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CN115073015A - Processing method of glass cover plate - Google Patents

Processing method of glass cover plate Download PDF

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Publication number
CN115073015A
CN115073015A CN202210730343.8A CN202210730343A CN115073015A CN 115073015 A CN115073015 A CN 115073015A CN 202210730343 A CN202210730343 A CN 202210730343A CN 115073015 A CN115073015 A CN 115073015A
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Prior art keywords
cover plate
glass cover
acid
glass
laser
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李青
李赫然
陈兵哲
胡恒广
闫冬成
张占永
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Hebei Guangxing Semiconductor Technology Co Ltd
Beijing Yuanda Xinda Technology Co Ltd
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Hebei Guangxing Semiconductor Technology Co Ltd
Beijing Yuanda Xinda Technology Co Ltd
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Priority to CN202210730343.8A priority Critical patent/CN115073015A/en
Publication of CN115073015A publication Critical patent/CN115073015A/en
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

The invention relates to the field of glass processing, and discloses a processing method of a glass cover plate, which comprises the following steps: laser processing: punching a to-be-cut line of the glass cover plate (1) by using a laser (4); acid etching: and etching the to-be-cut line by using corrosive acid liquid so as to cut off the glass cover plate (1) along the to-be-cut line. Through the technical scheme, the part of the glass affected by the laser heat can be corroded, so that the part affected by the laser heat is eliminated, the area affected by the laser heat of the glass cover plate which is cut along the line to be cut does not exist, the edge processing technology of the glass cover plate is not needed, and the production efficiency and the yield are improved.

Description

玻璃盖板的加工方法Processing method of glass cover plate

技术领域technical field

本发明涉及玻璃加工领域,具体地涉及一种玻璃盖板的加工方法。The invention relates to the field of glass processing, in particular to a processing method of a glass cover plate.

背景技术Background technique

随着柔性显示技术的快速发展,可折叠柔性屏逐渐受到市场青睐。传统的盖板玻璃因较厚不可折叠而不能使用,但是当玻璃厚度小于0.1mm时,便具有了可弯曲性,厚度越薄,弯曲性能越好,通常把厚度小于0.1mm玻璃称为超薄柔性玻璃UTG(Ultra Thin Glass)。超薄柔性玻璃具有弯折性好、透明度好、耐热稳定、硬度高等特点。With the rapid development of flexible display technology, foldable flexible screens are gradually favored by the market. The traditional cover glass cannot be used because it is too thick and cannot be folded, but when the thickness of the glass is less than 0.1mm, it has flexibility. Flexible glass UTG (Ultra Thin Glass). Ultra-thin flexible glass has the characteristics of good bendability, good transparency, heat resistance and stability, and high hardness.

目前玻璃厂商已经生产出0.02mm超薄柔性玻璃,其弯曲半径最小达到1.5mm。超薄玻璃经过切割、强化、复合、清洗等多道工艺处理后才可成为超薄柔性盖板。目前UTG加工通常采用激光切割,但激光切割完成后会在边部产生2μm以上的热影响区,这个区域会对弯折半径和弯折次数产生不利影响,所以还需采用一些工艺步骤来去除该区域,导致工艺繁琐、生产效率和良品率低等问题。At present, glass manufacturers have produced 0.02mm ultra-thin flexible glass with a minimum bending radius of 1.5mm. Ultra-thin glass can become an ultra-thin flexible cover after multiple processes such as cutting, strengthening, compounding, and cleaning. At present, laser cutting is usually used in UTG processing, but after laser cutting is completed, a heat-affected zone of more than 2 μm will be generated on the edge. This area will have an adverse effect on the bending radius and bending times, so some process steps are needed to remove this area. area, resulting in cumbersome process, low production efficiency and low yield.

发明内容SUMMARY OF THE INVENTION

本发明的目的是提供一种玻璃盖板的加工方法,以解决激光切割玻璃时容易产生热影响区域的问题。The purpose of the present invention is to provide a processing method for a glass cover plate, so as to solve the problem that a heat-affected zone is easily generated when laser cutting glass.

为了实现上述目的,本发明提供了一种玻璃盖板的加工方法,所述加工方法包括:激光处理:使用激光器在玻璃盖板的待切割线上打孔;酸刻蚀:使用腐蚀酸液在所述待切割线上刻蚀,以沿所述待切割线切断所述玻璃盖板。In order to achieve the above purpose, the present invention provides a processing method of a glass cover plate, the processing method includes: laser treatment: using a laser to make holes on the line to be cut of the glass cover plate; acid etching: using an etching acid solution to The to-be-cut line is etched to cut the glass cover plate along the to-be-cut line.

可选择的,所述激光器为飞秒激光器或皮秒激光器。Optionally, the laser is a femtosecond laser or a picosecond laser.

可选择的,所述加工方法包括在所述激光处理之前进行涂覆涂层,所述涂覆涂层包括:在所述玻璃盖板的表面上涂覆防酸涂层,所述防酸涂层位于所述待切割线之外的区域,以在所述待切割线处形成间隙。Optionally, the processing method includes applying a coating before the laser treatment, and the coating includes: applying an acid-proof coating on the surface of the glass cover, the acid-proof coating The layer is located in an area outside the line to be cut to form a gap at the line to be cut.

可选择的,所述防酸涂层的厚度为10μm—100μm。Optionally, the acid-proof coating has a thickness of 10 μm-100 μm.

可选择的,所述间隙的宽度为0.01mm—2mm。Optionally, the width of the gap is 0.01mm-2mm.

可选择的,所述加工方法包括在所述涂覆涂层之前进行第一次清洗检测。Optionally, the processing method includes performing a first cleaning inspection before the coating is applied.

可选择的,所述激光处理包括将所述玻璃盖板设置在玻璃载台上,所述玻璃载台吸附所述玻璃盖板,并且所述玻璃载台上设置有与所述待切割线对齐的凹槽。Optionally, the laser processing includes arranging the glass cover plate on a glass stage, the glass stage adsorbs the glass cover plate, and the glass stage is provided with a line aligned with the to-be-cut line groove.

可选择的,所述酸刻蚀包括使用流动的腐蚀酸液刻蚀所述玻璃盖板。Optionally, the acid etching includes etching the glass cover plate using a flowing etching acid solution.

可选择的,所述加工方法包括在所述酸刻蚀之后进行第二次清洗,所述第二次清洗包括:将玻璃盖板层叠间隔地设置在清洗架上,将所述清洗架放入清洗机中进行清洗,以去除腐蚀酸液和防酸涂层。Optionally, the processing method includes performing a second cleaning after the acid etching, and the second cleaning includes: stacking glass cover plates on a cleaning rack at intervals, placing the cleaning rack in Cleaning in a washing machine to remove corrosive acids and acid-resistant coatings.

可选择的,所述加工方法包括在所述第二次清洗之后进行化学强化,所述化学强化包括:将所述玻璃盖板放置在强化溶液中进行强化。Optionally, the processing method includes performing chemical strengthening after the second cleaning, and the chemical strengthening includes: placing the glass cover plate in a strengthening solution for strengthening.

通过上述技术方案,可以将受到激光热影响的那部分玻璃腐蚀掉,从而消除掉被热影响的部分,使得沿待切割线断开的玻璃盖板不存在受到激光热影响的区域,不需要再进行玻璃盖板的边部处理工艺,提高了生产效率和良品率。Through the above technical solution, the part of the glass that is affected by the laser heat can be etched away, thereby eliminating the heat-affected part, so that the glass cover plate disconnected along the to-be-cut line does not have an area affected by the laser heat. The edge treatment process of the glass cover plate is carried out, which improves the production efficiency and the yield rate.

附图说明Description of drawings

图1是本发明实施方式所述的玻璃盖板和防酸涂层的立体图;1 is a perspective view of a glass cover plate and an acid-proof coating according to an embodiment of the present invention;

图2是本发明实施方式所述的玻璃盖板和激光器的立体图;2 is a perspective view of a glass cover plate and a laser according to an embodiment of the present invention;

图3是本发明实施方式所述的清洗架和玻璃盖板的立体图。3 is a perspective view of a cleaning rack and a glass cover according to an embodiment of the present invention.

附图标记说明Description of reference numerals

1 玻璃盖板 2 防酸涂层1 Glass cover 2 Acid-proof coating

3 间隙 4 激光器3 Gap 4 Laser

5 玻璃载台 6 清洗架5 Glass stage 6 Washing rack

具体实施方式Detailed ways

以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是,此处所描述的具体实施方式仅用于说明和解释本发明,并不用于限制本发明。The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, but not to limit the present invention.

本方案提供了一种玻璃盖板的加工方法,其中,所述加工方法包括:This solution provides a processing method for a glass cover plate, wherein the processing method includes:

激光处理:使用激光器4在玻璃盖板1的待切割线上打孔;Laser processing: use the laser 4 to make holes on the to-be-cut line of the glass cover 1;

酸刻蚀:使用腐蚀酸液在所述待切割线上刻蚀,以沿所述待切割线切断所述玻璃盖板1。Acid etching: etching on the to-be-cut line with an etching acid solution to cut the glass cover plate 1 along the to-be-cut line.

玻璃盖板1需要沿待切割线切割为多个部分,玻璃盖板1可以为超薄柔性可折叠的玻璃盖板或其他厚度较小的玻璃盖板。The glass cover plate 1 needs to be cut into multiple parts along the line to be cut, and the glass cover plate 1 can be an ultra-thin flexible and foldable glass cover plate or other glass cover plates with a smaller thickness.

激光器4可以发射脉冲激光,脉冲激光在玻璃盖板1的表面上打孔,孔可以为通孔或盲孔,通过激光器4可以沿着待切割线形成间隔的成排的孔。需要注意的是,脉冲激光并不将玻璃盖板直接切断,而是只形成间隔的孔。The laser 4 can emit pulsed laser, and the pulsed laser can punch holes on the surface of the glass cover plate 1. The holes can be through holes or blind holes, and the laser 4 can form spaced rows of holes along the line to be cut. It should be noted that the pulsed laser does not directly cut the glass cover, but only forms spaced holes.

在所述酸刻蚀处理时,将能够腐蚀玻璃材料的腐蚀酸液置于待切割线处,腐蚀酸液进入激光打出的孔中,向孔的周围腐蚀玻璃盖板,随着孔被腐蚀而扩大,相邻的孔连通,从而实现玻璃盖板1的切断。玻璃盖板1的切断在激光处理的基础上通过酸刻蚀处理来实现。During the acid etching treatment, an etchant acid solution capable of corroding the glass material is placed at the line to be cut, and the etchant acid solution enters the hole punched by the laser to corrode the glass cover plate around the hole, and as the hole is corroded, the By expanding, the adjacent holes are connected, thereby realizing the cutting of the glass cover plate 1 . The cutting of the glass cover plate 1 is realized by acid etching treatment on the basis of laser treatment.

特别的,在脉冲激光形成的打出的通孔或盲孔中,腐蚀酸液向周围腐蚀的过程中,可以将受到激光热影响的那部分玻璃腐蚀掉,从而消除掉被热影响的部分,使得沿待切割线断开的玻璃盖板不存在受到激光热影响的区域,不需要再进行玻璃盖板的边部处理工艺,提高了生产效率和良品率。In particular, in the through hole or blind hole formed by the pulsed laser, the part of the glass affected by the laser heat can be etched away during the etching process of the etching acid solution to the surrounding, thereby eliminating the part affected by the heat, making the The glass cover plate disconnected along the line to be cut does not have an area affected by the laser heat, and the edge processing process of the glass cover plate is no longer required, thereby improving production efficiency and yield.

其中,腐蚀酸液可以为氢氟酸或其他可以腐蚀玻璃的酸液。Wherein, the etching acid can be hydrofluoric acid or other acid that can corrode glass.

其中,所述激光器4为飞秒激光器或皮秒激光器。激光器4可以为超快激光,可以发射飞秒激光或皮秒激光,以更好地控制激光的能量,减少对周围的热影响。Wherein, the laser 4 is a femtosecond laser or a picosecond laser. The laser 4 can be an ultrafast laser, and can emit a femtosecond laser or a picosecond laser, so as to better control the energy of the laser and reduce the thermal influence on the surroundings.

另外,所述加工方法包括在所述激光处理之前进行涂覆涂层,所述涂覆涂层包括:在所述玻璃盖板1的表面上涂覆防酸涂层2,所述防酸涂层2位于所述待切割线之外的区域,以在所述待切割线处形成间隙3。参考图1所示,多个防酸涂层2彼此间隔形成间隙3。在激光处理时,激光器在间隙3中对待切割线进行打孔。防酸涂层2用于防止腐蚀酸液与待切割线(存在一定宽度)之外的玻璃盖板1接触,使得腐蚀酸液仅在待切割线处腐蚀玻璃盖板1,以沿待切割线切断玻璃盖板1。防酸涂层2可以由酸性胶涂覆形成。当然,腐蚀酸液并不会完全腐蚀掉间隙3之间的玻璃盖板1,在玻璃盖板1被腐蚀切断时,防酸涂层2的边缘处存在少量的暴露部分。防酸涂层2可以为抗酸防护油墨制成。In addition, the processing method includes applying a coating layer before the laser treatment, and the coating layer includes: applying an acid-proof coating 2 on the surface of the glass cover plate 1 , the acid-proof coating The layer 2 is located in an area outside the line to be cut to form a gap 3 at the line to be cut. Referring to FIG. 1 , a plurality of acid-proof coatings 2 are spaced apart from each other to form gaps 3 . During laser processing, the laser perforates the line to be cut in the gap 3 . The acid-proof coating 2 is used to prevent the corrosive acid from contacting the glass cover 1 outside the line to be cut (with a certain width), so that the corrosive acid only corrodes the glass cover 1 at the line to be cut, so as to follow the line to be cut. Cut cover glass 1. The acid-proof coating 2 may be formed by coating with an acid glue. Of course, the etching acid will not completely corrode the glass cover plate 1 between the gaps 3. When the glass cover plate 1 is etched and cut off, there is a small amount of exposed part at the edge of the acid-proof coating 2. The acid-resistant coating 2 can be made of acid-resistant protective ink.

其中,可以仅在玻璃盖板1的其中一个表面上进行涂覆涂层操作,并仅在这一个表面上进行激光处理和酸刻蚀操作;当然,也可以在两个表面上分别进行涂覆涂层操作,并分别在两个表面上进行激光处理和酸刻蚀操作。Among them, the coating operation can be performed only on one surface of the glass cover plate 1, and the laser treatment and acid etching operations can be performed only on this surface; of course, the coating can also be performed on the two surfaces respectively. Coating operations, and laser treatment and acid etching operations were performed on both surfaces, respectively.

其中,所述防酸涂层2的厚度为10μm—100μm。防酸涂层2的厚度需要保证不会被腐蚀酸液穿透,因此,不能太薄,另外也不就太厚,以便于后续处理时容易清除。Wherein, the thickness of the acid-proof coating 2 is 10 μm-100 μm. The thickness of the acid-proof coating 2 needs to ensure that it will not be penetrated by the corrosive acid, therefore, it should not be too thin, and it should not be too thick, so that it can be easily removed during subsequent processing.

其中,所述间隙3的宽度为0.01mm—2mm。间隙3的宽度对应于腐蚀酸液所能接触的玻璃盖板1的宽度。间隙3的宽度可以根据激光在打孔时所导致的热影响区域的尺寸来确定,以保证受热影响的区域被完全腐蚀掉。间隙3的宽度,可以大于被腐蚀掉的部分的宽度,未被腐蚀掉的暴露部分可以便于夹持,例如通过以下所述的清洗架夹持,以进行清洗操作。Wherein, the width of the gap 3 is 0.01mm-2mm. The width of the gap 3 corresponds to the width of the glass cover plate 1 that the etching acid solution can contact. The width of the gap 3 can be determined according to the size of the heat-affected area caused by the laser during drilling, so as to ensure that the heat-affected area is completely etched away. The width of the gap 3 may be larger than the width of the etched part, and the exposed part that is not etched can be easily clamped, for example, clamped by the cleaning rack described below for cleaning operation.

其中,所述加工方法包括在所述涂覆涂层之前进行第一次清洗检测。在涂覆涂层之间,可以对玻璃盖板1进行清洗,使得玻璃盖板1的表面保持清洁;检测玻璃盖板1的表面的清洁度达标后,可以进行涂覆涂层操作。Wherein, the processing method includes performing a first cleaning inspection before the coating is applied. Between coating, the cover glass 1 can be cleaned to keep the surface of the cover glass 1 clean; after it is detected that the cleanliness of the surface of the cover glass 1 reaches the standard, the coating operation can be performed.

可选择的,参考图2所示,所述激光处理包括将所述玻璃盖板1设置在玻璃载台5上,所述玻璃载台5吸附所述玻璃盖板1,并且所述玻璃载台5上设置有与所述待切割线对齐的凹槽。玻璃载台5上可以设置真空吸附口,以吸附玻璃盖板1,实现对玻璃盖板1的相对固定,并保证玻璃盖板1的平整度。另外,玻璃载台5上设置凹槽,将玻璃盖板1放置在玻璃载台5上时,使得待切割线与凹槽对齐,当激光器4发射的脉冲激光穿透玻璃盖板1的待切割线后,凹槽可以避让脉冲激光,避免脉冲激光损坏玻璃载台5。Optionally, referring to FIG. 2 , the laser processing includes disposing the cover glass 1 on a glass stage 5 , the glass stage 5 adsorbs the cover glass 1 , and the glass stage 5 5 is provided with a groove aligned with the line to be cut. A vacuum suction port may be provided on the glass stage 5 to absorb the glass cover plate 1 , so as to realize the relative fixation of the glass cover plate 1 and ensure the flatness of the glass cover plate 1 . In addition, a groove is provided on the glass stage 5, and when the glass cover plate 1 is placed on the glass stage 5, the line to be cut is aligned with the groove, and when the pulsed laser emitted by the laser 4 penetrates the to-be-cutted glass cover plate 1 After the line, the grooves can avoid the pulsed laser, so as to prevent the pulsed laser from damaging the glass stage 5 .

可选择的,所述酸刻蚀包括使用流动的腐蚀酸液刻蚀所述玻璃盖板1。在酸刻蚀时,可以使得腐蚀酸液相对于玻璃盖板1流动,以提高蚀刻的效率。Optionally, the acid etching includes etching the glass cover plate 1 by using a flowing etching acid solution. During acid etching, the etching acid can be made to flow relative to the glass cover plate 1 to improve the etching efficiency.

另外,所述加工方法包括在所述酸刻蚀之后进行第二次清洗,所述第二次清洗包括:将玻璃盖板1层叠间隔地设置在清洗架6上,将所述清洗架6放入清洗机中进行清洗,以去除腐蚀酸液和防酸涂层2。参考图3所示,玻璃盖板1彼此保持间隔地设置在清洗架6上,避免相邻的玻璃盖板1粘连。清洗架6夹持玻璃盖板1的边缘未涂覆涂层的部分,以支撑多个玻璃盖板1,且允许清洗液进入到相邻的玻璃盖板1之间,以对玻璃盖板1的表面进行清洗,以洗掉残余的腐蚀酸液和防酸涂层2,使得玻璃盖板1的表面保持清洁。第二次清洗可以在多个容纳有不同各类的清洗液的清洗槽中进行清洗,提高清洁度。另外,可以采用超声波清洗机进行清洗,提高清洗效率。In addition, the processing method includes performing a second cleaning after the acid etching, and the second cleaning includes: arranging the glass cover plates 1 on the cleaning rack 6 at intervals, and placing the cleaning rack 6 on the cleaning rack 6 . It is cleaned in a cleaning machine to remove corrosive acids and acid-proof coatings2. Referring to FIG. 3 , the glass cover plates 1 are arranged on the cleaning rack 6 at a distance from each other, so as to avoid adhesion of adjacent glass cover plates 1 . The cleaning rack 6 clamps the uncoated portion of the edge of the glass cover plate 1 to support a plurality of glass cover plates 1 and allows the cleaning liquid to enter between adjacent glass cover plates 1 to clean the glass cover plates 1 The surface of the glass cover plate 1 is cleaned to wash off the residual corrosive acid solution and the acid-proof coating 2, so that the surface of the glass cover plate 1 is kept clean. The second cleaning can be performed in a plurality of cleaning tanks containing different types of cleaning liquids to improve the cleanliness. In addition, ultrasonic cleaning machine can be used for cleaning to improve cleaning efficiency.

此外,所述加工方法包括在所述第二次清洗之后进行化学强化,所述化学强化包括:将所述玻璃盖板1放置在强化溶液中进行强化。可以将清洗后的玻璃盖板1放入强化炉内配置好的硝酸钾溶液中进行化学强化,以提高玻璃盖板1表面硬度。In addition, the processing method includes chemical strengthening after the second cleaning, and the chemical strengthening includes: placing the glass cover plate 1 in a strengthening solution for strengthening. The cleaned glass cover plate 1 can be put into the potassium nitrate solution prepared in the strengthening furnace for chemical strengthening, so as to improve the surface hardness of the glass cover plate 1 .

以上结合附图详细描述了本发明的优选实施方式,但是,本发明并不限于此。在本发明的技术构思范围内,可以对本发明的技术方案进行多种简单变型,包括各个具体技术特征以任何合适的方式进行组合。为了避免不必要的重复,本发明对各种可能的组合方式不再另行说明。但这些简单变型和组合同样应当视为本发明所公开的内容,均属于本发明的保护范围。The preferred embodiments of the present invention have been described above in detail with reference to the accompanying drawings, however, the present invention is not limited thereto. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solutions of the present invention, including the combination of various specific technical features in any suitable manner. In order to avoid unnecessary repetition, the present invention will not describe various possible combinations. However, these simple modifications and combinations should also be regarded as the contents disclosed in the present invention, and all belong to the protection scope of the present invention.

Claims (10)

1. A processing method of a glass cover plate is characterized by comprising the following steps:
laser processing: punching a to-be-cut line of the glass cover plate (1) by using a laser (4);
acid etching: and etching the to-be-cut line by using corrosive acid liquid so as to cut off the glass cover plate (1) along the to-be-cut line.
2. The method of processing a glass cover plate according to claim 1, characterized in that the laser (4) is a femtosecond laser or a picosecond laser.
3. The method for processing a glass cover plate according to claim 1, characterized in that it comprises, before the laser treatment, a coating of a coating comprising: and coating an acid-proof coating (2) on the surface of the glass cover plate (1), wherein the acid-proof coating (2) is positioned in the area outside the line to be cut so as to form a gap (3) at the line to be cut.
4. A method for processing a glass cover plate according to claim 3, characterized in that the thickness of the acid-proof coating (2) is 10 μm to 100 μm.
5. A method for processing a glass cover plate according to claim 3, characterized in that the width of the gap (3) is 0.01 mm-2 mm.
6. A method for processing a glass cover plate according to claim 3, characterized in that it comprises a first cleaning check before the application of the coating.
7. The method according to claim 1, wherein the laser treatment comprises arranging the glass cover plate (1) on a glass carrier (5), the glass carrier (5) absorbing the glass cover plate (1), and the glass carrier (5) being provided with grooves aligned with the lines to be cut.
8. Method for processing a glass cover plate according to claim 1, characterized in that the acid etching comprises etching the glass cover plate (1) using a flowing etching acid.
9. The method for processing a glass cover plate according to claim 1, wherein the processing method comprises performing a second cleaning after the acid etching, the second cleaning comprising: the glass cover plates (1) are arranged on a cleaning frame (6) at intervals in a laminated mode, and the cleaning frame (6) is placed into a cleaning machine to be cleaned so as to remove the corrosive acid liquid and the acid-proof coating (2).
10. The method for processing a glass cover plate according to claim 9, characterized in that the processing method comprises performing chemical strengthening after the second cleaning, the chemical strengthening comprising: and placing the glass cover plate (1) in a strengthening solution for strengthening.
CN202210730343.8A 2022-06-24 2022-06-24 Processing method of glass cover plate Pending CN115073015A (en)

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Publication number Priority date Publication date Assignee Title
US20140147624A1 (en) * 2012-11-29 2014-05-29 Corning Incorporated Methods of Fabricating Glass Articles by Laser Damage and Etching
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JP2020142964A (en) * 2019-03-07 2020-09-10 株式会社Nsc Glass substrate manufacturing method
CN113185107A (en) * 2021-05-10 2021-07-30 深圳市吉祥云科技有限公司 Glass punching equipment and glass punching method
CN214600906U (en) * 2021-01-04 2021-11-05 河北光兴半导体技术有限公司 Flexible glass substrate cleaning rack
CN113814574A (en) * 2020-06-19 2021-12-21 Ap系统股份有限公司 Processing table for laser processing and device for laser processing with same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140147624A1 (en) * 2012-11-29 2014-05-29 Corning Incorporated Methods of Fabricating Glass Articles by Laser Damage and Etching
CN107835794A (en) * 2015-07-10 2018-03-23 康宁股份有限公司 Method for continuous manufacture of holes in flexible substrate sheet and products related thereto
CN110770640A (en) * 2017-05-24 2020-02-07 株式会社Nsc Method for manufacturing glass panel with transparent film, method for manufacturing liquid crystal panel with transparent film, method for manufacturing glass panel, and method for manufacturing liquid crystal panel
JP2020142964A (en) * 2019-03-07 2020-09-10 株式会社Nsc Glass substrate manufacturing method
CN113814574A (en) * 2020-06-19 2021-12-21 Ap系统股份有限公司 Processing table for laser processing and device for laser processing with same
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CN113185107A (en) * 2021-05-10 2021-07-30 深圳市吉祥云科技有限公司 Glass punching equipment and glass punching method

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Application publication date: 20220920