CN114928947A - OLED module rigid-flex printed circuit board manufacturing method and rigid-flex printed circuit board - Google Patents

Abstract

The manufacturing method of the OLED module rigid-flex printed circuit board comprises the steps of providing a substrate, wherein the substrate comprises an daughter board, the daughter board is provided with a first surface and a second surface, the first surface is provided with a first prepreg and a first board, and the second surface is provided with a copper reflecting layer, a second prepreg and a second board; routing a slot hole on the substrate from one surface of the first board far away from the daughter board, wherein the projection of the slot hole on the second surface is positioned in the processing area or is superposed with the processing area; using CO ₂ The daughter board below the slot hole is etched by laser, and the reflecting copper layer is exposed; the reflective copper layer in the trench is removed by etching. The method for manufacturing the rigid-flexible printed circuit board of the OLED module can solve the problem of precision in manufacturing the slotted hole on the rigid-flexible printed circuit board of the OLED moduleThe degree is poor, and the internal circuit is prevented from being damaged during processing.

Description

OLED module rigid-flex board manufacturing method and rigid-flex board

technical field

The present application relates to the technical field of manufacturing copper-based printed circuit boards, and in particular, to a method for manufacturing a rigid-flex board for an OLED module and a rigid-flex board.

Background technique

With the development of screen technology, the application of OLED screens is becoming more and more extensive, and the requirements for rigid-flex boards of OLED modules are gradually increasing. The rigid-flex board materials of OLED modules are mostly soft materials, which are suitable for flat structures. When they need to be stacked under the screen, they cannot meet the requirements. Therefore, other assembly modules are often required to be designed to avoid positions, so the cavity in the unit (cavity) The process came into being. The slot hole process in the unit is to make the slot hole on the inner hard board material of the rigid-flex board of the OLED module. The risk of excessive damage to the inner layer of the rigid-flex board of the OLED module.

SUMMARY OF THE INVENTION

The embodiments of the present application provide a method for manufacturing a rigid-flex board for an OLED module and a rigid-flex board, so as to solve the problem of poor precision when making slots on the rigid-flex board of an OLED module and damage to its internal circuits during processing the issue of risk.

An embodiment of the first aspect of the present application provides a method for manufacturing a rigid-flex board for an OLED module, including:

A substrate is provided, the substrate includes a sub-board, the sub-board has an opposite first surface and a second surface, the first surface is sequentially stacked with a first prepreg and a first board, and the second surface is provided A reflective copper layer, a second prepreg and a second board are stacked in sequence, an inner circuit layer is provided on the side of the second board close to the sub-board, a processing area is provided on the second side, and the reflective copper layer is The projection on the second surface coincides with the processing area;

A slot hole is formed on the base plate from the side of the first board away from the sub-board, and the projection of the slot hole on the second surface is located in the processing area or coincides with the processing area, so the slot hole extends to the side of the sub-board close to the first prepreg or extends to the inside of the sub-board;

Using CO ₂ laser to etch the sub-board under the slot to expose the reflective copper layer;

The reflective copper layer in the slot hole is removed by etching.

In some of these embodiments, the distance between the projection of the slot hole on the second surface and the edge of the processing area is greater than or equal to 0.1 mm.

In some of the embodiments, the first prepreg includes a first PP layer and a first PET layer that are stacked and disposed, and the first PET layer is located between the first PP layer and the sub-plate.

In some of the embodiments, the first PET layer includes a slotted area PET and a capping area PET that are spaced apart, and the projection of the slotted area PET on the second surface coincides with the processing area.

In some of these embodiments, the thickness of the sub-board is d1; when a slot is formed on the substrate from the side of the first board away from the sub-board, the first side and the Taking the center plane of the second surface as the benchmark, the control depth tolerance of the gong knife is ±d2, and d1 is greater than 2 times of d2.

In some of the embodiments, the thickness of the sub-board is 0.2 mm, and the depth control tolerance of the gong knife is ±75 μm.

In some of the embodiments, the first board and the second board are both double-sided boards; the substrate further includes a third board and a fourth board, and the third board and the fourth board are both single-sided The third board is stacked on the side of the first board away from the sub-board, the fourth board is stacked on the side of the second board away from the sub-board, and the third board is stacked on the side of the second board away from the sub-board. A third circuit layer and a fourth circuit layer are respectively provided on the side of the board away from the sub-board and on the side of the fourth board away from the sub-board; the reflective copper layer in the slot hole is removed by etching include:

Dry film: a dry film is attached on both the third circuit layer and the fourth circuit layer;

Exposure: exposing the dry film outside the slot hole;

Development: developing the unexposed dry film to expose the reflective copper layer;

Etching: etching and removing the reflective copper layer in the slot hole;

Stripping: stripping the dry film.

In some of the embodiments, before providing a substrate, the method for manufacturing a rigid-flex board for an OLED module further includes:

providing a core board, the core board includes a sub-board and a first copper layer and a second copper layer disposed on opposite sides of the sub-board;

All the first copper layer and part of the second copper layer are etched and removed by means of pattern transfer, and the remaining second copper layer is a reflective copper layer.

An embodiment of the second aspect of the present application provides a rigid-flex board, and the rigid-flex board is processed by the method for manufacturing a rigid-flex board for an OLED module as described in the first aspect.

An embodiment of the third aspect of the present application provides a rigid-flex board, including a sub-board, the sub-board has a first surface and a second surface opposite to each other, and the first surface is sequentially stacked with a first prepreg and a second surface. The first board, the second surface is provided with a reflective copper layer, a second prepreg and a second board in sequence, and an inner circuit layer is provided on the side of the second board close to the sub-board, and the second surface is provided with an inner circuit layer. There is a processing area thereon, and the projection of the reflective copper layer on the second surface coincides with the processing area.

The method for manufacturing a rigid-flex board for an OLED module provided by the embodiment of the present application has the beneficial effects that: when making a slot hole on the rigid-flex board for an OLED module, the first board can be placed on the substrate from the side of the first board away from the sub-board. Out of the slot hole, since the slot hole only needs to extend to the side of the sub-board close to the first prepreg or to the inside of the sub-board, it will not damage the inner circuit layer of the second board, and then use CO ₂ laser to etch the bottom of the slot hole The sub-board not only has higher machining accuracy, but also because the second surface of the sub-board is provided with a reflective copper layer, the projection of the reflective copper layer on the second surface coincides with the processing area, and the projection of the slot on the second surface is located at The processing area is in or overlapped with the processing area, so when the sub-board under the slot hole is etched by the CO ₂ laser, the CO ₂ laser will be reflected by the reflective copper layer, and will not damage the inner circuit layer on the second board, and finally pass through A slot hole that meets the requirements can be obtained by etching and removing the reflective copper layer in the slot hole.

The beneficial effects of the rigid-flex board provided by the present application compared with the prior art are the same as the beneficial effects of the manufacturing method of the rigid-flex board for an OLED module provided by the present application compared with the prior art, which will not be repeated here.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for the present application. In some embodiments, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

1 is a flowchart of a method for manufacturing a rigid-flex board for an OLED module in one embodiment of the present application;

2 is a schematic structural diagram of a substrate in one embodiment of the present application;

Fig. 3 is the schematic diagram of the slot hole on the substrate shown in Fig. 2;

Fig. 4 is the schematic diagram after the slot hole is made on the substrate shown in Fig. 2;

FIG. 5 is a schematic view of the structure of the substrate shown in FIG. 4 after using CO ₂ laser etching of the sub-board below the slot hole;

6 is a schematic structural diagram of the substrate shown in FIG. 5 after removing the reflective copper layer in the slot hole by etching;

FIG. 7 is a schematic diagram of the first lamination and lamination when the substrate shown in FIG. 2 is produced;

FIG. 8 is a schematic diagram of the second lamination and lamination when the substrate shown in FIG. 2 is produced;

Fig. 9 is the schematic diagram of making the first prepreg and the second prepreg shown in Fig. 2;

FIG. 10 is a schematic diagram of making the daughter board and the reflective copper layer shown in FIG. 2 .

The meanings of the marks in the figure are:

100, substrate; 10, daughter board; 11, first side; 12, second side; 20, first prepreg; 21, first PP layer; 22, first PET layer; 221, slot area PET; 222, 30, the first board; 40, the reflective copper layer; 40a, the first copper layer; 40b, the second copper layer; 50, the second prepreg; 51, the second PP layer; 52, the second PET layer ; 60, the second plate; 61, the inner circuit layer; 70, the slot hole; 80, the third plate; 81, the third circuit layer; 82, the first film; 90, the fourth plate; 91, the fourth circuit layer; 92. The second film.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application will be further described in detail below with reference to the accompanying drawings, that is, the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.

Reference in this specification to "one embodiment," "some embodiments," or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application . Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in other embodiments," etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean "one or more but not all embodiments" unless specifically emphasized otherwise. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments.

In order to illustrate the technical solutions of the present application, the following description is made with reference to the specific drawings and embodiments.

Referring to FIGS. 1 to 7 , an embodiment of the first aspect of the present application provides a method for manufacturing a rigid-flex board for an OLED module, including:

S100: Provide a substrate 100.

The substrate 100 includes a sub-board 10, the sub-board 10 has a first surface 11 and a second surface 12 opposite to each other. There are a reflective copper layer 40, a second prepreg 50 and a second board 60. The inner circuit layer 61 is provided on the side of the second board 60 close to the sub-board 10, and the second side 12 has a processing area, and the processing area needs to be processed later. In the area out of the slot 70, the projection of the reflective copper layer 40 on the second surface 12 coincides with the processing area, that is, the projection of the reflective copper layer 40 on the second surface 12 is the processing area.

Specifically, the sub-board 10 , the first prepreg 20 , the first board 30 , the reflective copper layer 40 , the second prepreg 50 and the second board 60 can be stacked together in a stacking sequence, and then pressed into a substrate by a conventional pressing machine 100.

Optionally, the sub-board 10, the first prepreg 20, the first board 30, the reflective copper layer 40, the second prepreg 50 and the second board 60 can be laminated with a PIN alignment sleeve, and then pressed by a traditional pressing machine, Multiple stacks are laminated in a 1+N+1 stacking mode.

Please refer to FIG. 10 together. Optionally, the sub-board 10 and the reflective copper layer 40 can be fabricated in the following manner: First, a core board is provided, the core board is cut to the required size by a cutting machine, and the core board includes the sub-board 10 and the first copper layer 40a and the second copper layer 40b disposed on the opposite sides of the sub-board 10; secondly, all the first copper layer 40a and part of the second copper layer 40b are etched and removed by pattern transfer, and the remaining The two copper layers 40b are the reflective copper layers 40 .

Wherein, etching and removing all the first copper layer 40a and part of the second copper layer 40b by means of pattern transfer includes:

The first step, sticking dry film: sticking dry film on the copper surface of the second copper layer 40b, and not sticking the film on the copper surface of the first copper layer 40a;

The second step, exposure: the position of the non-slot hole 70 corresponding to the dry film is blocked by the light-blocking area of the working film, and the dry film exposure does not occur in the light-blocking area. Exposure is performed by an exposure machine, and the first copper layer 40a is not exposed.

The third step, developing: remove the dry film in the area where the dry film is not exposed by dry film development, and expose the copper surface (after the development, the second copper layer 40b except the slot hole 70 position, all copper is exposed);

The fourth step, etching: The second copper layer 40b is etched away by an acid etching machine except the copper at the slot 70 position. After etching, the copper layer (that is, the reflective copper layer 40) is retained at the slot 70 position, and all other positions are etched away. Copper The layer exposes the substrate surface of the daughter board 10 .

Optionally, the daughter board 10 is configured as an FR4 board.

Optionally, the sub-board 10 , the first prepreg 20 , the first board 30 , the reflective copper layer 40 , the second prepreg 50 and the second board 60 are stacked together in a stacking sequence, and are pressed into a substrate by a conventional pressing machine After 100, the substrate 100 can be fabricated according to conventional drilling, hole metallization, circuit fabrication, and circuit protection (covering film/ink) processes, and then uncovered.

S200: A slot hole 70 is formed on the substrate 100 from the side of the first board 30 away from the sub-board 10.

The projection of the slot hole 70 on the second surface 12 is located in the processing area or coincides with the processing area.

Specifically, firstly, four positioning holes are drilled on the table top of the gong machine, and pins are marked. These four positioning holes correspond to four holes drilled on the base plate 100, and the base plate 100 is sleeved on the pins through the four positioning holes. Call the gong machine program, use gong knife to cut out the slot 70 on the substrate 100 from the side of the first board 30 away from the sub-board 10, and only need to ensure that the slot 70 extends until the sub-board 10 is close to the first prepreg 20 during processing. One side of the circuit board may extend to the inside of the sub-board 10 , so the precision requirement is not high, the precision is easy to be guaranteed, and the inner circuit layer 61 on the second board 60 will not be damaged.

It can be understood that the slot hole 70 does not penetrate through the sub-board 10 .

Optionally, the thickness of the sub-board 10 is d1. When the slot 70 is formed on the base plate 100 from the side of the first board 30 away from the sub-board 10, the center planes of the first surface 11 and the second surface 12 are taken as Benchmark, the control depth tolerance of the gong knife is ±d2, and d1 is greater than 2 times of d2. For example, when the thickness of the sub-board 10 is 0.2 mm, the depth control tolerance of the gong knife is ±80 μm, ±75 μm or ±70 μm, etc., or, when the thickness of the sub-board 10 is 0.15 mm, the depth control tolerance of the gong knife is ±70 μm , ±65μm or ±60μm, etc. In this way, not only can the gong knife pass through the first prepreg 20 to facilitate the removal of the waste generated in the gong slot 70 , but also the gong knife will not penetrate through the daughter board 10 , thereby damaging the inner circuit layer on the second board 60 . 61.

S300 : The sub-board 10 under the slot hole 70 is etched by a CO ₂ laser to expose the reflective copper layer 40 .

Specifically, the slot 70 of the substrate 100 can be facing upward, placed on the table top of the CO ₂ laser machine according to the direction, and the plate 100 can be fixed by drawing air, and then the laser data can be retrieved, and the Mark point of the substrate 100 can be grasped for positioning, and the laser energy can be adjusted. The parameters are processed, the processing position is carried out according to the path of the gong board, and the CO ₂ laser energy is set according to the thickness. According to the principle of reflecting CO ₂ laser, when the CO ₂ laser is processed in the depth direction of the slot hole 70 , the copper surface of the reflective copper layer 40 will be reflected off, and will not cause damage to the copper surface, so as to achieve the effect on the slot hole 70 . The effect of depth control, the CO ₂ laser is irradiated on the sub-board 10, and the sub-board 10 will absorb heat and vaporize. When the processing depth reaches the reflective copper layer 40, the CO ₂ laser will be reflected, but the processing process will continue to ensure that All the sub-boards 10 in the slot holes 70 are vaporized cleanly.

Optionally, the distance between the projection of the slot hole 70 on the second surface 12 and the edge of the processing area is greater than or equal to 0.1 mm, that is, the projection of the slot hole 70 on the second surface 12 is located inside the processing area. In this way, it can be ensured that the CO ₂ laser is completely reflected, and the positional accuracy of the slot hole 70 can be more easily guaranteed when the slot hole 70 is processed.

S400: Remove the reflective copper layer 40 in the slot hole 70 by etching.

Specifically, the reflective copper layer 40 in the slot hole 70 may be etched away by an acid etching machine.

Optionally, after removing the reflective copper layer 40 in the slot hole 70 by etching, the substrate 100 can also be subjected to UV laser engraving, uncovering, surface treatment, reinforcing assembly and die cutting, and punching according to the product shape to obtain the desired product. OLED module rigid-flex board.

In the method for manufacturing a rigid-flex board for an OLED module provided by the embodiment of the present application, when making the slot hole 70 on the rigid-flex board for an OLED module, the first board 30 may be placed on the substrate 100 from the side of the first board 30 away from the sub-board 10 . Out of the slot hole 70, since the slot hole 70 only needs to extend to the side of the sub-board 10 close to the first prepreg 20 or to the inside of the sub-board 10, the precision requirement is not high, and the inner circuit on the second board 60 will not be damaged. Layer 61, and then use CO ₂ laser to etch the sub-board 10 under the slot 70, not only the machining accuracy is higher, but also because the reflective copper layer 40 is provided on the second surface 12 of the sub-board 10, the reflective copper layer 40 is on the second The projection on the surface 12 coincides with the processing area, and the projection of the slot 70 on the second surface 12 is located in the processing area or coincides with the processing area, so when using the CO ₂ laser to etch the sub-board 10 under the slot 70, the CO ₂ The laser will be reflected by the reflective copper layer 40 and will not damage the inner circuit layer 61 on the second board 60 . Finally, the reflective copper layer 40 in the slot hole 70 is removed by etching to obtain the required slot hole 70 .

In the method for manufacturing a rigid-flex board for an OLED module provided by the embodiment of the present application, by making the slot holes 70 on the rigid-flex board for an OLED module, it solves the problem of mutual avoidance caused by the conventional OLED module rigid-flex board and other modules being assembled. The problem of waste of assembly space is improved, and the space utilization rate is improved.

The method for manufacturing a rigid-flex board for an OLED module provided in the embodiment of the present application can also be applied to the process of making similar slot holes on other types of rigid-flex boards.

Referring to FIG. 7 , in this embodiment, the first prepreg 20 includes a first PP layer 21 and a first PET layer 22 that are stacked and disposed, and the first PET layer 22 is located between the first PP layer 21 and the sub-board 10 . In this way, after the slot 70 is made on the substrate 100 from the side of the first board 30 away from the sub-board 10, the waste material in the slot 70 will be automatically separated from the inner sub-board 10, so that the waste material can be easily discharged.

It can be understood that the first PET layer 22 can be backed on the first PP layer 21 by a self-adhesive machine, and then cut into a required size by a cutting machine.

Optionally, the first PET layer 22 includes a slot area PET 221 and a cover uncovering area PET 222 which are arranged separately, and the projection of the slot area PET 221 on the second surface 12 coincides with the processing area. In this way, after the slot hole 70 is made on the substrate 100 from the side of the first board 30 away from the sub-board 10 , the waste material in the slot hole 70 can be more easily discharged.

It can be understood that UV laser can be used to process the first PP layer 21 on the first PET layer 22, and the first PP layer 21 can be processed in the area where the outer layer needs to be uncovered. 21 and the first PET layer 22 are fully engraved, and the first PET layer 22 outside the unit (including the area of the slot 70 corresponding to the first PP layer 21) is engraved through the first PET layer 22 (the first PP layer 21 is not engraved). The first PET layer 22 outside the unit is completely torn off, and only the slot area PET221 and the uncovering area PET222 remain.

Optionally, the second prepreg 50 includes a second PP layer 51 and a second PET layer 52 arranged in layers, and the second PP layer 51 is located between the second PET layer 52 and the sub-board 10 .

In some of these embodiments, both the first board 30 and the second board 60 are double-sided boards, ie boards with circuit layers on both sides. Both the first board 30 and the second board 60 can be fabricated as follows:

The first step, paste dry film: the double-sided copper surface of the roll material is attached with a dry film.

The second step, exposure: the non-circuit position corresponding to the dry film is blocked by the light-blocking area of the working film, and the dry film exposure does not occur in the light-blocking area. .

The third step, development: remove the dry film from the area where the dry film has not been exposed through dry film development, and expose the copper surface.

The fourth step, etching: the copper surface is then etched with an acid etching machine to etch the double-sided circuit layer.

The fifth step, pre-treatment: bite off a layer of copper on the surface of the circuit layer through an acidic etching solution, so that the stains on the copper surface fall off.

The sixth step, fitting: through the PIN positioning, stick the cover film on the circuit layer that needs to be protected.

The seventh step, pressing: use a rapid pressing machine, through high temperature and high pressure, so that the glue of the cover film flows and fills the lines on the circuit layer to play a protective role.

The eighth step, curing: using a high-temperature oven, the glue of the cover film is cured at a high temperature to achieve stable characteristics.

Please refer to FIG. 5 to FIG. 8 , the substrate 100 further includes a third board 80 and a fourth board 90 , the third board 80 and the fourth board 90 are both single-sided, and the third board 80 is stacked on the first board 30 away from the daughter board 10 side, the fourth board 90 is stacked on the side of the second board 60 away from the sub-board 10, the side of the third board 80 away from the sub-board 10 and the side of the fourth board 90 away from the sub-board 10 are respectively provided with The third wiring layer 81 and the fourth wiring layer 91 .

Wherein, removing the reflective copper layer 40 in the slot hole 70 by etching includes:

The first step, dry film: the dry film is attached on both the third circuit layer 81 and the fourth circuit layer 91 , that is, the first film 82 is attached on the third circuit layer 81 , and the fourth circuit layer 91 is attached The second film 92 .

The second step, exposure: Expose the dry film outside the slot hole 70, that is, the position of the dry film corresponding to the slot hole 70 is blocked by the light-blocking area of the working film, and the dry film exposure does not occur in the light-blocking area. (All positions except the slot hole 70) pass through the light-transmitting area of the working film, and then expose by the exposure machine.

The third step, development: the unexposed dry film is developed to reveal the reflective copper layer 40, and the dry film in the remaining exposed areas is retained for protection.

The fourth step, etching: the reflective copper layer 40 in the slot hole 70 is etched and removed.

The fifth step is to remove the film: to remove the dry film, that is, to remove the remaining dry film with an alkaline film removal solution.

By adopting the above solution, damage to the third wiring layer 81 and the fourth wiring layer 91 can be avoided when the reflective copper layer 40 in the slot hole 70 is removed by etching.

Optionally, the sub-board 10 , the first prepreg 20 , the first board 30 , the reflective copper layer 40 , the second prepreg 50 and the second board 60 may be pressed together in a stacking sequence, and then the laminated The sub-board 10 , the first prepreg 20 , the first board 30 , the reflective copper layer 40 , the second prepreg 50 and the second board 60 are pressed together with the third board 80 and the fourth board 90 .

An embodiment of the second aspect of the present application provides a rigid-flex board, which is processed by the method for manufacturing a rigid-flex board for an OLED module according to the first aspect.

In the rigid-flex board of the embodiment of the present application, not only the machining accuracy of the slot hole 70 is high, but also the inner circuit layer 61 will not be damaged in the process of machining the slot hole 70 .

An embodiment of the third aspect of the present application provides a rigid-flex board, including a sub-board 10 , the sub-board 10 has opposite first surfaces 11 and second surfaces 12 , and first prepregs are stacked on the first surface 11 in sequence. 20 and the first board 30, the second surface 12 is provided with a reflective copper layer 40, a second prepreg 50 and a second board 60 in sequence, and an inner circuit layer 61 is provided on the side of the second board 60 close to the sub-board 10, The second surface 12 has a processing area, and the projection of the reflective copper layer 40 on the second surface 12 coincides with the processing area.

In the rigid-flex board provided by the embodiment of the present application, the reflective copper layer 40 is provided on the second surface 12 of the sub-board 10 , so the side of the first board 30 away from the sub-board 10 can be firstly processed when the slot holes 70 are subsequently processed. Slot holes 70 are formed on the substrate 100. In this process, the slot holes 70 only need to extend to the side of the sub-board 10 close to the first prepreg 20 or to the inside of the sub-board 10, and then use CO ₂ laser to etch the bottom of the slot holes 70 The sub-board 10 of the second board 10 is sufficient, not only the processing accuracy is higher, but also because the CO ₂ laser will be reflected by the reflective copper layer 40 , the inner circuit layer 61 on the second board 60 will not be damaged.

The rigid-flex board provided in the embodiment of the present application can be applied to an OLED module or other similar modules.

The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The recorded technical solutions are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the application, and should be included in the application. within the scope of protection.

Claims (10)

1. A method for making a rigid-flex board for an OLED module, comprising: A substrate is provided, the substrate includes a sub-board, the sub-board has an opposite first surface and a second surface, the first surface is sequentially stacked with a first prepreg and a first board, and the second surface is provided A reflective copper layer, a second prepreg and a second board are stacked in sequence, an inner circuit layer is provided on the side of the second board close to the sub-board, a processing area is provided on the second side, and the reflective copper layer is The projection on the second surface coincides with the processing area; A slot hole is formed on the base plate from the side of the first board away from the sub-board, and the projection of the slot hole on the second surface is located in the processing area or coincides with the processing area, so the slot hole extends to the side of the sub-board close to the first prepreg or extends to the inside of the sub-board; Using CO ₂ laser to etch the sub-board under the slot to expose the reflective copper layer; The reflective copper layer in the slot hole is removed by etching. 2 . The method for manufacturing a rigid-flex board for an OLED module according to claim 1 , wherein a distance between the projection of the slot hole on the second surface and the edge of the processing area is greater than or equal to 0.1 mm. 3 . . 3 . The method for manufacturing a rigid-flex board for an OLED module according to claim 1 , wherein the first prepreg comprises a first PP layer and a first PET layer that are arranged in layers, and the first PET layer is located at the between the first PP layer and the sub-board. 4 . The method for manufacturing a rigid-flex board for an OLED module according to claim 3 , wherein the first PET layer comprises a slotted hole area PET and a cover uncovering area PET, and the slotted hole area PET is in the The projection on the second surface coincides with the processing area. 5. The method for manufacturing a rigid-flex board for an OLED module according to claim 1, wherein the thickness of the sub-board is d1; When the slot hole is formed on the base plate, the depth control tolerance of the gong knife is ±d2 based on the center plane of the first surface and the second surface, and d1 is greater than 2 times of d2. 6 . The method for manufacturing a rigid-flex board for an OLED module according to claim 5 , wherein the thickness of the sub-board is 0.2 mm, and the depth control tolerance of the gong knife is ±75 μm. 7 . 7. The method for manufacturing a rigid-flex board for an OLED module according to any one of claims 1 to 6, wherein the first board and the second board are both double-sided; the substrate further comprises a second board. Three boards and a fourth board, the third board and the fourth board are both single boards, the third board is stacked on the side of the first board away from the sub board, the fourth board Stacked on the side of the second board away from the sub-board, a third circuit is respectively provided on the side of the third board away from the sub-board and on the side of the fourth board away from the sub-board layer and a fourth circuit layer; removing the reflective copper layer in the slot hole by etching includes: Dry film: a dry film is attached on both the third circuit layer and the fourth circuit layer; Exposure: exposing the dry film outside the slot hole; Development: developing the unexposed dry film to expose the reflective copper layer; Etching: etching and removing the reflective copper layer in the slot hole; Stripping: stripping the dry film. 8. The method for manufacturing a rigid-flex board for an OLED module according to any one of claims 1 to 6, wherein before providing a substrate, the method for manufacturing a rigid-flex board for an OLED module further comprises: providing a core board, the core board includes a sub-board and a first copper layer and a second copper layer disposed on opposite sides of the sub-board; All the first copper layer and part of the second copper layer are etched and removed by means of pattern transfer, and the remaining second copper layer is a reflective copper layer. 9 . A rigid-flex board, characterized in that the rigid-flex board is processed by the method for manufacturing a rigid-flex board for an OLED module according to any one of claims 1 to 8 . 10. A rigid-flex board, characterized in that it comprises a sub-board, the sub-board has a first surface and a second surface opposite to each other, and the first surface is provided with a first prepreg and a first board stacked in sequence, The second surface is provided with a reflective copper layer, a second prepreg and a second board in sequence, an inner circuit layer is provided on the side of the second board close to the sub-board, and a processing area is provided on the second surface , the projection of the reflective copper layer on the second surface coincides with the processing area.

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