CN114923928A - A dual optical path confluence chip detection device - Google Patents
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Abstract
公开了一种双光路合流芯片检测装置,包括底座、双光路合流模块和检测镜组模块,双光路合流模块和检测镜组模块固定在底座上,待检测芯片在外部芯片拾取结构的作用下被压入双光路合流模块,双光路合流模块外侧固定的光源打亮芯片两个表面形成的光路经过双光路合流模块中的分光镜、等腰直角棱镜、转像棱镜后以汇合的双光路沿着水平光路方向进入检测镜组模块,在相机上形成一张待处理的图片;检测镜组模块包含镜组、导轨和电机模组,镜组固定在导轨上,在电机的带动下镜组能够前后移动实现焦距的调整,相比于传统的人工检测或者检测系统,可以简化检测的结构和步骤,节省空间,方便嵌入自动化生产设备,且适用不同尺寸芯片的检测需求。
A dual-optical path confluence chip detection device is disclosed, comprising a base, a dual-optical path confluence module and a detection mirror group module, the dual-optical path confluence module and the detection mirror group module are fixed on the base, and a chip to be detected is picked up by an external chip pickup structure. Press into the dual-optical path confluence module, and the light source fixed on the outside of the dual-optical path confluence module illuminates the two surfaces of the chip. The horizontal light path enters the detection mirror group module, and a picture to be processed is formed on the camera; the detection mirror group module includes a mirror group, a guide rail and a motor module. The mirror group is fixed on the guide rail. Driven by the motor, the mirror group can move forward and backward. Compared with the traditional manual inspection or inspection system, the adjustment of the focal length can be realized by moving, which can simplify the structure and steps of inspection, save space, facilitate embedding in automatic production equipment, and is suitable for the inspection requirements of chips of different sizes.
Description
技术领域technical field
本发明涉及光学检测领域,具体是一种双光路合流芯片检测装置。The invention relates to the field of optical detection, in particular to a dual-optical path confluence chip detection device.
背景技术Background technique
晶圆切割为单个晶粒(半成品芯片)后,通常需要对芯片各个面进行缺陷和脏污等物理检查,以便进行粘片固化工序,传统采用人工检测或设备自动检测,人工检测面临定位精度差,容易会造成误差,效率低下,检测精度不高,且增加污染源可能会损坏或污染芯片等问题;设备自动检测多为单面检测,检测时间长,成本高,现有的多面检测是通过设置一套检测系统,分次对各面进行检测实现的,同样存在检测时间长、产能显著降低、造价昂贵等问题,现有的检测设备通常在一个平面上实现光路检测和镜组成像,占用空间大,且现有的自动检测设备结构繁琐,不利于嵌入自动化生产设备。After the wafer is cut into a single die (semi-finished chip), it is usually necessary to perform physical inspection on all sides of the chip, such as defects and dirt, in order to carry out the bonding and curing process. Traditionally, manual inspection or automatic equipment inspection is used. Manual inspection faces poor positioning accuracy. , it is easy to cause errors, low efficiency, low detection accuracy, and the increase of pollution sources may damage or contaminate the chip and other problems; the automatic detection of equipment is mostly single-sided detection, the detection time is long, and the cost is high. The existing multi-sided detection is performed by setting A set of detection system, which is implemented by detecting each surface in stages, also has problems such as long detection time, significantly reduced production capacity, and high cost. The existing detection equipment usually realizes optical path detection and mirror imaging on one plane, occupying space. It is large, and the existing automatic detection equipment has a complicated structure, which is not conducive to embedding automatic production equipment.
发明内容SUMMARY OF THE INVENTION
本发明提出了一种双光路合流芯片检测装置,以解决上述背景技术中提出的问题,为实现上述目的,本发明提供如下方案:The present invention proposes a dual-optical path confluence chip detection device to solve the problems raised in the above-mentioned background technology. In order to achieve the above-mentioned purpose, the present invention provides the following solutions:
根据本发明实施例的一种双光路合流芯片检测装置包括双光路合流模块和检测镜组模块,待检测芯片在垂直方向上放入双光路合流模块,被照明的待检测芯片的两个表面分别形成第一光路和第二光路,第一光路和所述第二光路在双光路合流模块中形成方向垂直且光线边界无缝汇合的双光路,双光路合流模块包括转像棱镜,双光路经由转像棱镜反射后沿着水平光路方向进入检测镜组模块,检测镜组模块可位移地设置于所述水平光路方向上。According to an embodiment of the present invention, a dual-optical path confluence chip detection device includes a dual-optical path confluence module and a detection mirror group module. The chip to be detected is placed in the dual-optical path confluence module in the vertical direction, and the two surfaces of the illuminated to-be-detected chip are respectively A first optical path and a second optical path are formed, and the first optical path and the second optical path form a dual optical path whose direction is vertical and the light boundary seamlessly merges in the dual optical path confluence module. After being reflected by the prism, it enters the detection lens group module along the direction of the horizontal optical path, and the detection lens group module is displaceably arranged in the direction of the horizontal optical path.
待检测芯片通过外部芯片拾取机构被压入双光路合流模块中,被照明的待检测芯片的两个表面形成的第一光路和第二光路在双光路合流模块中被汇合成方向垂直向下的双光路,使得待检测芯片的两个表面可以用一组视觉系统进行检测,提高了芯片表面检测的效率,有效的降低了检测的时间;The chip to be inspected is pressed into the dual-optical path confluence module through the external chip pickup mechanism, and the first optical path and the second optical path formed by the two surfaces of the illuminated chip to be inspected are merged in the dual-optical path confluence module into a vertical downward direction. Double optical paths, so that the two surfaces of the chip to be tested can be detected by a set of vision systems, which improves the efficiency of chip surface detection and effectively reduces the detection time;
汇合的双光路通过转像棱镜后发生反射,使得汇合的双光路由垂直方向转为水平方向,并沿着水平光路方向进入检测镜组模块,传统芯片检测装置通常在一个方向上完成光路输出和检测成像,使得芯片表面检测装置的同一平面上的尺寸过大,转像棱镜的设置使得光路的汇合和输出与镜组检测在两个平面上进行,能够节省芯片检测装置的空间,更方便于嵌入自动化生产设备;The combined dual optical paths are reflected after passing through the image relay prism, so that the combined dual optical paths are converted from vertical to horizontal, and enter the detection lens module along the horizontal optical path. Traditional chip detection devices usually complete the optical output and output in one direction. The detection imaging makes the size of the same plane of the chip surface detection device too large. The setting of the relay prism makes the convergence of the light path and the output and the detection of the mirror group to be carried out on two planes, which can save the space of the chip detection device and is more convenient. Embedded in automated production equipment;
检测镜组模块可位移地设置于水平光路方向上,使得检测镜组模块能够实现焦距的调节,适应不同尺寸大小芯片的检测。The detection lens group module is displaceably arranged in the direction of the horizontal optical path, so that the detection lens group module can realize the adjustment of the focal length and adapt to the detection of chips of different sizes.
在一些具体实施例中,双光路合流模块还包括依次设置在垂直方向上的转像光学元件、合像光学元件,转像光学元件设置在待检测芯片和合像光学元件的两侧部上。In some specific embodiments, the dual-optical path confluence module further includes an image relay optical element and an image combination optical element arranged in the vertical direction in sequence, and the image relay optical element is arranged on both sides of the chip to be detected and the image combination optical element.
待检测芯片、合像光学元件和转像棱镜由上至下依次设置在垂直方向上,转像光学元件设置在待检测芯片和合像光学元件的两个侧部,被照明的待检测芯片的两个表面分别形成的水平方向向外的第一光路和第二光路,第一光路和第二光路经过转像光学元件后光路方向发生180°反射,水平方向向内的第一光路和第二光路经过合像光学元件90°转像,以双光路的形式汇合在合像光学元件下方,合流的双光路沿垂直方向向下传播。The chip to be detected, the imaging optical element and the relay prism are arranged in the vertical direction from top to bottom, and the relay optical element is arranged on the two sides of the chip to be detected and the imaging optical element, and the two sides of the illuminated chip to be detected are arranged in the vertical direction. The first optical path and the second optical path outward in the horizontal direction are formed by each surface respectively. After the first optical path and the second optical path pass through the relay optical element, the optical path direction is reflected by 180°, and the first optical path and the second optical path in the horizontal direction are inward. After 90° rotation of the image-combining optical element, it converges under the image-combining optical element in the form of dual optical paths, and the combined dual optical paths propagate downward in the vertical direction.
在一些具体实施例中,转像光学元件包含两块平板分光镜、两块等腰直角棱镜和固定板,两块平板分光镜分别对应着所述待检测芯片的两个表面,两块平板分光镜与水平平面夹角为45°;In some specific embodiments, the image relay optical element includes two flat beam splitters, two isosceles right angle prisms and a fixed plate, the two flat beam splitters correspond to the two surfaces of the chip to be detected, respectively, and the two flat plate beam splitters The angle between the mirror and the horizontal plane is 45°;
两块等腰直角棱镜对应地设置在分光镜下方,两块等腰直角棱镜的斜面与水平平面夹角为45°,等腰直角棱镜的斜面为全反射面,两块平板分光镜和两块等腰直角棱镜通过固定板进行固定。Two isosceles right-angle prisms are correspondingly arranged below the beam splitter, the angle between the inclined planes of the two isosceles right-angle prisms and the horizontal plane is 45°, the inclined planes of the isosceles right-angle prisms are total reflection surfaces, two flat beam splitters and two The isosceles right angle prism is fixed by the fixing plate.
待检测芯片两个表面反射的第一光路和第二光路通过对应设置在两个表面外侧的、平板分光镜时,第一光路和第二光路的反射路线与原始的方向成垂直关系,此时第一光路和第二光路的方向为垂直方向向下。When the first optical path and the second optical path reflected by the two surfaces of the chip to be detected pass through the flat-panel beam splitter correspondingly arranged on the outside of the two surfaces, the reflection paths of the first optical path and the second optical path are in a vertical relationship with the original direction. The directions of the first optical path and the second optical path are vertically downward.
两块等腰直角棱镜对应设置在两块平板分光镜的下方,斜面与水平平面夹角为45°,第一光路和第二光路经由平板分光镜反射后沿垂直方向向下到达等腰直角棱镜的斜面,再经由等腰直角棱镜的斜面90°反射后,第一光路和第二光路的方向转为水平方向向内。The two isosceles right-angle prisms are correspondingly arranged below the two flat beam splitters, and the angle between the inclined plane and the horizontal plane is 45°. The first optical path and the second optical path are reflected by the flat beam splitter and then reach the isosceles right angle prism in the vertical direction. After being reflected by the inclined plane of the isosceles right angle prism at 90°, the directions of the first optical path and the second optical path are turned inward in the horizontal direction.
在一些具体实施例中,合像光学原件包括两块以背对背方式放置的等腰直角棱镜,等腰直角棱镜斜面与垂直平面的夹角为45°,且等腰直角棱镜的斜面为全反射面。In some specific embodiments, the combined imaging optical element includes two isosceles right angle prisms placed in a back-to-back manner, the angle between the inclined surface of the isosceles right angle prism and the vertical plane is 45°, and the inclined surface of the isosceles right angle prism is a total reflection surface .
合像光学元件中两块等腰直角棱镜的斜面与转像光学元件中等腰直角棱镜的斜面相对应,使得通过转像光学元件后沿着水平向内方向的第一光路和第二光路通过合像光学元件时实现光路的反射和汇合,最终以合流的双光路形式沿着垂直向下的方向传播。The slopes of the two isosceles right-angle prisms in the combining optical element correspond to the slopes of the isosceles right-angle prisms in the relay optical element, so that the first optical path and the second optical path along the horizontal inward direction after passing through the relay optical element are combined. It realizes the reflection and convergence of the optical paths when it is like an optical element, and finally propagates in the vertical downward direction in the form of a combined double optical path.
在一些具体的实施例中,转像棱镜设置在合像光学元件的下方,所述转像棱镜的斜面与水平平面夹角为45°,所述转像棱镜的斜面为全反射面。In some specific embodiments, the relay prism is arranged below the image combining optical element, the angle between the inclined plane of the relay prism and the horizontal plane is 45°, and the inclined plane of the relay prism is a total reflection surface.
转像棱镜的斜面和检测镜组模块相对应,用于反射汇合的双光路,转像棱镜的斜面为45°倾斜的全反射面,汇合的双光路通过转像棱镜斜面反射后,最终沿着水平方向进入检测镜组。The inclined plane of the relay prism corresponds to the detection mirror group module, and is used to reflect the combined double light paths. The inclined plane of the relay prism is a total reflection surface inclined at 45°. Enter the detection mirror group in the horizontal direction.
在一些具体的实施例中,双光路合流模块包括两个条形光源,两个条形光源分别设置在转像光学元件的外侧,条形光源的光线打亮待检测芯片的两个表面。In some specific embodiments, the dual-optical path confluence module includes two strip-shaped light sources, the two strip-shaped light sources are respectively disposed outside the relay optical element, and the light from the strip-shaped light sources illuminates two surfaces of the chip to be detected.
条形光源的光线透过转像光学元件中的分光镜,打在待检测芯片的两个表面上,使得两个表面上具有均匀的亮度和照度,使得两个表面上形成的光路的检测效果更好,更有利于提高芯片表面检测的准确性。The light of the strip light source passes through the beam splitter in the relay optical element and hits the two surfaces of the chip to be detected, so that the two surfaces have uniform brightness and illuminance, so that the detection effect of the optical path formed on the two surfaces is improved. Better and more conducive to improving the accuracy of chip surface detection.
在一些具体的实施例中,双光路合流芯片检测装置包括底座,双光路合流模块和检测镜组模块沿着水平方向依次设置在所述底座上。In some specific embodiments, the dual-optical path confluence chip detection device includes a base, and the dual-optical path confluence module and the detection mirror group module are sequentially arranged on the base along a horizontal direction.
双光路合流模块和检测镜组模块固定在底座上,使得芯片检测装置在结构上更为稳定,方便日常检测使用更容易嵌入自动化生产设备。The dual optical path confluence module and the detection mirror group module are fixed on the base, which makes the chip detection device more stable in structure, convenient for daily detection and easier to be embedded in automatic production equipment.
在一些具体的实施例中,检测镜组模块包括电机模组、镜头固定单元、导轨和镜组,镜组包括远心镜头和相机,导轨、电机模组固定在底座上,镜组固定在导轨上,检测镜组模块可位移地设置于所述水平光路方向上。In some specific embodiments, the detection lens group module includes a motor module, a lens fixing unit, a guide rail and a lens group, the lens group includes a telecentric lens and a camera, the guide rail and the motor module are fixed on the base, and the lens group is fixed on the guide rail On the top, the detection lens group module is displaceably arranged in the direction of the horizontal optical path.
检测镜组模块可以在水平光路方向上前后移动是通过电机模组和导轨的设置完成的,电机模组能够根据芯片尺寸的大小带动镜组在水平方向上移动,实现镜组焦距的自动调节,从而使得不同尺寸芯片可以共用一套芯片检测装置,使得芯片的检测更加智能快捷,且节省了成本。The detection mirror group module can move back and forth in the direction of the horizontal optical path through the setting of the motor module and the guide rail. The motor module can drive the mirror group to move in the horizontal direction according to the size of the chip to realize the automatic adjustment of the focal length of the mirror group. Therefore, chips of different sizes can share a set of chip detection devices, so that the detection of chips is more intelligent and fast, and the cost is saved.
在一些具体的实施例中,导轨选用交叉滚子导轨,由于交叉滚子导轨具有摩擦小、速度快、承载能力大、稳定性能好等特点,能够实现镜组实现高精度、平稳的直线运动,使得检测芯片装置能够适应芯片尺寸的需求快速调焦,提高检测速度和效率。In some specific embodiments, the guide rails are cross-roller guide rails. Since the cross-roller guide rails have the characteristics of low friction, high speed, high bearing capacity, and good stability, the mirror group can achieve high-precision and stable linear motion. The detection chip device can quickly adjust the focus to meet the requirements of the chip size, and improve the detection speed and efficiency.
在一些具体的实施例中,电机模组为直线步进电机模组,所述直线步进电机模组包括直线步进电机、电机固定板、螺母座和护罩,直线步进电机具有体积小、重量轻、寿命高、效率高等优点。In some specific embodiments, the motor module is a linear stepping motor module, and the linear stepping motor module includes a linear stepping motor, a motor fixing plate, a nut seat and a shield. The linear stepping motor has a small volume. , Light weight, long life and high efficiency.
本申请的双光路合流芯片检测装置能够使得待检测芯片两个表面的光路汇合成双光路,便于同时对芯片的两个表面进行检测,提高了芯片的检测效率;双光路合流模块在垂直光路方向上实现双光路的汇合,检测镜组模块在水平光路上进行芯片的检测成像,相比于传统的检测装置,节省了空间,便于嵌入自动化生产设备;检测镜组模块能够根据待检测装置的尺寸在水平方向上移动,自动调节镜组的焦距,适应了不用尺寸芯片的使用需求。本申请的双光路合流芯片检测装置结构稳定,能够快速有效的进行光路的汇合和检测,占用空间小,适应生产设备的需求,一套检测系统可以用于多个表面和多种尺寸芯片的检测,提高了检测效率,节省了成本。The dual optical path confluence chip detection device of the present application can make the optical paths of the two surfaces of the chip to be detected merge into a dual optical path, which facilitates the simultaneous detection of the two surfaces of the chip and improves the detection efficiency of the chip; the dual optical path confluence module is in the direction of the vertical optical path. Compared with the traditional detection device, it saves space and is easy to be embedded in automated production equipment; the detection mirror group module can be based on the size of the device to be detected. Moving in the horizontal direction, the focal length of the lens group is automatically adjusted, which is suitable for the use of different size chips. The dual-optical path confluence chip detection device of the present application has a stable structure, can quickly and effectively perform the merging and detection of optical paths, occupies a small space, and is suitable for the needs of production equipment. A set of detection systems can be used for multiple surfaces and multiple sizes of chips. , improve the detection efficiency and save the cost.
附图说明Description of drawings
包括附图以提供对实施例的进一步理解并且附图被并入本说明书中并且构成本说明书的一部分。附图图示了实施例并且与描述一起用于解释本发明的原理。将容易认识到其它实施例和实施例的很多预期优点,因为通过引用以下详细描述,它们变得被更好地理解。附图的元件不一定是相互按照比例的。同样的附图标记指代对应的类似部件。The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated into and constitute a part of this specification. The drawings illustrate embodiments and together with the description serve to explain the principles of the invention. Other embodiments and many of the intended advantages of the embodiments will be readily recognized as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale to each other. Like reference numerals designate corresponding similar parts.
图1为本发明技术方案的一种双光路合流芯片检测装置的立体图,1 is a perspective view of a dual-optical path confluence chip detection device according to the technical solution of the present invention,
图2为本发明技术方案的一种双光路合流芯片检测装置的双光路合流模块的结构图,2 is a structural diagram of a dual-optical-path merging module of a dual-optical-path merging chip detection device according to the technical solution of the present invention,
图3为本发明技术方案的一种双光路合流芯片检测装置的双光路合流模块的剖视图,3 is a cross-sectional view of a dual-optical-path merging module of a dual-optical-path merging chip detection device according to the technical solution of the present invention,
图4a-4b为本发明技术方案的一种双光路合流芯片检测装置的光路路径示意4a-4b are schematic diagrams of optical paths of a dual-optical path confluence chip detection device according to the technical solution of the present invention
图picture
图5为本发明技术方案的一种双光路合流芯片检测装置的检测镜组模块的仰视图,5 is a bottom view of a detection mirror group module of a dual-optical path confluence chip detection device according to the technical solution of the present invention,
图6为本发明技术方案的一种双光路合流芯片检测装置的主视图。FIG. 6 is a front view of a dual-optical path confluence chip detection device according to the technical solution of the present invention.
具体实施方式Detailed ways
在以下详细描述中,参考附图,该附图形成详细描述的一部分,并且通过其中可实践本发明的说明性具体实施例来示出。对此,参考描述的图的取向来使用方向术语,例如“顶”、“底”、“左”、“右”、“上”、“下”等。因为实施例的部件可被定位于若干不同取向中,为了图示的目的使用方向术语并且方向术语绝非限制。应当理解的是,可以利用其他实施例或可以做出逻辑改变,而不背离本发明的范围。因此以下详细描述不应当在限制的意义上被采用,并且本发明的范围由所附权利要求来限定。In the following detailed description, reference is made to the accompanying drawings, which form a part hereof and are shown by way of illustrative specific embodiments in which the invention may be practiced. In this regard, directional terms such as "top," "bottom," "left," "right," "top," "bottom," etc. are used with reference to the orientation of the figures being described. Because components of an embodiment may be positioned in several different orientations, directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized or logical changes may be made without departing from the scope of the present invention. Therefore, the following detailed description should not be taken in a limiting sense, and the scope of the invention is defined by the appended claims.
如图1所示,本发明技术方案的一种双光路合流芯片检测装置,包括双光路合流模块1、检测镜组模块2和底座3,双光路合流模块1用于汇合待检测芯片5两个表面形成的光路,并使得光路方向改变,检测镜组模块用于待检测芯片两个表面的检测成像,双光路合流模块1和检测镜组模块2沿着水平的方向依次设置在底座3上。As shown in FIG. 1 , a dual-optical-path confluence chip detection device according to the technical solution of the present invention includes a dual-optical-path confluence module 1, a detection
在具体的实施例中,外部芯片拾取机构4将待检测芯片5在垂直方向上压入双光路合流模块1中,被待检测芯片5的两个表面经过照明后分别形成第一光路和第二光路,第一光路和第二光路经过双光路合流模块1中设置的光学元件反射后,以双光路合流的方式沿着水平光路方向进入检测镜组模块2。In a specific embodiment, the external
图2示出了本发明技术方案的双光路合流模块结构图,双光路合流模块1包括转像光学元件11、合像光学元件12、光源组件13、转像棱镜14、棱镜固定板15、固定座16和外壳17,转像棱镜14通过棱镜固定板15设置在固定座16上,转像棱镜 14垂直上方设置有合像光学元件12,合像光学元件12和待检测芯片4的两个侧部上设置有转像光学元件11,转像光学元件的外侧设置有光源组件13。FIG. 2 shows the structure diagram of the dual-optical path confluence module according to the technical solution of the present invention. The dual-optical-path confluence module 1 includes an image relay
在具体的实施例中,外壳17通过螺母和螺栓固定在固定座16的四周,光源组件13、转像光学元件11、合像光学元件12通过外壳17固定在垂直光路方向上。In a specific embodiment, the
在具体的实施例中,外壳17、固定座16和光源组件13使得双光路合流模块1 (双光路合流模块1在图1中示出)具有稳定的外部结构,转像光学元件11、合像光学元件12、转像棱镜14和棱镜固定板15设置在双光路合流模块1内部,双光路合流模块1内部进行光路的转像和合流,双光路合流模块1具有稳定的结构,以适用工业生产中对于芯片表面检测的需求。In a specific embodiment, the
图3示出了本发明技术方案的双光路合流模块的剖视图,转像光学元件11(转像光学元件11在图2中示出)包括平板分光镜111、平板分光镜112、等腰直角棱镜113、等腰直角棱镜114、固定板115和固定板116;合像光学元件12(合像光学元件12在图2中示出)包括等腰直角棱镜121、等腰直角棱镜122和固定板123;光源组件13(光源组件13在图2中示出)包括条形光源131和条形光源132。3 shows a cross-sectional view of the dual-optical path confluence module according to the technical solution of the present invention, and the relay optical element 11 (the relay
在具体的实施例中,平板分光镜111和平板分光镜112对应设置在待检测芯片的两个表面外侧,平板分光镜111和平板分光镜112与水平平面的夹角为45°,平板分光镜111通过分光镜和棱镜固定板116固定,平板分光镜112通过分光镜和棱镜固定板115固定。In a specific embodiment, the
在具体的实施例中,等腰直角棱镜113和等腰直角棱镜114固定在平板分光镜 111和平板分光镜112的下方,用于反射经过平板分光镜111和平板分光镜112后转为垂直向下的第一光路和第二光路,等腰直角棱镜113和等腰直角棱镜114斜面与水平平面的夹角为45°,等腰直角棱镜113和等腰直角棱镜114的斜面为全反射面,垂直方向向下的第一光路和第二光路经过等腰直角棱镜113和等腰直角棱镜114 后被反射,反射方向与入射方向垂直,第一光路和第二光路的传播方向由垂直方向向下转为水平方向向内。In a specific embodiment, the isosceles
在具体的实施例中,等腰直角棱镜121和等腰直角棱镜122通过固定板123以背对背的方式设置在等腰直角棱镜113和等腰直角棱镜114之间,等腰直角棱镜 121和等腰直角棱镜122的斜面与垂直平面的夹角为45°,水平方向向内的第一光路和第二光路分别通过等腰直角棱镜121和等腰直角棱镜122,光路沿着垂直的方向出射,使得第一光路和第二光路的方向转为垂直向下。In a specific embodiment, the isosceles right-
在具体的实施例中,平板分光镜111、平板分光镜112、等腰直角棱镜113和等腰直角棱镜114通过固定板115和固定板116固定在外壳17上。In a specific embodiment, the
图4a示出了待检测芯片表面的第一光路和第二光路通过转像光学元件和合像光学元件的光路路径,条形光源131和条形光源132用于打亮待检测芯片的两个表面形成第一光路和第二光路,第一光路和第二光路的方向沿着水平向外,第一光路和第二光路经过转像光学元件11后,第一光路和第二光路发生两次90度的反射,使得第一光路和第二光路发生180度的方向变化后以水平方向向内进入合像光学元件,水平方向向内的第一光路和第二光路经过合像光学元件12后,光路方向发生了90°的偏转,第一光路和第二光路汇合成方向相同的双光路。Fig. 4a shows the optical path of the first optical path and the second optical path of the surface of the chip to be inspected through the relay optical element and the combined image optical element. The
图4b示出了待检测芯片两个表面形成的合流双光路通过转像棱镜的光路路径,待检测芯片两个表面形成的第一光路和第二光路经过转像光学元件和合像光学元件后实现了方向的偏转和光路的合流,合流的双光路通过转像棱镜14后,双光路的传播方向由垂直向下转为水平方向向右。Figure 4b shows the optical path of the combined double optical paths formed by the two surfaces of the chip to be detected and passed through the relay prism. The first optical path and the second optical path formed by the two surfaces of the chip to be detected pass through the relay optical element and the combined image optical element. After the combined double light paths pass through the
在具体的实施例中,转像棱镜14为等腰直角结构,转像棱镜14通过固定板15 固定。In a specific embodiment, the
在具体的实施例中,转像棱镜14的斜面为全反射面,转像棱镜的设置方式为:斜面与检测镜组模块相对应,斜面与水平平面的夹角为45°。In a specific embodiment, the inclined plane of the
转像棱镜的设置使得双光路的方向由垂直转为水平,使得光路的合流、转像与镜组检测可以设置在不同平面上,缩小了芯片检测装置占用的空间。The setting of the image relay prism makes the direction of the dual optical paths change from vertical to horizontal, so that the confluence of the optical paths, the image relay and the detection of the mirror group can be arranged on different planes, which reduces the space occupied by the chip detection device.
图5示出了双光路合流芯片检测装置中检测镜组部件2的仰视图,检测镜组模块2包括镜组21、电机模组22、导轨23和镜组固定单元24,镜组21通过镜组固定单元24固定在导轨23上,电机模组22与镜组固定单元24固定连接,电机模组22 工作时,能够带动通过镜组固定单元24固定的镜组21在导轨23上在水平光路方向上前后移动,镜组21在水平光路方向上移动改变焦距,适应不同尺寸大小芯片的检测需求。5 shows a bottom view of the detection
在具体的实施例中镜组21包括远心镜头211和相机212,远心镜头211和相机 212固定连接在水平光路方向上,水平方向的合流双光路经过远心镜头211聚焦至相机212的感光芯片上形成一张待处理的图片,镜组21用于待检测芯片两个表面的检测和成像。In a specific embodiment, the lens group 21 includes a
在具体的实施例中,电机模组22包括安装板221、螺母座222、护罩223和电机224,安装板221包括底部安装板2211和电机安装板2212,底部安装板221与底座3(底座3在图1中示出)固定连接,电机安装板2212侧部与底座3固定连接,电机安装板2212与电机224固定连接,护罩223和电机安装板2212固定连接,螺母座 222设置在安装板221和护罩223所成的区域内部,螺母座222与镜组固定单元24 固定连接。安装板221和螺母座222对电机224进行固定,护罩223的设置使得电机模组22具有相对稳定的外部结构,避免部件分散暴露不便于嵌入自动化生产设备,安装板221与底座3的连接关系使得电机模组22可以固定设置在底座3上,螺母座 222与镜组固定单元24连接使得通过镜头固定单元24固定在导轨23上的镜组21能够在电机224的带动下在水平光路方向上移动。In a specific embodiment, the
在进一步的实施例中,电机224选用直线步进电机,直线步进电机具有体积小、重量轻、寿命高、效率高等优点,选用直线步进电机占用空间小且能够适应双光路合流检测装置检测效率高的需求。In a further embodiment, the
在具体的实施例中,导轨23选用交叉滚子导轨,交叉滚子导轨具有摩擦小、速度快、承载能力大、稳定性能好等特点,能够实现镜组实现高精度、平稳的直线运动,使得检测芯片装置能够适应芯片尺寸的需求快速调焦,提高检测速度和效率。In a specific embodiment, the
在具体的实施例中,检测镜组21通过镜组固定单元24固定在交叉滚子导轨23 上。In a specific embodiment, the detection mirror group 21 is fixed on the cross
在进一步的实施例中,电机模组22与镜组固定单元24固定连接,导轨23、电机模组22、镜组固定单元24和镜组21之间存在连接关系,电机224带动交叉滚子导轨23上的检测镜组21在水平方向上移动,使得检测镜组21的焦距能够适应不同尺寸芯片的检测需求。In a further embodiment, the
该双光路合流芯片检测装置的整体的工作流程如下:待检测芯片两个表面形成的第一光路和第二光路经过转像光学元件光路方向实现两次90°的偏转,沿着水平方向向内进入合像光学元件,第一光路和第二光路通过合像光学元件汇合成垂直方向向下的双光路,合流的双光路通过转像棱镜90°转像,沿着水平光路方向进入检测镜组模块,电机模组带动导轨上的镜组在水平光路方向上前后移动,调整焦距以获得清晰的成像效果,合流的双光路通过远心镜头聚焦至相机感光芯片上形成一张待处理的图片,至此,待检测芯片的两个表面可以通过一套检测装置一次性完成检测成像。The overall work flow of the dual-optical path confluence chip detection device is as follows: the first optical path and the second optical path formed on the two surfaces of the chip to be detected are deflected twice by 90° in the direction of the optical path of the switching optical element, and are inward along the horizontal direction. Entering the image combination optical element, the first optical path and the second optical path are combined into a vertical downward double optical path through the combined imaging optical element. Module, the motor module drives the mirror group on the guide rail to move back and forth in the direction of the horizontal optical path, adjust the focal length to obtain a clear imaging effect. So far, the two surfaces of the chip to be inspected can be inspected and imaged at one time by a set of inspection devices.
图6示出了本发明一种双光路合流芯片检测装置的主视图,光源模块13、外壳17、固定座16依次设置在垂直方向上,构成双光路合流模块1(双光路合流模块在图1中示出)的外部结构,使得内部设置的光学元件实现光路的转像和汇合能够稳步有序的进行,转像棱镜14设置在双光路合流模块的内部底端,转像棱镜 14的斜面与检测镜组模块2(检测镜组模块2在图1中示出)相对应,使得汇合的双光路沿着水平光路方向进入检测镜组模块2,完成了芯片检测装置结构上的折叠,减少占用的空间。检测镜组模块2包括镜组21、镜组固定单元24和电机模组 22,检测镜组模块2和双光路合流模块1固定在底座3上。6 shows a front view of a dual-optical path confluence chip detection device according to the present invention. The
在具体的实施例中,双光路合流模块1的上述组件通过螺栓和螺母固定连接,凭借该设置便于实现各组件的安装和拆卸,便于进行维护操作。In a specific embodiment, the above-mentioned components of the dual-optical path confluence module 1 are fixedly connected by bolts and nuts, which facilitates installation and disassembly of each component and facilitates maintenance operations.
在具体的实施例中,外壳17的表面上设置有开口,外壳17上设置的开口大小和位置与转像棱镜14相对应,通过转像棱镜14的合流双光路通过开口沿着水平光路方向进入检测镜组模块2。In a specific embodiment, an opening is provided on the surface of the
本发明的一种双光路合流芯片检测装置具有稳定的结构,使得光路转像合流和芯片的检测成像能够快速有序的进行,提高了检测效率。The dual optical path confluence chip detection device of the present invention has a stable structure, so that the optical path confluence and the detection and imaging of the chip can be carried out quickly and orderly, and the detection efficiency is improved.
本发明一种双光路合流芯片检测装置,遵循光学原理,通过光学元件、检测镜组和其他组件的设置,使得芯片两个表面上的光路可以实现方向的变化和光路汇合,从而满足生产中对于芯片多面检测的需求;光路的合流和转像在垂直光路方向上实现,光路的检测和成像在水平方向上实现,缩小了芯片表面光路检测成像装置占用的空间;检测镜组可以在检测方向上前后移动,根据芯片尺寸的大小调节焦距。本发明一种双光路合流芯片检测装置相比于传统的人工检测或者检测系统,可以简化检测的结构和步骤,节省空间,方便嵌入自动化生产设备,且适用不同尺寸芯片的检测需求。The invention is a dual-optical path confluence chip detection device, which follows the optical principle, and through the arrangement of optical elements, detection mirror groups and other components, the optical paths on the two surfaces of the chip can realize the change of direction and the convergence of the optical paths, so as to meet the requirements for production. The requirements for multi-faceted detection of chips; the confluence and transfer of optical paths are realized in the direction of the vertical optical path, and the detection and imaging of the optical paths are realized in the horizontal direction, which reduces the space occupied by the optical path detection and imaging device on the surface of the chip; the detection mirror group can be in the detection direction. Move back and forth to adjust the focus according to the size of the chip. Compared with the traditional manual detection or detection system, the dual-optical path confluence chip detection device of the present invention can simplify the detection structure and steps, save space, be convenient to be embedded in automatic production equipment, and be suitable for the detection requirements of chips of different sizes.
显然,本领域技术人员在不偏离本发明的精神和范围的情况下可以作出对本发明的实施例的各种修改和改变。以该方式,如果这些修改和改变处于本发明的权利要求及其等同形式的范围内,则本发明还旨在涵盖这些修改和改变。词语“包括”不排除未在权利要求中列出的其它元件或步骤的存在。某些措施记载在相互不同的从属权利要求中的简单事实不表明这些措施的组合不能被用于获利。权利要求中的任何附图标记不应当被认为限制范围。It will be apparent to those skilled in the art that various modifications and changes can be made to the embodiments of the present invention without departing from the spirit and scope of the invention. In this manner, the present invention is also intended to cover such modifications and changes if they come within the scope of the claims of the present invention and their equivalents. The word "comprising" does not exclude the presence of other elements or steps not listed in a claim. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.
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