CN115114882A - Method, system, and apparatus for drawing connector ground vias and adjacent layer hollows - Google Patents

Abstract

The application discloses a method, a system and equipment for drawing a connector ground via hole and adjacent layer hollowed-out area, mainly relates to the technical field of connector drawing, and is used for solving the problems that the drawing of the ground via hole and the adjacent layer hollowed-out area by the existing connector is time-consuming and high in error and the like. The method comprises the following steps: searching connectors using the same package in the PCB through a preset skill window; acquiring the serial numbers of the connectors packaged identically through a preset kill window to trigger a preset VIA page; acquiring a grounding VIA hole parameter through a preset VIA page, and further determining a PAD position and a grounding point position of the connector to finish drawing the grounding VIA hole of the connector; and acquiring preset adjacent layer hollowing information through a preset PAD void page, and further determining the PAD of the connector for drawing the adjacent layer hollowing area so as to draw the adjacent layer hollowing area. According to the method, the ground via hole and the adjacent layer hollowed area can be automatically drawn, the time is saved, and the errors are reduced.

Description

Method, system, and apparatus for drawing connector ground vias and adjacent layer hollows

technical field

The invention belongs to the technical field of connector drawing, and in particular relates to a method, a system and a device for drawing a grounding via of a connector and hollowing out an adjacent layer.

Background technique

In PCB design, in order to comply with various connector specifications and make the signal better quality, there will be special specifications on the connector to define the position of the ground via and the hollowing method of the adjacent layer of the high-speed signal PAD.

The existing technology for drawing the grounding via of the connector and the hollowing out of the adjacent layer is mainly: manual drawing of the connector by the layout engineer according to the connector specification provided by the SI engineer.

However, in the PCB design, the layout engineer needs to draw the GND via on the connector and the adjacent layer of the PAD one by one according to the special specifications on the connector. There is usually more than one connector in a PCB, such as a server PCB. If there are more than 10 connectors, it will take a lot of time to draw one by one, and there are problems such as irregularities caused by human error.

SUMMARY OF THE INVENTION

In the PCB design, the layout takes a lot of time to draw the connector PCB wiring grounding vias and the high-speed signal PAD adjacent layers hollowed out, and the design quality is low due to the negligence of human factors. A method, system and device for drawing a grounding via of a connector and hollowing out an adjacent layer are provided to solve the above technical problems.

In a first aspect, the present application provides a method for drawing a grounding via of a connector and hollowing out an adjacent layer, the method comprising: searching for a connector using the same package in a PCB board through a preset skill window; Obtain the number of the connector of the same package to trigger the preset VIA page; through the preset VIA page, obtain the grounding via parameters, and then determine the PAD position and grounding point position of the connector to complete the drawing of the grounding via of the connector; Through the preset PAD void page, the preset adjacent layer knockout information is obtained, and then the PAD of the connector for drawing the adjacent layer hollow area is determined, so as to draw the adjacent layer hollow area.

In an implementation manner of the present application, before obtaining the serial numbers of the connectors of the same package through a preset skill window, the method includes: displaying all the connector serial numbers using the same package through a preset display page.

In an implementation manner of the present application, the ground via parameters include: VIA TYPE parameter, PDA TYPE parameter, and PDA GAP parameter.

In an implementation manner of the present application, the parameters of the ground vias are acquired by presetting the VIA page, which specifically includes: acquiring the VIA TYPE parameters by presetting the VIA page; determining several PDA TYPE values corresponding to the VIA TYPE parameters; The TYPE parameter includes a length parameter and a width parameter; the VIATYPE parameter is determined from several PDA TYPE values through the preset VIA page.

In an implementation manner of the present application, the PAD position and the grounding point position of the connector are determined to complete the drawing of the grounding via of the connector, which specifically includes: calculating the grounding via according to the length parameter, the VIA TYPE parameter and the PDA GAP parameter position, to automatically complete the routing of the connector's PAD and ground vias, and complete the drawing of the connector's ground vias.

In an implementation manner of the present application, before determining the VIATYPE parameter from several PDA TYPE values through a preset VIA page, the method further includes: based on the VIA TYPE parameter, generating a VIA-PDA comparison interface to display the corresponding VIA TYPE parameter. Several PDA TYPE values.

In an implementation manner of the present application, determining the PAD area parameter of the connector for drawing the hollow area of the adjacent layer, specifically including: the skill program determines the PAD of the connector that draws the hollow area of the adjacent layer through the connector NET name, Gets the region parameter of the connector's PAD.

In a second aspect, the present application provides a system for drawing connector grounding vias and hollowing out adjacent layers, the system includes: a search module for searching for connectors using the same package in a PCB board through a preset skill window; The trigger module is used to obtain the number of the same packaged connector through the preset skill window to trigger the preset VIA page; the drawing module is used to obtain the ground via parameters through the preset VIA page, and then determine the PAD position of the connector and the position of the grounding point to complete the drawing of the grounding via of the connector; it is also used to obtain the preset adjacent layer hollowing information through the preset PADvoid page, and then determine the PAD area parameters of the connector for drawing the adjacent layer hollowing area , to draw the adjacent layer knockout area.

In an implementation manner of the present application, the search module further includes a display unit; the display unit is configured to display all connector numbers using the same package through a preset display page.

In a third aspect, the present application provides an apparatus for drawing a connector ground via and an adjacent layer hollow, including: a processor; and a memory on which executable code is stored, and when the executable code is executed, causes processing The controller performs any one of the above methods of drawing a connector ground via and an adjacent layer hollow.

The beneficial effect of the present invention is that the application runs the skill program, and then searches for the connector name through the preset skill window, so as to realize the automatic acquisition of several connectors of the same package in the PCB board; the connectors of the same package are obtained through the preset skill window. It is not necessary to select the connectors in the PCB board one by one during the running process, so that the connectors are automatically selected by the program; through the preset VIA page, the parameters of the grounding vias are obtained, and the PAD position and the grounding point position of the connector are determined. Automatically draw the grounding vias of the connector; through the preset PADvoid page, obtain the preset adjacent layer hollowing information, and realize the automatic calculation of the adjacent layer hollowing area.

In summary, this application can select the connectors in the PCB through the skill program in the Cadence Layout design, and then define the wiring method of the connector grounding holes and the hollow area of the adjacent layers, so as to reduce the repetitive work and improve the performance. Efficiency with the purpose of improving PCB quality.

In addition, the present invention has reliable design principle and simple structure, and has a very wide application prospect.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. In other words, other drawings can also be obtained based on these drawings without creative labor.

FIG. 1 is a flowchart of a method for drawing a connector grounding via and an adjacent layer hollow provided by an embodiment of the present application;

FIG. 2 is a schematic diagram of the internal structure of a system for drawing a grounding via of a connector and hollowing out an adjacent layer according to an embodiment of the present application.

FIG. 3 is a schematic diagram of the internal structure of a device for drawing a grounding via of a connector and hollowing out an adjacent layer according to an embodiment of the present application.

Detailed ways

In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that there are many kinds of PCB design software on the market. As the most widely used software in the industry, Cadence not only has powerful functions and a variety of related software to support it, but also provides an open secondary With the development interface and a relatively complete development language library, users can develop according to their own needs. Skill language is a high-level programming language built in Cadence software based on C language and LISP language. Cadence provides rich interactive functions for skill language. Studying skill language and then writing tools can greatly improve work efficiency.

Based on this, the present invention proposes a method, system and device for drawing connector grounding vias and adjacent layer hollows. In PCB design, one type of connector can be selected at a time through the invented Skill, and the skill can be used to select one type of connector at a time. Define the connector signal grounding via wiring method and the adjacent layer PAD (PAD: pad, which is the pin in the component package. In practical applications, solder is used to connect the pins of components such as resistors, capacitors, inductors, chips, etc. The pads are connected together for electrical connection. There are various forms of pads, which are divided into: through-hole pads in-line components and surface mount pads and surface mount components according to different packages; according to shape, they are divided into: regular pads and special-shaped pads ) hollowed out. It solves many shortcomings of the prior art solution, and can be used for each layout design time, and the drawing of the connector PCB wiring grounding via and the adjacent layer of the PAD can be completed with one button. By means of the present invention, layout design can be carried out quickly, work efficiency and accuracy are greatly improved, and design quality is improved.

The technical solutions proposed by the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

FIG. 1 provides a method for drawing a grounding via of a connector and hollowing out an adjacent layer according to an embodiment of the present application. As shown in FIG. 1 , the method for drawing a grounding via of a connector and hollowing out an adjacent layer provided by an embodiment of the present application mainly includes the following steps:

Step 110 , through the preset skill window, search for connectors that use the same package in the PCB.

It should be noted that connectors using the same package refer to connectors with the same preset Symbol name.

Specifically, run the Skill program, select the connector to execute the program, and jump out of the preset skill window. There is a Symbol name input box in this preset skill window, and import the package name of the connector to be searched into the Symbol name input box. Set the preset search button on the skill window to run the search program to search for connectors on the PCB that use the same package.

It can be understood by those skilled in the art that the present application can automatically obtain connectors of the same package through the above content, without the need to select parts in the PCB board one by one, thus realizing the automatic selection of connectors.

Step 120: Obtain the serial number of the connector of the same package through the preset skill window to trigger the preset VIA page.

It should be noted that this application can also show the operator the connector with the same Symbol name, so that the operator can obtain the corresponding connector number. Specifically, before obtaining the numbers of the connectors of the same package through the preset skill window, display all the connector numbers using the same package through the preset display page.

Specifically, there is a Ref Des input box in the preset skill window, import the connector number to be drawn into the RefDes input box, and trigger the preset EXIT button on the preset skill window to trigger the preset VIA page. Let the VIA page perform subsequent processing on the input connector number.

It can be understood by those skilled in the art that the present application can flexibly select a connector for subsequent drawing processing through the above content.

Step 130: Acquire the parameters of the grounding vias through the preset VIA page, and then determine the PAD position and the grounding point position of the connector, so as to complete the drawing of the grounding vias of the connector.

It should be noted that the ground via parameters include: VIA TYPE parameters, PDA TYPE parameters, and PDA GAP parameters.

Among them, "obtaining the ground via parameters through the preset VIA page" specifically includes: obtaining the VIA TYPE parameters through the preset VIA page; determining several PDA TYPE values corresponding to the VIA TYPE parameters; among which, the VIA TYPE parameters include the length parameter and Width parameter; the VIA TYPE parameter is determined from several PDA TYPE values through the preset VIA page.

Among them, before the VIA TYPE parameter is determined from several PDA TYPE values through the preset VIA page, the application can also show the operator several PDA TYPE values corresponding to the VIA TYPE parameter, so that the operator can determine the VIATYPE parameter. Specifically: based on the VIA TYPE parameter, a VIA-PDA comparison interface is generated to display several PDA TYPE values corresponding to the VIA TYPE parameter.

Among them, "determine the PAD position and grounding point position of the connector to complete the drawing of the grounding via of the connector", which can be specifically: taking the PAD center point of the connector as the reference point, according to the length parameter, VIA TYPE parameter and PDA GAP parameters, calculate the position of the ground via, to automatically complete the wiring of the connector's PAD and the ground via, and complete the drawing of the connector's ground via.

For example, when the PAD TYPE is R14x47, it means that the PAD size of this connector is 14x47mil; when the VIA TYPE is VIA18D8AT28, it means that the via size used is 18mil; when the PAD GAP input is 6, it means that the PADGAP of the via and the connector is 6mil. Taking the center point of the PAD of the connector as the reference point, the position of the ground via is calculated by (47/2+6+18/2), and the ground via is automatically drawn on the PAD of the connector.

Step 140: Acquire the preset adjacent layer knockout information by presetting the PAD void page, and then determine the PAD area parameters of the connector for drawing the adjacent layer hollow area, so as to draw the adjacent layer hollow area.

Specifically, the location information of the PAD of the connector is obtained, the location information is used as the coordinate of the center point, the size of the knockout area is calculated according to the preset adjacent layer knockout information, and the extension coordinate position is calculated in the form of a vector.

For example, the example PAD location coordinates are (0, 0) and (30, 0). X1=8.55mil; X2=8.55mil; Y1=3.93mil; Y2=11.8mil.

(X2,Y2)=(X1-X4-X5,Y1+Y4+Y5)=(0-7-8.85,0+23.5+11.8)=(-15.85,35.3);

(X2, Y3)=(X1-X4-X5.Y1-Y4-Y6)=(0-7-8.85,0-23.5-3.93)=(-15.85,-27.43);

(X3, Y2)=(X2+X4+X5, Y1+Y4+Y5)=(30+7+8.85,0+23.5+11.8)=(45.85,35.3);

(X3, Y3)=(X3+X4+X5, Y1-Y4-Y6)=(30+7+8.85,0-23.5-3.93)=(45.85,-27.43).

Further, draw a 61.7x62.73mil square area adjacent to the hollow area.

Among them, "determine the PAD area parameter of the connector that draws the hollow area of the adjacent layer", which can be specifically: the skill program determines the PAD of the connector that draws the hollow area of the adjacent layer through the NET name of the connector, and obtains the PAD of the connector area parameters.

As an example, the Member of Diff Pair parameter corresponding to the NET name in the connector is used to filter and distinguish, and the area parameter of the PAD of the connector with the Member of Diff Pair parameter is obtained.

Based on the above description, those skilled in the art can understand that: the present application searches for the connector name through the preset skill window, and realizes the automatic acquisition of several connectors of the same package in the PCB board; the connection of the same package is obtained through the preset skill window. It is not necessary to select the connectors in the PCB board one by one during the running process, so that the connector can be automatically selected by the program; through the preset VIA page, the grounding via parameters are obtained, and the PAD position and the grounding point position of the connector are determined. It can automatically draw the grounding vias of the connector; through the preset PADvoid page, the preset adjacent layer hollowing information is obtained, and the automatic calculation of the adjacent layer hollowing area is realized. In summary, this application can select the connectors in the PCB through the skill program in the Cadence Layout design, and then define the wiring method of the connector grounding holes and the hollow area of the adjacent layers, so as to reduce the repetitive work and improve the performance. Efficiency with the purpose of improving PCB quality.

In addition, an embodiment of the present application also provides a system for drawing a grounding via of a connector and hollowing out adjacent layers. As shown in FIG. 2 , the embodiment of the present application provides a system for drawing a grounding via of a connector and an adjacent layer. The system of layer hollowing mainly includes:

The search module 210 is configured to search for connectors using the same package in the PCB board through a preset skill window. It should be noted that connectors using the same package refer to connectors with the same preset Symbol name. Specifically, the search module runs the Skill program, selects the connector to execute the program, and jumps out of the preset skill window, where there is a Symbol name input box in the preset skill window, import the package name of the connector to be searched into the Symbol name input box, and in Trigger the preset search button on the preset skill window to run the search program to search for connectors on the PCB that use the same package.

It can be understood by those skilled in the art that the present application can automatically obtain connectors of the same package through the above content, without the need to select parts in the PCB board one by one, thus realizing the automatic selection of connectors.

The triggering module 220 is configured to obtain the serial number of the connector of the same package through the preset skill window, so as to trigger the preset VIA page.

Specifically, there is a Ref Des input box in the preset skill window, the trigger module imports the connector number to be drawn into the Ref Des input box, and triggers the preset EXIT button on the preset skill window to trigger the preset VIA page to The input connector number is post-processed by triggering the preset VIA page.

It can be understood by those skilled in the art that the present application can flexibly select a connector for subsequent drawing processing through the above content.

The drawing module 230 is used to obtain the grounding via parameters through the preset VIA page, and then determine the PAD position and the grounding point position of the connector, so as to complete the drawing of the grounding via of the connector; it should be noted that the grounding via parameters include: : VIATYPE parameter, PDA TYPE parameter, PDA GAP parameter.

Among them, "obtaining the ground via parameters through the preset VIA page" specifically includes: obtaining the VIA TYPE parameters through the preset VIA page; determining several PDA TYPE values corresponding to the VIA TYPE parameters; among which, the VIA TYPE parameters include the length parameter and Width parameter; the VIA TYPE parameter is determined from several PDA TYPE values through the preset VIA page.

Among them, before the VIA TYPE parameter is determined from several PDA TYPE values through the preset VIA page, the application can also show the operator several PDA TYPE values corresponding to the VIA TYPE parameter, so that the operator can determine the VIATYPE parameter. Specifically: based on the VIA TYPE parameter, a VIA-PDA comparison interface is generated to display several PDA TYPE values corresponding to the VIA TYPE parameter.

Among them, "determine the PAD position and grounding point position of the connector to complete the drawing of the grounding via of the connector", which can be specifically: taking the PAD center point of the connector as the reference point, according to the length parameter, VIA TYPE parameter and PDA GAP parameters, calculate the position of the ground via, to automatically complete the wiring of the connector's PAD and the ground via, and complete the drawing of the connector's ground via.

The drawing module 230 is further configured to obtain preset knockout information of adjacent layers through the preset PAD void page, and then determine the PAD area parameters of the connector for drawing the hollow area of the adjacent layer, so as to draw the hollow area of the adjacent layer.

Specifically, according to the preset adjacent layer hollowing information as a parameter, the PAD of the connector that is consistent with the preset adjacent layer hollowing information is selected from the connectors, the Location information of the PAD of the connector is obtained, and the location information is used. is the center point coordinate, calculates the size of the knockout area according to the preset adjacent layer knockout information, and calculates the extension coordinate position in the form of a vector.

Among them, "determine the PAD area parameter of the connector that draws the hollow area of the adjacent layer", which can be specifically: the skill program determines the PAD of the connector that draws the hollow area of the adjacent layer through the NET name of the connector, and obtains the PAD of the connector area parameters.

As an example, the Member of Diff Pair parameter corresponding to the NET name in the connector is used to filter and distinguish, and the area parameter of the PAD of the connector with the Member of Diff Pair parameter is obtained.

Based on the above description, those skilled in the art can understand that: the present application realizes the automatic acquisition of several identically packaged connectors in the PCB board through the search module 210; It is not necessary to select the connectors in the PCB board one by one, and the connector is automatically selected by the program; the grounding via parameters are obtained by the drawing module 230, the PAD position and the grounding point position of the connector are determined, and the grounding via of the connector is automatically drawn. In addition, the drawing module 230 realizes the automatic calculation of the cutout area of the adjacent layer by obtaining the preset cutout information of the adjacent layer. In summary, this application can select the connectors in the PCB through the skill program in the Cadence Layout design, and then define the wiring method of the connector grounding holes and the hollow area of the adjacent layers, so as to reduce the repetitive work and improve the performance. Efficiency with the purpose of improving PCB quality.

In addition, an embodiment of the present application also provides a device for drawing a grounding via of a connector and hollowing out an adjacent layer. As shown in FIG. 3 , an executable instruction is stored thereon, and the executable instruction is executed. When the above method is used for drawing a grounding via of a connector and hollowing out an adjacent layer. Specifically, the server sends an execution instruction to the memory through the bus, and when the memory receives the execution instruction, it sends an execution signal to the processor through the bus to activate the processor.

It should be noted that the processor is used to search for the connectors using the same package in the PCB board through the preset skill window; obtain the number of the connector of the same package through the preset skill window to trigger the preset VIA page; On the VIA page, obtain the parameters of the ground vias, and then determine the PAD position and ground point position of the connector to complete the drawing of the ground vias of the connector; through the preset PAD void page, obtain the preset adjacent layer hollowing information, and then determine Draw the PAD of the connector of the knockout area of the adjacent layer to draw the knockout area of the adjacent layer.

Although the present invention has been described in detail in conjunction with the preferred embodiments with reference to the accompanying drawings, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, those of ordinary skill in the art can make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions should all fall within the scope of the present invention/any Those skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should all be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims (10)

1. A method of drawing a void between a connector ground via and an adjacent layer, the method comprising:

searching for connectors using the same package in the PCB through a preset kill window;

acquiring the serial numbers of the connectors packaged identically through a preset kill window to trigger a preset VIA page;

acquiring a grounding VIA hole parameter through a preset VIA page, and further determining a PAD position and a grounding point position of the connector to finish drawing the grounding VIA hole of the connector;

and acquiring preset adjacent layer excavation information through a preset PAD void page, and further determining PAD area parameters of a connector for drawing adjacent layer excavation areas so as to draw adjacent layer excavation areas.

2. The method for drawing the hollowing of the ground via hole and the adjacent layer of the connector according to claim 1, wherein before the number of the connector in the same package is obtained through a preset kill window, the method comprises:

all connector numbers using the same package are displayed through a preset display page.

3. The method for mapping the connector ground via and adjacent layer void of claim 1, wherein the ground via parameters comprise: VIA TYPE parameter, PDA GAP parameter.

4. The method for drawing the hollowed-out of the ground VIA hole and the adjacent layer of the connector according to claim 3, wherein the obtaining of the ground VIA hole parameters through a preset VIA page specifically comprises:

acquiring the VIA TYPE parameter through a preset VIA page; determining a plurality of PDA TYPE numerical values corresponding to the VIA TYPE parameters; wherein, the VIA TYPE parameter comprises a length parameter and a width parameter;

the VIA TYPE parameter is determined from a number of PDA TYPE values VIA a preset VIA page.

5. The method for drawing the void between the ground via and the adjacent layer of the connector as claimed in claim 1, wherein determining the PAD position and the ground point position of the connector to complete drawing the ground via of the connector comprises:

and calculating the position of the grounding VIA hole according to the length parameter, the VIA TYPE parameter and the PDA GAP parameter so as to automatically finish the wiring of the PAD and the grounding VIA hole of the connector and finish the drawing of the grounding VIA hole of the connector.

6. The method of mapping connector ground VIAs and adjacent layer gouges of claim 4, wherein prior to determining VIA TYPE parameters from a plurality of PDA TYPE values VIA a preset VIA page, said method further comprises:

and generating a VIA-PDA contrast interface based on the VIA TYPE parameters to display a plurality of PDA TYPE values corresponding to the VIA TYPE parameters.

7. The method for drawing the hollowing of the ground via hole and the adjacent layer of the connector according to claim 1, wherein the determining of the PAD area parameters of the connector drawing the hollowed area of the adjacent layer specifically comprises:

and determining and drawing the PAD of the connector hollowed in the adjacent layer by the sketch program through the name of the NET of the connector, and acquiring the area parameters of the PAD of the connector.

8. A system for mapping connector ground vias and adjacent layer gouges, the system comprising:

the searching module is used for searching connectors which use the same package in the PCB through a preset skill window;

the triggering module is used for acquiring the serial numbers of the connectors packaged in the same way through a preset kill window so as to trigger a preset VIA page;

the drawing module is used for acquiring the parameters of the grounding VIA hole through a preset VIA page, and further determining the PAD position and the grounding point position of the connector so as to finish drawing the grounding VIA hole of the connector; and the PAD void area parameter determining module is also used for acquiring preset adjacent layer void information through a preset PAD void page, and further determining the PAD area parameter of the connector for drawing the adjacent layer void area so as to draw the adjacent layer void area.

9. The system for mapping connector ground vias and adjacent layer hollows out of claim 8, wherein said search module further comprises a display unit;

the display unit is used for displaying all connector numbers using the same package through a preset display page.

10. An apparatus for drawing connector ground vias hollowed out of adjacent layers, the apparatus comprising:

a processor;

and a memory having executable code stored thereon, that when executed, causes the processor to perform a method of mapping connector ground vias and adjacent layer gouges as claimed in any one of claims 1-7.

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