CN115020108A - Electronic component manufacturing apparatus - Google Patents
Electronic component manufacturing apparatus Download PDFInfo
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- CN115020108A CN115020108A CN202210728644.7A CN202210728644A CN115020108A CN 115020108 A CN115020108 A CN 115020108A CN 202210728644 A CN202210728644 A CN 202210728644A CN 115020108 A CN115020108 A CN 115020108A
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- green sheet
- electronic component
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- pressure bonding
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 91
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 238000010030 laminating Methods 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000003475 lamination Methods 0.000 claims description 46
- 239000011230 binding agent Substances 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 230000009477 glass transition Effects 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 34
- 238000004804 winding Methods 0.000 abstract description 22
- 239000010410 layer Substances 0.000 description 29
- 239000000919 ceramic Substances 0.000 description 15
- 238000005520 cutting process Methods 0.000 description 14
- 239000003985 ceramic capacitor Substances 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000306 polymethylpentene Polymers 0.000 description 2
- 239000011116 polymethylpentene Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides an electronic component manufacturing apparatus. In the step of producing a green sheet laminate by thermally pressing a plurality of green sheets, the shape of the green sheet laminate is less likely to be deformed. The method for manufacturing an electronic component, which uses a rotating pressure roller (7) and a laminating table (8) that reciprocates in the horizontal direction in synchronization with the rotation of the pressure roller (7), comprises the steps of: a step of winding the blank sheet (6) around a pressure-bonding roller (7); and a step of transferring the sheet (6) from the pressure roller (7) to the stacking base (8) at the processing point (P), heating and pressing the sheet to form a sheet stacked body (9) in which a plurality of sheets (6) are stacked on the stacking base (8), wherein near-infrared rays are irradiated at least to a portion of the sheet (6) wound around the pressure roller (7) and the portion of the uppermost layer of the sheet stacked body (9) and the portion thereof immediately before the processing point (P).
Description
The present application is a divisional application entitled "method and apparatus for manufacturing electronic component" filed as application No. 202010630462.7 and filed as application No. 2020.6.30.
Technical Field
The present invention relates to a method for manufacturing an electronic component, and more particularly, to a method for manufacturing an electronic component including a step of winding a Green sheet (Green sheet) around a pressure-bonding roller and a step of transferring the Green sheet from the pressure-bonding roller to a lamination stage, and heating and pressure-bonding the transferred Green sheet to the lamination stage to produce a Green sheet laminate in which a plurality of Green sheets are laminated on the lamination stage.
The present invention relates to an electronic component manufacturing apparatus, and more particularly, to an electronic component manufacturing apparatus capable of easily performing the method of manufacturing an electronic component of the present invention.
Background
Patent document 1 (japanese patent application laid-open No. 3-297117) discloses a method for manufacturing an electronic component, which has been widely practiced. The method for manufacturing an electronic component disclosed in patent document 1 includes a step of laminating a plurality of green sheets peeled from a carrier film on a stacking table, and heating and pressure-bonding the laminated green sheets to integrate the green sheets into a green sheet laminate. A method for manufacturing an electronic component disclosed in patent document 1 is described with reference to fig. 9.
The method of manufacturing an electronic component disclosed in patent document 1 uses a cutting table 101, an adsorption head 102, and a lamination table 103.
The suction head 102 can be lifted and lowered in the up-and-down direction as indicated by arrow X, and can be moved in the horizontal direction as indicated by arrow Y. The suction head 102 is provided with a cutter 104 at its periphery. In addition, the suction head 102 has air holes (vent holes) 105 formed in the lower surface.
The stacking base 103 can be moved up and down as indicated by arrow Z. The lamination stage 103 incorporates a heater 106.
First, the carrier film 108 having the mother substrate 107 formed on the upper main surface is placed on the cutting table 101. Next, the suction head 102 is lowered onto the mother sheet 107, and a sheet 109 of a predetermined size is cut out of the mother sheet 107 by the cutter 104. Then, the suction head 102 sucks the cut green sheet 109 through the air holes 105.
Next, the suction head 102 having the green sheet 109 sucked on the lower surface thereof is raised. As a result, the green sheet 109 is peeled from the carrier film 108. Next, the suction head 102, which has the green sheet 109 sucked on the lower surface thereof, is moved in the horizontal direction and disposed directly above the stacking base 103.
At this time, a green sheet stacked body 110 formed of a plurality of green sheets 109 stacked and integrated in advance is already formed on the upper surface of the stacking table 103. The green sheet laminate 110 is heated by the heater 106 to a high temperature. The reason why the green sheet stacked body 110 is heated by the heater 106 is that the temperature of the uppermost layer of the green sheet stacked body 110 is set to a high temperature, and the green sheets 109 stacked later are favorably heated and pressure-bonded.
Next, the stacking base 103 on which the green sheet stacked body 110 is formed is raised toward the green sheet 109 sucked by the suction head 102. Then, a pressure is applied between the green sheet stacked body 110 and the green sheet 109 sucked by the suction head 102 by the stacking table 103 and the suction head 102. As a result, the green sheet 109 sucked by the suction head 102 is heat-pressure bonded to the uppermost layer of the green sheet stacked body 110 heated to a high temperature.
In the method for manufacturing an electronic component disclosed in patent document 1, a predetermined number of green sheets 109 are heated and pressure-bonded to complete a green sheet laminate 110.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 3-297117
Disclosure of Invention
Problems to be solved by the invention
In the method of manufacturing an electronic component disclosed in patent document 1, the green sheet laminate 110 formed on the upper surface of the lamination stage 103 is heated to a high temperature by the heater 106 and softened. Therefore, when the green sheet laminate 110 and the new green sheet 109 are thermally and pressure bonded by the lamination stage 103 and the suction head 102, the green sheet laminate 110 may be deformed and deformed. More specifically, the green sheet laminate 110 is formed in a square shape when viewed in the lamination direction, and when the green sheet laminate 110 and the new green sheet 109 are thermally and pressure bonded, the vicinity of the center of each side of the square shape of the green sheet laminate 110 may bulge outward.
In an industrial production line, in order to collectively manufacture a large number of electronic components, a large number of green sheet laminates are collectively manufactured on 1 green sheet laminate 110. Specifically, for example, a green sheet laminate corresponding to a large number of electronic components is often produced by arranging 1 green sheet laminate 110 in a matrix, and this is used as a mother green sheet laminate. In such a case, the green sheet laminate 110, which is a mother green sheet laminate, is divided into green sheet laminates of the electronic components in the subsequent step.
In addition, before the green sheets 109 are laminated to produce the green sheet laminate 110, the internal electrodes of the electronic components are formed between the layers of the green sheet laminate 110, because the internal electrodes are formed by printing a conductive paste on the main surfaces of the green sheets 109.
As described above, in the method for manufacturing an electronic component disclosed in patent document 1, when the green sheet laminate 110 and the new green sheet 109 are thermally and pressure bonded, the shape of the green sheet laminate 110 heated to a high temperature may be deformed. Further, when the shape of the green sheet laminated body 110 is deformed, the positions of the internal electrodes of the electronic components formed between the layers of the green sheet laminated body 110 are displaced, and therefore, the green sheet laminated body of the electronic components obtained by dividing the green sheet laminated body 110 has a problem that the internal electrodes are not formed at the designed positions. In addition, the electronic component manufactured by firing the green sheet laminate in which the internal electrode is not formed at the designed position may not obtain desired electrical characteristics and required reliability, and may be a defective product.
When the green sheet laminate 110 is out of shape beyond the limit, the positions of the internal electrodes formed between the layers may be greatly displaced and overlap the dividing lines, and the green sheet laminate 110 may not be divided into green sheet laminates of the electronic components.
In view of the above, an object of the method for manufacturing an electronic component according to the present invention is to suppress deformation of the shape of a green sheet laminate in a step of producing the green sheet laminate by thermally pressing a plurality of green sheets. Further, an object of the electronic component manufacturing apparatus of the present invention is to enable the method of manufacturing an electronic component of the present invention to be easily carried out.
Means for solving the problems
The present invention has been made to solve the above-described conventional problems, and as a configuration thereof, a method for manufacturing an electronic component according to an aspect of the present invention uses a pressure roller that rotates and a lamination stage that reciprocates in a horizontal direction in synchronization with the rotation of the pressure roller, and includes: winding the blank sheet around a pressure roller; and a step of transferring the green sheets from the pressure bonding roller to the stacking base at the processing point, and performing heat pressure bonding to produce a green sheet stacked body in which a plurality of green sheets are stacked on the stacking base, wherein near infrared rays are irradiated to at least a portion of the green sheets wound around the pressure bonding roller, which portion is to reach the processing point, and a portion of the green sheets stacked on the uppermost layer of the green sheet stacked body, which portion is to reach the processing point.
In order to facilitate the method for manufacturing an electronic component according to an embodiment of the present invention, an electronic component manufacturing apparatus includes: a pressure bonding roller capable of rotating; and a lamination stage that reciprocates in the horizontal direction in synchronization with rotation of the pressure bonding roller, wherein the electronic component manufacturing apparatus winds the green sheet around the pressure bonding roller, and transfers the green sheet from the pressure bonding roller to the lamination stage at the processing point, and performs heat pressure bonding to produce a green sheet laminate in which a plurality of green sheets are laminated on the lamination stage, wherein the electronic component manufacturing apparatus further includes a near-infrared heater that irradiates near-infrared rays onto at least a portion of the green sheet wound around the pressure bonding roller that is to reach the processing point and a portion of the green sheet laminated on the uppermost layer of the green sheet laminate that is to reach the processing point.
ADVANTAGEOUS EFFECTS OF INVENTION
The method for manufacturing an electronic component according to the present invention can suppress the occurrence of deformation in the shape of a green sheet laminate obtained by pressure-bonding a plurality of green sheets.
In addition, the method for manufacturing an electronic component according to the present invention can be easily performed by using the apparatus for manufacturing an electronic component according to the present invention.
Drawings
Fig. 1 is a schematic diagram of a main part of an electronic component manufacturing apparatus 1000 used in the electronic component manufacturing method according to embodiment 1.
Fig. 2 is a sectional view showing the pressure roller 7 of the electronic component manufacturing apparatus 1000.
Fig. 3 (a) to 3 (C) are front views each showing a winding step in the method for manufacturing an electronic component according to embodiment 1.
Fig. 4 (a) to 4 (C) are explanatory views each showing a winding step in the method for manufacturing an electronic component according to embodiment 1.
Fig. 5 (a) to 5 (C) are front views each showing a lamination step of the method for manufacturing an electronic component according to embodiment 1.
Fig. 6 (a) to 6 (C) are explanatory views each showing a lamination step of the method for manufacturing an electronic component according to embodiment 1.
Fig. 7 is a graph showing an irradiation Profile (Profile) of near infrared rays in the method for manufacturing an electronic component according to embodiment 2.
Fig. 8 is a front view showing a laminating step of the method for manufacturing an electronic component according to embodiment 3.
Fig. 9 is an explanatory diagram of a method of manufacturing an electronic component disclosed in patent document 1.
Fig. 10 is a front view showing a lamination process of the method of manufacturing an electronic component of the reference example.
Description of the reference numerals
1a, the 1 st driving roller; 1b, the 2 nd drive roller; 2. a mother blank sheet; 3. a carrier film; 4. cutting table; 5. a cutting knife; 6. blank sheets; 7. a crimping roller; 7a, a vent hole; 7b, a heat source; 8. a laminating station; 8a, a heat source; 9. a green sheet laminate; 10. a near infrared heater; 20. a2 nd near infrared ray heater; a1, cutting area; a2, winding area; a3, lamination area; p, machining point.
Detailed Description
Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings. The embodiments are merely illustrative of the embodiments of the present invention, and the present invention is not limited to the contents of the embodiments. Further, the contents described in the different embodiments may be combined and implemented, and the implementation contents in this case are also included in the present invention. The drawings are for the purpose of facilitating understanding of the specification, and may be schematically drawn, and the components or the ratio of the dimensions between the components may not be the same as the ratio of the dimensions described in the specification. In addition, the constituent elements described in the specification may be omitted in the drawings, may be drawn as omitted elements, or the like.
[ embodiment 1 ]
Hereinafter, first, an outline of the method for manufacturing an electronic component according to the present embodiment will be described, and then, each step will be described in detail. In addition, the type of electronic component to be manufactured is arbitrary, and in the present embodiment, for example, a multilayer ceramic capacitor is manufactured.
Fig. 1 is a schematic diagram of a main part of an electronic component manufacturing apparatus 1000 used in the electronic component manufacturing method according to the present embodiment.
The electronic component manufacturing apparatus 1000 includes a cutting region a1, a winding region a2, and a laminating region A3.
The carrier film 3 having the long mother sheet 2 formed on the main surface thereof is conveyed to the cutting area a1 and the winding area a2 by the 1 st driving roller 1a and the 2 nd driving roller 1 b.
In the cutting area a1, the conveyance of the mother sheet 2 and the carrier film 3 is stopped, and the mother sheet 2 is cut into individual sheets 6 by the cutting table 4 and the cutter 5.
The cut raw sheet 6 and carrier film 3 are fed to a winding area a2 by a1 st driving roller 1a and a2 nd driving roller 1 b.
The electronic component manufacturing apparatus 1000 includes the pressure contact roller 7 that reciprocates between the winding area a2 and the lamination area A3.
The pressure roller 7 peels the web 6 from the carrier film 3 in the winding area a2, and winds the peeled web 6 around the outer peripheral surface of the pressure roller 7. Then, the pressure roller 7 around which the green sheet 6 is wound is moved to the laminating area a 3.
The electronic component manufacturing apparatus 1000 includes a lamination stage 8 that reciprocates in the horizontal direction in the lamination area a 3. The electronic component manufacturing apparatus 1000 includes the near-infrared heater 10 in the lamination area a 3.
In the laminating area a3, the pressure roller 7 delivers the wound green sheet 6 to the laminating table 8. The plurality of green sheets 6 joined by the pressure bonding rollers 7 are sequentially stacked on the upper surface of the stacking base 8, and are heated and pressure bonded to integrate the green sheets 6. Then, a predetermined number of green sheets 6 are thermally and pressure bonded to integrate these green sheets 6, thereby producing a green sheet laminate 9 on the upper surface of the lamination stage 8. Before the heating and pressure-bonding, the green sheet 6 wound around the pressure-bonding roller 7 and the green sheet 6 stacked on the uppermost layer are heated to a predetermined temperature by the near infrared heater 10.
Next, when the green sheet laminate 9 contains a plurality of electronic components, the green sheet laminate 9 is divided into a plurality of individual green sheet laminates.
Next, the green sheet laminate 9 or the green sheet laminates divided into individual pieces are fired in a predetermined curve to produce a ceramic laminate (not shown).
Finally, the external electrodes are formed on the outer surface of the ceramic laminate to complete the electronic component (multilayer ceramic capacitor) of the present embodiment.
The above description is made of the outline of the method for manufacturing an electronic component according to the present embodiment. Next, details of each step will be described.
First, the carrier film 3 is prepared. The material of the carrier film 3 is arbitrary, and for example, PET (polyethylene terephthalate), PP (polypropylene), and PEN (polymethylpentene) can be used. The carrier film 3 may have any desired dimensions, such as length, width, and thickness, and may be used as desired.
Next, ceramic powder, binder resin, solvent, and plasticizer are prepared, and the ceramic powder, binder resin, solvent, plasticizer, and the like are wet-mixed to prepare ceramic slurry. In this embodiment, for example, a dielectric ceramic is used for the ceramic for manufacturing a laminated ceramic capacitor.
The binder resin mixed in the ceramic slurry has a predetermined glass transition temperature. In addition, when a plasticizer is added to the ceramic slurry, the glass transition temperature of the binder resin can be lowered.
Next, the ceramic slurry is coated in a sheet form on the carrier film 3 using a die coater, a gravure coater, a micro-gravure coater, or the like, and dried. The thickness of the ceramic slurry to be applied is arbitrary, and is appropriately set according to the desired thickness of the mother sheet 2. The method of applying the ceramic slurry is also arbitrary, and a doctor blade or the like may be used instead of the coater.
This completes the carrier film 3 having the long mother sheet 2 formed on one main surface.
Next, if necessary, a conductive paste is printed in a desired pattern on the upper main surface of the mother substrate 2, thereby forming internal electrodes.
Next, as shown in fig. 1, the carrier film 3 on which the mother green sheet 2 is formed is supplied to the electronic component manufacturing apparatus 1000. The carrier film 3 on which the mother web 2 is formed is conveyed to the cutting area a1 and the winding area a2 by the 1 st driving roller 1a and the 2 nd driving roller 1 b. In addition, in the cutting area a1, the carrier film 3 on which the mother sheets 2 are formed is conveyed between the cutting table 4 and the cutter 5.
Next, the mother green sheet 2 is cut into green sheets 6 at the cutting area a 1. Specifically, first, the conveyance of the carrier film 3 on which the mother substrate 2 is formed is stopped. Subsequently, the cutter 5 is lowered to cut the mother green sheet 2 into green sheets 6. Although not visible in fig. 1, the cut green sheet 6 is rectangular in plan view.
Next, the carrier film 3 is intermittently fed by the 1 st driving roller 1a and the 2 nd driving roller 1b, the cut blank sheet 6 is fed to the winding area a2, and the portion of the mother blank sheet 2 to be cut next is fed to the cutting area a 1.
As described above, the electronic component manufacturing apparatus 1000 includes the pressure contact roller 7 that reciprocates between the winding area a2 and the lamination area A3. In the present embodiment, the pressure bonding roller 7 not only presses (heat-pressure bonds) the green sheets 6 stacked in the stacking region A3, but also separates the green sheets 6 from the carrier film 3 in the winding region a2 and winds the separated green sheets onto the pressure bonding roller 7, and conveys the wound green sheets 6 from the winding region a2 to the stacking region A3. That is, the pressure contact roller 7 serves as both a peeling roller and a conveyance roller.
In the present embodiment, as shown in fig. 2, the pressure bonding roller 7 has a Multi-chamber suction roller (Multi-chamber suction roller) structure in which a vent hole 7a is formed in the outer peripheral surface. The pressure roller 7 can be set to any state such as a suction state, a discharge state (an air blowing state), and an open state to the atmosphere in the state of the vent hole 7a for each region of the outer peripheral surface and every time.
In the present embodiment, the heat source 7b is provided in the pressure bonding roller 7 to heat the wound green sheet 6. The type of the heat source 7b is arbitrary, and for example, a resistance heating system such as a cartridge heater or a plate heater, an induction heating system, a dielectric heating system, a heat pump system using a heat medium, or the like can be used.
The material of the pressure roller 7 is arbitrary, and aluminum, carbon, SUS, or the like can be used, for example. The diameter of the pressure roller 7 is arbitrary, and can be set to 50mm or more and 1000mm or less, for example.
Next, as shown in fig. 3 a to 3C and 4 a to 4C, in the winding area a2, the blank sheet 6 formed on the carrier film 3 is peeled from the carrier film 3 by the pressure roller 7, and the peeled blank sheet 6 is wound around the outer peripheral surface of the pressure roller 7. Fig. 3 (a) to 3 (C) are front views. Fig. 4 a to 4C are explanatory views showing the states (suction state, state of being open to the atmosphere, and exhaust state) of the vent holes 7a of the pressure roller 7. Fig. 3 (a) and 4 (a) show the same timing, fig. 3 (B) and 4 (B) show the same timing, and fig. 3 (C) and 4 (C) show the same timing.
First, as shown in fig. 3 (a) and 4 (a), the rectangular blank sheet 6 is fed to the winding area a2 with the carrier film 3, and the tip end thereof is brought into contact with the lowermost portion of the pressure-bonding roller 7. At this time, the vent hole 7a of the pressure roller 7 is in an open state (or an exhaust state) and does not perform suction.
Next, as shown in fig. 3 (B) and 4 (B), the rectangular blank 6 is further conveyed by the carrier film 3, and the pressure-bonding roller 7 is rotated in synchronization with the conveyance. At this time, the vent holes 7a are sequentially switched from the state of being opened to the atmosphere (or the exhaust state) to the suction state when passing through the lowermost portion of the pressure bonding roller 7, and suck the green sheet 6. Then, the blank sheet 6 is peeled from the carrier film 3 with the rotation of the pressure bonding roller 7.
Next, as shown in fig. 3 (C) and 4 (C), the blank sheet 6 is completely peeled from the carrier film 3, and the blank sheet 6 is wound around the outer peripheral surface of the pressure-bonding roller 7.
In the present embodiment, the blank sheet 6 wound around the outer peripheral surface of the pressure bonding roller 7 is heated by the heat source 7b of the pressure bonding roller 7. The heating temperature is set to be lower than the glass transition temperature of the binder resin contained in the green sheet 6. When the glass transition temperature of the binder resin contained in the green sheet 6 is, for example, 60 ℃, the heating temperature of the heat source 7b is, for example, 40 ℃. The reason why the heating temperature of the heat source 7b is lower than the glass transition temperature of the binder resin contained in the green sheet 6 is to suppress softening of the green sheet 6 wound around the pressure-bonding roller 7.
Next, as shown in fig. 1, the pressure roller 7 around which the green sheet 6 is wound is moved to the laminating area a 3. However, instead of moving the pressure roller 7 to the laminating area a3, the laminating table 8 may be moved directly below the pressure roller 7 after retracting the 2 nd driving roller 1b together with the carrier film 3 in the horizontal direction (after retracting to the left in fig. 1). That is, the stacked region A3 may be provided at the same position as the winding region a 2.
As described above, the electronic component manufacturing apparatus 1000 includes the lamination stage 8 in the lamination area a 3. The lamination stage 8 reciprocates in the horizontal direction.
In the present embodiment, a heat source 8a is provided on the lamination stage 8 to heat the green sheet laminate 9. The type of the heat source 8a is arbitrary, and for example, a resistance heating system such as a cartridge heater or a plate heater, an induction heating system, a dielectric heating system, a heat pump system using a heat medium, or the like can be used.
As described above, the electronic component manufacturing apparatus 1000 includes the near-infrared heater 10 in the lamination area a 3.
Fig. 5 (a) to 5 (C) and 6 (a) to 6 (C) show a step of laminating the green sheets 6 in the lamination region a3 to produce the green sheet laminate 9. Fig. 5 (a) to 5 (C) are front views. Fig. 6 a to 6C are explanatory views showing the states (suction state, open to the atmosphere state, and exhaust state) of the vent holes 7a of the pressure roller 7. Fig. 5 (a) and 6 (a) show the same timing, fig. 5 (B) and 6 (B) show the same timing, and fig. 5 (C) and 6 (C) show the same timing.
First, as shown in fig. 5 (a) and 6 (a), the lamination stage 8 is moved below the pressure-contact roller 7 around which the web 6 is wound. In fig. 5 (a) and 6 (a), a plurality of green sheets 6 are stacked on the stacking base 8 and are thermally and pressure bonded, so that a green sheet stacked body 9 exists during production. However, when the 1 st layer green sheet 6 is laminated, the green sheet laminated body 9 (green sheet 6) does not exist on the lamination stage 8.
Fig. 5 (a) and 6 (a) show the timing when the leading end of the raw sheet 6 wound around the pressure-bonding roller 7 is brought into contact with the leading end of the uppermost raw sheet 6 of the raw sheet stacked body 9 stacked in the middle of production at the processing point P. The processing point P is a point at which the green sheet 6 wound around the pressure roller 7 is transferred from the pressure roller 7 to the stacking base 8, and the lower main surface of the transferred green sheet 6 is heat-pressure bonded to the upper main surface of the green sheet 6 stacked on the uppermost layer of the green sheet stacked body 9 in the middle of production by the pressure roller 7 and the stacking base 8.
At the time shown in fig. 5 (a) and 6 (a), the vent holes 7a of the pressure roller 7 are in the suction state, and the blank sheet 6 is wound around the pressure roller 7.
In the present embodiment, the green sheet laminated body 9 (during or after production) on the lamination stage 8 is heated by the heat source 8a of the lamination stage 8. The heating temperature is set to be lower than the glass transition temperature of the binder resin contained in the green sheet 6. When the glass transition temperature of the binder resin contained in the green sheet 6 is, for example, 60 ℃, the heating temperature of the heat source 8a is, for example, 40 ℃. The reason why the heating temperature of the heat source 8a is lower than the glass transition temperature of the binder resin contained in the green sheet 6 is to suppress softening of the green sheet laminate 9 (during or after production).
In the lamination area a3, near infrared rays are irradiated by the near infrared ray heater 10 at least to the portion of the green sheet 6 wound around the pressure bonding roller 7, which portion is to reach the processing point P, and to the portion of the uppermost green sheet 6 laminated on the green sheet laminated body 9 in the middle of production, which portion is to reach the processing point P. The reason for irradiating the near infrared ray is to increase the temperature of the above-mentioned portion of the green sheet 6, and to favorably perform the heat pressure bonding of the green sheet 6 newly stacked and the green sheet 6 stacked on the uppermost layer of the green sheet stacked body 9 in the middle of production.
The reason why near infrared rays are used for heating the green sheet 6 is that the binder resin contained in the green sheet 6 generally has an absorption wavelength range at the wavelength, and the green sheet 6 can be efficiently heated. The near infrared rays irradiated by the near infrared heater 10 are preferably 0.8 μm to 2 μm. This is because the green sheet 6 can be heated more efficiently in this case.
The temperature of the green sheet 6 to be newly laminated and the green sheet 6 laminated on the uppermost layer of the green sheet laminated body 9 in the middle of production is preferably higher than the glass transition temperature of the binder resin contained in the green sheet 6. The reason for this is that the heat crimping can be performed well in this case. Further, since the newly stacked green sheets 6 are heated by the heat source 7b of the pressure bonding roller 7 and the green sheet 6 stacked on the uppermost layer of the green sheet stacked body 9 in the middle of production is heated by the heat source 8a of the stacking table 8, the above-described green sheets 6 can be heated to a high temperature in a short time by irradiation of near infrared rays by the near infrared ray heater 10.
Next, as shown in fig. 5B and 6B, the pressure roller 7 is rotated and the lamination stage 8 is moved in the same direction as the rotation direction (right side of fig. 5B and 6B) in synchronization therewith. At this time, the vent holes 7a are sequentially switched from the suction state to the exhaust state (or the state of being opened to the atmosphere) when passing through the lowermost portion (machining point P) of the pressure bonding roller 7. As a result, the green sheets 6 wound around the pressure bonding rolls 7 are stacked and heat pressure bonded to the uppermost layer of the green sheet stacked body 9 in the middle of production on the stacking base 8.
Next, as shown in fig. 5 (C) and 6 (C), the green sheet 6 is completely heat-pressure bonded to the green sheet laminated body 9 to complete lamination of the green sheet 6.
The lamination of the green sheets 6 and the heat pressure bonding are repeated a predetermined number of times to complete the green sheet laminated body 9.
Next, the green sheet laminate 9 is divided into a plurality of individual green sheet laminates as necessary.
Next, the green sheet laminate 9 or the green sheet laminates divided into individual pieces are fired in a predetermined curve to produce a ceramic laminate (not shown). At this time, the conductive paste provided between the layers is also fired to form internal electrodes between the layers of the ceramic laminate.
Finally, the external electrodes are formed on the outer surface of the ceramic laminate to complete the electronic component (multilayer ceramic capacitor) of the present embodiment.
In the method of manufacturing an electronic component according to the present embodiment, the green sheet laminate 9 formed in the middle of the production on the lamination stage 8 is not heated by the heat source 8a to a temperature higher than the glass transition temperature of the binder resin contained in the green sheets 6, and therefore the shape of the green sheet laminate 9 is less likely to be deformed in the step of producing the green sheet laminate 9 by laminating the green sheets 6.
In the method of manufacturing an electronic component according to the present embodiment, in the lamination area a3, near infrared rays are irradiated by the near infrared ray heater 10 at least to the portion of the green sheet 6 wound around the pressure bonding roller 7 and the portion of the green sheet 6 laminated on the uppermost layer of the green sheet laminate 9 in the middle of the manufacturing process, which portion is to reach the processing point P, to thereby make the temperature of the green sheet 6 high, so that the green sheet 6 joined by the pressure bonding roller 7 and the green sheet 6 laminated on the uppermost layer of the green sheet laminate 9 in the middle of the manufacturing process can be favorably heat-pressure bonded. As described above, the green sheets 6 newly stacked and the green sheet 6 stacked on the uppermost layer of the green sheet stacked body 9 during the production are preferably irradiated with near infrared rays to have a temperature higher than the glass transition temperature of the binder resin contained in the green sheets 6.
[ reference example ]
Fig. 10 shows a reference example for reference to the method for manufacturing an electronic component according to the present invention.
The reference example does not use the pressure roller 7 used in embodiment 1, but instead uses the suction head 57 having a flat plate-like lower surface and the vent holes 57a formed in the lower surface, as in the method for manufacturing an electronic component disclosed in patent document 1 (see fig. 9). The web 6 is sucked through the vent holes 57a to convey the web 6. Further, the green sheet 6 is heat-pressure bonded to the uppermost layer of the green sheet stacked body 9 formed on the stacking table 8 using the stacking table 8 and the suction head 57.
In the reference example, a near-infrared heater 60 is provided at the tip of the adsorption head 57, and the green sheet 6 stacked on the uppermost layer of the green sheet stacked body 9 formed on the stacking table 8 is heated by near-infrared rays irradiated from the near-infrared heater 60 while the green sheet 6 is being conveyed.
The uppermost green sheet 6 stacked on the green sheet stacked body 9 can be heated by the method of the reference example. However, in the method of the reference example, when the green sheets 6 are heat-pressure bonded to the uppermost layer of the green sheet stacked body 9 formed on the stacking table 8 using the stacking table 8 and the suction head 57, the green sheets 6 stacked on the uppermost layer of the green sheet stacked body 9 have local temperature unevenness. That is, the temperature of the left portion in fig. 10 of the uppermost layered green sheet 6 to which near infrared rays are irradiated first is lower than the temperature of the right portion in fig. 10 of the uppermost layered green sheet 6 to which near infrared rays are irradiated last.
In the method of the reference example, when the green sheets 6 are heat-pressure bonded to the uppermost layer of the green sheet stacked body 9 formed on the stacking base 8, the green sheets 6 stacked on the uppermost layer of the green sheet stacked body 9 may be locally uneven in temperature, and thus there is a possibility that the green sheet stacked body 9 having uniform bonding strength as a whole cannot be manufactured.
[ 2 nd embodiment ]
In embodiment 2, a part of the steps of the method for manufacturing an electronic component according to embodiment 1 described above is modified. Specifically, in embodiment 1, near-infrared rays are continuously irradiated by the near-infrared heater 10. In embodiment 2, this structure is modified, and irradiation of near infrared rays by the near infrared ray heater 10 is intermittently performed in synchronization with the step of laminating the green sheets 6 to produce the green sheet laminated body 9. In embodiment 2, the electronic component manufacturing apparatus 1000 is also used as in embodiment 1. However, the electronic component manufacturing apparatus 1000 used in embodiment 2 is provided with a function of intermittently controlling irradiation of near infrared rays by the near infrared ray heater 10.
Fig. 7 shows a near-infrared ray irradiation curve by the near-infrared ray heater 10 according to embodiment 2. Fig. 7 is shown in 3 stages, i.e., an upper stage, a middle stage, and a lower stage. The upper section represents an energization curve of energizing the near infrared heater 10 with voltage. The middle section represents the output curve of the near infrared ray heater 10 by illuminance. The lower stage represents a thermocompression bonding curve by the speed of the lamination stage 8 (the speed at which the lamination stage 8 moves from left to right in fig. 1, 5, and 6 to perform thermocompression bonding).
Fig. 7 shows a case where the near infrared heater 10 is energized 3 times, the near infrared heater 10 is irradiated with the near infrared rays 3 times, the laminating table 8 is moved 3 times from left to right, and 3 green sheets 6 are laminated and heat-pressure bonded.
As can be seen from fig. 7, when the near infrared heater 10 starts to be energized, the output (illuminance) of the near infrared heater 10 starts to increase. When the energization of the near infrared heater 10 is completed, the output of the near infrared heater 10 reaches a peak at this time, and thereafter the output of the near infrared heater 10 starts to decrease. The laminating table 8 moves while the output of the near infrared heater 10 is maintained at a constant level or more (when the illuminance is higher than the illuminance indicated by the broken line in the middle stage), and laminates the green sheets 6 and thermally pressure-bonds them.
In embodiment 2, since the irradiation with near infrared rays by the near infrared ray heater 10 is performed intermittently, it is possible to suppress the green sheet laminate 9 (during or after the production) formed on the lamination stage 8 from exceeding the allowable range and becoming a high temperature (a temperature equal to or higher than the glass transition temperature of the binder resin contained in the green sheet 6) due to the irradiation with near infrared rays by the near infrared ray heater 10.
[ embodiment 3 ]
Fig. 8 shows a step of laminating green sheets 6 and heating and pressure-bonding the same to produce a green sheet laminate 9, which is performed in the method for manufacturing an electronic component according to embodiment 3. As shown in fig. 8, in the method of manufacturing an electronic component according to embodiment 3, a2 nd near-infrared heater 20 is provided, and after the green sheet 6 is heat-pressure bonded to the uppermost layer of the green sheet stacked body 9 during the production, near-infrared rays are irradiated from the 2 nd near-infrared heater 20, and the green sheet 6 which is newly heat-pressure bonded is further heated.
In the method of manufacturing an electronic component according to embodiment 3, the temperature of the green sheet 6 in the uppermost layer in the heat and pressure bonding state is further increased by irradiation of the near infrared rays from the 2 nd near infrared ray heater 20, and therefore the bonding strength between the green sheet laminated body 9 in the middle of the manufacturing process and the green sheet 6 in the uppermost layer in the heat and pressure bonding state is further improved. Therefore, the green sheet laminate 9 having higher interlayer bonding strength can be produced by the method for producing an electronic component according to embodiment 3.
The above describes the method for manufacturing the electronic component according to embodiments 1 to 3. However, the present invention is not limited to the above-described embodiments, and various modifications can be made in accordance with the gist of the present invention.
For example, in the above-described embodiment, the laminated ceramic capacitor was manufactured as the electronic component, but the electronic component to be manufactured is not limited to the laminated ceramic capacitor, and may be another type of electronic component.
In the above embodiment, the pressure roller 7 serves as both the peeling roller and the transport roller, but the two may be independent. For example, the blank sheet 6 peeled off from the carrier film 3 by the peeling roller may be transferred from the peeling roller to the pressure roller 7, or the blank sheet 6 may be transferred from the peeling roller to the transport roller and further transferred from the transport roller to the pressure roller 7.
In the above embodiment, the pressure roller 7 is a suction roller provided with the air vent holes 7a, but the pressure roller 7 may be a roller without air vent holes.
In the above embodiment, the pressure contact roller 7 is moved from the winding area a2 to the laminating area A3, but instead of this configuration, the laminating base 8 may be moved to the winding area a 2. That is, the winding region a2 and the lamination region A3 may be provided at the same position.
The method of manufacturing an electronic component according to an embodiment of the present invention is described in the section "means for solving the problem".
In the method for manufacturing an electronic component, the wavelength of the near infrared ray to be irradiated is preferably 0.8 μm or more and 2 μm or less. In this case, the green sheet can be heated more efficiently.
Further, it is preferable that the irradiation with the near infrared ray is intermittent. In this case, it is possible to prevent the green sheet stacked body formed on the stacking base from being heated to a high temperature beyond the allowable range by irradiation of the near infrared rays with the near infrared ray heater.
In addition, it is also preferable that the temperature of the portion of the green sheet wound around the pressure bonding roller and the portion of the green sheet laminated on the uppermost layer of the green sheet laminated body, which is to reach the processing point and is irradiated with the near infrared ray, is higher than the glass transition temperature of the binder resin contained in the green sheet. In this case, the green sheet can be more favorably heat-pressure bonded.
Further, it is also preferable that at least one of the pressure bonding roller and the lamination stage is heated at a temperature lower than the glass transition temperature of the binder resin contained in the green sheet. In this case, since the temperature of the green sheet is increased in advance, the green sheet can be made high in a short time by irradiation with near infrared rays by the near infrared ray heater.
The electronic component manufacturing apparatus according to an embodiment of the present invention is described in the section "means for solving the problem".
In the electronic component manufacturing apparatus, it is also preferable that the wavelength of the near infrared rays to be irradiated is 0.8 μm or more and 2 μm or less. In this case, the green sheet can be heated more efficiently.
Further, it is also preferable that the irradiation with the near infrared ray is intermittent. In this case, it is possible to prevent the green sheet stacked body formed on the stacking base from being heated to a high temperature beyond the allowable range by irradiation of the near infrared rays with the near infrared ray heater.
Claims (3)
1. An electronic component manufacturing apparatus, comprising:
a pressure bonding roller capable of rotating; and
a laminating table that reciprocates in a horizontal direction in synchronization with rotation of the pressure bonding roller,
the electronic component manufacturing apparatus peels the green sheet from the carrier film and winds the green sheet around the pressure bonding roller,
transferring the green sheet from the pressure bonding roll to the stacking base at a processing point, and heating and pressure bonding the green sheet to produce a green sheet stacked body in which a plurality of the green sheets are stacked on the stacking base,
heating at least one of the pressure bonding roller and the lamination stage.
2. The electronic component manufacturing apparatus according to claim 1,
the pressure bonding roller is provided with a vent hole,
the vent hole is switched from an air-open state or an air-exhaust state to a suction state when passing through the lowermost portion of the pressure bonding roller, and sucks the blank sheet, and the blank sheet is completely peeled off from the carrier film with the rotation of the pressure bonding roller, and the blank sheet is wound around the outer peripheral surface of the pressure bonding roller, and the lamination stage is moved to below the pressure bonding roller around which the blank sheet is wound, and the heating and pressing bonding are performed on the lamination stage.
3. The electronic part manufacturing apparatus according to claim 1 or 2,
the heating temperature is lower than the glass transition temperature of the binder resin contained in the green sheet.
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| JP2019123949A JP7176487B2 (en) | 2019-07-02 | 2019-07-02 | Electronic component manufacturing method and electronic component manufacturing apparatus |
| JP2019-123949 | 2019-07-02 | ||
| CN202010630462.7A CN112259376A (en) | 2019-07-02 | 2020-06-30 | Method for manufacturing electronic component and apparatus for manufacturing electronic component |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03297117A (en) * | 1990-04-16 | 1991-12-27 | Murata Mfg Co Ltd | Method and apparatus for lamination of ceramic green sheets |
| JP2000246718A (en) * | 1999-03-02 | 2000-09-12 | Murata Mfg Co Ltd | Method for laminating ceramic green sheet and laminating device |
| CN102148082A (en) * | 2010-11-26 | 2011-08-10 | 深圳顺络电子股份有限公司 | Manufacturing methods and equipment of laminated type ceramic electronic element and cover plate layer |
| CN104025224A (en) * | 2011-12-27 | 2014-09-03 | 株式会社村田制作所 | Electricity storage device and method for manufacturing same |
| CN109536083A (en) * | 2017-09-19 | 2019-03-29 | 藤森工业株式会社 | The manufacturing method of formed body |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09129483A (en) * | 1995-10-27 | 1997-05-16 | Murata Mfg Co Ltd | Method and device for manufacture of laminated ceramic electronic part |
| JP4492138B2 (en) * | 2004-01-30 | 2010-06-30 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component |
| CN101228600A (en) * | 2005-05-26 | 2008-07-23 | Tdk株式会社 | Method for manufacturing electronic component provided with internal electrode |
| JP5574119B2 (en) | 2010-05-13 | 2014-08-20 | 株式会社村田製作所 | Multilayer electronic component manufacturing apparatus and multilayer electronic component manufacturing method |
| CN102315021B (en) * | 2010-05-13 | 2013-03-13 | 株式会社村田制作所 | Laminated type electronic component manufacturing device and laminated type electronic component manufacturing method |
| CN102315020B (en) * | 2010-05-13 | 2013-04-24 | 株式会社村田制作所 | Laminated type electronic component manufacturing device and laminated type electronic component manufacturing method |
| CN102315023B (en) * | 2010-05-13 | 2013-03-27 | 株式会社村田制作所 | Apparatus and method for manufacturing laminated electronic component |
| CN104907113B (en) * | 2015-06-10 | 2017-02-22 | 复旦大学 | Method for preparing polymer microfluidic chip by assisting hot pressing via far infrared rays |
-
2019
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-
2020
- 2020-06-30 CN CN202010630462.7A patent/CN112259376A/en active Pending
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03297117A (en) * | 1990-04-16 | 1991-12-27 | Murata Mfg Co Ltd | Method and apparatus for lamination of ceramic green sheets |
| JP2000246718A (en) * | 1999-03-02 | 2000-09-12 | Murata Mfg Co Ltd | Method for laminating ceramic green sheet and laminating device |
| CN102148082A (en) * | 2010-11-26 | 2011-08-10 | 深圳顺络电子股份有限公司 | Manufacturing methods and equipment of laminated type ceramic electronic element and cover plate layer |
| CN104025224A (en) * | 2011-12-27 | 2014-09-03 | 株式会社村田制作所 | Electricity storage device and method for manufacturing same |
| CN109536083A (en) * | 2017-09-19 | 2019-03-29 | 藤森工业株式会社 | The manufacturing method of formed body |
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| JP7176487B2 (en) | 2022-11-22 |
| JP2021009960A (en) | 2021-01-28 |
| CN112259376A (en) | 2021-01-22 |
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