CN115121970A - Titanium alloy drilling system utilizing infrared picosecond ultrafast laser - Google Patents

Abstract

The invention provides a titanium alloy drilling system using infrared picosecond ultrafast laser, which comprises: a laser light source configured to emit infrared picosecond ultrafast laser light; a first laser mirror configured to reflect laser light emitted from the laser light source; a second laser mirror configured to reflect the laser light reflected by the first laser mirror so that the laser light reflected by the second laser mirror is parallel to the incident laser light of the first laser mirror; a laser conversion unit configured to change a polarization state, beam circularity, spot size, energy distribution, and divergence angle of the laser light reflected by the second laser mirror; and a multi-axis galvanometer and focus unit configured to: and changing the incidence angle of the laser passing through the laser conversion unit on the titanium alloy diaphragm to be processed, and focusing the laser to perform drilling processing.

Description

Titanium alloy drilling processing system using infrared picosecond ultrafast laser

technical field

The present invention relates to processing using ultrafast laser, in particular, to a titanium alloy drilling processing system using infrared picosecond ultrafast laser.

Background technique

At present, in the processing technology using ultrafast laser, nanosecond laser is generally used to process materials, and nanosecond laser means that the action time of a single pulse of laser is in the nanosecond range. The processing method using nanosecond laser is to use a high-energy laser beam to irradiate the surface of the material after focusing to cause a physical or chemical reaction. In essence, the processing method using nanosecond laser is a thermal processing method, but due to its effect The time is short, usually in the range of several nanoseconds, so the area of the material affected by heat is not very large, so that the processing effect and processing speed can be guaranteed.

In addition, in addition to nanosecond lasers, picosecond lasers also have ultra-short pulse times. The action time of a single pulse of picosecond lasers is in the picosecond range. The processing method using picosecond lasers has less thermal impact on materials, and even can be ignored. Compared with the processing with nanosecond laser, there is no recast material in the whole processing process, the processing process is clean, and the absorption of laser energy is less dependent on the material or wavelength. Therefore, it is more suitable for the field of micro-precision laser processing.

Due to the high strength of titanium alloys, nanosecond laser drilling is generally used for the drilling of titanium alloy diaphragms at present. However, the drilling of titanium alloy diaphragms by nanosecond lasers has the following problems: The diameter of the hole is more than 0.15mm, which cannot meet the requirements of micro-hole processing with the diameter of the hole less than 0.1mm; 2) There is a problem of a relatively large thermal impact on the material, and there is a phenomenon of burning black; 3) The use of nanosecond laser processing will affect the product performance and the presence of processing residues.

SUMMARY OF THE INVENTION

In order to solve the problems existing in the drilling processing of titanium alloys, the present invention provides a titanium alloy drilling processing system using an infrared picosecond ultrafast laser, which includes: a laser light source configured to emit infrared picosecond ultrafast lasers; A laser reflecting mirror configured to reflect the laser light emitted by the laser light source; a second laser reflecting mirror configured to reflect the laser light reflected by the first laser reflecting mirror, so that the second laser light The laser reflected by the mirror is parallel to the incident laser of the first laser mirror; the laser conversion unit is configured to change the polarization state, beam roundness, spot size, energy distribution and Divergence angle; and a multi-axis galvanometer and a focusing unit, which are configured to: change the incident angle of the laser beam passing through the laser conversion unit on the titanium alloy diaphragm to be processed, and focus the laser beam to perform drilling processing.

Optionally, the laser transforming unit includes: a first transforming device configured to change the spot size, beam circularity and polarization state of the laser light reflected by the second laser mirror; and a second transforming device configured In order to change the energy distribution and divergence angle of the laser light output by the first conversion device.

Optionally, the system further includes: a third laser mirror configured to reflect the laser light output by the first conversion device; and a fourth laser mirror configured to reflect the third laser mirror The reflected laser light is reflected so that the laser light reflected by the fourth laser mirror is parallel to the incident laser light of the third laser mirror.

Optionally, the first transforming device includes: a beam expander configured to change the spot size of the laser light reflected by the second laser mirror; and a polarizer configured to change the laser light passing through the beam expander beam circularity and polarization state.

Optionally, the second transforming device includes: a binary optical transforming element configured to change the energy distribution of the laser light reflected by the fourth laser mirror from a Gaussian distribution to a flat-top distribution; and a wave plate configured To change the divergence angle of the laser light passing through the binary optical conversion element.

Optionally, the system further includes: a processing fixture configured to fix the titanium alloy diaphragm to be processed; and a moving guide rail configured to enable the processing fixture to move.

Optionally, the power of the laser light emitted by the laser light source is 100W.

The titanium alloy drilling processing system utilizing the infrared picosecond ultrafast laser of the invention can meet the processing requirement of the diameter of the hole < 0.1 mm, and has less thermal influence on the material, the processing process is clean, and no processing residues appear.

Description of drawings

1 is a schematic diagram of a titanium alloy drilling processing system using an infrared picosecond ultrafast laser according to an exemplary embodiment of the present invention;

2 is a schematic diagram of a laser light path in a titanium alloy drilling processing system using an infrared picosecond ultrafast laser according to an exemplary embodiment of the present invention; and

3 is an effect diagram of a hole of a titanium alloy membrane processed by a titanium alloy drilling processing system using an infrared picosecond ultrafast laser according to an exemplary embodiment of the present invention.

Detailed ways

It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

Exemplary embodiments of the present invention will be described in detail below with reference to FIGS. 1 to 3 .

The titanium alloy drilling processing system 1 using infrared picosecond ultrafast laser according to the exemplary embodiment of the present invention may include: a laser light source 10 , a first laser mirror 20 , a second laser mirror 30 , a laser conversion unit 40 , and Multi-axis galvanometer and focusing unit 50 .

In this embodiment, the laser light source 10 can emit an infrared picosecond ultrafast laser, and in this embodiment, the power of the infrared picosecond ultrafast laser can be set to 100W.

In this embodiment, a first laser mirror 20 and a second laser mirror 30 can be provided, and the first laser mirror 20 can reflect the laser light emitted by the laser light source 10, and can be set so that the reflected laser and the incident laser are 90° °, that is, the first laser mirror 20 is arranged at an incident angle of 45°, and the first laser mirror 20 can also be arranged at an incident angle of other values according to actual needs. In addition, the second laser reflecting mirror 30 can further reflect the laser light reflected by the first laser reflecting mirror 20 , and the second laser reflecting mirror 30 can be arranged so that the reflected laser light is parallel to the incident laser light of the first reflecting mirror 20 .

The laser transforming unit 40 can change the polarization state, beam roundness, spot size, energy distribution and divergence angle of the laser light reflected by the second laser mirror 30 . In this embodiment, the laser transforming unit 40 may include a first transforming device 41 and a second transforming device 42 . Specifically, the first transforming device 41 can change the spot size of the laser light through the beam expander 411 and change the spot size of the laser through the polarizer 412 Beam circularity and polarization state of a laser. The second transformation device 42 can change the energy distribution of the laser light output by the first transformation device 41 from Gaussian distribution to flat-top distribution through the binary optical transformation element 421 , and change the divergence angle of the laser light through the wave plate 422 .

Furthermore, in this embodiment, a third laser mirror 60 and a fourth laser mirror 70 may be further provided between the first conversion device 41 and the second conversion device 42 . Specifically, the third laser mirror 60 can reflect the laser light output by the first conversion device 41 (in this embodiment, it can be the laser light passing through the polarizer 412 ). Similar to the above-mentioned first laser mirror 20 , it can be set The third laser mirror 60 is arranged so that the reflected laser light is at 90° to the incident laser light, that is, at an incident angle of 45°. Moreover, the fourth laser reflecting mirror 70 can further reflect the laser light reflected by the third laser reflecting mirror 60. Similar to the second laser reflecting mirror 30, the fourth laser reflecting mirror 70 can be set so that the reflected laser light is the same as the second laser reflecting mirror 30. The incident laser light of the three mirrors 60 is parallel.

As a whole, the direction of the laser light reflected by the fourth laser mirror 70 is the same as the direction of the laser light emitted by the laser light source 10 . In addition, in this embodiment, in order to realize the hardware layout more easily, four laser mirrors are set to change the transmission path of the laser light, but it is not limited to this, and different numbers of laser mirrors can also be set according to actual needs , so as to realize different laser transmission paths.

Further, the multi-axis galvanometer and focusing unit 50 in the system 1 of this embodiment can change the laser beam passing through the laser conversion unit 40 (in this embodiment, the laser beam passing through the wave plate 422 ) in the titanium alloy to be processed. The incident angle of the diaphragm, and the laser is focused for drilling. According to actual needs, by changing the incident angle of the laser, the inner wall of the hole formed after processing can be vertical or inclined at different angles.

In addition, in this embodiment, the titanium alloy drilling processing system 1 using an infrared picosecond ultrafast laser may further include a processing jig 80 and a moving guide rail 90 (not shown). The processing jig 80 can fix the titanium alloy film to be processed, and the moving guide rail 90 can make the processing jig 80 move so as to cooperate with the moving laser to ensure the processing effect.

In the titanium alloy drilling processing system 1 using infrared picosecond ultrafast laser in this embodiment, in order to optimize the overall layout of the hardware of the system 1, the first laser mirror 20, the second laser mirror 30, the third laser mirror The mirror 60 , the fourth laser mirror 70 and the respective optical elements in the laser conversion unit 40 may be integrated into a module, which may be referred to as an optical path adjustment and transmission module in this embodiment.

Likewise, the multi-axis galvanometer and the focusing unit 50 may also be integrated into a module, which may be referred to as a multi-axis galvanometer and focusing module in this embodiment.

In addition, the processing fixture 80 and the motion guide rail 90 may also be integrated into a module, which may be referred to as a processing fixture and a motion platform module in this embodiment.

The titanium alloy drilling processing system using the infrared picosecond ultrafast laser of this embodiment can meet the processing requirements of the diameter of the hole < 0.1 mm, and has less thermal influence on the material, the formed hole has high dimensional accuracy, and will not Processing residues appear.

The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific embodiments. The above-mentioned specific embodiments are only illustrative rather than restrictive. Under the inspiration of the present invention, without departing from the spirit of the present invention and the protection scope of the claims, many forms can also be made, which all belong to the protection scope of the present invention.

Claims (7)

1. A titanium alloy drilling processing system utilizing an infrared picosecond ultrafast laser, comprising: a laser light source configured to emit an infrared picosecond ultrafast laser; a first laser mirror configured to reflect the laser light emitted by the laser light source; a second laser reflecting mirror, configured to reflect the laser light reflected by the first laser reflecting mirror, so that the laser light reflected by the second laser reflecting mirror is parallel to the incident laser light of the first laser reflecting mirror; a laser conversion unit configured to change the polarization state, beam circularity, spot size, energy distribution and divergence angle of the laser light reflected by the second laser mirror; and The multi-axis galvanometer and the focusing unit are configured to: change the incident angle of the laser beam passing through the laser conversion unit on the titanium alloy diaphragm to be processed, and focus the laser beam to perform drilling processing. 2. The titanium alloy drilling processing system using infrared picosecond ultrafast laser according to claim 1, wherein the laser conversion unit comprises: a first transformation device configured to change the spot size, beam circularity and polarization state of the laser light reflected by the second laser mirror; and The second transformation device is configured to change the energy distribution and divergence angle of the laser light output by the first transformation device. 3. The titanium alloy drilling processing system utilizing infrared picosecond ultrafast laser according to claim 2, further comprising: a third laser mirror configured to reflect the laser light output by the first conversion device; and A fourth laser reflection mirror configured to reflect the laser light reflected by the third laser reflection mirror, so that the laser light reflected by the fourth laser reflection mirror is parallel to the incident laser light of the third laser reflection mirror. 4. The titanium alloy drilling processing system using infrared picosecond ultrafast laser according to claim 2, wherein the first transforming device comprises: a beam expander configured to vary the spot size of the laser light reflected by the second laser mirror; and a polarizer configured to change the beam circularity and polarization state of the laser light passing through the beam expander. 5. The titanium alloy drilling processing system using infrared picosecond ultrafast laser according to claim 3, wherein the second transforming device comprises: A binary optical conversion element configured to change the energy distribution of the laser light reflected by the fourth laser mirror from a Gaussian distribution to a flat-top distribution; and a wave plate configured to change the divergence angle of the laser light passing through the binary optical conversion element. 6. The titanium alloy drilling processing system using infrared picosecond ultrafast laser according to claim 1, wherein, it further comprises: a machining fixture configured to hold the titanium alloy diaphragm to be machined; and A motion rail configured to enable movement of the processing fixture. 7 . The titanium alloy drilling processing system using infrared picosecond ultrafast laser according to claim 1 , wherein the power of the laser light emitted by the laser light source is 100W. 8 .

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