CN114952024A - A kind of laser etching method for plastic workpiece and plastic workpiece - Google Patents

Abstract

The invention discloses a laser etching method for a plastic workpiece and the plastic workpiece, and relates to the technical field of plastic electronic manufacturing. The laser etching method for the plastic workpiece comprises the following steps: step 1, providing a plastic workpiece to be treated; step 2, determining a region to be etched on the plastic workpiece, and forming a heat conduction layer attached to the plastic workpiece at least around the region to be etched on the plastic workpiece; and 3, carrying out laser etching treatment on the area to be etched on the plastic workpiece based on the heat conduction layer. This application utilizes the heat conduction material to form the heat-conducting layer around the regional of treating the sculpture of plastics work piece in advance before carrying out laser etching, treats the sculpture region based on this heat-conducting layer and carries out laser etching when handling, treats that a large amount of heats that the sculpture region absorbs can be to spreading around through the heat-conducting layer to the heat of treating the regional outer fringe of sculpture is reduced fast, avoids its outer fringe surface to appear the uplift deformation defect of class "crater" formula.

Description

A kind of laser etching method for plastic workpiece and plastic workpiece

technical field

The invention belongs to the technical field of plastic electronic manufacturing, and in particular relates to a laser etching method for a plastic workpiece and a plastic workpiece.

Background technique

The basic principle of laser etching is to focus a low-power laser beam with high beam quality (usually ultraviolet laser, fiber laser) into a very small spot, and form a high power density at the focus, so that the material vaporizes and evaporates in an instant, forming a hole. , slot, slot, it has excellent processing performance such as non-contact processing, high degree of flexibility, fast processing speed, no noise, small heat-affected zone, extremely small spot that can be focused to the laser wavelength level, etc. It is widely used in various fields. manufacturing.

Although the potential of laser etching is high, there are some deficiencies in some specific aspects, such as laser etching on plastic workpieces such as PC and ABS, due to the poor temperature resistance of the plastic material and the large thermal resistance, As a result, after laser etching, the surface of the workpiece is prone to ablation defects in the form of "crater", which affects the processing quality of the workpiece.

SUMMARY OF THE INVENTION

In view of this, an object of the present invention is to propose a laser etching method for plastic workpieces, so as to solve the problem that laser etching is difficult to apply to plastic materials in the current technology.

In some illustrative embodiments, the laser etching method for a plastic workpiece includes: step 1, providing a plastic workpiece to be processed; step 2, determining an area to be etched on the plastic workpiece, and at least in all A heat-conducting layer attached to the plastic workpiece is formed around the area to be etched on the plastic workpiece; step 3, laser etching is performed on the area to be etched on the plastic workpiece based on the heat-conducting layer.

In some optional embodiments, the thermally conductive layer in step 2 covers the area to be etched, and in step 3, laser etching is performed on the area to be etched below the thermally conductive layer in conjunction with the thermally conductive layer.

In some optional embodiments, after the laser etching process is performed on the area to be etched on the plastic workpiece based on the thermally conductive layer, the method further includes: removing the thermally conductive layer.

In some optional embodiments, the thermal conductivity of the thermally conductive layer is greater than 1 W/mK.

In some optional embodiments, the thermally conductive layer is formed by printing a conductive ink mixed with metal particles.

In some optional embodiments, in the process of using the conductive ink to form the thermally conductive layer in step 2, the conductive ink is also used to form the conductive traces attached to the plastic workpiece.

In some optional embodiments, the thermally conductive layer is at least a portion of the conductive trace.

In some optional embodiments, the thermally conductive layer is formed by printing, printing or dipping.

In some optional embodiments, the plastic workpiece is one or more of PC, ABS, PMMA, PE, PVC, PS, PP, POM, PA, bakelite.

Another object of the present invention is to propose a plastic workpiece to solve the problems in the present technology.

In some illustrative embodiments, the plastic workpiece is formed using any one of the laser etching methods for plastic workpieces described above.

Compared with the prior art, the present invention has the following advantages:

Before laser etching is performed in the present application, a thermally conductive layer is formed around the area to be etched of the plastic workpiece in advance by using a thermally conductive material. Based on the thermal conductivity layer, when the area to be etched is laser etched, a large amount of absorbed energy around the area to be etched is absorbed. The heat can be diffused to the surroundings through the heat conduction layer, so as to quickly reduce the heat of the outer edge of the area to be etched, and avoid the “crater-like” bulge deformation defect on the outer edge surface. At the same time, since the thermally conductive layer is closely laid on the surface of the plastic workpiece, the thermal stability of the thermally conductive layer structure further limits the surface deformation of the plastic workpiece, which is beneficial to improve the product quality of the plastic workpiece for laser etching.

Description of drawings

1 is a flowchart of a laser etching method for a plastic workpiece in an embodiment of the present invention;

2 is a process schematic diagram of a laser etching method for a plastic workpiece in an embodiment of the present invention;

FIG. 3 is a schematic diagram of the effect of directly performing laser drilling on a plastic workpiece in the prior art.

Detailed ways

Reference will now be made in detail to various embodiments of the present application, examples of which are illustrated in the accompanying drawings. When described in conjunction with these embodiments, it should be understood that the embodiments are not intended to limit the application to these embodiments. On the contrary, this application is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of this application as defined by the appended claims. Furthermore, in the following detailed description of the present application, numerous specific details are set forth in order to provide a thorough understanding of the present application. It should be understood, however, that the application may be practiced without these specific details.

It should be noted that each technical feature in the embodiments of the present invention can be combined with each other without conflict.

An embodiment of the present invention discloses a laser etching method for a plastic workpiece, specifically, as shown in Figures 1-3, Figure 1 is a flowchart of a laser etching method for a plastic workpiece in an embodiment of the present invention; 2 is a process schematic diagram of a laser etching method for a plastic workpiece in an embodiment of the present invention; FIG. 3 is a schematic diagram of the effect of directly performing laser drilling on a plastic workpiece in the prior art.

The laser etching method for plastic workpieces includes:

Step S1, providing the plastic workpiece 1 to be processed;

Step S2, determining the area to be etched on the plastic workpiece 1, and forming a thermally conductive layer 4 attached to the plastic workpiece 1 at least around the area to be etched on the plastic workpiece 1;

Step S3 , performing laser etching on the area to be etched on the plastic workpiece 1 (eg, the through hole 2 ) based on the thermally conductive layer 4 .

Among them, the laser etching in the embodiment of the present invention refers to the use of a high-energy laser beam to ablate the workpiece to reduce the material, so as to obtain the target grooves and holes; the structure patterns of the grooves and holes can be designed according to actual needs limit.

Fig. 3 shows a "crater"-like defect 3 generated around a plastic workpiece when the through hole 2 is directly laser etched.

Before laser etching is performed in the present application, a thermally conductive layer is formed around the area to be etched of the plastic workpiece in advance by using a thermally conductive material. Based on the thermal conductivity layer, when the area to be etched is laser etched, a large amount of absorbed energy around the area to be etched is absorbed. The heat can be diffused to the surroundings through the heat conduction layer, so as to quickly reduce the heat of the outer edge of the area to be etched, and avoid the “crater-like” bulge deformation defect on the outer edge surface. At the same time, since the thermally conductive layer is closely laid on the surface of the plastic workpiece, the thermal stability of the thermally conductive layer structure further limits the surface deformation of the plastic workpiece, which is beneficial to improve the product quality of the plastic workpiece for laser etching.

The plastic workpiece in the embodiment of the present invention can be selected from one or more of PC, ABS, PMMA, PE, PVC, PS, PP, POM, PA, bakelite and the like.

The thermally conductive layer in the embodiment of the present invention can be selected from thermally conductive materials whose thermal conductivity is greater than that of the plastic workpiece, including but not limited to silicon, silicide, silicone grease, ceramics, polymers, metals, metal oxides, carbon, graphene, and One or more of the polymer mixtures (such as thermally conductive pastes, conductive inks, electronic pastes, etc.) containing the above-mentioned thermally conductive particles.

Wherein, the formation method of the thermally conductive layer is not limited to lamination, printing, printing, dipping, etc.; Compared with traditional lamination, this type of process is simple in operation, low in cost, and easy to implement, and the formed thermal conductive layer and the surface of the plastic workpiece are closely combined, and pores are not easily generated, which further improves its thermal conductivity. performance.

The laser selected in the laser etching process in the embodiment of the present invention is not limited to an infrared laser beam or an ultraviolet laser beam; preferably, the laser etching process in the embodiment of the present invention can be matched with a corresponding positioning system (not limited to a CCD positioning system) , to ensure the accuracy of laser etching; at the same time, a positioning mark (not limited to positioning holes) that cooperates with the positioning system can be formed on the plastic workpiece; wherein, the positioning mark can be located on the plastic workpiece. The area not covered by the thermal conductive layer, Alternatively, it is formed on the thermally conductive layer.

Further, the thermally conductive layer in the embodiment of the present invention can be formed of a thermally conductive material with a thermal conductivity greater than 1W/mK. The thermal conductivity of this type of thermally conductive material is much larger than that of a plastic workpiece, and has a significant effect on the diffusion of waste heat in laser etching. The thermally conductive materials with thermal conductivity greater than 1W/mK are not limited to one or more of silicon, silicide, silicone grease, ceramics, metals, metal oxides, and polymer mixtures containing the above materials.

In some cases, the thermal conductive layer in the embodiment of the present invention is not used as a target structure on the plastic workpiece, but only as a temporary auxiliary functional structure used in the laser etching process. Therefore, the laser etching on the plastic workpiece is completed in step S3 Afterwards, the thermally conductive layer can be removed, resulting in the targeted plastic workpiece. The removal method is not limited to one or more of erasing, mechanical peeling, cutting, and medicine. Then when the thermally conductive layer is the target structure on the plastic workpiece, it may not need to be removed.

In some embodiments, in step 2 of the embodiments of the present invention, a thermally conductive layer attached to the plastic workpiece is formed at least around the area to be etched on the plastic workpiece, which specifically includes: a pattern of the thermally conductive layer It is a complementary structure with the region to be etched, that is, the thermal conductive layer and the region to be etched are connected to each other in vertical projection and do not overlap each other.

Alternatively, the pattern of the thermally conductive layer and the region to be etched may be non-continuous and complementary, that is, there may be a certain distance between the thermally conductive layer and the region to be etched, and the distance may be determined according to the thermal conductivity of the thermally conductive layer.

In addition, it can also include: the thermal conductive layer covers the area to be etched, that is, the thermal conductive layer and the area to be etched overlap each other in the vertical projection and the size of the thermal conductive layer is larger than the area to be etched, so as to form a certain range of Thermal zone. In this case, the associated thermal conductive layer in step 3 is subjected to laser etching treatment on the area to be etched below it.

Preferably, the thermally conductive layer in the embodiment of the present invention covers the area to be etched, and the structure can ignore the pattern requirements of the thermally conductive layer as much as possible, making it easier to form and operate.

Preferably, the laying range of the thermally conductive layer is continuous with the area to be etched, and the minimum distance between the edge of the thermally conductive layer far away from the area to be etched and the area to be etched is 0.5mm, that is, there are at least 0.5mm around the area to be etched. Thermal layer. Wherein, the distance is not limited to 0.5mm, 0.8mm, 1mm, 1.5mm, 3mm, 5mm and the like. Preferably, the laying range of the thermal conductive layer at least covers an area of 0.5 mm around the area to be etched, so as to achieve a good heat dissipation effect on the residual heat of laser etching. Machining on plastic workpieces.

Preferably, the thermally conductive layer in the embodiment of the present invention may be formed by printing using conductive ink mixed with thermally conductive metal particles, which may be formed by one or more of spraying, silk-screen printing, pad printing, coating, and dipping. Compared with surface plating (evaporation, electroplating or electroless plating), it has the advantages of simple process, easy control of parameters such as layer thickness and density, high production efficiency and low cost. On the other hand, the conductive ink is mainly composed of thermally conductive metal particles and a resin carrier, which can be removed by appropriate means (such as a solvent corresponding to the resin carrier) after molding. As a temporary thermally conductive layer for laser etching on plastic workpieces.

In some cases, the plastic workpieces in the embodiments of the present invention can be used to make plastic electronic products. When processing electronic circuits on the plastic workpieces, conductive inks can be used to form conductive traces on the plastic workpieces; since the conductive traces and the implementation of the present invention The thermally conductive layers in the examples can be formed by the same process using conductive ink, so the thermally conductive layers in the embodiments of the present invention can be formed together in the process of forming the conductive traces, or the conductive traces can be formed in the process of forming the thermally conductive layer. formed together. In this embodiment, the conductive traces and the heat-conducting layer can be simultaneously formed by the same process using conductive ink, so for plastic electronic products, the manufacturing process can be saved, and the production efficiency can be further improved.

In some embodiments, the laser-etched thermally conductive layer is at least a portion of the conductive traces. That is, the thermally conductive layer may be part of the conductive traces after the laser etching process, and subsequent removal of the thermally conductive layer need not be considered in this embodiment.

In some optional embodiments, the conductive ink is selected from conductive silver paste.

Another object of the present invention is to provide a plastic workpiece, which can be formed by any one of the above-mentioned laser etching methods for plastic workpieces.

Those skilled in the art will also appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments herein may be implemented as electronic hardware, computer software, or combinations thereof. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether this functionality is implemented as hardware or software depends on the specific application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, however, such implementation decisions should not be interpreted as a departure from the scope of the present application.

Claims (10)

1. A laser etching method for a plastic workpiece is characterized by comprising the following steps:

step 1, providing a plastic workpiece to be treated;

step 2, determining a region to be etched on the plastic workpiece, and forming a heat conduction layer attached to the plastic workpiece at least around the region to be etched on the plastic workpiece;

and 3, carrying out laser etching treatment on the area to be etched on the plastic workpiece based on the heat conduction layer.

2. The laser etching method for the plastic workpiece according to claim 1, wherein the heat conducting layer in step 2 covers the area to be etched, and the area to be etched below the heat conducting layer is subjected to laser etching treatment in step 3.

3. The laser etching method for the plastic workpiece according to claim 1 or 2, wherein after the laser etching treatment is performed on the area to be etched on the plastic workpiece based on the heat conduction layer, the method further comprises:

removing the heat conductive layer.

4. The laser etching method for the plastic workpiece according to claim 1, wherein the heat conduction coefficient of the heat conduction layer is greater than 1W/mK.

5. The laser etching method for the plastic workpiece according to claim 1, wherein the heat conducting layer is formed by printing of conductive ink mixed with metal particles.

6. The laser etching method for the plastic workpiece according to claim 5, wherein in the step 2 of forming the heat conducting layer by using the conductive ink, the conductive ink is used together to form a conductive trace attached on the plastic workpiece.

7. The laser etching method for plastic workpieces according to claim 6, wherein the thermally conductive layer is at least a portion of the electrically conductive trace.

8. The laser etching method for the plastic workpiece according to claim 5, wherein the heat conducting layer is formed by printing, printing or dipping.

9. The laser etching method for the plastic workpiece according to claim 1, wherein the plastic workpiece is one or more of PC, ABS, PMMA, PE, PVC, PS, PP, POM, PA and bakelite.

10. A plastic workpiece, characterized in that it is formed by a laser etching method for plastic workpieces as claimed in any of claims 1 to 9.

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