CN115062745A

CN115062745A - Electronic label

Info

Publication number: CN115062745A
Application number: CN202210766792.8A
Authority: CN
Inventors: 王文赫; 付建锋; 李国强; 杜鹃
Original assignee: Beijing Smartchip Microelectronics Technology Co Ltd; Beijing Smartchip Semiconductor Technology Co Ltd
Current assignee: Beijing Smartchip Microelectronics Technology Co Ltd; Beijing Smartchip Semiconductor Technology Co Ltd
Priority date: 2022-06-30
Filing date: 2022-06-30
Publication date: 2022-09-16

Abstract

The invention discloses an electronic tag, which comprises: a label body; the tag antenna is arranged on the tag body; the tag chip is connected with the tag antenna; and the high-temperature protective layer covers the label body, the label antenna and the outside of the label chip. Therefore, the high-temperature protection layer is arranged, so that the high-temperature resistance of the electronic tag can be improved, the electronic tag can be prevented from being damaged after being heated, the application range of the electronic tag can be enlarged, and the application range of the electronic tag can be larger.

Description

Electronic label

Technical Field

The invention relates to the technical field of labels, in particular to an electronic label.

Background

In the related art, the electronic tag is attached to the surface of equipment, the surface temperature of an object is measured in a non-contact manner, the electronic tag is applied to multiple fields to detect whether the equipment fails, however, the electronic tag does not have the high temperature resistance characteristic, and the electronic tag is easily damaged after being subjected to high temperature, so that the application range of the electronic tag is limited, and the application range of the electronic tag is small.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, an object of the present invention is to provide an electronic tag, which can improve the high temperature resistance of the electronic tag by providing a high temperature protection layer, and can make the application range of the electronic tag larger.

The electronic tag according to the present invention comprises: a label body; the tag antenna is arranged on the tag body; the tag chip is connected with the tag antenna; and the high-temperature protective layer covers the label body, the label antenna and the outside of the label chip.

According to the electronic tag provided by the invention, the high-temperature resistant performance of the electronic tag can be improved by arranging the high-temperature protective layer, and the electronic tag can be prevented from being damaged after being subjected to high temperature, so that the application range of the electronic tag can be expanded, and the application range of the electronic tag can be larger.

In some examples of the invention, the tag body is provided with a mounting hole, the tag chip corresponds to the mounting hole, and at least part of the structure of the tag chip is arranged in the mounting hole.

In some examples of the invention, an outer surface of the label chip is provided with an epoxy layer.

In some examples of the invention, the tag chip is a temperature sensitive chip.

In some examples of the invention, the tag body has first and second opposing surfaces, each of which is affixed with the tag antenna.

In some examples of the invention, the frequency band of the tag chip is 840MHz-960 MHz.

In some examples of the invention, the tag antenna is provided as a flexible wiring board.

In some examples of the invention, the tag body is configured as a dielectric foam board.

In some examples of the invention, the dielectric foam board has a dielectric constant of 1.1 to 1.3.

In some examples of the present invention, the thickness of the electronic tag is D1, and satisfies the following relation: d1 is more than 1mm and less than or equal to 2 mm.

In some examples of the invention, the tag antenna has a thickness D2, satisfying the relationship: d2 is more than 0.072mm and less than or equal to 0.075 mm.

In some examples of the invention, a surface of the high temperature protection layer opposite to the tag antenna is provided with an adhesive structure for adhering to an object corresponding to the electronic tag.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a top view of an electronic label according to an embodiment of the invention;

fig. 2 is a schematic cross-sectional view of an electronic tag according to an embodiment of the invention.

Reference numerals:

an electronic tag 100;

a tag body 10; a mounting hole 11; a dielectric foam board 12;

a tag antenna 20;

a tag chip 30; an epoxy resin layer 31;

a high temperature protective layer 40.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

An electronic tag 100 according to an embodiment of the invention is described below with reference to fig. 1 and 2.

As shown in fig. 1 and 2, an electronic tag 100 according to an embodiment of the present invention includes: a tag body 10, a tag antenna 20, a tag chip 30, and a high temperature protective layer 40.

The tag antenna 20 is arranged on the tag body 10, the tag chip 30 is connected with the tag antenna 20, the tag chip 30 is in communication connection with the tag antenna 20, and the high-temperature protection layer 40 covers the tag body 10, the tag antenna 20 and the tag chip 30. In other words, in the thickness direction of the electronic tag 100, the projections of the tag body 10, the tag antenna 20 and the tag chip 30 are all located within the projection range of the high temperature protection layer 40.

Electronic tag 100 may be disposed within a cable to detect if the cable is faulty or electronic tag 100 may be applied to other devices. This is not limited by the present application. The following description will be given taking an example in which the electronic tag 100 is provided in a cable line.

When the electronic tag 100 is disposed in the cable line, a user may use a read-write device to interact with the electronic tag 100 to obtain information on the electronic tag 100, so as to detect whether the cable line is faulty, or the user may also use the read-write device to interact with the electronic tag 100, so as to write information into the electronic tag 100. The read-write device may be a dedicated handheld terminal, or the read-write device may also be a reader-writer, which is not limited in this application.

It will be appreciated that the electronic tag 100 may be provided on the armour of the cable at the stage of production of the cable, in particular the electronic tag 100 may be provided on the non-woven fabric of the armour of the cable. Optionally, the electronic tag 100 may be disposed on the armor of the cable by bonding, and after the electronic tag 100 is disposed on the armor of the cable, the cable needs to be covered with plastic so that the cable meets the national standard requirements. The cable conductor can carry out high temperature process at the package in-process of moulding, and after the cable conductor package was moulded, electronic tags 100 can be by the plastic envelope inside the cable conductor.

The electronic tag in the prior art does not have the characteristic of high temperature resistance, and is easy to damage after being subjected to high temperature, so that the electronic tag cannot be applied to cables.

In the present application, by providing the high temperature protection layer 40 and covering the high temperature protection layer 40 outside the tag body 10, the tag antenna 20 and the tag chip 30, the high temperature resistance of the electronic tag 100 can be significantly improved, and the electronic tag 100 can be prevented from being damaged after being subjected to high temperature, so that the electronic tag 100 can be applied to a cable, and the application range of the electronic tag 100 can be expanded.

Alternatively, the high-temperature protection layer 40 may be configured as high-temperature cloth, which is a high-temperature resistant inorganic fiber product, and by configuring the high-temperature protection layer 40 as the high-temperature cloth, the high-temperature resistance of the electronic tag 100 may be good, and the electronic tag 100 may be prevented from being damaged by high temperature.

Therefore, by providing the high temperature protection layer 40, the high temperature resistance of the electronic tag 100 can be improved, and the electronic tag 100 can be prevented from being damaged by high temperature, so that the application range of the electronic tag 100 can be expanded, and the application range of the electronic tag 100 can be enlarged.

Alternatively, the tag chip 30 may be an RFID (Radio Frequency Identification-Radio Frequency Identification) chip, and the reader device and the electronic tag 100 may interact with each other through a Radio Frequency Identification technology.

It can be understood that, by arranging the electronic tag 100 of the present application in a cable, a detection person interacts with the electronic tag 100 by using a read-write device, so as to obtain information on the electronic tag 100, and digital management and information management of the cable can be achieved.

And, through setting up electronic tags 100 of this application in the cable conductor, can be convenient for measurement personnel carry out accurate location to the trouble to can alleviate measurement personnel's work load, can improve the daily fortune dimension work efficiency of cable.

In some embodiments of the present invention, as shown in fig. 2, a mounting hole 11 may be formed on the tag body 10, the tag chip 30 may be disposed corresponding to the mounting hole 11 on the tag body 10, and at least a part of the structure of the tag chip 30 may be disposed in the mounting hole 11, and optionally, all the structures of the tag chip 30 may be disposed in the mounting hole 11. The tag body 10 may protect the tag chip 30 disposed in the mounting hole 11 to prevent the tag chip 30 from being damaged. For example, if the electronic tag 100 is disposed in a cable, when the cable is subjected to plastic coating, the tag body 10 can protect the tag chip 30 to prevent the tag chip 30 from being damaged. Thus, by disposing at least a part of the structure of the tag chip 30 in the mounting hole 11, the tag chip 30 can be prevented from being damaged, so that the reliability of use of the electronic tag 100 can be ensured.

In some embodiments of the present invention, as shown in fig. 1 and 2, the outer surface of the label chip 30 may be provided with an epoxy layer 31, wherein the epoxy layer 31 has a high temperature resistant property, the epoxy layer 31 may be configured as an epoxy glue, and the outer surface of the label chip 30 may be encapsulated with the epoxy layer 31. Through setting up epoxy layer 31, can avoid label chip 30 to be heated and damage to can further improve electronic tags 100's high temperature resistance, can further enlarge electronic tags 100's application scope.

In some embodiments of the present invention, as shown in fig. 1 and 2, the tag chip 30 may be configured as a temperature sensing chip, that is, the tag chip 30 may detect the temperature of the cable, and further, the tag chip 30 may be an RFID (Radio Frequency Identification-Radio Frequency Identification) temperature sensing chip.

It can be understood that, by configuring the tag chip 30 as a temperature sensing chip, the detection personnel can interact with the electronic tag 100 by using a read-write device to obtain the temperature inside the cable so as to determine whether the cable is faulty. Therefore, the label chip 30 is constructed to be a temperature sensing chip, so that the running temperature of the cable can be conveniently monitored in real time, whether the cable breaks down or not can be conveniently detected by a detector, and digital management and information management of the cable can be realized.

In some embodiments of the present invention, as shown in fig. 2, the tag body 10 has a first surface and a second surface, which may be oppositely disposed. The tag antenna 20 is attached to the first surface of the tag body 10, and the tag antenna 20 is also attached to the second surface of the tag body 10. The tag antenna 20 may be disposed as a whole, and the tag antenna 20 may be bent, so that the tag antenna 20 is attached to both the first surface and the second surface of the tag body 10.

In the prior art, the metal resistance of the electronic tag is weak, and a metal piece of equipment can affect the electronic tag, so that the reading distance of the electronic tag becomes very close, and even the electronic tag can not be read directly. For example, if the electronic tag is disposed inside the cable, the steel band in the cable may affect the electronic tag, so that the reading distance of the electronic tag becomes very close or the electronic tag cannot be read directly, thereby affecting the application range of the electronic tag.

In the present application, the tag antenna 20 is bent, and the tag antenna 20 is attached to the first surface and the second surface of the tag body 10, so that the metal resistance of the electronic tag 100 can be improved, the influence of a metal part on the electronic tag 100 can be weakened, the read distance of the electronic tag 100 can be increased, the electronic tag 100 can have a remote read-write function, and the application range of the electronic tag 100 can be further expanded.

In some embodiments of the present invention, the frequency band of the tag chip 30 may be set to 840MHz-960MHz, such that the electronic tag 100 of the present application can select any read-write device in the ultra-high frequency (840MHz-960MHz) frequency band sold in the market to interact with the electronic tag 100 of the present application based on the ISO18000-6C international standard (supporting the global EPC global Class 1Gen2 protocol), so as to improve the degree of generalization of the electronic tag 100.

In some embodiments of the present invention, the tag antenna 20 may be configured as a Flexible Printed Circuit (FPC) -Flexible Circuit, and it should be understood that the thickness of the Flexible Circuit is thin and the Flexible Circuit is easily bent. By providing the tag antenna 20 as a flexible wiring board, the thickness of the electronic tag 100 can be reduced, so that the electronic tag 100 can be conveniently disposed inside the cable, and by configuring the tag antenna 20 as a flexible wiring board, the electronic tag 100 can be bent according to the shape of the object, so that the electronic tag 100 can be applied to an object having a curved surface (e.g., a steel belt surface inside the cable) that requires flexibility of the electronic tag 100. This can further expand the application range of the electronic tag 100.

As some embodiments of the present invention, the electronic tag 100 may be configured as a passive electronic tag 100, that is, the electronic tag 100 does not need a power supply, and when a detection person sends an electromagnetic signal (electromagnetic wave) to the electronic tag 100 through a read-write device, the electronic tag 100 can obtain a voltage and a current required for its own operation by sensing the electromagnetic signal sent by the read-write device. By configuring the electronic tag 100 as a passive electronic tag 100, the electronic tag 100 does not need to use a power source, so that the electronic tag 100 does not need to be replaced with a power source, and the electronic tag 100 can be conveniently used.

In some embodiments of the present invention, the tag body 10 may be configured as a dielectric foam board 12. It should be understood that, in general, when electromagnetic waves are transmitted to a surface of a common dielectric material, interface reflection inevitably occurs, and the occurrence of the interface reflection directly affects transmission energy of the electromagnetic waves, so that the electronic tag 100 cannot receive the electromagnetic waves, the reading distance of the electronic tag 100 is affected, and the electronic tag 100 cannot perform long-distance reading and writing.

By configuring the tag body 10 as the dielectric foam board 12, the interface reflection phenomenon can be weakened, so that the read distance of the electronic tag 100 can be increased, the electronic tag 100 has a remote read-write function, and the application range of the electronic tag 100 can be further expanded.

And, the cotton board 12 of dielectric bubble's compression resilience preferred, after at least partial structure when label chip 30 set up in the mounting hole 11 of the cotton board 12 of dielectric bubble, the cotton board 12 of dielectric bubble can carry out effective protection to label chip 30 to can avoid label chip 30 to damage, can guarantee electronic tags 100's use reliability.

In some embodiments of the present invention, the dielectric constant of the dielectric foam board 12 may be any value between 1.1 and 1.3, preferably, the dielectric constant of the dielectric foam board 12 may be 1.2, and by setting the dielectric constant of the dielectric foam board 12 to any value between 1.1 and 1.3, the interface reflection phenomenon may be further attenuated, and thus the read distance of the electronic tag 100 may be further improved.

It should be understood that, by providing the epoxy layer 31 on the outer surface of the tag chip 30, providing the tag antenna 20 as a flexible circuit board, and covering the high-temperature protection layer 40 outside the tag body 10, the tag antenna 20 and the tag chip 30, the electronic tag 100 can be embedded into the cable line conveniently and nondestructively in the cable injection molding production process.

In some embodiments of the present invention, as shown in fig. 2, the thickness of electronic label 100 may be configured as D1, and D1 may satisfy the relationship: 1mm < D1 ≦ 2mm, i.e. D1 may be any value between 1mm and 2mm, preferably the thickness of electronic label 100 does not exceed 1.8 mm. It should be understood that if the thickness of the electronic tag 100 is too thin, the reading distance of the electronic tag 100 may be affected, and if the thickness of the electronic tag 100 is too thick, the electronic tag 100 may not be conveniently disposed in the cable, and by configuring the thickness of the electronic tag 100 to be any value between 1mm and 2mm, the thickness of the electronic tag 100 may be made reasonable, so that the electronic tag 100 may be ensured to have a longer reading distance, and the electronic tag 100 may be conveniently disposed in the cable.

In some embodiments of the present invention, the thickness of tag antenna 20 may be of configuration D2, and D2 may satisfy the relationship: 0.072mm < D2 ≦ 0.075mm, that is, D2 may be any value between 0.072mm and 0.075mm, preferably, the thickness of tag antenna 20 may be configured to be 0.074mm, and by configuring the thickness of tag antenna 20 to be 0.074mm, the thickness of tag antenna 20 may be adapted, so that tag antenna 20 may be easily bent, and thus, it may be convenient to dispose electronic tag 100 inside a cable.

In some embodiments of the present invention, the high temperature protection layer 40 may be provided with an adhesive structure, the adhesive structure may be disposed on a surface of the high temperature protection layer 40 opposite to the tag antenna 20, and the adhesive structure may be used for adhering to an object corresponding to the electronic tag 100 to adhere the electronic tag 100 to the corresponding object. For example, the adhesive structure may be used for adhesion to the sheath of the electric cable, and specifically, the adhesive structure may be used for adhesion to a nonwoven fabric of the sheath of the electric cable. By the arrangement, the bonding firmness between the electronic tag 100 and the object can be ensured, and the electronic tag 100 can be prevented from falling off from the object.

Alternatively, the position of the high temperature protection layer 40 opposite to the electronic label 100 may be provided with an adhesive structure, which may be used to adhere the high temperature protection layer 40 and the electronic label 100 together.

The non-opposite position of the high temperature protection layer 40 and the electronic tag 100 may also be provided with an adhesive structure, and the adhesive structure may be used to adhere to a corresponding object, so that the adhesion firmness between the electronic tag 100 and the object may be further ensured.

As some embodiments of the present invention, there exists a coupling coefficient M between the inductances Lc and Ld of the electronic tag 100, and the input impedance Z of the electronic tag 100 _in Calculated by the following formula:

according to the frequency band standard of the national standard 920MHz-925MHz, the frequency of the tag center of the electronic tag 100 is adjusted to be within the range, so that the electronic tag 100 can achieve the optimal impedance matching.

Further, the Q value at the tag center frequency of the electronic tag 100 may be optimized, and the Q value may be calculated by the following formula:

wherein Q is a quality factor, and the larger the Q value is, the larger the gain of the tag antenna 20 is, and the larger the reading distance of the electronic tag 100 is. The larger the tag Q value, the greater the sensitivity of the tag antenna 20, and the faster the response speed of the electronic tag 100.

As some embodiments of the present invention, after the read-write device collects data, the read-write device may transmit the data to the display device end of the job site through the wireless network, so that personnel in the job site can obtain the data collected by the read-write device.

Furthermore, the data information collected by the read-write equipment can be stored and managed through a background server, and the data information can be accessed and operated by connecting to the background server through a visual platform.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

In the description of the present invention, "the first feature" and "the second feature" may include one or more of the features.

In the description of the present invention, "a plurality" means two or more.

In the description of the invention, "on" or "under" a first feature may include that the first and second features are in direct contact, and may also include that the first and second features are not in direct contact but are in contact via another feature between them.

In the description of the invention, "above", "over" and "above" a first feature in a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic tag, comprising:

a label body;

the tag antenna is arranged on the tag body;

the tag chip is connected with the tag antenna;

and the high-temperature protective layer covers the label body, the label antenna and the outside of the label chip.

2. The electronic tag according to claim 1, wherein the tag body is provided with a mounting hole, the tag chip corresponds to the mounting hole, and at least a part of the structure of the tag chip is arranged in the mounting hole.

3. An electronic label according to claim 2, characterized in that the outer surface of the label chip is provided with an epoxy layer.

4. The electronic tag according to claim 1, wherein the tag chip is a temperature-sensitive chip.

5. The electronic tag according to claim 1, wherein said tag body has first and second opposing surfaces, each of said first and second surfaces being affixed with said tag antenna.

6. The electronic tag according to claim 1, wherein the frequency band of the tag chip is 840-960 MHz.

7. The electronic tag according to claim 1, wherein said tag antenna is provided as a flexible wiring board.

8. The electronic tag according to claim 1, wherein said tag body is configured as a dielectric foam board.

9. The electronic tag according to claim 8, wherein the dielectric foam board has a dielectric constant of 1.1-1.3.

10. The electronic tag according to claim 6, wherein the thickness of the electronic tag is D1, and the relation is satisfied: d1 is more than 1mm and less than or equal to 2 mm.

11. The electronic tag according to claim 1, wherein the tag antenna has a thickness D2, and satisfies the relationship: d2 is more than 0.072mm and less than or equal to 0.075 mm.

12. The electronic tag according to claim 1, wherein a surface of the high temperature protection layer opposite to the tag antenna is provided with an adhesive structure, and the adhesive structure is used for adhering to an object corresponding to the electronic tag.