CN114975159A - Wet processing apparatus and wet processing method - Google Patents

Abstract

A wet processing equipment and a wet processing method. The wet processing equipment includes a carrier plate, a deionized water spray device, a multi-fluid spray device, and a drying gas spray device. The carrier tray is configured to carry the object. The deionized water spraying device is arranged above the carrier plate and configured to spray the first deionized water toward the object. The multi-fluid spraying device is disposed above the carrier plate and configured to spray the mixed fluid toward the object. The mixed fluid includes a second deionized water, water vapor, and a volatile fluid. The drying gas spraying device is arranged above the carrier plate, and is configured to spray drying gas toward the object. The small molecules of water vapor can improve the cleaning effect. The volatilization of the volatile fluid can provide the diffusion and movement kinetic energy of the treatment liquid and particles remaining on the object, thereby shortening the cleaning time and reducing the amount of deionized water used in wet processing. Achieve the effect of improving removal efficiency, reducing product defects, and improving yield.

Description

Wet processing equipment and wet processing method

technical field

The present disclosure relates to a wet processing technology, and more particularly, to a wet processing apparatus and a wet processing method.

Background technique

Wet processing of manufactured objects with liquids, such as cleaning and etching, is widely used in the electronics manufacturing industry. For example, when the wafer is etched with a single-wafer spin wet etching equipment, it will undergo one or more times of etching with an acidic or alkaline etchant or cleaning with a cleaning solution. In the wet processing process, deionized (DI) water is usually used between the switching of different acidic or alkaline processing liquids to remove the remaining acidic or alkaline processing liquids on the wafer. In addition, after all the processing steps of the acidic or alkaline processing liquid are completed, the acid or alkaline processing liquid remaining on the wafer needs to be rinsed with deionized water. Therefore, the amount of deionized water required for each wafer in the entire etching process is quite large. Moreover, during wet processing, most of the deionized water will be quickly thrown out of the wafer due to the high-speed rotation of the wafer, resulting in limited cleaning effect of the deionized water.

In the case of limited water resources, major semiconductor factories have been forced to actively reduce and recycle deionized water. Therefore, there is an urgent need for a wet treatment technology that can improve the wet treatment effect and reduce the amount of deionized water used.

SUMMARY OF THE INVENTION

Therefore, an object of the present disclosure is to provide a wet processing apparatus and a wet processing method, which can spray deionized water on an object in turn, and a mist-like mist containing a mixed fluid of deionized water, water vapor, and volatile fluid. molecular. The small molecules of water vapor can reduce the use of deionized water in wet processing and can improve the cleaning effect. In addition, the volatilization of the volatile fluid can provide the diffusion and movement kinetic energy of the processing liquid and particles remaining on the object, which can shorten the cleaning time, further reduce the use of deionized water, improve the removal efficiency, and avoid damage to the object. This can reduce product defects and improve yield.

Another object of the present disclosure is to provide a wet processing apparatus and a wet processing method, which can spray objects with two fluids including dry nitrogen and saturated vapor of a volatile solution. The volatilization of the saturated vapor of the volatile solution can quickly take away the residual moisture on the object, so that the object can be spun faster, and the spraying time can be reduced, which can improve the drying efficiency, not only can effectively reduce the use of drying nitrogen, It can also increase productivity. In addition, the rapid removal of moisture on the object can reduce the probability of watermark defects, thereby reducing product defects and improving yield.

According to the above object of the present disclosure, a wet processing apparatus is proposed. The wet processing equipment includes a carrier plate, a deionized water spray device, a multi-fluid spray device, and a drying gas spray device. The carrier tray is configured to carry the object. The deionized water spraying device is arranged above the carrier plate and configured to spray the first deionized water toward the object. The multi-fluid spraying device is disposed above the carrier plate and configured to spray the mixed fluid toward the object. The mixed fluid includes a second deionized water, water vapor, and a volatile fluid. The drying gas spraying device is arranged above the carrier plate, and is configured to spray drying gas toward the object.

According to an embodiment of the present disclosure, the above-mentioned wet processing equipment further includes a multi-fluid generating device, a volatile fluid supplying device, a water vapor generator, and a deionized water supplying device. The multi-fluid generating device is in fluid communication with the multi-fluid spray device and is configured to generate a mixed fluid and supply the mixed fluid to the multi-fluid spray device. A volatile fluid supply device is in fluid communication with the multi-fluid generation device and is configured to supply volatile fluid to the multi-fluid generation device. A water vapor generator is in fluid communication with the multi-fluid generating device and is configured to generate and supply water vapor to the multi-fluid generating device. A deionized water supply is in fluid communication with the multi-fluid generation device and is configured to supply a second deionized water to the multi-fluid generation device.

According to an embodiment of the present disclosure, the above-mentioned volatile fluid is a saturated vapor of a volatile solution. Also, the volatile fluid supply device includes a volatile solution saturated vapor generator and a carrier gas supply device. The volatile solution saturated vapor generator is configured to generate volatile solution saturated vapor. The carrier gas supply is configured to provide nitrogen to carry the saturated vapor of the volatile solution to the multi-fluid generating device.

According to an embodiment of the present disclosure, the above-mentioned carrier gas supply device further includes a temperature controller configured to control the temperature of the nitrogen gas. The above-mentioned deionized water supply device further includes another temperature controller configured to control the temperature of the second deionized water.

According to an embodiment of the present disclosure, the above-mentioned drying gas spraying device is a drying nitrogen spraying device.

According to an embodiment of the present disclosure, the above-mentioned dry gas injection device is a dry nitrogen two-fluid injection device. Moreover, the wet processing equipment further includes a volatile solution saturated vapor generator and a carrier gas supply device. A volatile solution saturated vapor generator is in fluid communication with the drying gas injection device and is configured to generate volatile solution saturated vapor in the volatile fluid. The carrier gas supply is configured to provide dry nitrogen to carry the saturated vapor of the volatile solution to the dry gas injector.

According to an embodiment of the present disclosure, the above-mentioned wet processing equipment further includes a dry nitrogen spray device disposed above the carrier plate and configured to spray another dry nitrogen gas toward the object.

According to an embodiment of the present disclosure, the above-mentioned carrier gas supply device further includes a temperature controller configured to control the temperature of the drying nitrogen gas.

According to an embodiment of the present disclosure, the above-mentioned wet processing equipment further includes an etching solution spraying device disposed above the carrier plate and configured to spray the etching solution toward the object.

According to an embodiment of the present disclosure, the above-mentioned wet processing equipment further includes a clamping device, an air flotation device, a rotating shaft, and a motor. The clamping device is arranged on the carrier plate, and is configured to clamp and fix the object. The air flotation device is arranged on the carrying tray, and is configured to lift the object to separate the object from the carrying tray. The rotating shaft is connected with the carrying plate and is configured to rotate the carrying plate. The motor is connected with the rotating shaft and is configured to drive the rotating shaft.

According to the above objective of the present disclosure, another wet processing method is proposed. In this method, the object is sprayed with first deionized water using a deionized water spray device. Use a multi-fluid spray device to spray mixed fluids on objects. The mixed fluid includes a second deionized water, water vapor, and a volatile fluid. Spray drying gas on the object to dry the object.

According to an embodiment of the present disclosure, the spraying of the first deionized water on the object and the spraying of the mixed fluid on the object are performed in an alternate manner.

According to an embodiment of the present disclosure, the above-mentioned volatile fluid includes a volatile solution and/or a saturated vapor of the volatile solution.

According to an embodiment of the present disclosure, the spraying mixed fluid further includes using a carrier gas to carry the saturated vapor of the volatile solution.

According to an embodiment of the present disclosure, using the carrier gas to carry the saturated vapor of the volatile solution includes controlling the temperature of the carrier gas.

According to an embodiment of the present disclosure, the spraying of the mixed fluid includes controlling the temperature of the second deionized water.

According to an embodiment of the present disclosure, the spraying of the drying gas to the object includes spraying dry nitrogen to the object using a drying nitrogen spraying device.

According to an embodiment of the present disclosure, the spraying of the drying gas to the object further comprises spraying another dry nitrogen gas and a saturated vapor of the volatile solution to the object by using a dry nitrogen two-fluid spraying device. Dry nitrogen sparging and dry nitrogen two-fluid sparging were used in an alternating fashion.

According to an embodiment of the present disclosure, the above-mentioned method further includes spraying the etching solution on the object by using the etching solution spraying device.

According to an embodiment of the present disclosure, the spraying of the etching solution, the spraying of the first deionization, the spraying of the mixed fluid, and the spraying of the drying gas include rotating objects.

Description of drawings

In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

FIG. 1 is an apparatus schematic diagram illustrating a wet processing apparatus according to an embodiment of the present disclosure.

2 is a schematic diagram illustrating a multi-fluid supply system of a wet processing apparatus according to an embodiment of the present disclosure.

FIG. 3 is a schematic diagram illustrating an apparatus of a dry nitrogen two-fluid supply system of a wet processing apparatus according to an embodiment of the present disclosure.

4 is a schematic diagram illustrating the removal of processing liquid and particles remaining on an object according to an embodiment of the present disclosure.

【Description of main component symbols】

100: Wet processing equipment 110: Carrier tray

112: Bearing surface 120: Deionized water spray device

130: Multi-fluid spray device 140: Dry nitrogen spray device

150: Dry nitrogen two-fluid spray device 160: Object

162: Surface 164: Pattern Structure

170: Clamping device 180: Air flotation device

190: shaft 200: motor

210: Etching liquid spray device 300: Multi-fluid supply system

310: Multi-fluid generation device 320: Volatile fluid supply device

322: Volatile solution saturated vapor generator 324: Carrier gas supply device

326: Temperature Controller 330: Steam Generator

340: Deionized water supply device 342: Temperature controller

400: dry nitrogen two-fluid supply system 410: volatile solution saturated steam generator

420: Carrier gas supply 422: Temperature controller

AR: Arrow MF: Mixed Fluid

PC: Particulate PF: Treatment fluid

Detailed ways

The spatial relationship between the two elements described in the present disclosure is not only applicable to the orientation shown in the drawings, but also applicable to orientations not shown in the drawings, such as an upside-down orientation. In addition, the term "connection" or similar terms of two components referred to in the present disclosure is not limited to direct connection between the two, and indirect connection may also be included as required. "First", "second", .

Please refer to FIG. 1 , which is a schematic diagram illustrating a wet processing apparatus according to an embodiment of the present disclosure. The wet processing apparatus 100 can be applied to wet processing of electronic devices in the manufacturing process, such as cleaning, etching, and the like. For example, the wet processing apparatus 100 may be a wafer cleaning apparatus, a wafer etching apparatus, or a wafer etching and cleaning apparatus. In some examples, the wet processing apparatus 100 mainly includes a carrier tray 110, a deionized water spray device 120, a multi-fluid spray device 130, and a drying gas spray device. The drying gas injection device may be, for example, a dry nitrogen injection device 140 or a dry nitrogen two-fluid injection device 150 . In some examples, the wet processing apparatus 100 may include a dry nitrogen injection device 140 , or a dry nitrogen two-fluid injection device 150 , or a dry nitrogen injection device 140 and a dry nitrogen two-fluid injection device 150 .

The carrier tray 110 can be used to carry the object 160 to be wet-processed, such as a wafer. The carrying tray 110 has a carrying surface 112 , and the object 160 is disposed on the carrying surface 112 . In some examples, wet processing apparatus 100 may include gripping device 170 . The clamping device 170 can be disposed on the supporting surface 112 of the supporting tray 110 , and can be used to clamp and fix the object 160 on the supporting surface 112 . For example, the gripping device 170 may be a gripping tip. The wet processing equipment 100 may also have different fixing devices for fixing the object 160 . For example, an electrostatic chuck can be used to fix the object 160 on the bearing surface 112 of the bearing tray 110 .

The wet processing equipment 100 may optionally include an air flotation device 180 . The air flotation device 180 can be installed in the carrier plate 110, and the air flotation device 180 can spray gas toward the carrier surface 112 to lift the object 160, so that the object 160 is separated from the carrier surface 112 of the carrier plate 110 without direct Contact the bearing surface 112 .

In some examples, wet processing apparatus 100 is a rotatable processing apparatus. In such an example, the wet processing apparatus 100 may further include a rotating shaft 190 and a motor 200 . The rotating shaft 190 is connected to the carrying plate 110 and can rotate the carrying plate 110 . The motor 200 is connected to the rotating shaft 190 and can drive the rotating shaft 190 to rotate, thereby driving the carrying plate 110 to rotate.

The deionized water spraying device 120 is disposed above the carrying surface 112 of the carrying tray 110 and on the object 160 carried by the carrying tray 110 . The deionized water spraying device 120 can spray the first deionized water on the surface 162 of the object 160 to clean the object 160 .

The multi-fluid spraying device 130 is also disposed above the carrying surface 112 of the carrying tray 110 and above the object 160 . The multi-fluid spray device 130 may be adjacent to the deionized water spray device 120, for example. The multi-fluid spray device 130 may spray the mixed fluid toward the surface 162 of the object 160 . This mixed fluid contains a mixture of multiple fluids. In some examples, the mixed fluid includes a second deionized water, water vapor, and a volatile fluid. The volatile fluid may comprise a volatile solution and/or a saturated vapor of a volatile solution. For example, the volatile solution can be isopropyl alcohol (IPA). The deionized water spray device 120 and the multi-fluid spray device 130 may operate alternately to spray the deionized water and the mixed fluid on the surface 162 of the object 160 in turn.

Please refer first to FIG. 4 , which is a schematic diagram of removing the processing liquid and particles remaining on the object according to an embodiment of the present disclosure. In some examples, the surface 162 of the object 160 is provided with a pattern structure 164 of many elements. The acidic or alkaline processing liquid PF and the particles PC remain on the surface 162 of the object 160 and may fall between the pattern structures 164 . The multi-fluid spraying device 130 can spray small molecules in the form of a mist of mixed fluids. The thermal effect of the water vapor in the mixed fluid MF can generate cavitation. The cavitation phenomenon is a vibration with a certain degree of frequency, for example, 10KHz to 1MHz, due to heat exchange when pure water at normal temperature and water vapor at high temperature are mixed. Such vibrations can provide energy to decompose water molecules into hydrogen ions and hydroxide ions, and the high energy generated when unstable hydrogen ions and hydroxide ions return to water molecules can be converted into mechanical shocks, whereby the water molecules It can be quickly combined with the acidic or alkaline treatment liquid PF and the particles PC remaining on the surface 162 of the object 160 . The multi-fluid spraying device 130 sprays mixed fluid mist-like small molecules, which can not only reduce the consumption of deionized water, but also improve the cleaning effect.

In addition, the volatilization of the volatile fluid in the mixed fluid MF sprayed by the multi-fluid spraying device 130, such as the volatile solution and/or the saturated vapor of the volatile solution, can provide additional diffusion and movement of the residual treatment fluid PF and particulate PC. kinetic energy. The arrow AR in FIG. 4 represents the moving direction of the saturated vapor of the volatile solution in the mixed fluid MF. The saturated vapor of the volatile solution provides kinetic energy for movement and diffusion to the treatment liquid PF and the particles PC during the volatilization process. Thereby, the processing liquid PF and the particles PC remaining on the object 160 can be quickly carried away along with the mixed fluid MF. Therefore, the amount of deionized water used can be further reduced, and the removal efficiency of residual treatment liquid PF and particulate PC can be improved. Since the removal effect of the residual processing liquid PF and the particulate PC is improved, the multi-fluid spraying device 130 can effectively remove the residual processing liquid PF and the particulate PC without using too much spraying force. Therefore, the impact on the pattern structure 164 on the surface 162 of the object 160 can be reduced, for example, the impact on the element pattern structure of the wafer can be reduced, the damage of the object 160 can be avoided, the defects of the object 160 can be reduced, and the product can be effectively improved Yield.

Please refer to FIG. 1 and FIG. 2 at the same time, wherein FIG. 2 is a schematic diagram illustrating a multi-fluid supply system of a wet processing apparatus according to an embodiment of the present disclosure. In some examples, the wet processing facility 100 may further include a multi-fluid supply system 300 . The multi-fluid supply system 300 can be in fluid communication with the multi-fluid spray device 130 and can provide a mixed fluid of the plurality of fluids to the multi-fluid spray device 130 . In some examples, the multi-fluid supply system 300 may essentially include a multi-fluid generation device 310 , a volatile fluid supply device 320 , a water vapor generator 330 , and a deionized water supply device 340 .

The multi-fluid generating device 310 may be in fluid communication with the multi-fluid spraying device 130 . The multi-fluid generating device 310 may generate the mixed fluid and supply the generated mixed fluid to the multi-fluid spraying device 130 . The multi-fluid generating device 310 can generate a second deionized water, a volatile fluid, and a mixed fluid with water vapor.

The volatile fluid supply device 320 can be in fluid communication with the multi-fluid generating device 310 and can supply the volatile fluid to the multi-fluid generating device 310 . In some demonstrative examples, the volatile fluid supplied by the volatile fluid supply device 320 is a saturated vapor of a volatile solution. As shown in FIG. 2 , in such an example, the volatile fluid supply 320 may include, for example, a volatile solution saturated vapor generator 322 and a carrier gas supply 324 . The volatile solution saturated vapor generator 322 may be in fluid communication with the multi-fluid generating device 310 . The volatile solution saturated vapor generator 322 may generate the volatile solution saturated vapor and supply the volatile solution saturated vapor to the multi-fluid generating device 310 .

The carrier gas supply 324 may then be in fluid communication with the volatile solution saturated vapor generator 322 . The carrier gas supply device 324 may provide a carrier gas to the volatile solution saturated vapor generator 322 , so as to utilize the carrier gas to carry the volatile solution saturated vapor generated by the volatile solution saturated vapor generator 322 to the multi-fluid generating device 310 . The carrier gas can be, for example, nitrogen. In some demonstrative examples, carrier gas supply 324 may further include temperature controller 326 . The temperature controller 326 is configured to control the temperature of a carrier gas, such as nitrogen, supplied to the volatile solution saturated vapor generator 322 . The configuration of the temperature controller 326 can set various temperatures of the carrier gas, which can expand the applicability of the wet processing apparatus 100, such as the application of high temperature process.

In other examples, the volatile fluid supplied by the volatile fluid supply device 320 is a volatile solution. In such an example, the volatile solution provided by the volatile fluid supply device 320 can flow directly into the multi-fluid generating device 310 via the pipeline, so the carrier gas supply device 324 is not required. The volatile fluid supply device 320 may optionally be configured with a temperature controller (not shown) to control the temperature of the supplied volatile solution.

The steam generator 330 may likewise be in fluid communication with the multi-fluid generating device 310 . The water vapor generator 330 may generate water vapor and supply the water vapor to the multi-fluid generating device 310 .

Deionized water supply 340 may be in fluid communication with multi-fluid generation device 310 . Thereby, the deionized water supply device 340 can supply the second deionized water to the multi-fluid generating device 310 . In some exemplary examples, the deionized water supply device 340 may further include a temperature controller 342 to control the temperature of the second deionized water supplied to the multi-fluid generating device 310 , so as to expand the applicability of the wet processing apparatus 100 .

In some examples, please continue to refer to FIG. 1 , the drying gas spraying device, such as the drying nitrogen spraying device 140 and/or the dry nitrogen two-fluid spraying device 150 , is disposed above the carrier plate 110 and is configured to face the surface of the carrier surface 112 . The surface 162 of the object 160 is sprayed with drying gas to remove the residual liquid on the object 160 to dry the object 160 . The dry nitrogen spray device 140 can spray dry nitrogen toward the object 160 . The dry nitrogen two-fluid spraying device 150 can spray dry nitrogen and volatile solution saturated vapor toward the surface 162 of the object 160 , that is, the drying gas at this time includes dry nitrogen and volatile solution saturated vapor. When the wet processing equipment 100 includes both the dry nitrogen spray device 140 and the dry nitrogen two-fluid spray device 150 , the dry nitrogen spray device 140 and the dry nitrogen two-fluid spray device 150 can spray the drying gas on the surface 162 of the object 160 in turn.

Please refer to FIG. 1 and FIG. 3 at the same time, wherein FIG. 3 is a schematic diagram illustrating an apparatus of a dry nitrogen two-fluid supply system of a wet processing apparatus according to an embodiment of the present disclosure. In an example in which the wet processing apparatus 100 at least includes the dry nitrogen two-fluid spraying device 150 , the wet processing apparatus 100 may further include a dry nitrogen two-fluid supply system 400 . The dry nitrogen two-fluid supply system 400 can be in fluid communication with the dry nitrogen two-fluid spray device 150 and can provide two drying fluids to the dry nitrogen two-fluid spray device 150 . In some examples, the dry nitrogen two-fluid supply system 400 may mainly include a volatile solution saturated vapor generator 410 and a carrier gas supply device 420 .

The volatile solution saturated vapor generator 410 may be in fluid communication with the dry nitrogen two-fluid injection device 150 . The volatile solution saturated vapor generator 410 may generate the volatile solution saturated vapor, and supply the volatile solution saturated vapor to the dry nitrogen two-fluid spray device 150 .

The carrier gas supply 420 may be in fluid communication with the volatile solution saturated vapor generator 410 . The carrier gas supply device 420 may provide the carrier gas to the volatile solution saturated vapor generator 410 . Thereby, the saturated vapor of the volatile solution generated by the saturated vapor generator 410 of the volatile solution can be carried to the dry nitrogen two-fluid spraying device 150 by the carrier gas. The carrier gas can be, for example, dry nitrogen. In some demonstrative examples, carrier gas supply device 420 may further include temperature controller 422 . The temperature controller 422 is configured to control the temperature of the carrier gas, eg, dry nitrogen, supplied to the volatile solution saturated vapor generator 410 .

The dry nitrogen two-fluid spray device 150 can spray dry nitrogen and saturated vapor of the volatile solution. The volatilization of the saturated vapor of the volatile liquid can quickly take away the moisture remaining on the surface 162 of the object 160 , so that the drying process time can be reduced, and the usage amount of drying nitrogen can be reduced. In addition, since the two fluids of drying nitrogen and volatile liquid saturated vapor can spin dry the moisture on the surface 162 of the object 160 more quickly, the drying efficiency can be greatly improved, and the formation of watermark defects on the surface 162 of the object 160 can be reduced. probability, thereby reducing product defects and improving yield, and increasing yield.

In some examples, as shown in FIG. 1 , the wet processing equipment 100 may be a wet etching processing equipment, and further includes an etching solution spraying device 210 . The etchant spraying device 210 is also disposed above the bearing surface 112 of the carrier plate 110 , and can spray the etchant toward the surface 162 of the object 160 . The etching solution can be, for example, an acidic solution or an alkaline solution. In some demonstrative examples, wet processing apparatus 100 is a single wafer spin wet etch apparatus.

In some examples, the wet processing apparatus 100 may be utilized to wet clean the article 160 . Referring to FIG. 1 , in such an example, the first deionized water can be sprayed on the object 160 by the deionized water spray device 120 , and the mixed fluid can be sprayed on the object 160 by the multi-fluid spray device 130 . The mixed fluid may include a second deionized water, water vapor, and a volatile fluid. The volatile fluid may, for example, comprise a volatile solution and/or a saturated vapor of a volatile solution. Alternatively, the deionized water spraying device 120 and the multi-fluid spraying device 130 may be used to spray the first deionized water and the mixed fluid alternately on the object 160 . When spraying the first deionized and mixed fluid on the object 160 , the motor 200 can be used to drive the rotating shaft 190 to drive the carrier plate 110 and the object 160 on it to rotate.

2 , when the mixed fluid is sprayed on the surface 162 of the object 160 by the multi-fluid spraying device 130 , the carrier gas supply device 324 can be used to provide a carrier gas, and the carrier gas can carry the saturated vapor of the volatile solution to the multi-fluid generating device 310 . The multi-fluid generating device 310 mixes the saturated vapor of the volatile solution, the water vapor generated by the water vapor generator 330, and the second deionized water supplied by the deionized water supply device 340, and then supplies the mixed fluid to the multi-fluid spraying device 130. In addition, the temperature controller 326 of the carrier gas supply device 324 can be used to control the temperature of the provided carrier gas, and/or the temperature controller 342 of the deionized water supply device 340 can be used to control the temperature of the provided carrier gas according to the cleaning process requirements. The temperature of the second deionized water to provide the desired temperature of the mixed fluid.

Next, a drying gas spraying device, such as the drying nitrogen spraying device 140 and/or the drying nitrogen two-fluid spraying device 150 , can be used to spray the drying gas on the object 160 to dry the object 160 . The drying gas sprayed by the dry nitrogen spraying device 140 is dry nitrogen, and the drying gas sprayed by the dry nitrogen two-fluid spraying device 150 is a two-fluid composed of dry nitrogen and saturated vapor of a volatile solution. In an example where the wet processing equipment 100 includes both the dry nitrogen spray device 140 and the dry nitrogen two-fluid spray device 150, the dry nitrogen spray device 140 and the dry nitrogen two-fluid spray device 150 can be used to spray dry nitrogen on the object 160 in an alternate manner. , as well as dry nitrogen and saturated vapors of volatile solutions. When the drying gas is sprayed on the object 160 , the rotating shaft 190 can be used to drive the carrier plate 110 and the object 160 thereon to rotate, so as to accelerate the drying of the object 160 .

Please also refer to FIG. 3 , when the dry nitrogen two-fluid spraying device 150 is used to spray the dry nitrogen two-fluid toward the surface 162 of the object 160 , the volatile solution saturated steam generator 410 can be used to generate the volatile solution saturated steam, and the carrier gas can be used to supply Apparatus 420 provides dry nitrogen as a carrier gas to deliver the saturated vapor of the volatile solution to dry nitrogen two-fluid injection apparatus 150 . Likewise, according to the requirements of the drying process, the temperature controller 422 of the carrier gas supply device 420 can be used to control the temperature of the provided carrier gas, so as to provide the two fluids at the required temperature.

In an example in which the wet processing equipment 100 includes the etching solution spraying device 210 , the wet processing equipment 100 is a wet etching processing equipment. The surface 162 of the object 160 may be etched by spraying the etching solution on the surface 162 of the object 160 using the etching solution spraying device 210 . When spraying the etching solution on the object 160 , the rotating shaft 190 can be used to drive the carrier plate 110 and the object 160 on it to rotate. After each etching process, the wet processing apparatus 100 may be used to perform cleaning processing and subsequent drying processing on the object 160 .

The following uses an exemplary example to describe the wet etching process, cleaning process, and drying process of the object 160 by the wet processing apparatus 100 . Referring to FIG. 1 again, when the object 160 is loaded onto the carrier tray 110 by the conveying mechanism (not shown), the clamping device 170 is opened to receive the object 160 put down by the conveying mechanism, and then the clamping device 170 is closed to clamp The object 160 is tightened, and the object 160 is fixed on the bearing surface 112 of the bearing tray 110 . Next, a wet etching process may be performed on the object 160 , so as to use the motor 200 to drive the rotating shaft 190 to rotate, thereby further driving the carrier plate 110 and the object 160 fixed thereon to rotate. Next, the carrier plate 110 can be lifted and lowered to an appropriate position according to the recovery position of the etching solution, and then the etching solution is sprayed on the surface 162 of the object 160 by the etching solution spraying device 210 to perform the etching of the object 160 . At this time, the etching solution is thrown out of the object 160 due to the centrifugal force generated by the rotation of the object 160 , and falls into the etching solution recovery device around the carrier plate 110 . After the set number of etching seconds, the spraying of the etching solution is stopped, and the carrier plate 110 is moved up and down to the cleaning position to remove the etching solution and particles remaining on the object 160 .

During the cleaning process, the deionized water spraying device 120 and the multi-fluid spraying device 130 may alternately be used to spray the deionized water and the mixed fluid on the object 160 in turn. The spraying time of the deionized water spraying device 120 and the multi-fluid spraying device 130 can be set according to the requirements of the process.

After the cleaning process is completed, the dry nitrogen spray device 140 or the dry nitrogen two-fluid spray device 150 can be used alone, or the dry nitrogen spray device 140 and the dry nitrogen two-fluid spray device 150 can be used for drying according to the process requirements. In an alternate manner, the dry nitrogen spray device 140 and the dry nitrogen two-fluid spray device 150 can be used to spray the dry nitrogen and the dry nitrogen two-fluid to the object 160 in turn. Similarly, the spraying time of the drying nitrogen spraying device 140 and the drying nitrogen two-fluid spraying device 150 can be set according to the requirements of the process.

After the drying process is completed, the carrier tray 110 is lifted up and down to the transfer position and then stops rotating. The holding device 170 is opened, and the conveying device takes out the wet-processed object 160 , and places the next wet-processed object 160 , and repeats the above steps until all the objects 160 are processed.

As can be seen from the above-mentioned embodiments, one advantage of the present disclosure is that the present disclosure can spray deionized water and mist-like small molecules including deionized water, water vapor, and a mixed fluid of volatile fluids on objects in turn. The small molecules of water vapor can reduce the use of deionized water in wet processing and can improve the cleaning effect. In addition, the volatilization of the volatile fluid can provide the diffusion and movement kinetic energy of the processing liquid and particles remaining on the object, which can shorten the cleaning time, further reduce the use of deionized water, improve the removal efficiency, and avoid damage to the object. This can reduce product defects and improve yield.

Another advantage of the present disclosure is that the present disclosure can spray objects with two fluids including dry nitrogen and saturated vapor of a volatile solution. The volatilization of the saturated vapor of the volatile solution can quickly take away the residual moisture on the object, so that the object can be spun faster, and the spraying time can be reduced, which can improve the drying efficiency, not only can effectively reduce the use of drying nitrogen, It can also increase productivity. In addition, the moisture on the object is quickly taken away, which can reduce the formation probability of watermark defects, thereby reducing product defects and improving yield.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Technical personnel, within the scope of the technical solution of the present invention, can make some changes or modifications to equivalent examples of equivalent changes by using the technical content disclosed above, but any content that does not depart from the technical solution of the present invention, according to the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence of the invention still fall within the scope of the technical solutions of the present invention.

Claims (20)

1. A wet processing apparatus, comprising:

the bearing disc is configured to bear an object;

the deionized water spraying device is arranged above the bearing disc and is configured to spray first deionized water towards the object;

a multi-fluid spraying device disposed above the carrier tray and configured to spray a mixed fluid toward the object, wherein the mixed fluid comprises a second deionized water, water vapor, and a volatile fluid; and

the drying gas injection device is arranged above the bearing disc and is configured to inject drying gas towards the object.

2. The wet processing apparatus of claim 1, further comprising:

a multi-fluid generating device in fluid communication with the multi-fluid spraying device and configured to generate the mixed fluid and supply the mixed fluid to the multi-fluid spraying device;

a volatile fluid supply device in fluid communication with the multi-fluid generating device and configured to supply the volatile fluid to the multi-fluid generating device;

a steam generator in fluid communication with the multi-fluid generating device and configured to generate the steam and supply the steam to the multi-fluid generating device; and

a deionized water supply in fluid communication with the multi-fluid generating device and configured to supply the second deionized water to the multi-fluid generating device.

3. The wet processing apparatus of claim 2, wherein the volatile fluid is a volatile solution saturated vapor, and the volatile fluid supply device comprises:

a volatile solution saturated vapor generator configured to generate the volatile solution saturated vapor; and

a carrier gas supply configured to provide nitrogen to carry the saturated vapor of the volatile solution to the multi-fluid generating device.

4. A wet treatment apparatus as claimed in claim 3, wherein:

the carrier gas supply device further comprises a temperature controller configured to control the temperature of the nitrogen gas; and

the deionized water supply device further comprises another temperature controller configured to control the temperature of the second deionized water.

5. A wet treatment apparatus according to claim 1, wherein the dry gas injection means is a dry nitrogen gas injection means.

6. The wet processing apparatus of claim 1, wherein the dry gas injection device is a dry nitrogen two-fluid injection device, and the wet processing apparatus further comprises:

a volatile solution saturated vapor generator in fluid communication with the dry gas injection device and configured to generate volatile solution saturated vapor in the volatile fluid; and

a carrier gas supply configured to provide dry nitrogen gas to carry the volatile solution saturated vapor to the dry gas injection device.

7. The wet processing apparatus of claim 6, further comprising a dry nitrogen gas spraying device disposed above the susceptor and configured to spray another dry nitrogen gas toward the object.

8. The wet processing apparatus of claim 6, wherein the carrier gas supply device further comprises a temperature controller configured to control the temperature of the dry nitrogen gas.

9. The wet processing apparatus of claim 1, further comprising an etching solution spraying device disposed above the susceptor and configured to spray the etching solution toward the object.

10. The wet processing apparatus of claim 1, further comprising:

the clamping device is arranged on the bearing disc and is configured to clamp and fix the object;

the air floating device is arranged on the bearing disc and is configured to lift the object to separate the object from the bearing disc;

a rotation shaft connected to the carrier tray and configured to rotate the carrier tray; and

a motor connected to the shaft and configured to drive the shaft.

11. A wet processing method, comprising:

spraying first deionized water on the object by using a deionized water spraying device;

spraying a mixed fluid on the object by using a multi-fluid spraying device, wherein the mixed fluid comprises second deionized water, water vapor and a volatile fluid; and

spraying dry gas to the object to dry the object.

12. The method of claim 11, wherein spraying the first deionized water onto the object and spraying the mixed fluid onto the object are performed in an alternating manner.

13. The method of claim 11, wherein the volatile fluid comprises a volatile solution and/or a volatile solution saturated vapor.

14. The method of claim 13, wherein spraying the mixed fluid further comprises using a carrier gas to carry the saturated vapor of the volatile solution.

15. The method of claim 14, wherein using the carrier gas to carry the volatile solution saturated vapor comprises controlling a temperature of the carrier gas.

16. The method of claim 11, wherein spraying the mixed fluid comprises controlling a temperature of the second deionized water.

17. The method of claim 11, wherein injecting the dry gas against the object comprises injecting dry nitrogen gas against the object using a dry nitrogen gas injection device.

18. The method of claim 17, wherein injecting the dry gas against the object further comprises injecting another dry nitrogen gas and a volatile solution saturated vapor against the object using a dry nitrogen two-fluid injection device, wherein the dry nitrogen gas injection device and the dry nitrogen two-fluid injection device are used in an alternating manner.

19. The method of claim 11, further comprising spraying an etching solution toward the object using an etching solution spraying device.

20. The method of claim 19, wherein spraying the etching solution, spraying the first deionization solution, spraying the mixed fluid, and spraying the dry gas comprise rotating the object.

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