CN115064520B - A light-emitting diode chip integrated locator, mass transfer device and method - Google Patents
A light-emitting diode chip integrated locator, mass transfer device and method Download PDFInfo
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- CN115064520B CN115064520B CN202210854322.7A CN202210854322A CN115064520B CN 115064520 B CN115064520 B CN 115064520B CN 202210854322 A CN202210854322 A CN 202210854322A CN 115064520 B CN115064520 B CN 115064520B
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- H10W46/00—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
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- H10P72/0428—
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Abstract
The application provides a light-emitting diode chip integrated positioner, a mass transfer device and a mass transfer method. The LED chip integrated positioner comprises a third attaching structure, the attaching structure is used for attaching the LED chip integrated positioners, the orderly arrangement of a plurality of LED chip integrated positioners is realized, and the uniformity and the accuracy of LEDs attached to the substrate are improved. The material containing container comprises a material injection opening and a first valve, wherein the material injection opening is used for injecting a light-emitting diode chip integrated positioner, the first valve is used for injecting and discharging a first substance with density greater than that of the light-emitting diode chip integrated positioner, and a substrate is placed on one side of the material containing container in an opening mode so as to achieve attachment of the light-emitting diode chip and the substrate. The tight adhesion between the LED chip and the substrate is realized through the injection of the first substance, the reliability of the mass transfer of the LED is improved, and the efficiency is improved.
Description
Technical Field
The present application relates to the field of mass transfer technology, and in particular, to an integrated positioner for a light emitting diode chip, a mass transfer device and a method thereof.
Background
The mass transfer technology of the light emitting diode refers to a technology of separating a light emitting diode chip grown on a source substrate from the source substrate and transferring the chip to a display electronic device rapidly, accurately and reliably by a certain force.
Because of the small size and large number of chips transferred each time, the chips cannot be quickly, accurately and reliably transferred to display electronics using conventional devices and methods.
Disclosure of Invention
Accordingly, the present application is directed to an integrated positioner for a light emitting diode chip, a mass transfer device and a method thereof, which can rapidly, accurately and reliably implement mass transfer of the light emitting diode chip.
This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
In order to achieve the above purpose, the application has the following technical scheme:
in a first aspect, an embodiment of the present application provides a light emitting diode chip integrated positioner, including: the LED chip integrated positioner is used for attaching an LED chip;
The LED chip integrated positioner comprises a third attaching structure, wherein the third attaching structure is used for attaching a plurality of LED chip integrated positioners.
In a second aspect, an embodiment of the present application provides a mass transfer device for a light emitting diode, including:
a plurality of light emitting diode chip integrated positioners and a material accommodating container,
The LED chip integrated positioner is used for attaching an LED chip;
the LED chip integrated positioner comprises a third attaching structure, wherein the third attaching structure is used for attaching a plurality of LED chip integrated positioners;
The material accommodating container comprises a material injection port and a first valve, wherein the material injection port is used for injecting the light-emitting diode chip integrated positioner, and the first valve is used for injecting and discharging a first substance with density greater than that of the light-emitting diode chip integrated positioner;
and an opening at one side of the material accommodating container is used for accommodating a substrate so as to attach the light emitting diode chip to the substrate.
In a third aspect, an embodiment of the present application provides a method for transferring a bulk of a light emitting diode, including:
Attaching a light emitting diode chip by using a light emitting diode chip integrated positioner;
Injecting the LED chip integrated positioner into the material accommodating container through a material injection port of the material accommodating container; the LED chip integrated positioner comprises a third attaching structure, wherein the third attaching structure is used for attaching a plurality of LED chip integrated positioners;
Injecting a first substance with density greater than that of the integrated locator of the light-emitting diode chip into the material accommodating container through a first valve of the material accommodating container so as to attach the light-emitting diode chip to a substrate placed on one side of the material accommodating container and open.
Compared with the prior art, the embodiment of the application has the following beneficial effects:
The embodiment of the application provides a light emitting diode chip integrated positioner, a huge amount transfer device and a method, wherein the device comprises the following components: a plurality of light emitting diode chip integrated positioners and a material accommodating container, the LED chip integrated positioner is used for attaching the LED chip. The LED chip integrated positioner comprises a third attaching structure, wherein the third attaching structure is used for attaching the LED chip integrated positioners, so that the LED chip integrated positioners can be orderly arranged, and the uniformity and the accuracy of the LEDs attached on the substrate are improved. The material containing container comprises a material injection opening and a first valve, wherein the material injection opening is used for injecting a light-emitting diode chip integrated positioner, the first valve is used for injecting and discharging a first substance with density greater than that of the light-emitting diode chip integrated positioner, and an opening at one side of the material containing container is used for placing a substrate so as to realize attachment of the light-emitting diode chip and the substrate. Therefore, the tight adhesion between the light emitting diode chip and the substrate is realized through the injection of the first substance, and the reliability of the mass transfer of the light emitting diode chip is improved.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are some embodiments of the application and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.
The above and other features, advantages, and aspects of embodiments of the present disclosure will become more apparent by reference to the following detailed description when taken in conjunction with the accompanying drawings. The same or similar reference numbers will be used throughout the drawings to refer to the same or like elements. It should be understood that the figures are schematic and that elements and components are not necessarily drawn to scale.
Fig. 1 is a schematic diagram of a macro-transferring device of a light emitting diode according to an embodiment of the present application;
fig. 2 is a schematic diagram of an integrated positioner for a light emitting diode chip according to an embodiment of the present application;
FIG. 3 illustrates a top view of one LED chip integrated fixture provided in FIG. 2;
fig. 4 shows a cross-sectional view of a light emitting diode chip according to an embodiment of the present application;
FIG. 5 is a schematic diagram of yet another LED chip integrated positioner according to an embodiment of the present application;
FIG. 6 is a schematic diagram of another LED chip integrated positioner according to an embodiment of the present application;
FIG. 7 is a schematic diagram of yet another LED chip integrated positioner according to an embodiment of the present application;
FIG. 8 is a flow chart illustrating a method for transferring the bulk of a light emitting diode according to an embodiment of the present application;
fig. 9 is a flowchart illustrating a method for transferring the bulk of a light emitting diode according to another embodiment of the present application.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present application is not limited to the specific embodiments disclosed below.
As described in the background art, the applicant has found that the mass transfer technology of the light emitting diode refers to a technology of separating the light emitting diode chip grown on the source substrate from the source substrate and transferring the chip to the display electronic device rapidly, accurately and reliably by a certain force.
For example, a Mi cro-LED (micro light emitting diode, mi cro-i ght-EMITT I NG D I ode) is applied to a large-screen display, the Mi cro-LED is separated from a substrate after being manufactured on the substrate, and a Mi cro-LED chip is assembled on a substrate with a larger size and a logic circuit in a huge amount transfer manner, so that the requirement of the large-size display application is met. Likewise, flexible display applications also require LEDs to be transferred to a flexible substrate, and also require substantial transfer to be achieved.
Because of the small size and large number of chips transferred each time, the accuracy and speed requirements of the transfer process are very high, and the chips cannot be quickly, accurately and reliably transferred to the display electronic device by using the traditional device and method for transferring.
In order to solve the above technical problems, an embodiment of the present application provides a device and a method for transferring a huge amount of light emitting diodes, where the device includes: a plurality of light emitting diode chip integrated positioners and a material accommodating container, the LED chip integrated positioner is used for attaching the LED chip. The LED chip integrated positioner comprises a third attaching structure, wherein the third attaching structure is used for attaching the LED chip integrated positioners, so that the LED chip integrated positioners can be orderly arranged, and the uniformity and the accuracy of the LEDs attached on the substrate are improved. The material containing container comprises a material injection opening and a first valve, wherein the material injection opening is used for injecting a light-emitting diode chip integrated positioner, the first valve is used for injecting and discharging a first substance with density greater than that of the light-emitting diode chip integrated positioner, and an opening at one side of the material containing container is used for placing a substrate so as to realize attachment of the light-emitting diode chip and the substrate. Therefore, the tight adhesion between the light emitting diode chip and the substrate is realized through the injection of the first substance, and the reliability of the mass transfer of the light emitting diode is improved.
Exemplary apparatus
Referring to fig. 1, a schematic diagram of a macro-transferring device of a light emitting diode according to an embodiment of the present application includes:
The LED chip integrated positioner 1 comprises a plurality of LED chip integrated positioners 1 and a material accommodating container 2, wherein the material accommodating container 2 is a closable container, the LED chip integrated positioner 1 is used for attaching LED chips, and the LED chip integrated positioner 1 comprises a third attaching structure which is used for realizing attaching and fixing among the plurality of LED chip integrated positioners 1.
Specifically, the third attaching structure may include a smooth surface, and may be provided with a magnetic material, an electrostatic material, a chemical substance, or the like, so that the led chip integrated positioners 1 may attract or repel each other when they are close to each other, thereby realizing the orderly arrangement of the plurality of led chip integrated positioners 1 through the third attaching structure, and improving the uniformity and accuracy of the leds attached to the substrate 5.
The material accommodating container 2 comprises a sealable material injection opening 3 and a first valve 4, wherein the material injection opening 3 is used for injecting a first substance with the density greater than that of the light-emitting diode chip integrated positioner 1, and the first valve 4 is used for injecting and discharging the first substance with the density greater than that of the light-emitting diode chip integrated positioner 1. The opening at one side of the material accommodating container 2 is used for placing the substrate 5, so as to attach the light emitting diode chip to the substrate 5. Thereby realizing the close adhesion between the LED chip and the substrate 5 through the injection of the first substance, and improving the reliability of the mass transfer of the LED chip.
Specifically, referring to fig. 2 and 3, where fig. 3 is a top view of the structure shown in fig. 2, the led chip integrated positioner 1 provided in the embodiment of the present application may include a housing cavity 10 provided with a first attaching structure 101, where the housing cavity 10 is used for attaching and accommodating the led chip 7 by using the first attaching structure 101.
Referring to fig. 4, which is a schematic cross-sectional view of a light emitting diode chip 7 according to an embodiment of the present application, the light emitting diode chip 7 may include a first surface 71 for being attached to a substrate and a second surface 72 opposite to the first surface 71, and a second attaching structure 73 is disposed on a side of the second surface 72 away from the first surface 71, so that the second attaching structure 73 is attached to the first attaching structure 101, so as to accommodate the light emitting diode chip 7 in the accommodating cavity 10.
For example, the light emitting diode chip 7 may be transported to a position corresponding to the accommodating cavity 10 through a pipeline, and the first attaching structure 101 in the accommodating cavity 10 is used to attach the second attaching structure 73 of the light emitting diode chip 7.
Preferably, in order to ensure the quality of the led chip 7 transferred to the substrate 5 in the final bulk, before the led chip 7 is placed in the accommodating cavity 10, the quality of the led chip 7 may be checked and verified to ensure that the quality of the led chip 7 meets the requirement, so as to improve the yield of the display panel formed by the final bulk transfer.
Specifically, referring to fig. 5, the led chip integrated positioner 1 includes a third attaching structure 14, where the third attaching structure 14 is used to attach a plurality of led chip integrated positioners 1.
In one possible implementation manner, the first attaching structure 101, the second attaching structure 73, and the third attaching structure 14 provided in the embodiment of the present application may include: magnetic structures, electrostatic structures, and/or frozen structures.
For example, when the first attaching structure 101 is a magnetic structure, the material may include a magnetic material, the corresponding second attaching structure 73 on the led chip 7 may include a material such as iron and nickel, and the magnetic material may adsorb the iron and nickel material, so that the adsorption between the second attaching structure 73 and the first attaching structure 101 is completed, that is, the accommodating cavity 10 may be used to pick up the led chip 7 and accommodate the led chip.
When the third attaching structure 14 is a magnetic structure, the polarities of the opposite sides are opposite, so that mutual adsorption between the plurality of led chip integrated positioners 1 can be realized. Since the size of the led chips 7 is generally small, the led chip integrated locator 1 may be integrated into a unit of a specific size, several tens of groups, or several hundreds of groups, by mutual adsorption between the led chip integrated locators 1, and may be formed into one integrated unit according to a specific geometry, so as to achieve the orderly arrangement of the led chips 7, and improve the uniformity and accuracy of the led chips 7 subsequently attached to the substrate 5.
In one possible implementation manner, the accommodating cavity 10 provided in the embodiment of the present application may include a plurality of accommodating light emitting diode chips 7 of different colors, that is, as shown in fig. 6, the accommodating cavity 10 may include three accommodating light emitting diode chips 7 of different colors, for example, an accommodating cavity 21 of a red light emitting diode, an accommodating cavity 22 of a green light emitting diode, and an accommodating cavity 23 of a blue light emitting diode, so that pixel units may be formed between the light emitting diode chips 7 of different colors.
The led chips 7 can be transported to the corresponding locations for different housing chambers 10 by different mechanical pipes on the assembly line.
In one possible implementation manner, referring to fig. 2, the led chip integrated positioner 1 provided in the embodiment of the present application may include: and a second structure 11 connected to the receiving chamber 10, the second structure 11 having a density greater than that of the receiving chamber 10.
Alternatively, the first substance provided by the embodiment of the present application may include a liquid and/or a gas having chemical stability.
For example, when the first substance is pure water, the valve 4 is used for injecting the pure water, in order to prevent water pollution, a sleeve head with a larger density, namely, the second structure 11, can be provided, and the density of the accommodating cavity 10 can be set smaller, so that when the light emitting diode chip integrated positioner 1 floats on the water surface, the accommodating cavity 10 is positioned on the water surface to prevent water pollution, and in particular, as shown in fig. 1, the accommodating cavity is positioned on the liquid surface 6, thereby effectively avoiding water pollution.
Optionally, in order to further prevent water pollution and enable the device to float on the liquid surface vertically, referring to fig. 2, the device provided by the embodiment of the present application may further include a top core, i.e. a first structure 12, between the second structure 11 and the accommodating cavity 10, where the density of the top core 12 is also smaller than that of the first structure 12, so as to avoid the light emitting diode chip 7 in the accommodating cavity 10 from contacting the water surface.
Wherein the density of the first structures 12 may be arranged smaller than the density of the second structures 11 in order to distance the receiving chamber 10 from the liquid surface, optionally the shape of the first structures and/or the second structures is a square column shaped hexahedron.
In addition, the first attaching structure, the second attaching structure and/or the third attaching structure provided by the embodiment of the application comprise a hydrophilic first surface, and the smoothness of the first surface is greater than or equal to a second preset threshold value; the wettability of the first surface is greater than or equal to a third preset threshold.
Optionally, the device provided by the embodiment of the present application may further include a casing 13 disposed around the top core 12, where the material of the casing 13 may be an elastic material.
Alternatively, to further prevent water from contaminating the led chip 7, the first substance may comprise a relatively high density gas, or other substances that may prevent contamination.
In one possible implementation manner, in addition to avoiding water pollution as mentioned above, oxygen pollution such as air may be prevented, and referring to fig. 1, the material container provided in the embodiment of the present application may further include a second valve 8, where the second valve 8 injects and discharges a second material having a density less than that of the led chip integrated positioner 1, and the second material may include a gas having chemical stability, for example, nitrogen, carbon dioxide, an inert gas, and the like.
I.e. the material receiving container 2 is filled with a chemically stable gas to simultaneously prevent water oxygen attack.
In a possible implementation manner, the smoothness of the first surface 71 of the light emitting diode chip 7 provided by the embodiment of the present application is greater than or equal to the first preset threshold, and a fourth attaching structure 74 is disposed on a side of the first surface 71 away from the second surface 72.
The surface of the led chip 7 contacting the substrate 5 may be a smooth surface, and the fourth attaching structure 74 may be a material that is coated to facilitate adhesion to the substrate 5, so as to facilitate adhesion between the led chip 7 and the substrate 5.
For example, the fourth attaching structure 74 may include a smooth surface and an electrode on the same plane as the smooth surface, and the light-curing glue may be coated on the fourth attaching structure 74 or the substrate 5, and after the fourth attaching structure 74 contacts the substrate 5, the light-emitting diode chip 7 may be fixed to the substrate 5 through a light-curing process.
In one possible implementation, as shown in fig. 7, a plurality of grooves 121 may be disposed on a side of the top core 12 away from the second structure 11, and the led chips 7 with various colors are directly accommodated in the grooves 121, and the led chips 7 may be arranged in a specific red, green and blue combined color matrix, which has a simple structure and saves costs.
Preferably, the depth of the groove 121 may be set to be smaller than or equal to the thickness of the led chip 7, so as to facilitate the direct attachment of the subsequent led chip 7 to the substrate 5.
The embodiment of the application provides a huge amount transfer device of a light emitting diode, which comprises: a plurality of light emitting diode chip integrated positioners and a material accommodating container, the LED chip integrated positioner is used for attaching the LED chip. The LED chip integrated positioner comprises a third attaching structure, wherein the third attaching structure is used for attaching the LED chip integrated positioners, so that the LED chip integrated positioners can be orderly arranged, and the uniformity and the accuracy of the LEDs attached on the substrate are improved. The material containing container comprises a material injection opening and a first valve, wherein the material injection opening is used for injecting a light-emitting diode chip integrated positioner, the first valve is used for injecting and discharging a first substance with density greater than that of the light-emitting diode chip integrated positioner, and an opening at one side of the material containing container is used for placing a substrate so as to realize attachment of the light-emitting diode chip and the substrate. Therefore, the tight adhesion between the light emitting diode chip and the substrate is realized through the injection of the first substance, and the reliability of the mass transfer of the light emitting diode chip is improved.
The huge amount transfer device of the light-emitting diode provided by the embodiment of the application has the advantages of simple structure, low equipment cost, repeated use, efficiency improvement, cost saving, process requirement achievement, and rapid production and transfer of the LED migration. And because the buoyancy of the integrated locator of the light-emitting diode chip in the suspended matter can be regulated through the pressure of liquid or/and gas, and the liquid has certain elasticity, the stress of the light-emitting diode chip is easy to regulate, and the light-emitting diode chip is not easy to damage in operation.
Exemplary method
Referring to fig. 8, a flow chart of a method for transferring a lot of light emitting diodes according to an embodiment of the present application includes:
s101: attaching light emitting diode chips using a light emitting diode chip integrated locator
In the embodiment of the application, the light-emitting diode chip can be integrated into the light-emitting diode chip integrated positioner through static electricity, molecular acting force, magnetic force or the like.
In one possible implementation, the light emitting diode chip may be affixed into the receiving cavity using a light emitting diode chip integration locator.
The integrated locator of the light-emitting diode chip comprises a containing cavity provided with a first attaching structure, the light-emitting diode chip comprises a first surface for attaching to the substrate and a second surface opposite to the first surface, and a second attaching structure is arranged on one side, away from the first surface, of the second surface, so that the second attaching structure is attached to the first attaching structure, and the containing cavity is used for containing the light-emitting diode chip.
Specifically, in one possible implementation manner, when the first attaching structure and/or the second attaching structure includes a hydrophilic first surface, the smoothness of the first surface is greater than or equal to a second preset threshold, and the wettability of the first surface is greater than or equal to a third preset threshold, the temperature in the accommodating cavity may be reduced at a first speed, so that an ice film is formed between the light emitting diode chip and the accommodating cavity to be fixed.
That is, the first attaching structure may be a wet smooth surface, and after the LED is placed in the accommodating cavity, the LED and the accommodating cavity may be fixed in a rapid cooling manner, and at this time, the LED and the accommodating cavity form an ice film due to the temperature reduction, so that the LED and the accommodating cavity are connected together.
The mode of adopting the ice film to fix can be the temporary fixation mode, can realize the temporary fixation between LED and the holding chamber to can be when follow-up LED is attached with the base plate, can dispel the fixed between LED and the holding chamber fast, so as to realize the subsides fast.
S102: injecting the LED chip integrated positioner into the material accommodating container through a material injection port of the material accommodating container; the LED chip integrated positioner comprises a third attaching structure, wherein the third attaching structure is used for attaching a plurality of LED chip integrated positioners.
In embodiments of the application, a first volume of a first substance may be injected into the material-holding vessel, e.g., the integrated fixtures may be placed one by one on the liquid surface, with the integrated fixtures being connected in one piece. Further, the integrated locator may maintain a certain basic number, such as being connected end-to-end to different levels of integration or being modularized to a specific aggregate shape and level of integration.
The container is pre-filled with common pure water and chemically stable gas, such as nitrogen, carbon dioxide, etc., and the substrate is slowly placed into the container. Pure water is continuously injected, and gas is discharged and pressurized.
S103: injecting a first substance with density greater than that of the integrated locator of the light-emitting diode chip into the material accommodating container through a valve of the material accommodating container so as to enable the light-emitting diode chip to be attached to a substrate placed on one side of the material accommodating container in an opening mode.
In the embodiment of the application, pure water can be injected until the LED is tightly attached to the substrate, and water injection and pressurization are continuously performed until most devices are tightly attached to the substrate. Because the substrate and the LEDs are provided with smooth surfaces, and the water has certain elasticity, the LEDs can be tightly attached to the substrate, and the device is not easy to damage.
Specifically, when the attachment of the LED and the substrate is completed, a quick freezing mode may be adopted, for example, a certain temperature of gas may be replaced, or the temperature of the substrate may be reduced by other means, the LED and the substrate may be temporarily fixed, the liquid may be discharged, and the LED integrated positioner may be separated from the substrate due to gravity, or if the LED integrated positioner cannot be separated, a blowing scheme may be adopted.
In a possible implementation manner, after the light emitting diode chip is attached to the substrate placed on one side of the material accommodating container and opened, welding or gluing solidification can be performed between the light emitting diode chip and the substrate, so that the stability of connection is further improved, after stable connection is established between the light emitting diode chip and the substrate, the LED and the substrate which are temporarily fixed in a quick freezing manner can be quickly removed, and at the moment, only the temperature of the LED or the substrate is increased, so that the method is simple and convenient, and the efficiency is improved.
For example, referring to fig. 9, a flow chart of a method for transferring the bulk of a light emitting diode according to another embodiment of the application includes: after the LED wafers are separated, placing the LEDs in the LED integrated positioner according to three primary colors through quality inspection; injecting pure water and chemically stable gas, such as nitrogen, carbon dioxide, inert gas, etc., into the container; injecting the LED integrated positioner into a container through a mechanical arm or a pipeline and other devices; the LED integrated positioner is suspended on the liquid level in order; after the LED is attached to the substrate in order, pure water is continuously injected, gas is simultaneously discharged, and water is injected under pressure, and the LED is fixed to the substrate in order and separated from the LED integrated positioner.
And finally, turning over the substrate, and welding the LEDs on the substrate, or gluing and solidifying the LEDs to finish the mass transfer of the LEDs.
The embodiment of the application provides a method for transferring the huge quantity of a light-emitting diode, and a device using the method comprises the following steps: a plurality of light emitting diode chip integrated positioners and a material accommodating container, the LED chip integrated positioner is used for attaching the LED chip. The LED chip integrated positioner comprises a third attaching structure, wherein the third attaching structure is used for attaching the LED chip integrated positioners, so that the LED chip integrated positioners can be orderly arranged, and the uniformity and the accuracy of the LEDs attached on the substrate are improved. The material containing container comprises a material injection opening and a first valve, wherein the material injection opening is used for injecting a light-emitting diode chip integrated positioner, the first valve is used for injecting and discharging a first substance with density greater than that of the light-emitting diode chip integrated positioner, and an opening at one side of the material containing container is used for placing a substrate so as to realize attachment of the light-emitting diode chip and the substrate. Therefore, the tight adhesion between the light emitting diode chip and the substrate is realized through the injection of the first substance, and the reliability of the mass transfer of the light emitting diode chip is improved.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for the method embodiments, since they are substantially similar to the apparatus embodiments, the description is relatively simple, and reference is made to the description of the method embodiments in part.
The foregoing is merely a preferred embodiment of the present application, and the present application has been disclosed in the above description of the preferred embodiment, but is not limited thereto. Any person skilled in the art can make many possible variations and modifications to the technical solution of the present application or modifications to equivalent embodiments using the methods and technical contents disclosed above, without departing from the scope of the technical solution of the present application. Therefore, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present application still fall within the scope of the technical solution of the present application.
Claims (14)
1. A light emitting diode chip integrated locator, comprising: the LED chip integrated positioner is used for attaching an LED chip;
the LED chip integrated positioner comprises a third attaching structure, wherein the third attaching structure is used for attaching and orderly arranging a plurality of LED chip integrated positioners;
The LED chip integrated positioner comprises a containing cavity provided with a first attaching structure, wherein the containing cavity is used for attaching the LED chip by the first attaching structure and containing the LED chip;
the LED chip comprises a first surface for being attached to the substrate and a second surface opposite to the first surface, and a second attaching structure is arranged on one side, away from the first surface, of the second surface, so that the second attaching structure is attached to the first attaching structure, and the accommodating cavity accommodates the LED chip;
the first attachment structure, the second attachment structure, and the third attachment structure, comprising: magnetic structures, electrostatic structures, and/or frozen structures.
2. The locator of claim 1, wherein the smoothness of the first face is greater than or equal to a first predetermined threshold, and a fourth attachment structure is provided on a side of the first face remote from the second face.
3. The fixture of claim 1, wherein the receiving cavity comprises a plurality of receiving cavities for receiving light emitting diode chips of different colors, respectively.
4. The fixture of claim 1, wherein the light emitting diode chip integrated fixture further comprises
A first structure connected to the receiving cavity;
The density of the first structure is greater than that of the accommodating cavity.
5. The locator of claim 4, further comprising:
A second structure connected to the first structure,
The density of the second structure is greater than the density of the first structure.
6. The locator of claim 5, wherein the shape of the first structure and/or the second structure is a square column shaped hexahedron.
7. The locator of claim 1, wherein the first, second and/or third attachment structures comprise a hydrophilic first surface having a smoothness greater than or equal to a second preset threshold;
the wettability of the first surface is greater than or equal to a third preset threshold.
8. A mass transfer device for a light emitting diode, comprising: a plurality of light emitting diode chip integrated positioners and a material accommodating container,
The LED chip integrated positioner is used for attaching an LED chip;
the LED chip integrated positioner comprises a third attaching structure, wherein the third attaching structure is used for attaching and orderly arranging a plurality of LED chip integrated positioners;
The LED chip integrated positioner comprises a containing cavity provided with a first attaching structure, wherein the containing cavity is used for attaching the LED chip by the first attaching structure and containing the LED chip;
the LED chip comprises a first surface for being attached to the substrate and a second surface opposite to the first surface, and a second attaching structure is arranged on one side, away from the first surface, of the second surface, so that the second attaching structure is attached to the first attaching structure, and the accommodating cavity accommodates the LED chip;
the first attachment structure, the second attachment structure, and the third attachment structure, comprising: magnetic, electrostatic and/or frozen structures;
The material accommodating container comprises a material injection port and a first valve, wherein the material injection port is used for injecting the light-emitting diode chip integrated positioner, and the first valve is used for injecting and discharging a first substance with density greater than that of the light-emitting diode chip integrated positioner;
and an opening at one side of the material accommodating container is used for accommodating a substrate so as to attach the light emitting diode chip to the substrate.
9. The device of claim 8, wherein the first substance comprises a chemically stable liquid and/or gas.
10. The apparatus of claim 8, wherein the material-containing vessel further comprises a second valve;
The second valve is used for injecting and discharging a second substance with the density smaller than that of the integrated positioner of the light-emitting diode chip;
The second substance includes a chemically stable gas.
11. A method for mass transfer of a light emitting diode, comprising:
Attaching a light emitting diode chip by using a light emitting diode chip integrated positioner;
Injecting the LED chip integrated positioner into the material accommodating container through a material injection port of the material accommodating container; the LED chip integrated positioner comprises a third attaching structure, wherein the third attaching structure is used for attaching and orderly arranging a plurality of LED chip integrated positioners; injecting a first substance with density greater than that of the integrated locator of the light-emitting diode chip into the material accommodating container through a first valve of the material accommodating container so as to attach the light-emitting diode chip to a substrate placed on one side of the material accommodating container in an opening manner;
the attaching the light emitting diode chip by using the light emitting diode chip integrated locator comprises:
Attaching the light emitting diode chip into the accommodating cavity by utilizing the light emitting diode chip integrated positioner;
The LED chip integrated positioner comprises the accommodating cavity provided with a first attaching structure; the LED chip comprises a first surface for being attached to the substrate and a second surface opposite to the first surface, and a second attaching structure is arranged on one side, away from the first surface, of the second surface, so that the second attaching structure is attached to the first attaching structure, and the accommodating cavity accommodates the LED chip;
the first attachment structure, the second attachment structure, and the third attachment structure, comprising: magnetic structures, electrostatic structures, and/or frozen structures.
12. The method of claim 11, wherein injecting a first substance having a density greater than the led chip integrated locator into the material container through a first valve of the material container to attach the led chip to a substrate placed in an opening of a side of the material container, comprises:
injecting a first volume of a first substance into the material-holding container;
After the LED chip integrated positioner is injected into the material accommodating container, a second volume of first substance is injected into the material accommodating container, so that the LED chip is attached to a substrate placed on one side of the material accommodating container and opened.
13. The method as recited in claim 11, further comprising:
And reducing the temperature of the substrate at a second speed, and performing welding or gluing and curing between the light-emitting diode chip and the substrate after the light-emitting diode chip is attached to the substrate.
14. The method of claim 11, wherein when the first attachment structure and/or the second attachment structure comprises a hydrophilic first surface, the smoothness of the first surface is greater than or equal to a second preset threshold; when the wettability of the first surface is greater than or equal to a third preset threshold value, the method further comprises:
and reducing the temperature in the accommodating cavity at a first speed so as to fix the ice film between the light emitting diode chip and the accommodating cavity.
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| CN112967972A (en) * | 2020-06-03 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Device and method for transferring huge amount of micro light-emitting diodes |
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| CN112967972A (en) * | 2020-06-03 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Device and method for transferring huge amount of micro light-emitting diodes |
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