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CN115000138A - Display module, preparation method thereof and electronic equipment - Google Patents

Display module, preparation method thereof and electronic equipment Download PDF

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Publication number
CN115000138A
CN115000138A CN202210589337.5A CN202210589337A CN115000138A CN 115000138 A CN115000138 A CN 115000138A CN 202210589337 A CN202210589337 A CN 202210589337A CN 115000138 A CN115000138 A CN 115000138A
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China
Prior art keywords
layer
display module
touch
light
touch sensing
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CN202210589337.5A
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Chinese (zh)
Inventor
杨钱龙
唐向洁
骆江垒
朱馨
王莹
韩强
刘洋
文嘉伦
徐茂林
王云琴
陈福
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BOE Technology Group Co Ltd
Chongqing BOE Display Technology Co Ltd
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BOE Technology Group Co Ltd
Chongqing BOE Display Technology Co Ltd
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Priority to CN202210589337.5A priority Critical patent/CN115000138A/en
Publication of CN115000138A publication Critical patent/CN115000138A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40OLEDs integrated with touch screens
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present disclosure provides a display module, a manufacturing method thereof and an electronic device, wherein the display module comprises: a substrate including a plurality of pixel regions and a wiring region; a thin film transistor layer; the OLED layer comprises light emitting units which correspond to the pixel regions one by one; the touch control induction layer comprises a signal transmission line, a first insulating layer and a touch control signal line; the signal transmission line at least comprises a first graph routing line, and the first graph routing line is communicated with the cathodes of all the light-emitting units. According to the display module, the touch sensing layer is sunk and adjusted by adjusting the film layer structure of the display module, and the first graphic wiring formed by the transmission signal line is used as the signal input wiring of the cathode of the light-emitting unit, so that the overall thickness of the display module is reduced, and the cost is saved; and the working procedure of the touch sensing layer is improved before the luminescent material is manufactured, so that the performance of the touch sensing layer film is improved, and the quality of the display module is improved.

Description

一种显示模组及其制备方法、电子设备A display module and preparation method thereof, and electronic equipment

技术领域technical field

本公开涉及显示技术领域,特别涉及一种显示模组及其制备方法、电子设备。The present disclosure relates to the field of display technology, and in particular, to a display module, a preparation method thereof, and an electronic device.

背景技术Background technique

随着有机发光二极管(OLED,Organic Light-Emitting Diode)面板的技术逐渐成熟,不同OLED显示产品在设计和显示效果上的差异正在大幅度缩小,进而对产品成本的控制以及产品性能提出了更高的要求。As the technology of organic light-emitting diode (OLED, Organic Light-Emitting Diode) panels gradually matures, the differences in design and display effects of different OLED display products are being greatly reduced, which in turn puts forward higher requirements for product cost control and product performance. requirements.

发明内容SUMMARY OF THE INVENTION

本公开实施例的目的在于提供一种显示模组及其制备方法、电子设备,用以解决现有技术中对产品成本的控制以及产品性能提出了更高要求的问题。The purpose of the embodiments of the present disclosure is to provide a display module, a preparation method thereof, and an electronic device, so as to solve the problems in the prior art that higher requirements are placed on product cost control and product performance.

本公开的实施例采用如下技术方案:一种显示模组,包括:基板,所述基板包括多个阵列排布的像素区域以及用以划分所述像素区域的布线区域;设置在所述基板一侧表面的薄膜晶体管层;设置在所述薄膜晶体管层远离所述基板一侧的OLED层,所述OLED层中包括与所述像素区域一一对应的发光单元;设置在所述OLED层远离所述薄膜晶体管层一侧的触控感应层,所述触控感应层在第一方向上的正投影被所述布线区域在所述第一方向上的正投影完全覆盖,所述第一方向为垂直与所述基板表面的方向;其中,所述触控感应层至少包括依次设置在所述OLED层上的信号传输线、第一绝缘层以及触控信号线;所述信号传输线至少包括第一图形走线,所述第一图形走线与所有所述发光单元的阴极连通。The embodiments of the present disclosure adopt the following technical solutions: a display module includes: a substrate, the substrate includes a plurality of pixel regions arranged in an array and a wiring region for dividing the pixel regions; a thin film transistor layer on the side surface; an OLED layer disposed on the side of the thin film transistor layer away from the substrate, and the OLED layer includes light-emitting units corresponding to the pixel regions one-to-one; disposed on the OLED layer away from all The touch sensing layer on one side of the thin film transistor layer, the orthographic projection of the touch sensing layer in the first direction is completely covered by the orthographic projection of the wiring area in the first direction, and the first direction is The direction perpendicular to the surface of the substrate; wherein, the touch sensing layer at least includes a signal transmission line, a first insulating layer and a touch signal line sequentially arranged on the OLED layer; the signal transmission line at least includes a first pattern A wiring, the first pattern wiring is communicated with the cathodes of all the light-emitting units.

在一些实施例中,所述触控信号线包括多个按阵列排布的触控电极区域,每个所述触控电极区域内包括一个或多个相邻的所述像素区域。In some embodiments, the touch signal line includes a plurality of touch electrode regions arranged in an array, and each of the touch electrode regions includes one or more adjacent pixel regions.

在一些实施例中,所述信号传输线还包括第二图形走线,所述第二图形走线与所述第一图形走线之间不具有重合走线,并且所述第二图形走线与任意一个所述发光单元的阴极均不连通;所述第一绝缘层与所述第二图形走线对应的区域内开设有桥接孔,位于同一列中两个相邻的所述触控电极区域之间的所述触控信号线基于所述桥接孔与所述第二图形走线连接,以实现相邻的所述触控电极区域之间的信号传输。In some embodiments, the signal transmission line further includes a second pattern line, the second pattern line and the first pattern line do not have overlapping lines, and the second pattern line and the first pattern line do not have overlapping lines. The cathodes of any one of the light-emitting units are not connected; a bridge hole is opened in the area corresponding to the first insulating layer and the second pattern wiring, which are located in two adjacent touch electrode areas in the same column The touch signal lines therebetween are connected to the second pattern wirings based on the bridge holes, so as to realize signal transmission between the adjacent touch electrode regions.

在一些实施例中,所述触控感应层还包括第二绝缘层,所述第二绝缘层设置在所述触控信号线远离所述第一绝缘层一侧。In some embodiments, the touch sensing layer further includes a second insulating layer, and the second insulating layer is disposed on a side of the touch signal line away from the first insulating layer.

在一些实施例中,在所述第二绝缘层远离所述触控信号线的一侧表面的预设位置设置支撑结构,相邻的所述预设位置之间的距离大于或等于预设距离。In some embodiments, a support structure is provided at a predetermined position on a surface of the second insulating layer away from the touch signal line, and the distance between the adjacent predetermined positions is greater than or equal to a predetermined distance .

在一些实施例中,还包括:设置在所述触控感应层远离所述OLED层一侧的平坦层和封装保护层。In some embodiments, the method further includes: a flat layer and an encapsulation protection layer disposed on a side of the touch sensing layer away from the OLED layer.

本公开实施例还提供了一种显示模组的制备方法,用于制备如上述的显示模组,所述制备方法基于如下步骤实现:在基板表面制备薄膜晶体管层,其中,所述基板包括多个阵列排布的像素区域以及用以划分所述像素区域的布线区域;在所述薄膜晶体管层远离所述基板一侧制备OLED层中各个发光单元的阳极层、像素定义层以及阻隔层,所述发光单元与所述像素区域一一对应,所述像素定义层对应所述像素区域的位置具有开口;在所述阻隔层远离所述薄膜晶体管层的一侧制备触控感应层,所述触控感应层在第一方向上的正投影被所述布线区域在所述第一方向上的正投影完全覆盖,所述第一方向为垂直与所述基板表面的方向,其中,所述触控感应层至少包括依次设置在所述OLED层上的信号传输线、第一绝缘层以及触控信号线,所述信号传输线至少包括第一图形走线;刻蚀掉所有所述像素区域对应的阻隔层,并在所有所述像素区域内的所述阳极层远离所述薄膜晶体管层的一侧依次制备发光层和阴极层,使所有所述阴极层与所述第一图形走线连通。Embodiments of the present disclosure also provide a method for preparing a display module, which is used to prepare the above-mentioned display module. The preparation method is implemented based on the following steps: preparing a thin film transistor layer on a surface of a substrate, wherein the substrate includes multiple A pixel area arranged in an array and a wiring area for dividing the pixel area; the anode layer, pixel definition layer and barrier layer of each light-emitting unit in the OLED layer are prepared on the side of the thin film transistor layer away from the substrate. The light-emitting units are in one-to-one correspondence with the pixel regions, and the pixel definition layer has an opening at a position corresponding to the pixel region; a touch sensing layer is prepared on the side of the barrier layer away from the thin film transistor layer, and the touch sensing layer is formed. The orthographic projection of the control sensing layer in the first direction is completely covered by the orthographic projection of the wiring area in the first direction, and the first direction is a direction perpendicular to the surface of the substrate, wherein the touch control The sensing layer at least includes a signal transmission line, a first insulating layer and a touch signal line that are sequentially arranged on the OLED layer, and the signal transmission line at least includes a first pattern wiring; all the barrier layers corresponding to the pixel regions are etched away , and prepare a light-emitting layer and a cathode layer in sequence on the side of the anode layer far from the thin film transistor layer in all the pixel regions, so that all the cathode layers are connected to the first pattern wiring.

在一些实施例中,所述触控信号线包括多个按阵列排布的触控电极区域,每个所述触控电极区域内包括一个或多个相邻的所述像素区域;所述在所述像素定义层远离所述薄膜晶体管层的一侧制备触控感应层,包括:制备具有第二图形走线的所述信号传输线,所述第二图形走线与所述第一图形走线之间不具有重合走线,并且所述第二图形走线与任意一个所述发光单元的阴极均不连通;在所述第一绝缘层与所述第二图形走线对应的区域内开设桥接孔,使位于同一列中两个相邻的所述触控电极区域之间的所述触控信号线基于所述桥接孔与所述第二图形走线连接。In some embodiments, the touch signal line includes a plurality of touch electrode regions arranged in an array, and each of the touch electrode regions includes one or more adjacent pixel regions; the Forming the touch sensing layer on the side of the pixel definition layer away from the thin film transistor layer includes: preparing the signal transmission line with a second pattern wiring, the second pattern wiring and the first pattern wiring There is no overlapping wiring between, and the second pattern wiring is not connected to the cathode of any one of the light-emitting units; a bridge is provided in the area corresponding to the first insulating layer and the second pattern wiring holes, so that the touch signal lines located between two adjacent touch electrode regions in the same column are connected to the second pattern lines based on the bridge holes.

在一些实施例中,所述在所述像素定义层远离所述薄膜晶体管层的一侧制备触控感应层,包括:在所述触控信号线远离所述第一绝缘层一侧制备第二绝缘层,并且在所述第二绝缘层远离所述触控信号线的一侧表面的预设位置设置支撑结构,相邻的所述预设位置之间的距离大于或等于预设距离。In some embodiments, the forming the touch sensing layer on the side of the pixel definition layer away from the thin film transistor layer includes: forming a second touch signal line on the side of the touch signal line away from the first insulating layer An insulating layer is provided, and a support structure is provided at a preset position of a surface of the second insulating layer away from the touch signal line, and the distance between the adjacent preset positions is greater than or equal to a preset distance.

在一些实施例中,还包括:在所述触控感应层远离所述OLED层的一侧制备平坦层和封装保护层。In some embodiments, the method further includes: preparing a flat layer and an encapsulation protection layer on a side of the touch sensing layer away from the OLED layer.

本公开实施例还提供了一种电子设备,至少包括如上述的显示模组。An embodiment of the present disclosure also provides an electronic device, which at least includes the above-mentioned display module.

本公开实施例的有益效果在于:通过调整显示模组的膜层结构,将触控感应层的位置向基板一侧下沉调整,并利用触控感应层中的传输信号线所形成的第一图形走线作为OLED发光单元阴极的信号输入走线,使显示模组的整体厚度降低,实现产品成本的节约;并且在制备过程中将触控感应层的制备工序提至发光单元的发光材料制作之前,进而在制备过程中提升触控感应层的膜层性能,使显示模组在制备材料和工艺不变的情况下实现质量的提升。The beneficial effects of the embodiments of the present disclosure are: by adjusting the film layer structure of the display module, the position of the touch sensing layer is adjusted to sink toward the substrate side, and the first touch sensing layer formed by the transmission signal lines is used. The graphic trace is used as the signal input trace of the cathode of the OLED light-emitting unit, which reduces the overall thickness of the display module and saves the cost of the product; and in the preparation process, the preparation process of the touch sensing layer is transferred to the production of the light-emitting material of the light-emitting unit. Previously, the film performance of the touch sensing layer was improved during the preparation process, so that the quality of the display module could be improved while the preparation materials and processes were unchanged.

附图说明Description of drawings

为了更清楚地说明本公开实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本公开中记载的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments described in the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

图1为现有技术中显示模组的层级截面示意图;1 is a schematic cross-sectional view of a display module in the prior art;

图2为本公开第一实施例中显示模组的层级截面示意图;2 is a schematic cross-sectional view of a level of a display module in the first embodiment of the disclosure;

图3为本公开第一实施例中信号传输线的设置示意图;3 is a schematic diagram of the arrangement of the signal transmission line in the first embodiment of the present disclosure;

图4为本公开第一实施例中触控电极区域的设置示意图;FIG. 4 is a schematic diagram of the arrangement of the touch electrode area in the first embodiment of the disclosure;

图5为本公开第一实施例中桥接区域的层级截面示意图;5 is a schematic cross-sectional view of a level of a bridge region in the first embodiment of the disclosure;

图6为本公开第一实施例中支撑结构的层级截面示意图;6 is a schematic cross-sectional view of the support structure in the first embodiment of the disclosure;

图7为本公开第二实施例中显示模组的制备方法流程图。FIG. 7 is a flowchart of a method for manufacturing a display module according to a second embodiment of the present disclosure.

具体实施方式Detailed ways

此处参考附图描述本公开的各种方案以及特征。Various aspects and features of the present disclosure are described herein with reference to the accompanying drawings.

应理解的是,可以对此处申请的实施例做出各种修改。因此,上述说明书不应该视为限制,而仅是作为实施例的范例。本领域的技术人员将想到在本公开的范围和精神内的其他修改。It should be understood that various modifications may be made to the embodiments claimed herein. Therefore, the above description should not be regarded as limiting, but merely as exemplifications of embodiments. Those skilled in the art will envision other modifications within the scope and spirit of this disclosure.

包含在说明书中并构成说明书的一部分的附图示出了本公开的实施例,并且与上面给出的对本公开的大致描述以及下面给出的对实施例的详细描述一起用于解释本公开的原理。The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the general description of the disclosure given above and the detailed description of the embodiments given below, serve to explain the principles of the disclosure. principle.

通过下面参照附图对给定为非限制性实例的实施例的优选形式的描述,本公开的这些和其它特性将会变得显而易见。These and other features of the present disclosure will become apparent from the following description of preferred forms of embodiment, given as non-limiting examples, with reference to the accompanying drawings.

还应当理解,尽管已经参照一些具体实例对本公开进行了描述,但本领域技术人员能够确定地实现本公开的很多其它等效形式,它们具有如权利要求的特征并因此都位于借此所限定的保护范围内。It should also be understood that although the present disclosure has been described with reference to some specific examples, those skilled in the art will be able to realize many other equivalents of the present disclosure with certainty, which have the characteristics of the claims and are therefore located within the limits defined herein. within the scope of protection.

当结合附图时,鉴于以下详细说明,本公开的上述和其他方面、特征和优势将变得更为显而易见。The above and other aspects, features and advantages of the present disclosure will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.

此后参照附图描述本公开的具体实施例;然而,应当理解,所申请的实施例仅仅是本公开的实例,其可采用多种方式实施。熟知和/或重复的功能和结构并未详细描述以避免不必要或多余的细节使得本公开模糊不清。因此,本文所申请的具体的结构性和功能性细节并非意在限定,而是仅仅作为权利要求的基础和代表性基础用于教导本领域技术人员以实质上任意合适的详细结构多样地使用本公开。Specific embodiments of the present disclosure are hereinafter described with reference to the accompanying drawings; however, it is to be understood that the claimed embodiments are merely examples of the present disclosure, which may be embodied in various ways. Well-known and/or repeated functions and constructions have not been described in detail to avoid obscuring the present disclosure with unnecessary or redundant detail. Therefore, specific structural and functional details claimed herein are not intended to be limiting, but merely serve as a basis for the claims and a representative basis for teaching one skilled in the art to variously employ the present invention in substantially any suitable detailed structure. public.

本说明书可使用词组“在一种实施例中”、“在另一个实施例中”、“在又一实施例中”或“在其他实施例中”,其均可指代根据本公开的相同或不同实施例中的一个或多个。This specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may all refer to the same in accordance with the present disclosure or one or more of different embodiments.

随着OLED面板的技术逐渐成熟,不同OLED显示产品在设计和显示效果上的差异正在大幅度缩小,进而对产品成本的控制以及产品性能提出了更高的要求。图1示出了现有技术中OLED显示产品的显示模组的层级截面示意图,其从下至上依次为基板、用于实现发光控制的薄膜晶体管(TFT)层,包括但不限于图中所示的源漏极(SD2)、绝缘层(PLN2)等;SD2与发光单元的阳极(anode)连接,通过TFT实现对阳极的控制,阳极上设置有发光(EL)材料和阴极层,在TFT的控制下实现发光,HPDL层为像素定义层,利用HPDL层上开口的设置体现出像素区域,未开口的位置则可进行其他走线的布置,CVD1、IJP以及CVD2层等作为封装、平坦、绝缘等功能性层级依次设置在发光单元的阴极层表面,在特定位置的HPDL层表面还设置有PS层,主要用作发光层和阴极层制作时掩膜板(mask)的支撑结构;发光功能层上表面形成平面后在阻隔层Barrier表面制作触控感应(Touch Sensor Panel,TSP)相关的功能层级,包括但不限于用于实现触控信号传输的TMB走线,桥接区域内用于进行TMB走线跳线设置的TMA走线,以及层间绝缘和保护作用的TLD层、TOC层等,上方还可以设置其他封装保护层,如玻璃盖板等,图1中未进行示出。现有技术中显示模组在进行制作时优先进行了发光单元相关层级的制作,进而导致在后续进行TSP层级制作时只能采用低温工艺进行,导致显示模组制作成本上升并且TSP膜层性能无法充分发挥出来,使制作成本增加,产品性能较差。As the technology of OLED panels gradually matures, the differences in design and display effects of different OLED display products are greatly reduced, which in turn puts forward higher requirements for product cost control and product performance. FIG. 1 shows a schematic cross-sectional view of a level of a display module of an OLED display product in the prior art. From bottom to top, it is a substrate and a thin film transistor (TFT) layer for light emission control, including but not limited to those shown in the figure. The source and drain (SD2), insulating layer (PLN2), etc.; SD2 is connected to the anode (anode) of the light-emitting unit, and the anode is controlled by TFT. The anode is provided with a light-emitting (EL) material and a cathode layer. Light emission is realized under control. The HPDL layer is the pixel definition layer. The pixel area is reflected by the openings on the HPDL layer, and other traces can be arranged in the unopened positions. The CVD1, IJP and CVD2 layers are used as packaging, flat and insulating layers. and other functional layers are arranged on the surface of the cathode layer of the light-emitting unit in turn, and a PS layer is also arranged on the surface of the HPDL layer at a specific position, which is mainly used as a support structure for the mask when the light-emitting layer and the cathode layer are fabricated; the light-emitting functional layer After a plane is formed on the upper surface, the functional layers related to Touch Sensor Panel (TSP) are fabricated on the surface of the barrier layer, including but not limited to TMB traces for touch signal transmission, and TMB traces in the bridge area. The TMA traces set by the wire jumpers, as well as the TLD layer and TOC layer for interlayer insulation and protection, can also be provided with other encapsulation protection layers, such as glass cover plates, which are not shown in FIG. 1 . In the prior art, the display module is preferentially fabricated at the relevant level of the light-emitting unit during fabrication, which leads to the subsequent fabrication of the TSP layer only by using a low-temperature process, resulting in an increase in the fabrication cost of the display module and the inability of the TSP film layer to perform. Give full play to it, so that the production cost increases and the product performance is poor.

为了解决上述问题,本实施例提供了一种显示模组,其层级截面示意图如图2所示,主要包括如下层级结构:In order to solve the above problems, the present embodiment provides a display module, the schematic diagram of its hierarchical cross-section is shown in FIG. 2 , and mainly includes the following hierarchical structure:

基板10,即用于承载显示模组各个层级的基板,其可以是玻璃基板或PI衬底,其表面可以划分为多个按照阵列排布的像素区域以及用于划分各个像素区域的布线区域,像素区域所对应的位置主要用于制作OLED发光单元,布线区域所对应的位置则主要用于进行触控相关走线的布置。The substrate 10, that is, a substrate for carrying various levels of the display module, can be a glass substrate or a PI substrate, and its surface can be divided into a plurality of pixel areas arranged in an array and a wiring area for dividing each pixel area, The position corresponding to the pixel area is mainly used for fabricating the OLED light-emitting unit, and the position corresponding to the wiring area is mainly used for the layout of touch-related wirings.

在基板10的表面(即图2中基板10的上侧)设置有薄膜晶体管层20,薄膜晶体管层20中对应设置有多个薄膜晶体管TFT,TFT与像素区域一一对应,并通过TFT与发光单元的阳极连接,实现通过TFT的源极或漏极向阳极施加电压使发光单元发光。需要注意的是,图2中并未完全示出TFT的层级结构,仅体现了TFT的SD2(即源极或漏极)以及TFT内的绝缘层PLN1和PLN2,由于其制备方式和结构设计均与现有技术相同,本实施例在此不进行详细赘述。A thin film transistor layer 20 is disposed on the surface of the substrate 10 (ie, the upper side of the substrate 10 in FIG. 2 ), and a plurality of thin film transistors TFT are correspondingly disposed in the thin film transistor layer 20 . The anode of the unit is connected, so that the light-emitting unit emits light by applying a voltage to the anode through the source or drain of the TFT. It should be noted that the hierarchical structure of the TFT is not fully shown in FIG. 2, but only the SD2 (ie source or drain) of the TFT and the insulating layers PLN1 and PLN2 in the TFT are shown. Similar to the prior art, this embodiment will not be described in detail here.

如图2所示,在薄膜晶体管层20远离基板10的一侧(即图2中薄膜晶体管层20的上侧)设置有OLED层30,其主要包括与像素区域一一对应的多个发光单元,并通过TFT的控制实现发光单元的发光。具体地,发光单元主要包括在薄膜晶体管层20表面依次设置阳极层31、发光层32以及阴极层33,其中,对于一个发光单元来说,其阳极层31完全覆盖与其对应的像素区域,其上设置有像素定义层34,并且在像素定义层34上设有开口,并通过开口大小限定出像素区域的大小,在对应开口处进行发光层32和阴极层33的制作。As shown in FIG. 2 , an OLED layer 30 is disposed on the side of the thin film transistor layer 20 away from the substrate 10 (ie, the upper side of the thin film transistor layer 20 in FIG. 2 ), which mainly includes a plurality of light-emitting units corresponding to the pixel areas one-to-one. , and through the control of the TFT, the light-emitting unit can emit light. Specifically, the light-emitting unit mainly includes an anode layer 31, a light-emitting layer 32 and a cathode layer 33 sequentially arranged on the surface of the thin film transistor layer 20, wherein, for a light-emitting unit, the anode layer 31 completely covers the corresponding pixel area, and the A pixel definition layer 34 is provided, and an opening is provided on the pixel definition layer 34, and the size of the pixel area is defined by the size of the opening, and the light-emitting layer 32 and the cathode layer 33 are fabricated at the corresponding opening.

区别与现有技术的结构,在本实施例中,触控感应层40(TSP)所包含的相关层级并未设置在封装后的OLED层30表面,而是在像素定义层34表面与布线区域对应的位置处进行层级制作,即触控感应层40在第一方向上的正投影被布线区域在第一方向上的正投影完全覆盖,第一方向为垂直与基板表面的方向。具体地,触控感应层40至少包括依次设置在OLED层30表面上的信号传输线41、第一绝缘层42以及触控信号线43,其中,触控信号线43主要用于实现触控功能,信号传输线41则主要用于进行各类信号的传递。本实施例中的信号传输线41所形成的图案至少包括第一图形走线411,并且第一图形走线411与OLED层30内的所有发光单元的阴极层33连通,以通过信号传输线41向发光单元的阴极层33输入电信号,实现所有发光单元的阴极层33的统一控制,并在实际操作时利用TFT向需要进行发光的发光单元的阳极层31输入电信号,实现发光效果。Different from the structure of the prior art, in this embodiment, the related layers included in the touch sensing layer 40 (TSP) are not disposed on the surface of the encapsulated OLED layer 30 , but on the surface of the pixel definition layer 34 and the wiring area. Layer fabrication is performed at the corresponding position, that is, the orthographic projection of the touch sensing layer 40 in the first direction is completely covered by the orthographic projection of the wiring area in the first direction, and the first direction is a direction perpendicular to the substrate surface. Specifically, the touch sensing layer 40 at least includes a signal transmission line 41 , a first insulating layer 42 and a touch signal line 43 sequentially arranged on the surface of the OLED layer 30 , wherein the touch signal line 43 is mainly used to realize the touch function, The signal transmission line 41 is mainly used to transmit various signals. The pattern formed by the signal transmission line 41 in this embodiment includes at least the first pattern wiring 411 , and the first pattern wiring 411 is in communication with the cathode layers 33 of all light-emitting units in the OLED layer 30 , so as to emit light through the signal transmission line 41 . The cathode layer 33 of the unit inputs electrical signals to realize unified control of the cathode layers 33 of all light-emitting units, and uses TFT to input electrical signals to the anode layer 31 of the light-emitting unit that needs to emit light during actual operation to realize the light-emitting effect.

需要了解的是,本实施例所提供的显示模组的层级结构在具体制备时,应当在制备完阳极层31以及像素定义层24之后,在其表面制备一阻隔层50以实现像素区域和布线区域的全覆盖,在后续制备过程中保护阳极材料,随后进行触控感应层40的相关层级的制备,并根据像素区域的位置按照第一图形走线进行信号传输线41的制备,形成阴极搭接线路,在触控感应层40的其他层级制备完毕后,刻蚀掉阳极层31表面与对应的阻隔层50材料,并在裸露出的阳极层表面上依次制作发光层32以及阴极层33,使阴极层33通过预留的传输信号线41的阴极搭接线路实现与传输信号线41的连通。It should be understood that, during the specific preparation of the hierarchical structure of the display module provided in this embodiment, after the anode layer 31 and the pixel definition layer 24 are prepared, a barrier layer 50 should be prepared on the surface thereof to realize the pixel area and wiring. The full coverage of the area protects the anode material in the subsequent preparation process, and then prepares the relevant layers of the touch sensing layer 40, and prepares the signal transmission line 41 according to the position of the pixel area according to the first pattern wiring to form a cathode overlap circuit, after the other layers of the touch sensing layer 40 are prepared, the surface of the anode layer 31 and the corresponding material of the barrier layer 50 are etched away, and the light-emitting layer 32 and the cathode layer 33 are sequentially fabricated on the exposed surface of the anode layer, so that The cathode layer 33 is communicated with the transmission signal line 41 through the cathode bonding line of the reserved transmission signal line 41 .

图3示出了信号传输线41的设置示意图。如图3所示,每一个六边形格子代表一个像素区域,而形成像素区域的实线则对应为信号传输线41所呈现的第一图形走线411,每个像素区域均与第一图形走线连接411,实现所有像素区域内发光单元的阴极的连通。本实施例通过对显示模组层级结构的调整,将触控感应层40的相关层级向下调整,无需优先制备OLED封装的相关层级结构即可直接进行布线设置,实现了显示模组整体结构厚度的降低。与此同时,因层级的变化所导致的制备工序的调整,可以在阴极层和发光层制备之前优先通过高温沉积制作TSP膜层,避免因阴极层和发光层的存在影响TSP膜层的沉积温度,导致其性能下降,无法实现其最优特性。FIG. 3 shows a schematic diagram of the arrangement of the signal transmission line 41 . As shown in FIG. 3 , each hexagonal grid represents a pixel area, and the solid line forming the pixel area corresponds to the first pattern line 411 presented by the signal transmission line 41 , and each pixel area is aligned with the first pattern line 411 . The line connection 411 realizes the connection of the cathodes of the light-emitting units in all pixel regions. In this embodiment, by adjusting the hierarchical structure of the display module, the related levels of the touch sensing layer 40 are adjusted downward, and wiring settings can be directly performed without prioritizing the preparation of the related hierarchical structure of the OLED package, thereby realizing the overall structural thickness of the display module. decrease. At the same time, due to the adjustment of the preparation process caused by the change of the level, the TSP film can be produced by high-temperature deposition prior to the preparation of the cathode layer and the light-emitting layer, so as to avoid affecting the deposition temperature of the TSP film due to the existence of the cathode layer and the light-emitting layer. , resulting in its performance degradation, unable to achieve its optimal characteristics.

进一步地,触控信号线43主要用于实现显示模组的触控功能,结合像素区域的设置,触控信号线43被划分为多个按照阵列排布的触控电极区域100,如图4所示,对于单个触控电极区域100来说,其内部可以只包括一个独立的像素区域,也可以包括相邻的多个像素区域,位于同一列的触控电极区域100为触控信号的供电发射极(TX),位于同一行的触控电极区域100则为触控信号的接收极(RX)。处于同一行的两个触控电极区域100之间可以利用边界处相邻的两个像素区域所共用的触控信号线43实现信号的传递,而位于同一列的相邻两个触控电极区域100之间则由于横向的RX极设置,无法实现直接连通。为了解决上述问题,本实施例中的显示模组在进行信号传输线41的制备时,在同一列中的两个相邻的触控电极区域100的桥接区域101内对应形成第二图形走线412,如图3中的虚线位置所示,并在第一绝缘层42与第二图形走线412对应的区域内开设桥接孔421,对应层级截面示意图如图5所示,实现触控信号线43在桥接区域内通过桥接孔421与第二图形走线412连接,并利用第二图形走线412实现跳线,完成同列中触控电极区域100的连接。需要注意的是,本实施例中的第二图形走线412仅用于实现触控信号线43的桥接功能,因此其不与第一图形走线411存在重合的走线,也并未与任何一个发光单元的阴极连通,仅通过在桥接区域的设置实现触控信号线的连通功能。Further, the touch signal line 43 is mainly used to realize the touch function of the display module. Combined with the setting of the pixel area, the touch signal line 43 is divided into a plurality of touch electrode areas 100 arranged in an array, as shown in FIG. 4 . As shown, for a single touch electrode area 100, it may only include an independent pixel area, or may include multiple adjacent pixel areas, and the touch electrode area 100 located in the same column is the power supply for touch signals The emitter (TX), the touch electrode region 100 in the same row is the receiver (RX) of the touch signal. Between two touch electrode regions 100 in the same row, the touch signal line 43 shared by the two adjacent pixel regions at the boundary can be used to realize signal transmission, while the two adjacent touch electrode regions in the same column are used for signal transmission. Between 100, direct connection cannot be achieved due to the horizontal RX pole setting. In order to solve the above problems, when the signal transmission line 41 is prepared in the display module in this embodiment, the second pattern wiring 412 is correspondingly formed in the bridge region 101 of the two adjacent touch electrode regions 100 in the same column. 3, and a bridge hole 421 is opened in the area corresponding to the first insulating layer 42 and the second pattern wiring 412, and the corresponding level cross-sectional schematic diagram is shown in FIG. 5, to realize the touch signal line 43 In the bridging area, the bridge hole 421 is used to connect with the second pattern wiring 412, and the second pattern wiring 412 is used to realize the jumper, so as to complete the connection of the touch electrode areas 100 in the same column. It should be noted that the second pattern wiring 412 in this embodiment is only used to realize the bridging function of the touch signal line 43, so it does not have any overlapping wiring with the first pattern wiring 411, nor is it connected with any The cathode of one light-emitting unit is connected, and the connection function of the touch signal line is realized only by the setting in the bridge area.

如图2所示,在实际制备触控感应层40时,在触控信号线43远离第一绝缘层42的一侧还设置有第二绝缘层44,主要用于实现触控信号线43的封装保护。在一些实施例中,进行发光层32和阴极层33的制备过程中,需要通过掩膜板来进行相应层级材料的蒸镀,而在设置掩膜板时则需要在当前已有的层级结构上进行支撑结构的设计,用以实现掩膜板的支撑,现有技术中需要在HPDL层上额外进行PS结构的设置以实现支撑效果,进一步导致显示模组层级厚度的增加。本实施例中,在将触控感应层40的相关结构下沉之后,可直接利用第二绝缘层44进行相应支撑结构441的设置,如图6所示,在第二绝缘层44远离触控信号线43的一侧表面(即图6中第二绝缘层42的上侧)的预设位置处制作支撑结构441,使预设位置处的第二绝缘层44的厚度大于其他位置的第二绝缘层44的厚度。具体地,预设位置是指根据实际制备需求和掩膜板的设计所确定的需要进行支撑结构放置的位置,其通常设置在蓝色像素周围的布线区域内,相邻的预设位置之间的距离大于或等于预设距离,一般情况下,预设距离为六个像素的尺寸,即在每隔六个像素的蓝色像素的布线区域设置支撑结构即可。需要注意的是,预设距离可以根据显示模组尺寸、显示模组分辨率、掩膜板尺寸以及实际需求进行设置,只要保证对应设置的支撑结构可以实现掩膜板支撑功能即可。As shown in FIG. 2 , during the actual preparation of the touch sensing layer 40 , a second insulating layer 44 is further provided on the side of the touch signal line 43 away from the first insulating layer 42 , which is mainly used to realize the touch signal line 43 . Package protection. In some embodiments, in the process of preparing the light-emitting layer 32 and the cathode layer 33, it is necessary to use a mask to perform evaporation of the corresponding layered materials, and when setting the mask, it is necessary to use the existing layered structure. The design of the support structure is used to realize the support of the mask plate. In the prior art, an additional PS structure needs to be arranged on the HPDL layer to achieve the support effect, which further leads to an increase in the thickness of the display module level. In this embodiment, after the related structures of the touch sensing layer 40 are sunk, the second insulating layer 44 can be directly used to set the corresponding supporting structure 441 . As shown in FIG. 6 , the second insulating layer 44 is far away from the touch. A support structure 441 is fabricated at a predetermined position on one side surface of the signal line 43 (ie, the upper side of the second insulating layer 42 in FIG. 6 ), so that the thickness of the second insulating layer 44 at the predetermined position is greater than that of the second insulating layer 44 at other positions. Thickness of insulating layer 44 . Specifically, the preset position refers to the position where the support structure needs to be placed according to the actual preparation requirements and the design of the mask, which is usually set in the wiring area around the blue pixel, between adjacent preset positions The distance is greater than or equal to the preset distance. In general, the preset distance is the size of six pixels, that is, a support structure can be provided in the wiring area of the blue pixels every six pixels. It should be noted that the preset distance can be set according to the size of the display module, the resolution of the display module, the size of the mask, and the actual needs, as long as the corresponding support structure can realize the mask support function.

在实际实现时,如图2所示,触控感应层40远离OLED层30一侧还设置有平坦层60和封装保护层70,主要用于实现显示模组表面的平整处理以及封装保护。实际上,基于本实施例中触控感应层40的下沉式设计,利用平坦层60替代图1中原有TOC层的厚度,并进一步利用第二绝缘层44上支撑结构的设置实现TSP膜层对PS层的替代,使本实施例的显示模组的整体厚度相较于图1所示的显示模组来说减小了一组TSP膜层的厚度,实现对显示模组尺寸的缩减,降低了产品的制作成本。In actual implementation, as shown in FIG. 2 , the touch sensing layer 40 is further provided with a flat layer 60 and an encapsulation protection layer 70 on the side away from the OLED layer 30 , mainly for flattening the surface of the display module and encapsulation protection. In fact, based on the sunken design of the touch sensing layer 40 in this embodiment, the thickness of the original TOC layer in FIG. 1 is replaced by the flat layer 60 , and the TSP film layer is further realized by the setting of the support structure on the second insulating layer 44 The replacement of the PS layer makes the overall thickness of the display module of the present embodiment reduce the thickness of a group of TSP film layers compared to the display module shown in FIG. 1 , thereby reducing the size of the display module. The production cost of the product is reduced.

本实施例通过调整显示模组的膜层结构,将触控感应层的位置向基板一侧下沉调整,并利用触控感应层中的传输信号线所形成的第一图形走线作为OLED发光单元阴极的信号输入走线,使显示模组的整体厚度降低,实现产品成本的节约;并且在制备过程中将触控感应层的制备工序提至发光单元的发光材料制作之前,进而在制备过程中提升触控感应层的膜层性能,使显示模组在制备材料和工艺不变的情况下实现质量的提升。In this embodiment, by adjusting the film layer structure of the display module, the position of the touch sensing layer is adjusted downward to the substrate side, and the first pattern trace formed by the transmission signal line in the touch sensing layer is used as the OLED to emit light. The signal input wiring of the unit cathode reduces the overall thickness of the display module and saves the product cost; and in the preparation process, the preparation process of the touch sensing layer is carried out before the preparation of the light-emitting material of the light-emitting unit, and then in the preparation process The film performance of the touch sensing layer is improved in the middle, so that the quality of the display module can be improved without changing the preparation materials and process.

本公开的第二实施例提供了一种本公开第一实施例的显示模组的制备方法,其流程图如图7所示,主要包括步骤S10至S40:The second embodiment of the present disclosure provides a method for manufacturing a display module according to the first embodiment of the present disclosure, the flowchart of which is shown in FIG. 7 and mainly includes steps S10 to S40:

S10,在基板表面制备薄膜晶体管层,基板包括多个阵列排布的像素区域以及用以划分像素区域的布线区域。具体地,布线区域和像素区域的具体尺寸可根据显示模组的尺寸、分辨率需求等进行设置,薄膜晶体管层的制备也可直接通过现有技术进行,本实施例不进行具体描述。S10, a thin film transistor layer is prepared on a surface of a substrate, where the substrate includes a plurality of pixel regions arranged in an array and a wiring region for dividing the pixel regions. Specifically, the specific size of the wiring area and the pixel area can be set according to the size of the display module, resolution requirements, etc., and the preparation of the thin film transistor layer can also be directly performed by the prior art, which is not described in detail in this embodiment.

S20,在薄膜晶体管层远离基板一侧制备OLED层中各个发光单元的阳极层、像素定义层以及阻隔层。发光单元与像素区域一一对应,像素定义层在制备之后需要在对应像素区域的位置开设开口使阳极层裸露在外,但为了便于进行后续膜层的制备,在步骤S20中优先利用阻隔层将阳极层和像素定义层进行保护。S20, preparing an anode layer, a pixel definition layer and a barrier layer of each light-emitting unit in the OLED layer on the side of the thin film transistor layer away from the substrate. The light-emitting unit corresponds to the pixel area one-to-one. After the pixel definition layer is prepared, an opening needs to be opened at the position corresponding to the pixel area to expose the anode layer. However, in order to facilitate the preparation of the subsequent film layer, the barrier layer is preferentially used in step S20 to remove the anode. layer and pixel definition layer for protection.

S30,在阻隔层远离薄膜晶体管层的一侧制备触控感应层,所述触控感应层在第一方向上的正投影被所述布线区域在所述第一方向上的正投影完全覆盖,所述第一方向为垂直与所述基板表面的方向;具体地,触控感应层至少包括依次设置在所述OLED层上的信号传输线、第一绝缘层以及触控信号线,信号传输线至少包括第一图形走线,用以进行与阴极层的连接。S30, a touch sensing layer is prepared on the side of the barrier layer away from the thin film transistor layer, the orthographic projection of the touch sensing layer in the first direction is completely covered by the orthographic projection of the wiring area in the first direction, The first direction is a direction perpendicular to the surface of the substrate; specifically, the touch sensing layer at least includes a signal transmission line, a first insulating layer and a touch signal line sequentially arranged on the OLED layer, and the signal transmission line at least includes The first pattern wiring is used for connection with the cathode layer.

S40,刻蚀掉所有所述像素区域对应的阻隔层,并在所有所述像素区域内的所述阳极层远离所述薄膜晶体管层的一侧依次制备发光层和阴极层,使所有所述阴极层与所述第一图形走线连通;具体地,阴极层在蒸镀时可以使用Pattern化技术,使得TSP膜层不被屏蔽,同时通过信号传输线预留的阴极搭接线路实现不同发光单元的阴极连通,达到统一控制的目的。S40, etch away the barrier layers corresponding to all the pixel regions, and prepare a light-emitting layer and a cathode layer in turn on the side of the anode layer in all the pixel regions away from the thin film transistor layer, so that all the cathodes The layer is communicated with the first pattern wiring; specifically, the cathode layer can use the patterning technology during evaporation, so that the TSP film layer is not shielded, and simultaneously realize the different light-emitting units through the cathode lap line reserved by the signal transmission line. The cathode is connected to achieve the purpose of unified control.

在一些实施例中,触控信号线形成了多个按阵列排布的触控点击区域,每个触控电极区域内包括一个或多个相邻的像素区域,对应在制备触控感应层时,还需要制备具有第二图形走线的信号传输线,第二图形走线与第一图形走线之间不具有重合走线,并且第二图形走线也不与任何发光单元的阴极层连通;第二图形走线所设置的位置为同一列中相邻两个触控电极区域之间的桥接区域,在进行第一绝缘层的制备时,还需要在相邻的两个触控电极区域内的第一绝缘层上与第二图形走线对应的区域内开设桥接孔,使后续进行触控信号线的制备时使触控信号线基于桥接孔与第二图形走线连接,实现同列相邻的触控电极区域之间的连通。In some embodiments, the touch signal lines form a plurality of touch click areas arranged in an array, and each touch electrode area includes one or more adjacent pixel areas, corresponding to the preparation of the touch sensing layer. , it is also necessary to prepare a signal transmission line with a second pattern line, and there is no overlapping line between the second pattern line and the first pattern line, and the second pattern line is also not connected with the cathode layer of any light-emitting unit; The position where the second pattern traces are set is the bridge area between two adjacent touch electrode areas in the same column. During the preparation of the first insulating layer, it also needs to be in the adjacent two touch electrode areas. A bridging hole is opened in the area corresponding to the second pattern trace on the first insulating layer, so that the touch signal line is connected to the second graphic trace based on the bridge hole in the subsequent preparation of the touch signal line, so as to realize adjacent rows in the same row. connection between the touch electrode areas.

在一些实施例中,制备触控感应层时还应当在触控信号线远离第一绝缘层的一侧制备第二绝缘层,并在预设位置处减少第二绝缘层材料的刻蚀程度使其在表面上形成支撑结构,用以实现掩膜板的支撑作用。具体地,相邻的预设位置之间的距离大于或等于预设距离,预设距离则可根据实际情况进行确定。In some embodiments, when preparing the touch sensing layer, a second insulating layer should also be prepared on the side of the touch signal line away from the first insulating layer, and the etching degree of the material of the second insulating layer should be reduced at a preset position so that the It forms a support structure on the surface to realize the support function of the mask plate. Specifically, the distance between adjacent preset positions is greater than or equal to the preset distance, and the preset distance may be determined according to the actual situation.

在实际实现时,在触控感应层远离OLED层一侧还制备有平坦层和封装保护层,用以实现显示模组表面的平整处理以及封装保护。In actual implementation, a flat layer and an encapsulation protection layer are also prepared on the side of the touch sensing layer away from the OLED layer, so as to realize the flat treatment and encapsulation protection of the surface of the display module.

需要注意的是,在本实施例中所进行的TSP相关层级的制备过程中,其所用到的制备材料和使用的制备工艺均可直接使用现有技术的材料和工艺,对应各个层级的厚度也可直接使用常规的厚度设置,只要保证在第一图形走线制作时预留与阴极搭接的线路,以及在桥接区域实现触控信号线的跳线即可。It should be noted that in the preparation process of the TSP-related layers in this embodiment, the preparation materials and preparation processes used in the preparation can directly use the materials and processes of the prior art, and the thicknesses corresponding to each layer are also Conventional thickness settings can be used directly, as long as the lines that overlap with the cathode are reserved when the first pattern traces are made, and the jumpers of the touch signal lines are implemented in the bridging area.

本实施例通过调整显示模组的膜层结构,将触控感应层的位置向基板一侧下沉调整,并利用触控感应层中的传输信号线所形成的第一图形走线作为OLED发光单元阴极的信号输入走线,使显示模组的整体厚度降低,实现产品成本的节约;并且在制备过程中将触控感应层的制备工序提至发光单元的发光材料制作之前,进而在制备过程中提升触控感应层的膜层性能,使显示模组在制备材料和工艺不变的情况下实现质量的提升。In this embodiment, by adjusting the film layer structure of the display module, the position of the touch sensing layer is adjusted downward to the substrate side, and the first pattern trace formed by the transmission signal line in the touch sensing layer is used as the OLED to emit light. The signal input wiring of the unit cathode reduces the overall thickness of the display module and saves the product cost; and in the preparation process, the preparation process of the touch sensing layer is carried out before the preparation of the light-emitting material of the light-emitting unit, and then in the preparation process The film performance of the touch sensing layer is improved in the middle, so that the quality of the display module can be improved without changing the preparation materials and process.

本公开的第三实施例提供了一种电子设备,该电子设备可以是手机、电视、电脑等具有显示功能的设备,该电子设备至少包括本公开第一实施例提供的显示模组,进而实现电子设备整体厚度的降低,并提升了显示模组中触控感应层的膜层性能,使显示模组在制备材料和工艺不变的情况下实现质量的提升,用户在使用过程中也具有更好的使用体验。A third embodiment of the present disclosure provides an electronic device, which may be a device with a display function, such as a mobile phone, a TV, a computer, etc. The electronic device includes at least the display module provided in the first embodiment of the present disclosure, thereby realizing The overall thickness of the electronic device is reduced, and the film performance of the touch sensing layer in the display module is improved, so that the quality of the display module can be improved under the condition that the preparation materials and processes remain unchanged. good user experience.

以上对本公开多个实施例进行了详细说明,但本公开不限于这些具体的实施例,本领域技术人员在本公开构思的基础上,能够做出多种变型和修改实施例,这些变型和修改都应落入本公开所要求保护的范围之内。The various embodiments of the present disclosure have been described in detail above, but the present disclosure is not limited to these specific embodiments. Those skilled in the art can make various variations and modifications on the basis of the concept of the present disclosure. These variations and modifications All should fall within the scope of the claimed protection of the present disclosure.

Claims (11)

1. A display module, comprising:
the display device comprises a substrate and a display panel, wherein the substrate comprises a plurality of pixel areas arranged in an array and a wiring area used for dividing the pixel areas;
the thin film transistor layer is arranged on the surface of one side of the substrate;
the OLED layer is arranged on one side, far away from the substrate, of the thin film transistor layer and comprises light-emitting units which correspond to the pixel regions one by one;
the touch sensing layer is arranged on one side, far away from the thin film transistor layer, of the OLED layer, the orthographic projection of the touch sensing layer in a first direction is completely covered by the orthographic projection of the wiring area in the first direction, and the first direction is perpendicular to the surface of the substrate;
the touch sensing layer at least comprises a signal transmission line, a first insulating layer and a touch signal line which are sequentially arranged on the OLED layer;
the signal transmission line at least comprises a first graph routing line, and the first graph routing line is communicated with the cathodes of all the light-emitting units.
2. The display module of claim 1, wherein the touch signal line comprises a plurality of touch electrode regions arranged in an array, and each touch electrode region comprises one or more adjacent pixel regions.
3. The display module according to claim 2, wherein the signal transmission line further comprises a second graphic trace, the second graphic trace does not have a coincident trace with the first graphic trace, and the second graphic trace is not connected to the cathode of any of the light emitting units;
and a bridging hole is formed in an area corresponding to the first insulating layer and the second pattern wire, and the touch signal line between two adjacent touch electrode areas in the same row is connected with the second pattern wire based on the bridging hole so as to realize signal transmission between the adjacent touch electrode areas.
4. The display module according to claim 1, wherein the touch sensing layer further comprises a second insulating layer disposed on a side of the touch signal line away from the first insulating layer.
5. The display module according to claim 4, wherein a support structure is disposed at a predetermined position on a side surface of the second insulating layer away from the touch signal line, and a distance between adjacent predetermined positions is greater than or equal to a predetermined distance.
6. The display module according to any one of claims 1 to 5, further comprising:
the flat layer and the packaging protection layer are arranged on one side, far away from the OLED layer, of the touch sensing layer.
7. A preparation method of a display module, which is used for preparing the display module according to any one of claims 1 to 6, and is characterized in that the preparation method is realized based on the following steps:
preparing a thin film transistor layer on the surface of a substrate, wherein the substrate comprises a plurality of pixel regions arranged in an array manner and a wiring region for dividing the pixel regions;
preparing an anode layer, a pixel defining layer and a blocking layer of each light-emitting unit in an OLED layer on one side of the thin film transistor layer away from the substrate, wherein the light-emitting units correspond to the pixel regions one to one, and openings are formed in positions, corresponding to the pixel regions, of the pixel defining layer;
preparing a touch sensing layer on one side, far away from the thin film transistor layer, of the blocking layer, wherein the orthographic projection of the touch sensing layer in a first direction is completely covered by the orthographic projection of the wiring area in the first direction, and the first direction is perpendicular to the surface of the substrate;
etching the blocking layers corresponding to all the pixel regions, and sequentially preparing a light-emitting layer and a cathode layer on one side, far away from the thin film transistor layer, of the anode layer in all the pixel regions, so that all the cathode layers are communicated with the first graph routing line.
8. The method according to claim 7, wherein the touch signal line comprises a plurality of touch electrode regions arranged in an array, each touch electrode region comprising one or more adjacent pixel regions;
the preparing of the touch sensing layer on the side of the pixel definition layer far away from the thin film transistor layer includes:
preparing the signal transmission line with a second graphic trace, wherein the second graphic trace does not have a superposed trace with the first graphic trace, and the second graphic trace is not communicated with the cathode of any one of the light-emitting units;
and arranging a bridging hole in an area corresponding to the first insulating layer and the second graphic trace, so that the touch signal line between two adjacent touch electrode areas in the same row is connected with the second graphic trace based on the bridging hole.
9. The method according to claim 7, wherein the step of forming a touch sensing layer on a side of the pixel definition layer away from the thin-film transistor layer comprises:
preparing a second insulating layer on one side of the touch signal line, which is far away from the first insulating layer, arranging a supporting structure at a preset position on the surface of one side, which is far away from the touch signal line, of the second insulating layer, wherein the distance between the adjacent preset positions is larger than or equal to the preset distance.
10. The production method according to any one of claims 7 to 9, characterized by further comprising:
and preparing a flat layer and a packaging protective layer on one side of the touch sensing layer far away from the OLED layer.
11. An electronic device, characterized by comprising at least the display module according to any one of claims 1 to 6.
CN202210589337.5A 2022-05-26 2022-05-26 Display module, preparation method thereof and electronic equipment Pending CN115000138A (en)

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CN111029390A (en) * 2019-12-23 2020-04-17 武汉天马微电子有限公司 Display panel, driving method thereof and display device
WO2021190047A1 (en) * 2020-03-26 2021-09-30 京东方科技集团股份有限公司 Touch-control module, touch-control display screen, and method for manufacturing touch-control display screen
CN111722756A (en) * 2020-06-29 2020-09-29 南京中电熊猫液晶显示科技有限公司 Embedded touch module, driving method thereof and touch panel
CN111930264A (en) * 2020-09-15 2020-11-13 武汉华星光电半导体显示技术有限公司 Touch display panel and touch display device
CN112382646A (en) * 2020-11-10 2021-02-19 昆山国显光电有限公司 OLED display panel and touch display screen
CN113467650A (en) * 2021-07-29 2021-10-01 京东方科技集团股份有限公司 Touch display panel and display device

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* Cited by examiner, † Cited by third party
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TWI865962B (en) * 2022-11-11 2024-12-11 友達光電股份有限公司 Display device
WO2024198080A1 (en) * 2023-03-31 2024-10-03 惠科股份有限公司 Display panel and manufacturing method therefor
CN117750833A (en) * 2023-12-07 2024-03-22 惠科股份有限公司 Display panel and display device

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