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CN115129532B - Storage test equipment and hot-swap test device thereof - Google Patents

Storage test equipment and hot-swap test device thereof Download PDF

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Publication number
CN115129532B
CN115129532B CN202210910099.3A CN202210910099A CN115129532B CN 115129532 B CN115129532 B CN 115129532B CN 202210910099 A CN202210910099 A CN 202210910099A CN 115129532 B CN115129532 B CN 115129532B
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hot
controller
ith
hot plug
test
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CN115129532A (en
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王超
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Suzhou Inspur Intelligent Technology Co Ltd
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Suzhou Inspur Intelligent Technology Co Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/22Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/26Functional testing
    • G06F11/273Tester hardware, i.e. output processing circuits
    • G06F11/2733Test interface between tester and unit under test
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • G06F13/40Bus structure
    • G06F13/4063Device-to-bus coupling
    • G06F13/4068Electrical coupling
    • G06F13/4081Live connection to bus, e.g. hot-plugging

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The application discloses a storage test device and a hot plug test device thereof, which are applied to the technical field of product test and comprise: the mainboard to be tested is provided with N slots for connecting N interface cards, a switching circuit and a controller; the hot-plug adapter board is connected with the main board to be tested, the switch circuit is controlled to be in an off state after entering a test mode, and an ith level control signal is sent to the controller when an ith control instruction is received; the switch circuit is in a conducting state when in a default state so as to connect the controller and each slot position; the controller is respectively connected with the N slots, and when the ith level control signal is received, the level state of the target pin of the ith slot is controlled to perform hot plug testing on the ith slot. By applying the scheme of the application, each interface card is not required to be plugged and unplugged, the hot plug function of each interface card can be conveniently and efficiently tested, the test efficiency is improved, and the interface damage caused by repeated plugging and unplugging can be avoided.

Description

一种存储测试设备及其热插拔测试装置Storage test equipment and hot-swap test device thereof

技术领域Technical Field

本发明涉及产品测试技术领域,特别是涉及一种存储测试设备及其热插拔测试装置。The present invention relates to the technical field of product testing, and in particular to a storage testing device and a hot plug testing apparatus thereof.

背景技术Background technique

在大数据量,高速率的存储领域中,海量数据传输需要占用超大的带宽和接口数量。在超高的传输速率下,设备对外支持的接口卡数量及种类随之增加,伴随的问题是众多板卡如何保证稳定可靠运行,因此,在研发阶段需要及时有效地发现存在的风险及问题,这就意味着需要进行大量的试验,在保证测试质量的同时还需要提高工作效率。In the field of large data volume and high-speed storage, massive data transmission requires a large bandwidth and number of interfaces. Under the ultra-high transmission rate, the number and types of interface cards supported by the equipment increase accordingly, and the accompanying problem is how to ensure stable and reliable operation of many boards. Therefore, it is necessary to timely and effectively discover the existing risks and problems in the R&D stage, which means that a large number of tests are needed to ensure the quality of the test while improving work efficiency.

其中,设备的接口卡的“热插拔功能”测试是一个重要测试项目。但是由于存储设备支持的接口卡数量较多,逐一进行插拔测试导致工作效率较低,不利于缩短产品的测试周期,增大了开发成本。Among them, the "hot-swap function" test of the device's interface card is an important test item. However, since the storage device supports a large number of interface cards, plug-and-unplug testing one by one leads to low work efficiency, which is not conducive to shortening the product test cycle and increases development costs.

综上所述,如何更加方便高效地进行各个接口卡的热插拔功能的测试,是目前本领域技术人员急需解决的技术问题。In summary, how to test the hot-swap function of each interface card more conveniently and efficiently is a technical problem that those skilled in the art need to solve urgently.

发明内容Summary of the invention

本发明的目的是提供一种存储测试设备及其热插拔测试装置,以更加方便、高效地进行各个接口卡的热插拔功能的测试。The object of the present invention is to provide a storage test device and a hot-plug test apparatus thereof, so as to test the hot-plug function of each interface card more conveniently and efficiently.

为解决上述技术问题,本发明提供如下技术方案:In order to solve the above technical problems, the present invention provides the following technical solutions:

一种热插拔测试装置,包括:热插拔转接板以及待测主板,所述待测主板中设置有N个槽位,开关电路以及控制器;A hot-swap test device comprises: a hot-swap adapter board and a mainboard to be tested, wherein the mainboard to be tested is provided with N slots, a switch circuit and a controller;

N个所述槽位用于依次连接N个接口卡;The N slots are used to connect N interface cards in sequence;

所述热插拔转接板与所述待测主板连接,用于在进入测试模式之后,控制所述开关电路为关断状态,在接收到第i控制指令时,向所述控制器发送第i电平控制信号;N和i均为正整数且1≤i≤N;The hot-swap adapter board is connected to the motherboard to be tested, and is used to control the switch circuit to be in an off state after entering the test mode, and send an i-th level control signal to the controller when receiving the i-th control instruction; N and i are both positive integers and 1≤i≤N;

所述开关电路分别与N个槽位以及所述控制器连接,用于:在默认状态时为导通状态,以使得所述控制器通过所述开关电路与各个槽位连接;The switch circuit is connected to the N slots and the controller respectively, and is used to: be in a conducting state in a default state, so that the controller is connected to each slot through the switch circuit;

所述控制器分别与N个槽位连接,用于:在接收到所述第i电平控制信号时,控制N个槽位中的第i槽位的目标引脚的电平状态,以进行对于所述第i槽位的热插拔测试。The controller is connected to N slots respectively, and is used to: when receiving the i-th level control signal, control the level state of the target pin of the i-th slot among the N slots, so as to perform a hot plug test on the i-th slot.

优选的,所述待测主板中设置有第一连接器,所述第一连接器分别与所述控制器和所述开关电路连接;所述热插拔转接板中设置有第二连接器,N个控制按键;Preferably, the mainboard to be tested is provided with a first connector, and the first connector is connected to the controller and the switch circuit respectively; the hot-swap adapter is provided with a second connector and N control buttons;

所述第二连接器与所述第一连接器连接,用于:在所述热插拔转接板进入测试模式之后,通过所述第一连接器控制所述开关电路为关断状态;在接收到第i电平控制信号时,通过所述第一连接器将所述第i电平控制信号发送至所述控制器;The second connector is connected to the first connector and is used to: after the hot-swap adapter enters the test mode, control the switch circuit to be in an off state through the first connector; and when receiving an i-th level control signal, send the i-th level control signal to the controller through the first connector;

N个控制按键用于:当第i控制按键在用户操作下从默认状态切换为非默认状态时,确认接收到第i控制指令时,并向所述第二连接器发送第i电平控制信号。The N control buttons are used to: when the i-th control button is switched from a default state to a non-default state under a user operation, confirm receipt of the i-th control instruction and send an i-th level control signal to the second connector.

优选的,所述热插拔转接板中还设置有N个信息提示装置;Preferably, the hot-swap adapter board is also provided with N information prompting devices;

N个信息提示装置依次与N个控制按键连接,当第i控制按键为非默认状态时,与第i控制按键连接的第i信息提示装置输出提示信息。N information prompting devices are connected to N control buttons in sequence. When the i-th control button is in a non-default state, the i-th information prompting device connected to the i-th control button outputs prompting information.

优选的,所述热插拔转接板中还设置有显示装置;Preferably, the hot-swap adapter board is also provided with a display device;

所述显示装置与N个控制按键均连接,当任意1个或多个控制按键为非默认状态时,显示出当前为非默认状态的各个控制按键的编号。The display device is connected to N control buttons, and when any one or more control buttons are in a non-default state, the numbers of the control buttons currently in the non-default state are displayed.

优选的,还包括:N个隔离开关,隔离开关控制器,自检装置;Preferably, it also includes: N isolating switches, an isolating switch controller, and a self-test device;

第i隔离开关设置在所述第二连接器与第i控制按键之间;The i-th isolation switch is arranged between the second connector and the i-th control button;

所述自检装置用于:在所述热插拔转接板上电之后,检测所述热插拔转接板的状态,并在检测通过时,向所述隔离开关控制器发送自检通过信号;The self-test device is used to: detect the state of the hot-swap adapter board after the hot-swap adapter board is powered on, and send a self-test pass signal to the isolation switch controller when the detection passes;

所述隔离开关控制器用于:在接收到所述自检通过信号之后,控制N个默认状态为关断状态的隔离开关均切换为导通状态。The isolating switch controller is used to control N isolating switches that are in the off state by default to switch to the on state after receiving the self-test pass signal.

优选的,N个隔离开关均为MOS管。Preferably, the N isolation switches are all MOS tubes.

优选的,所述开关电路为设置有使能端的开关电路,所述热插拔转接板具体用于:在进入测试模式之后,通过所述开关电路的使能端,控制所述开关电路为关断状态。Preferably, the switch circuit is a switch circuit provided with an enable end, and the hot-swap adapter board is specifically used to: after entering the test mode, control the switch circuit to an off state through the enable end of the switch circuit.

优选的,还包括:Preferably, it also includes:

设置在所述热插拔转接板与所述控制器之间的静电防护装置。An electrostatic protection device is arranged between the hot-swap adapter board and the controller.

优选的,当所述待测主板中设置有用于连接所述热插拔转接板的第一连接器时,所述静电防护装置包括多个静电防护单元,在所述第一连接器与所述控制器之间的各条线路上各设置有1个所述静电防护单元。Preferably, when the mainboard to be tested is provided with a first connector for connecting the hot-swappable adapter board, the electrostatic protection device includes a plurality of electrostatic protection units, and one of the electrostatic protection units is provided on each line between the first connector and the controller.

一种存储测试设备,包括如上述所述的热插拔测试装置。A storage testing device comprises the hot-swap testing apparatus as described above.

应用本发明实施例所提供的技术方案。设置了热插拔转接板以提高工作效率。具体的,在接收到第i控制指令时,热插拔转接板可以向待测主板中的控制器发送第i电平控制信号,而控制器分别与N个槽位连接,可以在接收到第i电平控制信号时,控制N个槽位中的第i槽位的目标引脚的电平状态,从而进行对于第i槽位的热插拔测试。可以看出,本申请的方案不需要工作人员去插拔接口卡,只需要操作热插拔转接板,使得热插拔转接板接收到相应的控制指令,待测主板中的控制器便可以控制N个槽位中的相应槽位的目标引脚的电平状态,即模拟了接口卡的插拔操作,实现对于相应槽位的接口卡的热插拔测试。并且本申请考虑到,部分场合中,当槽位上插入接口卡时,如果开关电路为导通状态,只要接口卡不拔出,则该槽位中的相应引脚会始终被拉低,即控制器无法按照接收到的电平控制信号的要求,控制该槽位的目标引脚的电平状态,因此,本申请的方案中,热插拔转接板与待测主板连接,在进入测试模式之后,会控制开关电路为关断状态,从而使得各个接口卡中的与插拔相关的引脚不会被固定拉低,即目标引脚不会被固定拉低,保障了本申请的热插拔测试能够有效地执行。The technical solution provided by the embodiment of the present invention is applied. A hot-swappable adapter board is provided to improve work efficiency. Specifically, when the i-th control instruction is received, the hot-swappable adapter board can send the i-th level control signal to the controller in the motherboard to be tested, and the controller is respectively connected to N slots, and can control the level state of the target pin of the i-th slot among the N slots when the i-th level control signal is received, thereby performing a hot-swappable test on the i-th slot. It can be seen that the solution of the present application does not require the staff to plug and unplug the interface card, but only needs to operate the hot-swappable adapter board so that the hot-swappable adapter board receives the corresponding control instruction, and the controller in the motherboard to be tested can control the level state of the target pin of the corresponding slot among the N slots, that is, the plug-in and unplug operation of the interface card is simulated, and the hot-swappable test of the interface card in the corresponding slot is realized. In addition, the present application takes into account that in some cases, when an interface card is inserted into a slot, if the switch circuit is in the on state, as long as the interface card is not removed, the corresponding pin in the slot will always be pulled low, that is, the controller cannot control the level state of the target pin of the slot according to the requirements of the received level control signal. Therefore, in the scheme of the present application, the hot-swap adapter board is connected to the motherboard to be tested, and after entering the test mode, the switch circuit will be controlled to be in the off state, so that the pins related to plugging and unplugging in each interface card will not be fixedly pulled low, that is, the target pin will not be fixedly pulled low, thereby ensuring that the hot-swap test of the present application can be effectively executed.

综上所述,本申请的方案中,工作人员无需依次插拔各个接口卡来进行热插拔功能的测试,而是只需要操作热插拔转接板,便可以方便、高效地进行各个接口卡的热插拔功能的测试,提高了测试效率,也可以避免出现由于多次插拔导致的接口损坏情况。To sum up, in the scheme of the present application, the staff does not need to plug and unplug each interface card one by one to test the hot-swap function. Instead, they only need to operate the hot-swap adapter board to conveniently and efficiently test the hot-swap function of each interface card, thereby improving the test efficiency and avoiding interface damage caused by multiple plugging and unplugging.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

图1为本发明中一种热插拔测试装置的结构示意图;FIG1 is a schematic diagram of the structure of a hot-swap test device in the present invention;

图2为本发明一种具体实施方式中热插拔测试装置的结构示意图;FIG2 is a schematic diagram of the structure of a hot-swap test device in a specific embodiment of the present invention;

图3为本发明另一种具体实施方式中热插拔测试装置的结构示意图。FIG3 is a schematic diagram of the structure of a hot-swap test device in another specific implementation manner of the present invention.

具体实施方式Detailed ways

本发明的核心是提供一种热插拔测试装置,工作人员无需依次插拔各个接口卡来进行热插拔功能的测试,而是只需要操作热插拔转接板,便可以方便、高效地进行各个接口卡的热插拔功能的测试,提高了测试效率,也可以避免出现由于多次插拔导致的接口损坏情况。The core of the present invention is to provide a hot-swap test device. The staff does not need to plug and unplug each interface card in turn to test the hot-swap function. Instead, they only need to operate the hot-swap adapter board to conveniently and efficiently test the hot-swap function of each interface card, thereby improving the test efficiency and avoiding interface damage caused by multiple plugging and unplugging.

为了使本技术领域的人员更好地理解本发明方案,下面结合附图和具体实施方式对本发明作进一步的详细说明。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。In order to enable those skilled in the art to better understand the scheme of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

请参考图1,图1为本发明中一种热插拔测试装置的结构示意图,该热插拔测试装置包括:热插拔转接板20以及待测主板10,待测主板10中设置有N个槽位,开关电路11以及控制器12;Please refer to FIG. 1 , which is a schematic diagram of the structure of a hot-swap test device in the present invention, the hot-swap test device comprising: a hot-swap adapter board 20 and a motherboard to be tested 10, the motherboard to be tested 10 is provided with N slots, a switch circuit 11 and a controller 12;

N个槽位用于依次连接N个接口卡;N slots are used to connect N interface cards in sequence;

热插拔转接板20与待测主板10连接,用于在进入测试模式之后,控制开关电路11为关断状态,在接收到第i控制指令时,向控制器12发送第i电平控制信号;N和i均为正整数且1≤i≤N;The hot-swap adapter board 20 is connected to the motherboard to be tested 10, and is used to control the switch circuit 11 to be in an off state after entering the test mode, and send an i-th level control signal to the controller 12 when receiving the i-th control instruction; N and i are both positive integers and 1≤i≤N;

开关电路11分别与N个槽位以及控制器12连接,用于:在默认状态时为导通状态,以使得控制器12通过开关电路11与各个槽位连接;The switch circuit 11 is connected to the N slots and the controller 12 respectively, and is used to: in a default state, be in an on state, so that the controller 12 is connected to each slot through the switch circuit 11;

控制器12分别与N个槽位连接,用于:在接收到第i电平控制信号时,控制N个槽位中的第i槽位的目标引脚的电平状态,以进行对于第i槽位的热插拔测试。The controller 12 is connected to the N slots respectively, and is used to control the level state of the target pin of the i-th slot among the N slots when receiving the i-th level control signal, so as to perform a hot plug test on the i-th slot.

具体的,本申请的方案中,设置了热插拔转接板20,从而可以方便、高效地进行待测主板10的“热插拔功能”测试。Specifically, in the solution of the present application, a hot-swap adapter board 20 is provided, so that the "hot-swap function" test of the mainboard 10 to be tested can be performed conveniently and efficiently.

待测主板10中设置有N个槽位,N为正整数,具体取值可以根据需要进行设定,实际应用中通常为不小于2的正整数。The mainboard 10 to be tested is provided with N slots, where N is a positive integer. The specific value can be set as required, and is usually a positive integer not less than 2 in practical applications.

N个槽位分别与N个接口卡连接,各个接口卡的具体类型均可以根据需要进行设定和选取,例如为支持PCIE(Peripheral Component Interconnect Express,高速串行计算机扩展总线标准)等协议的OCP(Open Computing Project,开放计算项目)接口卡。The N slots are respectively connected to N interface cards, and the specific type of each interface card can be set and selected as needed, for example, an OCP (Open Computing Project) interface card that supports protocols such as PCIE (Peripheral Component Interconnect Express, a high-speed serial computer expansion bus standard).

本申请的方案中,为了方便进行热插拔测试,将热插拔转接板20与待测主板10连接之后,工作人员只需要操作热插拔转接板20即可,即本申请的方案并不需要插拔接口卡,而是实现了对“插拔接口卡”的模拟,从而提高测试效率,并由于不需要插拔接口卡,因此在批量测试的场合中,可以避免出现由于多次插拔导致的接口损坏情况。In the scheme of the present application, in order to facilitate hot-swap testing, after the hot-swap adapter board 20 is connected to the motherboard 10 to be tested, the staff only needs to operate the hot-swap adapter board 20. That is, the scheme of the present application does not require plugging and unplugging the interface card, but realizes the simulation of "plugging and unplugging the interface card", thereby improving the test efficiency. And because there is no need to plug and unplug the interface card, in the case of batch testing, interface damage caused by multiple plugging and unplugging can be avoided.

需要说明的是,由于本申请的方案并不需要插拔接口卡,因此,在实际应用中,对于某个槽位而言,在进行热插拔测试的过程中,该槽位上可能全程未插入接口卡,也可能在热插拔测试的过程中始终插有接口卡。当然,更多的情况下,是在热插拔测试的过程中,各个槽位上都始终插有接口卡。It should be noted that, since the solution of the present application does not require the plugging and unplugging of the interface card, in actual applications, for a certain slot, during the hot-plug test, the slot may not have an interface card inserted in the entire process, or the slot may always have an interface card inserted in the process of the hot-plug test. Of course, in more cases, during the hot-plug test, each slot always has an interface card inserted.

而如果在热插拔测试的过程中,某个槽位上始终插有接口卡,考虑到通常是通过PRSNT引脚进行接口卡的热插拔测试,当接口卡未插入槽位时,槽位上的PRSNT引脚为高电平状态,反之,当接口卡插入槽位之后,槽位上的该引脚会通过CPLD接地,即会始终被拉低。因此,为了在槽位上都始终插有接口卡的情况下,本申请的方案依然能够实现对“插拔接口卡”的模拟,本申请设置了分别与N个槽位以及控制器12连接的开关电路11。If an interface card is always inserted in a certain slot during the hot-swap test, considering that the hot-swap test of the interface card is usually performed through the PRSNT pin, when the interface card is not inserted into the slot, the PRSNT pin on the slot is in a high level state, on the contrary, when the interface card is inserted into the slot, the pin on the slot will be grounded through the CPLD, that is, it will always be pulled low. Therefore, in order to enable the solution of the present application to still simulate "plugging and unplugging the interface card" when the interface card is always inserted in the slot, the present application sets a switch circuit 11 connected to N slots and the controller 12 respectively.

以图1中的槽位1为例,如果未设置开关电路11,则槽位1插入接口卡之后,槽位1的热插拔测试引脚PRSNT_1便会通过控制器12接地,即该引脚被拉低,导致无法提升该引脚电平。开关电路11在默认状态时则为导通状态,使得控制器12可以通过开关电路11与各个槽位连接,即,在不进行热插拔测试时,开关电路11为默认的导通状态,从而不会影响待测主板10的原有功能,控制器12的相应引脚可以正常连接至各个槽位。Taking slot 1 in FIG. 1 as an example, if the switch circuit 11 is not set, after the interface card is inserted into slot 1, the hot-swap test pin PRSNT_1 of slot 1 will be grounded through the controller 12, that is, the pin is pulled low, resulting in the inability to increase the pin level. The switch circuit 11 is in the on state in the default state, so that the controller 12 can be connected to each slot through the switch circuit 11, that is, when the hot-swap test is not performed, the switch circuit 11 is in the default on state, so that it will not affect the original function of the motherboard 10 to be tested, and the corresponding pins of the controller 12 can be normally connected to each slot.

而需要进行热插拔测试时,即热插拔转接板20与待测主板10连接之后,可以进入测试模式之后,进而控制开关电路11为关断状态。由于开关电路11为关断状态,因此上述例子中槽位1的热插拔测试引脚PRSNT_1不会始终被拉低,从而使得本申请的方案可以对该引脚的电平进行控制,实现热插拔测试。When a hot-swap test is required, that is, after the hot-swap adapter board 20 is connected to the motherboard 10 to be tested, the test mode can be entered, and the switch circuit 11 can be controlled to be in the off state. Since the switch circuit 11 is in the off state, the hot-swap test pin PRSNT_1 of slot 1 in the above example will not be always pulled low, so that the solution of the present application can control the level of the pin to implement the hot-swap test.

当热插拔转接板20接收到第i控制指令时,说明需要进行第i槽位的热插拔测试,因此,可以向控制器12发送第i电平控制信号。由于需要实现对“插拔接口卡”的模拟,因此,本申请的方案中,需要专门设置相关线路,即需要将控制器12与N个槽位连接,并且可以理解的是,例如控制器12通过引脚A与槽位1的PRSNT_1引脚连接时,引脚A在控制器12的控制下,可以接高电平,也可以接地,从而使得控制器12通过引脚A控制槽位1的PRSNT_1引脚的电平状态,也即控制器12可以控制第1槽位的上电或下电,从而实现对于第1槽位的热插拔测试。When the hot-swap adapter board 20 receives the i-th control instruction, it indicates that the hot-swap test of the i-th slot needs to be performed, and therefore, the i-th level control signal can be sent to the controller 12. Since it is necessary to implement the simulation of the "plug-in interface card", in the scheme of the present application, it is necessary to specially set up relevant lines, that is, it is necessary to connect the controller 12 to the N slots, and it can be understood that, for example, when the controller 12 is connected to the PRSNT_1 pin of slot 1 through pin A, pin A can be connected to a high level or to ground under the control of the controller 12, so that the controller 12 controls the level state of the PRSNT_1 pin of slot 1 through pin A, that is, the controller 12 can control the power-on or power-off of the first slot, thereby implementing the hot-swap test for the first slot.

本申请的待测主板10中的控制器12,通常可以为CPLD(Compex ProgrammableLogic Device,复杂可编程逻辑器件)。控制器12接收到第i电平控制信号时,会控制第i槽位的目标引脚的电平状态,以进行对于第i槽位的热插拔测试。目标引脚也就是第i槽位中用于表示第i槽位是否插入接口卡的引脚,例如图1中示出的PRSNT_1和PRSNT_2便分别为第1槽位和第2槽位的目标引脚。The controller 12 in the motherboard 10 to be tested of the present application can generally be a CPLD (Compex Programmable Logic Device). When the controller 12 receives the i-th level control signal, it controls the level state of the target pin of the i-th slot to perform a hot plug test on the i-th slot. The target pin is the pin in the i-th slot used to indicate whether the i-th slot is inserted with an interface card. For example, PRSNT_1 and PRSNT_2 shown in FIG. 1 are the target pins of the 1st slot and the 2nd slot, respectively.

在控制第i槽位的目标引脚的电平状态时,是控制为高电平还是低电平,可以根据需要进行设定,均不影响本发明的实施,当然,通常是控制为高电平。When controlling the level state of the target pin of the i-th slot, whether it is controlled to be a high level or a low level can be set as needed, which does not affect the implementation of the present invention. Of course, it is usually controlled to be a high level.

例如一种场合中,在热插拔测试的过程中,第1槽位上始终插有接口卡,则控制器12不进行控制时,PRSNT_1引脚为低电平,当控制器12接收到第1电平控制信号时,便会控制第1槽位的PRSNT_1引脚为高电平状态,即模拟第1槽位的接口卡拔出,实现对于第1槽位的热插拔测试。又如一种场合中,在热插拔测试的过程中,第1槽位上始终未插有接口卡,则控制器12不进行控制时,PRSNT_1引脚为高电平状态,当控制器12接收到第1电平控制信号时,便会控制第1槽位的PRSNT_1引脚为低电平状态,即模拟第1槽位的接口卡插入,以进行对于第1槽位的热插拔测试。For example, in one case, during the hot-swap test, if an interface card is always inserted in the first slot, when the controller 12 does not perform control, the PRSNT_1 pin is at a low level, and when the controller 12 receives the first level control signal, it will control the PRSNT_1 pin of the first slot to a high level state, that is, simulate the interface card in the first slot to be pulled out, and implement the hot-swap test for the first slot. In another case, during the hot-swap test, if no interface card is always inserted in the first slot, when the controller 12 does not perform control, the PRSNT_1 pin is at a high level state, and when the controller 12 receives the first level control signal, it will control the PRSNT_1 pin of the first slot to a low level state, that is, simulate the interface card in the first slot to be inserted, so as to perform the hot-swap test for the first slot.

此外需要说明的是,控制器12是否接收到第i电平控制信号,影响的是第i槽位的目标引脚的电平状态,从而实现第i槽位的热插拔测试,而在该热插拔测试过程中,工作人员可以通过观察主板上的显示灯,或者接口卡上的显示灯,或者通过其他设定的方式,确认第i槽位的热插拔测试是否通过。例如上述例子中,第1槽位上始终插有接口卡,则控制器12不进行控制时,PRSNT_1引脚为低电平,接口卡上的指示灯亮起,当控制器12接收到第1电平控制信号时,控制第1槽位的PRSNT_1引脚为高电平状态,即模拟第1槽位的接口卡拔出,此时接口卡上的该指示灯不亮,表示该接口卡被拔出,且待测主板10也未发现任何异常,便说明第1槽位的热插拔测试通过。反之,控制器12接收到第1电平控制信号之后,工作人员如果观察到接口卡上的指示灯依旧为点亮状态,则可以认为第1槽位的热插拔测试未通过。In addition, it should be noted that whether the controller 12 receives the i-th level control signal affects the level state of the target pin of the i-th slot, thereby realizing the hot-swap test of the i-th slot. During the hot-swap test, the staff can confirm whether the hot-swap test of the i-th slot is passed by observing the display light on the mainboard, or the display light on the interface card, or by other setting methods. For example, in the above example, the interface card is always inserted in the first slot. When the controller 12 does not control, the PRSNT_1 pin is low level, and the indicator light on the interface card is on. When the controller 12 receives the first level control signal, the PRSNT_1 pin of the first slot is controlled to be high level, that is, the interface card of the first slot is simulated to be pulled out. At this time, the indicator light on the interface card is not on, indicating that the interface card is pulled out, and the mainboard 10 to be tested does not find any abnormality, which means that the hot-swap test of the first slot is passed. On the contrary, after the controller 12 receives the first level control signal, if the staff observes that the indicator light on the interface card is still on, it can be considered that the hot-swap test of the first slot has not passed.

本申请的热插拔转接板20的具体结构可以根据实际需要进行设定,能够实现本申请的热插拔转接板20的功能即可。The specific structure of the hot-swap adapter board 20 of the present application can be set according to actual needs, as long as the functions of the hot-swap adapter board 20 of the present application can be realized.

例如在本发明的一种具体实施方式中,可参阅图2,待测主板10中设置有第一连接器,第一连接器分别与控制器12和开关电路11连接;热插拔转接板20中设置有第二连接器,N个控制按键21;For example, in a specific embodiment of the present invention, referring to FIG. 2 , a first connector is provided in the mainboard 10 to be tested, and the first connector is connected to the controller 12 and the switch circuit 11 respectively; a second connector and N control buttons 21 are provided in the hot-swap adapter board 20;

第二连接器与第一连接器连接,第二连接器用于:在热插拔转接板20进入测试模式之后,通过第一连接器控制开关电路11为关断状态;在接收到第i电平控制信号时,通过第一连接器将第i电平控制信号发送至控制器12;The second connector is connected to the first connector, and the second connector is used to: after the hot-swap adapter board 20 enters the test mode, control the switch circuit 11 to be in the off state through the first connector; when receiving the i-th level control signal, send the i-th level control signal to the controller 12 through the first connector;

N个控制按键21用于:当第i控制按键21在用户操作下从默认状态切换为非默认状态时,确认接收到第i控制指令时,并向第二连接器发送第i电平控制信号。The N control buttons 21 are used to: when the i-th control button 21 is switched from a default state to a non-default state under a user operation, confirm receipt of the i-th control instruction and send an i-th level control signal to the second connector.

该种实施方式中,热插拔转接板20中设置有第二连接器和N个控制按键21。可以看出,第i控制按键21与第i插槽对应。各个控制按键21可以均设置为默认状态是弹起状态的控制按键21,当第i控制按键21被用户按下之后,即第i控制按键21在用户操作下从默认状态切换为非默认状态,此时的热插拔转接板20便可以视为是接收到了第i控制指令。此时,由于第i控制按键21被用户按下,则通过第二连接器会向待测主板10中的第一连接器发送第i电平控制信号,使得控制器12接收到第i电平控制信号,进而控制第i槽位的目标引脚的电平状态,以对第i槽位进行热插拔测试。In this embodiment, a second connector and N control buttons 21 are provided in the hot-swappable adapter board 20. It can be seen that the i-th control button 21 corresponds to the i-th slot. Each control button 21 can be set as a control button 21 in a pop-up state by default. When the i-th control button 21 is pressed by the user, that is, the i-th control button 21 is switched from the default state to the non-default state under the user's operation, the hot-swappable adapter board 20 at this time can be regarded as receiving the i-th control instruction. At this time, since the i-th control button 21 is pressed by the user, the i-th level control signal will be sent to the first connector in the motherboard 10 to be tested through the second connector, so that the controller 12 receives the i-th level control signal, and then controls the level state of the target pin of the i-th slot to perform a hot-swap test on the i-th slot.

在热插拔转接板20进入测试模式之后,控制开关电路11为关断状态也是由第一连接器和第二连接器实现。热插拔转接板20进入测试模式的触发方式也可以有多种,例如只要热插拔转接板20上电并与待测主板10连接,则热插拔转接板20自动进而测试模式,只要未将热插拔转接板20拔出,则热插拔转接板20便会通过第二连接器和第一连接器,控制开关电路11为关断状态。After the hot-swap adapter board 20 enters the test mode, the control of the switch circuit 11 to the off state is also realized by the first connector and the second connector. There can be multiple triggering methods for the hot-swap adapter board 20 to enter the test mode. For example, as long as the hot-swap adapter board 20 is powered on and connected to the motherboard 10 to be tested, the hot-swap adapter board 20 automatically enters the test mode. As long as the hot-swap adapter board 20 is not unplugged, the hot-swap adapter board 20 will control the switch circuit 11 to the off state through the second connector and the first connector.

控制开关电路11为关断状态的方式也有多种,实际应用中,考虑到通过使能端的控制较为方便,因此,开关电路11可以为设置有使能端的开关电路11,热插拔转接板20便可以在进入测试模式之后,通过开关电路11的使能端,控制开关电路11为关断状态。图2中示出的BUF_EN便是开关电路11的使能端。There are also many ways to control the switch circuit 11 to be in the off state. In practical applications, considering that the control through the enable end is more convenient, the switch circuit 11 can be a switch circuit 11 provided with an enable end. The hot-swap adapter board 20 can control the switch circuit 11 to be in the off state through the enable end of the switch circuit 11 after entering the test mode. BUF_EN shown in FIG. 2 is the enable end of the switch circuit 11.

如上文的描述,用户可以通过观察接口卡上的指示灯是否为点亮状态,确定相应槽位的热插拔测试是否通过。在本发明的一种具体实施方式中,考虑到部分场合中的槽位或者接口卡可能未设置指示灯,为了使得工作人员能够方便地得知热插拔测试结果,热插拔转接板20中还可以设置有N个信息提示装置;As described above, the user can determine whether the hot-swap test of the corresponding slot has passed by observing whether the indicator light on the interface card is on. In a specific embodiment of the present invention, considering that the slot or interface card in some occasions may not be provided with an indicator light, in order to enable the staff to easily know the hot-swap test result, N information prompt devices can also be provided in the hot-swap adapter board 20;

N个信息提示装置依次与N个控制按键21连接,当第i控制按键21为非默认状态时,与第i控制按键21连接的第i信息提示装置输出提示信息。The N information prompting devices are connected to the N control buttons 21 in sequence. When the i-th control button 21 is in a non-default state, the i-th information prompting device connected to the i-th control button 21 outputs prompting information.

该种实施方式中,在热插拔转接板20中设置有N个信息提示装置,考虑到成本和可靠性,通常可以选取为N个LED指示灯作为N个信息提示装置。这样当用户按下第i控制按键21时,由于第i控制按键21相连接的第i信息提示装置便会亮起,提示用户正在进行第i槽位的热插拔测试。并且,如果第i信息提示装置正常亮起,则可以说明第i电平控制信号被成功发送至待测主板10,可以说明相应线路正常。本申请的图2的实施方式中,N个信息提示装置便选取的是N个LED22。In this embodiment, N information prompting devices are provided in the hot-swap adapter board 20. Considering the cost and reliability, N LED indicator lights can usually be selected as the N information prompting devices. In this way, when the user presses the i-th control button 21, the i-th information prompting device connected to the i-th control button 21 will light up, prompting the user that the hot-swap test of the i-th slot is being performed. In addition, if the i-th information prompting device lights up normally, it can be explained that the i-th level control signal is successfully sent to the motherboard 10 to be tested, which can be explained that the corresponding circuit is normal. In the embodiment of Figure 2 of the present application, the N information prompting devices are selected as N LEDs 22.

在本发明的一种具体实施方式中,热插拔转接板20中还设置有显示装置;In a specific embodiment of the present invention, a display device is also provided in the hot-swap adapter board 20;

显示装置与N个控制按键21均连接,当任意1个或多个控制按键21为非默认状态时,显示出当前为非默认状态的各个控制按键21的编号。The display device is connected to all N control buttons 21 , and when any one or more control buttons 21 are in a non-default state, the numbers of the control buttons 21 currently in the non-default state are displayed.

前述实施方式中,设置的是N个信息提示装置。而在本发明的该种实施方式中,考虑到当N的取值较大时,所需要的信息提示装置的数量就较多,则该种实施方式设置了单个显示装置,该显示装置例如可以为显示屏,这样当任意1个或多个控制按键21为非默认状态时,该显示装置可以显示出当前为非默认状态的各个控制按键21的编号,例如显示的控制按键21的编号为1,3,5,则表示用户当前将第1控制按键21,第3控制按键21以及第5控制按键21按下。In the aforementioned embodiment, N information prompting devices are provided. In this embodiment of the present invention, considering that when the value of N is large, the number of information prompting devices required is large, this embodiment provides a single display device, which can be, for example, a display screen, so that when any one or more control buttons 21 are in a non-default state, the display device can display the numbers of the control buttons 21 that are currently in a non-default state, for example, if the displayed control buttons 21 are numbered 1, 3, 5, it means that the user currently presses the first control button 21, the third control button 21, and the fifth control button 21.

在本发明的一种具体实施方式中,可参阅图3,还可以包括:N个隔离开关23,隔离开关控制器,自检装置;In a specific embodiment of the present invention, referring to FIG. 3 , it may further include: N isolating switches 23 , an isolating switch controller, and a self-test device;

第i隔离开关23设置在第二连接器与第i控制按键21之间;The i-th isolation switch 23 is disposed between the second connector and the i-th control button 21;

自检装置用于:在热插拔转接板20上电之后,检测热插拔转接板20的状态,并在检测通过时,向隔离开关控制器发送自检通过信号;The self-test device is used to detect the state of the hot-swap adapter board 20 after the hot-swap adapter board 20 is powered on, and send a self-test pass signal to the isolation switch controller when the detection passes;

隔离开关控制器用于:在接收到自检通过信号之后,控制N个默认状态为关断状态的隔离开关23均切换为导通状态。The isolating switch controller is used to control N isolating switches 23 that are in the off state by default to switch to the on state after receiving the self-test pass signal.

该种实施方式考虑到,如果直接在热插拔转接板20上电之后,便直接开启热插拔转接板20与待测主板10之间的电连接,可能出现损坏待测主板10的情况,例如热插拔转接板20上电之后出现了短路,进而损坏待测主板10。This implementation takes into account that if the electrical connection between the hot-swap adapter board 20 and the mainboard to be tested 10 is directly opened after the hot-swap adapter board 20 is powered on, the mainboard to be tested 10 may be damaged. For example, a short circuit occurs after the hot-swap adapter board 20 is powered on, thereby damaging the mainboard to be tested 10.

对此,该种实施方式中,通过自检装置检测热插拔转接板20的状态,当然,自检装置具体的检测方式和检测内容可以根据需要进行设定和调整,可以取决于热插拔转接板20的具体电路设计,此处不对此展开说明。In this regard, in this embodiment, the state of the hot-swappable adapter board 20 is detected by a self-test device. Of course, the specific detection method and detection content of the self-test device can be set and adjusted as needed, and may depend on the specific circuit design of the hot-swappable adapter board 20, which will not be elaborated here.

当检测通过时,自检装置向隔离开关控制器发送自检通过信号。隔离开关控制器接收到自检通过信号时,说明热插拔转接板20自检通过,便可以控制N个隔离开关23均切换为导通状态。可以看出,当自检未完成或者自检未通过时,由于N个隔离开关23默认状态均为关断状态,第i隔离开关23设置在第二连接器与第i控制按键21之间,因此可以有效地避免由于热插拔转接板20故障所损坏待测主板10的情况,提高了本申请方案的可靠性。When the test passes, the self-test device sends a self-test pass signal to the isolating switch controller. When the isolating switch controller receives the self-test pass signal, it indicates that the hot-swappable adapter board 20 has passed the self-test, and the N isolating switches 23 can be controlled to switch to the on state. It can be seen that when the self-test is not completed or the self-test fails, since the default states of the N isolating switches 23 are all off, the i-th isolating switch 23 is set between the second connector and the i-th control button 21, so it can effectively avoid the situation where the mainboard 10 to be tested is damaged by the failure of the hot-swappable adapter board 20, thereby improving the reliability of the present application scheme.

隔离开关23的具体类型可以根据需要进行设定和选取,例如在本发明的一种具体实施方式中,N个隔离开关23可以均选取为MOS管,成本较低,体积较小。此外本申请的图3中,并未示出自检装置以及与N个隔离开关23均连接的隔离开关控制器。The specific type of the isolating switch 23 can be set and selected as needed. For example, in a specific embodiment of the present invention, the N isolating switches 23 can all be selected as MOS tubes, which have low cost and small size. In addition, in FIG. 3 of the present application, the self-test device and the isolating switch controller connected to the N isolating switches 23 are not shown.

在本发明的一种具体实施方式中,还可以包括:In a specific embodiment of the present invention, it may also include:

设置在热插拔转接板20与控制器12之间的静电防护装置。An electrostatic protection device is provided between the hot-swap adapter board 20 and the controller 12 .

该种实施方式考虑到,热插拔转接板20需要将相应的电平控制信号发送至控制器12,该过程可能存在静电干扰,因此热插拔转接板20与控制器12之间设置了静电防护装置,以消除静电干扰,进一步地提高本申请方案的可靠性。This implementation takes into account that the hot-swappable adapter board 20 needs to send the corresponding level control signal to the controller 12, and electrostatic interference may exist in this process. Therefore, an electrostatic protection device is provided between the hot-swappable adapter board 20 and the controller 12 to eliminate electrostatic interference and further improve the reliability of the solution of this application.

当然,具体的静电防护装置的类型以及位置可以根据需要进行设定和选取。Of course, the specific type and location of the electrostatic protection device can be set and selected as needed.

例如在本发明的一种具体实施方式中,当待测主板10中设置有用于连接热插拔转接板20的第一连接器时,静电防护装置可以包括多个静电防护单元13,在第一连接器与控制器12之间的各条线路上各设置有1个静电防护单元13。可参阅图3,但需要说明的是,图3仅出了该种实施方式中的1个静电防护单元13。For example, in a specific embodiment of the present invention, when the motherboard to be tested 10 is provided with a first connector for connecting the hot-swap adapter board 20, the electrostatic protection device may include a plurality of electrostatic protection units 13, and one electrostatic protection unit 13 is provided on each line between the first connector and the controller 12. Please refer to FIG3, but it should be noted that FIG3 only shows one electrostatic protection unit 13 in this embodiment.

应用本发明实施例所提供的技术方案。设置了热插拔转接板20以提高工作效率。具体的,在接收到第i控制指令时,热插拔转接板20可以向待测主板10中的控制器12发送第i电平控制信号,而控制器12分别与N个槽位连接,可以在接收到第i电平控制信号时,控制N个槽位中的第i槽位的目标引脚的电平状态,从而进行对于第i槽位的热插拔测试。可以看出,本申请的方案不需要工作人员去插拔接口卡,只需要操作热插拔转接板20,使得热插拔转接板20接收到相应的控制指令,待测主板10中的控制器12便可以控制N个槽位中的相应槽位的目标引脚的电平状态,即模拟了接口卡的插拔操作,实现对于相应槽位的接口卡的热插拔测试。并且本申请考虑到,部分场合中,当槽位上插入接口卡时,如果开关电路11为导通状态,只要接口卡不拔出,则该槽位中的相应引脚会始终被拉低,即控制器12无法按照接收到的电平控制信号的要求,控制该槽位的目标引脚的电平状态,因此,本申请的方案中,热插拔转接板20与待测主板10连接,在进入测试模式之后,会控制开关电路11为关断状态,从而使得各个接口卡中的与插拔相关的引脚不会被固定拉低,即目标引脚不会被固定拉低,保障了本申请的热插拔测试能够有效地执行。The technical solution provided by the embodiment of the present invention is applied. A hot-swappable adapter board 20 is provided to improve work efficiency. Specifically, when receiving the i-th control instruction, the hot-swappable adapter board 20 can send the i-th level control signal to the controller 12 in the mainboard 10 to be tested, and the controller 12 is respectively connected to N slots, and can control the level state of the target pin of the i-th slot among the N slots when receiving the i-th level control signal, thereby performing a hot-swappable test on the i-th slot. It can be seen that the solution of the present application does not require the staff to plug and unplug the interface card, but only needs to operate the hot-swappable adapter board 20 so that the hot-swappable adapter board 20 receives the corresponding control instruction, and the controller 12 in the mainboard 10 to be tested can control the level state of the target pin of the corresponding slot among the N slots, that is, the plug-in and unplug operation of the interface card is simulated, and the hot-swappable test of the interface card in the corresponding slot is realized. Furthermore, the present application takes into account that, in some cases, when an interface card is inserted into a slot, if the switch circuit 11 is in the on state, as long as the interface card is not unplugged, the corresponding pin in the slot will always be pulled low, that is, the controller 12 cannot control the level state of the target pin of the slot according to the requirements of the received level control signal. Therefore, in the scheme of the present application, the hot-swap adapter board 20 is connected to the motherboard 10 to be tested. After entering the test mode, the switch circuit 11 will be controlled to be in the off state, so that the pins related to plugging and unplugging in each interface card will not be fixedly pulled low, that is, the target pin will not be fixedly pulled low, thereby ensuring that the hot-swap test of the present application can be effectively executed.

综上所述,本申请的方案中,工作人员无需依次插拔各个接口卡来进行热插拔功能的测试,而是只需要操作热插拔转接板20,便可以方便、高效地进行各个接口卡的热插拔功能的测试,提高了测试效率,也可以避免出现由于多次插拔导致的接口损坏情况。To sum up, in the scheme of the present application, the staff does not need to plug and unplug each interface card in turn to test the hot-plug function. Instead, they only need to operate the hot-plug adapter board 20 to conveniently and efficiently test the hot-plug function of each interface card, thereby improving the test efficiency and avoiding interface damage caused by multiple plugging and unplugging.

相应于上面的热插拔测试装置的实施例,本发明实施例还提供了一种存储测试设备,可与上文相互对应参照,该存储测试设备可以包括如上述任一实施例中的热插拔测试装置,此处不再展开说明。Corresponding to the above embodiments of the hot-swap test device, an embodiment of the present invention further provides a storage test device, which can be referred to in correspondence with the above. The storage test device may include a hot-swap test device as in any of the above embodiments, which will not be described in detail here.

还需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

专业人员还可以进一步意识到,结合本文中所公开的实施例描述的各示例的单元及算法步骤,能够以电子硬件、计算机软件或者二者的结合来实现,为了清楚地说明硬件和软件的可互换性,在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行,取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能,但是这种实现不应认为超出本发明的范围。Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的技术方案及其核心思想。应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以对本发明进行若干改进和修饰,这些改进和修饰也落入本发明的保护范围内。The principles and implementation methods of the present invention are described in this article using specific examples. The description of the above embodiments is only used to help understand the technical solution and core ideas of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims (9)

1. A hot plug testing apparatus, comprising: the hot plug adapter plate and the main board to be tested are provided with N slots, a switch circuit and a controller;
the N slots are used for sequentially connecting N interface cards;
the hot-plug adapter plate is connected with the main board to be tested and is used for controlling the switch circuit to be in an off state after entering a test mode, and sending an ith level control signal to the controller when receiving an ith control instruction; n and i are positive integers, and i is more than or equal to 1 and less than or equal to N;
The switch circuit is respectively connected with the N slots and the controller and is used for: the controller is in a conducting state when in a default state, so that the controller is connected with each slot through the switch circuit;
the controller is connected with the N slots respectively and is used for: when the ith level control signal is received, controlling the level state of a target pin of an ith slot in N slots so as to perform a hot plug test on the ith slot;
the main board to be tested is provided with a first connector which is respectively connected with the controller and the switch circuit; the hot-plug adapter plate is internally provided with a second connector and N control keys;
the second connector is connected with the first connector for: after the hot plug adapter plate enters a test mode, the switch circuit is controlled to be in an off state through the first connector; when an ith level control signal is received, the ith level control signal is sent to the controller through the first connector;
The N control keys are used for: when the ith control button is switched from a default state to a non-default state under the operation of a user, the ith control button confirms that the ith control instruction is received, and sends an ith level control signal to the second connector.
2. The hot plug testing device according to claim 1, wherein N information prompting devices are further provided in the hot plug adapter plate;
The N information prompting devices are sequentially connected with the N control keys, and when the ith control key is in a non-default state, the ith information prompting device connected with the ith control key outputs prompting information.
3. The hot plug testing device according to claim 1, wherein a display device is further provided in the hot plug adapter plate;
the display device is connected with the N control keys, and when any 1 or more control keys are in a non-default state, the numbers of the control keys in the non-default state are displayed.
4. The hot plug testing apparatus of claim 1, further comprising: n isolating switches, an isolating switch controller and a self-checking device;
the ith isolating switch is arranged between the second connector and the ith control key;
the self-checking device is used for: after the hot plug adapter plate is electrified, detecting the state of the hot plug adapter plate, and sending a self-checking passing signal to the isolating switch controller when the detection passes;
The isolating switch controller is used for: and after receiving the self-checking passing signal, controlling the isolating switches with N default states as off states to be switched into on states.
5. The hot plug testing device of claim 4, wherein the N isolation switches are MOS transistors.
6. The hot plug testing device according to claim 1, wherein the switch circuit is a switch circuit provided with an enabling terminal, and the hot plug adapter plate is specifically configured to: after entering a test mode, the switch circuit is controlled to be in an off state through an enabling end of the switch circuit.
7. The hot plug testing apparatus according to any one of claims 1 to 6, further comprising:
And the electrostatic protection device is arranged between the hot plug adapter plate and the controller.
8. The device according to claim 7, wherein when a first connector for connecting the hot plug adapter board is provided in the motherboard to be tested, the electrostatic protection device includes a plurality of electrostatic protection units, and 1 electrostatic protection unit is provided on each line between the first connector and the controller.
9. Storage test apparatus comprising a hot plug test device according to any one of claims 1 to 8.
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