CN115107368A - Liquid ejection head and liquid ejection device - Google Patents
Liquid ejection head and liquid ejection device Download PDFInfo
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- CN115107368A CN115107368A CN202111508908.XA CN202111508908A CN115107368A CN 115107368 A CN115107368 A CN 115107368A CN 202111508908 A CN202111508908 A CN 202111508908A CN 115107368 A CN115107368 A CN 115107368A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
本发明提供加工性高的液体喷出头以及液体喷出装置。一实施方式所涉及的液体喷出头具备基座、压电体、顶板以及孔板。基座由工程陶瓷构成。压电体配置于所述基座的第一方向的一侧,且由压电性陶瓷构成,所述压电体具有构成压力室的多个槽。顶板配置于所述压电体的第一方向的一侧,且由可切削陶瓷构成。孔板与所述压电体及所述顶板的与所述第一方向不同的第二方向上的一侧的端面相对配置。孔板具有与所述压力室连通的喷嘴。所述基座的所述孔板侧的端部配置于与所述顶板及所述压电体的所述端面相比更从所述孔板退避的位置。
The present invention provides a liquid ejection head and a liquid ejection device with high processability. The liquid ejection head according to one embodiment includes a base, a piezoelectric body, a top plate, and an orifice plate. The base is constructed of engineering ceramics. The piezoelectric body is disposed on one side in the first direction of the base, and is made of piezoelectric ceramics, and the piezoelectric body has a plurality of grooves that constitute pressure chambers. The top plate is disposed on one side of the piezoelectric body in the first direction, and is made of machinable ceramics. The orifice plate is arranged to face the end faces of the piezoelectric body and the top plate on one side in a second direction different from the first direction. The orifice plate has nozzles in communication with the pressure chambers. The end portion of the base on the orifice plate side is disposed at a position retreated from the orifice plate rather than the top plate and the end surface of the piezoelectric body.
Description
技术领域technical field
本发明的实施方式涉及液体喷出头以及液体喷出装置。Embodiments of the present invention relate to a liquid ejection head and a liquid ejection device.
背景技术Background technique
在剪切模式共享壁方式的喷墨头等液体喷出头中,已知有一种在具有 多个构成压力室的槽的压电部件上层叠并接合底板和挡住槽的一侧的顶 板的结构。例如,在喷墨头中,在将由压电性陶瓷构成的压电部件、底板 以及顶板重叠并接合而成的层叠体的端面接合孔板。由于底板、顶板构成 与孔板接合的接合面,因此需要形成与同样构成接合面的压电部件相同的 面。因此,希望底板及顶板与压电部件的加工特性接近。另一方面,如果 由压电性陶瓷构成底板,则难以确保必要的强度。In a liquid ejection head such as a shear mode shared wall type ink jet head, a piezoelectric member having a plurality of grooves constituting a pressure chamber is laminated and joined to a bottom plate and a top plate that blocks one side of the grooves. For example, in an ink jet head, an orifice plate is bonded to an end surface of a laminate in which a piezoelectric member made of piezoelectric ceramics, a bottom plate, and a top plate are stacked and bonded. Since the bottom plate and the top plate constitute the joint surface to be joined to the orifice plate, it is necessary to form the same surface as that of the piezoelectric member which also constitutes the joint surface. Therefore, it is desirable that the processing characteristics of the bottom plate and the top plate be close to those of the piezoelectric component. On the other hand, if the base plate is made of piezoelectric ceramics, it is difficult to ensure necessary strength.
本发明所要解决的技术问题在于提供加工性良好的液体喷出头以及 液体喷出装置。The technical problem to be solved by the present invention is to provide a liquid ejection head and a liquid ejection device with good workability.
发明内容SUMMARY OF THE INVENTION
一实施方式所涉及的液体喷出头具备基座、压电体、顶板以及孔板。 基座由工程陶瓷构成。压电体配置于所述基座的第一方向的一侧,且由压 电性陶瓷构成,所述压电体具有构成压力室的多个槽。顶板配置于所述压 电体的第一方向的一侧,且由可切削陶瓷构成。孔板与所述压电体及所述 顶板的与所述第一方向不同的第二方向上的一侧的端面相对配置。孔板具 有与所述压力室连通的喷嘴。所述基座的所述孔板侧的端部配置于与所述顶板及所述压电体的所述端面相比更从所述孔板退避的位置。The liquid ejection head according to one embodiment includes a base, a piezoelectric body, a top plate, and an orifice plate. The base is constructed of engineering ceramics. The piezoelectric body is disposed on one side of the base in the first direction, and is made of piezoelectric ceramics, and the piezoelectric body has a plurality of grooves that constitute pressure chambers. The top plate is disposed on one side of the piezoelectric body in the first direction, and is made of machinable ceramics. The orifice plate is arranged to face the end faces of the piezoelectric body and the top plate on one side in a second direction different from the first direction. The orifice plate has nozzles in communication with the pressure chambers. The end portion of the base on the orifice plate side is disposed at a position retreated from the orifice plate rather than the top plate and the end surface of the piezoelectric body.
附图说明Description of drawings
图1是将第一实施方式所涉及的喷墨头的一部分截断表示的立体图。FIG. 1 is a perspective view showing a part of the ink jet head according to the first embodiment in a cutaway manner.
图2是同一喷墨头的截面图。FIG. 2 is a cross-sectional view of the same ink jet head.
图3是同一喷墨头的形状及动作的说明图。FIG. 3 is an explanatory diagram of the shape and operation of the same ink jet head.
图4是表示同一喷墨头的制造方法的说明图。FIG. 4 is an explanatory diagram showing a method of manufacturing the same ink jet head.
图5是表示可切削陶瓷的示例和热膨胀系数的表。FIG. 5 is a table showing examples of machinable ceramics and thermal expansion coefficients.
图6是表示可切削陶瓷的材料的示例和翘曲量的说明图。FIG. 6 is an explanatory diagram showing an example of the material of the machinable ceramic and the amount of warpage.
图7是表示使用了同一喷墨头的第二实施方式所涉及的喷墨打印机的 结构的说明图。Fig. 7 is an explanatory diagram showing the configuration of an ink jet printer according to a second embodiment using the same ink jet head.
图8是表示其他实施方式所涉及的喷墨头的制造方法的说明图。FIG. 8 is an explanatory diagram showing a method of manufacturing an ink jet head according to another embodiment.
附图标记说明Description of reference numerals
1…喷墨记录装置(液体喷出装置);10…喷墨头(液体喷出头);20… 基座;30…压电体;33…槽;331…第一槽;332…第二槽;34…层叠压电 元件;37…压力室;38…虚拟室;39…共用室;40…顶板;50…盖;60… 孔板;61…喷嘴;80…压电结构体;81…接合面。1...inkjet recording device (liquid ejection device); 10...inkjet head (liquid ejection head); 20...base; 30...piezoelectric body; 33...groove; 331...first groove; 332
具体实施方式Detailed ways
下面,参照图1至图3对第一实施方式所涉及的作为液体喷出头的喷 墨头10的结构进行说明。图1是将第一实施方式所涉及的喷墨头的一部 分截断表示的立体图,图2是同一喷墨头的截面图。图3是喷墨头的形状 及动作的说明图。为了便于说明,在各附图中适当地将结构放大、缩小或 省略而示出。图中X、Y、Z表示相互正交的三个方向。例如Z轴沿着第一方向,Y轴沿着第二方向,X轴沿着第三方向。Next, the configuration of the
本实施方式的喷墨头10例如是所谓的剪切模式共享壁方式的喷墨头。The
如图1至图3所示,喷墨头10具备基座20、压电体30、顶板40、盖 50以及孔板60。As shown in FIGS. 1 to 3 , the
基座20构成为例如矩形的板状。压电体30配置于基座20的层叠方 向即第一方向的一个主面上。另外,在基座20的一个主面的预定区域形 成有布线图案。作为一例,压电体30配置于一个主面上的一侧的区域21, 布线图案形成于另一侧的区域22。在基座20的上表面,驱动电路通过FPC 等与布线图案连接。油墨口23形成于基座20的预定位置,能够供油墨流 通。油墨口23是在沿着第一方向的厚度方向上贯通基座20的贯通孔,成 为向共用室39流入油墨的流入口、或者从共用室39排出油墨的排出口。The
作为一例,基座20在沿着喷嘴61的排列方向的长边方向上构成为大 于压电体30的尺寸。在基座20的层叠方向的一侧的主面上,压电体30 配置并接合于喷嘴61的排列方向及与层叠方向正交的第二方向的一侧的 区域。在基座20的第二方向上的一侧的端面24上,喷嘴的排列方向即第 三方向的两端部的未配置压电体30的部位与配置压电体30的第三方向中 央部相比,更向第二方向的一侧突出。即,基座20的第二方向的一侧的 端面24中至少包括配置压电体30的部位在内的中央的预定区域与两端部 相比,更向第二方向的另一侧退避。另外,第二方向的一侧的端面24在 至少包括层叠配置压电体30的部位在内的中央的预定区域处,与压电体 30、顶板40的第二方向的一侧的端面相比,更向第二方向的另一侧退避。 需要说明的是,基座20的两端部的端面也可以与压电体30、顶板40配置 于同一面。As an example, the size of the
基座20由工程陶瓷(engineering ceramic)构成。基座20由与构成压 电体30的压电部件相比更硬且刚度更强的材料构成。例如构成基座20的 工程陶瓷的热膨胀率大于构成压电体30的压电材料。作为构成基座20的 工程陶瓷,例如使用氧化铝、氧化锆、莫来石、堇青石、镁橄榄石、滑石 等。热膨胀系数可根据JISR1618(“精密陶瓷热膨胀的热机械分析测量方 法”求出。The
压电体30配置于基座20的一侧,通过粘接剂层与基座20粘接接合。 压电体30层叠有层叠方向的极化方向相反的两张压电部件31、32,通过 粘接材料层粘接接合。例如,作为粘接剂,使用通过加热粘接而固化的热 粘接剂。压电体30例如通过切断加工形成为预定的形状及大小,且形成 为在喷嘴61的排列方向即第三方向上较长的方形的板状。压电体30的与 第三方向正交的截面形状构成为梯形。压电体30的第二方向上的一侧的 端面构成与孔板60相对的接合面,与接合面相反的一侧的侧面、即第二 方向上的另一侧的端面构成相对于槽33的延伸方向即第二方向倾斜的锥 面。即,压电体30的一侧面具有从槽33的底面到基座20的主面的锥面。 作为构成压电体30的压电材料,使用例如PZT(锆钛酸铅)系或者无铅的KNN(铌酸钾钠)系等压电性陶瓷材料。The
压电体30具有多个槽33。槽33沿着压电体30的第二方向延伸,且 在第三方向上并排地排列多个。各槽33分别是长度方向沿着第二方向的 细长形状。槽33是在配置有孔板60的第二方向的一端侧和配置有顶板40 的第一方向的一侧开口的有底的狭缝。在第三方向上排列的多个槽33相 互平行地形成。The
多个槽33由交替配置的第一槽331和第二槽332构成。第一槽331 构成与喷嘴61及共用室39连通的压力室37。第二槽332构成封闭的虚拟 室38。The plurality of
压电体30的形成于相邻的槽33之间的壁状部分构成成为压力产生单 元的驱动部的层叠压电元件34。在第一方向上,多个层叠压电元件34和 多个槽33交替地排列配置于压电体30。多个层叠压电元件34通过构成槽 33的底部的压电部件32相互连续。各层叠压电元件34由层叠方向的极化 方向相反的一对压电元件部341、342层叠而构成。The wall-shaped portion of the
在压电体30的由各槽33构成的压力室37的内表面、倾斜面部,形 成有电极36。电极36从槽33的内表面穿过倾斜面部被导出,与基座20 的上表面的布线图案连接。Electrodes 36 are formed on the inner surface and the inclined surface portion of the
电极36例如通过真空蒸镀法、化学镀镍法等方法形成。电极36例如 可以与布线图案同时通过真空蒸镀法、化学镀等方法形成。电极36的材 料由镍、金、铜等导电性材料构成。电极36可以层叠两种以上的导电性 膜而构成。The electrode 36 is formed by, for example, a vacuum deposition method, an electroless nickel plating method, or the like. The electrodes 36 can be formed, for example, simultaneously with the wiring pattern by a method such as vacuum evaporation, electroless plating, or the like. The material of the electrode 36 is formed of a conductive material such as nickel, gold, and copper. The electrode 36 may be formed by laminating two or more types of conductive films.
顶板40例如由方形的板状部件构成。顶板40与压电体30的层叠方 向一侧的表面相对配置,挡住槽33的一侧的开口。顶板40由可切削陶瓷 (machinable ceramic)构成。The
如后所述,顶板40的孔板60侧的端面与压电体30的孔板60一侧的 端面同时被切断及研磨加工,而构成为同一面。顶板40及压电体30与基 座20相比更向孔板60一侧、即第二方向的一侧突出。换言之,基座20 在第二方向上向另一侧退避,以使得与顶板40及压电体30层叠而构成的 压电结构体80相比更远离孔板60。即,在喷墨头10中,基座20的端面 配置于与压电体30及顶板40的端面相比更靠第二方向的另一侧的位置。 此外,基座20的端面可以与基座20的底面正交,也可以不正交,可以与 由压电体30及顶板40构成的接合面81平行,也可以不平行。例如,基 座20的端面也可以倾斜或弯曲。As will be described later, the end surface of the
图5是表示主要的可切削陶瓷的热膨胀率的表。热膨胀系数可根据 JISR1618(“精密陶瓷热膨胀的热机械分析测量方法”求出。如图5所示, Macerite HSP为9.8×10-6/K,Macor为9.3×10-6/K,Macerite SP为9.2 ×10-6/K,Photoveel为7.8×10-6/K,PhotoveelL为6.1×10-6/K, Macerite ET为5.8×10-6/K,Macerite BT为4.5×10-6/K,Macerite PN为4.2×10-6/K。“Macerite”是日本福冈的黑崎播磨株式会社(Krosaki HarimaCorporation)的一种可加工陶瓷产品的注册商标,包括含氟金云母。 “Macor”是美国纽约州康宁公司的一种可加工陶瓷产品的注册商标,是 一种玻璃陶瓷。“Photoveel”是日本东京的日本磁性技术控股有限公司 (Ferrotec Holdings Corporation)的一种可加工陶瓷产品的注册商标,是 一种玻璃复合材料,其中均匀地析出氟金云母和氧化锆微晶。FIG. 5 is a table showing thermal expansion coefficients of main machinable ceramics. The thermal expansion coefficient can be obtained according to JISR1618 (“Thermal-mechanical analysis and measurement method of thermal expansion of fine ceramics”. As shown in Fig. 5, Macerite HSP is 9.8×10 -6 /K, Macor is 9.3×10 -6 /K, Macerite SP is 9.2 × 10 -6 /K, Photoveel is 7.8 × 10 -6 /K, Photoveel L is 6.1 × 10 -6 /K, Macerite ET is 5.8 × 10 -6 /K, Macerite BT is 4.5 × 10 -6 /K, Macerite PN is 4.2×10 -6 /K. "Macerite" is a registered trademark of Krosaki Harima Corporation of Fukuoka, Japan for a machinable ceramic product, including fluorine-containing phlogopite. "Macor" is New York, USA A registered trademark of a machinable ceramic product of State Corning Corporation, which is a glass ceramic. "Photoveel" is a registered trademark of a machinable ceramic product of Ferrotec Holdings Corporation, Tokyo, Japan, and is a A glass composite in which fluorphlogopite and zirconia crystallites are uniformly precipitated.
例如,在本实施方式中,顶板40由热膨胀率为4~10×10-6/K之间 的材料构成。具体而言,作为构成顶板40的可切削陶瓷,使用Macerite、 Macor或者Photoveel。For example, in the present embodiment, the
顶板40重叠接合在接合于基座20上的压电体30上。更优选的是, 作为构成顶板40的材料,使用热膨胀率成为构成基座20的工程陶瓷的热 膨胀率与压电性陶瓷的热膨胀率之间的值的可切削陶瓷。例如,在将压电 体30设为PZT、将基座20设为氧化铝的情况下,选定2×10-6/K以上 且7.2×10-6/K以下的热膨胀率。The
图6是表示将压电体30设为PZT,且由氧化铝构成基座20,并将顶 板40的材料设为PZT以及热膨胀率不同的两种Macerite(ET、SP)这三 种,且在120℃左右的温度下与压电体30热接合而成的组装体的翘曲量的 表。如图6所示,氧化铝的热膨胀率为7.2×10-6/K,PZT的热膨胀率为 2×10-6/K,Macerite SP的热膨胀率为9.2×10-6/K,Macerite ET的热膨 胀率为5.8×10-6/K。在由Macerite ET构成顶板40的情况下,翘曲量与 PZT及Macerite SP相比较小。由于翘曲量根据压电体30和基座20的材 料而不同,因此适当地选择顶板40的材料,例如,选择组装体的翘曲变 得更小的材料即可。FIG. 6 shows that the
盖50将与顶板40的层叠方向一侧相对配置的矩形的盖板51以及从 盖板51的侧边缘朝向基座20延伸的盖框架52以一体方式具备。盖50的 盖板51配置于顶板40上,盖框架52的端部与基座20的一侧接合。盖50 覆盖配置有压电体30的基座20的预定区域,并且在压电体30的侧方构 成共用室39。共用室39与形成于基座20的油墨口23及压电体30的多个 压力室37连通。The
孔板60构成为厚度约为10μm至100μm的方形的板状。孔板60与由 压电体30及顶板40构成的层叠结构物的一侧的侧面即接合面接合。在孔 板60上形成有在厚度方向上贯通的多个喷嘴61。喷嘴61分别设置在与每 隔一个配置的多个压力室37对应的位置。即,孔板60具有与压力室37 连通的喷嘴61,并且挡住虚拟室38的侧方的开口。The
需要说明的是,在孔板60与基座20的端面之间形成有预定的间隙。It should be noted that a predetermined gap is formed between the
图4是表示喷墨头10的制造方法的说明图。在此,作为一例,示出 了将构成两个喷墨头10的两个压电结构体80构成为一体后一分为二的例 子。本实施方式所涉及的喷墨头10的制造方法具备压电体形成处理、粘 接处理、梯形加工处理、槽加工处理、电极加工处理以及顶板粘接处理。FIG. 4 is an explanatory diagram showing a method of manufacturing the
首先,将预先在板厚方向上进行极化的两块板状的压电部件以极化方 向相互不同的方式层叠,并将该层叠体切割为期望的宽度及长度,形成两 个压电体30—体地连续的压电体部分300(压电体形成处理)。First, two plate-shaped piezoelectric members polarized in the plate thickness direction in advance are laminated so that the polarization directions are different from each other, and the laminated body is cut into desired widths and lengths to form two piezoelectric bodies 30 -
作为压电体粘接处理,通过粘接剂等将压电体部分300无缝隙地粘贴 于两个基座20连续而成的板状部件即基座部分200(Act11)。此外,在基 座部分200,两块板状的基座20连接于第三方向的两端处,在第三方向的 中央部形成有长度方向沿着第三方向并且在厚度方向上贯通的狭缝201。 狭缝201在作为第二方向的宽度方向上具有阶梯差的宽度的两倍宽度,在 通过后续的分割工序分割为两个基座20时,形成与压电体30的阶梯差。As the piezoelectric body bonding process, the
接着,作为梯形加工处理,将基座部分200加工成梯形以引出电极36 (Act12)。另外,作为槽加工处理,在具备压电体部分300的基座部分200 的表面,通过使用了切割锯、刮刀等的机械加工形成多个槽33(Act13)。Next, as a trapezoidal processing process, the
进一步,作为电极加工处理,通过真空蒸镀法等形成电极36、布线图 案等导电膜(Act13)。在通过镀敷形成电极之后,通过蚀刻、激光图案化 去除不需要的电极,形成连接压力室和基座端部的期望的电极布线。Further, as an electrode processing treatment, conductive films such as electrodes 36 and wiring patterns are formed by a vacuum deposition method or the like (Act 13). After the electrodes are formed by plating, unnecessary electrodes are removed by etching, laser patterning, and desired electrode wirings connecting the pressure chamber and the end of the susceptor are formed.
接着,作为顶板粘接处理,在压电体部分300的上表面,覆盖两个顶 板40—体地连续而成的顶板部分400,通过粘接剂层而加热粘接(Act14)。Next, as a top plate bonding process, the upper surface of the
之后,作为分割处理,通过切割加工将由基座部分200、压电体部分 300以及顶板部分400层叠并接合而成的压电结构体部分800一分为二, 从而完成两个压电结构体80(Act15)。此外,分割时的切断面成为喷嘴接 合面81。喷嘴接合面81与作为基准的基座20的底面成直角或大致直角。 在仅通过切断加工达到的直角角度不足时或者表面粗糙度较大时,也可以 进一步对切断面进行研磨加工(Act16)。After that, as a division process, the
由以上构成的各个压电结构体80具有由顶板40及压电体30的端面 构成的接合面81。在压电结构体80中,基座20的端面24配置于与由顶 板40及压电体30的侧面构成的接合面81相比在第二方向上离配置孔板 60的位置更远的位置。换言之,接合孔板60的接合面81由顶板40及压 电体30的侧面形成,不包含基座20的表面。Each of the
并且,在顶板40及压电体30的侧面,粘接安装孔板60。此时,喷嘴 61与构成压力室37的第一槽331相对配置,并且构成虚拟室38的第二槽 332被挡住。Then, the mounting
另外,从压电结构体80的一侧覆盖盖50,将盖50的盖框架52的端 面粘接并安装于基座20的表面。通过以上方式完成图1所示的喷墨头10。In addition, the
在如上所述构成的喷墨头10中,从静止状态暂时打开压力室使油墨 流入,之后缩小压力室对油墨加压使其喷出。具体而言,如图3所示,在 进行从喷嘴61喷出材料的驱动时,通过驱动电路经由形成于基座20上的 布线图案对驱动元件施加驱动电压,从而对驱动的压力室37内的电极36 和两个相邻的虚拟室38的电极36赋予电位差。于是,层叠压电元件34 的一对压电元件部341、342彼此反向地变形,且通过两个压电元件的变 形,驱动元件弯曲变形。作为一例,首先通过使驱动的压力室37向打开 的方向变形而使压力室37内成为负压,从而将油墨向压力室37内引导(油 墨流入)。接着,通过使压力室37向关闭的方向变形而对压力室37内加 压(油墨加压),从而使油墨滴从喷嘴61喷出,返回到基准电位(切断油墨柱)。In the
根据本实施方式,能够提供加工性良好的喷墨头10。由于作为具有喷 嘴61的孔板60的接合面的压力室的壁由可切削陶瓷和压电体构成,因此 能够容易进行加工,且能够通过机械加工使接合孔板60的接合面成为同 一面。即,由于由具有同样的加工特性的压电体30和顶板40构成接合面, 因此加工条件变得容易,能够使孔板60准确无遗漏地接合。另外,通过 使基座20的材料为无铅材料,能够提供适合于环境的喷墨头10。According to the present embodiment, the
例如在本实施方式中使用的三种材料中,由于氧化铝非常硬,且加工 条件也不同,因此如果进行同时加工,加工面会变得粗糙,或者会产生碎 屑、毛刺多等问题,难以进行加工。例如,对于加工性不同的材料而言, 加工时容易产生阶梯差。即,有时柔软的材料隔着粘接层从刀具脱离并在 加工后复原,导致柔软的材料的层突出,或者有时柔软的材料被加工得较 多,导致坚硬的材料的层突出。例如,即使在实施了研磨处理的情况下, 在该研磨处理中也会因研磨量的差而产生阶梯差,且难以消除阶梯差。由 此可见,如果在与孔板60接合的接合面形成阶梯差,则在接合孔板60时 容易产生缝隙。与此相对,在本实施方式中,通过对顶板40和压电体30 使用加工特性接近的材料,并利用这些部分形成接合面,从而难以在接合 面产生较大的阶梯差,能够无缝隙地接合孔板60。另外,通过使基座20 的端面24从接合面81退避,能够消除与基座20的加工性相关的材料选 定的限制,且在基座20的材料选定上容易确保强度,因此能够实现喷墨 头10的薄型化及小型化。For example, among the three materials used in this embodiment, since alumina is very hard and the machining conditions are different, if simultaneous machining is performed, the machined surface will become rough, or there will be problems such as many chips and burrs, which is difficult to carry out. processing. For example, for materials with different workability, a level difference is likely to occur during processing. That is, the soft material may be detached from the tool via the adhesive layer and recovered after machining, causing the layer of the soft material to protrude, or the soft material may be processed more, and the layer of the hard material may protrude. For example, even when a polishing process is performed, a level difference occurs due to a difference in the amount of polishing in the polishing process, and it is difficult to eliminate the level difference. From this, it can be seen that if a step is formed in the joint surface to be joined to the
另外,在上述实施方式中,例如,通过采用可切削陶瓷,并在4~10 ×10-6/K之间选择热膨胀率,能够防止接合后的翘曲、变形。因此,即 使使用热固化性的粘接剂,也能够防止接合后的翘曲、变形,且在分断加 工时容易固定,从而容易加工。In addition, in the above-described embodiment, for example, by using machinable ceramics and selecting the thermal expansion coefficient between 4 and 10×10 −6 /K, warpage and deformation after joining can be prevented. Therefore, even if a thermosetting adhesive is used, warpage and deformation after joining can be prevented, and it is easy to fix at the time of the cutting process, so that it is easy to process.
进一步而言,在上述实施方式中,通过以使组装体的翘曲达到最小的 方式适当地选择可切削陶瓷的热膨胀率,能够使机械加工时向装置的吸附 等成为可能,且能够实现加工性更高的结构。例如,通过选定顶板40的 材料作为压电体30的热膨胀率与基座20的热膨胀率之间的材料,能够减 少组装体的翘曲。Furthermore, in the above-described embodiment, by appropriately selecting the thermal expansion coefficient of the machinable ceramics so as to minimize the warpage of the assembly, it is possible to enable adsorption to the device during machining and the like, and to achieve workability higher structure. For example, by selecting the material of the
另外,例如在制造工序中,对于接合后在基座上形成阶梯差的方法, 如果翘曲较多,则为了切除氧化铝,会与翘曲份量相应的切削较多的PZT, 这会导致孔板的接合面变小,但在上述实施方式中,通过设为翘曲较小的 结构,从而减少PZT的切削量,容易确保孔板的接合面。In addition, for example, in the manufacturing process, in the method of forming a step on the base after bonding, if there is a lot of warpage, in order to cut off the alumina, a large amount of PZT is cut corresponding to the amount of warpage, which leads to holes. The joint surface of the plate is reduced, but in the above-mentioned embodiment, by setting the structure with a small warpage, the cutting amount of the PZT is reduced, and the joint surface of the orifice plate can be easily secured.
[第二实施方式][Second Embodiment]
下面,参照图7对作为液体喷出装置的喷墨打印机100进行说明。喷 墨打印机100是使用了第一实施方式所涉及的喷墨头10的打印机。Next, the
喷墨打印机100是一边沿着预定的输送路径输送例如作为印刷介质的 纸张P一边进行图像形成等各种处理的装置。喷墨记录装置1具备机壳110、 作为纸张供给部的供纸盒111、作为排出部的排纸盘112、作为支承部的 保持辊(鼓)113、输送装置114以及翻转装置118。The
机壳110构成喷墨打印机100的外廓。供纸盒111设置于机壳110的 内部。排纸盘112设置于机壳110上部。保持辊(鼓)113将纸张P保持 在外表面上进行旋转。输送装置114沿着从供纸盒111通过保持辊113的 外周到达排纸盘112而形成的预定的输送路径A输送纸张P。翻转装置118 使从保持辊113剥离的纸张P的正反面翻转并再次供给到保持辊113的表面上。The
输送装置114具备沿着输送路径A设置的多个引导部件121至125、 多个输送用辊126至131。作为输送用辊,设置有拾取辊、供纸辊对、对 齐辊对、分离辊对、输送辊对以及排出辊对。这些输送用辊126至131由 输送用电机驱动而旋转,从而将纸张P沿着输送路径A向下游侧输送。The
在输送路径A的各处配置有用于监视纸张的输送状况的传感器S等。Sensors S etc. for monitoring the conveyance state of a sheet are arranged in various places of the conveyance path A. As shown in FIG.
保持辊113通过在其表面上保持纸张P的状态下进行旋转而输送纸张 P。保持辊113在与喷墨头10相对的位置支承作为印刷介质的纸张P。在 此,保持辊113通过在图7中顺时针方向旋转而将纸张P沿着外周向顺时 针方向输送。The holding
在保持辊113的外周部分从上游侧朝向下游侧依次设置有保持装置 115、图像形成装置116、除电剥离装置117以及清洁装置119。A holding
保持装置115具备按压辊115a以及带电辊115b。按压辊115a向保持 辊113的外表面按压。通过被供给电力,带电辊115b产生使纸张P吸附 于保持辊113的外表面的方向的静电力(带电)。通过该静电力,纸张P 被吸附于保持辊113。The holding
图像形成装置116具备与青色、品红色、黄色、黑色这四种颜色分别 对应的四个喷墨头10作为与保持辊113的外表面相对配置的多个(四种 颜色)喷墨头10。四个喷墨头10从以预定的间距(pitch)设置的喷嘴61 向纸张P喷出油墨,并在被保持于保持辊113的外表面的纸张P上形成图 像。作为各喷墨头10,使用在第一实施方式中说明的喷墨头10。The
除电剥离装置117具备对纸张P进行除电的除电辊、以及将纸张P从 保持辊113剥离的剥离爪。The static-removing
清洁装置119具备清洁部件,该清洁部件在与保持辊113接触的状态 下旋转,从而清洁保持辊113。The
翻转装置118翻转从保持辊113剥离的纸张P并将纸张P再次供给到 保持辊113的表面上。翻转装置118例如沿着使纸张P向前后方向反向转 向的预定的翻转路径引导纸张P而进行输送,使纸张P翻转。The
此外,喷墨打印机100具备作为控制器的CPU(中央控制装置)、存 储各种程序等的ROM、临时存储各种可变数据、图像数据等的RAM以 及输入来自外部的数据或向外部输出数据的I/F(接口)。In addition, the
例如,当用户指示打印机印刷时,喷墨打印机100的CPU向喷墨头 10的驱动电路输出印刷信号。由此,喷墨头10被驱动,从而在纸张P上 形成图像。For example, when the user instructs the printer to print, the CPU of the
在如上构成的喷墨打印机100中,也能够得到与上述第一实施方式同 样的效果。Also in the
需要说明的是,本发明并不限于上述实施方式的原样,在实施阶段, 能够在不脱离本发明的主旨的范围内对构成要素进行变形而加以实施。It should be noted that the present invention is not limited to the above-described embodiments as they are, and can be implemented by modifying constituent elements in an implementation stage without departing from the gist of the present invention.
例如,在上述实施方式中,作为喷墨头10的制造方法,示出了预先 在基座部分200上形成了构成阶梯差的狭缝的例子,但不限于此。例如, 如图8所示,基座部分200也可以构成为在整个长度上构成为连续的板状, 而非预先具有狭缝。在该情况下,在将压电体部分300粘贴于基座部分200 的第二方向中央部的表面一侧之后,以预定宽度从基座部分200的背面侧 研磨至预定深度,通过切削基座部分200和压电体部分300的一部分,形 成具有基座部分200的厚度以上的深度的槽83。之后,在通过该槽83的 宽度方向的中央的线C处,将压电结构体部分800切断为两个,从而形成 具有底座20的端面24从接合面81退避的阶梯差的两个压电结构体80。For example, in the above-described embodiment, as a method of manufacturing the
例如,喷墨头10的具体构成、包括流路的形状、基座20、压电体30、 顶板40、盖50以及孔板60在内的各种部件的构成、位置关系不限于上述 的例子,可以适当变更。另外,喷嘴61、压力室37的排列也不限于上述。 例如,也可以排列两列以上的喷嘴61。另外,也可以在多个压力室37之 间配置两个以上的虚拟室38。For example, the specific configuration of the
例如,喷出的液体不限于印字用的油墨,例如也可以是喷出包含用于 形成印刷布线基板的布线图案的导电性粒子的液体的装置等。For example, the liquid to be ejected is not limited to the ink for printing, and may be, for example, a device or the like that ejects a liquid containing conductive particles for forming a wiring pattern of a printed wiring board.
另外,在上述实施方式中,示出了喷墨头10用于喷墨记录装置1等 液体喷出装置的例子,但不限于此,例如也可以用于3D打印机、工业用 的制造机械以及医疗用途,能够实现小型轻量化及低成本化。In addition, in the above-described embodiment, the
根据以上说明的至少一个实施方式,能够提供加工性良好的液体喷出 头及液体喷出装置。According to at least one of the embodiments described above, it is possible to provide a liquid ejection head and a liquid ejection device with good workability.
此外,虽然对本发明的几个实施方式进行了说明,但这些实施方式只 是作为示例而提出的,并非旨在限定发明的范围。这些新的实施方式能够 以其他各种方式实施,在不脱离发明的主旨的范围内,能够进行各种省略、 替换、变更。这些实施方式或其变形包含于发明的范围或主旨中,并且包 含于权利要求书所记载的发明及其等同的范围中。Further, although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments or modifications thereof are included in the scope and spirit of the invention, and are included in the invention described in the claims and the scope of equivalents thereof.
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JP2021-044877 | 2021-03-18 | ||
JP2021044877A JP7570953B2 (en) | 2021-03-18 | 2021-03-18 | Liquid ejection head and liquid ejection device |
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EP (1) | EP4059722A1 (en) |
JP (1) | JP7570953B2 (en) |
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JP3759713B2 (en) * | 2001-11-27 | 2006-03-29 | シャープ株式会社 | Electrode connection structure of ink jet head and method of manufacturing ink jet head |
JP2003182080A (en) * | 2001-10-10 | 2003-07-03 | Sii Printek Inc | Ink jet head and its manufacturing method |
JP4396192B2 (en) | 2002-09-12 | 2010-01-13 | コニカミノルタホールディングス株式会社 | Inkjet recording head |
JP2004262146A (en) | 2003-03-03 | 2004-09-24 | Sharp Corp | Inkjet head and inkjet device |
JP2014177076A (en) * | 2013-03-15 | 2014-09-25 | Sii Printek Inc | Liquid jet head and liquid jet device |
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2021
- 2021-03-18 JP JP2021044877A patent/JP7570953B2/en active Active
- 2021-11-04 EP EP21206527.0A patent/EP4059722A1/en not_active Withdrawn
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EP4059722A1 (en) | 2022-09-21 |
JP7570953B2 (en) | 2024-10-22 |
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Application publication date: 20220927 |