CN115106300A - Chip detecting and sorting machine - Google Patents
Chip detecting and sorting machine Download PDFInfo
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- CN115106300A CN115106300A CN202210965405.3A CN202210965405A CN115106300A CN 115106300 A CN115106300 A CN 115106300A CN 202210965405 A CN202210965405 A CN 202210965405A CN 115106300 A CN115106300 A CN 115106300A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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Abstract
本发明公开一种芯片检测分选机,包括第一上料盘输送机构、第二上料盘输送机构、多个下料盘输送机构、料盘翻转机械手、分选机械手、第一视觉检测装置、第二视觉检测装置以及第三视觉检测装置;第一上料盘输送机构用于上料满载有芯片的料盘;第二上料盘输送机构用于上料空载的料盘;下料盘输送机构用于下料料盘;第一视觉检测装置及第二视觉检测装置对料盘上的芯片依次拍照检测;料盘翻转机械手用于翻转并转移料盘;分选机械手用于对芯片的底面拍照检测,并对芯片分选转移。本发明芯片检测分选机可通过视觉检测芯片正反面后自动分选下料,全自动化测试,降低了工人的劳动强度,提高生产效率。
The invention discloses a chip detection and sorting machine, comprising a first feeding tray conveying mechanism, a second feeding tray conveying mechanism, a plurality of unloading tray conveying mechanisms, a tray turning manipulator, a sorting manipulator, and a first visual inspection device , the second visual inspection device and the third visual inspection device; the first feeding tray conveying mechanism is used for feeding the tray full of chips; the second feeding tray conveying mechanism is used for feeding the empty tray; unloading The tray conveying mechanism is used to unload the tray; the first visual inspection device and the second visual inspection device take pictures and detect the chips on the tray in turn; the tray turning robot is used to turn over and transfer the tray; the sorting robot is used to check the chips The bottom surface of the chip is photographed and detected, and the chips are sorted and transferred. The chip detection and sorting machine of the invention can automatically sort and unload the chips after visual detection of the front and back sides of the chips, and fully automate the test, thereby reducing the labor intensity of workers and improving production efficiency.
Description
技术领域technical field
本发明涉及一种半导体检测分选机,尤其涉及一种通过视觉检测芯片正反面后自动分选下料的芯片检测分选机。The invention relates to a semiconductor detection and sorting machine, in particular to a chip detection and sorting machine for automatically sorting and blanking the front and back of a chip by visual inspection.
背景技术Background technique
由于半导体或芯片在生产过程存在个体差异,性能有高低,质量有好坏,外形有瑕疵分,因此,在生产过程中需要及时对芯片进行分选,从而为后续生产提供参考。然而,在现有技术中,半导体或芯片的测试及分选往往需要人工辅助,例如,需要工人将芯片放入检测机内,利用检测机检测,检测完成后又需要工人将芯片取出翻转或者放入新的芯片再检测。而在检测完成后又需要工人根据测度结果将芯片进行人工分类。因此,现有的这种方式自动化程度低、工人的工作强度大,生产效率比较低,不利于大批量生产。Since there are individual differences in the production process of semiconductors or chips, the performance is high or low, the quality is good or bad, and the appearance is defective. Therefore, the chips need to be sorted in time during the production process, so as to provide a reference for subsequent production. However, in the prior art, the testing and sorting of semiconductors or chips often requires manual assistance. For example, a worker is required to put the chip into a testing machine and use the testing machine to detect it. After the test is completed, the worker needs to take out the chip, turn it over or put it on the tester. Insert a new chip and test again. After the test is completed, workers are required to manually classify the chips according to the measurement results. Therefore, the existing method has a low degree of automation, high work intensity of workers, and low production efficiency, which is not conducive to mass production.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种通过视觉检测芯片正反面后自动分选下料的芯片检测分选机,其可实现全自动化检测,降低工人的劳动强度,提高生产效率。The purpose of the present invention is to provide a chip detection and sorting machine that automatically sorts and unloads the chips by visual inspection of the front and back sides, which can realize fully automatic detection, reduce labor intensity of workers, and improve production efficiency.
为了实现上述目的,本发明提供的芯片检测分选机包括第一上料盘输送机构、第二上料盘输送机构、多个下料盘输送机构、料盘翻转机械手、分选机械手、第一视觉检测装置、第二视觉检测装置以及第三视觉检测装置;所述第一上料盘输送机构、所述第二上料盘输送机构及多个所述下料盘输送机构依次并排地设置;所述第一上料盘输送机构用于上料满载有芯片的料盘;所述第二上料盘输送机构用于上料空载的料盘;所述下料盘输送机构用于下料满载有分选芯片的料盘;所述第一视觉检测装置及第二视觉检测装置沿输送方向依次设置于所述第一上料盘输送机构的中部上方,以对料盘上的芯片反面依次拍照检测;所述料盘翻转机械手横跨于所述第一上料盘输送机构、第二上料盘输送机构以及多个所述下料盘输送机构的端部上方,以将所述第一上料盘输送机构上的料盘翻转并转移到所述下料盘输送机构上,或者将所述第二上料盘输送机构的空料盘转移到所述下料盘输送机构上;所述第三视觉检测装置对翻转后的芯片正面进行拍照检测;所述分选机械手横跨于多个所述下料盘输送机构的上方;所述分选机械手包括分选手臂及第四视觉检测装置,以对芯片的正面拍照检测,并将芯片在多个所述下料盘输送机构的料盘之间分选转移。In order to achieve the above purpose, the chip detection and sorting machine provided by the present invention includes a first feeding tray conveying mechanism, a second feeding tray conveying mechanism, a plurality of unloading tray conveying mechanisms, a tray turning manipulator, a sorting manipulator, and a first feeding tray conveying mechanism. a visual inspection device, a second visual inspection device and a third visual inspection device; the first feeding tray conveying mechanism, the second feeding tray conveying mechanism and a plurality of the discharging tray conveying mechanisms are arranged side by side in sequence; The first feeding tray conveying mechanism is used for feeding a tray full of chips; the second feeding tray conveying mechanism is used for feeding an empty tray; the unloading tray conveying mechanism is used for unloading A tray fully loaded with sorting chips; the first visual inspection device and the second visual inspection device are sequentially arranged above the middle of the first feeding tray conveying mechanism along the conveying direction, so as to sequentially align the reverse sides of the chips on the tray Photo detection; the feeding tray turning manipulator straddles the ends of the first feeding tray conveying mechanism, the second feeding tray conveying mechanism and the plurality of unloading tray conveying mechanisms, so as to turn the first feeding tray conveying mechanism The feeding tray on the feeding tray conveying mechanism is turned over and transferred to the discharging tray conveying mechanism, or the empty tray of the second feeding tray conveying mechanism is transferred to the discharging tray conveying mechanism; the The third visual inspection device takes pictures and inspects the front of the flipped chip; the sorting manipulator straddles above the plurality of feeding tray conveying mechanisms; the sorting manipulator includes a sorting arm and a fourth visual inspection device , to take a picture of the front side of the chip for detection, and sort and transfer the chip among the multiple trays of the feeding tray conveying mechanism.
与现有技术相比,由于本发明通过设置第一上料盘输送机构对满载有芯片的料盘上料,然后在所述第一上料盘输送机构的中部设置第一视觉检测装置及第二视觉检测装置,利用所述第一视觉检测装置及第二视觉检测装置对料盘上的芯片的反面进行视觉检测,从而可以检测出各个芯片的差异。再通过并排地设置第二上料盘输送机构及多个上料盘输送机构,利用第二上料盘输送机构上空料盘,又利用所述料盘翻转机械手将满载芯片的料盘翻转后转移到所述下料盘输送机构上,最后利用所述第三视觉检测装置及第四视觉检测装置对芯片的正面进行检测并通过所述分选机械手将芯片分类并将不同类别的芯片转移到不同的下料盘输送机构上。因此,本发明芯片检测分选机无需人工进行检测及分类,整个过程从上料盘、检测、分选及下料均自动完成,自动化程度极高,极大地降低劳动强度,提高生产效率。Compared with the prior art, in the present invention, a first feeding tray conveying mechanism is arranged to feed a tray full of chips, and then a first visual detection device and a second visual inspection device are arranged in the middle of the first feeding tray conveying mechanism. Two visual detection devices, the first visual detection device and the second visual detection device are used to visually detect the reverse side of the chips on the tray, so as to detect the difference of each chip. Then, by arranging a second feeding tray conveying mechanism and a plurality of feeding tray conveying mechanisms side by side, the second feeding tray conveying mechanism is used to empty the feeding tray, and the tray turning manipulator is used to flip the feeding tray full of chips and transfer it. On the conveying mechanism of the unloading tray, finally use the third visual inspection device and the fourth visual inspection device to detect the front side of the chip, and classify the chips by the sorting robot and transfer the chips of different categories to different ones. on the unloading tray conveying mechanism. Therefore, the chip detection and sorting machine of the present invention does not need manual detection and classification, and the entire process from the feeding tray, detection, sorting and unloading is automatically completed, and the degree of automation is extremely high, which greatly reduces labor intensity and improves production efficiency.
较佳地,所述料盘翻转机械手包括基架、横向移动机构、移动支架、两竖向移动机构、抱盘气缸、爪手以及翻转治具,所述横向移动机构设置于所述基架上且输出端与所述移动支架连接,以驱动所述移动支架横向移动;其中一所述竖向移动机构设置于所述移动支架上且输出端与所述抱盘气盘连接,以驱动所述抱盘气缸竖向移动;所述抱盘气缸的输出端与所述爪手连接,以驱动使所述爪手抓取或释放所述料盘;另一所述竖向移动机构设置于所述移动支架上且输出端与所述翻转治具连接,所述翻转治具可驱使所述料盘翻转。通过设置所述抱盘气缸及爪手,利用所述抱盘气缸驱动爪手可以对空料盘快速地夹持并放置于翻转治具上,又再利用所述翻转治具对空料盘进行翻转,从而可以使得空料盘翻转180度,之后再利用抱盘气缸及爪手将翻转后的空料盘放置于装载有芯片的料盘上,然后使空料盘及载有芯片的料盘同时再次翻转,从而可以使得芯片从一料盘转移到另一料盘上并实现正反面翻转,达到自动翻转的目的,自动化程度高,有效降低劳动强度。Preferably, the material tray turning manipulator includes a base frame, a lateral moving mechanism, a moving bracket, two vertical moving mechanisms, a tray-holding cylinder, a claw hand and a turning fixture, and the lateral moving mechanism is arranged on the base frame. And the output end is connected with the moving support to drive the moving support to move laterally; wherein one of the vertical moving mechanisms is arranged on the moving support and the output end is connected with the holding plate air plate to drive the The pan-holding cylinder moves vertically; the output end of the pan-holding cylinder is connected with the claw hand to drive the claw hand to grab or release the material tray; another vertical movement mechanism is arranged on the The output end of the moving bracket is connected with the turning jig, and the turning jig can drive the material tray to turn over. By arranging the holding plate cylinder and the claw hand, the empty material plate can be quickly clamped and placed on the overturning jig by using the holding plate cylinder to drive the claw hand, and then the empty material plate can be clamped by the overturning fixture. Turn over, so that the empty tray can be turned 180 degrees, and then use the holding cylinder and the claw to place the flipped empty tray on the tray loaded with chips, and then make the empty tray and the tray loaded with chips. At the same time, it is turned over again, so that the chips can be transferred from one tray to another, and the front and back sides can be flipped to achieve the purpose of automatic flipping. The degree of automation is high and the labor intensity is effectively reduced.
具体地,所述翻转治具包括基板、分盘气缸、下板、下板气缸、压紧气缸及旋转装置,所述基板呈中间镂空的框架结构,所述分盘气缸设置于所述基板上表面的相对两侧,所述下板分别设置于所述基板下底面的相对两侧,所述下板气缸设置于所述下板与所述基板之间,以驱动所述下板靠近或远离所述基板的中部;所述压紧气缸设置于所述基板与所述下板之间,以驱动所述下板靠近或远离所述基板的底面。通过利用上板472紧料盘,再利用所述旋转装置进行翻转,使得空料盘实现正反面翻转,又通过设置下板及下板气缸,可以使得两反向叠置的料盘能承载于所述翻转治具上,从而可以通过所述分盘气缸以及压紧气缸将两反向叠置的料盘定位并压紧,进而使得芯片能准确地从一料盘转移到另一料盘上,实现自动翻转。Specifically, the overturning fixture includes a base plate, a plate dividing cylinder, a lower plate, a lower plate cylinder, a pressing cylinder and a rotating device, the base plate has a frame structure with a hollow in the middle, and the plate dividing cylinder is arranged on the base plate On opposite sides of the surface, the lower plates are respectively arranged on opposite sides of the lower bottom surface of the base plate, and the lower plate cylinder is arranged between the lower plate and the base plate to drive the lower plate to approach or move away from The middle part of the base plate; the pressing cylinder is arranged between the base plate and the lower plate to drive the lower plate to approach or move away from the bottom surface of the base plate. By using the
具体地,所述翻转治具还包括上板及上板气缸,所述上板分别设置于所述基板上表的相对两侧,所述上板气缸设置于所述上板与所述基板之间,以驱动所述上板靠近或远离所述基板的中部。Specifically, the turning fixture further includes an upper plate and an upper plate cylinder, the upper plates are respectively arranged on opposite sides of the upper surface of the base plate, and the upper plate cylinders are arranged between the upper plate and the base plate to drive the upper plate closer to or away from the middle of the base plate.
具体地,所述下板上设有滑块、所述基板上设有滑轨,所述滑块与所述滑轨滑动地配合;所述滑块上设有导向柱、所述下板滑动地设置于所述导向柱,所述下板与所述滑块之间设有弹性件,以提供一使所述下板远离所述滑块的弹性力。通过在所述滑块上设置导向柱,并在所述下板与所述滑块之间设有弹性件,从而可以使得所述下板自动远离所述基板,并配合所述压紧气缸,进而可以将使两料盘自动相互压紧或自动释放。Specifically, the lower plate is provided with a sliding block, the base plate is provided with a sliding rail, and the sliding block is slidably matched with the sliding rail; the sliding block is provided with a guide column, and the lower plate slides is arranged on the guide post, and an elastic member is arranged between the lower plate and the sliding block to provide an elastic force to keep the lower plate away from the sliding block. By arranging a guide column on the slider and an elastic member between the lower plate and the slider, the lower plate can be automatically moved away from the base plate and cooperate with the pressing cylinder, Then, the two material trays can be automatically pressed against each other or automatically released.
具体地,所述翻转治具还包括震盘气缸,所述震盘气缸设置于所述基板上,以使所述料盘震动。设置所述震盘气缸,其可以在芯片从一料盘翻转到另一料盘的过程中对料盘生产震动,进而避免芯片因粘附于料盘上而无法翻转,有效提高芯片翻转的成功率。Specifically, the overturning fixture further includes a disc vibration cylinder, and the disc vibration cylinder is arranged on the base plate to vibrate the material disc. The vibration plate cylinder is provided, which can vibrate the plate during the process of flipping the chips from one plate to another, so as to prevent the chips from sticking to the plate and cannot be turned over, effectively improving the success of chip turnover Rate.
具体地,所述压紧气缸的输出端连接有压板,所述压板延伸到两所述下板的底面,以在压紧时通过所述压板推动所述下板靠近所述基板。通过设置于所述压板可以利用一压紧气缸同时压紧两所述下板,有效减少所述压紧气缸的数量,使结构更加简化。Specifically, a pressing plate is connected to the output end of the pressing cylinder, and the pressing plate extends to the bottom surfaces of the two lower plates, so as to push the lower plates to approach the base plate through the pressing plates during pressing. By being arranged on the pressing plate, one pressing cylinder can simultaneously press the two lower plates, thereby effectively reducing the number of the pressing cylinders and simplifying the structure.
较佳地,所述第一视觉检测装置包括第一支架、第一横向驱动机构、第一平台、第一竖向驱动机构及第一相机,所述第一横向驱动机构设置于所述第一支架上,且输出端与所述第一平台连接,以驱动所述第一平台带动所述第一相机沿横向滑动;所述第一竖向驱动机构设置于所述第一平台上且输出端与所述第一相机连接,以驱动所述第一相机靠近或远离所述料盘。这样可以使得所述第一相机能对料盘上的各个芯片进行有效检测,避免出现漏检。Preferably, the first visual inspection device includes a first bracket, a first lateral drive mechanism, a first platform, a first vertical drive mechanism and a first camera, and the first lateral drive mechanism is arranged on the first on the bracket, and the output end is connected with the first platform to drive the first platform to drive the first camera to slide laterally; the first vertical drive mechanism is arranged on the first platform and the output end connected with the first camera to drive the first camera to approach or move away from the tray. In this way, the first camera can effectively detect each chip on the tray to avoid missed detection.
较佳地,所述第二视觉检测装置包括第二支架、第二横向驱动机构、第二平台、第二竖向驱动机构及第二相机,所述第二横向驱动机构设置于所述第二支架上,且输出端与所述第二平台连接,以驱动所述第二平台带动所述第二相机沿横向滑动;所述第二竖向驱动机构设置于所述第二平台上且输出端与所述第二相机连接,以驱动所述第二相机靠近或远离所述料盘;所述第二相机的数量为至少二个。这样可以使得所述第二相机能对料盘上的各个芯片进行有效检测,避免出现漏检。Preferably, the second visual inspection device includes a second bracket, a second lateral drive mechanism, a second platform, a second vertical drive mechanism and a second camera, and the second lateral drive mechanism is arranged on the second on the bracket, and the output end is connected with the second platform to drive the second platform to drive the second camera to slide laterally; the second vertical drive mechanism is arranged on the second platform and the output end connected with the second camera to drive the second camera close to or away from the material tray; the number of the second camera is at least two. In this way, the second camera can effectively detect each chip on the tray to avoid missed detection.
较佳地,所述第一上料盘输送机构、第二上料盘输送机构及所述下料盘输送机构的结构相同;所述第一上料盘输送机构包括轨道槽、料盘堆叠夹具、分盘机构、夹盘机构、夹盘驱动机构及顶升机构,所述夹盘机构滑动地设置于所述轨道槽内,所述夹盘驱动机构设置于所述轨道槽并驱动所述夹盘机构沿所述轨道槽移动;所述料盘堆叠夹具设置于所述轨道槽的输入端的上方并可将料盘层叠地设置,所述分盘机构设置于所述轨道槽上且位于所述料盘堆盘夹具的底部,以将依次位于最低层的一个料盘分离;所述顶升机构设置于所述轨道槽的下方,且位于所述料盘堆叠夹具的下方,以驱使所述料盘在所述料盘堆叠夹具及所述夹盘机构之间转移。通过设置分盘机构,可以将所述料盘堆叠夹具内位于最低层的料盘与其他料盘分离,进而可以利用所述顶升机构将该料盘下降到所述夹盘机构上。又通过在轨道槽内设置夹盘驱动机构,使得所述夹盘机构可以沿轨道槽方向移动,因此,利用所述夹盘机构夹持料盘,可以使料盘实现直线移动输出,从而将能料盘依次输送到视觉检测装置以及所述料盘机械手上,实现自动检测、自动上料盘以及自动转移料盘的目的,自动化程度高。Preferably, the first feeding tray conveying mechanism, the second feeding tray conveying mechanism and the unloading tray conveying mechanism have the same structure; the first feeding tray conveying mechanism includes a rail groove, a tray stacking fixture. , Disk mechanism, chuck mechanism, chuck drive mechanism and lift mechanism, the chuck mechanism is slidably arranged in the track groove, the chuck drive mechanism is arranged in the track groove and drives the clamp The tray mechanism moves along the track slot; the tray stacking fixture is arranged above the input end of the track slot and can stack the trays, and the disc dividing mechanism is arranged on the track slot and located in the The bottom of the tray stacking fixture to separate a tray located at the lowest level in sequence; the lifting mechanism is arranged below the track groove and below the tray stacking fixture to drive the material The trays are transferred between the tray stacking fixture and the chuck mechanism. By setting the tray dividing mechanism, the tray at the lowest level in the tray stacking fixture can be separated from other trays, and then the tray can be lowered onto the chuck mechanism by the lifting mechanism. And by setting the chuck drive mechanism in the track groove, the chuck mechanism can move in the direction of the track groove. Therefore, by using the chuck mechanism to clamp the material plate, the material plate can be moved and output in a straight line, so that the energy The material trays are conveyed to the visual inspection device and the material tray manipulator in turn to achieve the purpose of automatic detection, automatic feeding of the material trays and automatic transfer of the material trays, with a high degree of automation.
附图说明Description of drawings
图1是本发明芯片检测分选机的立体图。FIG. 1 is a perspective view of the chip detection and sorting machine of the present invention.
图2是本发明芯片检测分选机的俯视图。FIG. 2 is a top view of the chip detection and sorting machine of the present invention.
图3是本发明芯片检测分选机的第一上料盘输送机构的立体图。3 is a perspective view of the first feeding tray conveying mechanism of the chip detection and sorting machine of the present invention.
图4是本发明芯片检测分选机的第一上料盘输送机构的俯视图。4 is a top view of the first feeding tray conveying mechanism of the chip detection and sorting machine of the present invention.
图5是本发明芯片检测分选机的第一上料盘输送机构的侧视图。5 is a side view of the first feeding tray conveying mechanism of the chip detection and sorting machine of the present invention.
图6是本发明第一上料盘输送机构的夹盘机构的结构图。6 is a structural diagram of the chuck mechanism of the first feeding tray conveying mechanism of the present invention.
图7是本发明第一上料盘输送机构的分盘机构的结构图。FIG. 7 is a structural diagram of the disc dividing mechanism of the first feeding tray conveying mechanism of the present invention.
图8是本发明芯片检测分选机的料盘翻转机械手的立体图。FIG. 8 is a perspective view of the tray turning manipulator of the chip detection and sorting machine of the present invention.
图9是本发明芯片检测分选机的料盘翻转机械手的抱盘气缸及翻转治具的立体图。FIG. 9 is a perspective view of the tray holding cylinder and the inversion jig of the tray inversion manipulator of the chip detection and sorting machine of the present invention.
图10是本发明芯片检测分选机的料盘翻转机械手的翻转治具的立体图。FIG. 10 is a perspective view of a turning jig of a tray turning manipulator of the chip detection and sorting machine of the present invention.
图11是本发明芯片检测分选机的料盘翻转机械手的翻转治具的主视图。FIG. 11 is a front view of the flipping fixture of the tray flipping manipulator of the chip detection and sorting machine of the present invention.
图12是本发明芯片检测分选机的料盘翻转机械手的翻转治具的侧视图。FIG. 12 is a side view of the turning fixture of the tray turning manipulator of the chip detection and sorting machine of the present invention.
图13是图11中A部分的放大图。FIG. 13 is an enlarged view of part A in FIG. 11 .
图14是本发明芯片检测分选机的第一视觉检测装置及第二视觉检测装置的立体图。14 is a perspective view of the first visual inspection device and the second visual inspection device of the chip inspection and sorting machine of the present invention.
图15是本发明芯片检测分选机的第一视觉检测装置及第二视觉检测装置的俯视图。15 is a top view of the first visual inspection device and the second visual inspection device of the chip inspection and sorting machine of the present invention.
图16是本发明芯片检测分选机的第三视觉检测装置和分选机械手的立体图。16 is a perspective view of the third visual inspection device and the sorting robot of the chip inspection and sorting machine of the present invention.
图17是本发明芯片检测分选机的第三视觉检测装置和分选机械手的另一立体图。17 is another perspective view of the third visual inspection device and the sorting robot of the chip inspection and sorting machine of the present invention.
图18是本发明芯片检测分选机的分选机械手的分选手臂的结构图。18 is a structural diagram of the sorting arm of the sorting robot of the chip detection and sorting machine of the present invention.
具体实施方式Detailed ways
为详细说明本发明的技术内容、构造特征、所实现的效果,以下结合实施方式并配合附图详予说明。In order to describe in detail the technical content, structural features, and achieved effects of the present invention, detailed descriptions are given below with reference to the embodiments and the accompanying drawings.
如图1、图2及图16所示,本发明的芯片检测分选机100包括第一上料盘输送机构1、第二上料盘输送机构2、多个下料盘输送机构3、料盘翻转机械手 4、分选机械手5、第一视觉检测装置6、第二视觉检测装置7以及第三视觉检测装置52;所述第一上料盘输送机构1、所述第二上料盘输送机构2及多个所述下料盘输送机构3依次并排地设置;所述第一上料盘输送机构1用于上料满载有芯片的料盘;所述第二上料盘输送机构2用于上料空载的料盘;所述下料盘输送机构3用于下料满载有分选芯片的料盘;所述第一视觉检测装置6及第二视觉检测装置7沿输送方向依次设置于所述第一上料盘输送机构1的中部上方,以对料盘上的芯片反面依次拍照检测;所述料盘翻转机械手4横跨于所述第一上料盘输送机构1、第二上料盘输送机构2以及多个所述下料盘输送机构3 的端部上方,以将所述第一上料盘输送机构1上的料盘翻转并转移到所述下料盘输送机构3上,或者将所述第二上料盘输送机构2的空料盘转移到所述下料盘输送机构3上;所述第三视觉检测装置52对翻转后的芯片正面进行拍照检测;所述分选机械手5横跨于多个所述下料盘输送机构3的上方;所述分选机械手5 包括分选手臂51及第四视觉检测装置53,以对芯片的正面拍照检测,并将芯片在多个所述下料盘输送机构3的料盘之间分选转移。As shown in FIG. 1 , FIG. 2 and FIG. 16 , the chip detection and sorting machine 100 of the present invention includes a first feeding tray conveying mechanism 1 , a second feeding tray conveying mechanism 2 , a plurality of unloading tray conveying mechanisms 3 , Tray turning manipulator 4, sorting manipulator 5, first visual inspection device 6, second visual inspection device 7 and third visual inspection device 52; the first feeding tray conveying mechanism 1, the second feeding tray conveying The mechanism 2 and a plurality of the feeding tray conveying mechanisms 3 are arranged side by side in sequence; the first feeding tray conveying mechanism 1 is used for feeding a tray full of chips; the second feeding tray conveying mechanism 2 is used for feeding The unloading tray conveying mechanism 3 is used to unload the tray fully loaded with sorting chips; the first visual inspection device 6 and the second visual inspection device 7 are arranged in sequence along the conveying direction Above the middle of the first feeding tray conveying mechanism 1, the reverse side of the chips on the feeding tray is photographed and detected in sequence; the feeding tray turning manipulator 4 straddles the first feeding tray conveying mechanism 1, the second Above the ends of the feeding tray conveying mechanism 2 and a plurality of the feeding tray conveying mechanisms 3 , the feeding trays on the first feeding tray conveying mechanism 1 are turned over and transferred to the feeding tray conveying mechanism 3 or transfer the empty tray of the second feeding tray conveying mechanism 2 to the unloading tray conveying mechanism 3; the third visual inspection device 52 takes pictures and detects the front of the flipped chip; the The sorting manipulator 5 straddles the top of the plurality of said unloading tray conveying mechanisms 3; the sorting manipulator 5 includes a sorting arm 51 and a fourth visual inspection device 53 to take pictures of the front of the chip and detect it, and the chip Sorting and transferring among the multiple trays of the unloading tray conveying mechanism 3 .
请参阅图3至图7,所述第一上料盘输送机构1包括轨道槽11、料盘堆叠夹具12、分盘机构13、夹盘机构14、夹盘驱动机构15及顶升机构16,所述夹盘机构14滑动地设置于所述轨道槽11内,所述夹盘驱动机构15设置于所述轨道槽11并驱动所述夹盘机构14沿所述轨道槽11移动;所述夹盘驱动机构15 包括伺服电机151及皮带152,所述电机设置于所述轨道槽11外底部,所述伺服电机151的输出端连接于皮带轮,所述皮带152围绕于两皮带轮之间,以使得所述皮带152设置于所述轨道槽11内并被所述伺服电机151驱动运行。所述皮带152沿所述轨道槽11的延伸方向设置。所述料盘堆叠夹具12设置于所述轨道槽11的输入端的上方并可将料盘层叠地设置。具体地,所述料盘堆叠夹具12具有四个呈直角的限位柱121,所述限位柱121为直角钢,所述限位柱121 分布于四个角处形成与所述料盘外形相同的四方形空间,料盘即可依次堆叠于所述限位柱121围成的空间内。所述分盘机构13设置于所述轨道槽11上且位于所述料盘堆盘夹具12的底部两侧,以将依次位于最低层的一个料盘分离。所述分盘机构13包括分盘气缸131以及分盘插板132,所述分盘气缸131的输出端与所述分盘插板132连接,以驱动所述分盘插板132伸缩。所述顶升机构16 设置于所述轨道槽11的下方,且位于所述料盘堆叠夹具12的下方,以驱使所述料盘在所述料盘堆叠夹具12及所述夹盘机构14之间转移。通过设置分盘机构13,可以将所述料盘堆叠夹具12内位于最低层的料盘与其他料盘分离,进而可以利用所述顶升机构16将该料盘下降到所述夹盘机构14上。又通过在轨道槽11内设置夹盘驱动机构15,使得所述夹盘机构14可以沿轨道槽11方向移动,因此,利用所述夹盘机构14夹持料盘,可以使料盘实现直线移动输出,从而能将料盘输送到视觉检测装置以及所述料盘翻转机械手4上,实现自动检测、自动上料盘以及自动转移料盘的目的,自动化程度高。所述顶升机构16包括顶升电机161以及顶升板162,所述顶升电机161设置于所述轨道槽11的下方且输出端朝向上,所述顶升板162连接于所述顶升电机161的输出端。所述顶升电机161为步进丝杆电机,电机上自带丝杆螺母,通过丝杆驱动螺母可以带动所述机耕升板162升降。Please refer to FIGS. 3 to 7 , the first feeding
再如图6所示,所述夹盘机构14包括座体141、前夹盘气缸142及后夹盘气缸143,所述座体141连接于所述夹盘驱动机构15的输出端且可滑动地设置于所述轨道槽11内。所述前夹盘气缸142设置于所述座体141的一端且输出端向上伸出于所述座体141,所述后夹盘气缸143设置于所述座体141的另一端且输出端伸出横向伸出,所述后夹盘气缸143的输出端还连接有夹块1431,所述夹块1431向上伸出于所述座体141,以与所述前夹盘气缸142的输出端共同夹持料盘。通过设置前夹盘气缸142及后夹盘气缸143,可以使得所述料盘能稳固定地定位于所述座体141,保证夹盘机构14在移动所述料盘不会发生移位,提高料盘输送及定位的准确性。As shown in FIG. 6 , the
另外,再如图3及图4所示,所述轨道槽11正对所述料盘堆叠夹具12的一侧设有感应装置(图中未标出),以检测所述料盘堆叠夹具12内是否有料盘。所述轨道槽11正对两视觉检测装置的一侧设有感应装置(图中未标出),以检测视觉检测装置上是否有料盘。所述轨道槽11上设有限高检测装置8,所述限高检测装置8为限高光纤,以检测所述料盘上的芯片是高度是否超出设定值。所述轨道槽11远离所述料盘堆叠夹具12的一侧设有感应装置,检测轨道槽11 的该端是否有料盘。In addition, as shown in FIGS. 3 and 4 , a sensing device (not shown in the figure) is provided on the side of the
再请参阅图3至图5,所述第一上料盘输送机构1、第二上料盘输送机构2 及所述下料盘输送机构3的结构基本相同。不同点在于,所述第一上料盘输送机构11及第二上料盘输送机构2是先将料盘堆叠于所述料盘堆叠夹具12上,再通过分盘机构13将低层的料盘分离,然后利用顶升机构16将料盘放置于夹盘机构14上,最后通过夹盘驱动机构15驱动夹盘机构14移动,实现料盘的上料输出。而所述下料盘输送机构3的动作则与上述相反。其是在夹盘机构14接收到料盘后,通过夹盘驱动机构15驱动夹盘机构14移动,将料盘转移到所述料盘堆叠夹具12的下方,再通过顶升机构16将料盘顶升到所述料盘堆叠夹具 12的底部,使得料盘与所述料盘堆叠夹具12上的其他料盘堆叠在一起,最后利用所述分盘机构13将该料盘支撑起来,使得所述顶升机构16可以离开,进而将料盘一一都堆放到料盘堆叠夹具12上。在本实施例中,所述第一上料盘输送机构1具两组夹盘机构14、夹盘驱动机构15,分别设置于所述轨道槽11内的相对两侧,这样可以使所述夹盘机构14能错开地输送所述料盘,提高输送的效率。另外,上料盘输送机构1还包括缓存顶升机构17及缓存支撑块18,所述缓存顶升机构17位于所述轨道槽11远离所述上下料区的一端的下方,所述缓存支撑块18设置于所述轨道槽11远离所述料盘堆叠夹具12的一端上,所述缓存支撑块18在受到所述料盘的向上顶推后可向上翻转而避让料盘,当料盘上升到位后又可自动向下翻转而阻挡料盘下落。因此当料盘来料过多而分选不过来时,所述缓存顶升机构17及缓存支撑块18可以承接这些料盘,并使这些料盘堆叠起来。Referring again to FIGS. 3 to 5 , the structures of the first feeding
如图8至图13所示,所述料盘翻转机械手4包括基架41、横向移动机构 42、移动支架43、两竖向移动机构44、48、抱盘气缸45、爪手46以及翻转治具47,所述横向移动机构42设置于所述基架41上且输出端与所述移动支架43 连接,以驱动所述移动支架43横向移动。其中一所述竖向移动机构44设置于所述移动支架43上且输出端与所述抱盘气盘连接,以驱动所述抱盘气缸45竖向移动。所述抱盘气缸45的输出端与相对两侧的所述爪手46连接,以驱动使所述爪手46抓取或释放所述料盘。另一所述竖向移动机构48设置于所述移动支架43上且输出端与所述翻转治具47连接以驱动翻转治具47升降,所述翻转治具47可驱使所述料盘翻转。通过设置所述抱盘气缸45及爪手46,利用所述抱盘气缸45驱动爪手46可以对空料盘快速地夹持并放置于翻转治具47上,又再利用所述翻转治具47对空料盘进行翻转,从而可以使得空料盘翻转180度,之后再利用抱盘气缸45及爪手46将翻转后的空料盘放置于装载有芯片的料盘上,然后使空料盘及载有芯片的料盘同时再次翻转,从而可以使得芯片从一料盘转移到另一料盘上并实现正反面翻转,达到自动翻转的目的,自动化程度高,有效降低劳动强度。As shown in FIGS. 8 to 13 , the
请参阅图10至图12,所述翻转治具47包括基板471、上板472、上板气缸 473、分盘气缸474、下板475、下板气缸476、旋转装置478及压紧气缸479,所述基板471呈中间镂空的框架结构,所述上板472分别设置于所述基板471 上表面的相对两侧,所述上板气缸473设置于所述上板472与所述基板471之间,以驱动所述上板472靠近或远离所述基板471的中部;所述分盘气缸474 连接于所述基板471。所述分盘气缸474分布于所述基板471上表面的相对两侧。所述下板475分别设置于所述基板471下底面的相对两侧,所述下板气缸476 设置于所述下板475与所述基板471之间,以驱动所述下板475靠近或远离所述基板471的中部。所述压紧气缸479设置于所述基板471与所述下板475之间,以驱动所述下板475靠近或远离所述基板471的底面。通过利用所述上板 472和下板475夹紧料盘,再利用所述旋转装置478进行翻转,使得空料盘实现在正反面之间翻转,又通过设置下板475及下板气缸476,可以使得两反向叠置的料盘能承载于所述翻转治具47上,通过压紧气缸479将两反向叠置的料盘定位并压紧,进而使得芯片能准确地从一料盘转移到另一料盘上,实现自动翻转。Please refer to FIGS. 10 to 12 , the
再请参阅图10至图12,具体地,所述上板475的一侧两端设有滑块,所述基板471朝向所述上板的一侧设有滑轨,所述下板475的一侧两端上设有滑块 4751、所述基板471朝向所述下板475的一侧两端上设有滑轨4711,所述滑块 4751与所述滑轨4711滑动地配合,从而使得两所述下板475能向所述基板471 的中部靠拢或远离所述基板471的中部;所述滑块4751上设有导向柱4752、所述下板475滑动地设置于所述导向柱4752,所述下板475与所述滑块4751之间设有弹性件4753,以提供一使所述下板475远离所述滑块4751的弹性力,所述有弹性件4753为压缩弹簧。通过在所述滑块4751上设置导向柱4752,并在所述下板475与所述滑块4751之间设有弹性件4753,从而可以使得所述下板475 自动远离所述基板471,并配合所述压紧气缸479,进而可以将使两料盘自动相互压紧或自动释放。Please refer to FIG. 10 to FIG. 12 again. Specifically, the
所述翻转治具47还包括震盘气缸(图中未示),所述震盘气缸设置于所述基板471上,所述震盘气缸的输出端朝向所述基板471的中部伸出,从而可以与所述料盘接触,以使所述料盘震动。设置所述震盘气缸,其可以在芯片从一料盘翻转到另一料盘的过程中对料盘产生震动,进而避免芯片因粘附于料盘上而无法翻转,有效提高芯片翻转的成功率。The overturning
再如图13所示,所述压紧气缸479的输出端连接有压板4791,所述压板 4791延伸到两所述下板475的底面,以在压紧时通过所述压板4791推动所述下板475靠近所述基板471。通过设置于所述压板4791可以利用一压紧气缸479 同时压紧两所述下板475,有效减少所述压紧气缸479的数量,使结构更加简化。As shown in FIG. 13 , a
请参阅图14及图15,所述第一视觉检测装置6包括第一支架61、第一横向驱动机构62、第一平台63、第一竖向驱动机构64及第一相机65,所述第一横向驱动机构62设置于所述第一支架61上,且输出端与所述第一平台63连接,以驱动所述第一平台63沿横向滑动;所述第一竖向驱动机构64设置于所述第一平台63上且输出端与所述第一相机65连接,以驱动所述第一相机65靠近或远离所述料盘。所述第一相机65为2D相机。这样可以使得所述第一相机65能对料盘上的各个芯片进行有效检测,避免出现漏检。Please refer to FIG. 14 and FIG. 15 , the first
再请参阅图14及图15,所述第二视觉检测装置7包括第二支架71、第二横向驱动机构72、第二平台73、第二竖向驱动机构74及第二相机75,所述第二横向驱动机构72设置于所述第二支架71上,且输出端与所述第二平台73连接,以驱动所述第二平台73沿横向滑动;所述第二竖向驱动机构74设置于所述第二平台73上且输出端与所述第二相机75连接,以驱动所述第二相机75靠近或远离所述料盘;所述第二相机75为3D相机。所述第二相机75的数量为至少二个。这样可以使得所述第二相机75能对料盘上的各个芯片进行有效检测,避免出现漏检。本发明所述第一视觉检测装置6及第二视觉检测装置7为相邻设置,因此,所述第一支架61及第二支架71可以组成一体结构。14 and 15 again, the second
如图16至图18所示,所述分选手臂51包括第三支架511、第三横向驱动机构512、第三平台513、第三竖向驱动机构514、变距机构515、气缸516及吸嘴517,所述第三横向驱动机构512设置于所述第三支架511上并驱动所述第三平台513横向移动。所述第三竖向驱动机构514设置于所述第三平台513上并驱动的变距机构515竖向移动,所述变距机构515可驱动所述气缸516及吸嘴517调整与相邻的吸嘴517的间距。所述气缸516设置于所述变距机构515 的输出端且输出端与所述吸嘴517连接。所述第四视觉检测装置53设置于所述第三平台513上,以跟随所述第三平台513滑动,并可对翻转后的芯片拍照检测,所述第四视觉检测装置53为3D相机。所述变距机构515包括变距电机(图中未示)、安装架、驱动板及安装架体,所述安装架连接于所述第三竖向驱动机构514的输出端,所述变距电机设置于所述安装架上且输送端与所述驱动板连接,所述驱动板呈竖向滑动地设置于所述安装架上且侧面设有多个向外辐射的导轨;所述安装架体呈横向滑动地设置于所述安装架上且一端滑动地所述导轨配合。所述气缸设置于所述安装架体上。所述变距电机驱动所述驱动板竖向移动,以使得所述安装架体相互远离或靠拢。由于不同种类的料盘上的芯片的排列间距可能存在不同,因此,利用所述变距机构515可以夹取不同排列间距的芯片,从而使得分选机械手5能适应该各种不同的料盘,提高使用的便利性。所述第三视觉检测装置52设置于所述第三支架511的另一端,所述第三视觉检测装置52上还设有第四横向驱动机构521,所述第四横向驱动机构521设置于所述第三支架511上并可驱动所述第三视觉检测装置52横向移动。所述第三视觉检测装置52为2D相机。As shown in FIG. 16 to FIG. 18 , the sorting
综合上述并结合上述附图,下面对所述料盘翻转机械手4翻转料盘的工作原理进行描述:Summarizing the above and in conjunction with the above-mentioned accompanying drawings, the working principle of turning the feeding tray by the feeding
在初始状态时,所述震盘气缸,下板气缸476,分盘气缸474)气缸缩回,其余气缸伸出;上板472在上方。当需要翻转料盘时,首先竖向移动机构44带动爪手46下降至空料盘位上,抱盘气缸45带动爪手46抱住一个空料盘然后上升;同时上板气缸473带上板472合拢;分盘气缸474伸出使料盘位于上层。然后分盘气缸474驱使爪手46打开,竖向移动机构44上升;同时爪手46上升离开。这时,空料盘夹持于翻转治具47上。之后,旋转装置478带动翻转治具47翻转,使得空料盘翻转180°。然后,所述竖向移动机构44驱动爪手46下降,爪手46抱住翻转后的空料盘,然后分盘气缸474缩回,爪手46带动空料盘放回空料盘原来的位置上。然后,所述竖向移动机构44上升,旋转装置478 复位。之后,所述爪手46下降再次把空料盘抓取并放至于翻转治具47的上层。横向移动机构42带动翻转治具47移至满载的料盘的上方。然后,爪手46手上的空料盘放置于满载的料盘的上方使两料盘叠置。之后,爪手46下降抓取两个料盘上升(上方为空料盘,下方为满载的料盘);这时,下板气缸476和分盘气缸474伸出,使得下板475伸出托住下方的料盘,分盘气缸474夹住上方的料盘,同时,压紧气缸479带动压板4791,使得压板4791抵顶下板475,最后下板475压紧两个料盘。之后,爪手46松开上升避让,旋转装置478带动治具翻转,使得两料盘翻转180°。这时,满载的料盘位于上方,空料盘位于下方,同时,震盘气缸震动敲击料盘,使得芯片从上方满载的料盘翻转到下方的空料盘上(芯片的底面向下),最后,爪手46下降抱住两料盘,压紧气缸479松开,然后下板475打开,爪手46带动满载的料盘下降放入下料盘输送机构3上。In the initial state, the shock plate cylinder, the
结合上述附图,下面对本发明芯片检测分选机100的工作原理进行描述,如下:With reference to the above drawings, the working principle of the chip detection and sorting
首先,人工将满载芯片的料盘(芯片的底面向上)放置于所述第一上料盘输送机构1的料盘堆叠夹具12,又将空载的料盘放置于所述第二上料盘输送机构2上。之后,所述顶升机构16顶升并承载所述料盘,而所述分盘机构13收缩脱离料盘。然后,所述顶升机构16向下移动一个料盘的高度的距离。这时,所述分盘机构13的分盘气缸474伸出,所述分盘插板插入到最低层以及其上一层的料盘之间,使得最低层的料盘与上一层的料盘分离。此时,所述顶升机构 16带动最低层的料盘下降并使料盘承载于所述座体上,这时,所述前夹盘气缸及所述后夹盘气缸依次伸出,将料盘夹持定位。所述夹盘驱动机构15即可驱动所述夹盘机构14沿所述轨道槽11向另一端移动。当依次移动到所述第一视觉检测装置6及第二视觉检测装置7的下方时,对应的感应装置感应后,所述夹盘驱动机构15停止,这时,所述第一视觉检测装置6对料盘上的芯片拍照检测,所述第二视觉检测装置7对料盘上的芯片拍照检测,并将结果记录到控制系统上。之后,所述夹盘驱动机构15再次驱动所述夹盘机构14移动,并经过限高光纤的限高检测后到达所述轨道槽11的另一端,所述夹盘机构14释放所述料盘,之后缓存顶升机构17顶升已检测料盘至缓存支撑块18承接料盘,并使料盘堆叠起来。同时,所述第二上料盘输送机构2输送空载的料盘到其另一端。此时,所述料盘翻转机械手4将空载的料盘转移到其中一所述下料盘输送机构3 上,并将第一上料盘输送机构1上满载的料盘翻转并分别转移到其他下料盘输送机构3上,使得两所述下料盘输送机构3上均具有一满载芯片的料盘,而另一所述下料盘输送机构3上具有空载的料盘。之后,各个所述下料盘输送机构3 将各自的料盘输送到所述分选机械手5的下方。此时,所述第三视觉检测装置 52及第四视觉检测装置53依次对芯片进行检测,之后,所述分选机械手5对芯片进行分选。具体是,控制系统根据视觉检测的结果,分为至少两种类型,例如合格或不合格两种,从而控制分选机械手5,将第一种类型的芯片放置于其中一所述下料盘输送机构3上的料盘上,将第二种类型的芯片放置于另一所述下料盘输送机构3上的料盘上,从而可以将同一种类型的芯片放置于同一料盘上。当各个料盘装满后,对应该料盘上的下料盘输送机构3将该料盘输送到下料端,并将其堆叠于所述料盘堆叠治具上,等待取出。当所述下料盘输送机构3上没有料盘时,所述料盘翻转机械手4将所述第一上料盘输送机构1上的满载的料盘转移到所述下料盘输送机构3上;或者将所述第二上料盘输送机构2上的空载的料盘转移到所述下料盘输送机构3上,从而可以持续地进行分选。First, manually place a tray full of chips (with the bottom side of the chips facing up) on the
与现有技术相比,由于本发明通过设置第一上料盘输送机构1对满载有芯片的料盘上料,然后在所述第一上料盘输送机构1的中部设置第一视觉检测装置6及第二视觉检测装置7,利用所述第一视觉检测装置6及第二视觉检测装置 7对料盘上的芯片的反面进行视觉检测,从而可以检测出各个芯片的差异。再通过并排地设置第二上料盘输送机构2及多个上料盘输送机构,利用第二上料盘输送机构2上空料盘,又利用所述料盘翻转机械手4将满载芯片的料盘翻转后转移到所述下料盘输送机构3上,最后利用所述第三视觉检测装置52及第四视觉检测装置53对芯片的正面进行检测并通过所述分选机械手5将芯片分类并将不同类别的芯片转移到不同的下料盘输送机构3上。因此,本发明芯片检测分选机100无需人工进行检测及分类,整个过程从上料盘、检测、分选及下料均自动完成,自动化程度极高,极大地降低劳动强度,提高生产效率。Compared with the prior art, in the present invention, a first feeding
以上所揭露的仅为本发明的较佳实例而已,当然不能以此来限定本发明之权利范围,因此依本发明申请专利范围所作的等同变化,仍属于本发明所涵盖的范围。The above disclosures are only preferred examples of the present invention, and of course, the scope of the rights of the present invention cannot be limited by this. Therefore, equivalent changes made according to the scope of the patent application of the present invention still belong to the scope covered by the present invention.
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CN118455117A (en) * | 2024-06-05 | 2024-08-09 | 无锡九霄科技有限公司 | Packaged chip defect detection device |
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