CN115116864A - BGA chip packaging method - Google Patents
BGA chip packaging method Download PDFInfo
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- CN115116864A CN115116864A CN202210914067.0A CN202210914067A CN115116864A CN 115116864 A CN115116864 A CN 115116864A CN 202210914067 A CN202210914067 A CN 202210914067A CN 115116864 A CN115116864 A CN 115116864A
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- bga chip
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- 238000000034 method Methods 0.000 title claims abstract description 59
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 55
- 239000000463 material Substances 0.000 claims abstract description 72
- 230000001681 protective effect Effects 0.000 claims abstract description 65
- 238000002955 isolation Methods 0.000 claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 11
- 238000007790 scraping Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 230000002209 hydrophobic effect Effects 0.000 claims description 4
- 238000011068 loading method Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 241000405070 Percophidae Species 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010981 drying operation Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 17
- 150000003839 salts Chemical class 0.000 abstract description 15
- 239000003595 mist Substances 0.000 abstract description 11
- 230000007797 corrosion Effects 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract description 5
- 238000005520 cutting process Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 8
- 239000000047 product Substances 0.000 description 5
- 229920006335 epoxy glue Polymers 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 210000001015 abdomen Anatomy 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a BGA chip packaging method which comprises the steps of obtaining packaging information of a BGA chip to be packaged, manufacturing and cutting isolation paper with a corresponding size according to the packaging information, pasting the isolation paper in a hollow area between the corresponding BGA chip and a peripheral device, extruding a special protection material into a space between the BGA chip and a PCB through a target packaging edge until the special protection material is freely extruded from each non-target packaging edge of the BGA chip, removing redundant special protection materials on each edge of the BGA chip, and removing the isolation paper. According to the invention, the BGA solder balls are coated by the special protective material, so that exchange with external water molecules and contact with salt mist are isolated, the problem of solder ball corrosion or short circuit of the BGA chip in a damp-heat and salt mist environment is thoroughly solved, the protective material has no mechanical stress influence on a BGA chip body, the solder balls and a PCB pad in the treatment process and the subsequent use process, and the protective material can remove good reworkability by adopting a matched protective material removing process.
Description
Technical Field
The invention relates to the technical field of BGA chip surface treatment, in particular to a BGA chip packaging method.
Background
BGA-ball grid array solder ball layout, high density solder balls; generally used for the packaging mode of high-end chips. For example: various processors, arithmetic units, logic circuits, and the like. Military high-end modules heavily use circuit chips in the form of BGA packages.
For military electronic products, due to the characteristics of use in various severe environment platforms, the military circuit module, particularly a BGA chip, is required to be subjected to three-proofing protection treatment in order to ensure normal long-term reliable operation of the military electronic products. The key point for the BGA chip is to protect the solder balls and corresponding pads of the ball grid array under the abdomen of the BGA chip.
As shown in FIG. 1, the BGA chip has a great feature, the space distance between the BGA package chip and the PCB is generally only 0.2mm-0.4mm, and the surface/diameter ratio of the BGA is more than or equal to 100. The existing methods for processing the BGA chip are damp-proof, water-proof and salt fog-proof and have 3 types.
A. And (3) spraying the BGA chip by using three-proofing coatings such as S01-3, DC1-2577 and the like, wherein the spraying is intentionally carried out on the gap between the BGA chip and the PCB. However, as the space distance between the BGA packaging chip and the PCB is very small and the surface/diameter ratio of the BGA is large, paint mist is at the edge of the BGA chip, and most paint mist is reflected and rebounded away; another small part even if entering the space between the BGA packaged chip/PCB board, the spray paint pressure is rapidly attenuated due to the dense ball grid array solder ball distribution, making it difficult for 100% of the solder balls in the central region of the belly of the BGA chip to be completely coated.
B. The single-component room temperature vulcanized silicone rubber such as 812 silicone rubber, 703 silicone rubber and the like is adopted to fill the space between the BGA package chip and the PCB (mainly, cofferdam type sealing filling is carried out from 4 sides of the BGA chip in a sealing mode, which means that the space between the BGA package chip and the PCB is sealed by the cofferdam with 4 sides, so that moisture and salt mist are prevented from entering the space between the BGA package chip and the PCB in the later period of use.
Although the dam seal achieves the so-called sealing effect, the moisture vapor transmission rate of the silicone rubber is 46g/sq.m/day, and there is no problem in a short time; however, if the product works in a damp and hot (water vapor) environment for a long time, when the external saturated vapor pressure is larger than the saturated vapor pressure in the BGA chip cofferdam space, the water vapor can slowly permeate into the BGA chip cofferdam space, and once the BGA chip cofferdam space enters the BGA chip cofferdam space, the BGA chip cofferdam space becomes liquid water (can enter the BGA chip cofferdam space and is difficult to exit), the water is accumulated more and more, and finally enough liquid drops are formed. Because of the dam-type encapsulation process, the solder balls in the central area of the BGA chip are kept in the original exposed state.
At this time, the penetrated water vapor is condensed and accumulated to form water drops, which directly causes the short circuit risk during the power-on process of the BGA chip. Moreover, in the presence of water, there is also a risk of metal corrosion of the solder balls/pads. Therefore, the cofferdam sealing process method has little problem aiming at the outdoor environments of vehicle-mounted electronic products, accidental rainstorm and the like; but the risk is high when the method is used for ship-borne and airborne electronic products working in the aviation and ocean environment for a long time.
C. And filling and packaging the BGA chip by adopting high-temperature epoxy resin glue. The process comprises the following steps: when the BGA chip is assembled on the PCBA, the BGA on the PCB is firstly subjected to electric fitting, high-temperature epoxy resin is filled at the bottom of the lower part (underfil) of the abdomen of the BGA after the electric fitting, and after the high-temperature epoxy resin is cured at 150 ℃, a shrinkage compressive stress is generated on one hand, so that a BGA device is more firmly fixed on the PCB, and the reinforcing effect is achieved; on the other hand, the underfill filling technology is adopted, so that the solder balls of the BGA are all encapsulated in the high-temperature epoxy glue, and the protection effect of moisture/salt mist resistance is achieved.
The process has obvious effect on solving the problems of long-term moisture resistance, water resistance and salt mist resistance of the BGA chip. However, because the high-temperature epoxy glue is used for bottom filling, once the epoxy glue is cured, the epoxy glue can never be removed. It is very good if the BGA chip is always working properly. If the BGA chip is failed, the whole PCBA module is directly scrapped because the BGA chip cannot be replaced. The biggest disadvantage of the process is poor reworkability.
The process is not suitable for the electric mounting process of a mixed circuit due to high curing temperature (150 ℃). (applicable only to mass production and this process must be arranged in the front end of the assembly of PCBAs, not after soldering of other devices, but after long curing at 150 ℃ there is thermal stress \ damage to the devices.)
Disclosure of Invention
The invention mainly aims to provide a BGA chip packaging method, and aims to solve the technical problem that the packaging effect of the conventional BGA chip packaging process is poor under the requirements of moisture resistance, water resistance and salt spray resistance.
In order to achieve the above object, the present invention provides a BGA chip packaging method, comprising the steps of:
s1: acquiring packaging information of a BGA chip to be packaged;
s2: manufacturing isolation paper with a cut corresponding size according to the packaging information;
s3: pasting isolation paper on an open area between the corresponding BGA chip and the peripheral device;
s4: extruding the special protective material into a space between the BGA chip and the PCB through the target packaging edge until the special protective material is freely extruded from each non-target packaging edge of the BGA chip;
s5: and removing the redundant special protective materials on each edge of the BGA chip, and detaching the release paper.
Optionally, the encapsulation information includes: the quantity, the position and the spatial relationship between the BGA chips to be packaged and peripheral devices.
Optionally, before the step S3, the method further includes: and performing standard cleaning and drying operation on the BGA chip, the PCB and peripheral devices.
Optionally, the step S4 specifically includes:
s41: according to the packaging information, defining one side farthest from the peripheral device as an A side;
s42: loading the special protective material into a glue extruder, and installing a glue extruding head;
s43: extending the glue extruding head into a space between the BGA chip corresponding to the side A and the PCB;
s44: and slowly applying pressure to extrude the special protective material into the space between the BGA chip and the PCB until the special protective material is freely extruded from three B \ C \ D sides of the BGA chip.
Optionally, the special glue squeezing head is a duckbill nozzle.
Optionally, the method until the special protective material is freely extruded from three B \ C \ D sides of the BGA chip specifically comprises the following steps: and stopping extruding the edge A until special protective materials overflow from three edges B \ C \ D of the BGA chip and the width of each edge is completely occupied.
Optionally, the step S5 specifically includes:
s51: scraping a circle along the periphery of the BGA chip by using a scraper;
s52: scraping the redundant special protective material overflowing from the periphery of the BGA chip to the isolation paper by using a scraper;
s53: and (5) taking off the special release paper by using tweezers.
Optionally, the special protective material is a hydrophobic insulating adhesive material.
The BGA chip packaging method comprises the steps of obtaining packaging information of a BGA chip to be packaged, manufacturing and cutting isolation paper with a corresponding size according to the packaging information, pasting the isolation paper in a hollow area between the corresponding BGA chip and a peripheral device, extruding a special protective material into a space between the BGA chip and a PCB through a target packaging edge until the special protective material is freely extruded from each non-target packaging edge of the BGA chip, removing redundant special protective material on each edge of the BGA chip, and removing the isolation paper. According to the invention, the BGA solder balls are coated by the special protective material, so that exchange with external water molecules and contact with salt mist are isolated, the problem of solder ball corrosion or short circuit of the BGA chip in a damp-heat and salt mist environment is thoroughly solved, the protective material has no mechanical stress influence on a BGA chip body, the solder balls and a PCB pad in a treatment process and a subsequent use process, and the protective material can remove good reworkability by adopting a matched protective material removing process.
Drawings
FIG. 1 is a schematic view of a BGA chip protection process;
FIG. 2 is a schematic flow chart illustrating a BGA chip packaging method in accordance with an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a BGA chip packaging method in accordance with an embodiment of the present invention;
fig. 4 is a schematic diagram of implementing BGA chip packaging in accordance with an embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
At present, in the related technical field, the packaging effect of the existing BGA chip packaging process is poor under the requirements of moisture resistance, water resistance and salt mist resistance.
To solve this problem, various embodiments of the BGA chip packaging method of the present invention are proposed. According to the BGA chip packaging method provided by the invention, the exchange with external water molecules and the contact with salt spray are isolated by coating the BGA solder balls with the special protective material, so that the problem of solder ball corrosion or short circuit of the BGA chip in a damp-heat and salt spray environment is thoroughly solved, the protective material has no mechanical stress influence on a BGA chip body, the solder balls and a PCB pad in the treatment process and the subsequent use process, and the protective material can remove the good reworkability by adopting a matched protective material removing process.
An embodiment of the present invention provides a BGA chip packaging method, and referring to fig. 2, fig. 2 is a schematic flowchart of an embodiment of the BGA chip packaging method of the present invention.
In this embodiment, the BGA chip packaging method includes the steps of:
s1: acquiring packaging information of a BGA chip to be packaged;
s2: manufacturing isolation paper with a cut corresponding size according to the packaging information;
s3: pasting the isolation paper on the empty area between the corresponding BGA chip and the peripheral device;
s4: extruding the special protective material into a space between the BGA chip and the PCB through the target packaging edge until the special protective material is freely extruded from each non-target packaging edge of the BGA chip;
s5: and removing the redundant special protective materials on each edge of the BGA chip, and detaching the release paper.
Specifically, as shown in fig. 3, the BGA chip packaging method includes the following steps:
A. pretreatment
1) And digesting the drawing, and confirming the quantity (number) of the BGA chips to be processed on the drawing, the positions of the corresponding BGA chips and the spatial relationship between the BGA chips and the peripheral devices.
2) According to the above-mentioned information making and cutting out the special-purpose barrier paper of correspondent size
3) And carrying out standard cleaning operation and drying on the module and the BGA chip according to normal procedures.
4) And pasting the special release paper with the corresponding size in the vacant area between the corresponding BGA chip and the peripheral device.
B. Treatment of
1) According to the information of the spatial relationship between the BGA chip and the peripheral devices, which is acquired during the pre-processing, defining the side which is farthest away from the peripheral devices as the side A;
2) loading the special protective material into a special glue extruder, and installing a special glue extruding head;
3) extending a duckbill-shaped nozzle of the special glue extruding head into a space gap between the BGA packaging chip and the PCB at the edge A of the BGA chip;
4) slowly applying pressure to enable the special protective material to be squeezed into the space between the BGA package chip and the PCB; until the special protective material is freely extruded from three B \ C \ D sides of the BGA chip, it needs to be explained that the free extrusion is specifically as follows: and (4) stopping extruding the edge A when special protective materials overflow from three edges B \ C \ D of the BGA chip and the width of each edge is completely occupied by the special protective materials observed by naked eyes.
In this embodiment, because the precise viscosity of the special protective material is precisely controlled, the special protective material can extend to the width of each side of the BGA chip, but does not flow to the open area between the BGA chip and the peripheral device.
C. Post-treatment
1) Scraping a circle along the four sides of the BGA chip A/B/C/D by using a special scraper (scalpel), thereby achieving the effect of neatness and beauty of the special protective materials at the four sides of the BGA chip A/B/C/D;
2) scraping the redundant special protective material overflowing from the four sides of the BGA chip A/B/C/D to the special isolation paper by using a special scraper (scalpel), so as to facilitate subsequent cleaning;
3) and (5) taking off the special isolation paper by using special tweezers.
D. Self-checking and mutual checking
And confirming that the four sides of the processed BGA chip A/B/C/D are all encapsulated by 100% of the special protective material, and the special protective material on the four sides of the BGA chip A/B/C/D is neat and attractive, and is qualified.
E. Special inspection
And confirming that the four sides of the processed BGA chip A/B/C/D are all encapsulated by 100% of the special protective material, and the special protective material on the four sides of the BGA chip A/B/C/D is neat and attractive, and is qualified.
As shown in fig. 4, in the present embodiment, by using the characteristics of the special protective material, through the extrusion of the edge a, the paste-like special protective material with a specific viscosity is used for controlling, so that the special protective material can smoothly walk through the pitch of the solder balls of the BGA chip dense ball grid array, and the purpose of contacting the special protective material with all the solder balls is achieved; meanwhile, due to specific viscosity control, the purpose that the special protective material does not flow and run off after entering the space between the BGA package chip and the PCB can be ensured.
Meanwhile, as the special protective material has good hydrophobicity, the solder balls contacted with the special protective material can have obvious water-resistant and hydrophobic effects on liquid water drops.
In a preferred embodiment, the hydrophobic angle of the specialty barrier material is up to 105 °.
Meanwhile, as the special protective material has good insulativity, even if the thickness of a solder ball contacting the special protective material is only very thin, through test tests, the thickness of the solder ball is only 0.1mm, the breakdown voltage resistance value of 500V can be achieved, and the sufficient insulation voltage resistance effect of the BGA chip under the working voltage condition can be achieved.
The special protective material with specific viscosity is controlled to fill the space between the BGA packaging chip and the PCB by an extrusion process; the good hydrophobicity and insulativity of the special protective material are utilized to achieve the effects of moisture prevention and salt mist prevention in a damp and hot environment filled with water vapor after the BGA chip is processed.
In the embodiment, a BGA chip packaging method is provided, in which a BGA solder ball is coated with a special material, so as to isolate exchange with external water molecules and contact with salt fog, thereby thoroughly solving the problem of solder ball corrosion or short circuit of the BGA chip in a hot and humid environment and a salt fog environment; due to the characteristics of the process, the heating and curing are not needed, so that the heat stress influence on the components is avoided, and the risk of heat damage of the components is avoided; due to the characteristics of the process, the protective material has no mechanical stress influence on the BGA chip body, the solder balls and the bonding pads of the PCB during the processing process and the subsequent use process; the process operation has no requirements of equipment such as an oven and the like, has low requirements on operation conditions, and is suitable for the operation of the BGA chip back-end process with protection requirements and the operation of an external field base; the matched protective material removing process is adopted, the protective material can be removed, and the repairing performance is good.
The above are only preferred embodiments of the invention, and are not intended to limit the scope of the invention, and all equivalent structures or equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the invention.
Claims (8)
1. A BGA chip packaging method, characterized in that the method comprises the following steps:
s1: acquiring packaging information of a BGA chip to be packaged;
s2: manufacturing isolation paper with a cut corresponding size according to the packaging information;
s3: pasting isolation paper on an open area between the corresponding BGA chip and the peripheral device;
s4: extruding the special protective material into a space between the BGA chip and the PCB through the target packaging edge until the special protective material is freely extruded from each non-target packaging edge of the BGA chip;
s5: and removing the redundant special protective materials on each edge of the BGA chip, and detaching the release paper.
2. The BGA chip packaging method of claim 1, wherein the packaging information includes: the quantity, the position and the spatial relationship between the BGA chips to be packaged and peripheral devices.
3. The BGA chip packaging method of claim 1, wherein prior to step S3, the method further includes: and performing standard cleaning and drying operation on the BGA chip, the PCB and peripheral devices.
4. The BGA chip packaging method of claim 1, wherein step S4 includes:
s41: according to the packaging information, defining one side farthest from the peripheral device as an A side;
s42: loading the special protective material into a glue extruder, and installing a glue extruding head;
s43: extending the glue extruding head into a space between the BGA chip corresponding to the side A and the PCB;
s44: and slowly applying pressure to extrude the special protective material into the space between the BGA chip and the PCB until the special protective material is freely extruded from three B \ C \ D sides of the BGA chip.
5. The BGA chip packaging method of claim 4, wherein the dedicated dispensing head employs a duckbill nozzle.
6. The BGA chip packaging method of claim 4, wherein the special protective material is freely extruded from three B \ C \ D sides of the BGA chip, specifically: and stopping extruding the edge A until special protective materials overflow from three edges B \ C \ D of the BGA chip and the width of each edge is completely occupied.
7. The BGA chip packaging method of claim 1, wherein step S5 includes:
s51: scraping a circle along the periphery of the BGA chip by using a scraper;
s52: scraping the redundant special protective material overflowing from the periphery of the BGA chip to the isolation paper by using a scraper;
s53: and (5) taking off the special release paper by using tweezers.
8. The BGA chip packaging method of any one of claims 1-7, wherein the special protective material is a hydrophobic insulating adhesive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210914067.0A CN115116864A (en) | 2022-07-28 | 2022-07-28 | BGA chip packaging method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210914067.0A CN115116864A (en) | 2022-07-28 | 2022-07-28 | BGA chip packaging method |
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| CN115116864A true CN115116864A (en) | 2022-09-27 |
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| CN202210914067.0A Pending CN115116864A (en) | 2022-07-28 | 2022-07-28 | BGA chip packaging method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1022341A (en) * | 1996-07-05 | 1998-01-23 | Oki Electric Ind Co Ltd | Mounting method for bga package and mounted structure |
| KR20010002264A (en) * | 1999-06-14 | 2001-01-15 | 윤종용 | Ball grid array package |
| US6214650B1 (en) * | 2000-02-01 | 2001-04-10 | Lockheed Martin Corporation | Method and apparatus for sealing a ball grid array package and circuit card interconnection |
| JP2007049154A (en) * | 2005-08-10 | 2007-02-22 | Phoenix Precision Technology Corp | Chip embedded package structure and manufacturing method therefor |
| CN207199611U (en) * | 2017-08-29 | 2018-04-06 | 睿力集成电路有限公司 | A kind of chip stack stereo encapsulation structure |
| CN215496694U (en) * | 2021-06-07 | 2022-01-11 | 烟台固邦新材料有限公司 | Environment-friendly halogen-free chip underfill structure |
-
2022
- 2022-07-28 CN CN202210914067.0A patent/CN115116864A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1022341A (en) * | 1996-07-05 | 1998-01-23 | Oki Electric Ind Co Ltd | Mounting method for bga package and mounted structure |
| KR20010002264A (en) * | 1999-06-14 | 2001-01-15 | 윤종용 | Ball grid array package |
| US6214650B1 (en) * | 2000-02-01 | 2001-04-10 | Lockheed Martin Corporation | Method and apparatus for sealing a ball grid array package and circuit card interconnection |
| JP2007049154A (en) * | 2005-08-10 | 2007-02-22 | Phoenix Precision Technology Corp | Chip embedded package structure and manufacturing method therefor |
| CN207199611U (en) * | 2017-08-29 | 2018-04-06 | 睿力集成电路有限公司 | A kind of chip stack stereo encapsulation structure |
| CN215496694U (en) * | 2021-06-07 | 2022-01-11 | 烟台固邦新材料有限公司 | Environment-friendly halogen-free chip underfill structure |
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