CN115036409A - Array substrate, preparation method thereof, lamp panel assembly and backlight module - Google Patents

Abstract

The embodiments of the present application provide an array substrate and a method for preparing the same, a lamp panel assembly and a method for preparing the same, and a backlight module. The array substrate includes a base material, a solder mask structure disposed on one side of the base material, a plurality of filling structures, and a plurality of conductive units arranged in an array; each conductive unit includes two pads; each filling structure covers the substrate between the two pads of each conductive unit; the solder mask structure has a plurality of Through holes, each conductive unit and each filling structure are located in each through hole; the side of the pad away from the base material is used for connecting with the curable conductive structure, and the thickness of the filling structure is smaller than the first part of the solder mask structure away from the base material. The minimum distance between the surface and the substrate is not greater than the sum of the thickness of the pad and the curable conductive structure. The filling structure of the embodiment of the present application covers the base material between the two pads of each conductive unit, which can reduce the residual air and reduce the air bubbles generated during the fabrication of the protective structure.

Description

Array substrate and preparation method thereof, lamp panel assembly and backlight module

technical field

The present application relates to the field of backlight technology, and in particular, the present application relates to an array substrate and a method for preparing the same, a lamp panel assembly and a method for preparing the same, and a backlight module.

Background technique

The current light board assembly is formed by connecting the conductive units on the array substrate with the light-emitting elements. After the light-emitting elements are installed, a protective structure needs to be used to protect the light-emitting elements.

Generally, in the process of manufacturing the protective structure by the glue dispensing process, the glue needs to wrap the light-emitting element and the hollow area between the light-emitting element and the substrate as a whole. Therefore, bubbles are prone to appear in the hollow area.

After the glue forms the initial protective structure, the initial protective structure needs to be cured to obtain the final protective structure. During the curing process, a large number of air bubbles are difficult to be discharged, and the air remains around the light-emitting element, which affects the light-emitting effect of the light-emitting element and reduces the quality of the light board assembly. Rate.

SUMMARY OF THE INVENTION

In view of the shortcomings of the existing methods, the present application proposes an array substrate and a preparation method thereof, a lamp panel assembly and a preparation method thereof, and a backlight module, so as to solve the problem that a large number of air bubbles in the prior art are difficult to be discharged, and the air remains around the light-emitting element , which affects the light-emitting effect of the light-emitting element and reduces the technical problem of the yield of the light board assembly.

In a first aspect, an embodiment of the present application provides an array substrate, including: a base material, a solder mask structure disposed on one side of the base material, a plurality of filling structures, and a plurality of conductive units arranged in an array;

Each conductive unit includes two pads; each filling structure covers the substrate between the two pads of each conductive unit;

The solder mask structure has a plurality of through holes arranged in an array, and each conductive unit and each filling structure are located in each through hole;

The side of the pad away from the substrate is used to connect with the curable conductive structure. The thickness of the filling structure is less than the minimum distance between the first surface of the solder mask structure away from the substrate and the substrate, and is not greater than the pad and the curable conductive structure. the sum of the thicknesses.

Optionally, the thickness of the filling structure is greater than the thickness of the pad.

Optionally, the array substrate further includes: a first circuit structure;

The first circuit structure is arranged on the same layer as the conductive unit and is located between at least part of the solder mask structure and the base material;

The projection of the first circuit structure and the conductive unit on the substrate has no overlapping area.

Optionally, the array substrate further includes:

The second circuit structure is arranged on the side of the base material away from the solder mask structure;

The second solder resist layer is arranged on one side of the second circuit structure and the base material.

In a second aspect, an embodiment of the present application further provides a light panel assembly, comprising: a plurality of light-emitting elements, a plurality of curable conductive structures, and any array substrate provided in the first aspect; one side of each light-emitting element has two electrodes;

Each pad of each conductive unit of the array substrate is connected with a curable conductive structure; the sum of the thickness of the curable conductive structure and the pad is greater than the thickness of the filling structure;

The light emitting element is located on the side of the curable conductive structure away from the pad, and each electrode on one side of each light emitting element is respectively connected with the curable conductive structure on one side of each pad.

Optionally, the distance between the side of the light emitting element having the electrode and the filling structure is not less than 5 micrometers and not more than 10 micrometers.

Optionally, the light panel assembly further includes: a protection structure;

The protection structure covers the at least one light-emitting element and is connected with the side of the solder resist structure away from the base material and the side of the curable conductive structure away from the base material.

In a third aspect, an embodiment of the present application further provides a backlight module, including: any lamp panel assembly provided in the foregoing second aspect.

In a fourth aspect, an embodiment of the present application further provides a method for preparing any of the array substrates provided in the first aspect, including:

A plurality of conductive units arranged in an array are fabricated on one side of the substrate, and each conductive unit includes two pads;

Making a plurality of filling structures on one side of the base material, so that each filling structure covers the base material between the two pads of each conductive unit;

A solder mask structure is fabricated on one side of the base material, and the solder mask structure has a plurality of through holes arranged in an array, so that each conductive unit and each filling structure are located in each through hole;

The thickness of the filling structure is smaller than the minimum distance between the first surface of the solder mask structure away from the base material and the base material, and is not greater than the sum of the thicknesses of the pad and the curable conductive structure.

In a fifth aspect, an embodiment of the present application further provides a method for preparing any lamp panel assembly provided in the foregoing second aspect, including:

An initial curable conductive structure is fabricated on one side of each pad of each conductive unit of any array substrate prepared in the fourth aspect; the sum of the thickness of the curable conductive structure and the pad is greater than the filling of the array substrate the thickness of the structure;

A plurality of light-emitting elements are arranged on one side of the initial curable conductive structure of the plurality of conductive units, and the curable conductive structure is obtained by curing the initial curable conductive structure, so that each electrode and each pad of each light-emitting element are Curable conductive structure connection on one side;

Based on the dispensing process, an initial protective structure is fabricated on one side of the solder resist structure, the curable conductive structure and the light-emitting element of the array substrate, and the initial protective structure is cured to obtain the protective structure.

The beneficial technical effects brought by the technical solutions provided in the embodiments of the present application include:

The array substrate in the embodiment of the present application includes a base material, a solder resist structure disposed on one side of the base material, a plurality of filling structures, and a plurality of conductive units arranged in an array. Wherein, each conductive unit is located in the through hole of the solder mask structure, each conductive unit includes two pads, and there is a hollow out exposing the substrate between the two pads. The filling structure covers the base material between the two pads of each conductive unit, and fills the hollowed-out area to a certain extent, so that the hollowed-out area becomes shallower, which can reduce the bubbles generated during the production of the protective structure and reduce the residual air. Thus, the possibility of air damage to the light-emitting element is reduced, the influence of air bubbles on the light-emitting effect of the light-emitting element is reduced, and the yield rate and service life of the light board assembly are improved. In addition, the thickness of the filling structure is smaller than the minimum distance between the first surface of the solder mask structure away from the base material and the base material, and is not greater than the sum of the thicknesses of the pad and the curable conductive structure. Therefore, the filling structure will not affect the light-emitting element and the Soldering between curable conductive structures.

In the preparation method of the array substrate in the embodiment of the present application, a filling structure is first formed between two pads of each conductive unit, and then a solder mask structure with a plurality of through holes is formed, and then the solder mask structure is opened. During the process, only the solder mask material in the opening area is removed, and the prefabricated filling structure is not removed, and the filling structure can always be filled between the light-emitting element and the substrate. The preparation method of the array substrate provided by the present application has high reliability, low cost and mass production.

Additional aspects and advantages of the present application will be set forth in part in the following description, which will become apparent from the following description, or may be learned by practice of the present application.

Description of drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:

FIG. 1 is a schematic top-view structure diagram of an array substrate according to an embodiment of the present application;

Fig. 2 is the cross-sectional structure schematic diagram at straight line AA in Fig. 1;

FIG. 3 is a schematic cross-sectional structure diagram of another array substrate according to an embodiment of the present application;

FIG. 4 is a schematic structural diagram of a lamp panel assembly according to an embodiment of the present application;

FIG. 5 is a schematic flowchart of a method for preparing an array substrate according to an embodiment of the present application;

6 is a schematic flowchart of a method for manufacturing a lamp panel assembly provided by an embodiment of the present application;

FIG. 7 In a method for preparing a light panel assembly provided by an embodiment of the present application, a plurality of light-emitting elements are disposed on one side of an initial curable conductive structure of a plurality of conductive units, and the initial curable conductive structure is cured to obtain a The curable conductive structure, so that each electrode of each light-emitting element is connected with the curable conductive structure on one side of each pad in a one-to-one correspondence;

FIG. 8 is a schematic cross-sectional structure diagram at line BB in FIG. 7;

FIG. 9 is a schematic diagram of fabricating an initial protection structure on one side of a solder mask structure, a curable conductive structure and a light-emitting element of an array substrate in a method for fabricating a lamp panel assembly provided by an embodiment of the present application.

Reference number:

100-light board assembly;

10-array substrate; 11-substrate; 12-solder mask structure; 121-through hole; 122-first surface;

13-filling structure; 14-conductive unit; 141-pad; 15-first circuit structure;

16- the second circuit structure; 17- the second solder mask;

20-light-emitting element; 30-curable conductive structure; 40-protective structure;

200-dispensing machine; 201-protective glue droplets.

Detailed ways

Embodiments of the present application are described below with reference to the accompanying drawings in the present application. It should be understood that the embodiments described below in conjunction with the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application, and do not limit the technical solutions of the embodiments of the present application.

It will be understood by those skilled in the art that the singular forms "a", "an", "the" and "the" as used herein can include the plural forms as well, unless expressly stated otherwise. It should be understood that the word "comprising" used in the specification of the present application means that the features, integers, steps, operations, elements and/or components are present, but does not exclude the realization of other features, information, data, steps, operations, elements, components and/or combinations thereof, etc. It will be understood that when we refer to an element as being "connected" or "coupled" to another element, the one element can be directly connected or coupled to the other element, or the one element and the other element may be intervening through intervening elements Establish a connection relationship. The term "and/or" as used herein refers to at least one of the items defined by the term, eg "A and/or B" can be implemented as "A", or as "B", or as "A and B" ".

In order to make the objectives, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

Conventional array substrates are provided with conductive units for connecting light-emitting elements. Since light-emitting elements generally have two electrodes, the conductive units also have two pads corresponding to the electrodes one-to-one. The two pads in each conductive unit need to be separated to avoid short circuits. Therefore, the pads are disconnected by hollowing out, and the substrate will be exposed at the hollowing out.

Generally, a curable conductive structure is connected to the pads of the array substrate. When the light-emitting element is soldered to the array substrate, the electrodes of the light-emitting element are connected to the curable conductive structure and the pads in layers, while the light-emitting element is not connected to the curable conductive structure. When the protective structure is made, bubbles are easily generated in this space, which affects the light-emitting effect of the light-emitting element, and even causes the light-emitting element to fail to emit light, thereby reducing the quality of the light board assembly. Rate.

The array substrate and the preparation method thereof, the lamp panel assembly and the preparation method thereof, and the backlight module provided by the present application aim to solve the above technical problems in the prior art.

The technical solutions of the present application and how the technical solutions of the present application solve the above-mentioned technical problems will be described in detail below with specific examples. It should be noted that the following embodiments may refer to, learn from, or combine with each other, and the same terms, similar features, and similar implementation steps in different embodiments will not be described repeatedly.

Referring to FIGS. 1 and 2 , an embodiment of the present application provides an array substrate 10 , including: a substrate 11 , a solder mask structure 12 disposed on one side of the substrate 11 , a plurality of filling structures 13 , and a plurality of array arrangements the conductive unit 14.

Each conductive unit 14 includes two pads 141 . Each filling structure 13 covers the substrate 11 between the two pads 141 of each conductive unit 14 .

The solder mask structure 12 has a plurality of through holes 121 arranged in an array, and each conductive unit 14 and each filling structure 13 are located in each through hole 121 .

The side of the pad 141 away from the base material 11 is used for connecting with the curable conductive structure 30 , and the thickness of the filling structure 13 is smaller than the minimum distance between the first surface 122 of the solder mask structure 12 away from the base material 11 and the base material 11 , and is not It is greater than the sum of the thicknesses of the pads 141 and the curable conductive structure 30 .

In this embodiment, the array substrate 10 includes a base material 11 , a solder resist structure 12 disposed on one side of the base material 11 , a plurality of filling structures 13 and a plurality of conductive units 14 arranged in an array. Wherein, each conductive unit 14 is located in the through hole 121 of the solder mask structure 12 , and each conductive unit 14 includes two pads 141 , and a hollow exposing the substrate 11 exists between the two pads 141 . The filling structure 13 covers the base material 11 between the two pads 141 of each conductive unit 14, and fills the hollowed-out area to a certain extent, so that the hollowed-out area becomes shallower, which can reduce the bubbles generated during the fabrication of the protective structure 40. The residual air is reduced, the possibility of air damage to the light-emitting element 20 is reduced, the influence of air bubbles on the light-emitting effect of the light-emitting element 20 is reduced, and the yield rate and service life of the light board assembly 100 are improved. In addition, the thickness of the filling structure 13 is smaller than the minimum distance between the first surface 122 of the solder mask structure 12 away from the base material 11 and the base material 11, and is not greater than the sum of the thicknesses of the pads 141 and the curable conductive structure 30. Therefore, the filling The structure 13 does not affect the soldering between the light emitting element 20 and the curable conductive structure 30 .

Optionally, the thickness of the solder mask structure 12 is not unique, there may be some other circuit structures between the solder mask structure 12 and the substrate 11 , and the solder mask structure 12 can protect the gap between the solder mask structure 12 and the substrate 11 . line structure. Therefore, the filling structure 13 is shorter than the solder resist structure 12 at the through hole 121 , or in other words, the thickness of the filling structure 13 is smaller than the depth of the through hole 121 .

Optionally, the minimum distance between the first surface 122 of the solder mask structure 12 away from the base material 11 and the base material 11 ranges from 25 to 60 microns.

Optionally, the solder mask structure 12 is made of insulating materials such as white ink or white film, which can improve the reflectivity of the light board assembly 100 .

Optionally, the filling structure 13 is made of insulating materials such as white ink or white reflective film.

Optionally, the surface of the pad 141 may be subjected to a gold chemical process or an Organic Solderability Preservatives (OSP, Organic Solderability Preservatives) process, which can protect the pad 141 from being corroded.

In some possible implementations, the thickness of the filling structure 13 is greater than the thickness of the pad 141 .

In this embodiment, the filling structure 13 is higher than the pad 141 . When the curable conductive structure 30 is continuously fabricated on the pad 141 , the thickness of the curable conductive structure 30 will fluctuate to a certain extent, resulting in the thickness of the curable conductive structure 30 . It cannot be maintained at a constant value, but it can be determined that the thickness of the curable conductive structure 30 is within a range. Since the thickness of the curable conductive structure 30 is relatively thin, the filling structure 13 is higher than the pad 141, but smaller than the sum of the thicknesses of the core pads 141 of the curable conductive structure 30, and the curable conductive structure 30 is slightly higher than the filling structure 13, In other words, the height of the filling structure 13 can approach the height of the curable conductive structure 30 , further reducing the hollowing out, so that the gap between the filling structure 13 and the light-emitting element 20 is smaller, thereby reducing the air remaining under the light-emitting element 20 , to reduce the generation of air bubbles.

In some possible implementations, please refer to FIG. 3 , the array substrate 10 further includes: a first circuit structure 15 .

The first circuit structure 15 is disposed on the same layer as the conductive unit 14 and is located between at least part of the solder mask structure 12 and the base material 11 .

The projection of the first circuit structure 15 and the conductive unit 14 on the substrate 11 has no overlapping area.

In this embodiment, according to the wiring requirements, the first circuit structure 15 and the conductive unit 14 are prepared on one side of the substrate 11. The first circuit structure 15 and the conductive unit 14 are arranged in the same layer, and the same material and the same Process preparation.

Optionally, the thickness of the first circuit structure 15 and the conductive unit 14 is the same as 15 microns.

In some possible implementations, please refer to FIG. 3 , the array substrate 10 further includes:

The second circuit structure 16 is disposed on the side of the base material 11 away from the solder resist structure 12 .

The second solder resist layer 17 is disposed on one side of the second circuit structure 16 and the base material 11 .

The array substrate 10 provided in this embodiment has a two-layer circuit structure, and a second circuit structure 16 and a solder mask structure 12 are further provided on the other side of the substrate 11 , and the solder mask structure 12 protects the second circuit structure 16 .

Based on the same inventive concept, an embodiment of the present application further provides a light panel assembly 100. Please refer to FIG. 4. The light panel assembly 100 includes: a plurality of light-emitting elements 20, a plurality of curable conductive structures 30, and any of the above-mentioned embodiments. An array substrate 10 . Each light-emitting element 20 has two electrodes on one side.

The curable conductive structure 30 is connected to each pad 141 of each conductive unit 14 of the array substrate 10 . The sum of the thicknesses of the curable conductive structure 30 and the pads 141 is greater than the thickness of the filling structure 13 .

The light emitting element 20 is located on the side of the curable conductive structure 30 away from the pad 141 , and each electrode on one side of each light emitting element 20 is respectively connected to the curable conductive structure 30 on one side of each pad 141 .

In this embodiment, a curable conductive structure 30 is fabricated on each pad 141 of the conductive unit 14 of the array substrate 10 , and the curable conductive structure 30 is connected to the electrodes of the light emitting element 20 . Compared with the base material 11 , the pad 141 is lower than the filling structure 13 , and the curable conductive structure 30 is slightly higher than the filling structure 13 , which can ensure that the electrodes of the light-emitting element 20 are smoothly welded to the curable conductive structure 30 and avoid the filling structure 13 Too high can lead to poor welding. In this embodiment, the two electrodes of each light-emitting element 20 are respectively electrically connected to the two pads 141 in each conductive unit 14 in a one-to-one correspondence.

The light panel assembly 100 provided in this embodiment includes any of the array substrates 10 provided in the above-mentioned embodiments, and the implementation principles thereof are similar, which will not be repeated here.

Optionally, the curable conductive structure 30 includes printed solder paste with a thickness ranging from 10 to 20 microns (including 10 and 20 microns).

Optionally, the light-emitting element 20 includes an LED chip (Light Emitting Diode light-emitting chip) with a size of 0.16 mm*0.46 mm.

Optionally, the two electrodes of the light-emitting element 20 are a positive electrode and a negative electrode.

In some possible implementations, the distance between the side of the light-emitting element 20 having the electrode and the filling structure 13 is not less than 5 micrometers and not more than 10 micrometers.

In this embodiment, after the curable conductive structure 30 is connected to the two electrodes of the light emitting element 20, a part of the light emitting element 20 is not connected to the curable conductive structure 30, and this part of the light emitting element 20 is opposite to the filling structure 13 and is opposite to the filling structure 13. There is a gap between the filling structures 13, the size of this gap is not less than 5 microns and not more than 10 microns, and the gap is small. The production process of the protective structure 40 using the glue dispenser 200 in the later stage is a capillary operation, and the protective glue droplet 201 is easier. Filling the gap can reduce the hollow between the light-emitting element 20 and the filling structure 13 , thereby reducing the residual air and reducing the generation of air bubbles.

In some possible implementations, please refer to FIG. 4 , the light panel assembly 100 further includes: a protection structure 40 .

The protective structure 40 covers the at least one light emitting element 20 and is connected to the side of the solder resist structure 12 away from the substrate 11 and the side of the curable conductive structure 30 away from the substrate 11 .

In this embodiment, after the light-emitting element 20 is soldered on the array substrate 10, the light-emitting element 20 needs to be protected. The protection structure 40 can cover the light-emitting element 20, the curable conductive structure 30 and the solder mask structure 12. The light-emitting element 20 and the places where various circuits are connected are protected.

Optionally, the light board assembly 100 is a sub-millimeter light emitting diode (Mini Light Emitting Diode, abbreviated as Mini LED in English).

Based on the same inventive concept, an embodiment of the present application further provides a backlight module, including: any of the lamp panel assemblies 100 provided in the foregoing embodiments.

The backlight module provided in this embodiment includes any of the lamp panel assemblies 100 provided in the above-mentioned embodiments, and the implementation principles thereof are similar, and will not be repeated here.

Based on the same inventive concept, an embodiment of the present application also provides a method for preparing any of the array substrates 10 provided in the foregoing embodiments. The schematic flowchart of the method is shown in FIG. 5 , and the method includes steps S101-S103:

S101: Fabricating a plurality of conductive units 14 arranged in an array on one side of the substrate 11, each conductive unit 14 including two pads 141.

S102 : forming a plurality of filling structures 13 on one side of the base material 11 , so that each filling structure 13 covers the base material 11 between the two pads 141 of each conductive unit 14 .

S103 : forming a solder resist structure 12 on one side of the substrate 11 , the solder resist structure 12 has a plurality of through holes 121 arranged in an array, so that each conductive unit 14 and each filling structure 13 are located in each through hole 121 , and the filling structure 12 is filled The thickness of the structure 13 is smaller than the minimum distance between the first surface 122 of the solder mask structure 12 away from the substrate 11 and the substrate 11 , and is not greater than the sum of the thicknesses of the pads 141 and the curable conductive structure 30 .

In the preparation method of the array substrate 10 in the embodiment of the present application, the filling structure 13 is first formed between the two pads 141 of each conductive unit 14 , and then the solder mask structure 12 having a plurality of through holes 121 is formed. During the process of opening the solder mask structure 12 , only the solder mask material in the opening area is removed, and the prefabricated filling structure 13 is not removed, and the filling structure 13 can always be filled between the light emitting element 20 and the substrate 11 . The preparation method of the array substrate 10 provided by the present application has high reliability, low cost and mass production.

Optionally, the filling structure 13 can be fabricated by existing processes such as exposure and development.

Optionally, the above step S101 further includes: fabricating a first circuit layer on one side of the base material 11, and patterning the first circuit layer to obtain the first circuit structure 15 and a plurality of conductive layers arranged on the same layer unit 14.

Optionally, the above step S103 includes forming a first solder resist layer on one side of the base material 11 , the first circuit structure 15 and each of the conductive units 14 .

The first solder mask layer is patterned to obtain a solder mask structure 12 having a plurality of through holes 121 arranged in an array, so that each of the conductive units 14 and each of the filling structures 13 is located in each of the through holes 121 . into the through hole 121 .

Optionally, the patterning treatment includes exposure, development and other processes.

Optionally, the method for preparing the array substrate 10 further includes: fabricating a second circuit layer on the other side of the base material 11 .

The second circuit layer is patterned to obtain a second circuit structure 16 .

A second solder resist layer 17 is formed on the other side of the base material 11 and one side of the second circuit structure 16 .

In this embodiment, by fabricating circuit structures on both sides of the base material 11 , the array substrate 10 has two circuit layers to meet the wiring requirements. In addition, the surface of the circuit structure on both sides of the base material 11 is protected by a solder resist material, and the conductive unit 14 or other circuit structures that need to be electrically connected are exposed by punching or opening a window on the solder resist material.

Based on the same inventive concept, an embodiment of the present application also provides a method for preparing any lamp panel assembly 100 provided in the foregoing embodiments. The schematic flowchart of the method is shown in FIG. 6 , and the method includes steps S201-S203:

S201 : forming an initial curable conductive structure 30 on one side of each pad 141 of each conductive unit 14 of the array substrate 10 , the sum of the thicknesses of the curable conductive structure 30 and the pad 141 is greater than the filling structure of the array substrate 10 13 thickness.

The array substrate 10 is prepared by using any of the methods for preparing the array substrate 10 provided in the foregoing embodiments of the present application.

Alternatively, the initial curable conductive structure 30 may be printed onto the pads 141 by a printer.

S202: Disposing the plurality of light-emitting elements 20 on one side of the initial curable conductive structures 30 of the plurality of conductive units 14, and curing the initial curable conductive structures 30 to obtain the curable conductive structures 30, so that the Each electrode is connected to the curable conductive structure 30 on one side of each pad 141 . For schematic structural diagrams after step S202, reference may be made to FIG. 7 and FIG. 8 .

S203 : forming an initial protection structure 40 on one side of the solder mask structure 12 , the curable conductive structure 30 and the light emitting element 20 of the array substrate 10 based on the glue dispensing process, and curing the initial protection structure 40 to obtain the protection structure 40 .

In this embodiment, any array substrate 10 prepared by any of the methods for preparing the array substrate 10 provided in the foregoing embodiments is used to prepare the light panel assembly 100 . First, the initial curable conductive structure 30 is fabricated on each pad 141 , and then the electrodes of the light-emitting element 20 are correspondingly placed on the initial curable conductive structure 30 on the pad 141 , and then the initial curable conductive structure 30 is processed. After curing, a curable conductive structure 30 that is finally connected to the electrodes of the light-emitting element 20 is obtained. Finally, an initial protective structure 40 is fabricated on the light emitting element 20 and the array substrate 10 , and the initial protective structure 40 is cured to obtain a final protective structure 40 , and then a complete lamp panel assembly 100 is obtained.

Optionally, the electrodes of the light emitting element 20 and the curable conductive structure 30 may be fixed by soldering through a reflow oven.

Optionally, please refer to FIG. 9 , in the process of making the initial protective structure 40 , the glue dispensing operation can be performed by the glue dispensing machine 200 , and the diameter of the protective glue droplet 201 is usually not less than 0.5 mm. The glue droplet 201 can wrap the light-emitting element 20 and the gap between the light-emitting element 20 and the filling structure 13 as a whole. When the initial protection structure 40 is finally cured, the residual air can be reduced, the generation of air bubbles can be reduced, and the damage of the protection structure 40 can be reduced. The risk of dispensing is increased, and the yield of the light panel assembly 100 is improved.

By applying the embodiments of the present application, at least the following beneficial effects can be achieved:

1. In the embodiment of the present application, the array substrate 10 includes a base material 11 , a solder resist structure 12 disposed on one side of the base material 11 , a plurality of filling structures 13 , and a plurality of conductive units 14 arranged in an array. Wherein, each conductive unit 14 is located in the through hole 121 of the solder mask structure 12 , and each conductive unit 14 includes two pads 141 , and a hollow exposing the substrate 11 exists between the two pads 141 . The filling structure 13 covers the base material 11 between the two pads 141 of each conductive unit 14, and fills the hollowed-out area to a certain extent, so that the hollowed-out area becomes shallower, which can reduce the bubbles generated during the fabrication of the protective structure 40. The residual air is reduced, the possibility of air damage to the light-emitting element 20 is reduced, the influence of air bubbles on the light-emitting effect of the light-emitting element 20 is reduced, and the yield rate and service life of the light board assembly 100 are improved. In addition, the thickness of the filling structure 13 is smaller than the minimum distance between the first surface 122 of the solder mask structure 12 away from the base material 11 and the base material 11, and is not greater than the sum of the thicknesses of the pads 141 and the curable conductive structure 30. Therefore, the filling The structure 13 does not affect the soldering between the light emitting element 20 and the curable conductive structure 30 .

2. The filling structure 13 in the embodiment of the present application is higher than the pad 141. When the curable conductive structure 30 is continuously fabricated on the pad 141, the thickness of the curable conductive structure 30 will fluctuate to a certain extent, resulting in the curable conductive structure. The thickness of 30 cannot be maintained at a constant value, but it can be determined that the thickness of the curable conductive structure 30 is within a range. Since the thickness of the curable conductive structure 30 is relatively thin, the filling structure 13 is higher than the pad 141, but smaller than the sum of the thicknesses of the core pads 141 of the curable conductive structure 30, and the curable conductive structure 30 is slightly higher than the filling structure 13, In other words, the height of the filling structure 13 can approach the height of the curable conductive structure 30 , further reducing the hollowing out, so that the gap between the filling structure 13 and the light-emitting element 20 is smaller, thereby reducing the air remaining under the light-emitting element 20 , to reduce the generation of air bubbles.

3. In the embodiment of the present application, a curable conductive structure 30 is fabricated on each pad 141 of the conductive unit 14 of the array substrate 10 , and the curable conductive structure 30 is connected to the electrodes of the light emitting element 20 . Compared with the base material 11 , the pad 141 is lower than the filling structure 13 , and the curable conductive structure 30 is slightly higher than the filling structure 13 , which can ensure that the electrodes of the light-emitting element 20 are smoothly welded to the curable conductive structure 30 and avoid the filling structure 13 Too high can lead to poor welding.

4. In the embodiment of the present application, after the curable conductive structure 30 is connected to the two electrodes of the light-emitting element 20, a part of the light-emitting element 20 is not connected to the curable conductive structure 30, and this part of the light-emitting element 20 is opposite to the filling structure 13. And there is a gap between it and the filling structure 13. The size of this gap is not less than 5 microns and not more than 10 microns, and the gap is small. In the later stage, the production process of the protective structure 40 using the glue dispenser 200 is a capillary operation, and it is easier to protect the droplets. Filling the gap can reduce the hollow between the light-emitting element 20 and the filling structure 13 , thereby reducing the residual air and reducing the generation of air bubbles.

5. In the preparation method of the array substrate 10 in the embodiment of the present application, the filling structure 13 is first formed between the two pads 141 of each conductive unit 14, and then the solder mask structure 12 having a plurality of through holes 121 is formed, In the process of opening the solder mask structure 12 , only the solder mask material in the opening area will be removed, and the prefabricated filling structure 13 will not be removed, and the filling structure 13 can always be filled between the light-emitting element 20 and the substrate 11 . . The preparation method of the array substrate 10 provided by the present application has high reliability, low cost and mass production.

Those skilled in the art can understand that various operations, methods, steps, measures, and solutions in the process discussed in this application may be alternated, modified, combined or deleted. Other steps, measures, and solutions in the various operations, methods, and processes that have been discussed in this application may also be alternated, modified, rearranged, split, combined, or deleted. The steps, measures, and solutions in the prior art with various operations, methods, and processes disclosed in this application may also be alternated, modified, rearranged, decomposed, combined, or deleted.

In the description of this application, the words "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", " The directions or positional relationships indicated by "bottom", "inside", "outside", etc. are based on the exemplary directions or positional relationships shown in the drawings, and are for the convenience of describing or simplifying the description of the embodiments of the present application, rather than indicating or It is implied that the device or component referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as a limitation of the present application.

The terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features delimited with "first", "second" may expressly or implicitly include one or more at least one of such features. In the description of this application, unless stated otherwise, "at least one" means two or more.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in specific situations.

In the description of this specification, the particular features, structures, materials or characteristics may be combined in any suitable manner in any one or at least one embodiment or example.

It should be understood that although the various steps in the flowchart of the accompanying drawings are sequentially shown as indicated by arrows, the execution order of these steps is not limited to the sequence indicated by the arrows. Unless explicitly stated herein, in some implementation scenarios of the embodiments of the present application, steps in each process may be performed in other sequences as required. Moreover, some or all of the steps in each flowchart are based on actual implementation scenarios, and may include multiple sub-steps or multiple stages. Some or all of these sub-steps or stages can be executed at the same time, or can be executed at different times. In scenarios with different execution times, the execution order of these sub-steps or stages can be flexibly configured according to requirements. This application implements Example is not limited to this.

The above are only some embodiments of the present application. It should be pointed out that for those skilled in the art, other similar implementation means based on the technical idea of the present application can be adopted without departing from the technical idea of the solution of the present application. , which also belong to the protection category of the embodiments of the present application.

Claims (10)

1. An array substrate, comprising: a base material, a solder resist structure disposed on one side of the base material, a plurality of filling structures, and a plurality of conductive units arranged in an array; Each of the conductive units includes two pads; each of the filling structures covers the substrate between the two pads of each of the conductive units; The solder mask structure has a plurality of through holes arranged in an array, and each of the conductive units and each of the filling structures is located in each of the through holes; The side of the pad away from the base material is used for connecting with the curable conductive structure, and the thickness of the filling structure is smaller than the minimum distance between the first surface of the solder mask structure away from the base material and the base material. The distance is not greater than the sum of the thicknesses of the pad and the curable conductive structure. 2 . The array substrate according to claim 1 , wherein the thickness of the filling structure is greater than the thickness of the pad. 3 . 3. The array substrate according to claim 1, further comprising: a first circuit structure; The first circuit structure is disposed on the same layer as the conductive unit and is located between at least part of the solder mask structure and the base material; The projection of the first circuit structure and the conductive unit on the substrate has no overlapping area. 4. The array substrate of claim 1, further comprising: a second circuit structure, disposed on the side of the base material away from the solder mask structure; The second solder resist layer is disposed on one side of the second circuit structure and the base material. 5. A light panel assembly, comprising: a plurality of light-emitting elements, a plurality of curable conductive structures, and the array substrate according to any one of claims 1-4; one side of each light-emitting element has two electrodes; Each pad of each conductive unit of the array substrate is connected with the curable conductive structure; the sum of the thickness of the curable conductive structure and the pad is greater than the thickness of the filling structure; The light-emitting element is located on the side of the curable conductive structure away from the pad, and each of the electrodes on one side of each light-emitting element is respectively connected to the curable conductive structure on one side of each of the pads. Structural connection. 6 . The light board assembly according to claim 5 , wherein the distance between the side of the light-emitting element with the electrode and the filling structure is not less than 5 micrometers and not more than 10 micrometers. 7 . 7. The light panel assembly of claim 5, further comprising: a protection structure; The protection structure covers at least one of the light-emitting elements and is connected to a side of the solder resist structure away from the base material and a side of the curable conductive structure away from the base material. 8. A backlight module, comprising: the lamp panel assembly according to any one of claims 5-7. 9. A method for preparing an array substrate according to any one of claims 1-4, characterized in that, comprising: Making a plurality of conductive units arranged in an array on one side of the substrate, each of the conductive units includes two pads; Making a plurality of filling structures on one side of the base material, so that each filling structure covers the base material between the two pads of each of the conductive units; A solder mask structure is fabricated on one side of the substrate, the solder mask structure has a plurality of through holes arranged in an array, so that each of the conductive units and each of the filling structures is located in each of the through holes; The thickness of the filling structure is smaller than the minimum distance between the first surface of the solder resist structure away from the base material and the base material, and is not greater than the sum of the thicknesses of the pad and the curable conductive structure. 10. A method for preparing a lamp panel assembly according to any one of claims 5-7, characterized in that, comprising: An initial curable conductive structure is fabricated on one side of each pad of each conductive unit of the array substrate according to any one of claims 1-4; the sum of the thickness of the curable conductive structure and the pad, greater than the thickness of the filling structure of the array substrate; A plurality of light-emitting elements are arranged on one side of the initial curable conductive structures of the plurality of conductive units, and the curable conductive structures are obtained by curing the initial curable conductive structures, so that each of the light-emitting elements has a curable conductive structure. an electrode is connected to the curable conductive structure on one side of each of the pads; An initial protection structure is fabricated on one side of the solder resist structure of the array substrate, the curable conductive structure and the light-emitting element based on a glue dispensing process, and the initial protection structure is cured to obtain a protection structure.

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