CN115113452A

CN115113452A - Preparation method of display panel

Info

Publication number: CN115113452A
Application number: CN202110300487.5A
Authority: CN
Inventors: 窦振康; 董承翰
Original assignee: Transcend Optronics Technology Yangzhou Co ltd
Current assignee: Transcend Optronics Technology Yangzhou Co ltd
Priority date: 2021-03-22
Filing date: 2021-03-22
Publication date: 2022-09-27

Abstract

The application discloses a preparation method of a display panel, which comprises the steps of providing a first substrate; arranging a driving layer on the first substrate; arranging an electrophoresis layer on the driving layer, wherein the substrate, the driving layer and the electrophoresis layer form a first panel assembly; providing a second substrate; arranging the filter layer on the second substrate, wherein the filter layer and the second substrate form a second panel assembly; orienting an electrophoretic layer in the first panel assembly toward a filter layer in the second panel assembly; and attaching the first panel assembly and the second panel assembly. The first panel assembly and the second panel assembly are separately prepared, and different quantities of production equipment are selected according to the production speeds of the first panel assembly and the second panel assembly, so that the capacity of the whole production line can be greatly increased. Therefore, the application realizes a high-efficiency preparation method of the display panel.

Description

Preparation method of display panel

Technical Field

The application relates to the technical field of displays, in particular to a preparation method of a display panel.

Background

With the technological progress, electronic products are widely used in daily life. For example, various displays such as electronic paper are used instead of conventional paper, allowing people to conveniently browse articles. That is, the dependence and demand for such displays are increasing.

Taking an electrophoretic display as an example, a driving layer, an electrophoretic layer, and a filter layer are generally stacked in sequence on a substrate to form a display device for displaying. However, the stacking process of each layer is not the same for the prior art. Further, it takes a long time per unit area of the filter layer to be formed by spraying or the like, and other functional layers (e.g., a driving layer, an electrophoretic layer, etc.) per unit area need only a short time to be formed. In practice, one production facility can produce only 300PCS of filter layers per unit area per day, while 4000PCS of other functional layers per unit area can be produced. Therefore, the production rate of the whole production line is greatly affected by the preparation process of the filter layer. Therefore, how to produce an electrophoretic display more efficiently becomes an urgent issue to be solved.

Disclosure of Invention

The embodiment of the application provides a display panel, which solves the problem that the efficiency of the existing preparation method of a display is poor.

In order to solve the technical problem, the present application is implemented as follows:

provided is a method of manufacturing a display panel, including: providing a first substrate; arranging a driving layer on the first substrate; arranging an electrophoresis layer on the driving layer, wherein the substrate, the driving layer and the electrophoresis layer form a first panel assembly; providing a second substrate; arranging the filter layer on the second substrate, wherein the filter layer and the second substrate form a second panel assembly; orienting an electrophoretic layer in the first panel assembly toward a filter layer in the second panel assembly; and attaching the first panel assembly and the second panel assembly.

In the embodiment of the present application, the display panel is formed by attaching a first panel and a second panel to each other. The first panel comprises a first substrate, a driving layer and an electrophoresis layer, and the second panel comprises a second substrate and a filter layer. The first panel assembly and the second panel assembly are separately prepared, and different quantities of production equipment are selected according to the production speeds of the first panel assembly and the second panel assembly, so that the capacity of the whole production line can be greatly increased. In practical application, the total energy can be even improved by more than 100%. Therefore, the application realizes a high-efficiency preparation method of the display panel.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of a first panel of an embodiment of the present application;

FIG. 3 is a schematic view of a second panel of an embodiment of the present application; and

fig. 4 is a schematic diagram of a display panel according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, it should be noted that the above-mentioned steps are not fixed or indispensable in order, some steps may be performed, omitted or added simultaneously, and the flow describes the steps of the present application in a broader and easier way, and is not used to limit the order and number of steps of the preparation method of the present application. As shown in the figure, the preparation method of the display panel comprises the following steps:

step S10: a first substrate is provided. In some embodiments, the first substrate may be a transparent substrate. For example, the first substrate may be a glass substrate, such as: an alkali-containing glass substrate, an alkali-free glass substrate, or a strengthened glass substrate treated in a physical/chemical manner; it may also be a plastic substrate, for example: polyethylene terephthalate (PET), Polycarbonate (PC), polymethyl methacrylate (PMMA), or polycycloolefin polymer (COP). However, the present application is not limited thereto. In other embodiments, any substrate recognized by those skilled in the art may be used in the present application.

Step S11: a driving layer is disposed on the first substrate. The driving layer is used for driving the lower electric field. Further, the lower electric field generated by the driving layer and the upper electric field generated by the electrophoretic layer form a complete electric field to control the movement of the charged particles in the electrophoretic layer (as will be explained in detail below).

In some embodiments, the driving layer may be formed on the first substrate through a semiconductor process. For example, the driving layer may include a first driving element formed by a semiconductor process. The first driving component may be a Thin film transistor array (TFT array) including a plurality of transistors and a plurality of transmission lines. The transistors are electrically connected through a plurality of transmission lines. Each transistor may include a Gate (Gate), a Gate dielectric layer, a semiconductor layer, a Source (Source), a Drain (Drain), and other elements as recognized by those skilled in the art.

In some embodiments, the material of the gate may include copper, aluminum, molybdenum, tungsten, gold, chromium, nickel, platinum, titanium, iridium, rhodium, or other metal material with good conductivity, or any combination thereof. In other embodiments, the material of the gate electrode may be a non-metal material as long as the material used has conductivity.

In some embodiments, the gate dielectric layer may comprise silicon oxide, silicon nitride, silicon oxynitride, silicon methane, a high dielectric constant (high-k) dielectric material, or any combination thereof. Alternatively, the gate dielectric layer may comprise a metal oxide or silicate of hafnium, aluminum, zirconium, lanthanum, magnesium, barium, titanium, lead, or any combination thereof. The gate dielectric layer may be formed by a Chemical Vapor Deposition (CVD) method or a spin-on method. For example, the chemical vapor deposition method may be, but is not limited to, LPCVD (low pressure chemical vapor deposition), LTCVD (low temperature chemical vapor deposition), RTCVD (rapid thermal chemical vapor deposition), PECVD (plasma enhanced chemical vapor deposition), ALD (atomic layer deposition) of ALD (atomic layer deposition).

In some embodiments, the semiconductor layer may include: elemental semiconductors, such as: amorphous silicon (amorphous-Si), polycrystalline silicon (poly-Si), germanium (germanium); compound semiconductors, for example: gallium nitride (GaN), silicon carbide (silicon carbide), gallium arsenide (gallium arsenide), gallium phosphide (gallium phosphide), indium phosphide (indium phosphide), indium arsenide (indium arsenide), and/or indium antimonide (indium antimonide); alloy semiconductors, such as: silicon germanium alloy (SiGe), gallium arsenic phosphide (GaAsP), aluminum indium arsenide (AlInAs), aluminum gallium arsenide (AlGaAs), indium gallium arsenide (GaInAs), indium gallium phosphide (GaInP) and/or indium gallium arsenide phosphide (GaInAsP); metal oxides, such as: indium Gallium Zinc Oxide (IGZO), Indium Zinc Oxide (IZO), indium gallium tin zinc oxide (IGZTO); organic semiconductors, for example: a polycyclic aromatic compound; or any combination of the above materials.

In some embodiments, the source and drain materials may include: copper, aluminum, molybdenum, tungsten, gold, chromium, nickel, platinum, titanium, iridium, rhodium, or other metal materials with good electrical conductivity, or any combination thereof. In other embodiments, the material of the source electrode and the drain electrode may be a non-metal material as long as the material used has conductivity.

In some embodiments, the material of the transmission line may include copper, aluminum, molybdenum, tungsten, gold, chromium, nickel, platinum, titanium, iridium, rhodium, or other metallic materials with good electrical conductivity, or any combination thereof. In other embodiments, the material of the transmission line may be a non-metallic material as long as the material used has electrical conductivity.

Step S12: and arranging an electrophoresis layer on the driving layer, wherein the substrate, the driving layer and the electrophoresis layer form a first panel assembly.

In particular, the electrophoretic layer may be in the form of Microcapsule (Microcapsule) electrophoresis. For example, the electrophoretic layer may include a second driving element, a developing capsule and charged particles, wherein the second driving element corresponds to the first driving element to drive the developing capsule and the charged particles to move.

In some embodiments, the second driving element formed by the semiconductor process may be a transparent conductive layer or a conductive film, a conductive connection hole, and a connection line. Further, the second driving component provides an electric field signal to the conductive connection hole and transmits the electric field signal to the conductive film (generally, transparent metal oxide) through a corresponding line.

In some embodiments, the charged particles may include a plurality of white particles and a plurality of black particles, and each of the white particles and the black particles are encapsulated by an imaging capsule. When the charged particles (i.e., white particles and black particles) covered by the developing capsules are driven by the electric field to move, the display panel can display a corresponding image.

It should be noted that the electrophoretic layer is not limited to the form of microcapsule electrophoresis. In other embodiments, the electrophoretic layer may also be MicroCup (MicroCup) electrophoresis. The charged particles may be composed of other colored particles, for example, red or yellow.

Step S13: a second substrate is provided. The second substrate is used for bearing the filter layer positioned on the second substrate. In some embodiments, the second substrate may be a polystyrene protective film, but is not limited thereto. For example, the second substrate may be a release film, a glass substrate such as the first substrate, or a plastic substrate.

In other embodiments, the second substrate may be a multi-layer film structure, and each layer has different effects. For example, the second substrate may be configured as a multi-layer film structure to have various functions of anti-glare, anti-abrasion, anti-scratch, anti-moisture, and high light transmittance.

In some embodiments, before the step of disposing the filter layer on the second substrate, the method for manufacturing a display panel may further include a first sub-step of: and arranging the first optical cement between the second substrate and the filter layer. In other words, the first optical glue may be formed on the second substrate, and the filter layer may be formed on the first optical glue.

In some embodiments, the thickness of the first optical glue may be between 10um to 50 um. For example, the thickness of the first optical adhesive can be 10um, 15um, 20um, 25um, 30um, 35um, 40um, 45um, 50um, or any range of the above values.

In some embodiments, the first optical cement may be cured at a temperature between 50 ℃ and 80 ℃ for a time between 10mins and 50 mins. Further, the first optical glue may be cured (curing) via a light beam. For example, the first optical adhesive may be cured by a light beam at a temperature of 50 ℃, 55 ℃, 60 ℃, 65 ℃, 70 ℃, 75 ℃, 80 ℃ or any range of the above values, and the curing time is inversely proportional to the temperature.

Step S14: and arranging the filter layer on the second substrate, wherein the filter layer and the second substrate form a second panel assembly. It should be noted that when the manufacturing method performs the first sub-step, the filter layer is disposed on the first optical adhesive, and the filter layer, the first optical adhesive, and the second substrate constitute the second panel assembly.

In some embodiments, the filter layer may be formed by spraying a color ink, but is not limited thereto. In other embodiments, the colored inks can be formed by ink-jet printing, screen printing, offset printing, flexographic printing, or other means as will be appreciated by those skilled in the art.

In some embodiments, the colored inks correspond to red, green, and blue. More specifically, the colored ink may be an array including a red pattern, a green pattern, and a blue pattern. Wherein the red, green, and blue patterns may be arranged at equal intervals. Alternatively, the red, green, and blue patterns may have different sizes and be arranged at unequal intervals to make the display effect more excellent. Further, the color ink in the filter layer is used to filter the mid-band spectrum (i.e., visible spectrum: 360nm to 830nm) incident from the outside, so that the reflected light becomes the desired color. However, the color ink of the present application is not limited to the three colors mentioned above, and in other embodiments, the color ink may correspond to magenta, cyan, and yellow.

In some embodiments, the filter layer may have a thickness between 2um and 15 um. For example, the thickness of the filter layer may be 2um, 3um, 5um, 7um, 9um, 11um, 13um, 15um, or any range of the above values.

In some embodiments, after the step of disposing the filter layer on the second substrate, a second sub-step may further be included: and arranging a second optical cement on the filter layer. It should be noted that when the manufacturing method performs the second sub-step, the second optical glue, the filter layer, the first optical glue, and the second substrate constitute a second panel assembly. The second optical glue may be similar to or the same as the first optical glue, and thus is not described in detail.

In some embodiments, after the step of disposing the filter layer on the second substrate, a third sub-step may be further included: and arranging a protective layer on the filter layer. It should be noted that when the manufacturing method performs the second sub-step, the protective layer is disposed on the second optical adhesive, and the protective layer, the second optical adhesive, the filter layer, the first optical adhesive, and the second substrate constitute a second panel assembly. Or when the preparation method implements the first substep and the second substep, the protective layer is disposed on the second optical glue, and the protective layer, the second optical glue, the filter layer, the first optical glue, and the second substrate form a second panel assembly.

In some embodiments, the protective layer may be a polystyrene protective film, a release film, or any protective layer recognized by those skilled in the art. The protection layer is used to protect the filter layer in the second panel assembly from being scratched by external dust or moisture in the air.

In some embodiments, the second panel assembly may include more than the above-mentioned protective layer, second optical glue, filter layer, first optical glue, and second substrate. That is, other functional layers with different functions can be added to the second panel assembly according to the requirement. For example, the second panel assembly may also include a touch layer, a waterproof layer, an anti-glare layer, etc., but is not limited thereto.

Step S15: the electrophoretic layer in the first panel assembly is oriented towards the filter layer in the second panel assembly.

Step S16: laminating first panel assembly and second panel assembly.

In some embodiments, the protective layer is removed before attaching the first panel assembly and the second panel assembly.

In some embodiments, the bonding process may use a pull-up prevention and high-precision alignment bonding method. Further, the second panel assembly comprises a soft and easily deformable material, and the single-point color photoresist is small. Therefore, in practical use, the filter layer is fixed by the attaching mode through the adsorption platform controlled by the multiple regions. In the roller fitting process, the suction force is reduced along with the reduction of the area of the residual materials which are not yet fitted on the platform. Therefore, the problem of membrane pulling deformation caused by large suction force is avoided.

On the other hand, in order to perform positioning with high accuracy, image capture (for example, 2000W pixels) by alignment may be performed by using a high-resolution Charge Coupled Device (CCD) and bonding may be performed by edge alignment when the first panel assembly and the second panel assembly are aligned. The specific process is as follows: firstly, two groups of color R/G/B point bit images of the diagonal edge of the second panel component to be attached are captured by a group of high-definition charge coupled elements and set as corresponding coordinate points (0,0) - (X, Y). Then, another group of charge coupled devices synchronously captures the corresponding pixel edge patterns on the diagonal line in the first substrate of the first panel assembly to be bonded, and synchronously sets coordinates (0,0) - (X, Y). According to the precision of the charge coupled device, the mode can enable the attaching precision to reach 0.001mm, so that the effect of attaching with high precision is achieved.

In summary, the above steps can realize a method for manufacturing a high efficiency display panel, and the display panel manufactured by the method is an electrophoretic display. Please refer to fig. 2 to fig. 4. Fig. 2 is a schematic view of a first panel assembly according to an embodiment of the present application, the first panel assembly including a first substrate 10, a driving layer 11, and an electrophoretic layer 12, which are sequentially stacked. Fig. 3 is a schematic diagram of a second panel assembly according to an embodiment of the present disclosure, which includes a second substrate 17, a first optical adhesive 16, a filter layer 15, a second optical adhesive 14, and a protection layer 13 stacked in sequence. Fig. 4 is a schematic diagram of a display panel attached to a first panel assembly and a second panel assembly according to an embodiment of the present disclosure. As shown in fig. 4, the display panel obtained by attaching the first panel assembly and the second panel assembly (the protection layer 13 needs to be removed) includes a first substrate 10, a driving layer 11, an electrophoretic layer 12, a second optical adhesive 14, a filter layer 15, a first optical adhesive 16, and a second substrate 17 stacked in sequence.

In summary, the display panel of the present application is formed by attaching a first panel and a second panel to each other. The first panel comprises a first substrate, a driving layer and an electrophoresis layer, and the second panel comprises a second substrate and a filter layer. The first panel assembly and the second panel assembly are separately prepared, and different quantities of production equipment are selected according to the production speeds of the first panel assembly and the second panel assembly, so that the capacity of the whole production line can be greatly increased. In practical application, the total energy can be even improved by more than 100%. Therefore, the application realizes a high-efficiency preparation method of the display panel.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element identified by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the present embodiments are not limited to those precise embodiments, which are intended to be illustrative rather than restrictive, and that various changes and modifications may be effected therein by one skilled in the art without departing from the scope of the appended claims.

Claims

1. A method for manufacturing a display panel, comprising:

providing a first substrate;

arranging a driving layer on the first substrate;

arranging an electrophoretic layer on the driving layer, wherein the first substrate, the driving layer and the electrophoretic layer form a first panel assembly;

providing a second substrate;

arranging a filter layer on the second substrate, wherein the filter layer and the second substrate form a second panel assembly;

directing the electrophoretic layer in the first panel assembly toward a filter layer in the second panel assembly; and

and attaching the first panel assembly and the second panel assembly.

2. The method for manufacturing a display panel according to claim 1, wherein in the step of disposing a filter layer on the second substrate, the filter layer is formed by spraying a color ink.

3. The method of claim 2, wherein the color ink comprises red, blue, and green.

4. The method of claim 2, wherein the color ink comprises magenta, cyan, and yellow.

5. The method according to claim 1, wherein the filter layer has a thickness of 2um to 15 um.

6. The method for manufacturing a display panel according to claim 1, wherein before the step of disposing the filter layer on the second substrate, a first optical adhesive is disposed between the second substrate and the filter layer.

7. The method according to claim 6, wherein the thickness of the first optical glue is between 10um and 50 um.

8. The method according to claim 6, wherein the first optical adhesive is cured at a temperature of 50 ℃ to 80 ℃ for 10mins to 50 mins.

9. The method of claim 1, further comprising disposing a second optical glue on the filter layer after the step of disposing the filter layer on the second substrate.

10. The method for manufacturing a display panel according to claim 1, wherein after the step of disposing the filter layer on the second substrate, a protective layer is further provided on the filter layer, and wherein before the step of attaching the first panel assembly and the second panel assembly, the method further comprises removing the protective layer.