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CN115058168A - Coating base plate for PCB drilling and preparation method thereof - Google Patents

Coating base plate for PCB drilling and preparation method thereof Download PDF

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Publication number
CN115058168A
CN115058168A CN202110908571.5A CN202110908571A CN115058168A CN 115058168 A CN115058168 A CN 115058168A CN 202110908571 A CN202110908571 A CN 202110908571A CN 115058168 A CN115058168 A CN 115058168A
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China
Prior art keywords
coating
parts
pcb
drilling
lubricant
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Application number
CN202110908571.5A
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Chinese (zh)
Inventor
李仁胜
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Dongguan Xianghua Electronic Technology Co ltd
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Dongguan Xianghua Electronic Technology Co ltd
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Priority to CN202110908571.5A priority Critical patent/CN115058168A/en
Publication of CN115058168A publication Critical patent/CN115058168A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09D161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C09D161/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/06—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to wood
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2203/00—Other substrates
    • B05D2203/20—Wood or similar material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention relates to the technical field of PCB (printed circuit board) drilling base plates, in particular to a coating base plate for PCB drilling. The coating base plate for PCB drilling comprises a base material and coatings coated on the upper surface and the lower surface of the base material, wherein the coating comprises, by weight, 30-40 parts of urea-formaldehyde resin, 55-65 parts of inorganic filler, 30-35 parts of lubricant, 1.5-2.5 parts of defoaming agent, 2-4 parts of curing agent and 50-55 parts of solvent. The coating base plate for PCB drilling not only has good hydrophobicity, but also has good hardness and flatness.

Description

Coating base plate for PCB drilling and preparation method thereof
Technical Field
The invention relates to the technical field of PCB (printed circuit board) drilling base plates, in particular to a coating base plate for PCB drilling.
Background
The backing plate is a material commonly obtained in PCB drilling, the consumption of the PCB industry is large, the backing plate is an indispensable material in the PCB industry, and meanwhile, the quality requirement of the backing plate in the industry during PCB drilling is particularly high. If the roughness of backing plate is not good can make the base material burr appear when drilling the mouth, if the hardness of backing plate crosses low its protection drilling machine mesa that can not be fine excessively, thereby the influence of the easy received temperature of some backing plates that have on the market, humidity causes the backing plate warpage big, the poor question of roughness.
In response to the above problems, the applicant previously developed a coated pad for PCB drilling and applied for a related patent (application No. 2019111973106) with good water resistance, but found that the pad has a general hardness in use.
The invention aims to develop a coating base plate for PCB drilling with good hardness and good water resistance on the basis of the prior art.
Disclosure of Invention
In order to solve the technical problems, the first aspect of the invention provides a coating base plate for PCB drilling, which comprises a base material and coatings coated on the upper surface and the lower surface of the base material, wherein the raw materials of the coatings comprise, by weight, 30-40 parts of urea-formaldehyde resin, 55-65 parts of inorganic filler, 30-35 parts of lubricant, 1.5-2.5 parts of defoaming agent, 2-4 parts of curing agent and 50-55 parts of solvent.
As a preferable technical scheme of the invention, the coating layers coated on the upper surface and the lower surface of the base material are 20-30 μm.
In a preferred embodiment of the present invention, the inorganic filler includes gypsum.
As a preferable technical scheme, the gypsum material is a composition of gypsum powder and gypsum whiskers.
As a preferred technical scheme of the invention, the inorganic filler also comprises titanium dioxide.
As a preferable technical scheme of the invention, the raw material of the coating also comprises 1.5-3 parts by weight of a compound with the following structure,
Figure BDA0003202809370000021
r is C 10 -C 20 Alkyl group of (1).
In a preferred embodiment of the present invention, the lubricant is at least one selected from the group consisting of an amide lubricant, a fatty acid lubricant, an ester lubricant, a hydrocarbon lubricant, and an alcohol lubricant.
In a preferred embodiment of the present invention, the defoaming agent is a polysiloxane-based defoaming agent.
The second aspect of the invention provides a preparation method of a coating base plate for PCB drilling, which comprises the following preparation steps:
s1: coating a surface coating on the substrate, namely rolling the coating on the upper surface of the substrate by a roller, flattening an anilox roller and curing to obtain the surface coating on the upper surface of the substrate;
s2: coating a surface coating on the lower surface of the substrate, and rolling the surface coating on the lower surface of the substrate by a roller, flattening by an anilox roller and curing to obtain the surface coating on the lower surface of the substrate.
As a preferred technical scheme of the invention, the curing temperature is 150-.
Has the advantages that:
1. the coating of the coating base plate for PCB drilling comprises a raw material with a special structure, so that the coating system can be well and closely arranged, and the hydrophobicity is further increased;
2. the gypsum whisker has a special structure similar to fiber, so that the coating has better smoothness and flatness when being combined with a wood fiberboard;
3. the raw materials with special structures in the invention enable the gypsum whiskers to reduce the boring loss rate of gypsum, and simultaneously, the gypsum whiskers and other raw materials synergistically act to increase the hardness of the backing plate.
Detailed Description
The present invention will be more readily understood by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.
The term "prepared from …" as used herein is synonymous with "comprising". The terms "comprises," "comprising," "includes," "including," "has," "having," "contains," "containing," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
The conjunction "consisting of …" excludes any unspecified elements, steps or components. If used in a claim, the phrase is intended to claim as closed, meaning that it does not contain materials other than those described, except for the conventional impurities associated therewith. When the phrase "consisting of …" appears in a clause of the subject matter of the claims rather than immediately after the subject matter, it defines only the elements described in the clause; no other elements are excluded from the claims as a whole.
When an amount, concentration, or other value or parameter is expressed as a range, preferred range, or as a range of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when a range of "1 to 5" is disclosed, the described range should be interpreted to include the ranges "1 to 4", "1 to 3", "1 to 2 and 4 to 5", "1 to 3 and 5", and the like. When a range of values is described herein, unless otherwise stated, the range is intended to include the endpoints thereof and all integers and fractions within the range.
The singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. "optional" or "any" means that the subsequently described event or events may or may not occur, and that the description includes instances where the event occurs and instances where it does not.
Approximating language, as used herein throughout the specification and claims, is intended to modify a quantity, such that the invention is not limited to the specific quantity, but includes portions that are literally received for modification without substantial change in the basic function to which the invention is related. Accordingly, the use of "about" to modify a numerical value means that the invention is not limited to the precise numerical value. In some instances, the approximating language may correspond to the precision of an instrument for measuring the value. In the present description and claims, range limitations may be combined and/or interchanged, including all sub-ranges contained therein if not otherwise stated.
In addition, the indefinite articles "a" and "an" preceding an element or component of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the element or component. Thus, "a" or "an" should be read to include one or at least one, and the singular form of an element or component also includes the plural unless the stated number clearly indicates that the singular form is intended.
In order to solve the above technical problems, a first aspect of the present invention provides a coated pad for PCB drilling, which includes a substrate and coatings coated on upper and lower surfaces of the substrate.
In one embodiment, the coating layers applied to the upper and lower surfaces of the substrate are 20 to 30 μm.
The substrate used in the present invention is a wood fiber board, which is commercially available from manufacturers including, but not limited to, Jiangsu New Su building materials, Inc.
In one embodiment, the raw materials of the coating comprise, by weight, 30-40 parts of urea-formaldehyde resin, 55-65 parts of inorganic filler, 30-35 parts of lubricant, 1.5-2.5 parts of defoaming agent, 2-4 parts of curing agent and 50-55 parts of solvent.
In a preferred embodiment, the raw materials of the coating comprise, by weight, 35 parts of urea-formaldehyde resin, 61 parts of inorganic filler, 32 parts of lubricant, 2 parts of defoaming agent, 3 parts of curing agent and 52 parts of solvent.
The urea-formaldehyde resin has moderate water resistance, is used in the wood industry more frequently, and is selected in the invention in order to ensure that the performance of the base plate is more excellent, and the source of the urea-formaldehyde resin is not limited.
In one embodiment, the urea-formaldehyde resin is available from Shandong Moore chemical Co., Ltd.
In one embodiment, the inorganic filler comprises a gypsum material.
In a preferred embodiment, the gypsum material is a composition of gypsum powder and gypsum whiskers, and the weight ratio of the gypsum powder to the gypsum whiskers is (5-10): 1; preferably 8: 1.
in order to ensure the whiteness of the coating, in a preferred embodiment, the inorganic filler further comprises titanium dioxide.
In a preferred embodiment, the weight ratio of the titanium dioxide to the gypsum material is 1: (1.5-2); preferably 1: 1.7.
in one embodiment, the landplaster is available from Zaozhuang Hui George building materials, Inc. under the trade designation zy-021.
In one embodiment, the gypsum whiskers are available from Hebei Hemikushiyaite products, Inc.
In one embodiment, the titanium dioxide is dupont titanium dioxide R902.
In one embodiment, the coating further comprises from 1.5 to 3 parts by weight of a compound of the following structure:
Figure BDA0003202809370000051
r is C 10 -C 20 The alkyl group of (1).
In a preferred embodiment, R is C 13 -C 18 Alkyl group of (1).
In a more preferred embodiment, the coating material further comprises 1.5 to 3 parts by weight of a composition of compounds of the following structure:
Figure BDA0003202809370000052
r is C 14 Alkyl group of (A) or (B),
Figure BDA0003202809370000053
R is C 16 In a weight ratio of (1-1.5): 1; preferably 1.3: 1; in particular to a composition of ditetradecyl dimethyl ammonium chloride and dioctadecyl dimethyl ammonium chloride.
In one embodiment, the dioctadecyl dimethyl ammonium chloride is available from southbound runfeng petrochemical company, inc; the ditetradecyl dimethyl ammonium chloride is purchased from Ghan scientific & Jie Biotech limited.
The applicant also previously prepared a coating base plate for PCB drilling, which has good water resistance, but has general smoothness and hardness, and based on previous researches, the applicant found that the coating base plate for PCB drilling of the invention has better water resistance and better hardness and smoothness compared with the previous coating base plate for PCB drilling, probably because a certain amount of gypsum whiskers are added in the invention, the gypsum whiskers have a special structure similar to fibers, so that the coating has better smoothness and smoothness when being combined with a wood fiber board, meanwhile, the ditetradecyl dimethyl ammonium chloride and the dioctadecyl dimethyl ammonium chloride drive the dispersibility of gypsum and titanium dioxide in a system, and simultaneously, the inorganic filler and resin have good compatibility, and the smoothness of the base plate surface is further increased, the ditetradecyl dimethyl ammonium chloride and the dioctadecyl dimethyl ammonium chloride have similar hydrophobic chains and structures, are well closely arranged in a coating system, and increase the defect that the retention rate of the gypsum whisker is reduced due to the synergistic effect of the ditetradecyl dimethyl ammonium chloride and the dioctadecyl dimethyl ammonium chloride, so that the hardness and the hydrophobicity of the backing plate are increased.
In order to maintain uniformity and stability of the coating system, in one embodiment, the lubricant is selected from at least one of an amide-based lubricant, a fatty acid-based lubricant, an ester-based lubricant, a hydrocarbon-based lubricant, and an alcohol-based lubricant.
In a preferred embodiment, the lubricant is a combination of an amide-based lubricant and a hydrocarbon-based lubricant in a weight ratio of (2-4): 1; preferably 3: 1.
in one embodiment, the amide-based lubricant is selected from at least one of stearic acid amide, erucic acid amide, oleic acid amide, N-ethylene bis-stearamide, polyamide wax.
In one embodiment, the hydrocarbon lubricant is selected from at least one of microcrystalline paraffin, liquid paraffin, solid paraffin, polyethylene wax.
In a preferred embodiment, the amide lubricant is a combination of erucamide, oleamide, polyamide wax in the weight ratio of (4-7): (3-6): 1; preferably 6: 5: 1.
in order to increase the water resistance of the pad in cooperation with tetradecyldimethylammonium chloride and dioctadecyldimethylammonium chloride in the system, in a preferred embodiment, the hydrocarbon lubricant is polyethylene wax.
In one embodiment, the erucamide is a DINGHAI brand erucamide; the oleamide is of DINGHAI brand; the polyamide wax is AQH-800 of Disibulone, Japan.
In one embodiment, the polyethylene wax is Honeywell AC-6.
In one embodiment, the defoamer is a silicone based defoamer.
In one embodiment, the silicone based anti-foaming agent is available from federal fine chemicals limited, guangdong.
In one embodiment, the curing agent is selected from at least one of ammonium sulfate, hexamethylenetetramine, urea, ammonium chloride, ammonia; ammonium chloride is preferred.
The solvent is water.
In one embodiment, the coating is prepared by a method comprising:
(1) mixing and stirring the resin and the solvent for 10-30min to obtain a material A;
(2) adding the rest raw materials except the curing agent into the material A, mixing and stirring for 40-50min to obtain a material B;
(3) before use, adding the curing agent into the material B, and uniformly stirring to obtain the coating.
The second aspect of the invention provides a preparation method of a coating base plate for PCB drilling, which comprises the following preparation steps:
s1: coating a surface coating on the substrate, namely rolling the coating on the upper surface of the substrate by a roller, flattening an anilox roller and curing to obtain the surface coating on the upper surface of the substrate;
s2: and coating the surface coating on the lower surface of the base material, namely rolling the surface coating on the lower surface of the base material by a roller, flattening by an anilox roller and curing to obtain the surface coating on the lower surface of the base material.
In one embodiment, the curing temperature is 150 ℃ and 180 ℃ and the curing time is 10-30 min.
The present invention will be specifically described below by way of examples. It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
In addition, the starting materials used are all commercially available, unless otherwise specified.
Examples
Example 1
A PCB drilling coating base plate comprises a base material and coatings coated on the upper surface and the lower surface of the base material; the coatings coated on the upper surface and the lower surface of the base material are 25 micrometers;
the base material is a wood fiber board, and the wood fiber board is purchased from Jiangsu New Su building materials Co., Ltd;
the raw materials of the coating comprise, by weight, 35 parts of urea-formaldehyde resin, 61 parts of inorganic filler, 32 parts of lubricant, 2 parts of defoaming agent, 3 parts of curing agent and 52 parts of solvent;
the urea-formaldehyde resin is purchased from Shandong Moore chemical Co., Ltd;
the inorganic filler comprises a gypsum material; the gypsum material is a composition of gypsum powder and gypsum whiskers, and the weight ratio of the gypsum material to the gypsum whisker is 8: 1; the inorganic filler also comprises titanium dioxide; the weight ratio of the titanium dioxide to the gypsum material is 1: 1.7;
the gypsum powder is purchased from Zaozhuang Hui Meng building materials Co., Ltd, and the product number is zy-021; the gypsum whisker is purchased from Hebei Hemiguang mineral products, Inc.; the titanium dioxide is DuPont titanium dioxide R902;
the raw materials of the coating also comprise a composition of 2 parts by weight of ditetradecyl dimethyl ammonium chloride and dioctadecyl dimethyl ammonium chloride, and the weight ratio of the ditetradecyl dimethyl ammonium chloride to the dioctadecyl dimethyl ammonium chloride is 1.3: 1;
the dioctadecyl dimethyl ammonium chloride is purchased from Nantong Runfeng petrochemical company Limited; the ditetradecyl dimethyl ammonium chloride is purchased from Ghan scientific & Jie Biotech limited.
The lubricant is a combination of an amide lubricant and a hydrocarbon lubricant, and the weight ratio of the amide lubricant to the hydrocarbon lubricant is 3: 1; the amide lubricant is a combination of erucamide, oleamide and polyamide wax, and the weight ratio of the amide lubricant to the polyamide wax is 6: 5: 1; the hydrocarbon lubricant is polyethylene wax;
the erucamide is under the DINGHAI brand; the oleamide is of DINGHAI brand; the polyamide wax is AQH-800 of King-Siblon, Japan; the polyethylene wax is Honeywell AC-6;
the defoaming agent is polysiloxane defoaming agent; the polysiloxane defoamer is purchased from federal fine chemical limited in Guangdong;
the curing agent is ammonium chloride;
the solvent is water
The preparation method of the coating comprises the following steps: (1) mixing and stirring the resin and the solvent for 20min to obtain a material A; (2) adding the rest raw materials except the curing agent into the material A, mixing and stirring for 45min to obtain a material B; (3) before use, adding a curing agent into the material B, and uniformly stirring to obtain a coating;
the preparation method of the coating base plate for PCB drilling comprises the following preparation steps:
s1: coating a surface coating on the substrate, namely rolling the coating on the upper surface of the substrate by a roller, flattening an anilox roller and curing to obtain the surface coating on the upper surface of the substrate;
s2: coating a surface coating on the lower surface of the substrate, and rolling the surface coating on the lower surface of the substrate by a roller, flattening by an anilox roller and curing to obtain the surface coating on the lower surface of the substrate.
The curing temperature is 165 ℃ and the curing time is 20 min.
Example 2
The specific implementation mode of the coating base plate for PCB drilling is the same as that of the embodiment 1, but the coating base plate does not contain dioctadecyl dimethyl ammonium chloride.
Example 3
A coated backing plate for PCB drilling is disclosed, which is similar to example 1 except that there are no gypsum whiskers.
Example 4
The specific implementation mode of the coating backing plate for PCB drilling is the same as that of example 1, and the weight ratio of the gypsum powder to the gypsum whisker is 15: 1.
performance testing
1. And (3) hardness testing:
the hardness of the surface of the coating pad for PCB drilling in the examples was tested using a pencil hardness tester.
2. Thickness range test:
the test samples were: the coating pad plate for PCB drilling in the embodiment; the test method comprises the following steps: and measuring the thicknesses of the four corners and the middle 5 position of each plate, and calculating the thickness range of each plate.
The test results are shown in table 1:
TABLE 1
Figure BDA0003202809370000091
The foregoing examples are merely illustrative and serve to explain some of the features of the method of the present invention. The appended claims are intended to claim as broad a scope as is contemplated, and the examples presented herein are merely illustrative of selected implementations in accordance with all possible combinations of examples. Accordingly, it is applicants' intention that the appended claims are not to be limited by the choice of examples illustrating features of the invention. Also, where numerical ranges are used in the claims, subranges therein are included, and variations in these ranges are also to be construed as possible being covered by the appended claims.

Claims (10)

1. The coating base plate for PCB drilling comprises a base material and coatings coated on the upper surface and the lower surface of the base material, and is characterized in that the raw materials of the coatings comprise, by weight, 30-40 parts of urea-formaldehyde resin, 55-65 parts of inorganic filler, 30-35 parts of lubricant, 1.5-2.5 parts of defoaming agent, 2-4 parts of curing agent and 50-55 parts of solvent.
2. The coated backing plate for drilling holes in PCB of claim 1, wherein the coating layer coated on the upper and lower surfaces of the substrate is 20-30 μm.
3. A coated pad for drilling holes in PCBs according to claim 1 or 2, wherein the inorganic filler comprises a gypsum material.
4. The coated pad for drilling holes in PCB of claim 3, wherein said gypsum material is a combination of gypsum powder and gypsum whiskers.
5. The coated pad for drilling holes in PCB of claim 1, wherein said inorganic filler further comprises titanium dioxide.
6. The coated pad plate for PCB drilling according to claim 3, wherein the raw material of the coating further comprises 1.5-3 parts by weight of a compound of the following structure,
Figure FDA0003202809360000011
r is C 10 -C 20 Alkyl group of (1).
7. The coated pad for drilling of PCB according to claim 1 or 2, wherein the lubricant is at least one selected from amide-based lubricant, fatty acid-based lubricant, ester-based lubricant, hydrocarbon-based lubricant, and alcohol-based lubricant.
8. The coated pad for drilling PCB according to claim 1 or 2, wherein the defoaming agent is polysiloxane-based defoaming agent.
9. A method for preparing a coated pad for PCB drilling according to any one of claims 1 to 8, comprising the steps of:
s1: coating the upper surface coating of the base material, namely coating the upper surface coating of the base material, and obtaining the upper surface coating of the base material through roll extrusion, smoothing of an anilox roller and curing;
s2: coating a surface coating on the lower surface of the substrate, and rolling the surface coating on the lower surface of the substrate by a roller, flattening by an anilox roller and curing to obtain the surface coating on the lower surface of the substrate.
10. The method as claimed in claim 9, wherein the curing temperature is 150 ℃ and 180 ℃ and the curing time is 10-30 min.
CN202110908571.5A 2021-08-09 2021-08-09 Coating base plate for PCB drilling and preparation method thereof Pending CN115058168A (en)

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