CN115050789B - Display Panel - Google Patents
Display Panel Download PDFInfo
- Publication number
- CN115050789B CN115050789B CN202210657335.5A CN202210657335A CN115050789B CN 115050789 B CN115050789 B CN 115050789B CN 202210657335 A CN202210657335 A CN 202210657335A CN 115050789 B CN115050789 B CN 115050789B
- Authority
- CN
- China
- Prior art keywords
- layer
- display area
- display panel
- crack
- touch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002184 metal Substances 0.000 claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 213
- 239000000758 substrate Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 20
- 238000005538 encapsulation Methods 0.000 claims description 17
- 239000012044 organic layer Substances 0.000 claims description 13
- 229920000620 organic polymer Polymers 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims description 2
- 239000010909 process residue Substances 0.000 abstract description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 20
- 239000011147 inorganic material Substances 0.000 description 20
- 239000011229 interlayer Substances 0.000 description 6
- 239000011368 organic material Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Position Input By Displaying (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本发明提供一种显示面板，显示面板包括显示区域和非显示区域，非显示区域表面设置有段差填充层，段差填充层之上设置有触控金属引线；其中，段差填充层用于扩展触控金属引线的有效布线区，相对于现有技术，本发明通过在位于非显示区域的封装层表面增加段差填充层，降低非显示区域边缘的膜层高度差，进而增加触控金属引线有效布线宽度，具有更小的阻抗，提高边框位置的布线空间，可以有效改善因边框缩窄，导致布线宽度及走线过窄的阻抗过大问题；还可以改善因段差过大导致布线后工艺残留问题。
The present invention provides a display panel, which includes a display area and a non-display area. A step filling layer is arranged on the surface of the non-display area, and a touch metal lead is arranged on the step filling layer; wherein the step filling layer is used to expand the effective wiring area of the touch metal lead. Compared with the prior art, the present invention increases the effective wiring width of the touch metal lead by adding a step filling layer on the surface of a packaging layer located in the non-display area, thereby reducing the height difference of the film layer at the edge of the non-display area, and having a smaller impedance. The wiring space at the frame position is increased, and the problem of excessive impedance caused by narrow wiring width and routing due to narrowing of the frame can be effectively improved; the problem of process residue after wiring caused by excessive step difference can also be improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel.
Background
The organic light emitting diode has excellent characteristics of self luminescence, low energy consumption, wide viewing angle, quick response and the like, and the panel made of the OLED device has the characteristics of simple structure, flexibility and the like, so that great interest in scientific research and industry is brought, and the panel is considered to be a potential next generation display technology.
Organic layers and cathodes of OLED devices are very sensitive to water and oxygen, so various means are required to encapsulate the OLED devices in the preparation of OLED display panels, and currently, thin film encapsulation technology has been successfully applied to OLED display panels. In the display area of the OLED display panel, TFE can ensure good characteristics, and the entire surface can be made very flat, but there are large irregularities in the edge portions of the non-display area.
Because the height difference near the edge position of the non-display area is large, uneven landforms are formed, the problem of process residues is easy to exist on the uneven landforms of the touch lead arrangement, the frame is narrowed, the wiring space of the touch lead is insufficient, the wiring width and the wiring are too narrow, and the problem of overlarge impedance of the touch lead is caused, so that further improvement is needed.
Disclosure of Invention
According to the prior art, the application provides the display panel, which can solve the problems that in the prior art, the height difference near the edge position of a non-display area is large, the uneven landform is formed, the touch lead is arranged on the uneven landform, the wiring space of the touch lead is insufficient due to the narrowing of a frame, the wiring width and wiring are too narrow, and the impedance of the touch lead is too large.
In order to solve the problems, the technical scheme provided by the invention is as follows:
The embodiment of the invention provides a display panel, which comprises a display area and a non-display area positioned at one side of the display area, wherein in the non-display area, the display panel comprises a substrate, a power module and a GOA circuit which are positioned on the substrate, a signal wiring group positioned on the power module and the GOA circuit, a pixel definition layer positioned on the signal wiring group, and a packaging layer positioned on the pixel definition layer.
The packaging layer near one side of the edge of the non-display area is of a concave structure due to the existence of a level difference, a level difference filling layer is arranged on the concave structure, a touch metal lead is arranged on the level difference filling layer, and the level difference filling layer is used for expanding an effective wiring area of the touch metal lead.
According to an optional embodiment of the present invention, the material of the step-difference filling layer is an organic polymer material, and the organic polymer material is one or more of acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, and polystyrene.
According to an alternative embodiment of the present invention, the material of the level difference filling layer is optically transparent adhesive.
According to an alternative embodiment of the present invention, the material of the level difference filling layer is UV curable epoxy resin or moisture absorbing frame glue.
According to an alternative embodiment of the present invention, in the display region, the display panel includes a substrate, a TFT layer over the substrate, a planarization layer over the TFT layer, a pixel definition layer over the planarization layer, a light emitting device within a pixel opening of the pixel definition layer, an encapsulation layer over the light emitting device, and a touch layer over the encapsulation layer.
According to an alternative embodiment of the invention, the light emitting device comprises an anode, a layer of light emitting material over the anode, and a cathode layer over the layer of light emitting material.
The cathode layer is electrically connected with the power module through the signal wiring group, and the GOA circuit is electrically connected with the TFT layer.
According to an optional embodiment of the present invention, the touch metal lead array is disposed on a surface of the level difference filling layer, and a side of the level difference filling layer away from the substrate is a smooth inclined plane, a curved plane or a plane.
According to an alternative embodiment of the present invention, one end of the touch metal lead is electrically connected to the touch chip, and the other end is electrically connected to the touch layer of the display area.
According to an alternative embodiment of the present invention, the edge of the non-display area further includes a first crack stopper and a second crack stopper located at the periphery of the first crack stopper, where one side of the first crack stopper near the display area is attached to the side surface of the level difference filling layer.
According to an alternative embodiment of the invention, the first crack stop and the second crack stop each comprise an organic layer and a water barrier superposition module.
The display panel comprises a display area and a non-display area, wherein a level difference filling layer is arranged on the surface of the non-display area, a touch metal lead is arranged on the level difference filling layer, the level difference filling layer is used for expanding an effective wiring area of the touch metal lead, the level difference filling layer is added on the surface of a packaging layer positioned in the non-display area, the film layer height difference of the edge of the non-display area is reduced, the effective wiring width of the touch metal lead is further increased, the wiring space of a frame position is increased, the problem that the load of the wiring width and wiring is too narrow due to frame narrowing is solved, and the problem that the process residue after wiring is caused by too large level difference is solved.
Drawings
In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a display panel in the prior art.
Fig. 2 is a schematic diagram of a film structure of a display panel according to an embodiment of the invention.
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., are only referring to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the invention and is not limiting of the invention. In the drawings, like elements are denoted by the same reference numerals, and broken lines in the drawings indicate that they are not present in the structure, and only the shape and position of the structure are described.
As shown in fig. 1, the prior art provides a schematic structure of a tiled display panel 10. The display panel 10 is divided into a display region 12 and a non-display region 11, and in the display region 12, the display panel 10 includes a substrate 13, a TFT layer 181 over the substrate 13, a planarization layer 182 over the TFT layer 181, a pixel definition layer 19 over the planarization layer 182, a light emitting material layer 21 over the pixel definition layer 19, and an encapsulation layer over the light emitting material layer 21, the encapsulation layer including a first inorganic material layer 221, an organic material layer 222 over the first inorganic material layer 221, and a second inorganic material layer 223 over the organic material layer 222. In the non-display area 11, a power module 15, a GOA circuit 14 and a reference voltage module 16 are disposed on the substrate 13, a signal trace group 17 is further disposed on the power module 15 and the GOA circuit 14, the signal trace group 17 is used for electrically connecting the power module 15 with a cathode layer in the luminescent material layer 21, the GOA circuit 14 is electrically connected with the TFT layer 181, and a crack stop 24 is further disposed at the edge of the non-display area 11.
The first inorganic material layer 221 and the second inorganic material layer 223 on the signal routing group 17 are bent due to the zigzag topography, so that the first inorganic material layer 221 and the second inorganic material layer 223 in the area are bent in multiple segments, and the touch metal lead 23 is arranged on the part of the flat structure of the first inorganic material layer 221 and the second inorganic material layer 223 in the area, so that the wiring area 111 of the touch metal lead 23 is very narrow, the wiring space of the touch lead is insufficient, the wiring width and the routing are too narrow, and the impedance of the touch metal lead 23 is too large.
Aiming at the technical problems, the embodiment of the invention provides a display panel which comprises a display area and a non-display area positioned at one side of the display area, wherein in the non-display area, the display panel comprises a substrate, a power module and a GOA circuit which are positioned on the substrate, a signal wiring group which is positioned on the power module and the GOA circuit, a pixel definition layer which is positioned on the signal wiring group, and a packaging layer which is positioned on the pixel definition layer, wherein the packaging layer which is positioned near one side of the non-display area is in a concave structure due to the existence of a step, a step filling layer is arranged on the concave structure, and a touch metal lead is arranged on the step filling layer, wherein the step filling layer is used for expanding the effective wiring area of the touch metal lead.
Specifically, as shown in fig. 2, an embodiment of the present invention provides a film structure schematic diagram of a display panel. The display panel 30 includes a display area 32 and a non-display area 31 located at one side of the display area 32. In the non-display area 31, the display panel includes a substrate 33, a power module 35 and a GOA circuit 34 disposed on the substrate 33, a signal wiring group 36 disposed on the power module 35 and the GOA circuit 34, a pixel defining layer 391 disposed on the signal wiring group 36, and a packaging layer 41 disposed on the pixel defining layer 391, wherein a reference voltage module 36 is disposed on a side of the GOA circuit 34 adjacent to the display area. The encapsulation layer 41 includes a first inorganic material layer 411, an organic material layer 412 on the first inorganic material layer 411, and a second inorganic material layer 413 on the organic material layer 412. The organic material layer 412 is located at one side of the non-display area 31 close to the display area 32, the first inorganic material layer 411 and the second inorganic material layer 413 at one side of the non-display area 31 are attached together, the encapsulation layer 41 at one side close to the edge of the non-display area 31 is in a concave structure due to the existence of a step difference, and the combined structure of the first inorganic material layer 411 and the second inorganic material layer 413 presents a multi-section bending structure. The step filling layer 42 is arranged on the concave structure, the touch metal lead 43 is arranged on the step filling layer 42, wherein the step filling layer 42 is used for expanding an effective wiring area of the touch metal lead, and can accommodate the touch metal lead 43 with larger wiring width and wiring width, and compared with the prior art, the touch metal lead 43 of the embodiment has smaller impedance.
In the display region 32, the display panel 30 includes a substrate 33, a TFT layer 381 over the substrate 33, a planarization layer 382 over the TFT layer 381, a light emitting function layer 39 over the planarization layer 382, and an encapsulation layer 41 over the light emitting function layer 39. The signal trace group 36 is used for electrically connecting the power module 35 and the cathode of the light emitting functional layer 39, and the GOA circuit 34 is electrically connected to the TFT layer 381, specifically, the GOA circuit 34 outputs a scan signal and a data signal, the scan signal is applied to the first gate and the second gate of the TFT layer 381, and the data signal is applied to the source of the TFT layer 381.
The edge of the non-display area 31 further comprises a first crack stop 44 and a second crack stop 45 located at the periphery of the first crack stop 44, wherein the side of the first crack stop 44 close to the display area 32 is attached to the side face of the step filling layer 42. Each crack stopper comprises an organic layer and a waterproof layer superposition module, wherein the cross section of the organic layer is rectangular, and the cross section of the waterproof layer is trapezoidal. The organic layer in the crack stopper in this embodiment is a partially planarized layer, and the water blocking layer in the crack stopper is a partially pixel defining layer. The first crack stopper 44 includes an organic layer 441 and a water-blocking layer 442 disposed on the organic layer 441, the organic layer 441 is a partially planarized layer, i.e. the organic layer 441 and the planarized layer 382 are made of the same material, the water-blocking layer 442 is a partially pixel defining layer, i.e. the water-blocking layer 442 and the pixel defining layer 391 are made of the same material, and the second crack stopper 45 includes an organic layer 451 and a water-blocking layer 452 disposed on the organic layer 451.
The encapsulation layer 41 extends from the display region 32 to the non-display region 31, the encapsulation layer 41 in the non-display region 31 is in a concave structure, and the step filling layer 42 fills the concave structure. The level difference filling layer 42 is made of an organic polymer material, the organic polymer material is one or more of acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate and polystyrene, the level difference filling layer 42 can be printed by ink jet, the level difference between the first crack stop 44 and the display area is obviously 6um to 12um, the printing range of the position of the non-display area 31 is controlled by the ink jet printing speed, and the organic polymer material is prevented from overflowing to the display area and the cutting path.
In another embodiment, the level difference filling layer 42 is made of an optical transparent glue layer, and the range of the optical transparent glue layer can be controlled by a conventional exposure mode in this embodiment, so that the optical OC glue material is prevented from overflowing into the display area and the dicing channels.
The material of the level difference filling layer 42 in the further embodiment is UV curable epoxy or hygroscopic sealant to increase the packaging effect of the non-display area 31.
The substrate 33 in this embodiment includes a first flexible layer, a first water-blocking layer, a second flexible layer, and a second water-blocking layer, which are stacked, and the materials of the first flexible layer and the second flexible layer are preferably transparent polyimide or yellow polyimide. The first and second water barrier layers are preferably silica.
The TFT layer 381 is located over the substrate 33 and includes a light shielding layer disposed over the substrate 33, a buffer layer disposed over the substrate 33 and covering the light shielding layer, an active layer disposed over the buffer layer, a first gate insulating layer disposed over the active layer, a first gate electrode disposed over the first gate insulating layer, a second gate insulating layer disposed over the first gate insulating layer and covering the first gate electrode, a second gate electrode disposed over the second gate insulating layer, a first interlayer insulating layer disposed over the second gate insulating layer and covering the second gate electrode, source and drain electrodes disposed over the first interlayer insulating layer, a second interlayer insulating layer disposed over the first interlayer insulating layer and covering the source and drain electrodes, and a planarization layer disposed over the second interlayer insulating layer. The active layer comprises a channel region corresponding to the lower part of the first gate, and a source electrode contact region and a drain electrode contact region which are respectively positioned at two sides of the channel region. The source electrode contact hole and the drain electrode contact hole which are respectively corresponding to the source electrode contact area and the drain electrode contact area are formed in the first interlayer insulating layer, the second gate insulating layer and the first gate insulating layer, the source electrode and the drain electrode are respectively electrically connected with the drain electrode contact area through the source electrode contact hole and the drain electrode contact hole and the source electrode contact area of the active layer, and orthographic projection of the light shielding layer on the substrate 33 covers orthographic projection of the active layer on the flexible substrate, so that the light shielding layer can completely cover the active layer, the active layer is prevented from being irradiated by light, and negative drift of threshold voltage of the driving circuit layer is avoided.
The light emitting functional layer 39 is located on the TFT layer 381 and includes an anode layer, a pixel defining layer 391 over the anode layer, the pixel defining layer 391 being spaced apart to form a pixel opening in which the light emitting device 392 is formed, the light emitting device 392 including an anode, a light emitting material layer over the anode, and a cathode layer over the light emitting material layer, the cathode layer being electrically connected to the power module 35, the anode being electrically connected to the drain of the TFT layer 381.
The encapsulation layer 41 is located on the light emitting function layer 39 and covers the light emitting function layer 39. The encapsulation layer 41 includes a first inorganic material layer 411, an organic material layer 412, and a second inorganic material layer 413, where the first inorganic material layer 411 and the second inorganic material layer 413 are prepared by physical vapor deposition, and the organic layer generally uses an inkjet printing manner, so that the encapsulation layer has a higher light transmittance and can effectively relieve stress of the inorganic layer. The touch layer is located above the encapsulation layer 41, and the touch layer includes touch sensor units arranged in an array, and the touch sensor units are electrically connected with the touch metal leads 43. In this embodiment, the array of touch metal leads 43 is disposed on the surface of the level difference filling layer 42, and one side of the level difference filling layer 42 away from the substrate 33 is a smooth inclined plane, curved plane or plane, one end of the touch metal lead 43 is electrically connected with the touch chip, and the other end is electrically connected with the touch layer of the display area, so as to realize normal transmission of driving signals and receiving signals of the touch layer.
The invention reduces the film layer height difference at the edge of the non-display area by adding the level difference filling layer on the surface of the packaging layer positioned in the non-display area, further increases the effective wiring width of the touch metal lead, improves the wiring space at the frame position, solves the problem of overlarge load caused by narrowing the frame and too narrow wiring width and wiring, and improves the problem of process residue after wiring caused by overlarge level difference.
In summary, although the present invention has been described in terms of the preferred embodiments, the above-mentioned embodiments are not intended to limit the invention, and those skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention, so that the scope of the invention is defined by the appended claims.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210657335.5A CN115050789B (en) | 2022-06-10 | 2022-06-10 | Display Panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210657335.5A CN115050789B (en) | 2022-06-10 | 2022-06-10 | Display Panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115050789A CN115050789A (en) | 2022-09-13 |
| CN115050789B true CN115050789B (en) | 2025-02-14 |
Family
ID=83161221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210657335.5A Active CN115050789B (en) | 2022-06-10 | 2022-06-10 | Display Panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115050789B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210084990A (en) * | 2019-12-30 | 2021-07-08 | 엘지디스플레이 주식회사 | Display device |
| CN113377229A (en) * | 2021-06-08 | 2021-09-10 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI740908B (en) * | 2016-03-11 | 2021-10-01 | 南韓商三星顯示器有限公司 | Display apparatus |
| CN107591498B (en) * | 2017-08-31 | 2019-05-10 | 京东方科技集团股份有限公司 | OLED display panel and manufacturing method thereof, and OLED display device |
-
2022
- 2022-06-10 CN CN202210657335.5A patent/CN115050789B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210084990A (en) * | 2019-12-30 | 2021-07-08 | 엘지디스플레이 주식회사 | Display device |
| CN113377229A (en) * | 2021-06-08 | 2021-09-10 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115050789A (en) | 2022-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12293046B2 (en) | Electroluminescent display including touch sensor | |
| US10707429B2 (en) | Flexible display panel and flexible display apparatus | |
| US10509498B2 (en) | Foldable display device | |
| KR102590307B1 (en) | Flexible display device and method of manufacturing the same | |
| CN105977275B (en) | Flexible display | |
| US9058074B2 (en) | Organic light emitting display | |
| CN103681742B (en) | OLED and manufacture method thereof | |
| US10593738B2 (en) | Organic light-emitting display device | |
| TWI644425B (en) | Organic light emitting display device | |
| KR102095013B1 (en) | Flexible device | |
| KR20200036127A (en) | Display device | |
| KR20180005313A (en) | Display device | |
| US9054327B2 (en) | Organic light emitting display device | |
| KR102100656B1 (en) | Organic light emitting display device and method of fabricating thereof | |
| CN112736122A (en) | Display panel and display device | |
| EP3503237B1 (en) | Organic light emitting display device and method of manufacturing the same | |
| KR20180025058A (en) | Organic light emitting display device | |
| KR20230167003A (en) | Flexible display device | |
| US20230187582A1 (en) | Display device | |
| KR102674786B1 (en) | Multi screen display apparatus and method of manufacturing the same | |
| CN115050789B (en) | Display Panel | |
| KR20230084648A (en) | Display apparatus | |
| KR20200037161A (en) | Flexible device | |
| KR20240108857A (en) | Display device | |
| CN111816076A (en) | display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |