CN115058757B - Electroplating equipment and film plating machine - Google Patents

Abstract

The invention discloses electroplating equipment and a film plating machine, wherein the electroplating equipment comprises an electroplating bath and one or more first anode modules, the electroplating bath is used for electroplating a conductive base film entering the electroplating bath, one side of the conductive base film entering the electroplating bath is a groove entering side, one side of the conductive base film leaving the electroplating bath is a groove exiting side, the direction from the groove entering side to the groove exiting side is a first direction, the direction inclined or vertical to the first direction is a second direction, the first anode modules are arranged in the electroplating bath and are electrically connected with a power supply, and in the second direction, the current introduced into the middle area of the first anode modules is larger than the current introduced into the two end areas of the first anode modules, so that the thickness of a plating layer of the conductive base film along the direction vertical to the first direction tends to be uniform.

Description

Electroplating equipment and film plating machine

Technical Field

The invention relates to the technical field of electroplating, in particular to electroplating equipment and a film plating machine.

Background

The current collector is an important component of the lithium battery, and current generated by the active materials of the battery is gathered and output to the outside. In preparing a new composite current collector, a metal plating layer is plated on a conductive base film using a plating apparatus to prepare the current collector.

Specifically, the conductive base film is placed into a plating tank of a plating device, an anode plate positioned in the plating tank is electrically connected with an anode of a power supply, a conductive clamp is clamped at two ends of the conductive base film in the width direction and is electrically connected with a cathode of the power supply, so that the anode plate is used as the anode, the conductive base film is used as the cathode, and a metal plating layer is plated on the conductive base film, so that the current collector is prepared and formed. However, in the related art, there is a problem in that the uniformity of the plating of the conductive base film is not good.

Disclosure of Invention

The embodiment of the invention discloses electroplating equipment and a coating machine, wherein the electroplating equipment can improve the thickness uniformity of a coating of an electroplated conductive base film.

To achieve the above object, in a first aspect, an embodiment of the present invention discloses an electroplating apparatus, including:

the electroplating device comprises an electroplating bath and one or more first anode modules, wherein the electroplating bath is used for electroplating a conductive base film entering the electroplating bath, the film entering direction of the conductive base film is a first direction, and the direction inclined or perpendicular to the first direction is a second direction; the first anode module is arranged in the electroplating bath and is electrically connected with the power supply anode, and in the second direction, the current flowing in the middle area of the first anode module is larger than the current flowing in the two end areas of the first anode module, so that the thickness of the plating layer of the conductive base film in the direction perpendicular to the first direction tends to be uniform.

The first anode module arranged in the electroplating bath is connected with the power supply to electroplate the conductive base film, when the conductive base film is arranged in the electroplating bath, the two end areas of the first anode module correspond to the two ends of the conductive base film in the width direction, the middle area of the first anode module corresponds to the middle of the conductive base film in the width direction, and the current introduced into the middle area of the first anode module is larger than the current introduced into the two end areas of the first anode module.

As an alternative embodiment, in an embodiment of the first aspect of the present invention, the first anode module includes a plurality of anode units aligned along the second direction, two adjacent anode units are separated by an insulating medium, and at least part of the anode units are electrically connected to the power source. Because the first anode module includes a plurality of anode units arranged along the second direction, compared with the first anode module which is arranged as a whole, the plurality of anode units are electrically connected with the power supply so as to be convenient for controlling the currents of the plurality of anode units respectively, for example, the current introduced by the corresponding anode units can be adjusted according to the requirement on the electroplating uniformity of the conductive base film or the requirement on the electroplating thickness of different positions of the conductive base film.

As an alternative embodiment, in an embodiment of the first aspect of the present invention, the plurality of anode units of the first anode module includes one or more second anode units located in a middle region of the first anode module, one or more first anode units located in an end region of the first anode module, and one or more third anode units located in an other end region of the first anode module;

wherein the second anode unit is electrically connected to a power source, and

The first anode unit and/or the third anode unit are/is electrically connected to a power supply and the connected current is smaller than the connected current of the second anode unit, or the current which is not electrically connected to the power supply or connected in the first anode unit and/or the third anode unit is zero.

It is understood that the second anode unit located at the middle region of the first anode module corresponds to the middle position of the conductive base film for electroplating, and the first anode unit and the third anode unit located at the both end regions of the first anode module correspond to both sides of the conductive base film in the width direction. When the second anode unit is electrically connected with a power supply, radial power lines generated by the second anode unit can be radiated to two sides of the conductive base film in the width direction while electroplating the middle position of the conductive base film so as to realize electroplating of the two sides of the conductive base film in the width direction, and when the current introduced by the first anode unit and/or the third anode unit is smaller than the current introduced by the second anode unit, the situation that the current density of the two sides of the conductive base film corresponding to the first anode unit and the third anode unit is overlarge can be avoided, so that the uniformity of the plating layer of the conductive base film is improved. When the current which is not electrically connected or connected with the power supply is zero, the first anode unit and the third anode unit cannot be supplied with current, so that the first anode unit and the third anode unit cannot plate the two sides of the conductive base film along the second direction, the two sides of the conductive base film along the second direction are plated through the power lines radiated by the second anode unit group positioned in the middle of the first anode module, the current density of the two sides of the conductive base film along the second direction can be effectively reduced, the current density of the two sides of the conductive base film along the second direction is more similar, namely, the current density distribution of the conductive base film along the second direction is more uniform, and the electroplating uniformity of the conductive base film is improved. Meanwhile, the first anode unit and the third anode unit are not electrically connected with the power supply, so that the power connection mode of the first anode module is simplified, the use quantity of the power supply is reduced, namely, the electroplating equipment can reduce the use quantity of the power supply, simplify the power connection mode of the first anode module, and simultaneously improve the electroplating uniformity of the conductive base film.

As an alternative implementation manner, in an embodiment of the first aspect of the present invention, in the first anode module, a sum of conductive areas of the first anode unit is S1, a sum of conductive areas of the second anode unit is S2, and a sum of conductive areas of the third anode unit is S3;

When the first anode unit and the third anode unit of the first anode module are not electrically connected to a power source or the connected current is zero, 1.5% S2 is less than or equal to (S1+S3) and less than or equal to 16% S2;

When the first anode unit of the first anode module is not electrically connected to a power supply or the connected current is zero, the third anode unit is electrically connected to the power supply, 1.5% (S2+S3) is more than or equal to S1 and less than or equal to 16% (S2+S3);

When the third anode unit of the first anode module is not electrically connected to a power supply or the connected current is zero, 1.5% (S1+S2) is less than or equal to S3 and less than or equal to 16% (S1+S2) when the first anode unit is electrically connected to the power supply. In other words, the sum of the conductive areas of the anode units which are not supplied with current is controlled to be 1.5% -16% of the sum of the areas of the anode units which are not supplied with current, and the ratio of the sum of the conductive areas of the anode units which are not supplied with current to the sum of the conductive areas of the anode units which are supplied with current is reasonably set, so that when the first anode module is used for electroplating the conductive base film, the situation that the plating thickness of the two sides of the conductive base film is too thick and the plating thickness of the middle position is too thin can not be caused, and the situation that the plating thickness of the two sides of the conductive base film is too thin and the plating thickness of the middle position is too thick can not be caused, namely, the uniformity of the current density of the two sides of the conductive base film along the second direction can be effectively controlled, so that the uniformity of electroplating the conductive base film is improved.

As an alternative embodiment, in an embodiment of the first aspect of the present invention, the second anode units are provided in plurality, and the current flowing through the second anode unit located in the middle of the middle area is greater than the current flowing through the second anode unit located at both ends of the middle area along the direction perpendicular to the first direction. The current introduced by the second anode unit in the middle of the middle area is larger than the current introduced by the second anode unit at the two ends of the middle area, so that the uniformity of the current density applied to the conductive base film is further improved, and the uniformity of the plating thickness of the conductive base film is improved.

As an alternative embodiment, in an embodiment of the first aspect of the present invention, the first anode module includes three or more anode units, the anode units are electrically connected to a power source, respectively, and the anode units are connected with current in a manner of gradually decreasing current from the middle of the first anode module to two ends. Because the current of the anode unit gradually decreases from the middle of the first anode module to two ends, the problem that the current of the middle of the conductive base film is large when the first anode module is used for electroplating the conductive base film can be avoided, and the uniformity of the first anode module for electroplating the conductive base film can be improved.

In an optional implementation manner, in an embodiment of the first aspect of the present invention, projections of the first anode module and the conductive base film on a bottom surface of the plating tank are a first projection and a second projection, respectively, where the first projection is located in the second projection. In other words, along the second direction, two sides of the conductive base film along the second direction protrude from two sides of the first anode module, so that two sides of the conductive base film along the second direction are electroplated through the electric lines of force radiated by the first anode module, the problem that the density of the electric lines of force of the two sides of the conductive base film along the second direction is high can be avoided, and the uniformity of the thickness of the conductive base film along the second direction is improved.

In an alternative embodiment, in the embodiment of the first aspect of the present invention, the distances between two edges of the first projection along the direction perpendicular to the first direction and the corresponding two edges of the second projection along the direction perpendicular to the first direction are L1 and L2, respectively, where L1 is 20mm less than or equal to 300mm, and L2 is 20mm less than or equal to 300mm. Illustratively, L1 is 20mm, 100mm, 150mm, 250mm, 300mm, etc., and L2 is 20mm, 100mm, 150mm, 250mm, 300mm, etc. The distance between the two edges of the first projection and the two edges of the second projection is 20-300 mm, so that the density uniformity of the electric lines of force on two opposite sides of the conductive base film along the second direction when the first anode module is used for electroplating the conductive base film is further improved, and the uniformity of the plating thickness of the conductive base film is improved.

As an alternative embodiment, in the example of the first aspect of the invention, 50 mm.ltoreq.L1.ltoreq.200mm, 50 mm.ltoreq.L2.ltoreq.200mm. Illustratively, L1 is 50mm, 80mm, 120mm, 140mm, 170mm, 200mm, etc., and L2 is 50mm, 80mm, 120mm, 140mm, 170mm, 200mm, etc. The distance between the two edges of the first projection and the two edges of the second projection is 50-200 mm, so that the density uniformity of the electric lines of force on two opposite sides of the conductive base film along the second direction when the first anode module is used for electroplating the conductive base film is further improved, and the uniformity of the plating thickness of the conductive base film is improved.

As an alternative embodiment, in an example of the first aspect of the invention,

The anode units of the first anode module are arranged in a matrix type of a plurality of rows and columns,

Wherein the plurality of anode units form a plurality of columns extending in the second direction, the anode units of each column including one or more second anode units located in a middle region of the first anode module, one or more first anode units located in an end region of the first anode module, one or more third anode units located in an other end region of the first anode module;

the second anode unit is electrically connected to a power source, and

The first anode unit and/or the third anode unit are/is electrically connected to a power supply, and the connected current is smaller than the connected current of the second anode unit, or the first anode unit and/or the third anode unit are/is not electrically connected to the power supply;

the plurality of anode units form a plurality of rows extending along the first direction, and the anode units positioned in the same row are connected in parallel.

Because the lengths of the conductive base films from the conductive clips are different along the second direction, the resistances of the conductive base films at different positions are different, the resistances of the conductive base films at the positions close to the conductive clips are smaller, the resistances of the conductive base films at the positions far away from the conductive clips are larger, then the currents applied to the positions of the edges of the conductive base films by the conductive clips are larger, the currents applied to the positions of the middle parts of the conductive base films are smaller, namely, the currents applied to the conductive base films everywhere along the second direction by the conductive clips are different, the currents which are electrically conducted by the first anode unit and/or the third anode unit along the second direction are smaller than the currents which are conducted by the first anode unit and/or the third anode unit along the second direction or are not electrically connected to a power supply, so that the current densities applied to the conductive base films by the first anode unit and the third anode unit are smaller, the current densities applied to the conductive base films by the second anode unit are larger, the current densities applied to the conductive base films along the second direction are balanced, and the current densities of the conductive base films along the second direction tend to be uniform, and the electroplating uniformity along the second direction of the conductive base films is improved. Since the resistances of the conductive base films corresponding to the plurality of anode units arranged in the first direction are the same, it is not necessary to control the current flowing through the plurality of first anode units in the first direction to equalize the current density applied to the conductive base films, and therefore, the number of power supplies can be reduced by arranging the plurality of anode units in the first direction to be connected in parallel to the same power supply.

As an alternative implementation manner, in an embodiment of the first aspect of the present invention, m first anode modules are arranged along the first direction, each first anode module includes n anode units arranged along the second direction, and two adjacent anode units are separated by an insulating medium; the anode units are distributed in a matrix arrangement of n rows and m columns, wherein m is a natural number greater than 1, and n is a natural number greater than 0; and in the first direction, the current flowing into at least one row of the first anode units is gradually increased.

Since the current flowing into at least one row of anode units in the first direction is gradually increased, the current applied by the first anode units can be correspondingly increased along with the thickening of the plating thickness and the enhancement of the current carrying capacity of the conductive base film, so that the current density of the conductive base film is increased, and the electroplating rate is further increased.

As an alternative implementation manner, in an embodiment of the first aspect of the present invention, in the first direction, the current that is introduced into the first anode unit in row a located in the middle area of the first anode module gradually increases;

The anode units of row B are respectively arranged on two sides of the anode units of row A, and the current introduced by the anode units of row B is increased and then decreased; wherein A, B is a natural number greater than 0. As can be seen from the foregoing, the resistance of the two sides of the conductive base film along the second direction is smaller, the resistance of the middle part is larger, so that the current density of the two sides of the conductive base film along the second direction y is large, the current density of the middle part is small, along the first direction, the current of the first anode units of the a row and the B row gradually increases, the increasing speed of the plating thickness of the two sides of the conductive base film corresponding to the B row is larger than the increasing thickness of the plating layer of the middle part of the conductive base film corresponding to the a row, and the current introduced by the first anode units of the B row gradually decreases, so that the increasing speed of the plating thickness of the two sides of the conductive base film along the second direction is reduced, so that the plating thickness of the conductive base film along the second direction is more uniform, and the plating rate is improved, and better plating uniformity is achieved.

As an alternative implementation manner, in an embodiment of the first aspect of the present invention, the current that is passed through the first anode units of the B rows at the first position is changed from gradually increasing to gradually decreasing; when the conductive base film is at the first position, the thickness of a metal coating on the edge of the conductive base film is d1, the thickness of a metal coating on the middle part of the conductive base film is d2, the thickness of a target metal coating of the conductive base film is d3, d1-d2 is more than or equal to 20% d3, d1 is more than or equal to 40% d3, or d1 is more than or equal to 400nm. Through ingenious setting up the electric current of going the first positive pole unit of line B in first position department become gradually the reduction by increasing gradually, can avoid first positive pole module to the plating layer that both sides of electrically conductive base film electroplated too thick, the middle part position plated the thinner condition of plating layer, also can avoid the plating layer thickness of first positive pole module to the plating layer thickness of electrically conductive base film both sides too thin, the middle part position plated the plating layer thickness too thick condition, promptly, can effectively improve electrically conductive base film along the electroplating homogeneity of second direction.

As an alternative implementation manner, in an embodiment of the first aspect of the present invention, the electroplating apparatus further includes a second anode module, where the second anode module is disposed in the electroplating tank, and the second anode module is closer to the in-tank side than the first anode module;

The second anode module comprises a plurality of fourth anode units, two adjacent fourth anode units are separated by an insulating medium, the fourth anode units are electrically connected to the power supply, and at least part of the fourth anode units are connected in parallel to the same power supply. At least part of the fourth anode units are connected in parallel with the same power supply, so that the number of power supply settings can be reduced, and the cost is reduced.

In a second aspect, an embodiment of the present invention further discloses a plating machine, including a plating apparatus according to the first aspect, and a transport mechanism, where the plating apparatus is used for plating a conductive base film, and the transport mechanism is used for clamping the conductive base film and moving the conductive base film in the plating tank of the plating apparatus along the first direction.

Compared with the prior art, the embodiment of the invention has the beneficial effects that:

By adopting the electroplating equipment provided by the embodiment, the first anode module arranged in the electroplating bath is connected with the power supply to electroplate the conductive base film, when the conductive base film is arranged in the electroplating bath, the two end areas of the first anode module correspond to the two ends of the conductive base film in the width direction, the middle area of the first anode module corresponds to the middle position of the conductive base film in the width direction, and the current introduced into the middle area of the conductive first anode module is larger than the current introduced into the two end areas of the first anode module by arranging the middle area of the conductive first anode module.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a related art coating machine;

FIG. 2 is a schematic view of a plating apparatus according to the present application;

FIG. 3 is a schematic view showing the construction of a first plating apparatus according to the present application;

FIG. 4 is a schematic view showing the construction of a second plating apparatus according to the present application;

FIG. 5 is a schematic view showing the construction of a third plating apparatus according to the present application;

FIG. 6 is a schematic view showing a structure of a fourth plating apparatus according to the present application;

FIG. 7 is a schematic view showing a construction of a fifth plating apparatus;

FIG. 8 is a schematic view of a first anode module and conductive base film provided herein as projected onto the bottom surface of a plating bath;

FIG. 9 is a schematic view showing a construction of a fifth plating apparatus;

FIG. 10 is a schematic view showing the internal structure of the plating apparatus of FIG. 9;

fig. 11 is a schematic structural diagram of the coating machine provided by the application.

Icon: 1. electroplating equipment; 1a, a groove entering side; 1b, a groove outlet side; 11. plating bath; 12. a first anode module; 120. a first anode unit; 121. a first anode unit; 122. a second anode unit; 123. a third anode unit; 12a, a first anode unit; 12b, a second anode unit; 12c, a third anode unit; 12d, a fourth anode unit; 12e, a fifth anode unit; 12f, a sixth anode unit; 12g, seventh anode unit; 12h, eighth anode unit; 12i, a ninth anode unit; 12j, a tenth anode unit; a. a first projection; 1201. a first row of anode units; 1202. a second row of anode units; 1203. a third row of anode units, 1204 and a fourth row of anode units; 1205. a fifth row anode unit; 13. a second anode module; 131. a second anode unit; x, a first direction; y, the second direction; 2. a conductive base film; b. a second projection; 3. a power supply; 100. a film plating machine; 4. a transport mechanism; 41-driving means; 42-conveyor belt; 43-conductive clips.

Detailed Description

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present invention and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.

Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present invention will be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish between different devices, elements, or components (the particular species and configurations may be the same or different), and are not used to indicate or imply the relative importance and number of devices, elements, or components indicated. Unless otherwise indicated, the meaning of "a plurality" is two or more.

The conductive base film is a film with metal layers attached to two sides of an insulating material, and can be used for preparing a current collector of a lithium battery after electroplating the thickened metal layers.

As shown in fig. 1, in the related art, a plating machine 10 is used to plate a conductive base film 20, the plating machine 10 includes a plating tank 101, the plating tank 101 is filled with a plating solution, an anode plate 102 (in order not to block other structures, shown in a form of a dashed frame in the drawing, actually a solid structure) is disposed in the plating tank 101, when the conductive base film 20 is plated, the anode plate 102 is disposed corresponding to the conductive base film 20, the anode plate 102 is electrically connected to an anode of a power supply, and the conductive base film 20 is electrically connected to a cathode of the power supply, so as to realize plating of the conductive base film 20.

Specifically, the plating machine 10 has opposite inlet and outlet sides 10a and 10b, the other two opposite sides of the plating machine 10 are further provided with a transport mechanism 103, the transport mechanism 103 is provided with a conductive clip 131, when the conductive base film 20 is plated, the conductive base film 20 is unwound from the inlet side 10a to enter the plating tank 101 and immersed in the plating solution in the plating tank 101, the conductive clip 131 is clamped on the two opposite sides of the conductive base film 20 in the width direction, and the conductive clip 131 is electrically connected to the negative electrode of the power supply to negatively charge the conductive base film 20. The conductive clip 131 holds the conductive base film 20 to move in the direction from the in-groove side 10a to the out-groove side 10b, so that the plating is completed when the conductive base film 20 is transported to the out-groove side 10b, and is wound up at the out-groove side 10 b.

However, since the conductive clips 131 are clamped at opposite sides of the conductive base film 20, the middle of the conductive base film 20 is longer in distance from the conductive clips 131 and larger in resistance than the two sides of the conductive base film 20 in the width direction of the conductive base film 20, and thus the current density of the middle of the conductive base film 20 is smaller and the current density of the two sides of the conductive base film in the width direction is larger, and thus the plating thickness of the middle of the conductive base film 20 is thinner and the plating of the two sides of the conductive base film 20 in the width direction is thicker, which causes the problem of uneven plating thickness of the conductive base film.

Based on the above, the application provides electroplating equipment and a coating machine, which can effectively solve the problem of uneven thickness of a plated coating of a conductive base film.

The technical scheme of the invention will be further described with reference to the examples and the accompanying drawings.

Referring to fig. 2, a first aspect of the present invention discloses an electroplating apparatus 1, which includes an electroplating tank 11 and one or more first anode modules 12, wherein the electroplating tank 11 is used for electroplating a conductive base film 2 entering the electroplating tank, the film entering direction of the conductive base film 2 is a first direction x, the direction inclined or perpendicular to the first direction x is a second direction y, the first anode modules 12 are disposed in the electroplating tank 11 and electrically connected with an anode of a power supply 3, and in the second direction y, a current flowing into a middle region 12a1 of the first anode modules 12 is greater than a current flowing into two end regions 12a2 of the first anode modules, so that when a thickness of a plating layer of the conductive base film 2 along a direction perpendicular to the first direction tends to be uniform.

According to the electroplating equipment 1 of the first aspect of the invention, the first anode module 12 arranged in the electroplating tank 11 is connected with the power supply 3 to electroplate the conductive base film 2, when the conductive base film 2 is arranged in the electroplating tank 11, the two end areas 12a2 of the first anode module 12 correspond to two sides of the width direction of the conductive base film 2, the middle area 12a1 of the first anode module 12 corresponds to the middle position of the width direction of the conductive base film 2, and the current passing through the middle area 12a1 of the first anode module 12 is larger than the current passing through the two end areas 12a2 of the first anode module 12, so that when the conductive base film 2 is electroplated, the current density of the middle position of the conductive base film 2 can be improved, the condition that the current density of the middle part of the conductive base film 2 is smaller than the current density of the two sides of the conductive base film 2 when the current is equal to each part of the first anode unit due to the fact that the middle resistance of the conductive base film 2 is larger is effectively relieved, and the thickness uniformity of a plating layer of the conductive base film 2 along the direction perpendicular to the first direction is improved.

It should be noted that, the above-mentioned middle region 12a1 and two end regions 12a2 of the first anode module 12 may be understood that the middle region 12a1 of the first anode module 12 is farther from two edges of the first anode module 12 in the width direction than the two end regions 12a2 of the first anode module 12, and the concept that the middle region 12a1 and the two end regions 12a2 are two opposite positions is not limited to one absolute position of the first anode module 12, in other words, the current of the first anode module 12 increases and decreases in the second direction y. The two sides of the conductive base film in the width direction are: on both sides of the conductive base film in a direction perpendicular to or oblique to the film-feeding direction itself.

It should be further noted that, the thickness of the plating layer of the conductive base film along the direction perpendicular to the first direction x tends to be uniform, which is to be understood that in the embodiment of the present invention, the thickness of the plating layer of the conductive base film 2 along the direction perpendicular to the first direction x is not exactly the same, and may have a certain difference, compared to the manner in which the portions of the first anode module 12 are supplied with the same current, when the electroplating apparatus 1 in the embodiment of the present invention is used to electroplate the conductive base film 2, the thickness of the plating layer of the conductive base film along the direction perpendicular to the first direction x is more uniform.

The film feeding direction of the conductive base film 2 is understood to be the film feeding direction of the conductive base film 2, in which the side of the conductive base film 2 entering the plating tank 11 is the in-tank side 1a, the side of the conductive base film leaving the plating tank 11 is the out-tank side 1b, and the direction from the in-tank side 1a to the out-tank side 1b is the film feeding direction of the conductive base film 2.

It will be appreciated that the plating tank 11 is generally a rectangular plating tank 11, the first anode module 12 is in a rectangular plate structure, when the first anode module 12 is disposed in the plating tank 11, the length direction of the first anode module 12 can be set along the width direction of the plating tank 11, so that a plurality of first anode modules 12 arranged at intervals along the first direction x can be disposed in the plating tank 11, and then the second direction y is perpendicular to the first direction x, and when the conductive base film 2 is disposed in the plating tank 11, the second direction y can also be regarded as the width direction of the conductive base film 2. Of course, in other embodiments, the first anode module 12 may be disposed in the plating tank 11 in an inclined manner, and the second direction y may be inclined with respect to the first direction x.

Alternatively, the first anode module 12 may be an anode plate assembly or a titanium basket assembly. It can be understood that, when one surface of the conductive base film 2 is plated, the first anode module 12 is correspondingly disposed on one surface of the conductive base film 2 to be plated, and when both surfaces of the conductive base film 2 need to be plated, the first anode module 12 needs to be correspondingly disposed on both surfaces of the conductive base film 2.

Alternatively, the first anode module 12 includes a plurality of anode units 120 arranged along the second direction y, two adjacent anode units 120 are separated by an insulating medium, and at least part of the anode units 120 are electrically connected to the power source 3. Since the first anode module 12 includes the plurality of anode units 120 arranged along the second direction, the plurality of anode units 120 are electrically connected to the power source 3 so as to control the current of the plurality of anode units 120, for example, the current flowing into the corresponding anode units 120 can be adjusted according to the requirement of the plating uniformity of the conductive base film 2 or the requirement of the plating thickness of different positions of the conductive base film 2, compared to the first anode module 12 being integrally arranged.

Alternatively, the insulating medium may be a rubber strip, a plastic strip, or the like. The anode unit 120 can be effectively prevented from being electroplated by the insulating medium.

In order to realize that the current flowing through the middle region 12a1 of the conductive base film 2 in the second direction y is greater than the current flowing through the two end regions 12a2 thereof, as an alternative embodiment, the first anode module 12 includes three or more anode units 120, the anode units 120 are electrically connected to the power source 3, respectively, and the anode units 120 supply current in a manner of gradually decreasing the current from the middle to the two ends of the first anode module 12. Since the plurality of anode units 120 gradually decrease in current from the middle of the first anode module 12 to both ends, the current density applied to the middle of the conductive base film 2 by the anode units 120 can be made larger than the current applied to both ends of the conductive base film 2 in the width direction, thereby alleviating the problem that the current density at both ends of the conductive base film 2 is larger than that at the middle position due to the electrical connection of both ends of the conductive base film 2, making the current density of the conductive base film 2 in the width direction more uniform, and improving the thickness of the plating layer of the conductive base film 2 in the width direction more uniform.

It will be appreciated that the insulating medium between two adjacent anode units 120 may be an insulating tape, although in other embodiments, the insulating medium may be other insulating materials.

Referring to fig. 3 to 5, in other embodiments, the plurality of anode units 120 of the first anode module 12 includes one or more second anode units 122 located in the middle region 12a1 of the first anode module 12, one or more first anode units 121 located in one end region of the first anode module 12, and one or more third anode units 123 located in the other end region of the first anode module 12; the second anode unit 122 is electrically connected to the power source 3, and the first anode unit 121 and/or the third anode unit 123 is electrically connected to the power source and the current connected to the first anode unit 121 is smaller than the current connected to the second anode unit 122, or the current in the first anode unit 121 and/or the third anode unit 123, which is not electrically connected to the power source 3, is zero. In other words, the second anode unit 122 is electrically connected to the power source 3, the first anode unit 121 and/or the third anode unit 123 is electrically connected to the power source 3 and the current connected is smaller than the current connected to the second anode unit 122, or the second anode unit 122 is electrically connected to the power source 3, the first anode unit 121 and/or the third anode unit 123 is not electrically connected to the power source 3 or the current connected is zero.

It is understood that the second anode unit 122 located at the middle region 12a1 of the first anode module 12 corresponds to the middle position of the conductive base film 2 for plating, and the first anode unit 121 and the third anode unit 123 located at the both end regions 12a2 of the first anode module 12 correspond to both sides of the conductive base film 2 in the width direction. When the second anode unit 122 is electrically connected to the power supply 3, the radial electric lines of force generated by the second anode unit 122 can be radiated to both sides of the conductive base film 2 in the width direction while plating the middle position of the conductive base film 2, so as to plate both sides of the conductive base film 2 in the width direction.

When the current flowing in the first anode unit 121 and/or the third anode unit 123 is smaller than the current flowing in the second anode unit 122, the middle part of the conductive base film 2 is electroplated by the second anode unit 122 with larger current, both sides of the conductive base film 2 in the width direction are electroplated by the radiation of the electric line of force of the second anode unit 122 and are electroplated by the first anode unit 121 and the third anode unit 123 with smaller current, so that the electroplating uniformity of the conductive base film 2 in the width direction is balanced, and the thickness uniformity of the plating layer of the conductive base film 2 in the width direction is improved.

When the current that the first anode unit 121 and the second anode unit 122 are not electrically connected or connected to the power supply 3 is zero, that is, the first anode unit 121 and the third anode unit 123 do not supply current, so that the first anode unit 121 and the third anode unit 123 do not plate both sides of the conductive base film 2 along the second direction y, the both sides of the conductive base film 2 along the second direction y are plated through the power lines radiated by the second anode unit 122 located in the middle of the first anode module 12, the current density of both sides of the conductive base film 2 along the second direction y can be effectively reduced, so that the current densities of both sides and the middle of the conductive base film 2 along the second direction y are more similar, that is, the current density distribution of the conductive base film 2 along the second direction y is more uniform, so as to improve the uniformity of plating the conductive base film 2.

As can be seen from the foregoing, the first anode unit 121, the second anode unit 122, and the third anode unit 123 may be one or more, the first anode unit 121 and the third anode unit 123 are respectively located at two end regions 12a2 of the first anode module 12, and the second anode unit 122 is located at a middle region 12a1 of the first anode module 12, and then the first anode unit 121 and the third anode unit 123 are respectively located at two sides of the second anode unit 122, and there are positional relative relationships among the first anode unit 121, the second anode unit 122, and the third anode unit 123, but various dividing manners may be included, which will be illustrated below.

As shown in fig. 3, when the first anode module 12 includes three anode units 120 arranged at intervals in the second direction y in order, the three anode units 120 include one first anode unit 121, one second anode unit 122, and one third anode unit 123, respectively, as a first example. As shown in fig. 4, as a second example, when the first anode module 12 includes four anode units 120 arranged at intervals in the second direction y in order, the four anode units 120 include one first anode unit 121, two second anode units 122, and one third anode unit 123, respectively. As shown in fig. 5, as a third example, when the first anode module 12 includes five anode units 120 arranged at intervals in the second direction y in order, the five anode units 120 include one first anode unit 121, three second anode units 122, and one third anode unit 123, respectively. As shown in fig. 6, when the first anode module 12 includes five anode units 120 arranged at intervals in the second direction y in order, as a fourth example, the five anode units 120 may further include two first anode units 121, one second anode unit 122, and two third anode units 123, respectively. It is to be understood that the number of the first anode units 120 included in the first anode unit 121, the second anode unit 122, and the third anode unit 123 may be one or a plurality of, the same or different, and the above is merely illustrative, as long as the first anode unit 121, the second anode unit 122, and the third anode unit 123 are sequentially arranged along the second direction y. In this embodiment, a division manner in a third example is described as an example.

Further, when the second anode units 122 are provided in plurality, the current flowing through the second anode units 122 located in the middle of the middle region 12a1 is greater than the current flowing through the second anode units 122 located at both ends of the middle region 12a1 in the direction perpendicular to the first direction x. In this way, by further applying different currents to different positions of the second anode unit 122 of the first anode module 12, the current in the middle of the middle region 12a1 of the first anode module 12 is made larger than the current at both ends thereof, further improving the uniformity of the first anode module for the conductive base film plating.

Further, in the first anode module 12, the sum of the conductive areas of the first anode unit 121 is S1, the sum of the conductive areas of the second anode unit 122 is S2, the sum of the conductive areas of the third anode unit 123 is S3, when the first anode unit 121 and the third anode unit 123 of the first anode module 12 are not electrically connected to the power source or the current to be connected thereto is zero, 1.5% s2.ltoreq.s1+s3.ltoreq.16% S2, when the first anode unit 121 of the first anode module 12 is not electrically connected to the power source or the current to be connected thereto is zero, 1.5% (s2+s3). Ltoreq.s1.ltoreq.16% (s2+s3) when the third anode unit 123 of the first anode module 12 is not electrically connected to the power source or the current to be connected thereto is zero, 1.5% (s1+s2). Ltoreq.16% (s1+s2) when the first anode unit 121 is electrically connected to the power source 3. In other words, the sum of the conductive areas of the anode units that are not energized is 1.5% -16% of the sum of the conductive areas of the anode units that are energized, and illustratively, the sum of the conductive areas of the anode units that are not energized is 1.5%, 5%, 10%, 16% of the sum of the conductive areas of the anode units that are energized. By reasonably setting the ratio of the sum of the conductive areas of the anode units which are not electrified with current to the sum of the conductive areas of the anode units which are electrified with current, the situation that the plating thickness of the two sides of the conductive base film 2 is too thick and the plating thickness of the middle position is too thin can not be caused when the first anode module 12 is used for electroplating the conductive base film 2, and the situation that the plating thickness of the two sides of the conductive base film 2 is too thin and the plating thickness of the middle position is too thick can not be caused, namely, the uniformity of the current density of the two sides of the conductive base film 2 along the second direction y can be effectively controlled, so that the uniformity of electroplating the conductive base film 2 is improved.

The above-mentioned conductive area is the area of the surface of the anode unit 120 for plating the conductive base film 2, in other words, the area of the surface of the anode unit 120 facing the conductive base film 2.

As can be seen from the foregoing, in some embodiments, the first anode module 12 includes a plurality of first anode units 120 disposed at intervals, and two adjacent first anode units 120 are separated by an insulating medium, optionally, in order to improve the uniformity of electroplating the conductive base film 2 by the first anode module 12, the first anode module 12 may be divided into more first anode units 120, so that the control of the current density applied to the conductive base film 2 can be more accurate by controlling the current flowing into each first anode unit 120. As shown in fig. 7, alternatively, the plurality of anode units 120 may be arranged in a matrix of a plurality of rows and a plurality of columns, wherein a plurality of columns extending in the second direction y may be formed along the plurality of anode units 120, and each column of anode units includes one or more second anode units 122 located in the middle region 12a1 of the first anode module 12, one or more first anode units 121 located in one end region of the first anode module 12, and one or more third anode units 123 located in the other end region of the first anode module 12 as described above; the plurality of anode cells 120 may form a plurality of rows extending in the first direction, and the anode cells 120 located in the same row are connected in parallel. Since the plurality of first anode units 120 of the first anode module 12 are arranged in a matrix, the first anode module 12 has a plurality of anode units 120, and control of uniformity of current density applied to the conductive base film 2 can be improved by controlling current supplied to each anode unit electrically connected to a power source, respectively. Moreover, since the resistances of the conductive base films 2 corresponding to the plurality of anode units 120 disposed along the first direction x are the same, it is not necessary to control the current flowing through the plurality of first anode units 120 along the first direction x to balance the current density applied to the conductive base films 2, and therefore, the plurality of first anode units 120 along the first direction x can be connected in parallel to the same power supply 3, thereby being beneficial to reducing the number of power supplies 3 used and further reducing the cost.

As can be seen from the foregoing, the first anode unit group 121 and the third anode unit group 123 located at both sides of the first anode module 12 are not connected, the second anode unit group 122 located at the middle of the first anode module 12 is connected, and the current flowing from the middle to both sides of the first anode units 120 of the second anode unit group 122 is gradually reduced. As an example, as shown in fig. 7, for convenience of distinction, lines in which different power sources 3 are electrically connected to the anode unit 120 are represented by different lines. Illustratively, the first anode module 12 includes ten anode units 120, the ten anode units 120 are arranged in two rows of five, the first row of anode units located at the inlet side 1a is respectively referred to as a first anode unit 12a, a second anode unit 12b, a third anode unit 12c, a fourth anode unit 12d, and a fifth anode unit 12e, the row of anode units located at the outlet side 1b is respectively referred to as a sixth anode unit 12f, a seventh anode unit 12g, an eighth anode unit 12h, a ninth anode unit 12i, and a tenth anode unit 12j, and is respectively disposed corresponding to the first anode unit 12a, the second anode unit 12b, the third anode unit 12c, the fourth anode unit 12d, and the fifth anode unit 12e, then, the first anode unit 12a and the sixth anode unit 12f, the fifth anode unit 12e and the tenth anode unit 12j located at the side of the first anode module 12 are respectively a first anode unit 121 and a third anode unit 123, the first anode unit 121 and the third anode unit 123 are not connected with electricity, and the remaining six anode units 120 are second anode units 122, wherein the second anode unit 12b and the seventh anode unit 12g located at the same row are connected in parallel to the first power supply 31, the third anode unit 12c and the eighth anode unit 12h located at the same row are connected in parallel to the second power supply 32, the fourth anode unit 12d and the ninth anode unit 12i located at the same row are connected in parallel to the third power supply 33, and the current output by the second anode power supply 3 is greater than the current output by the first power supply 3 and the third power supply 3.

The inventors have found that the electric lines of force generated by the anode unit 120 located in the middle region 12a1 of the first anode module 12 during electroplating of the conductive base film 2 are also radiated to both sides of the conductive base film 2 along the second direction y due to the fact that the conductive base film 2 is closer to the conductive clips along the second direction y, the electric resistance of both sides of the conductive base film 2 along the second direction y is smaller, the electric current is larger, and thus the plating layer of both sides of the conductive base film 2 along the second direction y is thicker, based on this, in some embodiments, as shown in fig. 8, the projections of the first anode module 12 and the conductive base film 2 on the bottom surface of the electroplating bath 11 are respectively the first projection a and the second projection b, and the first projection a is located in the second projection b. In other words, in the second direction y, the two sides of the conductive base film 2 along the second direction y protrude from the two sides of the first anode module 12, so that the two sides of the conductive base film 2 along the second direction y are electroplated through the electric lines of force radiated by the first anode module 12, which can avoid the problem of greater density of the electric lines of force on the two sides of the conductive base film 2 along the second direction y, and is beneficial to improving the uniformity of the thickness of the conductive base film 2 along the second direction y.

Further, the distances between the two edges of the first projection a perpendicular to the first direction and the corresponding edges of the second projection b perpendicular to the first direction are L1, L2, 20 mm.ltoreq.L1.ltoreq.300mm, 20 mm.ltoreq.L2.ltoreq.300 mm, and L1 is, illustratively, 20mm, 100mm, 150mm, 250mm, 300mm, etc., and L2 is 20mm, 100mm, 150mm, 250mm, 300mm, etc. By setting the distance between the two edges of the first projection a and the two edges of the second projection b to be 20-300 mm, the density uniformity of the electric lines of force on the two opposite sides of the conductive base film 2 along the second direction y when the conductive base film 2 is electroplated by the first anode plate is further improved, and the uniformity of the plating thickness of the conductive base film 2 is improved.

Still further, 50 mm.ltoreq.L1.ltoreq.200mm, 50 mm.ltoreq.L2.ltoreq.200mm, and L1 is, illustratively, 50mm, 80mm, 120mm, 140mm, 170mm, 200mm, etc., and L2 is 50mm, 80mm, 120mm, 140mm, 170mm, 200mm, etc. By setting the distance L between the two edges of the first projection a and the two edges of the second projection b to be 50-200 mm, the density uniformity of the electric lines of force on the two opposite sides of the conductive base film 2 along the second direction y when the conductive base film 2 is electroplated by the first anode plate is further improved, so that the uniformity of the plating thickness of the conductive base film 2 is improved.

It will be appreciated that when the conductive base film 2 is not electroplated, the metal layers attached to both sides of the insulating material of the conductive base film 2 are thinner, resulting in weaker conductive capability and smaller current carrying capability, so that when the conductive base film 2 just begins to enter the electroplating bath 11, the first anode module 12 can only apply smaller current in order to match the current carrying capability of the conductive base film, and as the conductive base film 2 moves from the inlet side 1a to the outlet side 1b, the conductive base film 2 is electroplated, the plating thickness of the conductive base film 2 gradually increases, and the current carrying capability thereof gradually increases, based on which, in order to increase the electroplating rate, as shown in fig. 9, in some embodiments, m first anode modules 12 are arranged in the first direction x, each first anode module 12 includes n anode units 120 arranged in a row-by-row arrangement in the second direction y, the adjacent two anode units are separated by the insulating medium, the anode units are distributed in a matrix arrangement of n rows and m columns, wherein m is a natural number of anodes greater than 1, n is a natural number greater than 0, and at least one row of the anode units 120 gradually increases in the first direction x. Since the current flowing through at least one row of anode units 120 in the first direction x gradually increases, the current applied by the anode units 120 can be correspondingly increased along with the thickness increase and the current carrying capacity enhancement of the plating layer of the conductive base film 2, so as to increase the current density of the conductive base film 2 and further increase the electroplating rate. For example, when n=1, the first anode modules 12 are a whole anode unit 120, the current flowing through the first anode modules 12 increases gradually along the first direction x, when n > 1, the anode units 120 of the first anode modules 12 form a plurality of rows, and when n=2, the current flowing through the first anode units 120 of at least one row increases gradually along the first direction x, for example, when n=2, the current flowing through each of the two rows of first anode units 120 increases gradually along the first direction x, for example, when n=5, the current flowing through the first anode units 120 of 3 rows located in the middle of the first anode modules 12 increases gradually along the first direction x. As shown in fig. 9, an example is illustrated in which m=3, n=5, and each first anode module 12 includes two columns of anode units 120.

Optionally, in the first direction x, the current flowing through the anode units 120 of row a located in the middle area 12a1 of the first anode module 12 gradually increases, the anode units 120 of row B are respectively located at two sides of the anode units 120 of row a, and the current flowing through the anode units 120 of row B increases and decreases first, where A, B is a natural number greater than 0. As can be seen from the foregoing, the resistance of the conductive base film 2 along the second direction y is smaller, the resistance of the middle portion is larger, and thus the current density of the conductive base film 2 along the second direction y is larger, and the current density of the middle portion is smaller, so that the plating thickness of the conductive base film 2 along the second direction y is more uniform, and the plating uniformity is improved while the plating rate is improved, by gradually reducing the current flowing into the first anode unit 120 along the B line, as the current of the anode units 120 along the a line and the B line is gradually increased, the plating thickness of the conductive base film 2 along the second direction y is increased at a higher speed than the plating thickness of the middle portion of the conductive base film 2 along the B line. For example, when n=5, a=3, and b=1, where in the second direction y, the 5 rows of anode units 120 are respectively called a first row of anode units 1201, a second row of anode units 1202, a third row of anode units 1203, a fourth row of anode units 1204, and a fifth row of anode units 1205, the current flowing in the second row of anode units 1202, the third row of anode units 1203, and the fourth row of anode units 1204 along the first direction x in the middle of the first anode module 12 gradually increases, and the current flowing in the first row of anode units 1201 and the fifth row of anode units 1205 along the first direction x on both sides of the first anode module 12 increases and then decreases.

Referring to fig. 9 and 10 together, further, at the first position, the current flowing through the anode units 120 of row B is changed from gradually increasing to gradually decreasing, wherein when the conductive base film 2 is at the first position, the thickness of the metal coating at the edge of the conductive base film 2 is d1, the thickness of the metal coating at the middle part of the conductive base film 2 is d2, the thickness of the target metal coating of the conductive base film 2 is d3, d1-d2 is greater than or equal to 20% d3, or d1 is greater than or equal to 40% d3, or d1 is greater than or equal to 400nm. Through ingenious setting up the electric current of going first positive pole unit 120 of line B in first position department change from increase gradually to reduce gradually, can avoid first positive pole module 12 to the plating layer that both sides of electrically conductive base film 2 electroplate too thick, the middle part position electroplate the thinner condition of plating layer, also can avoid the plating layer thickness that first positive pole module 12 electroplate both sides of electrically conductive base film 2 too thin, the plating layer thickness that middle part position electroplate too thick condition, namely, can effectively improve electrically conductive base film 2 along second direction y's electroplating homogeneity. As can be seen from the foregoing, when the conductive base film 2 just enters the plating tank 11, the conductive base film 2 can only carry a smaller current density, otherwise, the conductive base film 2 may be burnt, burned through, etc., so if the middle current of the first anode module 12 is large and the current on both sides is small to improve the plating uniformity of the conductive base film 2, on one hand, the middle of the first anode module 12 is limited by the smaller current carrying capacity of the conductive base film 2, and the current applied on both sides of the first anode module 12 is smaller, which results in slower plating rate. Based on this, in some embodiments, the electroplating apparatus 1 further includes a second anode module 13, the second anode module 13 is disposed in the electroplating tank 11, and the second anode module 13 is closer to the tank inlet side 1a than the first anode module 12, the second anode module 13 includes a plurality of fourth anode units 131, and two adjacent fourth anode units 131 are separated by an insulating medium, and the plurality of fourth anode units 131 are electrically connected to the power source 3, where at least a portion of the fourth anode units 131 are connected in parallel to the same power source. Since at least part of the fourth anode units 131 are connected in parallel to the same power supply, the currents fed into the fourth anode units 131 are the same, and the number of power supplies can be reduced, which is beneficial to reducing the cost. In addition, in order to have a faster plating rate, the current flowing into the plurality of second anode modules 13 may be the maximum value of the current carrying capacity of the conductive base film 2, so that the plating rate may be increased, and then a larger current is flowing into the middle region 12a1 of the first anode module 12 located on the outlet side 1b of the second anode module 13, and smaller currents are flowing into the two side regions, so as to balance the plating thickness of the conductive base film 2 along the second direction y, thereby ensuring a faster plating rate and achieving better plating uniformity.

Illustratively, the plurality of fourth anode units 131 are divided into two groups, and the two groups of fourth anode units 131 are electrically connected to the two power sources 3, respectively. By dividing the fourth anode unit 131 into two groups to be electrically connected to the two power supplies 3, the second anode module is only required to be electrically connected to the two power supplies 3, the number of the used power supplies 3 is small, the production cost can be reduced, the wiring mode can be simplified, and in addition, the two groups of fourth anode unit groups 122 are controlled by the two power supplies 3, compared with the case that only the second anode module is connected to one power supply 3, the output current of each power supply 3 is easier to control, so that the stability of the current control of each anode unit is improved.

The electroplating apparatus 1 of the first aspect of the present invention can increase the current density at the middle position of the conductive base film 2 when electroplating the conductive base film 2 by providing the current flowing through the middle of the first anode module 12 of the first anode structure to be greater than the current flowing through both ends of the first anode module 12 of the first anode structure, thereby improving the uniformity of electroplating the conductive base film 2.

As shown in fig. 11, the second aspect of the present invention discloses a plating machine 100, which comprises a plating apparatus 1 as described in the first aspect, and a transport mechanism 4, wherein the plating apparatus 1 is used for plating a conductive base film 2, and the transport mechanism 4 is used for clamping the conductive base film 2 and moving the conductive base film 2 in a first direction x in a plating tank 11 of the plating apparatus 1.

It will be appreciated that the plating machine 100 including the plating apparatus 1 according to the above embodiment has all the technical effects of the plating apparatus 1 according to the first aspect, and will not be described herein.

Specifically, the transporting mechanism 4 may include a driving device 41, a conveyor belt 42, and a conductive clip 43 connected to the conveyor belt 42, where the driving device 41 is used to drive the conveyor belt 42 to move so as to drive the conductive clip 43 to move along the first direction x, and the conductive clip 43 is used to clip on the conductive base film 2. Of course, in other embodiments, the transporting mechanism 4 may have other structures as long as the conductive base film 2 can be transported to move the conductive base film 2 along the first direction x.

The electroplating apparatus disclosed in the embodiments of the present invention has been described in detail, and specific examples are applied herein to illustrate the principles and embodiments of the present invention, and the description of the above examples is only for helping to understand the electroplating apparatus and core ideas of the present invention; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the idea of the present invention, the present disclosure should not be construed as limiting the present invention in summary.

Claims (12)

1. An electroplating apparatus, comprising:

The electroplating tank is used for electroplating the conductive base film entering the electroplating tank, the film entering direction of the conductive base film is a first direction, and the direction inclined or perpendicular to the first direction is a second direction; and

The first anode modules are arranged in the electroplating tank and are electrically connected with a power supply, and in the second direction, the current flowing in the middle area of the first anode modules is larger than the current flowing in the two end areas of the first anode modules, so that the thickness of the plating layer of the conductive base film in the direction perpendicular to the first direction tends to be uniform;

In the first direction, the number of the first anode modules is m, each first anode module comprises n anode units arranged in a second direction, and two adjacent anode units are separated by an insulating medium; the anode units are distributed in a matrix arrangement of n rows and m columns, wherein m is a natural number greater than 1, and n is a natural number greater than 0;

the current flowing into at least one row of the first anode units is gradually increased along the first direction;

The current flowing into the anode units in the row A in the middle area of the first anode module is gradually increased along the first direction;

The anode units of row B are respectively arranged on two sides of the anode units of row A, and the current introduced by the anode units of row B is increased and then decreased;

Wherein A, B is a natural number greater than 0;

The current flowing into the anode units of the row B at the first position is changed from gradual increase to gradual decrease;

When the conductive base film is at the first position, the thickness of a metal coating on the edge of the conductive base film is d1, the thickness of a metal coating on the middle part of the conductive base film is d2, the thickness of a target metal coating of the conductive base film is d3, d1-d2 is more than or equal to 20% d3, d1 is more than or equal to 40% d3, or d1 is more than or equal to 400nm.

2. The plating apparatus as recited in claim 1, wherein said first anode module includes a plurality of anode units aligned in said second direction, adjacent ones of said anode units being separated by an insulating medium, at least a portion of said anode units being electrically connected to said power source.

3. Electroplating apparatus according to claim 2, wherein:

The plurality of anode units of the first anode module comprise one or more second anode units positioned in the middle area of the first anode module, one or more first anode units positioned in the one end area of the first anode module, and one or more third anode units positioned in the other end area of the first anode module;

wherein the second anode unit is electrically connected to a power source, and

The first anode unit and/or the third anode unit is/are electrically connected to a power supply and the connected current is smaller than the connected current of the second anode unit, or the first anode unit and/or the third anode unit is/are not electrically connected to the power supply or the connected current is zero.

4. A plating apparatus according to claim 3, wherein:

In the first anode module, the sum of the conductive areas of the first anode units is S1, the sum of the conductive areas of the second anode units is S2, and the sum of the conductive areas of the third anode units is S3;

When the first anode unit and the third anode unit of the first anode module are not electrically connected to a power source or the connected current is zero, 1.5% S2 is less than or equal to (S1+S3) and less than or equal to 16% S2;

When the first anode unit of the first anode module is not electrically connected to a power supply or the connected current is zero, the third anode unit is electrically connected to the power supply, 1.5% (S2+S3) is more than or equal to S1 and less than or equal to 16% (S2+S3);

When the third anode unit of the first anode module is not electrically connected to a power supply or the connected current is zero, 1.5% (S1+S2) is less than or equal to S3 and less than or equal to 16% (S1+S2) when the first anode unit is electrically connected to the power supply.

5. A plating apparatus according to claim 3, wherein said second anode units are provided in plural, and a current flowing in said second anode unit located in the middle of said middle region is larger than a current flowing in said second anode unit located at both ends of said middle region in a direction perpendicular to said first direction.

6. The plating apparatus as recited in claim 2, wherein said first anode module includes three or more of said anode units, each of said anode units being electrically connected to a power source, respectively, and wherein a current is supplied between each of said anode units in such a manner that a current gradually decreases from a middle of said first anode module toward both ends.

7. The electroplating apparatus of claim 1, wherein the projections of the first anode module and the conductive base film on the bottom surface of the electroplating bath are a first projection and a second projection, respectively, and the first projection is located in the second projection.

8. The electroplating apparatus of claim 7, wherein the first projection has a distance L1, L2, 20mm ∈l1 ∈300mm,20mm ∈l2 ∈300mm along two edges perpendicular to the first direction and the second projection has a distance from the corresponding edge perpendicular to the first direction, respectively.

9. The plating apparatus as recited in claim 8, wherein 50 mm. Ltoreq.L1.ltoreq.200mm, 50 mm. Ltoreq.L2.ltoreq.200mm.

10. The plating apparatus as recited in claim 2, wherein said plurality of anode units of said first anode module are arranged in a matrix arrangement of a plurality of rows and a plurality of columns,

Wherein the plurality of anode units form a plurality of columns extending in the second direction, the anode units of each column including one or more second anode units located in a middle region of the first anode module, one or more first anode units located in an end region of the first anode module, one or more third anode units located in an other end region of the first anode module;

the second anode unit is electrically connected to a power source, and

The first anode unit and/or the third anode unit are/is electrically connected to a power supply and the connected current is smaller than the connected current of the second anode unit, or the first anode unit and/or the third anode unit are/is not electrically connected to the power supply;

the plurality of anode units form a plurality of rows extending along the first direction, and the anode units positioned in the same row are connected in parallel.

11. The plating apparatus as recited in any one of claims 1-10, wherein said plating apparatus further comprises a second anode module, and said second anode module is closer to a tank-entering side than said first anode module;

The second anode module comprises a plurality of fourth anode units, two adjacent fourth anode units are separated by an insulating medium, the fourth anode units are electrically connected to the power supply, and at least part of the fourth anode units are connected in parallel to the same power supply.

12. A film plating machine comprising a plating apparatus according to any of claims 1-11 for plating a conductive base film and a transport mechanism for clamping the conductive base film and moving the conductive base film in the first direction in the plating tank of the plating apparatus.