CN114944447A - A new type of LED packaging structure - Google Patents
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 238000005538 encapsulation Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000000084 colloidal system Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000009954 braiding Methods 0.000 abstract 1
- 238000012858 packaging process Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
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Abstract
本发明公开了一种新型LED封装结构，涉及到LED封装技术领域，包括带有绝缘区域和第一、二焊线区域的基板、LED芯片及荧光胶体，所述基板、所述LED芯片及所述荧光胶体外设置有封装结构，所述封装体不具有完全的镜面对称性，所述封装结构至少有六个面，所述封装结构的所有面中至少有一个面的形状不是正方形或者长方形，所述封装结构的所有面中至少有一个面的形状为梯形，所述封装结构内可以放置一个或者多个LED芯。本申请使用非对称封装结构，其在安放时可以直接从振动台上辨别LED的发光面和正负极，主要根据封装结构的出光面的形状大小来判断，不用对LED封装进行编带，可以缩减显示屏或者灯具制造的流程和成本。
The invention discloses a novel LED packaging structure, which relates to the technical field of LED packaging and includes a substrate with an insulating area and first and second bonding wire areas, an LED chip and a fluorescent colloid. An encapsulation structure is provided outside the fluorescent colloid, the encapsulation body does not have complete mirror symmetry, the encapsulation structure has at least six faces, and at least one of all faces of the encapsulation structure is not square or rectangular in shape, At least one of all surfaces of the package structure is trapezoidal in shape, and one or more LED cores can be placed in the package structure. This application uses an asymmetric package structure, which can directly identify the light-emitting surface and the positive and negative electrodes of the LED from the vibration table when placing it, mainly based on the shape and size of the light-emitting surface of the package structure, without braiding the LED package, which can reduce the display. The process and cost of screen or luminaire manufacturing.
Description
技术领域technical field
本发明涉及LED封装技术领域，特别涉及一种新型LED封装结构。The invention relates to the technical field of LED packaging, in particular to a novel LED packaging structure.
背景技术Background technique
LED以其节能、色彩丰富、体积小、寿命长等优点，在照明和显示领域得到广泛应用，LED的发光波长可以覆盖整个可见光波段，具有重要的应用价值，特别是在大型显示屏应用中具有不可替代的地位。LEDs are widely used in lighting and display fields due to their advantages of energy saving, rich colors, small size and long life. The luminous wavelength of LEDs can cover the entire visible light band, which has important application value, especially in large-scale display applications. irreplaceable status.
目前行业中常用的LED封装形式主要有直插式、表贴式(SMD)及COB(Chip onBoard)，随着封装设备的进步，表面贴装结构SMD已成为LED封装形式的主流技术，如图4所示，传统的SMD封装体一般是长方体或者正方体，这种封装形式制造时加工模具比较简单，但使用时不容易判断出光面和电极正负，因此需要精确编带，安放到编带中固定位置的凹陷中，以便于贴装时用机械吸嘴选取贴装，这一过程增加了显示屏或者灯具制造时的复杂性和成本，为此我们提出了一种新型LED封装结构。At present, the commonly used LED packaging forms in the industry mainly include in-line, surface mount (SMD) and COB (Chip on Board). As shown in 4, the traditional SMD package is generally a cuboid or a cube. This type of package is relatively simple to process the mold, but it is not easy to judge the positive and negative of the smooth surface and the electrode when using it, so it needs to be accurately taped and placed in the tape. In the recess of the fixed position, it is convenient to select and mount with a mechanical suction nozzle during mounting. This process increases the complexity and cost of the display or lamp manufacturing. For this reason, we propose a new type of LED packaging structure.
发明内容SUMMARY OF THE INVENTION
本申请的目的在于提供一种新型LED封装结构，本申请使用非对称封装结构，其在安放时可以直接从振动台上辨别LED的发光面和正负极，主要根据封装结构的出光面的形状大小来判断，不用对LED封装进行编带，可以缩减显示屏或者灯具制造的流程和成本。The purpose of this application is to provide a new type of LED packaging structure. The application uses an asymmetric packaging structure, which can directly identify the light-emitting surface and the positive and negative electrodes of the LED from the vibration table when placed, mainly according to the shape and size of the light-emitting surface of the packaging structure. It is judged that there is no need to tape the LED package, which can reduce the process and cost of the display or lamp manufacturing.
为实现上述目的，本申请提供如下技术方案：一种新型LED封装结构，包括带有绝缘区域和第一、二焊线区域的基板、LED芯片及荧光胶体，所述基板、所述LED芯片及所述荧光胶体外设置有封装结构，所述封装体不具有完全的镜面对称性，所述封装结构至少有六个面，所述封装结构的所有面中至少有一个面的形状不是正方形或者长方形，所述封装结构的所有面中至少有一个面的形状为梯形。In order to achieve the above purpose, the present application provides the following technical solutions: a novel LED packaging structure, comprising a substrate with an insulating area and first and second bonding wire areas, an LED chip and a fluorescent colloid, the substrate, the LED chip and The fluorescent colloid is provided with an encapsulation structure, the encapsulation body does not have complete mirror symmetry, the encapsulation structure has at least six faces, and at least one of all faces of the encapsulation structure is not square or rectangular in shape , the shape of at least one of all surfaces of the package structure is a trapezoid.
本申请使用非对称封装结构，其在安放时可以直接从振动台上辨别LED的发光面和正负极，主要根据封装结构的出光面的形状大小来判断，不用对LED封装进行编带，可以缩减显示屏或者灯具制造的流程和成本。The application uses an asymmetric package structure, which can directly identify the light-emitting surface and the positive and negative electrodes of the LED from the vibrating table during placement, mainly based on the shape of the light-emitting surface of the package structure. The process and cost of screen or luminaire manufacturing.
优选的，所述封装结构内可以放置一个或者多个LED芯。Preferably, one or more LED cores can be placed in the package structure.
优选的，所述封装结构的面中至少有一个面是透明设置。Preferably, at least one of the surfaces of the package structure is transparent.
优选的，所述封装结构包括顶面、底面、左侧面、右侧面、前侧面和后侧面，所述顶面、所述底面、所述左侧面、所述右侧面、所述前侧面和所述后侧面的形状均为等腰梯形，所述左侧面、右侧面、前侧面和后侧面首尾依次连接，所述左侧面与所述后侧面连接，所述顶面和所述底面的尺寸不同，所述左侧面、所述右侧面和所述后侧面的尺寸不同。这样的设计在封装流程中可以根据各面的形状可以直接辨别LED的出光面，也可以根据出光面各边长的大小来判断LED的正负极，不用对LED封装体进行编带，减少应用产品制造的流程和成本。Preferably, the package structure includes a top surface, a bottom surface, a left side surface, a right side surface, a front side surface and a rear side surface, the top surface, the bottom surface, the left side surface, the right side surface, the The shapes of the front side and the back side are all isosceles trapezoids, the left side, the right side, the front side and the back side are connected end to end in turn, the left side is connected with the back side, and the top side is connected to the back side. The dimensions of the left side, the right side and the rear side are different from the dimensions of the bottom surface. Such a design can directly identify the light-emitting surface of the LED according to the shape of each surface in the packaging process, and can also judge the positive and negative poles of the LED according to the length of each side of the light-emitting surface. The process and cost of product manufacturing.
优选的，所述封装结构包括顶面、底面、左侧面、右侧面、前侧面和后侧面，所述顶面、所述底面、所述左侧面、所述右侧面、所述前侧面和所述后侧面的形状均为直角梯形，所述左侧面、右侧面、前侧面和后侧面首尾依次连接，所述左侧面与所述后侧面连接，所述顶面和所述底面的尺寸不同，所述左侧面、所述右侧面、所述前侧面和所述后侧面的尺寸不同。这样的设计在封装流程中也可以根据各面的形状直接辨别LED的出光面，根据出光面各边长的大小来判断LED的正负极，不用对LED封装体进行编带，减少应用产品制造的流程和成本。Preferably, the package structure includes a top surface, a bottom surface, a left side surface, a right side surface, a front side surface and a rear side surface, the top surface, the bottom surface, the left side surface, the right side surface, the The shapes of the front side and the back side are all right-angled trapezoids, the left side, the right side, the front side and the back side are connected end to end in sequence, the left side is connected with the back side, and the top and The size of the bottom surface is different, and the size of the left side surface, the right side surface, the front side surface and the rear side surface are different. Such a design can also directly identify the light-emitting surface of the LED according to the shape of each surface in the packaging process, and judge the positive and negative poles of the LED according to the length of each side of the light-emitting surface. processes and costs.
优选的，所述封装结构的形状为截角长方体。这样设计的好处是，便于进行识别，从而便于使用。Preferably, the shape of the package structure is a truncated cuboid. The advantage of this design is that it is easy to identify and thus easy to use.
综上，本发明的技术效果和优点：To sum up, the technical effects and advantages of the present invention:
本申请使用非对称封装结构，其在安放时可以直接从振动台上辨别LED的发光面和正负极，主要根据封装结构的出光面的形状大小来判断，不用对LED封装进行编带，可以缩减显示屏或者灯具制造的流程和成本，从而便于使用。The application uses an asymmetric package structure, which can directly identify the light-emitting surface and the positive and negative electrodes of the LED from the vibrating table during placement, mainly based on the shape of the light-emitting surface of the package structure. The process and cost of screen or lamp manufacturing, so as to be easy to use.
附图说明Description of drawings
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that are used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative effort.
图1是实施例1中一种具有非对称形状的LED封装结构的立体图；1 is a perspective view of an LED package structure with an asymmetric shape in Embodiment 1;
图1-1为实施例1中顶面a2的平面图；Figure 1-1 is a plan view of the top surface a2 in Example 1;
图1-2为实施例1中底面b2的平面图；1-2 is a plan view of the bottom surface b2 in Example 1;
图1-3为实施例1中左侧面c2的平面图；1-3 is a plan view of the left side c2 in Embodiment 1;
图1-4为实施例1中右侧面d2的平面图；1-4 is a plan view of the right side d2 in Embodiment 1;
图1-5为实施例1中前侧面e2、后侧面f2的平面图。1-5 are plan views of the front side e2 and the rear side f2 in the first embodiment.
图2是实施例2中一种具有非对称形状的LED封装结构的立体图；2 is a perspective view of an LED package structure with an asymmetric shape in
图2-1为实施例2中顶面a3的平面图；Figure 2-1 is a plan view of the top surface a3 in Example 2;
图2-2为实施例2中底面b3的平面图；Figure 2-2 is a plan view of the bottom surface b3 in Example 2;
图2-3为实施例2中左侧面c3的平面图；2-3 is a plan view of the left side c3 in
图2-4为实施例2中右侧面d3的平面图；2-4 is a plan view of the right side d3 in
图2-5为实施例2中前侧面e3的平面图；2-5 is a plan view of the front side e3 in
图2-6为实施例2中后侧面f3的平面图；2-6 is a plan view of the rear side f3 in
图3-1是实施例3中一种具有非对称形状的LED封装结构的立体图；3-1 is a perspective view of an LED package structure with an asymmetric shape in Example 3;
图3-2为实施例3中截角封装体底面的图形；Fig. 3-2 is the figure of the bottom surface of the truncated package body in Example 3;
图4是传统LED封装结构的立体图。FIG. 4 is a perspective view of a conventional LED package structure.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
实施例一Example 1
一种新型LED封装结构，包括带有绝缘区域和第一、二焊线区域的基板、LED芯片及荧光胶体，基板的第一、二焊线区域的材料可以是铜、铝、铁或者合金材料的一种或者几种，基板的绝缘区域的材料可以是树脂、硅胶或者陶瓷材料，基板、LED芯片及荧光胶体外设置有封装结构，封装体不具有完全的镜面对称性，封装结构至少有六个面，封装结构的所有面中至少有一个面的形状不是正方形或者长方形，封装结构的所有面中至少有一个面的形状为梯形；封装结构内可以放置一个或者多个LED芯，多个LED芯片的颜色可以是一种颜色，也可以是多种不同颜色的组合；封装结构的面中至少有一个面是透明设置。A new type of LED packaging structure includes a substrate with an insulating area and first and second bonding wire areas, an LED chip and a fluorescent colloid. The material of the first and second bonding wire areas of the substrate can be copper, aluminum, iron or alloy materials One or several of the substrates, the material of the insulating area of the substrate can be resin, silica gel or ceramic material, the substrate, LED chip and fluorescent colloid are provided with an encapsulation structure, the encapsulation body does not have complete mirror symmetry, and the encapsulation structure has at least six The shape of at least one surface of all surfaces of the package structure is not square or rectangular, and the shape of at least one surface of all surfaces of the package structure is trapezoid; one or more LED cores can be placed in the package structure, multiple LEDs The color of the chip can be one color or a combination of multiple different colors; at least one of the surfaces of the package structure is transparent.
本申请使用非对称封装结构，其在安放时可以直接从振动台上辨别LED的发光面和正负极，主要根据封装结构的出光面的形状大小来判断，不用对LED封装进行编带，可以缩减显示屏或者灯具制造的流程和成本。The application uses an asymmetric package structure, which can directly identify the light-emitting surface and the positive and negative electrodes of the LED from the vibrating table during placement, mainly based on the shape of the light-emitting surface of the package structure. The process and cost of screen or luminaire manufacturing.
参考图1、图1-1、图1-2、图1-3、图1-4和图1-5，封装结构包括顶面、底面、左侧面、右侧面、前侧面和后侧面，顶面、底面、左侧面、右侧面、前侧面和后侧面的形状均为等腰梯形，左侧面、右侧面、前侧面和后侧面首尾依次连接，左侧面与后侧面连接，顶面和底面的尺寸不同，左侧面、右侧面和后侧面的尺寸不同。这样的设计在封装流程中可以根据各面的形状可以直接辨别LED的出光面，也可以根据出光面各边长的大小来判断LED的正负极，不用对LED封装体进行编带，减少应用产品制造的流程和成本。Referring to Figure 1, Figure 1-1, Figure 1-2, Figure 1-3, Figure 1-4 and Figure 1-5, the package structure includes a top side, a bottom side, a left side, a right side, a front side and a back side , the shapes of the top, bottom, left, right, front and back sides are all isosceles trapezoids, the left side, right side, front side and back side are connected end to end, left side and back side Connection, the dimensions of the top and bottom sides are different, and the dimensions of the left side, right side and rear side are different. Such a design can directly identify the light-emitting surface of the LED according to the shape of each surface in the packaging process, and can also judge the positive and negative poles of the LED according to the length of each side of the light-emitting surface. The process and cost of product manufacturing.
实施例二
与实施例1不同的是，参考图2、图2-1、图2-2、图2-3、图2-4、图2-5和图2-6所示，封装结构包括顶面、底面、左侧面、右侧面、前侧面和后侧面，顶面、底面、左侧面、右侧面、前侧面和后侧面的形状均为直角梯形，左侧面、右侧面、前侧面和后侧面首尾依次连接，左侧面与后侧面连接，顶面和底面的尺寸不同，左侧面、右侧面、前侧面和后侧面的尺寸不同。这样的设计在封装流程中也可以根据各面的形状直接辨别LED的出光面，根据出光面各边长的大小来判断LED的正负极，不用对LED封装体进行编带，减少应用产品制造的流程和成本。Different from Embodiment 1, referring to Fig. 2, Fig. 2-1, Fig. 2-2, Fig. 2-3, Fig. 2-4, Fig. 2-5 and Fig. 2-6, the package structure includes a top surface, Bottom, left, right, front and back, top, bottom, left, right, front and back are all right-angled trapezoids, left, right, front The side and rear sides are connected end to end, the left side is connected with the rear side, the top and bottom sides have different sizes, and the left side, right side, front side and rear side have different sizes. Such a design can also directly identify the light-emitting surface of the LED according to the shape of each surface in the packaging process, and judge the positive and negative poles of the LED according to the length of each side of the light-emitting surface. processes and costs.
实施例三
与实施例1不同的是，参考图3-1和图3-2所示，封装结构的形状为截角长方体。这样设计的好处是，便于进行识别，从而便于使用。Different from Embodiment 1, as shown in FIG. 3-1 and FIG. 3-2 , the shape of the package structure is a truncated cuboid. The advantage of this design is that it is easy to identify and thus easy to use.
最后应说明的是：以上仅为本发明的优选实施例而已，并不用于限制本发明，尽管参照前述实施例对本发明进行了详细的说明，对于本领域的技术人员来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。Finally, it should be noted that the above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the present invention. within the scope of protection.
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| CN202210302194.5A CN114944447A (en) | 2022-03-24 | 2022-03-24 | A new type of LED packaging structure |
| PCT/CN2022/098151 WO2023178844A1 (en) | 2022-03-24 | 2022-06-10 | Novel led packaging structure |
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| US20120206660A1 (en) * | 2009-12-01 | 2012-08-16 | Sharp Kabushiki Kaisha | Light source package, illumination device, display device, and television receiving device |
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| CN103700754A (en) * | 2013-12-13 | 2014-04-02 | 京东方科技集团股份有限公司 | LED (Light Emitting Diode) encapsulation piece, backlight module and display device |
| US9696199B2 (en) * | 2015-02-13 | 2017-07-04 | Taiwan Biophotonic Corporation | Optical sensor |
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| CN1393942A (en) * | 2001-06-11 | 2003-01-29 | 株式会社西铁城电子 | Illuminating device and mfg. method thereof |
| US20080099778A1 (en) * | 2006-10-27 | 2008-05-01 | Bily Wang | LED package structure for increasing light-emitting effiency and method of packaging the same |
| JP2013145927A (en) * | 2013-04-26 | 2013-07-25 | Toshiba Corp | Semiconductor light-emitting device |
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