CN114989758A - Two-component epoxy adhesive - Google Patents
Two-component epoxy adhesive Download PDFInfo
- Publication number
- CN114989758A CN114989758A CN202210832399.4A CN202210832399A CN114989758A CN 114989758 A CN114989758 A CN 114989758A CN 202210832399 A CN202210832399 A CN 202210832399A CN 114989758 A CN114989758 A CN 114989758A
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- Prior art keywords
- component
- toughening
- agent
- epoxy adhesive
- filler
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- 229920006332 epoxy adhesive Polymers 0.000 title claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 239000000945 filler Substances 0.000 claims abstract description 17
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 239000004952 Polyamide Substances 0.000 claims abstract description 11
- 229920002647 polyamide Polymers 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 239000007822 coupling agent Substances 0.000 claims abstract description 8
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003085 diluting agent Substances 0.000 claims abstract description 7
- 239000012745 toughening agent Substances 0.000 claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 6
- 229920000459 Nitrile rubber Polymers 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000003889 chemical engineering Methods 0.000 claims 1
- 239000013530 defoamer Substances 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 229920005573 silicon-containing polymer Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 239000003292 glue Substances 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 11
- 230000006872 improvement Effects 0.000 description 8
- 238000003756 stirring Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007665 sagging Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011863 silicon-based powder Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000037380 skin damage Effects 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a two-component epoxy adhesive which consists of a component A and a component B, wherein the component A comprises the following components: 45.5-55 wt% of epoxy resin, 3.5-4.5 wt% of MBS toughening resin, 8-15 wt% of glycidyl ether diluent, 1-3 wt% of coupling agent, 25-32 wt% of A filler and 0.1-0.5 wt% of A defoaming agent. The component B comprises 55-60 wt% of toughening polyamide curing agent, 3-9 wt% of accelerator, 10.5-15 wt% of toughening agent, 18-25 wt% of filling material B and 0.1-0.5 wt% of defoaming agent B. The invention has the advantages of high bonding strength, strong operation adaptability, short curing time and stable performance.
Description
Technical Field
The invention belongs to the field of adhesives, and particularly relates to a two-component epoxy adhesive.
Background
The box structures such as square cabins, motor caravans and refrigerated vehicles are usually riveted and formed through composite sandwich plates (called large plates for short), and in order to ensure the air tightness of the box and prevent the riveted parts from loosening, the rivets need to be riveted with structural glue and scraped flat with the glue. Because the compartment body structure is used in different environments and generally experiences the effects of road bumping and various external forces, the structural adhesive needs to have good impact-resistant structural strength, high-temperature resistance and environmental adaptability. When a gap caused by skin error or a small pit and external skin damage caused by collision occur in the composite sandwich plate, the composite sandwich plate needs to be quickly repaired in a simple and convenient mode. At present, structural adhesive is generally adopted for filling and repairing, the used structural adhesive is mostly polyurethane adhesive, and the defects of the adhesive are as follows: 1) the anti-impact strength is not high, and when the compartment body is loaded heavily or used for a long time, fish eyes are easy to appear at the rivets of the aluminum at the corners of the compartment body, namely, cracks appear at the joints of the rivet heads and the adhesives, and the rivet heads protrude, so that the appearance is influenced, and the structural strength is also influenced; 2) the requirement on the environment is limited, the operation temperature is above 15 ℃, and the operation time is 50 min; 3) the curing time is long: the curing at normal temperature needs 5 days or 5 hours at 60 ℃ to reach the bonding strength; 4) the performance is unstable: the bulge phenomenon is easy to occur at the repairing position of the structural adhesive after daily production or long-time use.
In order to solve the defects of the prior art, an ideal technical solution is always sought.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides the two-component epoxy adhesive which is high in adhesive strength, strong in operation adaptability, short in curing time and stable in performance.
In order to achieve the above object, the present invention provides the following technical solutions, each of which at least partially solves the above problems:
the two-component epoxy adhesive is composed of a component A and a component B, and is characterized in that the component A comprises the following components by taking the total mass of the component A as a reference:
45.5-55 wt% of epoxy resin
3.5 to 4.5 weight percent of MBS toughening resin
8-15 wt% of glycidyl ether diluent
1-3 wt% of coupling agent
25-32 wt% of A filler
0.1-0.5 wt% of a methyl defoaming agent;
based on the total mass of the component B, the component B comprises:
55-60 wt% of toughening polyamide curing agent
3-9 wt% of imidazole accelerator
10.5-15 wt% of toughening agent
18-25 wt% of B filler
0.1-0.5 wt% of defoaming agent B;
and (2) mixing the component A and the component B according to the mass ratio of 100 (45-65). When the mass ratio of the component B is lower than 45, the glue is not cured; when the mass ratio of the component B is higher than 65, the glue is cured too fast, becomes brittle and has low strength.
The component A is prepared by sequentially adding the components into a reaction kettle according to the sequence of bisphenol A epoxy resin, toughening resin, diluent, coupling agent, filler A and defoaming agent, keeping the temperature of the reaction kettle between 25 and 40 ℃ and stirring; and the component B is prepared by sequentially adding the components into a reaction kettle according to the sequence of the curing agent, the accelerator, the flexibilizer, the filler and the defoaming agent, keeping the temperature of the reaction kettle between 25 and 40 ℃ and stirring. The first and second components are stored separately and mixed with glue before use.
The curing mechanism of the adhesive is as follows: and the epoxy group of the epoxy resin and active hydrogen on the functional group of the curing agent react one to one under the action of the coupling agent so as to cure the glue.
The MBS toughening resin is an MBS polymer, has a core-shell structure and an acrylate component, does not damage other performances such as thermal deformation temperature and the like while improving the impact strength, and has no adverse effect on weather resistance; the filler and MBS toughening resin improve the viscosity, the anti-sagging property, the impact strength and the heat resistance of the product. On the basis of increasing the viscosity of the glue by the filler and the MBS toughening resin, the diluent can improve the reaction activity of the curing agent and the epoxy resin. The imidazole accelerator improves the reaction speed of curing and ensures the toughness of the product. The toughening polyamide curing agent is obtained by modifying conventional polyamide and adding an ether bond structure, so that the flexibility of the curing agent is improved, and the crosslinking density and the shear strength of glue are improved by matching with an accelerator and a diluent.
As a further improvement of the technical scheme, the epoxy resin is bisphenol A type epoxy resin.
As a further improvement of the technical scheme, in order to improve the curing speed, the accelerator is one or more of methylimidazole, 2-methylimidazole and 2-ethyl-4-methylimidazole.
As a further improvement of the technical scheme, in order to prolong the operation time of the glue and increase the viscosity of the glue and ensure that the anti-sagging property of the glue is excellent, the second filler and the second filler are silica micropowder.
As a further improvement of the technical scheme, the filler A and the filler B are 1000-5000 meshes of silica micropowder.
As a further improvement of the technical scheme, in order to reduce the brittleness and improve the flexibility of the cured adhesive, the toughening agent is liquid nitrile rubber.
As a further improvement of the technical scheme, in order to quickly eliminate bubbles generated in the stirring and mixing process of the glue and stabilize the components, the defoaming agent is an oily organic silicon polymer.
As a further improvement of the technical scheme, in order to increase the bonding strength of the cured adhesive, the coupling agent is a silane coupling agent.
As a further improvement of the technical scheme, the toughening resin is one or more of M-722, M-564 and M711 (Shanghai Kaihin chemical industry), and the toughening curing agent is one or two of XH351 or XH498 (Shenzhen Jia Di Da).
The prior art is referred to in the art for techniques not mentioned in the present invention.
Compared with the prior art, the adhesive has outstanding substantive characteristics and remarkable progress, and particularly, the adhesive improves the toughness and the shear strength and reduces the curing time by adopting the interaction of the specific types of toughening resin, the accelerator, the diluent and the modified polyamide curing agent. Furthermore, the invention improves the viscosity of the glue and prolongs the operation time of the glue together by adding the fillers such as the silica powder and the like, assisting the MBS resin and designing the proportion of the formula, has excellent sagging resistance and further reduces the curing time. The invention has the advantages of high bonding strength, strong operation adaptability, short curing time and stable performance.
Detailed Description
The technical solution of the present invention is further described in detail by the following embodiments. The compounds used in the examples are commercially available, and the techniques not specified in the examples are known in the art.
In the examples, MBS toughening resin is purchased from Shanghai Kainen chemical industry, glycidyl ether is purchased from Anhui Xinyuan, coupling agent is purchased from Nanjing forwards, defoaming agent is purchased from Pic chemistry, toughening polyamide curing agent is purchased from Shenzhen Jia Di, bisphenol A epoxy resin is purchased from Nantong Xinjiang synthetic material, and liquid nitrile rubber is purchased from Shenzhen Jia Di.
Example 1
The component A comprises: 55 percent of bisphenol A epoxy resin (mass percent, the same is not repeated), M5644 percent of MBS toughening resin, XY 6319.7 percent of glycidyl ether, KH 5602 percent of silane coupling agent, 29 percent of 5000-mesh silica powder and 0.3 percent of defoaming agent BYK066N 0.3.
B, component B: toughened polyamide curing agent XH 49860%, accelerator 2-ethyl-4-methylimidazole 7%, liquid nitrile rubber 12.7%, 5000 mesh silicon micropowder 20%, and defoaming agent BYK066N 0.3.3%.
When the components A and B are prepared, the components are required to be sequentially added into a reaction kettle according to the sequence, the temperature of the reaction kettle is kept at 30 ℃, and ultrasonic stirring is continuously carried out for 5 hours.
When in use, the component A and the component B are mixed according to the mass ratio of 100: 55.
Example 2
The component A comprises: 52.5 percent of bisphenol A epoxy resin, 7114.5 percent of MBS toughening resin M, XY 6229 percent of glycidyl ether, KH 5602.3 percent of silane coupling agent, 31.5 percent of 1000-mesh silicon powder and 0.2 percent of defoaming agent BYK066N 0.2.
B, component B: toughening polyamide curing agent XH 35120%, XH 49838.5%, curing agent accelerator 2-methylimidazole 8%, liquid nitrile rubber 10.2%, 1000-mesh silicon micropowder 23%, and defoaming agent BYK066N 0.3.3%.
When the components A and B are prepared, the components are required to be sequentially added into a reaction kettle according to the sequence, the temperature of the reaction kettle is kept between 35 ℃, and the ultrasonic stirring is continuously carried out for 5.5 hours.
When in use, the component A and the component B are mixed according to the mass ratio of 100: 50.
Example 3
The component A comprises: 45.5% of bisphenol A epoxy resin, 45.24% of MBS toughening resin M7224%, glycidyl ether XY 63011.5%, a silane coupling agent KH 5503.5%, 35% of 1000-mesh silicon powder and 5300.5% of a defoaming agent BYK-A.
B, component B: toughening polyamide curing agent XH 35155%, curing agent accelerator 2-methylimidazole 9%, liquid nitrile rubber 14.5%, 1000-mesh silicon micropowder 21%, and defoaming agent BYK-A5300.5%.
When the components A and B are prepared, the components are required to be sequentially added into a reaction kettle according to the sequence, the temperature of the reaction kettle is kept between 40 ℃, and ultrasonic stirring is continuously carried out for 6 hours.
When in use, the component A and the component B are mixed according to the mass ratio of 100: 45.
Examples 1-3 Performance testing: the adhesive shear strength is tested according to the adhesive tensile shear strength test method (metal and metal) of GB/T7124-.
The performance detection results of the embodiments 1 to 3 are as follows:
finally, it should be noted that the above examples are only used to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention; without departing from the spirit of the present invention, it is intended to cover all aspects of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a two ingredient epoxy adhesives, comprises A component and second component, its characterized in that with A component gross mass is the benchmark, A component includes:
45.5-55 wt% of epoxy resin
3.5 to 4.5 weight percent of MBS toughening resin
8-15 wt% of glycidyl ether diluent
1-3 wt% of coupling agent
25-32 wt% of A filler
0.1-0.5 wt% of a methyl defoaming agent;
based on the total mass of the component B, the component B comprises:
55-60 wt% of toughening polyamide curing agent
3-9 wt% of imidazole accelerator
10.5-15 wt% of toughening agent
18-25 wt% of B filler
0.1-0.5 wt% of defoaming agent B;
and (2) mixing the component A and the component B according to the mass ratio of 100 (45-65).
2. The two-part epoxy adhesive of claim 1, wherein the epoxy resin is a bisphenol a type epoxy resin.
3. The two-component epoxy adhesive according to claim 1, wherein the accelerator is one or more of methylimidazole, 2-methylimidazole and 2-ethyl-4-methylimidazole.
4. The two-component epoxy adhesive according to claim 1, wherein the A filler is silica micropowder.
5. The two-component epoxy adhesive according to claim 4, wherein the A filler is 1000-5000 mesh silica micropowder.
6. The two-component epoxy adhesive according to claim 4 or 5, wherein the second filler is 1000-5000 mesh silica micropowder.
7. The two-component epoxy adhesive according to claim 1, wherein the toughening agent is a liquid nitrile rubber.
8. The two-part epoxy adhesive of claim 1, wherein the defoamer is an oily silicone polymer.
9. The two-part epoxy adhesive of claim 1, wherein the coupling agent is a silane coupling agent.
10. The two-component epoxy adhesive according to claim 1, wherein the toughening resin is one or more of toughening resins of M-722, M-564 and M711 in Shanghai Kay chemical engineering; the toughening polyamide curing agent is one or two of XH351 or XH498 of Shenzhen Jia Di.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210832399.4A CN114989758A (en) | 2022-07-15 | 2022-07-15 | Two-component epoxy adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210832399.4A CN114989758A (en) | 2022-07-15 | 2022-07-15 | Two-component epoxy adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114989758A true CN114989758A (en) | 2022-09-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210832399.4A Pending CN114989758A (en) | 2022-07-15 | 2022-07-15 | Two-component epoxy adhesive |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010407A (en) * | 2016-06-02 | 2016-10-12 | 北京中德新亚建筑技术有限公司 | High-thixotropy modified epoxy resin steel sticking glue |
| CN109266274A (en) * | 2018-08-21 | 2019-01-25 | 溧阳二十八所系统装备有限公司 | A kind of high intensity room temperature fast-curing two-component epoxy construction gluing agent |
| CN109777333A (en) * | 2017-11-13 | 2019-05-21 | 北京天山新材料技术有限公司 | A kind of epoxy adhesive and preparation method thereof |
| CN112680156A (en) * | 2020-12-23 | 2021-04-20 | 重庆德天汽车新材料研究院有限公司 | High-toughness bi-component epoxy structural adhesive and preparation method thereof |
-
2022
- 2022-07-15 CN CN202210832399.4A patent/CN114989758A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010407A (en) * | 2016-06-02 | 2016-10-12 | 北京中德新亚建筑技术有限公司 | High-thixotropy modified epoxy resin steel sticking glue |
| CN109777333A (en) * | 2017-11-13 | 2019-05-21 | 北京天山新材料技术有限公司 | A kind of epoxy adhesive and preparation method thereof |
| CN109266274A (en) * | 2018-08-21 | 2019-01-25 | 溧阳二十八所系统装备有限公司 | A kind of high intensity room temperature fast-curing two-component epoxy construction gluing agent |
| CN112680156A (en) * | 2020-12-23 | 2021-04-20 | 重庆德天汽车新材料研究院有限公司 | High-toughness bi-component epoxy structural adhesive and preparation method thereof |
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Application publication date: 20220902 |