CN115124171A - Treatment method and treatment system for gold-containing waste liquid - Google Patents

Abstract

The invention provides a treatment method and a treatment system of gold-containing waste liquid, wherein the treatment method comprises the following steps: carrying out electrolysis treatment on the first gold-containing waste liquid to obtain metallic gold and electrolysis raffinate; performing adsorption treatment on the electrolysis residual liquid and the second gold-containing waste liquid by using resin to obtain gold-loaded resin and adsorption residual liquid; the gold content in the first gold-containing waste liquid is greater than the gold content in the second gold-containing waste liquid. The treatment method can realize the high-efficiency recovery of gold, does not generate secondary wastewater, and is beneficial to industrial production and application.

Description

Treatment method and treatment system for gold-containing waste liquid

technical field

The invention relates to the technical field of wastewater treatment, in particular to a treatment method and treatment system for gold-containing waste liquid.

Background technique

With the rising gold price in the market, the cost of gold plating has become the focus of attention. In the gold plating process of the circuit board, the circuit board to be gold-plated is first plated with gold, and then the gold-plated circuit board is washed with water. The gold plating residue contains a large amount of unreacted gold salt, and the washing residue contains a small amount of gold salt. Directly discharging the gold-plating residual liquid and the water-washing residual liquid into the environment will not only cause environmental pollution, but also increase the manufacturing cost.

Therefore, how to effectively treat and recover the gold-containing waste liquid produced in the gold plating process of the circuit board is a technical problem to be solved urgently in the art.

SUMMARY OF THE INVENTION

The invention provides a processing method and a processing system for the gold-containing waste liquid, which can effectively treat and recover the gold-containing waste liquid.

In one aspect of the present invention, a method for treating gold-containing waste liquid is provided, comprising the following steps: electrolyzing the first gold-containing waste liquid to obtain metallic gold and electrolytic residual liquid; The gold waste liquids are respectively subjected to adsorption treatment to obtain a gold-loaded resin and an adsorption residual liquid; the gold content in the first gold-containing waste liquid is greater than that in the second gold-containing waste liquid.

According to an embodiment of the present invention, the conditions of the electrolysis treatment are as follows: the voltage is 2.5-5V, the current is 2.5-5V, and the temperature is 50-80°C.

According to an embodiment of the present invention, the resin includes epoxy resin.

According to an embodiment of the present invention, before the electrolytic treatment of the first gold-containing waste liquid, the method further includes: filtering the first gold-containing waste liquid; : Filter the second gold-containing waste liquid.

According to an embodiment of the present invention, the first gold-containing waste liquid is a gold-plating waste liquid obtained after gold-plating the circuit board to be gold-plated; the second gold-containing waste liquid is obtained by washing the gold-plated circuit board with water.

According to an embodiment of the present invention, the water washing treatment includes the following steps: performing primary water washing treatment on the gold-plated circuit board to obtain the second gold-containing waste liquid and the circuit board after primary water washing, and using the cleaning solution to wash the circuit board after primary water washing The circuit board is subjected to secondary water washing treatment to obtain secondary drainage and a circuit board after secondary water washing; the secondary drainage is used to perform primary water washing treatment on the gold-plated circuit board.

Another aspect of the present invention provides a treatment system for gold-containing waste liquid for implementing the above-mentioned treatment method for gold-containing waste liquid, comprising: an electrolysis device and a resin adsorption device, a liquid phase outlet of the electrolysis device and a resin adsorption device The entrance is connected.

According to an embodiment of the present invention, it further includes a water washing device, the water washing device includes a primary water washing tank and a secondary water washing tank, the secondary water washing tank is provided with a secondary water outlet, and in the direction of gravity, the secondary water outlet is higher than The primary water inlet of the primary water washing tank; the primary water washing tank is provided with a primary water outlet, and the primary water outlet is communicated with the resin absorption device.

According to an embodiment of the present invention, a liquid storage device is further included, and the liquid storage device is used for accommodating the second gold-containing waste liquid; the inlet of the liquid storage device is connected to the outlet of the primary water outlet, and the outlet of the liquid storage device is connected to the resin Absorber.

According to an embodiment of the present invention, it further includes a first filter device and a second filter device; the liquid outlet of the first filter device is connected to the inlet of the electrolysis device; the inlet of the second filter device is connected to the outlet of the liquid storage tank, and the second filter device The liquid outlet of the filtering device communicates with the inlet of the resin adsorption tank.

The implementation of the present invention has at least the following beneficial effects:

The method for treating the gold-containing waste liquid provided by the present invention distinguishes the gold-containing waste liquid to be treated according to the gold content, and adopts a more appropriate method for treatment, so that the gold in the gold-containing waste liquid can be efficiently recovered. Specifically, if the gold content of the first gold-containing waste liquid is greater than the gold content of the second gold-containing waste liquid, the first gold-containing waste liquid is electrolytically treated to reduce the gold content in the first gold-containing waste liquid, and then a resin The electrolysis residual liquid and the second gold-containing waste liquid are respectively subjected to adsorption treatment to further recover metallic gold and reduce the gold content in the electrolysis residual liquid and the second gold-containing waste liquid. The treatment method can realize the efficient recovery of gold in the first gold-containing waste liquid and the second gold-containing waste liquid, without generating secondary waste water and greatly reducing the treatment cost; in addition, the treatment method also has the advantages of simple treatment process, It has the advantages of easy operation, etc., which is beneficial to industrial production and application.

The gold-containing waste liquid treatment system provided by the present invention, which uses an electrolysis device and a resin adsorption device in combination, can be used to treat the first gold-containing waste liquid generated in the gold-plating process and the second gold-containing waste liquid generated by water washing. The system has simple structure and strong practicability.

Description of drawings

Fig. 1 is the flow chart of the processing method of gold-containing waste liquid in one embodiment of the present invention;

Fig. 2 is the flow chart of the treatment method of gold-containing waste liquid in one embodiment of the present invention;

3 is a schematic diagram of a treatment system for gold-containing waste liquid in an embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are part of the implementation of the present invention. examples, but not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that terms such as "first" and "second" are only used for descriptive purposes, such as distinguishing different waste liquids, so as to describe/explain the technical solution more clearly, and should not be understood as indicating or implying the indicated technical features Quantity or substantive order, etc. In addition, in the description of the present invention, unless otherwise expressly specified and limited, the terms "arranged", "connected", "connected", "connected with" and the like should be understood in a broad sense, for example, the communication may be direct communication, or It can be indirectly connected through an intermediary. For those of ordinary skill in the art, the above-mentioned specific meanings in the present invention can be understood in specific situations.

As shown in Figure 1, the present invention provides a kind of treatment method of gold-containing waste liquid, comprising the following steps: carry out electrolytic treatment to the first gold-containing waste liquid, obtain metallic gold and electrolysis residual liquid; The two gold-containing waste liquids are respectively subjected to adsorption treatment to obtain a gold-loaded resin and an adsorption residual liquid; the gold content in the first gold-containing waste liquid is greater than that in the second gold-containing waste liquid.

The method for treating gold-containing waste liquid provided by the invention can not only reduce the gold content in the gold-containing waste liquid, but also realize the recovery of gold in the gold-containing waste liquid.

In the present invention, the gold-containing waste liquid includes the first gold-containing waste liquid and the second gold-containing waste liquid. The gold content in the first gold-containing waste liquid is relatively high, and the metal gold can be recovered by electrolytic treatment. The content of gold in the gold-containing wastewater is greatly reduced, and resin can be used to adsorb the residual liquid of electrolysis. The content of gold in the second gold-containing waste liquid is relatively low, and it is suitable to adopt resin adsorption to recover gold.

In some embodiments, the first gold-containing waste liquid is a gold-plating waste liquid obtained after the circuit board to be gold-plated is subjected to gold-plating treatment, wherein the gold content ranges from 0.4 g/L to 1.2 g/L.

Further, the first gold-containing waste liquid may also be the gold-containing waste liquid generated in the process of gold immersion and chemical gold treatment on the surface of the circuit board.

In some embodiments, the second gold-containing waste liquid is obtained by washing the gold-plated circuit board with water, that is, the second gold-containing waste liquid comes from the waste liquid generated by water washing, and the gold content ranges from 2ppm to 5ppm.

As shown in FIG. 2 , in some embodiments, before the electrolytic treatment of the first gold-containing waste liquid, the method further includes filtering the first gold-containing waste liquid to remove solid impurities, Sediment, etc., to prevent it from affecting the effect of electrolytic treatment.

Usually, the above-mentioned electrolysis treatment is carried out in an electrolysis device, and the electrolysis device at least includes an electrolytic cell, a cathode plate, and an anode plate.

In the above-mentioned electrolytic treatment, the first gold-containing waste liquid is introduced into an electrolytic cell and energized for electrolytic treatment, and the voltage and current of the electrolytic treatment are controlled. During the electrolysis process, the gold ions in the first gold-containing waste liquid are reduced. The surface of the cathode plate is precipitated in the form of deposits, and then the deposits deposited on the cathode plate are scraped off, and the deposits are purified, cleaned and dried to obtain metallic gold. After the electrolysis treatment, the remaining solution in the electrolysis tank is the electrolysis residual solution.

In the above embodiment, a stable voltage is usually used to electrolyze the first gold-containing waste liquid, so as to avoid voltage fluctuation and reduce the current fluctuation range. The voltage of the electrolytic treatment is 2.5V-5V, for example, a range composed of 2.5V, 3V, 3.5V, 4V, 4.5V, 5V or any two thereof. If the voltage of the electrolysis treatment is low, the rate of electrolysis is slow, and it is difficult for gold to deposit on the surface of the cathode; It falls off from the surface of the cathode plate, which affects the effect of electrolytic treatment.

In some embodiments, the current of the electrolytic treatment is 2.5A-5A, such as a range of 2.5A, 3A, 3.5A, 4A, 4.5A, 5A, or any two thereof. If the current of the electrolysis treatment is small, the electron flow is small, and the probability of electron transfer is reduced, which is not conducive to the precipitation of gold; if the current is large, the electrode plate is easy to heat up, which affects the normal operation of the electrolysis device.

In order to carry out the electrolytic treatment process normally, it is necessary to maintain the temperature of the first gold-containing waste liquid passed into the electrolytic cell unchanged. In some embodiments, the temperature of the electrolytic treatment is 50°C-80°C, eg, a range of 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, 80°C, or any two thereof. If the temperature is low, the electrolysis rate will be slow, the energy consumption will be increased, and the electrolysis efficiency will be affected; if the temperature is high, the evaporation of the solution in the first gold-containing waste liquid will be increased, and the crystallization of the deposit will be coarser.

In the specific implementation, firstly preheat the electrolytic cell, and set parameters such as the temperature of the electrolytic cell; preheat the first gold-containing waste liquid, and pass the preheated first gold-containing waste water into the electrolytic cell to make the anode The first gold-containing waste liquid between the plate and the cathode plate flows; when the first gold-containing waste liquid is filled between the anode plate and the cathode plate in the electrolytic cell, the anode plate and the cathode plate are energized, and the anode plate and the cathode plate are set. The voltage across the plate is used to electrolyze the first gold-containing waste liquid.

In the above-mentioned specific implementation process, electrolysis is carried out when the first gold-containing waste liquid is filled between the anode plate and the cathode plate in the electrolytic cell, which is beneficial to the uniform electrolysis of the first gold-containing waste liquid between the electrode plates, and is conducive to improving gold The recovery rate is high, and it is beneficial to the large-scale treatment of the first gold-containing waste liquid.

In the above specific implementation process, when the surface of the cathode material on the cathode plate is full of deposits, the cathode plate is taken out from the electrolytic cell, replaced with a new cathode material, and then inserted into the electrolytic cell; when the anode plate is When the anode material is consumed, the anode plate is directly taken out from the electrolytic cell, the anode material is removed, the new anode material is replaced, and then inserted into the electrolytic cell.

In some embodiments, resin is used to perform adsorption treatment on the electrolysis residual liquid and the second gold-containing waste liquid, so as to further reduce the gold content in the electrolytic residual liquid and the second gold-containing waste liquid. In the adsorption treatment, the residual gold in the electrolysis residual liquid and the second gold-containing waste liquid is adsorbed on the resin to obtain a gold-loaded resin and an adsorption residual liquid. The gold content in the adsorption residual liquid is greatly reduced, and it can be directly discharged into the environment without causing secondary pollution to the environment.

As shown in Figure 2, in the above-mentioned embodiment, before adopting resin to carry out adsorption treatment to the second gold-containing waste liquid, it also includes: filtering the second gold-containing waste liquid to remove solid impurities, sediment, etc., Preventing clogging of the resin affects the performance of the resin to selectively adsorb gold.

In the above embodiment, the electrolysis residual liquid and the second gold-containing waste liquid are fully contacted with the resin, so that the residual gold is adsorbed on the resin, and the adsorption treatment is carried out under normal temperature conditions.

In the specific implementation process of the present invention, the electrolysis residual liquid and the second gold-containing waste liquid are made to flow through the resin, so that the liquid and the resin are fully contacted. The waste liquid is respectively flowed to the adsorption column for adsorption treatment, wherein the flow rate of the liquid is 1000L/h-1500L/h.

In the above embodiment, when the resin is saturated with gold adsorption, the gold-loaded resin can be removed from the adsorption column and replaced with a new resin for adsorption.

In the present invention, the selected resin has high selectivity to gold, can eliminate the interference of other metals such as copper and nickel on the resin selectivity, and improve the adsorption rate of gold. In some embodiments, the resin includes epoxy resin. The resin of the present invention may be commercially available or obtained by conventional methods. The saturated adsorption capacity of the resin is not limited herein.

In the above embodiment, after the adsorption treatment is completed, the desorption and regeneration of the gold-loaded resin are also included, and the gold-loaded resin is desorbed and regenerated by conventional methods in the field such as incineration, pickling, etc. Gold is withdrawn. Exemplarily, the gold-loaded resin is fully contacted with the desorption liquid, so that the gold adsorbed on the resin is dissolved in the desorption liquid in the form of ions, and after the desorption is completed, the desorbed gold-loaded resin is washed with clean water to obtain recycled resin.

In the present invention, the second gold-containing waste liquid comes from the waste liquid generated after washing the circuit board, and the water washing treatment includes the following steps: performing a primary water washing treatment on the gold-plated circuit board to obtain the second gold-containing waste liquid and a The circuit board after the first-level water washing is used to perform the second-level water washing treatment on the circuit board after the first-level water washing, so as to obtain the second-level drainage and the circuit board after the second-level water washing; the second-level drainage is used to perform the first-level water washing treatment on the gold-plated circuit board. .

In the present invention, the secondary drainage produced by the secondary water washing treatment is used in the primary water washing treatment, and the secondary drainage is recycled. By adopting this water washing method, not only the residual gold on the surface of the circuit board is washed off, but also a small amount of water can be used for washing. To achieve the cleaning effect, in order to achieve the purpose of saving water.

In the above embodiment, the cleaning solution may be a conventional circuit board cleaning solution in the art.

In the present invention, the combined application of the above-mentioned water washing treatment of circuit boards and the treatment method of gold-containing wastewater is beneficial to improve the recovery rate of gold, and is conducive to large-scale treatment of the first gold-containing waste liquid and the second gold-containing waste liquid .

The invention provides a treatment system for gold-containing waste liquid, which is used for implementing the above-mentioned treatment method for gold-containing waste liquid. The device includes an electrolysis device and a resin adsorption device.

Wherein, the inlet of the electrolysis device may be directly communicated with the waste liquid tank of the gold plating process, or may be communicated with the collection tank of the first gold-containing waste liquid.

In the present invention, the electrolysis device includes a power source, an electrolytic cell, a cathode plate, and an anode plate. The cathode plate and the anode plate are both arranged in the electrolytic cell, the anode plate is connected to the positive electrode of the power source, and the cathode plate is connected to the negative electrode of the power source.

In the present invention, the resin adsorption device includes an adsorption tank and a resin filled in the adsorption tank, wherein the resin is detachably filled in the adsorption tank, and the adsorption tank may be an adsorption column.

In some embodiments, a gold recovery water washing device and a gold tank are also included, wherein the gold recovery water washing device is used for cleaning the deposited gold produced after electrolytic treatment, the gold tank is used for collecting the recovered gold, and the inlet of the gold recovery water washing device is communicated with At the solid outlet of the electrolysis device, the gold tank is communicated with the gold recovery water washing device.

In the above embodiment, the collecting tank of the first gold-containing waste liquid is used to collect the first gold-containing waste liquid. The collection tank of the first gold-containing waste liquid is communicated with the inlet of the electrolysis device, and the first gold-containing waste liquid in the collection tank can be passed into the electrolysis tank of the electrolysis device through the inlet of the electrolysis device.

In some embodiments, the resin adsorption device is used for adsorption treatment of the electrolysis residual liquid, and the inlet of the resin adsorption device is communicated with the liquid outlet of the electrolysis device.

In the specific implementation process of the present invention, the electrolysis residual liquid is discharged from the liquid outlet of the electrolysis device, so that the electrolytic residual liquid flows through the liquid outlet to the resin adsorption device for adsorption treatment.

In the above-described embodiments, the communication of the present invention may be ducted.

In the above-mentioned embodiment, a first filter device is also included, and before the first filter device is installed in the electrolysis device, it is used to filter out impurities such as solid particles in the first gold-containing waste liquid. In some embodiments, the inlet of the first filtering device is communicated with the collection tank of the first gold-containing waste liquid, and the liquid outlet of the first filtering device is communicated with the inlet of the electrolysis device.

In some embodiments, a water washing device is also included, and the water washing device includes a primary water washing tank and a secondary water washing tank, and the primary water washing tank and the secondary water washing tank are arranged in sequence.

In the above embodiment, the water washing device is used to wash the gold-plated circuit board with water to obtain the washed circuit board and the second gold-containing waste liquid.

In some embodiments, a primary water inlet and a primary water outlet are provided on the side wall of the primary water washing tank, and a secondary water inlet and a secondary water outlet are provided on the side wall of the secondary water washing tank; The primary water outlet is communicated with the resin absorption device.

In the above embodiment, the height of the secondary water outlet is not higher than the height of the secondary water inlet, and the height of the primary water outlet is not higher than the height of the primary water inlet.

In the above embodiment, the height of the secondary water outlet is higher than the height of the primary water inlet, and the secondary water outlet and the primary water inlet are communicated with each other through pipes.

In the present invention, the inlet of the water washing device is the secondary water inlet of the secondary water washing tank, and the outlet of the water washing device is the primary water outlet of the primary water washing tank.

In some embodiments, the flow direction of the cleaning liquid is as follows: entering from the secondary water inlet of the secondary washing tank, flowing through the secondary washing tank and the primary washing tank in sequence, and finally discharging from the primary drainage port of the primary washing tank.

In the specific implementation process of the present invention, the cleaning liquid first flows into the secondary washing tank from the secondary water inlet, and when the water level in the secondary washing tank exceeds the height of the secondary water outlet, the cleaning liquid overflows from the secondary washing tank To the first-level washing tank, when the water level in the first-level washing tank exceeds the height of the first-level drain outlet, it will be discharged from the first-level washing tank.

In the present invention, when cleaning the circuit board, the entering sequence of the circuit board after gold plating is opposite to the flow direction of the cleaning solution. The gold-plated circuit board flows through the first-level washing tank and the second-level washing tank in sequence, that is, the circuit board is first washed (cleaned) in the first-level washing tank, and then moved to the second-level washing tank for cleaning after cleaning.

In the above embodiment, the circuit board enters from the primary discharge port of the primary washing tank, passes through the primary washing tank and the secondary washing tank in sequence, and finally discharges from the secondary water inlet of the secondary washing tank.

In the above embodiment, when using the water washing device to wash the circuit board, the cleaning solution can be made to flow through the secondary water washing tank and the primary water washing tank in sequence, and then the circuit board enters the water washing device for cleaning. After cleaning, The liquid discharged from the primary water outlet is the second gold-containing waste liquid.

In the above embodiment, in the process of the cleaning liquid flowing from the secondary washing tank to the primary washing tank, the cleaning liquid is gradually turbid. Therefore, when the circuit board enters in the opposite direction to the cleaning liquid, the circuit board is washed by the primary water. When the tank enters, you can use the turbid cleaning solution to clean the dirty circuit board first. As the circuit board enters the secondary washing tank for cleaning, the circuit board becomes cleaner and the cleaning solution is cleaner The cleaning effect is also better and the cleaning fluid can be saved.

In the present invention, the circuit board is cleaned by setting two water washing tanks, and the overflow water washing is used to clean the circuit board, which not only has a good cleaning effect, but also saves a large amount of cleaning liquid, reduces the production cost, and is conducive to energy saving and emission reduction.

In some embodiments, a liquid storage device is further included, the liquid storage device is used to temporarily accommodate the second gold-containing waste liquid, and when the amount of the second gold-containing waste liquid in the liquid storage device meets a certain volume, the second gold-containing waste liquid is The waste liquid flows to the resin adsorption device.

In the above embodiment, the inlet of the liquid storage device is communicated with the outlet of the water washing device, and the outlet of the liquid storage device is communicated with the resin absorption device.

In the specific implementation process of the present invention, the second gold-containing waste liquid generated in the water washing device flows into the liquid storage device, and then the second gold-containing waste liquid is transported from the outlet of the liquid storage device to the resin absorption device for adsorption treatment. .

In some embodiments, the resin adsorption device is used for adsorption treatment of the second gold-containing waste liquid, the resin adsorption device is provided with an adsorption resin, and the inlet of the resin adsorption device is communicated with the outlet of the liquid storage device.

In the specific implementation process of the present invention, the second gold-containing waste liquid is discharged from the outlet of the liquid storage device and flows into the resin adsorption device for adsorption treatment. The gold in the second gold-containing waste liquid is adsorbed on the resin to form a gold-loaded resin, and the adsorption residual liquid can be directly discharged from the outlet of the resin adsorption device.

In the above embodiment, when the adsorption capacity of the gold-loaded resin reaches the saturated adsorption capacity of the resin, the gold-loaded resin in the resin adsorption device needs to be disassembled, replaced with a new resin, and then desorbed and removed from the gold-loaded resin. regeneration.

In some embodiments, the above-mentioned treatment system further includes a second filtering device for filtering the second gold-containing waste liquid, so as to remove solid impurities, sediment, etc. in the second gold-containing waste liquid, and prevent them from entering into resin adsorption The resin is blocked in the device, which affects the performance of the resin to adsorb gold.

In the above embodiment, the inlet of the second filter device is communicated with the outlet of the liquid storage tank, and the liquid outlet of the second filter device is communicated with the inlet of the resin adsorption tank.

In the present invention, the collection tank of the first gold-containing waste liquid continuously feeds the first gold-containing waste liquid into the electrolysis device, the electrolysis device continuously electrolyzes the first gold-containing waste liquid, and the water washing device continuously The circuit board is washed with water, and the above-mentioned uninterrupted operation processing system can be combined with the circuit board manufacturing production line to realize large-scale popularization and application.

The gold-containing waste liquid treatment system provided by the invention has a simple structure, is convenient and quick to use, and can be used to treat the gold-containing waste liquid, recover the gold in the gold-containing waste liquid, and at the same time further reduce the gold content in the gold-containing waste liquid. The system can be used in conjunction with the surface gold plating, immersion gold and chemical gold processing production lines of circuit boards.

In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are part of the implementation of the present invention. examples, but not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Example 1

The treatment system of the gold-containing waste liquid of the present embodiment is shown in Figure 3, including:

The first gold-containing waste liquid collection tank 1 is used to collect the first gold-containing waste water;

The water washing device 2 includes a first-level washing tank 3 and a second-level washing tank 4 arranged in sequence; it is used for washing the circuit board;

The liquid storage device 5 is used for accommodating the second gold-containing waste liquid generated after the water washing treatment; the inlet of the liquid storage device 5 is connected to the outlet of the water washing device 2;

The first filter device 6 is used to remove solid impurities, sediment, etc. in the first gold-containing waste liquid; the inlet of the first filter device 6 is connected to the first gold-containing waste liquid collection tank 1;

The second filter device 7 is used to remove solid impurities, sediment, etc. in the second gold-containing waste liquid; the inlet of the second filter device 7 is connected to the outlet of the liquid storage device 5;

The electrolysis device 8 is used for electrolyzing the filtered first gold-containing waste liquid; the inlet of the electrolysis device 8 is communicated with the liquid outlet of the first filter device 6;

The resin adsorption device 9 is used to carry out adsorption treatment to the electrolysis residual liquid and the filtered second gold-containing waste liquid; the inlet of the resin adsorption device 9 is respectively connected to the liquid outlet of the electrolysis device 8 and the liquid outlet of the second filter device 7;

The gold recovery water washing device 10 is used to clean the deposited gold deposited on the cathode by electrolytic treatment;

The gold vat 11 is used to collect the cleaned gold.

The processing method of the gold-containing waste liquid of the present embodiment is carried out in the above-mentioned processing system, including:

The first gold-containing waste liquid in the first gold-containing waste liquid collection tank (the gold concentration is 0.4g/L-1.2g/L, and the control median value is 0.8g/L) is passed into the first filter device, and filtered. Then, flow to the electrolysis device for electrolysis treatment, and control the temperature in the electrolysis treatment to be 50° C., the voltage to be 2-3V, and the current to be 3-5A; after the electrolysis treatment, the average gold concentration in the electrolysis residual liquid was measured to be 0.0166g/ L;

Then the electrolytic residual liquid is discharged through the liquid outlet of the electrolysis device, and flows to the resin absorption device for adsorption treatment; the flow rate of the fluid for the adsorption treatment is controlled to be 1000L/h-1500L/h,

The cleaning liquid enters from the secondary water inlet and flows through the secondary washing tank and the primary washing tank in turn; the circuit board is transported to the washing device for washing, and flows through the primary washing tank and the secondary washing tank in turn. The second gold-containing waste liquid is discharged from the first-level drainage port, and flows to the liquid storage device and the second filtering device. After filtering, it flows to the resin absorption device for adsorption treatment; the flow rate of the fluid for adsorption treatment is controlled to be 1000L/h-1500L /h, after measurement, the average gold-containing concentration of the second gold-containing waste liquid in the liquid storage device is 0.004368g/L;

The gold concentration in the adsorption residual liquid measured at the outlet of the resin adsorption device is 0.00001g/L, which can be directly discharged into the environment.

The gold-containing waste liquid treatment method and treatment system provided by the invention can thoroughly recover the residual gold ions in the first gold-containing waste liquid and the second gold-containing waste liquid, and at the same time further reduce the gold content in the gold-containing waste liquid, The treated liquid is discharged into the environment without causing secondary pollution.

The preferred embodiments of the present invention and the experimental verification are described in detail above. It should be understood that many modifications and changes can be made according to the concept of the present invention by those skilled in the art without creative efforts. Therefore, all technical solutions that can be obtained by those skilled in the art through logical analysis, reasoning or limited experiments on the basis of the prior art according to the concept of the present invention shall fall within the protection scope determined by the claims.

Claims (10)

1. a processing method of gold-containing waste liquid, is characterized in that, comprises the following steps: the first gold-containing waste liquid is carried out electrolytic treatment, obtains metallic gold and electrolysis residual liquid; The electrolysis residual liquid and the second gold-containing waste liquid are respectively subjected to adsorption treatment with resin to obtain gold-loaded resin and adsorption residual liquid; The gold content in the first gold-containing waste liquid is greater than the gold content in the second gold-containing waste liquid. 2 . The treatment method according to claim 1 , wherein the electrolytic treatment conditions are as follows: the voltage is 2.5-5V, the current is 2.5-5V, and the temperature is 50-80° C. 3 . 3. The processing method of claim 1, wherein the resin comprises an epoxy resin. 4. The processing method according to claim 1, characterized in that, before the first gold-containing waste liquid is electrolyzed, further comprising, filtering the first gold-containing waste liquid; Before performing adsorption treatment on the second gold-containing waste liquid with resin, the method further includes: filtering the second gold-containing waste liquid. 5. The processing method according to claim 1, wherein the first gold-containing waste liquid is the gold-plated waste liquid obtained after the circuit board to be plated with gold is subjected to gold-plating treatment; The second gold-containing waste liquid is obtained by washing the gold-plated circuit board with water. 6. processing method according to claim 5, is characterized in that, described washing treatment comprises the following steps: The circuit board after the gold-plating treatment is subjected to a primary water washing treatment to obtain the second gold-containing waste liquid and a circuit board after the primary water washing, and the circuit board after the primary water washing is subjected to a secondary water washing treatment with a cleaning solution to obtain a secondary drainage and circuit boards after secondary washing; The first-level water washing treatment is performed on the gold-plated circuit board by using the second-level drainage. 7. A processing system for gold-containing waste liquid, characterized in that, for implementing the processing method of the gold-containing waste liquid according to any one of claims 1-6, comprising: An electrolysis device and a resin adsorption device, wherein the liquid phase outlet of the electrolysis device is communicated with the inlet of the resin adsorption device. 8 . The treatment system according to claim 7 , further comprising a water washing device, wherein the water washing device comprises a primary water washing tank and a secondary water washing tank, and the secondary water washing tank is provided with a secondary water outlet, and the In the direction of gravity, the secondary water outlet is higher than the primary water inlet of the primary washing tank; The primary water washing tank is provided with a primary water outlet, and the primary water outlet is communicated with the resin absorption device. 9 . The processing system according to claim 8 , further comprising a liquid storage device, wherein the liquid storage device is used for accommodating the second gold-containing waste liquid; 9 . The inlet of the liquid storage device is communicated with the outlet of the primary water outlet, and the outlet of the liquid storage device is communicated with the resin absorption device. 10. The processing system of claim 9, further comprising a first filtering device and a second filtering device; The liquid outlet of the first filtering device is communicated with the inlet of the electrolysis device; The inlet of the second filter device is communicated with the outlet of the liquid storage tank, and the liquid outlet of the second filter device is communicated with the inlet of the resin adsorption tank.

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