Detailed Description
In view of the shortcomings in the prior art, the inventor of the present invention has long studied and practiced in a large number of ways to propose the technical scheme of the present invention. The technical scheme, the implementation process, the principle and the like are further explained as follows.
The beam splitter provided by the embodiment of the invention has random offset distance in application, but fixed direction, and the beam splitter provided by the embodiment of the invention does not need two degrees of freedom in directions, the same effect can be achieved by only carrying out random offset (direction agreed by algorithm) in one direction, and the invention can reduce half of random parameter number when designing the microlens array with the same scale, and can be described by only needing fewer parameters for the microlens array with the large scale.
Embodiments of the present invention provide a beam splitter comprising an array of microstructures disposed on a substrate, the array of microstructures comprising a plurality of microstructures,
The microstructure comprises a first part and a second part which are mutually matched, wherein the first part comprises a first branch structure, a second branch structure and a third branch structure which are mutually connected and are integrally arranged in a radial shape, and the first part and the second part are not in direct contact;
Defining the row direction and the column direction of the microstructure array as an X direction and a Y direction respectively, wherein the X direction and the Y direction are arranged orthogonally, and the microstructure meets at least one of the following conditions of 0.15< DX/PX <0.35,0.7< T1/PX <0.9,0.8< T2/PX <0.98,0.15< DY/PY <0.35,0.5< T3/PY <0.7,0.8< T4/PY <0.98;
Wherein PX is the distance between the first feature point of one microstructure and the first feature point of the next microstructure in the same row in the X direction, PY is the distance between the second feature point of one microstructure and the second feature point of the next microstructure in the same column in the Y direction, DX is the maximum distance between the two feature points of the second portion in the X direction, DY is the maximum distance between the two feature points of the second portion in the Y direction, T1 is the maximum distance between the two feature points of the first and third branch structures in the X direction, T2 is the maximum distance between the two feature points of the first and third branch structures in the X direction, T3 is the maximum distance between the two feature points of the first and third branch structures in the Y direction, and T4 is the maximum distance between the two feature points of the first and third branch structures in the Y direction.
In some more specific embodiments, the second portion is disposed in a region between the first branch structure and the third branch structure, and an orthographic projection of the second portion of the microstructure along the X direction coincides with an orthographic projection of the third branch structure along the X direction, and an entirety of the orthographic projection of the second portion of the microstructure along the Y direction is located within an orthographic projection of the first branch structure along the Y direction.
In some more specific embodiments, the first portion of the microstructure is integrally formed in a treasured cap shape.
In some more specific embodiments, the beam splitter is used to split a single beam of light into a plurality of 5 x 5 beams of light, wherein the single beam of light is a laser, and the single beam of light has a wavelength of 850+/-20nm or 940+/-20nm.
In some more specific embodiments, the diffraction angles of the beam splitter in the X direction and the Y direction are respectively 10-14 degrees and 7-11 degrees.
In some more specific embodiments, both the substrate and the microstructure are transparent, the microstructure comprising raised or recessed features disposed on the surface of the substrate.
In some more specific embodiments, the microstructures have a height of protrusions or depth of recesses relative to the surface of the substrate of 1000+/-100nm.
In some more specific embodiments, the substrate and microstructure materials include optical glass, optical resin, or optical cement.
In some more specific embodiments, the microstructures are formed on the surface of the substrate by at least embossing or etching.
The embodiment of the invention also provides application of the beam splitter in depth detection or three-dimensional detection based on flight time or structured light.
The embodiment of the invention also provides an optical assembly, which comprises a light source and the beam splitter, wherein the beam splitter is used for splitting light rays emitted by the light source.
In some more specific embodiments, the light source comprises a laser.
The embodiment of the invention also provides application of the optical component in depth detection or three-dimensional detection based on flight time or structured light.
The technical scheme of the invention will be specifically described below with reference to the accompanying drawings and some embodiments. It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the invention. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
Referring to fig. 1, a beam splitter includes a microstructure array disposed on a substrate, where the microstructure array includes a plurality of microstructures, the microstructures include a first portion 10 and a second portion 20 that are mutually matched, the first portion 10 includes a first branch structure 11, a second branch structure 12 and a third branch structure 13 that are mutually connected and integrally radially disposed, and the first portion 10 and the second portion 20 are not in direct contact, which can be understood that the first portion 10 is a three-branch island structure, and the second portion 20 is an island structure.
Referring to fig. 1 and 2 again, the row direction and the column direction of the microstructure array are respectively defined as X direction and Y direction, and the X direction and the Y direction are orthogonally arranged, so that the microstructure satisfies the following conditions of 0.15< dx/PX <0.35,0.7< t1/PX <0.9,0.8< t2/PX <0.98,0.15< dy/PY <0.35,0.5< t3/PY <0.7,0.8< t4/PY <0.98;
Wherein PX is a distance between a first feature point of one microstructure and a first feature point of a next microstructure located in the same row in the X direction, PY is a distance between a second feature point of one microstructure and a second feature point of a next microstructure located in the same column in the Y direction, DX is a maximum distance between two feature points of the second portion 20 in the X direction, DY is a maximum distance between two feature points of the second portion 20 in the Y direction, T1 is a maximum distance between two feature points of the first and second branch structures 11 and 12 in the X direction, T2 is a maximum distance between two feature points of the first and third branch structures 11 and 13 in the X direction, T3 is a maximum distance between two feature points of the first and second branch structures 11 and 12 in the Y direction, and T4 is a maximum distance between two feature points of the first and third branch structures 11 and 13 in the Y direction.
In this embodiment, the second portion 20 is disposed in the area between the first branch structure 11 and the third branch structure 13, the orthographic projection of the second portion 20 of the microstructure along the X direction coincides with the orthographic projection of the third branch structure 13 along the X direction, and all of the orthographic projection of the second portion 20 of the microstructure along the Y direction is located within the orthographic projection of the first branch structure 11 along the Y direction.
In this embodiment, the first portion 10 of the microstructure is generally treasured cover-shaped.
In this embodiment, the beam splitter is formed by coating an optical adhesive layer on an optical glass, then pressing a microstructure array on the optical adhesive layer by using an embossing mold with a preset convex pattern structure, wherein the optical adhesive layer can be formed by using a commercially available UV adhesive, the coating thickness of the optical adhesive layer can be 0.005mm, the dimension of a first portion of the microstructure in the x direction is 3.339-5.698 um, the dimension of a second portion in the y direction is 4.1265-7.854 um, the dimension of the second portion in the x direction is 0.9135-1.5785 um, the dimension in the y direction is 1.134-2.1175 um, and the embossing depth is 1000nm, of course, the pattern structure on the embossing mold can also be replaced by a concave pattern structure, and fig. 3 shows the test result of splitting the laser with a wavelength of 940nm by using one of the optical beam splitters, so that the optical beam splitter can realize uniform beam splitting of the laser with a wavelength of 5×5.
Example 1
Referring to fig. 4 in conjunction with fig. 1-3, fig. 4 shows a structure of a single microstructure in this embodiment, and a beam splitter includes a microstructure array disposed on a substrate, where the microstructure array includes a plurality of microstructures, the microstructures include a first portion 10 and a second portion 20 that are disposed in cooperation with each other, the first portion 10 includes a first branch structure 11, a second branch structure 12, and a third branch structure 13 that are connected to each other and are disposed radially as a whole, and the first portion 10 and the second portion 20 are not in direct contact, which can be understood that the first portion 10 is in a three-branch island structure, and the second portion 20 is in an island structure.
In this embodiment, the row direction and the column direction of the microstructure array are respectively defined as an X direction and a Y direction, where the X direction and the Y direction are orthogonally arranged, and structural parameters of the microstructures DX, DY, PX, PY, T1, T2, T3, T4, DX/PX, T1/PX, T2/PX, DY/PY, T3/PY, and T4/PY in this embodiment are shown in table 1.
Wherein PX is a distance between a first feature point of one microstructure and a first feature point of a next microstructure located in the same row in the X direction, PY is a distance between a second feature point of one microstructure and a second feature point of a next microstructure located in the same column in the Y direction, DX is a maximum distance between two feature points of the second portion 20 in the X direction, DY is a maximum distance between two feature points of the second portion 20 in the Y direction, T1 is a maximum distance between two feature points of the first and second branch structures 11 and 12 in the X direction, T2 is a maximum distance between two feature points of the first and third branch structures 11 and 13 in the X direction, T3 is a maximum distance between two feature points of the first and second branch structures 11 and 12 in the Y direction, and T4 is a maximum distance between two feature points of the first and third branch structures 11 and 13 in the Y direction.
Example 2
Referring to fig. 5 in conjunction with fig. 1-3, fig. 5 shows a structure of a single microstructure in this embodiment, and a beam splitter includes a microstructure array disposed on a substrate, where the microstructure array includes a plurality of microstructures, the microstructures include a first portion 10 and a second portion 20 that are disposed in cooperation with each other, the first portion 10 includes a first branch structure 11, a second branch structure 12, and a third branch structure 13 that are connected to each other and are disposed radially as a whole, and the first portion 10 and the second portion 20 are not in direct contact, which can be understood that the first portion 10 is in a three-branch island structure, and the second portion 20 is in an island structure.
In this embodiment, the row direction and the column direction of the microstructure array are respectively defined as an X direction and a Y direction, where the X direction and the Y direction are orthogonally arranged, and structural parameters of the microstructures DX, DY, PX, PY, T1, T2, T3, T4, DX/PX, T1/PX, T2/PX, DY/PY, T3/PY, and T4/PY in this embodiment are shown in table 1.
Example 3
Referring to fig. 6 in conjunction with fig. 1-3, fig. 6 shows a structure of a single microstructure in this embodiment, and a beam splitter includes a microstructure array disposed on a substrate, where the microstructure array includes a plurality of microstructures, the microstructures include a first portion 10 and a second portion 20 that are disposed in cooperation with each other, the first portion 10 includes a first branch structure 11, a second branch structure 12, and a third branch structure 13 that are connected to each other and are disposed radially as a whole, and the first portion 10 and the second portion 20 are not in direct contact, which can be understood that the first portion 10 is in a three-branch island structure, and the second portion 20 is in an island structure.
In this embodiment, the row direction and the column direction of the microstructure array are respectively defined as an X direction and a Y direction, where the X direction and the Y direction are orthogonally arranged, and structural parameters of the microstructures DX, DY, PX, PY, T1, T2, T3, T4, DX/PX, T1/PX, T2/PX, DY/PY, T3/PY, and T4/PY in this embodiment are shown in table 1.
Example 4
Referring to fig. 7 in conjunction with fig. 1-3, fig. 7 shows a structure of a single microstructure in this embodiment, and a beam splitter includes a microstructure array disposed on a substrate, where the microstructure array includes a plurality of microstructures, the microstructures include a first portion 10 and a second portion 20 that are disposed in cooperation with each other, the first portion 10 includes a first branch structure 11, a second branch structure 12, and a third branch structure 13 that are connected to each other and are disposed radially as a whole, and the first portion 10 and the second portion 20 are not in direct contact, which can be understood that the first portion 10 is in a three-branch island structure, and the second portion 20 is in an island structure.
In this embodiment, the row direction and the column direction of the microstructure array are respectively defined as an X direction and a Y direction, where the X direction and the Y direction are orthogonally arranged, and structural parameters of the microstructures DX, DY, PX, PY, T1, T2, T3, T4, DX/PX, T1/PX, T2/PX, DY/PY, T3/PY, and T4/PY in this embodiment are shown in table 1.
Example 5
Referring to fig. 8 in conjunction with fig. 1-3, fig. 8 shows a structure of a single microstructure in this embodiment, and a beam splitter includes a microstructure array disposed on a substrate, where the microstructure array includes a plurality of microstructures, the microstructures include a first portion 10 and a second portion 20 that are disposed in cooperation with each other, the first portion 10 includes a first branch structure 11, a second branch structure 12, and a third branch structure 13 that are connected to each other and are disposed radially as a whole, and the first portion 10 and the second portion 20 are not in direct contact, which can be understood that the first portion 10 is in a three-branch island structure, and the second portion 20 is in an island structure.
In this embodiment, the row direction and the column direction of the microstructure array are respectively defined as an X direction and a Y direction, where the X direction and the Y direction are orthogonally arranged, and structural parameters of the microstructures DX, DY, PX, PY, T1, T2, T3, T4, DX/PX, T1/PX, T2/PX, DY/PY, T3/PY, and T4/PY in this embodiment are shown in table 1.
Example 6
Referring to fig. 9 in conjunction with fig. 1-3, fig. 9 shows a structure of a single microstructure in this embodiment, and a beam splitter includes a microstructure array disposed on a substrate, where the microstructure array includes a plurality of microstructures, the microstructures include a first portion 10 and a second portion 20 that are disposed in cooperation with each other, the first portion 10 includes a first branch structure 11, a second branch structure 12, and a third branch structure 13 that are connected to each other and are disposed radially as a whole, and the first portion 10 and the second portion 20 are not in direct contact, which can be understood that the first portion 10 is in a three-branch island structure, and the second portion 20 is in an island structure.
In this embodiment, the row direction and the column direction of the microstructure array are respectively defined as an X direction and a Y direction, where the X direction and the Y direction are orthogonally arranged, and structural parameters of the microstructures DX, DY, PX, PY, T1, T2, T3, T4, DX/PX, T1/PX, T2/PX, DY/PY, T3/PY, and T4/PY in this embodiment are shown in table 1.
Table 1 shows structural parameters of DX, DY, PX, PY, T, T2, T3, T4, DX/PX, T1/PX, T2/PX, DY/PY, T3/PY, T4/PY of the microstructures in examples 1-6
The beam splitter provided by the embodiment of the invention can realize a uniform beam splitting effect of 5 multiplied by 5, can meet the requirements of various lattice projection schemes (including speckle structure light and dToF), has a simple preparation process, is suitable for large-scale production, and has a wide application prospect.
It should be understood that the above embodiments are merely for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the present invention and implement the same according to the present invention without limiting the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.