CN114939509B - Automatic gluing device and method for semiconductor silicon wafer - Google Patents
Automatic gluing device and method for semiconductor silicon wafer Download PDFInfo
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- CN114939509B CN114939509B CN202210703793.8A CN202210703793A CN114939509B CN 114939509 B CN114939509 B CN 114939509B CN 202210703793 A CN202210703793 A CN 202210703793A CN 114939509 B CN114939509 B CN 114939509B
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- lifting
- silicon wafer
- gluing
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- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 77
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 74
- 239000010703 silicon Substances 0.000 title claims abstract description 74
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 107
- 239000003292 glue Substances 0.000 claims abstract description 39
- 238000007790 scraping Methods 0.000 claims abstract description 25
- 239000007921 spray Substances 0.000 claims abstract description 23
- 238000005507 spraying Methods 0.000 claims abstract description 10
- 235000012431 wafers Nutrition 0.000 claims description 78
- 230000005540 biological transmission Effects 0.000 claims description 31
- 238000007789 sealing Methods 0.000 claims description 15
- 230000033001 locomotion Effects 0.000 claims description 11
- 238000013016 damping Methods 0.000 claims description 10
- 230000009467 reduction Effects 0.000 claims description 10
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 230000035939 shock Effects 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 6
- 230000003014 reinforcing effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000007480 spreading Effects 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/023—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
- B05C11/028—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface with a body having a large flat spreading or distributing surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an automatic gluing device and method for a semiconductor silicon wafer in the field of silicon wafer gluing, and the device comprises a gluing mechanism, a mounting rack, a lifting sliding table, a tray for containing the silicon wafer and a sucker for adsorbing the tray; the gluing mechanism and the lifting sliding table are connected to the mounting frame in a sliding manner; the sucker is arranged on the lifting sliding table; the lifting driving mechanism drives the lifting sliding table and the gluing mechanism to slide; the tray is provided with a first positioning conical surface of the positioning and gluing mechanism and a second positioning conical surface of the positioning sucker; the gluing mechanism comprises a lifting frame, a rotating motor and an inverted T-shaped connecting pipe; the bottom of the connecting pipe is provided with a plurality of spray heads for gluing and scraping plates for scraping the glue; the rotating motor drives the connecting pipe to rotate around the axis; according to the invention, the scraper scrapes the glue so that the glue is uniformly coated on the silicon wafer, and the first positioning conical surface and the second positioning conical surface are used for positioning the spraying, so that the spraying process is more accurate, and the spraying efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of silicon wafer gluing, and particularly relates to an automatic silicon wafer gluing and spin coating device and method.
Background
With the production and technical development of the semiconductor industry, the requirement on the automation of production equipment is higher and higher. The gluing treatment of the silicon wafer is an indispensable link in the semiconductor industry. In the past, the gluing of the silicon wafer is mostly finished manually by manpower, the working efficiency is low, and the thickness and the uniformity degree of the final adhesive film are difficult to ensure. In recent years, with continuous researches of technicians, an automatic glue spreader is widely applied in the semiconductor industry, and at present, the glue spreading treatment of silicon wafers in the semiconductor industry generally adopts equipment and process flows of manually placing a wafer basket, automatically feeding the wafer to a feeding station, carrying the silicon wafer to a glue spreading station for spreading glue, carrying the silicon wafer to a drying station for drying, carrying the silicon wafer to a discharging station and the like.
The existing device has poor continuity when gluing the silicon wafer, needs manual participation, has low efficiency, and can easily cause uneven smearing of the silicon wafer by mechanized operation when gluing.
Disclosure of Invention
The invention aims to provide an automatic gluing device and method for a semiconductor silicon wafer, which can realize automatic gluing of the silicon wafer and ensure the uniformity and continuity of gluing.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the invention provides an automatic gluing device for a semiconductor silicon wafer, which comprises a gluing mechanism, a mounting frame, a lifting sliding table, a tray for containing the silicon wafer and a sucker for adsorbing the tray; the gluing mechanism and the lifting sliding table are connected to the mounting frame in a sliding manner; the sucker is arranged on the lifting sliding table; the gluing mechanism is arranged above the sucker; the lifting driving mechanism drives the lifting sliding table and the gluing mechanism to slide;
the gluing mechanism comprises a lifting frame, a rotating motor and an inverted T-shaped connecting pipe; the lifting frame is connected with the mounting frame in a sliding manner; the top of the connecting pipe is rotationally connected with the lifting frame; the bottom of the connecting pipe is provided with a plurality of spray heads for gluing and scraping plates for scraping the glue; guide wheels for positioning are arranged at two ends of the connecting pipe; the rotating motor drives the connecting pipe to rotate around the axis;
the tray is provided with a first positioning conical surface and a second positioning conical surface; the first positioning conical surface is matched with the sucker to position the relative positions of the tray and the sucker; the second positioning conical surface is matched with the guide wheel, and positions of the tray and the connecting pipe are positioned relatively; the bottom of the tray is provided with an adsorption hole for adsorbing the silicon wafer, and the adsorption hole is arranged corresponding to the sucker.
Preferably, the bottom of the tray is provided with a reverse flow groove; the backflow groove is arranged around the silicon wafer.
Preferably, the connecting pipes comprise a first section of connecting pipe which is vertically arranged and a second section of connecting pipe which is horizontally arranged; the center of the second section connecting pipe is connected with the first section connecting pipe; the guide wheel, the spray head and the scraping plate are arranged on the second section of connecting pipe;
the first section of connecting pipe is rotatably connected to the lifting frame; a shell is arranged on the lifting frame; one end of the shell is communicated with the fixed pipe; a connector is arranged on the first section of connecting pipe, and the other end of the shell is inserted into the connector; a first sealing ring is arranged between the connector and the shell; the shell is rotationally connected with the first section of connecting pipe through a sealing bearing; the shell is in threaded connection with an end cover for positioning the sealing bearing; and a second sealing ring is arranged between the end cover and the first section of connecting pipe.
Preferably, the second section of connecting pipe is arranged along the radial direction of the silicon wafer in the gluing process; the two guide wheels are arranged at two ends of the second section of connecting pipe; the guide wheel is arranged in a conical shape; the outer wall of the guide wheel is matched with the second positioning conical surface.
Preferably, the mounting frame comprises a mounting seat, a first supporting plate and a second supporting plate which are parallel to each other; the first supporting plate and the second supporting plate are respectively arranged at two sides of the mounting seat; the second supporting plate is arranged on the mounting seat through an upright post; a sliding rail for the lifting sliding table to slide is arranged on the first supporting plate; and a chute for the lifting frame to slide is arranged on the second supporting plate.
Preferably, a conveying mechanism for conveying the silicon wafers is arranged between the first supporting plate and the second supporting plate; the conveying mechanism comprises two conveying chains which are arranged in parallel and a conveying motor for driving the conveying chains; two ends of the tray are respectively arranged on the two conveying chains; and the tray is provided with a through hole for sucking the silicon wafer by the sucking disc.
Preferably, the conveying mechanism is provided with a photoelectric switch for monitoring the tray; a positioning cylinder is arranged on the mounting seat; the positioning cylinder drives the limiting block to lift, and the limiting block blocks the movement of the tray on the conveying chain.
Preferably, the lifting driving mechanism drives the lifting sliding table to slide through the first conveying mechanism; the lifting driving mechanism drives the gluing mechanism to slide through the second conveying mechanism; the lifting driving mechanism comprises a lifting motor, a reduction gearbox and a gear box; the lifting motor is connected with an input shaft of the reduction gearbox; the output shaft of the reduction gearbox is in gear transmission with the input shaft of the gearbox; the transmission ratio of the gear box is 1; the first transmission mechanism is connected with the input shaft of the gear box; the second transmission mechanism is connected with the output shaft of the gear box; a180-degree phase difference is arranged between the first transmission mechanism and the second transmission mechanism.
Preferably, the first transmission mechanism comprises a first connecting rod A, a second connecting rod A and a third connecting rod A which are sequentially connected in a rotating way; the gearbox input shaft drives the first connecting rod A to do circular motion; the third connecting rod A is fixed on the lifting sliding table.
Preferably, the second transmission mechanism comprises a first connecting rod B, a second connecting rod B and a third connecting rod B which are sequentially and rotatably connected; the output shaft of the gear box drives the first connecting rod B to do circular motion; the third connecting rod B is arranged on the lifting frame through a damping mechanism; a 180-degree phase difference is arranged between the first connecting rod A and the first connecting rod B.
Preferably, the damping mechanism comprises a connecting block, a damping plate and a spring; the connecting block is fixedly connected to the lifting frame; the connecting block and the lifting frame are respectively arranged on the front side and the back side of the second supporting frame; a guide post is arranged above the connecting block; the spring is sleeved on the guide post; the end part of the guide post is provided with a stop block; the damping plate is connected with the guide post in a sliding way and is limited between the stop block and the connecting block; the spring is arranged between the shock absorption plate and the connecting block.
The invention provides a second aspect of an automatic gluing method for a semiconductor silicon wafer, which comprises the following steps:
the lifting driving mechanism drives the lifting sliding table and the gluing mechanism to slide simultaneously, and the lifting sliding table is lifted to the position that the sucker is attached to the silicon wafer;
the sucking disc is used for sucking and fixing the silicon wafer;
the rotating motor drives the connecting pipe to rotate around the vertical axis, the spray head sprays glue on the silicon wafer, the scraping plate scrapes the glue to uniformly coat the glue on the silicon wafer, and when the connecting pipe rotates for one whole circle, the spray head stops spraying the glue;
after the connecting pipe rotates for a set number of turns, the rotating speed of the rotating motor is increased, and the glue scraped by the scraping plate is thrown out of the silicon wafer;
the rotation motor stops rotating, and the sucking disc loosens the silicon wafer; the lifting driving mechanism drives the lifting sliding table and the gluing mechanism to slide to an initial state.
Compared with the prior art, the invention has the beneficial effects that:
in the present invention; the first positioning conical surface is matched with the sucker to position the relative positions of the tray and the sucker; the second positioning conical surface is matched with the guide wheel to determine the relative position of the tray and the connecting pipe, and the spraying is positioned, so that the spraying process is more accurate; the rotating motor drives the connecting pipe to rotate around the vertical axis, the spray head sprays glue on the silicon wafer, and the scraping plate scrapes the glue to uniformly coat the glue on the silicon wafer; and a plurality of spray heads spray glue on the silicon wafer at the same time, so that the spraying efficiency is improved.
In the invention, the first transmission mechanism is connected with the input shaft of the gear box; the first transmission mechanism is connected with the output shaft of the gear box; the first transmission mechanism and the second transmission mechanism are provided with a 180-degree phase difference, the mechanical mechanism realizes that the lifting driving mechanism drives the lifting sliding table and the gluing mechanism to slide simultaneously, and compared with independent driving of the air cylinder, the automatic gluing device has the advantages of avoiding safety faults caused by disordered codes of programs, along with simple structure, safety, reliability and convenience in maintenance.
Drawings
FIG. 1 is a right side view of an automatic semiconductor wafer dispensing apparatus according to the present invention;
FIG. 2 is a left side view of an automatic semiconductor wafer dispensing apparatus according to the present invention;
FIG. 3 is a block diagram of a second gear train of the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3 in accordance with the present invention;
FIG. 5 is a block diagram of a first gear train of the present invention;
FIG. 6 is a block diagram of a gumming mechanism in accordance with the present invention;
FIG. 7 is a diagram showing the connection relationship between the first section of connecting pipe and the lifting frame in the present invention;
FIG. 8 is a block diagram of a tray and silicon wafer in accordance with the present invention;
fig. 9 is a structural view of a conveying mechanism in the present invention.
In the figure: 1 mount pad, 2 supporting parts, 3 lifting motor, 4 reduction gearbox, 5 gear box, 51 gear box input shaft, 52 gear box output shaft, 6 first transmission mechanism, 61 first connecting rod A, 62 second connecting rod A, 63 third connecting rod C, 7 lifting sliding table, 8 reinforcing plate, 81 positioning cylinder, 82 limiting block, 9 sucking disc, 10 tray, 101 first conical surface, 102 second conical surface, 103 sucking hole, 104 guiding groove, 11 silicon chip, 12 gluing mechanism, 121 lifting frame, 121a shell, 121B sealing bearing, 121C second sealing ring, 121d end cover, 122 fixed pipe, 123 rotating motor, 124 first gear, 125 second gear, 126 first section connecting pipe, 126a connector, 126B first sealing ring, 127 second section connecting pipe, 128 nozzle, 129 scraping plate, 1210, 13 upright post, 14 second supporting plate, 141 sliding groove, 15 second transmission mechanism, 151 first connecting rod B, 152 second connecting rod B, 153 third connecting rod B, 16 damping mechanism, 161 damping plate, 162, 163 guide post, 164 spring, 17, 18 conveying mechanism, 182 conveying motor, 181 conveying chain, 181 conveying support plate, and 181 conveying chain.
Description of the embodiments
The invention is further described below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present invention, and are not intended to limit the scope of the present invention.
It should be noted that, in the description of the present invention, the directions or positional relationships indicated by the terms "front", "rear", "left", "right", "upper", "lower", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. The terms "front", "back", "left", "right", "upper", "lower" as used in the description of the present invention refer to directions in the drawings, and the terms "inner", "outer" refer to directions toward or away from the geometric center of a particular component, respectively.
Example 1
As shown in fig. 1 to 9, an automatic gluing device for semiconductor silicon wafers comprises a gluing mechanism 12, a mounting frame, a lifting sliding table 7, a tray for placing the silicon wafers 11 and a sucker 9 for sucking the tray; the gluing mechanism 12 and the lifting sliding table 7 are connected to the mounting frame in a sliding manner; the sucker 9 is arranged on the lifting sliding table 7; the gluing mechanism 12 is arranged above the suction disc 9;
the mounting frame comprises a mounting seat 1, a first supporting plate 19 and a second supporting plate 14 which are parallel to each other; the four corners of the mounting seat 1 are provided with supporting parts 2; the first support plate 19 and the second support plate 14 are respectively arranged at two sides of the mounting seat 1; the second support plate 14 is mounted on the mounting seat 1 through upright posts 13, two upright posts 13 are vertically arranged on the mounting seat 1, and the second support plate 14 is arranged between the two upright posts 13 through angle steel; the second supporting plate 14 is provided with two sliding grooves 141 for the lifting frame to slide, and the two sliding grooves 141 are vertically arranged; the first supporting plate 19 is provided with a sliding rail for the lifting sliding table 7 to slide; the top of the mounting seat 1 is provided with a reinforcing plate 8; the reinforcing plate 8 is arranged between the first supporting plate 19 and the second supporting plate 14, and through holes for the lifting sliding table 7 and the sucking discs 9 to pass through are formed in the reinforcing plate 8.
A conveying mechanism 18 for conveying the silicon wafers is arranged between the first supporting plate 19 and the second supporting plate 14; the conveying mechanism 18 is arranged above the reinforcing plate 8; the conveying mechanism 18 comprises two conveying chains 182 which are arranged in parallel with each other and a conveying motor 183 for driving the conveying chains; two ends of the tray 10 are respectively arranged on the two conveying chains 182; the silicon wafer 11 is arranged on the tray 10, and a reverse flow groove 104 is arranged at the bottom of the tray 10; the backflow groove 104 is arranged around the silicon wafer 11; the conveying mechanism 18 is provided with two groups of photoelectric switches 181 for monitoring the tray 10; the two groups of photoelectric switches 181 are arranged on the front side and the rear side of the gluing station; a positioning cylinder 81 is arranged on the reinforcing plate 8 of the mounting seat 1; the positioning cylinder 81 drives the limiting block 82 to lift, and the limiting block 82 blocks the movement of the tray 10 on the conveying chain.
The gluing mechanism 12 comprises a lifting frame 121, a rotating motor 123 and a connecting pipe; the lifting frame 121 is slidably connected to the chute 141; the connecting pipe comprises a first section of connecting pipe 126 and a second section of connecting pipe 127 which are connected in sequence to form an inverted T shape; the axis of the first section of connecting pipe 126 coincides with the center of the circle of the silicon wafer 11 when gluing, and the second section of connecting pipe 127 is arranged along the radial direction of the silicon wafer 11; the first connecting pipe 126 is rotatably connected to the lifting frame 121.
The lifting frame 121 is provided with a shell 121a; one end of the shell 121a is communicated with a fixed pipe 122, and the fixed pipe is externally connected with a glue providing device; a connector 126a is arranged on the first section of connecting pipe 126, the other end of the shell 121a is inserted into the connector 126a, and the connector 126a is arranged in a conical shape; the shell 121a is internally provided with a conical surface matched with the connector 126a so as to position the rotation center of the connecting pipe; a first sealing ring 126b is arranged between the connector 126a and the shell 121a; the shell 121a is rotatably connected with the first section connecting pipe 126 through a sealing bearing 121 b; the shell 121a is in threaded connection with an end cover 121c for positioning a sealing bearing 121 b; a second sealing ring 121d is arranged between the end cover 121c and the first section connecting pipe 126; the rotating motor 123 is provided with a first gear 124; a second gear 125 is arranged on the first section of connecting pipe 126; the first gear 124 meshes with a second gear 125; the rotary motor 123 drives the first-stage connection pipe (126) to rotate around an axis.
The middle part of the second section connecting pipe 127 is provided with a plurality of spray heads 128 for gluing and a scraping plate 129 for scraping off glue; the set distance is reserved between the bottom of the scraping plate 129 and the silicon wafer 11, so that the scraping plate 129 is prevented from scraping all glue on the silicon wafer 11, and meanwhile, the damage of the scraping plate 129 to the silicon wafer 11 is avoided; guide wheels 1210 are arranged at two ends of the second section connecting pipe 127, and the guide wheels 1210 are arranged in a conical shape.
The tray 10 is provided with a first positioning conical surface 101 and a second positioning conical surface 102; the second positioning conical surface 102 is matched with the conical surface of the guide wheel 1210, and the relative positions of the positioning tray 10 and the second section connecting pipe 127 not only ensure that the second section connecting pipe 127 is arranged along the radial direction of the silicon wafer 11, but also ensure the relative heights of the spray head 128 and the scraping plate 129 to the silicon wafer 11, and play a role in positioning so as to improve the gluing quality; the bottom of the tray 10 is provided with an adsorption hole 103 for adsorbing the silicon wafer 11; the first positioning conical surface 101 is matched with the sucker 9, and the relative positions of the positioning tray 10 and the sucker 9 ensure that the adsorption holes 103 are correspondingly arranged with the sucker 9.
The lifting driving mechanism drives the lifting sliding table 7 to slide through the first conveying mechanism 6; the lifting driving mechanism drives the gluing mechanism 12 to slide through the second conveying mechanism 15; the lifting driving mechanism comprises a lifting motor 3, a reduction gearbox 4 and a gear box 5; the lifting motor 3 is a servo motor; the lifting motor 3 is connected with an input shaft of the reduction gearbox 4; the gear transmission is realized between the output shaft of the reduction gearbox 4 and the input shaft of the gear box 5; the transmission ratio of the gear box 5 is 1, so that the first transmission mechanism 6 and the second transmission mechanism 15 can synchronously move; the first transmission mechanism 6 is connected with the gearbox input shaft 51; the second transmission 6 is connected to the gearbox output shaft 52.
The first transmission mechanism 6 comprises a first connecting rod A61, a second connecting rod A62 and a third connecting rod A63 which are sequentially connected in a rotating way; the gearbox input shaft 51 drives the first link a61 to perform circular motion; the third connecting rod A63 is fixed on the lifting sliding table 7.
The second transmission mechanism 15 comprises a first connecting rod B151, a second connecting rod B152 and a third connecting rod B153 which are sequentially connected in a rotating way; the gear box output shaft 52 drives the first connecting rod B151 to do circular motion; the third connecting rod B153 is disposed on the lifting frame 121 through a damping mechanism 16; the 180-degree phase difference is arranged between the first connecting rod A61 and the first connecting rod B151, the movement direction of the lifting sliding table 7 and the movement direction of the gluing mechanism 12 are opposite, the synchronous movement and the opposite telecontrol direction of the lifting sliding table 7 and the gluing mechanism 12 are guaranteed through a mechanical structure, the lifting sliding table is safer and more reliable, and meanwhile, the lifting sliding table is convenient to maintain and adjust.
The damping mechanism 16 includes a damping plate 161 and a spring 164; the connecting block 17 is fixedly connected to the lifting frame 121; the connecting block 17 and the lifting frame 121 are respectively arranged on the front side and the back side of the second supporting frame 14; a guide post 163 is arranged above the connecting block 17; the spring 164 is sleeved on the guide post 163; a stop block 162 is arranged at the end part of the guide post 163; the shock-absorbing plate 161 is slidably connected to the guide post 163 and is limited between the stopper 162 and the connection block 17; the spring 164 is disposed between the damper plate 161 and the connection block 17, and can damp the rotation motor 123 through the damper mechanism, and provide a pressing force for the cooperation of the guide wheel 1210 and the tray 10, so as to prevent the guide wheel 1210 and the tray 10 from being separated during the gluing process.
Example 2
The automatic gluing method for semiconductor silicon wafers, which is provided in this embodiment, can be applied to the gluing device in the first embodiment, and includes:
the transmission mechanism 18 transmits the tray 10 and the silicon wafer 11 to the gluing station, the photoelectric switch 181 in front of the gluing station detects the next tray 10, and after the photoelectric switch 181 in back of the gluing station does not detect the last tray 10, the positioning cylinder 81 drives the limiting block 82 to ascend, and the limiting block 82 blocks the tray 10 to stay on the gluing station;
the lifting driving mechanism drives the lifting sliding table 7 and the gluing mechanism 12 to slide simultaneously, the lifting sliding table 7 is lifted to the position that the sucking disc 9 is attached to the first positioning conical surface 101 of the tray 10, and the gluing mechanism 12 is lowered to attach the guide wheel 1210 to the second positioning conical surface 102 of the tray 10; the relative positions of the sucker 9, the gluing mechanism 12 and the tray 10 are determined through the first positioning conical surface 101 and the second positioning conical surface 102; the sucking disc 9 adsorbs and fixes the silicon wafer 11 through the adsorption hole 103.
The rotating motor 123 drives the connecting pipe to rotate around the axis, the rotating speed of the connecting pipe is 12r/min, the spray head 128 sprays glue on the silicon wafer 11, the scraping plate 129 scrapes the glue to uniformly coat the glue on the silicon wafer 11, and when the connecting pipe rotates for one whole circle, the spray head 128 stops spraying the glue;
after the connecting pipe rotates for a set number of turns, the rotating speed of the rotating motor 123 is increased, so that the rotating speed of the connecting pipe is increased to 2000r/min; the glue scraped by the scraping plate 129 is thrown out of the silicon wafer 11, and the glue slides down to the diversion trench 104 along the inner wall of the tray 10, so that the collection of the glue is realized;
the rotation motor 123 stops rotating, and the sucking disc 9 loosens the silicon wafer 11; the lifting driving mechanism drives the lifting sliding table 7 and the gluing mechanism 12 to slide to an initial state simultaneously, and the process is repeated to glue the sequential silicon wafers.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that modifications and variations could be made by those skilled in the art without departing from the technical principles of the present invention, and such modifications and variations should also be regarded as being within the scope of the invention.
Claims (10)
1. The automatic gluing device for the semiconductor silicon wafers is characterized by comprising a gluing mechanism (12), a mounting rack, a lifting sliding table (7), a tray for containing the silicon wafers (11) and a sucker (9) for adsorbing the tray (10); the gluing mechanism (12) and the lifting sliding table (7) are connected to the mounting frame in a sliding manner; the sucker (9) is arranged on the lifting sliding table (7); the gluing mechanism (12) is arranged above the sucker (9); the lifting driving mechanism drives the lifting sliding table (7) and the gluing mechanism (12) to slide;
the gluing mechanism (12) comprises a lifting frame (121), a rotating motor (123) and an inverted T-shaped connecting pipe; the lifting frame (121) is connected to the mounting frame in a sliding manner; the top of the connecting pipe is rotationally connected with the lifting frame (121); the bottom of the connecting pipe is provided with a plurality of spray heads (128) for gluing and scraping plates (129) for scraping the glue; guide wheels (1210) for positioning are arranged at the two ends of the connecting pipe;
the tray (10) is provided with a first positioning conical surface (101) and a second positioning conical surface (102); the first positioning conical surface (101) is matched with the sucker (9) to position the relative positions of the tray (10) and the sucker (9); the gluing mechanism (12) descends to enable the guide wheel (1210) to be attached to the second positioning conical surface (102) of the tray (10), and the relative positions of the tray (10) and the connecting pipe are positioned; an adsorption hole (103) for adsorbing the silicon wafer is formed in the bottom of the tray (10), and the adsorption hole (103) is arranged corresponding to the sucker (9);
the rotating motor (123) drives the connecting pipe to rotate around the vertical axis, the spray head (128) sprays glue on the silicon wafer, the scraping plate (129) scrapes the glue to uniformly coat the glue on the silicon wafer, and after the connecting pipe rotates for one whole circle, the spray head (128) stops spraying the glue; after the connecting pipe rotates for a set number of turns, the rotating speed of the rotating motor (123) is increased, and the glue scraped by the scraping plate (129) is thrown out of the silicon wafer (11).
2. An automatic gluing device for semiconductor wafers according to claim 1, wherein the connecting pipes comprise a first section of connecting pipe (126) arranged vertically and a second section of connecting pipe (127) arranged horizontally; the center of the second section connecting pipe (127) is connected with the first section connecting pipe (126); the guide wheel (1210), the spray head (128) and the scraping plate (129) are arranged on the second section connecting pipe (127);
the first section of connecting pipe (126) is rotatably connected to the lifting frame (121); a shell (121 a) is arranged on the lifting frame (121); one end of the shell (121 a) is communicated with the fixed pipe (122); a connector (126 a) is arranged on the first section of connecting pipe (126), and the connector (126 a) is inserted into the other end of the shell (121 a); a first sealing ring (126 b) is arranged between the connector (126 a) and the shell (121 a); the shell (121 a) is rotationally connected with the first section of connecting pipe (126) through a sealing bearing (121 b); the shell (121 a) is in threaded connection with an end cover (121 d) for positioning the sealing bearing; a second sealing ring (121 c) is arranged between the end cover (121 d) and the first section of connecting pipe (126).
3. An automatic gluing device for semiconductor wafers according to claim 1, characterized in that the mounting frame comprises a mounting seat (1), a first support plate (19) and a second support plate (14) parallel to each other; the first supporting plate (19) and the second supporting plate (14) are respectively arranged at two sides of the mounting seat (1); a sliding rail for the lifting sliding table (7) to slide is arranged on the first supporting plate (19); the second supporting plate (14) is provided with a chute (141) for the lifting frame (121) to slide.
4. An automatic gluing device for semiconductor wafers according to claim 3, characterized in that a transfer mechanism (18) for transferring wafers is arranged between the first support plate (19) and the second support plate (14); the conveying mechanism (18) comprises two conveying chains (182) which are arranged in parallel and a conveying motor (183) which drives the conveying chains; two ends of the tray (10) are respectively arranged on the two conveying chains (182); the silicon chip (11) is arranged on the tray (10); the tray (10) is provided with a through hole for sucking the silicon wafer (11) by the sucking disc (9).
5. An automatic gluing device for semiconductor wafers according to claim 4, characterized in that the transfer mechanism (18) is provided with a photoelectric switch (181) for monitoring the tray; a positioning cylinder (81) is arranged on the mounting seat (1); the positioning cylinder (81) drives the limiting block (82) to lift, and the limiting block (82) blocks the tray (10) on the conveying chain (182) from moving.
6. A semiconductor silicon wafer automatic gluing device according to claim 3, wherein the lifting driving mechanism drives the lifting sliding table (7) to slide through the first conveying mechanism (6); the lifting driving mechanism drives the gluing mechanism (12) to slide through the second conveying mechanism (15); the lifting driving mechanism comprises a lifting motor (3), a reduction gearbox (4) and a gear box (5); the lifting motor (3) is connected with an input shaft of the reduction gearbox (4); the output shaft of the reduction gearbox (4) is in gear transmission with the input shaft of the gear box (5); the transmission ratio of the gear box (5) is 1; the first transmission mechanism (6) is connected with the gear box input shaft (51); the second transmission mechanism (15) is connected with the gear box output shaft (52); a180-degree phase difference is arranged between the first transmission mechanism (6) and the second transmission mechanism (15).
7. The automatic gluing device for semiconductor silicon wafers according to claim 6, wherein the first transmission mechanism (6) comprises a first connecting rod A (61), a second connecting rod A (62) and a third connecting rod A (63) which are connected in turn in a rotating manner; the gearbox input shaft (51) drives the first connecting rod A (61) to do circular motion; the third connecting rod A (63) is fixed on the lifting sliding table (7).
8. The automatic gluing device for semiconductor silicon wafers according to claim 7, wherein the second transmission mechanism (15) comprises a first connecting rod B (151), a second connecting rod B (152) and a third connecting rod B (153) which are connected in turn in a rotating manner; the gear box output shaft (52) drives the first connecting rod B (151) to do circular motion; the third connecting rod B (153) is arranged on the lifting frame (121) through a damping mechanism (16); a180-degree phase difference is arranged between the first connecting rod A (61) and the first connecting rod B (151).
9. An automatic gluing device for semiconductor wafers according to claim 8, wherein the shock absorbing mechanism (16) comprises a shock absorbing plate (161) and a spring (164); the connecting block (17) is fixedly connected to the lifting frame (121); the connecting block (17) and the lifting frame (121) are respectively arranged on the front side and the back side of the second supporting frame (14); a guide post (163) is arranged above the connecting block (17); the spring (164) is sleeved on the guide post (163); a stop block (162) is arranged at the end part of the guide post (163); the shock absorbing plate (161) is connected with the guide post (163) in a sliding manner and is limited between the stop block (162) and the connecting block (17); the spring (164) is arranged between the shock absorbing plate (161) and the connecting block (17).
10. The automatic wafer dispenser according to any one of claims 1 to 9, comprising:
the lifting driving mechanism drives the lifting sliding table (7) and the gluing mechanism (12) to slide simultaneously; the lifting sliding table (7) is lifted to the position that the sucker (9) is attached to the first positioning conical surface (101) of the tray (10), and the relative positions of the tray (10) and the connecting pipe are positioned; the gluing mechanism (12) descends to enable the guide wheel (1210) to be attached to the second positioning conical surface (102) of the tray (10), and the relative positions of the tray (10) and the connecting pipe are positioned;
the sucking disc (9) adsorbs and fixes the silicon wafer (11) through the adsorption hole (103);
the rotating motor (123) drives the connecting pipe to rotate around the vertical axis, the spray head (128) sprays glue on the silicon wafer, the scraping plate (129) scrapes the glue to uniformly coat the glue on the silicon wafer, and after the connecting pipe rotates for one whole circle, the spray head (128) stops spraying the glue;
after the connecting pipe rotates for a set number of turns, the rotating speed of the rotating motor (123) is increased, and the glue scraped by the scraping plate (129) is thrown out of the silicon wafer (11);
the rotation motor (123) stops rotating, and the sucking disc (9) loosens the silicon wafer (11); the lifting driving mechanism drives the lifting sliding table (7) and the gluing mechanism (12) to slide to an initial state.
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| CN115889081B (en) * | 2022-11-30 | 2023-06-27 | 安徽微芯长江半导体材料有限公司 | Silicon carbide wafer wax pasting device and method thereof |
| CN118357075B (en) * | 2024-06-17 | 2024-09-03 | 季华实验室 | Spray head and spray equipment |
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