CN114952641B - Modularized distributed plane millstone - Google Patents
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- CN114952641B CN114952641B CN202210682426.4A CN202210682426A CN114952641B CN 114952641 B CN114952641 B CN 114952641B CN 202210682426 A CN202210682426 A CN 202210682426A CN 114952641 B CN114952641 B CN 114952641B
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- 238000003491 array Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 abstract description 9
- 239000000463 material Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 11
- 238000013461 design Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000010432 diamond Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
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Abstract
Description
技术领域technical field
本发明属于平面磨盘领域,尤其涉及一种模块化分布式平面磨盘。The invention belongs to the field of flat grinding discs, in particular to a modular distributed flat grinding disc.
背景技术Background technique
研磨抛光工艺在半导体材料加工中的应用十分广泛。随着集成电路技术的进一步发展,以及元器件集成度的增加,要求元器件中晶片的表面平整度达到纳米级。随着晶片尺寸不断增加,对作为影响研磨抛光加工质量、面形精度、材料去除率及材料去除稳定性的重要因素的研磨盘提出了更高要求。Grinding and polishing processes are widely used in the processing of semiconductor materials. With the further development of integrated circuit technology and the increase in the integration of components, it is required that the surface flatness of the wafer in the components reaches the nanometer level. As the wafer size continues to increase, higher requirements are put forward for the grinding disc, which is an important factor affecting the grinding and polishing process quality, surface accuracy, material removal rate and material removal stability.
现有常规金刚石研磨盘,由于金刚石的随机、无序排列,使磨盘在研磨过程中极易出现磨削液流动受阻,利用率不高,排屑困难的情况,造成材料去除率低下,材料去除稳定性差,使工件表面产生二次损伤问题,表面质量低于预期。Due to the random and disordered arrangement of diamonds in the existing conventional diamond grinding discs, the grinding fluid flow is easily blocked during the grinding process, the utilization rate is not high, and chip removal is difficult, resulting in low material removal rate and material removal. The stability is poor, causing secondary damage to the surface of the workpiece, and the surface quality is lower than expected.
现今研究主要针对不同设计的磨削表面,以获得较高的工件表面质量,但这些设计往往基于摩擦学滞后的工程经验,磨盘的设计原则不明确,结构优化不系统,导致在工作效率和研磨质量方面的性能改善有限。Today's research mainly focuses on grinding surfaces with different designs to obtain higher workpiece surface quality, but these designs are often based on engineering experience of tribological lag. Quality-wise performance improvements are limited.
发明内容Contents of the invention
本发明的目的在于提供一种模块化分布式平面磨盘,以解决现有磨盘由于磨粒无序、随机排列造成的加工过程中材料去除率低下,材料去除稳定性差,冷却液利用率低,冷却液流动流畅性差的问题。The purpose of the present invention is to provide a modular distributed flat grinding disc to solve the problem of low material removal rate, poor material removal stability, low cooling fluid utilization rate and cooling The problem of poor fluid flow.
一种模块化分布式平面磨盘,包括磨盘本体以及在磨盘本体端面开设的渐开线沟槽,磨盘本体的端面上设置大齿模块分布区域和小齿模块分布区域,大齿模块分布区域和小齿模块分布区域均沿渐开线沟槽设置,大齿模块分布区域两侧的渐开线沟槽之间的宽度大于小齿模块分布区域两侧的渐开线沟槽之间的宽度;大齿模块分布区域沿磨盘本体圆周方向阵列设置多个,相邻两个大齿模块分布区域之间设置多个小齿模块分布区域,大齿模块分布区域和小齿模块分布区域内均设置齿型模块;渐开线沟槽的曲线参数方程为:A modular distributed flat grinding disc, comprising a grinding disc body and an involute groove opened on the end face of the grinding disc body, a large tooth module distribution area and a small tooth module distribution area are set on the end face of the grinding disc body, the large tooth module distribution area and the small tooth module distribution area The tooth module distribution area is set along the involute groove, and the width between the involute grooves on both sides of the large tooth module distribution area is greater than the width between the small tooth module distribution area; The tooth module distribution area is arranged in multiple arrays along the circumferential direction of the grinding disc body, and a plurality of small tooth module distribution areas are set between two adjacent large tooth module distribution areas. module; the curve parameter equation of the involute groove is:
t的取值范围为0~2Π。 The value range of t is 0~2Π.
优选的,渐开线沟槽的深度为3mm,宽度为2mm。Preferably, the involute groove has a depth of 3mm and a width of 2mm.
优选的,齿型模块包括宽度相同的齿星和齿槽。Preferably, the tooth profile module comprises a tooth star and a tooth groove having the same width.
优选的,齿星和齿槽深度均为2mm。Preferably, the depths of the tooth star and the tooth groove are both 2mm.
优选的,大齿模块分布区域和小齿模块分布区域沿磨盘本体径向均分为内圈、中圈、外圈,同一圈内大齿模块分布区域内的齿型模块的结构尺寸为小齿模块分布区域内的齿型模块结构尺寸的两倍。Preferably, the large-tooth module distribution area and the small-tooth module distribution area are divided into inner ring, middle ring, and outer ring along the radial direction of the grinding disc body, and the structural size of the tooth-type modules in the large-tooth module distribution area in the same ring is small tooth Twice the size of the toothed module structure in the module distribution area.
优选的,磨盘本体上沿径向间隔分布有多个圆沟槽,齿型模块沿磨盘本体径向方向设置于两个圆沟槽之间。Preferably, a plurality of circular grooves are arranged at intervals along the radial direction on the grinding disc body, and the tooth-shaped module is arranged between the two circular grooves along the radial direction of the grinding disc body.
优选的,圆沟槽的深度为3mm,宽度为2mm。Preferably, the circular groove has a depth of 3mm and a width of 2mm.
优选的,大齿模块分布区域中沿磨盘本体径向方向由内到外各圈中的齿型模块宽度依次增加。Preferably, in the distribution area of the large tooth modules, the width of the tooth-type modules in each ring increases sequentially from the inner to the outer along the radial direction of the grinding disc body.
优选的,齿星的截面为U形,齿槽的截面为等腰三角形,齿星的深度和齿槽的深度均为2mm。Preferably, the cross section of the tooth star is U-shaped, the cross section of the tooth groove is an isosceles triangle, and the depth of the tooth star and the depth of the tooth groove are both 2 mm.
优选的,同一齿模块分布区域沿径向方向上相邻两个齿型模块相反设置。Preferably, the distribution area of the same tooth module is arranged oppositely to two adjacent tooth modules in the radial direction.
与现有技术相比,本发明具有以下有益的技术效果:Compared with the prior art, the present invention has the following beneficial technical effects:
本发明一种模块化分布式平面磨盘,通过在磨盘本体的端面上设置大齿模块分布区域和小齿模块分布区域,大齿模块分布区域和小齿模块分布区域均沿渐开线沟槽设置,大齿模块分布区域两侧的渐开线沟槽之间的宽度大于小齿模块分布区域两侧的渐开线沟槽之间的宽度;大齿模块分布区域沿磨盘本体圆周方向阵列设置多个,相邻两个大齿模块分布区域之间设置多个小齿模块分布区域,大齿模块分布区域和小齿模块分布区域内均设置齿型模块;通过在磨盘需上采用沟槽结构同时结合齿型模块,进行了磨削表面结构优化,有效避免切屑对工件表面的二次划伤,减少磨削液及磨屑的流动、排出受阻问题,进而获得较高的表面质量。The present invention is a modular distributed flat grinding disc. By setting the large tooth module distribution area and the small tooth module distribution area on the end surface of the grinding disc body, the large tooth module distribution area and the small tooth module distribution area are arranged along the involute groove , the width between the involute grooves on both sides of the distribution area of the large tooth module is greater than the width between the involute grooves on both sides of the distribution area of the small tooth module; Multiple small tooth module distribution areas are set between two adjacent large tooth module distribution areas, and tooth type modules are set in both the large tooth module distribution area and the small tooth module distribution area; Combined with the tooth profile module, the grinding surface structure is optimized to effectively avoid secondary scratches on the workpiece surface by chips, reduce the flow and discharge of grinding fluid and grinding chips, and obtain higher surface quality.
进一步的,发明渐开线沟槽、圆沟槽的深度均为3mm,宽度均为2mm,以提升磨屑的排出效率及磨削液的利用率、流动性,减少因磨削液分布不均或磨屑残留造成的二次损伤问题。Further, the depth of the involute groove and the circular groove are both 3mm and the width is 2mm, so as to improve the discharge efficiency of grinding debris, the utilization rate and fluidity of grinding fluid, and reduce the uneven distribution of grinding fluid. Or secondary damage caused by residual wear debris.
进一步的,将同一齿模块分布区域沿径向方向上相邻两个齿型模块相反设置,以进一步提升磨削过程中的材料去除率。Further, the distribution area of the same tooth module is arranged oppositely to two adjacent tooth modules in the radial direction, so as to further increase the material removal rate in the grinding process.
本发明通过渐开线式沟槽及同心圆式沟槽设计提升了冷却液的利用率及磨屑的排出效率,减少了磨削过程中的二次损伤问题;通过大小齿模块分布区域设计,优化了磨削过程中的材料去除稳定性,有效地提高了研磨质量。The present invention improves the utilization rate of coolant and the discharge efficiency of grinding debris through the design of involute grooves and concentric grooves, and reduces the secondary damage problem in the grinding process; through the design of the distribution area of the large and small tooth modules, The stability of material removal during the grinding process is optimized, effectively improving the grinding quality.
附图说明Description of drawings
图1为本发明实施例中磨盘本体主视图。Fig. 1 is a front view of the main body of the grinding disc in the embodiment of the present invention.
图2为本发明实施例中大齿模块分布区域和小齿模块分布区域结构示意图。Fig. 2 is a schematic structural diagram of the distribution area of the large-tooth module and the distribution area of the small-tooth module in the embodiment of the present invention.
图3为本发明实施例中大齿模块分布区域和小齿模块分布区域间隔设置结构示意图。Fig. 3 is a schematic diagram of the arrangement of the distribution area of the large tooth module and the distribution area of the small tooth module at intervals in the embodiment of the present invention.
图4为本发明实施例中大齿模块分布区域间隔分布结构示意图。Fig. 4 is a schematic diagram of the interval distribution structure of the large tooth module distribution area in the embodiment of the present invention.
图5为本发明实施例中齿星和齿槽结构示意图。Fig. 5 is a schematic diagram of the structure of the tooth star and the tooth groove in the embodiment of the present invention.
图6为本发明实施例中齿型模块结构示意图。Fig. 6 is a schematic structural diagram of a toothed module in an embodiment of the present invention.
图中标记说明:大齿模块分布区域1,小齿模块分布区域2,齿星3,齿槽4,渐开线沟槽5,内圈6,中圈7,外圈8,同心圆沟槽9,齿型模块10,区域旋转角11。Explanation of marks in the figure: large tooth module distribution area 1, small tooth module distribution area 2, tooth star 3, tooth groove 4, involute groove 5, inner ring 6, middle ring 7, outer ring 8, concentric circular grooves 9, tooth profile module 10, area rotation angle 11.
具体实施方式Detailed ways
为了使本技术领域的人员更好地理解本发明方案,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分的实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本发明保护的范围。In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
如图1所示,一种模块化分布式平面磨盘,包括磨盘本体,磨盘本体的端面上设置大齿模块分布区域1和小齿模块分布区域2,大齿模块分布区域1和小齿模块分布区域2均沿渐开线沟槽5设置,大齿模块分布区域1两侧的渐开线沟槽之间的宽度大于小齿模块分布区域2两侧的渐开线沟槽之间的宽度;大齿模块分布区域1沿磨盘本体圆周方向阵列设置多个,相邻两个大齿模块分布区域1之间设置多个小齿模块分布区域2,大齿模块分布区域1和小齿模块分布区域2内均设置齿型模块10;渐开线沟槽5的曲线参数方程为:As shown in Figure 1, a modular distributed flat grinding disc includes a grinding disc body, the end face of the grinding disc body is provided with a large tooth module distribution area 1 and a small tooth module distribution area 2, and a large tooth module distribution area 1 and a small tooth module distribution area Areas 2 are all arranged along the involute grooves 5, and the width between the involute grooves on both sides of the large tooth module distribution area 1 is greater than the width between the involute grooves on both sides of the small tooth module distribution area 2; The large tooth module distribution area 1 is arranged in multiple arrays along the circumferential direction of the grinding disc body, and a plurality of small tooth module distribution areas 2 are arranged between two adjacent large tooth module distribution areas 1, and the large tooth module distribution area 1 and the small tooth module distribution area 2 are equipped with a tooth profile module 10; the curve parameter equation of the involute groove 5 is:
t的取值范围为0~2Π, The value range of t is 0~2Π,
磨盘本体沿其轴向方向由基体层和工作层层叠设置,大齿模块分布区域1和小齿模块分布区域2设置于工作层上;大齿模块分布区域1和小齿模块分布区域2内的齿型模块尺寸不同,齿型模块呈模块化单元排布于大齿模块分布区域1和小齿模块分布区域2内。The body of the grinding disc is stacked by a base layer and a working layer along its axial direction, and the large tooth module distribution area 1 and the small tooth module distribution area 2 are arranged on the working layer; the large tooth module distribution area 1 and the small tooth module distribution area 2 The tooth-shaped modules have different sizes, and the tooth-shaped modules are arranged in modular units in the distribution area 1 of the large-tooth module and the distribution area 2 of the small-tooth module.
每个大齿模块分布区域1和每个小齿模块分布区域2均以磨盘本体轴心为圆心,旋转角为60度,组成一个完整模块分布区域。Each large-tooth module distribution area 1 and each small-tooth module distribution area 2 are centered on the axis of the grinding disc body, and the rotation angle is 60 degrees, forming a complete module distribution area.
渐开线沟槽5的深度为3mm,宽度为2mm;以磨盘本体轴心为圆心旋转对称分布有六个大齿模块分布区域1,相邻两个大齿模块分布区域1之间设置多个小齿模块分布区域2。The involute groove 5 has a depth of 3 mm and a width of 2 mm; six large-tooth module distribution areas 1 are distributed rotationally symmetrically around the axis of the grinding disc body, and multiple large-tooth module distribution areas 1 are arranged between two adjacent large-tooth module distribution areas 1 Small teeth module distribution area 2.
设置于大齿模块分布区域1和小齿模块分布区域2内的齿型模块包括宽度相同的齿星3和齿槽4,各齿型模块中的齿星3和齿槽4深度均为2mm。The tooth-shaped modules arranged in the large-tooth module distribution area 1 and the small-tooth module distribution area 2 include tooth stars 3 and tooth grooves 4 with the same width, and the depths of the tooth stars 3 and tooth grooves 4 in each tooth-shaped module are both 2mm.
每个大齿模块分布区域1所占圆弧角为10°,由工作层内边界向外边界依渐开线沟槽5走向排布,各大齿模块单元的齿星3和齿槽4与同心圆沟槽9相连通;所述小齿模块分布区域2整体所占圆弧角为50°,与大齿模块分布区域1间隔排布,以提升磨削加工过程的材料去除均匀性。The arc angle occupied by the distribution area 1 of each large tooth module is 10°, and it is arranged along the direction of the involute groove 5 from the inner boundary of the working layer to the outer boundary. The tooth star 3 and the tooth groove 4 of each large tooth module unit The concentric circular grooves 9 are connected; the small tooth module distribution area 2 occupies an overall arc angle of 50°, and is arranged at intervals with the large tooth module distribution area 1 to improve the uniformity of material removal during the grinding process.
大齿模块分布区域1和小齿模块分布区域2沿磨盘本体径向均分为内圈6、中圈7、外圈8,同一圈的大齿模块分布区域1内的齿型模块的结构尺寸为小齿模块分布区域2内的齿型模块结构尺寸的两倍;磨盘本体上沿径向间隔分布有多个圆沟槽9,齿型模块沿磨盘本体径向方向设置于两个圆沟槽9之间,圆沟槽9的深度为3mm,宽度为2mm。Large-tooth module distribution area 1 and small-tooth module distribution area 2 are divided into inner ring 6, middle ring 7, and outer ring 8 along the radial direction of the grinding plate body. It is twice the structural size of the tooth module in the distribution area 2 of the small tooth module; there are a plurality of circular grooves 9 distributed along the radial interval on the grinding disc body, and the tooth module is arranged in two circular grooves along the radial direction of the grinding disc body 9, the depth of the circular groove 9 is 3mm, and the width is 2mm.
具体的,大齿模块分布区域中沿磨盘本体径向方向由内到外各圈中的齿型模块宽度依次增加,具体的,大齿模块分布区域中的内圈6内的齿型模块宽度为4mm,大齿模块分布区域中的中圈7内的齿型模块宽度为6mm,大齿模块分布区域中的外圈8内的齿型模块宽度为8mm。Specifically, in the distribution area of the large-tooth modules, the width of the tooth-shaped modules in each ring increases sequentially from the inside to the outside along the radial direction of the grinding disc body. Specifically, the width of the tooth-shaped modules in the inner ring 6 in the distribution area of the large-tooth modules is 4mm, the width of the tooth module in the middle ring 7 in the distribution area of the large tooth module is 6mm, and the width of the tooth module in the outer ring 8 in the distribution area of the large tooth module is 8mm.
同圈中小齿模块分布区域2内的齿型模块宽度为大齿模块分布区域1内的齿型模块宽度的0.5倍;具体的,小齿模块分布区域2的内圈6内的齿型模块宽度为2mm,齿模块分布区域2的中圈7内的齿型模块宽度为3mm,齿模块分布区域2的外圈8内的齿型模块宽度为4mm。The width of the tooth-shaped module in the distribution area 2 of the small-tooth module in the same ring is 0.5 times the width of the tooth-shaped module in the distribution area 1 of the large-tooth module; specifically, the width of the tooth-shaped module in the inner ring 6 of the small-tooth module distribution area 2 The tooth module width in the middle ring 7 of the tooth module distribution area 2 is 3 mm, and the tooth module width in the outer ring 8 of the tooth module distribution area 2 is 4 mm.
如图5、图6所示,齿星3的截面为U形,齿槽4的截面为等腰三角形,齿星3的深度和齿槽4的深度均为2mm;齿星3和齿槽4前端均设置倾角,具体的齿形倾角为13°;齿星3的倾角和齿槽4的倾角位于同一端,形成齿型模块10的尖端,齿型模块10沿磨盘本体圆周切向方向。As shown in Figure 5 and Figure 6, the cross section of tooth star 3 is U-shaped, the cross section of tooth alveolar 4 is an isosceles triangle, the depth of tooth star 3 and the depth of alveolar 4 are both 2mm; tooth star 3 and alveolar 4 The front end is provided with an inclination angle, and the specific inclination angle of the tooth shape is 13°; the inclination angle of the tooth star 3 and the inclination angle of the tooth groove 4 are located at the same end, forming the tip of the tooth-shaped module 10, which is tangential to the circumference of the grinding disc body.
本发明渐开线沟槽5、圆沟槽9的深度均为3mm,宽度均为2mm,以提升磨屑的排出效率及磨削液的利用率、流动性,减少因磨削液分布不均或磨屑残留造成的二次损伤问题。The depth of the involute groove 5 and the circular groove 9 of the present invention are both 3 mm and the width is 2 mm, so as to improve the discharge efficiency of grinding debris and the utilization rate and fluidity of grinding fluid, and reduce the grinding fluid caused by uneven distribution of grinding fluid. Or secondary damage caused by residual wear debris.
如图2所示,将同一齿模块分布区域沿径向方向上相邻两个齿型模块10相反设置,以进一步提升磨削过程中的材料去除率。As shown in FIG. 2 , two adjacent tooth modules 10 in the same tooth module distribution area are arranged oppositely in the radial direction, so as to further increase the material removal rate during the grinding process.
如图3、图4所示,内圈6、中圈7和外圈8内的大齿模块分布区域1沿磨盘本体圆周方向间隔交错设置,具体如图3、图4所示的区域旋转角11及齿型模块10位置关系,以进一步增加磨削过程中的材料去除率。As shown in Figure 3 and Figure 4, the distribution areas 1 of the large tooth modules in the inner ring 6, the middle ring 7 and the outer ring 8 are alternately arranged at intervals along the circumferential direction of the grinding disc body, and the specific area rotation angles shown in Figure 3 and Figure 4 11 and the positional relationship of the tooth module 10 to further increase the material removal rate in the grinding process.
本发明模块化分布式平面磨盘,在其上端设置齿型模块10,进一步提升加工过程中的材料去除率;通过渐开线式沟槽及同心圆式沟槽设计提升了冷却液的利用率及磨屑的排出效率,减少了磨削过程中的二次损伤问题;通过大小齿模块分布区域设计,优化了磨削过程中的材料去除稳定性,有效地提高了研磨质量。The modular distributed flat grinding disc of the present invention is equipped with a toothed module 10 on its upper end, further improving the material removal rate in the processing process; the utilization rate of the cooling liquid and the The discharge efficiency of grinding debris reduces the secondary damage during the grinding process; through the design of the distribution area of the large and small tooth modules, the stability of material removal during the grinding process is optimized, and the grinding quality is effectively improved.
本发明是通过一些实施例进行描述的,本领域技术人员知悉的,在不脱离本发明的精神和范围的情况下,可以对这些特征和实施例进行各种改变或等效替换。另外,在本发明的教导下,可以对这些特征和实施例进行修改以适应具体的情况及材料而不会脱离本发明的精神和范围。因此,本发明不受此处所公开的具体实施例的限制,所有落入本申请的权利要求范围内的实施例都属于本发明所保护的范围内。The present invention is described through some embodiments, those skilled in the art know that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, the features and embodiments may be modified to adapt a particular situation and material to the teachings of the invention without departing from the spirit and scope of the invention. Therefore, the present invention is not limited by the specific embodiments disclosed here, and all embodiments falling within the scope of the claims of the present application belong to the protection scope of the present invention.
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2068288A1 (en) * | 1992-05-08 | 1993-11-09 | Yvon Gagne | Abrasive member |
JP2011025382A (en) * | 2009-07-28 | 2011-02-10 | Sanko Seito Kk | Rotary grinding wheel |
KR20110027982A (en) * | 2009-09-11 | 2011-03-17 | 새솔다이아몬드공업 주식회사 | Diamond grinder |
CN202964426U (en) * | 2012-12-05 | 2013-06-05 | 修明 | Grinding wheel |
CN204487395U (en) * | 2014-11-25 | 2015-07-22 | 河南秀川新材料科技有限公司 | A kind of electric angle grinder abrasive disc |
CN110370178A (en) * | 2019-07-31 | 2019-10-25 | 冼国强 | A kind of individual particle ordered arrangement electroplating diamond grinding block and preparation method thereof |
CN110948381A (en) * | 2019-12-05 | 2020-04-03 | 华侨大学 | Groove grinding disc and manufacturing method thereof |
CN113752160A (en) * | 2021-09-01 | 2021-12-07 | 广东粤港澳大湾区黄埔材料研究院 | Polishing pad with grooves on surface |
-
2022
- 2022-06-16 CN CN202210682426.4A patent/CN114952641B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2068288A1 (en) * | 1992-05-08 | 1993-11-09 | Yvon Gagne | Abrasive member |
JP2011025382A (en) * | 2009-07-28 | 2011-02-10 | Sanko Seito Kk | Rotary grinding wheel |
KR20110027982A (en) * | 2009-09-11 | 2011-03-17 | 새솔다이아몬드공업 주식회사 | Diamond grinder |
CN202964426U (en) * | 2012-12-05 | 2013-06-05 | 修明 | Grinding wheel |
CN204487395U (en) * | 2014-11-25 | 2015-07-22 | 河南秀川新材料科技有限公司 | A kind of electric angle grinder abrasive disc |
CN110370178A (en) * | 2019-07-31 | 2019-10-25 | 冼国强 | A kind of individual particle ordered arrangement electroplating diamond grinding block and preparation method thereof |
CN110948381A (en) * | 2019-12-05 | 2020-04-03 | 华侨大学 | Groove grinding disc and manufacturing method thereof |
CN113752160A (en) * | 2021-09-01 | 2021-12-07 | 广东粤港澳大湾区黄埔材料研究院 | Polishing pad with grooves on surface |
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