CN115121934B - Cutting processing method and system - Google Patents
Cutting processing method and system Download PDFInfo
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- CN115121934B CN115121934B CN202110301727.3A CN202110301727A CN115121934B CN 115121934 B CN115121934 B CN 115121934B CN 202110301727 A CN202110301727 A CN 202110301727A CN 115121934 B CN115121934 B CN 115121934B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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Abstract
本发明公开了一种切割加工方法以及系统，该方法通过在接收到对待切割材料进行切割的切割指令之后，控制第一激光器发射第一定位激光，同时控制第二激光器发射第二定位激光；沿待切割材料的长度方向，控制预设传送装置向定位切割区域传送待切割材料；在预设切割位置移动至定位切割区域，且第三激光器发射的定位切割激光聚焦在预设切割位置时，通过定位切割激光在预设切割位置进行激光切割，以在待切割材料上切割出切割线；控制预设传送装置沿待切割材料的长度方向，将待切割材料继续传送至预设裁切区域，以通过预设裁切区域中位于切割线上方的裁刀对齐切割线并切断待切割材料之后，确认完成本次切割。本发明提高了激光切割的准确率以及效率。
The present invention discloses a cutting processing method and system, which controls a first laser to emit a first positioning laser and a second laser to emit a second positioning laser after receiving a cutting instruction to cut a material to be cut; controls a preset conveying device to convey the material to be cut to a positioning cutting area along the length direction of the material to be cut; when the preset cutting position moves to the positioning cutting area and the positioning cutting laser emitted by the third laser focuses on the preset cutting position, the positioning cutting laser is used to perform laser cutting at the preset cutting position to cut a cutting line on the material to be cut; controls the preset conveying device to continue conveying the material to be cut to a preset cutting area along the length direction of the material to be cut, so as to align the cutting line with a cutter located above the cutting line in the preset cutting area and cut the material to be cut, and then confirms that the cutting is completed. The present invention improves the accuracy and efficiency of laser cutting.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a cutting processing method and system.
Background
In existing laser processing equipment, cutting of bar-type materials is well established and perfected. However, in the prior art, when the roll-to-roll sheet material is cut by laser cutting, the problem of lower cutting accuracy still exists, and the main reason for the phenomenon is that firstly, because the roll-to-roll sheet material is too long, the phenomenon that the position of the material deviates from the original track often occurs in the process of cutting the roll-to-roll sheet material, at the moment, the deviation of the cutting position occurs, and secondly, when the roll-to-roll sheet material is cut by a cutter, the cutter is difficult to adjust to be consistent with the level of the roll-to-roll sheet material to be cut, so that the error exists in the cut position of the material, and the cutting accuracy is further reduced.
Disclosure of Invention
The embodiment of the invention provides a cutting processing method and a cutting processing system, which aim to solve the problem of lower cutting accuracy when a roll-to-roll sheet material is cut through laser cutting.
A cutting processing method comprising:
After receiving a cutting instruction for cutting a material to be cut, controlling a first laser to emit first positioning laser and controlling a second laser to emit second positioning laser parallel to the first positioning laser, wherein the cutting instruction comprises a preset cutting position on the material to be cut;
Controlling a preset conveying device to convey the material to be cut to a positioning cutting area below a third laser along the length direction of the material to be cut; the length direction is perpendicular to the width direction, and the material to be cut is always positioned between and attached to the first positioning laser and the second positioning laser in the conveying process;
When the preset cutting position moves to the positioning cutting area and positioning cutting laser emitted by a third laser focuses on the preset cutting position, performing laser cutting at the preset cutting position through the positioning cutting laser so as to cut a cutting line perpendicular to the first positioning laser on the material to be cut;
and controlling the preset conveying device to continuously convey the material to be cut to a preset cutting area along the length direction of the material to be cut, and confirming that the cutting is finished after the cutting knife positioned above the cutting line in the preset cutting area aligns with the cutting line and cuts off the material to be cut.
The cutting processing system comprises a first laser, a second laser, a third laser, a preset conveying device, a cutting working platform, a cutter and a controller, wherein the controller is used for executing the cutting processing method.
The cutting processing method and system comprise the steps of controlling a first laser to emit first positioning laser and a second laser to emit second positioning laser parallel to the first positioning laser after a cutting instruction for cutting a material to be cut is received, controlling a first laser to emit the first positioning laser and a second laser to emit the second positioning laser parallel to the first positioning laser, enabling the laser distance between the first positioning laser and the second positioning laser to be equal to the width of the material to be cut when the cutting instruction comprises a preset cutting position on the material to be cut, controlling a preset conveying device to convey the material to be cut to a positioning cutting area below a third laser along the length direction of the material to be cut, enabling the length direction to be perpendicular to the width direction, enabling the material to be cut to be always located between the first positioning laser and the second positioning laser and attached to the first positioning laser in the conveying process, enabling the positioning cutting laser to be moved to the preset cutting area when the positioning cutting laser emitted by the third laser is focused on the preset cutting position, enabling the positioning cutting laser to conduct laser cutting on the preset cutting position so that the material to be cut on the preset cutting area, enabling the material to be conveyed to be cut to be perpendicular to the cutting line to the cutting area when the preset cutting line is located on the cutting line to be cut, and the cutting line is confirmed to be perpendicular to the cutting line to the cutting area.
In the invention, the two lasers (namely the first laser and the second laser) are used for positioning the material to be cut, and the laser distance between the first positioning laser and the second positioning laser is kept equal to the material width of the material to be cut in the process of conveying the material to be cut, so that the material to be cut is always in a horizontal state, the premise of stable cutting is provided for the subsequent laser cutting of the material to be cut, and the accuracy of cutting the material to be cut is improved. Cutting lines are cut at preset cutting positions of the materials to be cut through the third laser, so that when the materials to be cut are cut through the cutting knife aiming at the cutting lines, the cutting treatment of the materials to be cut can be completed rapidly and accurately.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a cutting system according to an embodiment of the present invention;
FIG. 2 is a flow chart of a cutting method according to an embodiment of the invention;
FIG. 3 is a flowchart of step S20 in a cutting method according to an embodiment of the present invention;
FIG. 4 is another flowchart of step S20 in a cutting method according to an embodiment of the present invention;
FIG. 5 is a flowchart of step S30 in a cutting method according to an embodiment of the present invention;
FIG. 6 is a flowchart of step S40 in a cutting method according to an embodiment of the present invention;
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The present invention provides a cutting processing method that can be applied to a controller of a cutting processing system shown in fig. 1, the cutting processing system including a first laser 1, a second laser 2, a third laser 4, a preset conveyor 3, a cutting work platform 5, a cutting work platform (not shown in fig. 1), a cutter 6, and a controller.
In one embodiment, as shown in fig. 2, a cutting processing method is provided, which includes the following steps:
S10, after a cutting instruction for cutting a material to be cut is received, controlling a first laser 1 to emit first positioning laser and controlling a second laser 2 to emit second positioning laser parallel to the first positioning laser, wherein the cutting instruction comprises a preset cutting position on the material to be cut, and the laser distance between the first positioning laser and the second positioning laser is equal to the material width of the material to be cut.
Alternatively, the material to be cut may be a bar-type material of various materials, or a coil, and when the material to be cut is a coil, the material to be cut is stretched and then placed on the preset conveyor 3. It will be appreciated that the cutting command may be sent by the staff responsible for the cutting process or may be automatically generated after the material to be cut has been placed on the preset conveyor 3. The preset cutting position refers to a preset manually set cutting processing position, and one or more preset cutting positions may exist on one material to be cut. Alternatively, the first laser 1 and the second laser 2 may be an infrared laser or an environment laser, and the first laser 1 and the second laser 2 are preferably infrared lasers in this embodiment because the infrared lasers have visible light beams that are more intuitive and obvious.
Further, the first positioning laser refers to a visible light beam emitted by the first laser 1, the second positioning laser refers to a visible light beam emitted by the second laser 2, and the first positioning laser is parallel to the second positioning laser, and it can be understood that the first positioning laser and the second positioning laser are used together for positioning a material to be cut, that is, when the width of the material to be cut (the width of the material refers to the width value of the material to be cut) is equal to the laser distance between the first positioning laser and the second laser, the optical path of the first positioning laser or the second positioning laser is not blocked by the characterization of the material to be cut, so that the positioning success of the material to be cut is determined, and the positioning accuracy of the material to be cut is improved. Further, by comparing the laser distance with the material width to determine whether the material to be cut is positioned accurately, the first laser 1 and the second laser 2 may be simultaneously disposed at the start end or the end of the material length direction of the material to be cut, or the first laser 1 and the second laser 2 may be disposed at the start end and the end of the material length direction of the material to be cut, respectively (for example, the first laser 1 is disposed at the start end of the material length of the material to be cut, and the second laser 2 is disposed at the end of the material length of the material to be cut).
And S20, along the length direction of the material to be cut, controlling a preset conveying device 3 to convey the material to be cut to a positioning cutting area below a third laser 4, wherein the length direction is perpendicular to the width direction, and the material to be cut is always positioned between and attached to the first positioning laser and the second positioning laser in the conveying process.
It will be appreciated that the length direction of the material to be cut is that direction parallel to the first positioning laser and the second positioning laser. The third laser 4 may be a galvanometer laser welder, and the third laser 4 may further control laser focusing on a preset cutting position of the material to be cut to perform laser cutting through oscillation of a galvanometer, preferably, the cutting processing speed of the third laser 4 is 500mm/s, the cutting frequency is 500KHZ, and the cutting power is 10W. Alternatively, the preset conveyor 3 may be a conveyor composed of a conveyor belt or a conveyor composed of a plurality of conveyor shafts. Positioning the cutting area refers to an area for laser cutting the material to be cut.
Specifically, after the first laser 1 is controlled to emit the first positioning laser and the second laser 2 is controlled to emit the second positioning laser parallel to the first positioning laser, the preset conveying device 3 is controlled to convey the material to be cut to the positioning cutting area below the third laser 4 along the length direction of the material to be cut, and in the conveying process of the material to be cut, whether the material to be cut is always located between the first positioning laser and the second positioning laser and is attached to the material to be cut needs to be detected in real time, so that the position of the material to be cut is not moved after the material to be cut is conveyed to the positioning cutting area, and then the laser cutting can be accurately performed at the preset cutting position of the material to be cut, and the accuracy of cutting processing is improved.
In an embodiment, as shown in fig. 3, in step S20, that is, along the length direction of the material to be cut, the controlling the preset conveying device 3 to convey the material to be cut to the positioning cutting area below the third laser 4 includes:
s201, detecting whether the material to be cut exceeds a preset positioning area in real time in the conveying process, wherein the preset positioning area is an area between the first positioning laser and the second positioning laser.
It can be understood that, in order to further ensure that the position of the material to be cut is not moved after the material to be cut is conveyed to the positioning cutting area, so that the laser cutting can be accurately performed at the preset cutting position of the material to be cut, and the accuracy of cutting processing is improved, therefore, in the conveying process of the material to be cut, whether the material to be cut is positioned in the preset positioning area in the conveying process needs to be detected in real time, that is, whether the material to be cut is positioned between the first positioning laser and the second positioning laser in the conveying process and is attached to the first positioning laser and the second positioning laser in real time.
And S202, when the material to be cut exceeds the preset positioning area in the conveying process, generating a material position adjustment instruction so as to adjust the material to be cut to the preset positioning area according to the position adjustment instruction.
It can be understood that when the material to be cut is detected to exceed the preset positioning area in the conveying process, if the material to be cut exceeds the preset positioning area, the laser beams of the first positioning laser and the second positioning laser are blocked, and then when the laser beams of the first positioning laser and the second positioning laser are detected to be blocked, the material to be cut can be determined to exceed the preset positioning area at the moment, and then a material position adjusting instruction is generated, the material to be cut can be adjusted to the preset positioning area in a manual adjustment mode, and the material to be cut can be adjusted to the preset positioning area through adjusting devices (such as a pulling sheet and the like) arranged on two sides of the preset conveying device 3 and is attached to the first positioning laser and the second positioning laser.
In another embodiment, as shown in fig. 4, in step S20, that is, controlling the preset conveying device 3 to convey the material to be cut to the positioning cutting area under the third laser 4 includes:
And S203, acquiring focus position information of positioning cutting laser focus emitted by the third laser 4 and cutting position information of the preset cutting position.
S204, determining a first moving distance of the material to be cut according to the focal position information and the cutting position information.
It will be understood that the focal position information refers to the position information corresponding to the positioning cutting laser generated by the third laser 4 focused on the preset conveying device 3, and the cutting position information refers to the cutting position information of the preset cutting position of the material to be cut when the material to be cut is fed, and the focal position information and the cutting position information should be selected to be in the same plane, so that the distance that the material to be cut needs to be moved to be conveyed to the positioning cutting area, that is, the first moving distance, is determined according to the focal position information and the cutting position information. It can be understood that, the preset cutting position of the material to be cut can be directly overlapped with the focusing position of the positioning cutting laser emitted by the third laser 4 directly through the focal position information and the first moving distance determined by the cutting position information, and then after the preset cutting position is moved to the focusing position of the positioning cutting laser emitted by the third laser 4, the laser cutting can be performed at the preset cutting position of the material to be cut through the third laser 4.
S205, driving the material to be cut to move to the positioning cutting area by the first moving distance through a preset conveying device so that the preset cutting position moves to the positioning cutting area, and focusing positioning cutting laser emitted by a third laser at the preset cutting position.
Specifically, after determining the first moving distance of the material to be cut according to the focal position information and the cutting position information, the preset conveying device 3 drives the material to be cut to move towards the positioning cutting area by the first moving distance so that the preset cutting position moves to the positioning cutting area, and when positioning cutting laser emitted by the third laser 4 is focused at the preset cutting position, laser cutting is performed at the preset cutting position by the positioning cutting laser.
In a specific embodiment, the positioning and cutting area includes a cutting platform 5 above the preset conveyor 3, and after step S20, that is, before the laser cutting is performed at the preset cutting position 3 by the positioning and cutting laser, to cut a cutting line perpendicular to the first positioning laser on the material to be cut, the method includes:
Starting the cutting working platform 5, enabling the cutting working platform 5 to absorb the material to be cut, enabling the material to be cut to deviate from the end face of the third laser 4, and attaching the material to be cut to the cutting working platform 5.
It can be understood that, in order to improve the accuracy of laser cutting of the material to be cut, a cutting working platform 5 with adsorption capability is disposed above the preset conveying device 3 and below the third laser 4 (for example, an adsorption hole is disposed on the upper end surface of the cutting working platform, and the adsorption hole is communicated with an adsorption device capable of vacuumizing the adsorption hole, so long as the material to be cut is tiled and attached to the upper end surface of the cutting working platform, at this time, the cutting working platform is started to start vacuumizing the adsorption hole to adsorb the material to be cut on the cutting working platform, the conveying device 3 is controlled to convey the material to be cut to a positioning cutting area below the third laser 4, and the cutting working platform 5 is started to adsorb the material to be cut when the positioning cutting laser emitted by the third laser 4 is focused at the preset cutting position, so that the material to be cut is far away from the end surface of the third laser 4, and attached to the cutting working platform 5, and the material to be cut is kept level on the cutting working platform 5, thereby improving the accuracy of the material to be cut. It should be noted that, the width of the platform of the cutting platform 5 is greater than or equal to the width of the material to be cut, so as to ensure that the cutting line generated when the material to be cut is cut by laser is accurate (when the width of the material to be cut is greater than the width of the platform of the cutting platform 5, the material to be cut exceeding the cutting platform 5 cannot be ensured to be horizontal, which may further cause deviation of the cutting result of the material to be cut).
And S30, when the preset cutting position moves to the positioning cutting area and positioning cutting laser emitted by the third laser 4 is focused at the preset cutting position, performing laser cutting at the preset cutting position through the positioning cutting laser so as to cut a cutting line perpendicular to the first positioning laser on the material to be cut.
Specifically, after the preset conveying device 3 is controlled to convey the material to be cut to a positioning cutting area located below the third laser 4 along the length direction of the material to be cut, the material to be cut is moved to the positioning cutting area at a preset cutting position, and when positioning cutting laser emitted by the third laser 4 is focused at the preset cutting position, laser cutting is performed at the preset cutting position by the positioning cutting laser, the cutting processing speed of the third laser 4 is 500mm/s, the cutting frequency is 500KHZ, the cutting power is 10W, and the cutting times are 1 time, so that a cutting line perpendicular to the first positioning laser is cut on the material to be cut. It can be understood that the third laser 4 performs laser cutting on the preset cutting position of the material to be cut, only generates a cutting line, and does not perform cutting processing on the material to be cut at the preset cutting position, where the cutting line is obtained by performing preprocessing (i.e., laser cutting) on the material to be cut by the third laser 4, so that accurate cutting of the material to be cut by the cutter in step S40 is conveniently achieved, accuracy of laser cutting is improved, and waste rate of the material to be cut is reduced.
In a specific embodiment, as shown in fig. 5, the cutting instruction further includes a cutting length and a cutting width of the cutting line, and step S30 includes:
and S301, determining the laser parameters of the third laser 4 according to the cutting length and the cutting width.
S302, controlling the third laser to emit positioning cutting laser corresponding to the laser parameters, and performing laser cutting through the positioning cutting laser focused at the preset cutting position so as to cut a cutting line with the cutting length and the cutting width at the preset cutting position.
It can be understood that the cutting length and the cutting width refer to a length value and a width value of a material to be cut at a preset cutting position, so that when the preset cutting position moves to a positioning cutting area, and positioning cutting laser emitted by the third laser 4 is focused at the preset cutting position, laser parameters of the third laser 4 are determined according to the cutting length and the cutting width, and then laser cutting is performed at the preset cutting position of the material to be cut by positioning cutting laser emitted by the third laser 4 and containing the laser parameters, so as to cut a cutting line perpendicular to the first positioning laser on the material to be cut.
And S40, controlling the preset conveying device 3 to continuously convey the material to be cut to a preset cutting area along the length direction of the material to be cut, and confirming that the cutting is finished after the cutting knife 6 positioned above the cutting line in the preset cutting area aligns with the cutting line and cuts the material to be cut.
It is understood that the preset cutting area is an area for performing a cutting process on a cutting line of the material to be cut. The cutter 6 is used for realizing cutting-off treatment of the material to be cut.
Specifically, as shown in fig. 6, in step S40, that is, the controlling the preset conveying device 3 to continuously convey the material to be cut to a preset cutting area along the length direction of the material to be cut includes:
s401, acquiring cutting position information of the cutter 6 and focus position information of positioning cutting laser focus emitted by the third laser 3.
S402, determining a second moving distance of the material to be cut according to the cutting position information and the focus position information.
It will be appreciated that the clipping position information refers to the position information of the cutter 6, and the focal position information and the clipping position information should be selected to be the same plane, so that the second moving distance of the material to be cut is determined according to the clipping position information and the focal position information. It will be appreciated that the second movement distance determined directly by the clipping position information and the focal position information may directly enable the cutting line of the material to be cut to coincide with the position just below the cutter 6, and further may align the cutting line and cut the material to be cut by the cutter 6 after the cutting line of the material to be cut moves to the position below the cutter 6 (i.e. clipping position information).
S403, closing the cutting working platform 5, and enabling the cutting working platform 5 to loosen the material to be cut.
S404, driving the material to be cut to move by the second moving distance through a preset conveying device so that the cutting line moves from the positioning cutting area to the preset cutting area, and a cutting knife positioned above the cutting line in the preset cutting area is aligned with the cutting line.
It may be appreciated that, in the above embodiment, when the preset cutting position is moved to the positioning cutting area and the positioning cutting laser emitted by the third laser 4 is focused at the preset cutting position, the cutting working platform 5 is started, so that the cutting working platform 5 adsorbs the material to be cut, so that the material to be cut is away from the end face of the third laser 4 and is attached to the cutting working platform 5, therefore, after the cutting line perpendicular to the first positioning laser is cut at the preset cutting position of the material to be cut, the cutting working platform 5 is closed, so that the cutting working platform 5 releases the material to be cut, and then the material to be cut is conveyed by the preset conveying device 3 to move by the second moving distance, so that the cutting line is moved from the positioning cutting area to the preset cutting area, and the cutting line is aligned with the cutting line and the material to be cut by the cutter 6 located above the cutting line in the preset cutting area.
In one embodiment, the positioning and cutting area comprises a cutting work platform below the cutter 6 and above the preset conveying device 3, and the method comprises the following steps of:
Starting the cutting working platform to enable the cutting working platform to adsorb the material to be cut so as to enable the material to be cut to deviate from the end face of the cutter 6 and attach to the cutting working platform.
It can be appreciated that, in order to improve the accuracy of cutting the material to be cut, a cutting working platform with adsorption capability is arranged above the preset conveying device 3 and below the cutter 6, after the material to be cut is continuously conveyed to a preset cutting area, the cutting working platform is started, so that the material to be cut is adsorbed by the cutting working platform, and is made to deviate from the end face of the cutter 6, and is attached to the cutting working platform, so that the material to be cut is kept horizontal on the cutting working platform, and the accuracy and efficiency of cutting the material to be cut are improved. It should be noted that the platform width of the cutting platform should be greater than or equal to the material width of the material to be cut and greater than or equal to the width of the cutter 6.
In the invention, the two lasers (namely the first laser 1 and the second laser 2) are used for positioning the material to be cut, and the laser distance between the first positioning laser and the second positioning laser is kept equal to the material width of the material to be cut in the process of conveying the material to be cut, so that the material to be cut is always in a horizontal state, the premise of stable cutting is provided for the subsequent laser cutting of the material to be cut, and the accuracy of cutting the material to be cut is improved. The third laser 4 cuts the cutting line at the preset cutting position of the material to be cut, so that when the material to be cut is cut by the cutter 6, the cutting process of the material to be cut can be rapidly and accurately completed.
In an embodiment, a cutting processing system is provided, which includes a first laser 1, a second laser 2, a third laser 4, a preset conveying device 3, a cutting work platform 5, a cutting work platform, a cutter 6, and a controller, where the controller is configured to execute the cutting processing method in the above embodiment.
It should be understood that the sequence number of each step in the foregoing embodiment does not mean that the execution sequence of each process should be determined by the function and the internal logic, and should not limit the implementation process of the embodiment of the present invention.
Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in embodiments provided herein may include non-volatile and/or volatile memory. The nonvolatile memory can include Read Only Memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (SYNCHLINK) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), among others.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional units and modules is illustrated, and in practical application, the above-described functional distribution may be performed by different functional units and modules according to needs, i.e. the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-described functions.
The foregoing embodiments are merely illustrative of the technical solutions of the present invention, and not restrictive, and although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that modifications may still be made to the technical solutions described in the foregoing embodiments or equivalent substitutions of some technical features thereof, and that such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A cutting processing method, characterized by comprising:
After receiving a cutting instruction for cutting a material to be cut, controlling a first laser to emit first positioning laser and controlling a second laser to emit second positioning laser parallel to the first positioning laser, wherein the cutting instruction comprises a preset cutting position on the material to be cut;
The method comprises the steps of controlling a preset conveying device to convey the material to be cut to a positioning cutting area below a third laser along the length direction of the material to be cut, wherein the length direction is perpendicular to the width direction, and the material to be cut is always positioned between and attached to the first positioning laser and the second positioning laser in the conveying process;
When the preset cutting position moves to the positioning cutting area and positioning cutting laser emitted by a third laser focuses on the preset cutting position, performing laser cutting at the preset cutting position through the positioning cutting laser so as to cut a cutting line perpendicular to the first positioning laser on the material to be cut;
and controlling the preset conveying device to continuously convey the material to be cut to a preset cutting area along the length direction of the material to be cut, and confirming that the cutting is finished after the cutting knife positioned above the cutting line in the preset cutting area aligns with the cutting line and cuts off the material to be cut.
2. The cutting process of claim 1, wherein controlling the preset conveyor to convey the material to be cut to a positioning cutting area located under a third laser along the length direction of the material to be cut comprises:
Detecting whether the material to be cut exceeds a preset positioning area in the conveying process in real time, wherein the preset positioning area is an area between the first positioning laser and the second positioning laser;
And when the material to be cut exceeds the preset positioning area in the conveying process, generating a material position adjusting instruction so as to adjust the material to be cut to the preset positioning area according to the position adjusting instruction.
3. The cutting process of claim 1, wherein controlling the preset conveyor to convey the material to be cut to a localized cutting zone below a third laser comprises:
Acquiring focal point position information of positioning cutting laser focusing emitted by the third laser and cutting position information of the preset cutting position;
determining a first moving distance of the material to be cut according to the focal position information and the cutting position information;
The material to be cut is driven to move to the positioning cutting area by the first moving distance through a preset conveying device, so that the preset cutting position moves to the positioning cutting area, and positioning cutting laser emitted by a third laser is focused at the preset cutting position.
4. The cutting process of claim 1, wherein the localized cutting zone comprises a cutting table above the predetermined conveyor and below the third laser;
The laser cutting is performed at the preset cutting position by the positioning cutting laser, so that before cutting a cutting line perpendicular to the first positioning laser on the material to be cut, the laser cutting device comprises:
And starting the cutting working platform to enable the cutting working platform to adsorb the material to be cut so as to enable the material to be cut to deviate from the end face of the third laser and attach to the cutting working platform.
5. The cutting processing method as set forth in claim 4, wherein controlling the preset conveyor to continuously convey the material to be cut to a preset cutting area along a length direction of the material to be cut to align a cutting line by a cutter located above the cutting line in the preset cutting area, comprises:
acquiring cutting position information of the cutter and focus position information of positioning cutting laser focus emitted by the third laser;
determining a second moving distance of the material to be cut according to the cutting position information and the focus position information;
closing the cutting working platform, and enabling the cutting working platform to loosen the material to be cut;
The material to be cut is driven to move by the preset conveying device for the second moving distance, so that the cutting line moves from the positioning cutting area to the preset cutting area, and a cutting knife positioned above the cutting line in the preset cutting area is aligned with the cutting line.
6. The cutting processing method according to claim 1, wherein the cutting instruction further includes a cutting length and a cutting width of a cutting line, and the laser cutting is performed at the preset cutting position by the positioning cutting laser to cut a cutting line perpendicular to the first positioning laser on the material to be cut, comprising:
determining laser parameters of the third laser according to the cutting length and the cutting width;
And controlling the third laser to emit positioning cutting laser corresponding to the laser parameters, and performing laser cutting through the positioning cutting laser focused at the preset cutting position so as to cut a cutting line with the cutting length and the cutting width at the preset cutting position.
7. The method of claim 1, wherein the positioning the cutting area includes positioning a cutting table below the cutter and above the predetermined conveyor, and wherein the continuously conveying the material to be cut to the predetermined cutting area comprises:
Starting the cutting working platform to enable the cutting working platform to adsorb the material to be cut, so that the material to be cut is away from the end face of the cutter and is attached to the cutting working platform.
8. The cutting process of claim 1, wherein the first laser and the second laser are infrared lasers.
9. The cutting process of claim 1, wherein the third laser has a cutting process speed of 500mm/s and a cutting frequency of 500KHZ.
10. A cutting processing system, characterized by comprising a first laser, a second laser, a third laser, a preset conveyor, a cutting work platform, a cutter and a controller for executing the cutting processing method according to any one of claims 1 to 9.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5877124B2 (en) * | 2012-05-25 | 2016-03-02 | 日本板硝子株式会社 | Cutting method of glass strip |
| CN208277632U (en) * | 2018-05-30 | 2018-12-25 | 浙江开尔新材料股份有限公司 | Enamel decorative panel air brushing is kept to the side positioning device |
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| JP2009255216A (en) * | 2008-04-15 | 2009-11-05 | Tookoo:Kk | Sheet cutting device |
| KR101826233B1 (en) * | 2016-08-05 | 2018-02-06 | 한국미쯔보시다이아몬드공업(주) | Apparatus for dividing glass substrate continuously without stop |
| US20180118602A1 (en) * | 2016-11-01 | 2018-05-03 | Corning Incorporated | Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5877124B2 (en) * | 2012-05-25 | 2016-03-02 | 日本板硝子株式会社 | Cutting method of glass strip |
| CN208277632U (en) * | 2018-05-30 | 2018-12-25 | 浙江开尔新材料股份有限公司 | Enamel decorative panel air brushing is kept to the side positioning device |
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