CN114927448A - Wafer dividing and guiding equipment and working method thereof - Google Patents

Abstract

The application discloses wafer dividing and guiding equipment and a working method thereof, wherein the working method of the wafer dividing and guiding equipment comprises the following steps: forming a first carrying position on the carrying seat for carrying a wafer boat containing wafers to be separated; the wafer boat loaded on the first loading position drives a stop block to move through a belt moving assembly so as to avoid a space for separately guiding the movement of a sub-guide arm loaded on the wafer boat, wherein the stop block is arranged to extend along the arrangement direction of a plurality of sub-guide arms, the stop block is arranged on the loading seat in a manner that the stop block can be driven by the belt moving assembly and can be switched between a state of moving away from a moving path of a push-guide end and a state of returning to the moving path of the push-guide end, and each sub-guide arm corresponds to a wafer of a first placing groove of the wafer boat; and pushing the guide dividing arm to divide and derive the wafers which correspond to the pushed guide dividing arm and are positioned in the first placing groove of the wafer bearing boat.

Description

Wafer guide equipment and its working method

technical field

The present invention relates to the field of semiconductor equipment, in particular to a wafer guide equipment and a working method thereof.

Background technique

Wafers refer to silicon wafers used to make silicon semiconductor circuits. The original material is silicon, and boat boxes are commonly used wafer storage devices. Generally, batches of wafers are stored in the boat box. When all the wafers in a boat are put into production, the wafers after production need to be inspected to screen the wafers. For qualified wafers, the products that have passed the inspection in the wafer boat need to be shipped in pieces, while batches of wafers are stored in the wafer boat. The wafers located in the middle and bottom of the wafer are blocked by the top wafer. Therefore, it is necessary to manually remove the top wafers one by one to move the target wafers out of other wafer boats, which is inefficient.

There are many different processes in the production process of wafer boats, and these processes will place the wafers in different environments, so the wafer boats that carry the wafers also need to be separated according to the different process environments. For example, the wafer boat needs to be baked during production. At this time, the ordinary wafer boat box cannot meet the temperature requirements in the baking process, and some wafers located in the ordinary wafer boat box need to be transferred to the wafer boat dedicated for the baking process. In the box, if the wafers in the boat box are introduced into the special boat box one by one, the efficiency is too low, which is not conducive to production.

At present, there are some automatic slicing and slicing machines on the market, but the wafer boats for each wafer storage have differences in length and height, and the wafers are easily damaged by a small force. Therefore, when exporting it, the exporting device needs to be aligned with the wafer, otherwise the wafer will be easily damaged due to uneven force. Therefore, when using this type of automated machine, it takes a lot of time to debug it, resulting in the separation of the lead. of low efficiency.

In addition, since the wafer is fragile, that is to say, the wafer on the carrier and the wafer boat will be damaged when subjected to a small pressure. Therefore, it is necessary to prevent the wafer from being damaged during separation.

SUMMARY OF THE INVENTION

One advantage of the present invention is to provide a wafer guide device and a working method thereof. The wafer guide device can separate and unload the wafers located at any position of the carrier wafer boat without having to take them out and place them in the wafer boat box in advance. other wafers located on top of the wafer, thereby improving the efficiency of the separation.

Another advantage of the present invention is to provide a wafer guide device and a working method thereof. The present invention also provides an integral guide assembly, which can synchronize at least two wafers in the carrier wafer boat. Divide to a receiving boat.

Another advantage of the present invention is to provide a wafer guide device and a working method thereof. The present invention also provides an integral guide assembly, which can synchronize the wafers in the carrier wafer once Divide to a receiving boat.

Another advantage of the present invention is to provide a wafer guiding device and a working method thereof, wherein the wafer guiding device can prevent the wafer being separated from being damaged due to uneven force.

Another advantage of the present invention is to provide a wafer guide device and a working method thereof, wherein the wafer guide device can prevent the workers from being mishandled without preventing the wafer boat from being in the correct position. The wafer is crushed.

One advantage of the present invention is to provide a wafer guiding device and a working method thereof. The present invention also provides a limiting member to fix the position of the wafer boat assembly and improve the stability of the wafer boat during the separation and guiding process.

One advantage of the present invention is to provide wafer separation and guiding equipment, and the present invention is further provided with a foolproof mechanism, which can hinder the separation when the carrying wafer boat and the receiving wafer boat are not at any predetermined positions. The guide arm pushes the wafer, avoids exporting the wafer, and protects the wafer.

In order to achieve at least one of the above advantages of the present invention, the present invention provides a wafer guide device for separating at least one wafer out of a carrier wafer boat, and the carrier wafer boat has a first entrance, a first opening and a a first storage space in which the inlet is communicated with the first opening, and at least one group of first placement grooves are formed on the inner wall of the carrier boat that forms the first storage space, wherein the first placement grooves extend laterally, And between the first inlet and the first opening, for placing the wafer, the wafer guide device includes:

a bearing seat, wherein the bearing seat forms a first bearing position for carrying the bearing wafer boat;

A sub-guide assembly, wherein the sub-guide assembly includes a plurality of spaced apart sub-guide arms and a guide body, wherein the sub-guide arms have a derivation end, wherein the guide body is disposed on the bearing seat, wherein each The sub-guide arms are slidably arranged on the guide body in parallel, wherein each of the sub-guide arms corresponds to the wafer in the first placement groove of the wafer boat, so that in any of the sub-guide arms After the guide arm is driven to slide into the first storage space through the first inlet, the corresponding wafer located in the first placement slot is pushed by the branch guide arm, and follows the branch guide arm. While continuously sliding toward the first opening, the wafer is branched out from the first opening;

A foolproof mechanism, wherein the foolproof mechanism comprises at least one stopper and a belt shift assembly, the stopper is arranged to extend along the direction in which the plurality of sub-guide arms are arranged, and the stopper is capable of being used by all The belt shifting assembly is driven to be able to switch between the state of moving away from the moving path of the derivation end and the state of returning to the moving path of the derivation end. When the stopper moves, the stopper moves away from the moving path of the derivation end, thereby allowing the derivation end to pass the position of the stopper and extend into the first storage of the carrier wafer boat space.

According to an embodiment of the present invention, the bearing base forms a second bearing position for bearing a receiving wafer boat aligned with the first opening, wherein the receiving wafer boat has a second inlet and a second opening and a second storage space communicated with the second inlet and the second opening, at least one group of second placement grooves are formed on the inner wall of the carrier wafer boat that forms the second storage space, wherein the second storage space is The placement slot extends laterally and is interposed between the second inlet and the second opening, wherein the second inlet and the first opening are aligned, and wherein the receiving boat is carried on the first opening. After two bearing positions, each of the second placement slots is aligned with the first placement slot.

According to an embodiment of the present invention, the foolproof mechanism includes two of the stopper stops and two of the belt shifting assemblies, and each of the stopper stops can be driven by the belt shifting assembly and can be moved away from The mode of switching between the state of the moving path of the derivation end and the state of returning to the moving path of the derivation end is set on the bearing seat, and the two stoppers after moving away from the moving path of the derivation end are respectively The distance between the two stop stops held on both sides of the sub-guide arm and moved away from the moving path of the deriving end is set to allow the sub-guide arm to pass through.

According to an embodiment of the present invention, the belt shifting assembly includes at least one sliding block, a connecting rod and an elastic member, the stopper and the sliding block are respectively fixed to two ends of the connecting rod, and the elastic The sliding block is arranged between the sliding block and the blocking wall formed by the bearing seat, and the sliding block is slidably arranged on the bearing seat along a transverse direction perpendicular to the moving direction of the sub-guide arm.

According to an embodiment of the present invention, the foolproof mechanism further includes at least one limiting member, wherein the limiting member is disposed on the edge of the first bearing position of the bearing base.

According to an embodiment of the present invention, the limiting member and the sliding block of the belt shifting assembly form a bayonet with an adjustable size in the second bearing position.

According to an embodiment of the present invention, the wafer guide device includes an integral guide assembly, and the integral guide assembly includes an integral guide member and a plurality of driving members arranged in the same column, wherein the integral guide member forms A set of avoidance channels, wherein the height of each avoidance channel is at the same level as each of the sub-guide arms, so that when the sub-guide arms slide in the lateral direction, each of the sub-guide arms is respectively The first storage space can be entered into the first storage space from the first entrance of the carrier boat through the corresponding avoidance channel, and the driving member is arranged on each of the sub-guide arms of the sub-guide assembly, and between the derivation end of the sub-guide arm and the integral sub-guide member, wherein the driving member is arranged on the moving path of the integral sub-guide member to move on the integral sub-guide member , the driving member can move together with the movement of the integral sub-guide member.

According to an embodiment of the present invention, the driving member is implemented as a protrusion disposed on the sub-guide arm.

According to an embodiment of the present invention, the driving member can be telescopically disposed on the sub-guide arm in a direction perpendicular to the extension direction of the sub-guide arm.

According to an embodiment of the present invention, the guide body includes a main body and at least one first displacement limiting structure, the main body forms a first slideway, the first displacement restricting structure is disposed on the guiding main body, and the guiding main body At least one outlet is defined in communication with the first slideway, wherein the outlet is in communication with the first inlet, and the sub-guide arm is movably installed on the The first movement-limiting structure.

According to an embodiment of the present invention, the branch guide assembly includes at least a first taxi control structure, and the branch guide arm is fixedly connected to the first taxi control structure.

According to an embodiment of the present invention, the first sliding control structure includes at least one control pin and at least one limiting groove, the limiting groove is formed on the body, and the limiting groove is located on the first slideway Connected. The extending direction of the limiting slot is parallel to the moving direction of the sub-guide arm, the limiting slot is used to limit the moving direction of the control pin, one end of the control pin is connected to the sub-guide arm, and the One end of the control pin away from the sub-guide arm extends out of the limiting groove, so that the operator can operate the sub-guide arm.

According to an embodiment of the present invention, the sliding path of the sub-guide arm is located on a straight line where the diameter of the wafer carried in the carrier boat is located.

In order to achieve at least one of the above objects, according to another aspect of the present invention, the present invention provides a working method of a wafer guide device, and the working method of the wafer guide device includes:

A first bearing position is formed on the bearing seat, which is used to carry the bearing boat with the wafers to be separated;

The carrier boat carried on the first carrying position drives the stopper to move through the belt shifting assembly, so as to avoid a space for the movement of the guide arm carried on the carrier boat, wherein the stopper moves. The shift block is arranged to extend along the direction in which the plurality of sub-guide arms are arranged, and the stop block can be moved by the belt shifting assembly to move away from the moving path of the derivation end and return to the derivation end to move The mode of switching between the states of the paths is arranged on the carrier, wherein each of the sub-guide arms corresponds to the wafer in the first placement slot of the carrier boat;

The sub-guide arm is pushed, and the wafer corresponding to the pushed sub-guide arm and located in the first placement groove of the wafer carrier is separated out.

Description of drawings

FIG. 1 shows a schematic structural diagram of the bearing assembly of the present invention.

FIG. 2 shows a schematic diagram of the wafer guiding device according to the present invention guiding wafers from a carrier wafer boat to a receiving wafer boat.

FIG. 3 shows an enlarged schematic view of part A in FIG. 2 .

FIG. 4 shows a perspective view of the wafer guide apparatus according to the present invention.

FIG. 5 shows a schematic structural diagram of a part of the wafer guide apparatus according to the present invention.

FIG. 6 shows a schematic structural diagram of another part of the wafer guide apparatus according to the present invention.

FIG. 7 is a schematic diagram showing the driving member of the present invention in a state capable of blocking the driving member.

FIG. 8 shows a schematic diagram of the driving member of the present invention in a state in which the driving member cannot be blocked.

FIG. 9 shows a bottom view of the wafer guide apparatus of the present invention.

FIG. 10 shows a schematic diagram of one of the sliding blocks sliding when the carrier wafer boat is carried in the first carrying position.

FIG. 11 is a schematic diagram of another sliding block sliding when the receiving wafer boat is carried in the second carrying position.

Detailed ways

The following description serves to disclose the invention to enable those skilled in the art to practice the invention. The preferred embodiments described below are given by way of example only, and other obvious modifications will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It should be understood by those skilled in the art that in the disclosure of the present invention, the terms "portrait", "horizontal", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by vertical, horizontal, top, bottom, inner, outer, etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and to simplify the description, rather than to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus the above terms should not be construed as limiting the invention.

It should be understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be one. The number may be plural, and the term "one" should not be understood as a limitation on the number.

Referring to FIG. 1 to FIG. 11 , a wafer guide apparatus according to a preferred embodiment of the present invention will be described in detail below. The wafer guide apparatus is used to guide at least one wafer carried in a wafer boat assembly. Circle 700 for sub-derivation.

Referring to FIG. 1 , the wafer boat assembly includes a carrier wafer boat 800 and a receiving wafer boat 900 , and the carrier wafer boat 800 is detachably mounted on the receiving wafer boat 900 . The carrier boat 800 forms a first inlet 801 and a first opening 802, and a first storage space 8001 is formed between the first inlet 801 and the first opening 802 for storing the wafers 700 . The receiving boat 900 forms a second inlet 901 and a second opening 902 , and forms a second storage space 9001 between the second inlet 901 and the second opening 902 for storing the wafers 700 .

Through the wafer guide device of this embodiment, the wafers 700 located in the carrier boat 800 can be separated to the receiving boat 900 , and the wafers 700 carried in the receiving boat 900 can also be separated. The wafer 700 is guided to the carrier boat 800 . That is to say, it is only necessary to adjust the relative positions of the carrier boat 800 and the receiving boat 900 with respect to the wafer guide device, and then the wafers 700 in the carrier boat 800 can be separated. Guide the receiving wafer boat 900 or guide the wafers 700 in the receiving wafer boat 900 to the carrying wafer boat 800 .

In order to enable those skilled in the art to understand the specific implementation of the present invention, in this embodiment, the wafer 700 located in the carrier wafer boat 800 is guided to the receiving device only through the wafer guiding device. The crystal boat 900 is taken as an example to illustrate.

At least one set of first placement grooves 803 is formed on the inner wall of the carrier wafer boat 800 on which the first storage space 8001 is formed, wherein the first placement grooves 803 extend laterally and are between the first inlet 801 and the The wafer 700 is placed between the first openings 802 .

Preferably, the carrier wafer boat 800 forms a plurality of horizontal first placement grooves 803 at different heights and spaced by a predetermined distance, so as to place the wafers 700 horizontally. The receiving boat 900 is formed with a plurality of horizontal second placement grooves 903 at different heights and spaced by a predetermined distance. The second placement grooves 903 extend in the lateral direction for carrying the wafers 700 .

It is worth mentioning that the dimensions of the receiving boat 900 and the carrying boat 800 are the same, and the extending direction of each of the second placement grooves 903 on the receiving boat 900 is the same as the carrying boat 800 . The extension directions of the first placement grooves 803 on the The wafer 700 can be slid into the second placement slot 903 via the first placement slot 803 .

Referring to FIGS. 6 and 2 , the wafer guide apparatus includes a guide assembly 10 . The sub-guide assembly 10 includes at least one sub-guide arm 11, wherein the sub-guide arm 11 is configured to be movable in a lateral direction.

Preferably, the sub-guide assembly 10 includes a plurality of the sub-guide arms 11 . A plurality of the sub-guide arms 11 are arranged at intervals, and each of the sub-guide arms 11 is arranged to be slidable laterally independently. Therefore, when it is necessary to use the wafer guide device to guide the wafers 700 carried in the carrier boat 800 to the receiving boat 900 , at least one of the guide components 10 only needs to be separated. The guide arm 11 is aligned with the first inlet 801 of the carrier boat 800 , the first opening 802 of the carrier boat 800 and the second opening 902 of the receiving boat 900 alignment. Then, as the sub-guide arm 11 is operated to move laterally and extend into the first storage space 8001 from the first inlet 801 , the wafer 700 carried in the first placement slot 803 will is pushed into the second placement slot 903 of the receiving boat 900 .

Preferably, the sliding path of the sub-guide arm 11 is located on a straight line where the diameter of the wafer 700 carried in the carrier wafer boat 800 is located, so that the wafer 700 can be uniformly stressed.

Referring to FIG. 2 , the guide assembly 10 includes a guide body 12 . The guide body 12 forms at least one first slideway 1201 , and the sub-guide arm 11 is laterally slidably disposed on the first slideway 1201 .

The guide body 12 includes a body 121 and at least one first movement limiting structure 122 . The main body 121 forms the first slideway 1201, and the first movement limiting structure 122 is disposed on the main body 121 to limit the movement of the sub-guide arm 11, and the sub-guide arm 11 is movable along the The extension direction of the first movement limiting structure 122 is movably installed on the first movement limiting structure 122 . The guide body 12 defines at least one outlet 12201 that communicates with the first slideway 1201 , and communicates with the first inlet 801 through the outlet 12201 , and the sub-guide arm 11 is set through the first inlet 801 The first slideway 1201 can be moved in or out in a horizontal direction.

In this way, when the sub-guide arm 11 pushes the wafer 700 to move along the second storage space 9001 , the wafer 700 located in the carrying boat 800 is transferred to the receiving boat 900 .

It is worth mentioning that the distance that the guide arm 11 can slide along the first slideway 1201 is greater than the width of the carrier wafer boat 800, so that the wafer 700 can be completely guided to the receiving wafer. Boat 900.

Preferably, the body 121 has two side walls, wherein opposite sides of the two side walls are laterally provided with a groove for defining the first slideway 1201 .

Both sides of the sub-guide arm 11 are slidably disposed in the two grooves, so as to guide the sub-guide arm 11 to slide laterally.

Referring to FIG. 2 and FIG. 4 , preferably, the sub-guide assembly 10 further includes at least one first sliding control structure 13 , and the sub-guide arm 11 is fixedly connected to the first sliding control structure 13 for controlling all the The sliding distance of the sub-guide arm 11 is described.

Specifically, the first sliding control structure 13 includes at least one first control pin 131 and at least one first limiting groove 132 , the first limiting groove 132 is formed in the main body 121 , and the first limiting groove 132 is The slot 132 communicates with the first slideway 1201 . The extending direction of the first limiting slot 132 is parallel to the moving direction of the sub-guide arm 11 , and the first limiting slot 132 is used to limit the moving direction of the first control pin 131 . One end of 131 is connected to the sub-guide arm 11, and one end of the first control pin 131 away from the sub-guide arm 11 extends out of the first limiting groove 132, so that the operator can operate the sub-guide arm 11.

In a variant embodiment, the first sliding control structure 13 includes a driving unit, wherein the driving unit is configured as an air cylinder, a hydraulic cylinder or any component capable of driving the sub-guide arm 11 to move laterally.

It is worth mentioning that since there are multiple sub-guide arms 11 , and the sub-guide arms 11 are respectively installed at different levels of the first slideway 1201 . In this way, each of the wafers 700 at different levels can be separately separated by the separating arms 11 having the same level. And during separation, all other wafers on top of the wafer 700 do not need to be removed.

It can be understood that when the operator controls the first control pin 131 to move along the first limiting groove 132 to the side close to the outlet 12201 , the first control pin 131 drives the branch guide arm 11 The wafers 700 located in the carrier boat 800 are transferred to the receiving boat 900 by moving to the receiving boat 900 via the carrying boat 800 . And according to actual requirements, the wafers 700 in different horizontal positions are exported by using the sub-guide arms 11 with different horizontal heights.

Referring to FIG. 2 , FIG. 3 and FIG. 6 , further, the wafer guide device further includes an integral guide assembly 20 .

The integral guide assembly 20 is laterally slidably disposed on the moving path of the guide arm 11, wherein at least one avoidance channel 201 is provided on the integral guide assembly 20, as shown in FIG. The height of the avoidance channel 201 is at the same level as each of the sub-guide arms 11, so that when the sub-guide arms 11 slide laterally, each of the sub-guide arms 11 can pass through the corresponding sub-guide arms 11 respectively. The avoidance channel 201 enters the first storage space 8001 from the first inlet 801 of the carrier wafer boat 800 , and then the wafer 700 located in the first storage space 8001 is deduced to the receiving The second storage space 9001 of the wafer boat 900 .

Referring specifically to FIG. 6 , the integral guide assembly 20 includes an integral guide member 21 and a driving member 22 , wherein the integral guide member 21 forms the lateral escape channel 201 . The driving member 22 is disposed on each of the sub-guide arms 11 of the sub-guide assembly 10, and is interposed between the derivation end 111 of the sub-guide arm 11 and the integral sub-guide member 21, In addition, the entraining member 22 is disposed on the moving path of the integral sub-guide member 21 .

Preferably, the integral sub-guide assembly 20 includes a plurality of the driving members 22 arranged in the same row, that is, the distance between each of the driving members 22 and the deriving end 111 of the sub-guide arm 11 In the same way, when the integral sub-guide member 21 moves, the driving member 22 can move together with the movement of the integral sub-guide member 21, so that all the sub-guide arms 11 synchronously push the The wafers in the carrier boat 800 are moved to the receiving boat 900 . In this way, the wafer guide device can guide all the wafers 700 in the carrier boat 800 to the receiving boat 900 at one time.

In one embodiment, the driving member 22 is implemented as a protrusion disposed on the sub-guide arm 11 , so that when the integral sub-guide member 21 moves toward the carrier wafer boat 800 , the integral sub-guide member 21 moves The moving member 21 gradually approaches the driving member 22, so that the integral sub-guide member 21 drives the driving member 22 to slide together, so that all the sub-guide arms 11 simultaneously push the carrier wafer 800 on the carrier boat 800. The wafers in are moved to the receiving boat 900 . Thus, the wafers 700 in the carrier boat 800 are all directed to the receiving boat 900 at one time.

Preferably, the driving member 22 can be telescopically disposed on the sub-guide arm 11 along the extending direction of the sub-guide arm 11 . In this way, when only at least two of the wafers 700 in the carrier boat 800 need to be directed to the receiving boat 900, the arm 11 corresponding to the wafer to be directed can be directed. The driving member 22 on the top extends out, and the remaining driving members 22 are retracted to the corresponding sub-guide arms 11 , so that when the integral sub-guide member 21 moves, the retracted driving members 22 are retracted. The sub-guide arm 11 can avoid the sliding space of the integral sub-guide member 21; Slide toward the first storage space 8001 for carrying the wafer boat 800 , so that at least two corresponding wafers 700 are synchronously distributed to the receiving wafer boat 900 .

Preferably, the driving member 22 is configured as a telescopic pin structure, specifically including a spring and a telescopic pin, wherein the spring is sleeved on the telescopic pin, and the protruding part of the telescopic pin forms the Raised. When the telescopic pin is in the retracted state, the entire telescopic pin is hidden in the sub-guide arm 11 .

The integral guide assembly 20 further includes a push arm 23, as shown in FIG. 3 , FIG. 7 and FIG. 8 . The main body 121 of the guide body 12 is provided with a second slideway 1202 parallel to the first slideway 1201 , wherein the integral sub-guide member 21 is fixed to the end of the push arm 23 , and The push arm 23 is slidably disposed on the second slideway 1202 . In this way, when the pushing arm 23 is pushed, the integral sub-guide member 21 will also slide horizontally, until the driving member 22 drives all the sub-guide arms 11 to push the carrier wafer boat together. Wafer motion in 800.

It is worth mentioning that the size of the integral guide member 21 is set to be suitable for sliding into the first storage space 8001 from the first inlet 801 of the carrier wafer boat 800 .

In a modified embodiment, the integral guide member 21 of the integral guide assembly 20 includes a branch guide body 211 and an integral guide plate 212 , wherein the branch guide body 211 forms the second slideway 1202 , wherein the integral sub-guide plate 212 forms the avoidance channel 201 .

Referring to FIG. 5 , preferably, the integral guide assembly 20 further includes at least one second sliding control structure 24 , and the push arm 23 is controllably connected to the second sliding control structure 24 for controlling the The push arm 23 moves a distance relative to the main body 121 , so as to control the sliding distance of the sub-guide arm 11 as a whole.

Specifically, the second sliding control structure 24 forms at least one second chute 241 and at least one second limiting pin 242 , and the second chute 241 is formed on the main body 121 . The second chute 241 communicates with the first chute 1201, the extension direction of the second chute 241 is parallel to the moving direction of the sub-guide arm 11, and one end of the second limit pin 242 is connected to One end of the push arm 23 and the second limit pin 242 away from the push arm 23 extends out of the second chute 241, so that the operator can manipulate the second limit pin 242, and by controlling the push The arm 23 thus controls the sliding distance of the sub-guide arm 11 as a whole.

Referring to FIG. 4 , in a preferred embodiment, the integrated guide assembly 20 further includes at least one integrated reset component 25 , the integrated reset component 25 is mounted on the body 121 , and the integrated reset component 25 is used to The sub-guide arm 11 is reset.

Referring to FIG. 4 , the overall reset assembly 25 includes a toggle member 251 , and the toggle member 251 is mounted on the body 121 . The toggle member 251 has an initial position. In the initial position, the toggle member 251 is disposed at one end of the body 121 close to the outlet 12201 . The toggle member 251 pushes all the first control pins 131 close to the outlet 12201 to one end away from the outlet 12201 , so as to reset the branch guide arm 11 as a whole. In this way, the toggle member 251 moves from the initial position to the end away from the carrier boat 800 to push the first control pin 131 close to the carrier boat 800 away from the carrier boat 800 . One end of the wafer boat 800 is supported, so as to realize the reset of all the sub-guide arms 11 .

The integral reset assembly 25 further includes at least one sliding reset slot 252, the toggle member 251 is movably disposed in the slide reset slot 252, and the slide reset slot 252 is provided on the toggle member 251 and the toggle member 252. Between the guide bodies 12 , the movement of the toggle member 251 is limited.

The sliding reset groove 252 may be implemented as a third groove and a protrusion, and the protrusion is installed in the third groove to limit the movement of the toggle member 251 .

In one embodiment, the protrusion is disposed on a side of the toggle member 251 close to the guide body 12 , and the third groove is formed on a side of the guide body 12 close to the toggle member 251 . side.

It can be understood that, the operator controls the first control pin 131 to move along the first limiting groove 132 to the side close to the outlet 12201 , and the sub-guide arm 11 passes through the avoidance channel 201 to the side of the exit 12201 . The first storage space 8001 moves in the direction, so that the guide arm 11 pushes the wafer 700 to move from the carrier boat 800 to the receiving boat 900 . The operator can control the movement of the guide arms 11 with different heights to transfer the wafers 700 with different heights. The operator controls the second limit pin 242 to move along the second chute 241 to the side close to the outlet 12201 , and the second limit pin 242 drives the push arm 23 to move closer to the outlet Move in the direction of 12201, then, the push arm 23 pushes the integral guide member 21 to move from the carrying boat 800 to the receiving boat 900. Under the action of the driving member 22, the driving member 22 All the guide arms 11 running through the avoidance channel 201 are driven to transfer the entire wafer 700 in the carrier boat 800 to the receiving boat 900 . The wafer separating and guiding device can realize the purpose of separate wafer separation and also realize the operation of overall transfer.

Further, the wafer guide device further includes a bearing seat 30 . The carrier base 30 forms a first carrier position and a second carrier position, wherein the first carrier position is used to carry the carrier wafer boat 800 , wherein the second carrier position is used to carry the receiving wafer boat 900.

The branch guide assembly 10 is mounted on the bearing base 30 , and the support base 30 is used to support the wafer boat assembly, the branch guide assembly 10 and the overall branch guide assembly 20 .

Referring to FIG. 2 , FIG. 4 , FIG. 5 , FIG. 9 and FIG. 10 , especially referring to FIG. 5 and FIG. 9 , further, the wafer guide apparatus further includes at least one foolproof mechanism 40 . The foolproof mechanism 40 includes at least one stopper 41 and a belt-shifting component 42 . The stopper 41 is arranged to extend along a direction in which the plurality of sub-guide arms 11 are arranged. Specifically, in at least one embodiment, the stopper 41 is arranged to extend in a vertical direction. The stopper 41 is provided at the place in such a way that it can be driven by the belt shifting assembly 42 to switch between a state of moving away from the moving path of the derivation end 111 and a state of returning to the moving path of the derivation end 111 . The bearing seat 30 is described. Therefore, when the belt shifting assembly 42 drives the stopper 41 to move, the stopper 41 moves away from the moving path of the deduction end 111 , thereby allowing the deduction end 111 to pass the distance of the stopper 41 . position and extend into the first storage space 8001 carrying the wafer boat 800 .

Preferably, the belt shift assembly 42 is disposed on the edge of the first bearing position, so that when the carrier wafer boat 800 is placed in the first bearing position, the belt shift assembly 42 is triggered to drive the The stop 41 moves.

Specifically, in one embodiment, the belt shifting assembly 42 includes at least a sliding block 421 , a connecting rod 422 and an elastic member 423 . The stopper 41 and the sliding block 421 are respectively fixed to two ends of the connecting rod 422 , and the elastic member 423 is disposed between the blocking wall formed by the sliding block 421 and the bearing seat 30 . .

The sliding block 421 is slidably disposed on the bearing base 30 along a lateral direction perpendicular to the moving direction of the sub-guide arm 11 . That is, when the sliding block 421 is pushed to move toward the edge of the bearing base 30 , the elastic member 423 is compressed, and at the same time, the end portion is fixed to the connecting rod 422 of the sliding block 421 . It is also driven, so that the stopper 41 can be switched between a state of moving away from the moving path of the derivation end 111 and a state of returning to the state of returning to the moving path of the derivation end 111 .

The sliding block 421 is arranged at the boundary of the second bearing position or the boundary of the first bearing position, preferably, the sliding block 421 is arranged at the boundary of the second bearing position, and is When the receiving boat 900 is placed in the second bearing position, the sliding block 421 is pushed away by the receiving boat 900 and slides toward the edge of the bearing seat 30 , and correspondingly, the elastic member 423 is pushed away by the receiving boat 900 . Compression makes the sliding block 421 press the receiving boat 900 . At the same time, driven by the connecting rod 422 , the stopper 41 is also moved away from the moving path of the deriving end 111 , thereby allowing the guiding arm 11 to be guided into the carrying boat 800 . of the wafer 700.

It can be understood that, only when the receiving boat 900 is correspondingly placed in the second bearing position, the stopper 41 will move away from the moving path of the deriving end 111 . When the receiving boat 900 is not placed in the second carrying position, the lead end 111 of the branch guide arm 11 is blocked by the stopper 41 and cannot extend into the first storage space 8001 Therefore, the foolproof mechanism 40 can effectively prevent the user from operating the sub-guide arm 11 under the condition of forgetting to place the carrier wafer boat 800 . In this way, the wafer 700 can be prevented from falling from the carrier boat 800 due to the operation of the sub-guide arm 11 without the carrier boat 800 .

Preferably, the foolproof mechanism 40 includes two stoppers 41 and two belt shifting assemblies 42 , each of the stopper 41 can be driven by the belt shifting assembly 42 and can be moved away from the The mode of switching between the state of the moving path of the derivation end 111 and the state of returning to the moving path of the derivation end 111 is provided on the bearing base 30 . And the two stoppers 41 after moving away from the moving path of the derivation end 111 are respectively held on both sides of the sub-guide arm 11 , and the two stoppers 41 after moving away from the moving path of the derivation end 111 . The spacing between the shift stops 41 is set to allow the sub-guide arm 11 to pass through. After moving away from the moving path of the deriving end 111 , the distance between the two stoppers 41 is set to allow the integral guide member 21 to pass through.

In this way, only when the carrying wafer boat 800 and the receiving wafer boat 900 are simultaneously carried in the first carrying position and the second carrying position, respectively, the sub-guide arm 11 and/or the whole Only the split guide 21 can be allowed to operate. In this way, in the case where the first carrying position does not carry the carrying wafer boat 800 and/or the second carrying position does not carry the receiving wafer boat 900, misoperation by the operator can be effectively avoided, thereby protecting the Wafer 700.

At least one sliding through groove 301 is formed on the bearing base 30 , and the sliding block 421 is slidably disposed in the sliding through groove 301 , so that the sliding block 421 can follow the extending direction of the sliding through groove 301 . slide. That is, the extending direction of the sliding through groove 301 is set to be consistent with the sliding direction of the sliding block 421 , and the sliding through groove 301 is set through the top and bottom of the bearing base 30 . The belt shifting assembly 42 is disposed at the bottom of the carrier 30 to prevent the linkage of the belt shifting assembly 42 from interfering with the carrier wafer boat 800 and/or the receiving wafer boat 900 .

The foolproof mechanism 40 further includes at least one limiting member 43 , wherein the limiting member 43 is disposed on the edge of the first bearing position and/or the edge of the second bearing position of the bearing base 30 . . The limiting member 43 and the sliding block 421 of the belt shifting assembly 42 form a bayonet with an adjustable size at the first bearing position and/or the second bearing position, so that when the bearing crystal When the boat 800 and/or the receiving boat 900 are placed in the corresponding first vehicle space and/or the second carrying space, the carrying boat 800 and/or the receiving boat 900 can be stuck in the corresponding position. In this way, the first placement slot 803 on the carrier wafer boat 800 and the second placement slot 903 on the receiving wafer boat 900 at the same height as the first placement slot 803 can be placed in the The wafers 700 are aligned in the sliding direction. In this way, it can be ensured that the wafers 700 will not be affected by the second placement slot during the process of sliding from the carrier boat 800 to the receiving boat 900 . 903 is not aligned with the first placement groove 803 and is blocked and crushed.

In other words, in this embodiment, providing the foolproof mechanism 40 can facilitate the alignment of the first placement groove 803 and the second placement groove 903 .

The limiting member 43 includes a fixing block 431, wherein the fixing block 431 is fixed on the edge of the first bearing position and/or the edge of the second bearing position.

9, 10 and 11, preferably, the limiting member 43 includes a movable block 431A, a spring 432 and a sliding rod 433, wherein the movable block 431A is arranged on the edge of the first bearing position and/or the edge of the second bearing position, wherein the sliding rod 433 is provided on the bearing seat 30 , wherein the spring 432 is compressively held on the movable block 431A and the bearing seat 30 . between the blocks, so that the movable block 431A can be returned to the edge of the first bearing position and/or the edge of the second bearing position and away from the edge of the first bearing position and/or The position of the edge of the second bearing position is changed, wherein when the movable block 431A is far away from the edge of the first bearing position and/or the edge of the second bearing position, the loading boat 800 or The receiving boat 900 is clamped.

Preferably, the limiting member 43 and the sliding block 421 surround the edge of the first carrying position and/or the edge of the second carrying position, so that the carrying boat 800 and the receiving boat are 900 can be guided by the limiting member 43 and the sliding block 421 to a position corresponding to the sub-guide arm 11 . That is to say, the foolproof mechanism 40 is also defined as a guide mechanism.

Preferably, the fool-proof mechanism 40 is provided with two limiting members 43 , and one of the limiting members 43 is set at a position opposite to one of the sliding blocks 421 to form a position with the sliding blocks 421 . The size of the bayonet can be adjusted, and the other limiting member 43 is arranged at a position opposite to the other sliding block 421, so as to form another size-adjustable socket with the other sliding block 421. said bayonet.

When both the carrying boat 800 and the receiving boat 900 are placed in the first carrying position and the second carrying position, the two sliding blocks 421 are held by the carrying boat 800 and the second carrying position, respectively. The receiving boat 900 is pressed and moved toward the edge of the carrier 30 . On the one hand, the stopper 41 will be driven by the belt moving assembly 42 to move away from the moving path of the deriving end 111 , which is the On the other hand, the carrier boat 800 and the receiving boat 900 will both be stuck in the corresponding first and second bearing positions, and further Ensure that the second placement groove 903 is aligned with the first placement groove 803 .

According to another aspect of the present invention, the present invention also provides a working method of a wafer singling device, and the working method of the wafer singling device includes:

A first carrying position is formed on the carrying seat 30 for carrying the carrying wafer boat 800 containing the wafers to be separated;

The carrier boat 800 carried on the first carrying position drives the stopper 41 to move through the belt shifting component 42 to avoid the guide arm for guiding the carrier boat 800 11 moving space, wherein the stopper 41 is arranged to extend along the direction in which the plurality of sub-guide arms 11 are arranged, and the stopper 41 can be driven by the belt shifting assembly 42 to move away from the The mode of switching between the state of the moving path of the derivation end 111 and the state of returning to the moving path of the derivation end 111 is set on the bearing seat 30 , wherein each of the sub-guide arms 11 and the bearing boat 800 are connected to each other. The wafer 700 in the first placement groove 803 corresponds to;

The sub-guide arm 11 is pushed, and the wafer 700 corresponding to the pushed sub-guide arm 11 and located in the first placement groove 803 of the carrier wafer boat 800 is separated out.

According to yet another aspect of the present invention, by means of the foolproof mechanism 40 , the receiving boat 900 and the carrying boat 800 can be connected to the branching arm of the branching assembly 10 on the bearing seat 30 . 11 Move path alignment. Specifically, when the receiving boat 900 and the carrying boat 800 are placed in the first carrying position and the second carrying position, respectively, the sliding block 421 of the belt shifting assembly 42 and the The limiting member 43 can guide the carrying boat 800 and the receiving boat 900 to a position aligned with the moving path of the sub-guide arm 11 .

In this way, in a preferred embodiment, during the sliding process of the sub-guide arm 11 , the sliding path of the sub-guide arm 11 can always be maintained on the wafer located in the wafer carrier 800 . The diameter of the circle 700 lies on a straight line. In this way, the wafers 700 in the carrier boat 800 will not be damaged due to uneven force.

It should be understood by those skilled in the art that the embodiments of the present invention shown in the above description and the accompanying drawings are only examples and do not limit the present invention. The advantages of the present invention have been fully and effectively realized. The functional and structural principles of the present invention have been shown and described in the embodiments, and the embodiments of the present invention may be modified or modified in any way without departing from the principles.

Claims (10)

1. The wafer dividing and guiding device is used for dividing and guiding at least one wafer out of a bearing wafer boat through a dividing and guiding arm of at least one dividing and guiding assembly, wherein the dividing and guiding assembly comprises a guiding main body and a plurality of dividing and guiding arms arranged at intervals, each dividing and guiding arm is provided with a pushing and guiding end, the dividing and guiding arms are arranged on the guiding main body in a parallel sliding mode, the bearing wafer boat is provided with a first inlet, a first outlet and a first storage space communicated with the first inlet and the first outlet, at least one group of first placing grooves are formed in the inner wall of the bearing wafer boat, the first placing grooves extend in the transverse direction and are arranged between the first inlet and the first outlet to place the wafer, and the wafer dividing and guiding device is characterized by comprising:

the bearing seat forms a first bearing position for bearing the wafer boat;

at least two guiding mechanisms, wherein each guiding mechanism comprises at least one stopping block, a belt moving component and at least two limiting components, the stopping block is arranged on the bearing seat in a manner that the stopping block can be driven by the belt moving component to switch between a state of moving away from the pushing end moving path and a state of returning to the pushing end moving path, when the belt moving component drives the stopping block to move, the stopping block moves away from the pushing end moving path, so that the pushing end is allowed to cross the position of the stopping block and extend into the first storage space of the bearing wafer boat, the belt moving component comprises at least one sliding block, a connecting rod and an elastic piece, the stopping block and the sliding block are respectively fixed at two ends of the connecting rod, and the elastic piece is arranged between the sliding block and a blocking wall formed by the bearing seat, the sliding blocks are slidably arranged on the bearing seats along a transverse direction perpendicular to the moving direction of the guide arm, the sliding block of one of the belt moving assemblies is arranged at the edge of a plurality of first bearing positions, the sliding block of the other belt moving assembly is arranged at the edge of the second bearing position, one of the limiting members is arranged at a position opposite to the sliding block so as to form one size-adjustable bayonet with the sliding block, and the other limiting member is arranged at a position opposite to the other sliding block so as to form the other size-adjustable bayonet with the other sliding block.

2. The wafer dividing and guiding apparatus as claimed in claim 1, wherein the guiding mechanism comprises two stopping blocks and two belt moving assemblies, each stopping block is disposed on the carrier in such a manner that it can be moved by the belt moving assembly to switch between a state of moving away from the pushing end moving path and a state of returning to the pushing end moving path, the two stopping blocks after moving away from the pushing end moving path are respectively retained on two sides of the dividing and guiding arm, and the distance between the two stopping blocks after moving away from the pushing end moving path is set to allow the dividing and guiding arm to pass through.

3. The wafer dividing and guiding apparatus as claimed in claim 1, wherein the wafer dividing and guiding apparatus comprises an integral dividing and guiding assembly, the integral dividing and guiding assembly comprises an integral dividing and guiding member and a plurality of driving members arranged in the same row, wherein the integral dividing and guiding member forms a set of avoiding channels, each of the avoiding channels is located at a same level as each of the dividing and guiding arms, so that each of the dividing and guiding arms can enter the first storage space from the first inlet of the wafer boat through the corresponding avoiding channel when the dividing and guiding arm slides in the transverse direction, the driving member is disposed on each of the dividing and guiding arms of the dividing and guiding assembly and between the pushing end of the dividing and guiding arm and the integral dividing and guiding member, wherein the driving member is disposed on a moving path of the integral dividing and guiding member so as to move the integral dividing and guiding member, the entrainment member is movable with the movement of the integral distributor.

4. The wafer indexing apparatus of claim 3, wherein the catch is implemented as a protrusion disposed on the indexing arm.

5. The wafer dividing and guiding apparatus as claimed in claim 3, wherein the driving member is telescopically disposed on the dividing arm in a direction perpendicular to an extending direction of the dividing arm.

6. The wafer de-guiding apparatus as claimed in claim 1, wherein the guide body includes a body forming a first slide way and at least a first movement limiting structure disposed on the guide body, the guide body defining at least an outlet communicating with the first slide way, wherein the outlet communicates with the first inlet, the guide arm is movably mounted to the first movement limiting structure along an extending direction of the first movement limiting structure, the guide assembly includes at least a first sliding control structure, the guide arm is fixedly connected to the first sliding control structure, the first sliding control structure includes at least a control pin and at least a limiting groove, the limiting groove is formed on the body and communicates with the first slide way, the extending direction of the limiting groove is parallel to the moving direction of the guide arm, the limiting groove is used for limiting the moving direction of the control pin, one end of the control pin is connected to the branch guide arm, one end part, far away from the branch guide arm, of the control pin extends out of the limiting groove, so that an operator can operate the branch guide arm, the integral branch guide assembly further comprises a pushing arm, the body of the guide main body is provided with a second slide way parallel to the first slide way, the integral branch guide is fixed at the end part of the pushing arm, and the pushing arm is slidably arranged on the second slide way.

7. The wafer de-indexing apparatus as claimed in claim 6, wherein the integral de-indexing assembly further comprises at least a second sliding control structure, the push arm being controllably connected to the second sliding control structure for controlling a distance of movement of the push arm relative to the body, thereby controlling a sliding distance of the integral de-indexing arm.

8. The wafer de-guiding apparatus as claimed in claim 7, wherein the second sliding control structure forms at least a second sliding slot and at least a second limiting pin, the second sliding slot is formed on the body, wherein the second sliding slot is connected to the first sliding channel, the extending direction of the second sliding slot is parallel to the moving direction of the de-guiding, one end of the second limiting pin is connected to the pushing arm, and one end of the second limiting pin, which is far away from the pushing arm, extends out of the second sliding slot.

9. The wafer de-indexing apparatus of claim 8, wherein the integral de-indexing assembly comprises at least one integral repositioning assembly mounted to the body, the integral repositioning assembly being configured to reposition the integral de-indexing arm.

10. The wafer de-guiding apparatus as claimed in claim 9, wherein the integral reset assembly includes a toggle member and a sliding reset slot, the toggle member is mounted to the body, the toggle member has an initial position in which the toggle member is disposed at an end of the body near the outlet, the toggle member is movably disposed in the sliding reset slot, and the sliding reset slot is disposed between the toggle member and the guiding body.

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