring a phase signal output by the sensor to be detected; and the signal conditioning circuit is connected with the signal acquisition card and is used for receiving and dynamically analyzing the phase signals so as to filter burrs in the phase signals.

7. The sensor chip position inspection device with electronic excitation according to any one of claims 1 to 6, wherein the chip position inspection module measures and calculates a phase angle and a phase angle difference of the phase signal, and compares the phase angle difference with a preset inspection threshold to determine whether the position of the chip is shifted or tilted.

8. The device as claimed in any one of claims 1 to 6, wherein the chip position checking unit is capable of setting and scheduling the multi-angle electronic excitation module, the sensor power supply and load module, and the phase acquisition and processing module, and measuring and calculating the phase signals to determine the chip position status in the sensor under test.

9. The sensor chip position inspection device with electronic excitation according to claim 8, wherein the chip position inspection unit measures and calculates a phase angle and a phase angle difference of the phase signal, and compares the phase angle difference with a preset inspection threshold to determine whether the position of the chip is shifted or tilted.

10. The apparatus of claim 8, wherein the chip position inspecting module further comprises an electronic excitation synchronizing unit installed at a main control computer, the electronic excitation synchronizing unit being capable of receiving instructions and configuration parameters of the chip position inspecting unit to synchronize and calibrate the electronic excitation signals of the multi-angle electronic excitation module.

11. The sensor chip position inspection device with electronic excitation according to any one of claims 1 to 6, wherein the chip position inspection module further comprises a result display screen and a result display lamp; the result display screen is used for displaying the intermediate information and the result information output by the chip position checking unit; the result display lamp is used to indicate whether the inspection is completed.

12. The device for inspecting position of a sensor chip with electronic excitation according to any one of claims 1 to 6, wherein the sensor under test is an engine sensor, and the engine sensor includes a crank sensor or a camshaft sensor.

13. A sensor chip position inspection method using a sensor chip position inspection device with electronic excitation according to any one of claims 1 to 12, characterized by comprising the steps of:

the sensor to be measured is fixedly arranged at the position of the electronic excitation signal;

starting the sensor chip position checking device with electronic excitation to start checking;

the inspection is completed and the inspection result is displayed.

14. The method of claim 13, further comprising the step of synchronizing and calibrating the multi-angle electronic excitation module with the electronic excitation synchronizing unit before starting the inspection.

15. The method of claim 13, further comprising the step of setting parameters of modules of the sensor chip position inspection device with electronic excitation before starting inspection.

16. The method of claim 13, further comprising the steps of sequentially generating alternating electrical excitation signals for the sensor under test in an angular sequence, and processing, measuring and calculating phase signals output from the sensor under test to obtain phase angle differences during the inspection.

17. The method for inspecting the position of a sensor chip according to claim 16, further comprising the step of comparing the phase angle difference with a preset inspection threshold to determine whether the position of the sensor chip to be inspected is shifted or tilted.

18. The method of claim 13, wherein the step of displaying the inspection result further comprises displaying the phase angle, the phase angle difference, and the inspection result, and the result display lamp is turned on.

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