CN114905419B - Cutting sheet with protective layer and preparation method thereof - Google Patents
Cutting sheet with protective layer and preparation method thereof Download PDFInfo
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- CN114905419B CN114905419B CN202210292448.XA CN202210292448A CN114905419B CN 114905419 B CN114905419 B CN 114905419B CN 202210292448 A CN202210292448 A CN 202210292448A CN 114905419 B CN114905419 B CN 114905419B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with cooling provisions, e.g. with radial slots
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The cutting sheet with the protective layer comprises a base abrasive layer and the protective layer, wherein the protective layer is coated on the radial direction and two sides of the outer circular cutting edge of the base abrasive layer in a U-shaped mode, the protective layer is metallurgically combined with a binding agent layer on the surface layer of the base abrasive layer, and the surface layer abrasive outside the base abrasive layer is protected. According to the invention, the U-shaped coating protective layer is arranged on the radial direction and two side edge parts of the outer diameter edge cutting edge of the base blank abrasive layer, so that the performance of the cutting blade has a larger application range, and the use effect of the blade is improved.
Description
Technical Field
The invention relates to an ultrathin cutting blade, in particular to a cutting blade with a protective layer and a preparation method thereof.
Background
The electroforming cutting sheet is an integral ultrathin cutting sheet formed by using an electrodeposition method to deposit the diamond or CBN abrasive particles on a base blank by taking metallic nickel as a bonding agent, separating the diamond or CBN abrasive particles from the base blank, and then machining the base blank. As a key technology of precise cutting, an electroforming ultrathin cutting blade is always the key point of research and development in the cutting processing field, and is mainly used for excircle cutting equipment with the main shaft rotating speed of 5000-60000N/min. The method is applied to precise cutting of hard and brittle materials which are difficult to process, such as sapphire, monocrystalline silicon, glass, ceramics and the like. The electroforming blade has an ultrathin thickness of 0.03-0.5 mm, so that the plane processability of the electroforming blade is poor, and a product structure with a complex profile is difficult to manufacture, and the electroforming blade is a plane structure of A1A 1 grinding wheel.
The abrasive grain size of the cutting sheet is a main factor influencing cutting sharpness and product notch edge breakage in cutting processing under the conditions of rated processed products, cutting depth and rotating speed of a main shaft of equipment. The ability of the cutting blade to remove the amount of grinding at the nominal line speed is dependent on the volume of the abrasive grain out of the edge and the amount of abrasive, so that the coarser abrasive grain size and the out-edge height have stronger grinding ability. However, the larger the particle size of the abrasive, the larger the edge breakage of the cut product, and with the development of the fine semiconductor, the smaller the product size, and the more stringent the requirements for the edge breakage of the cut. The more hard and brittle the processed product material, such as silicon nitride, aluminum oxide, silicon carbide, microcrystalline ceramics, glass ceramics and the like. In addition, the requirement of edge breakage is improved, and the sharpness and the processing efficiency of cutting are seriously affected.
In the cutting use process of the cutting sheet, the lip effect can appear on the cutting edge along with the extension of the use time. The outer diameter edge portion of the blade will wear against the product in the radial direction and on both sides of the edge area. In particular, the two tips at the joint of the radial direction and the two sides of the cutting edge are worn by radial and lateral force at the same time, so that the abrasion is maximum, and the abrasive is quickly dropped. The central abrasive is protected by the outer surface abrasive, so that the abrasion ratio of the abrasive at the central part and the abrasive at the outer surface is greatly different, the cutting edge can gradually appear in a circular arc shape or a sharp circular arc shape, and when the sharp angle reaches a certain degree, the knife repair is needed. On one hand, the peeling of the side abrasive material makes the abrasive particles in the central part fully exposed and not supported and protected, and is a main reason for accelerating the peeling of the whole abrasive material of the blade and the reduction of the diameter of the blade and causing failure. In addition, the trimming process is a blade trimming process and also a blade wearing process. Yuan Jie by Siam et al, J.P.32, 5 th edition semiconductor technology «: lip effect generation and improvement during GBA substrate cutting-in one article, the lip effect generation is reduced and the blade life is improved by the effective collocation of the hardness of the blade and the cut product. There have also been proposed a multi-layered ultra-thin diamond blade, such as the patent: CN 103590091B, this design can also effectively reduce the lip effect in cutting and improve the grinding ratio of blade, and this kind of outside fine grit abrasive center is the abrasive of coarse grain simultaneously, also can reduce the edge breakage of product cutting bottom surface.
The progressive development of dicing technology is also increasingly being applied to large-depth processing, such as dicing after lamination of flexible screen carrier glass. And (3) compounding the large-size ultrathin glass with the thickness of 0.05-0.1 mm through a protective layer glass, and then laminating and compounding the glass, wherein the cutting depth is 3-15 mm. When the cutting depth of the product reaches more than 3mm, the repeated grinding of the cutting end face of the cut product is aggravated by the side face of the blade, and the cutting port of the product can be trapezoidal, so that the processing precision of the product is affected. There have also been researchers who design a cutting surface on a dicing blade, the thickness of the cutting surface being larger than the thickness of the blade blank. Such as the patent: CN 110091260A, which does solve the problem of cutting precision of large-size products, but the technology has extremely high manufacturing difficulty and manufacturing cost, and the machining precision of the cutting blade is not controllable, so no visible finished product exists in the market at present.
The technology of materials is new and new, and the difficulty of processing required by precision cutting is gradually increased, such as silicon carbide, microcrystalline glass, microcrystalline ceramics and the like. These also provide new research topics for the technology of cutting blades used in cutting.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art and providing the cutting sheet with the protective layer and the preparation method thereof, wherein the cutting sheet can effectively reduce the lip effect and improve the cutting precision.
In order to solve the technical problems, the technical scheme provided by the invention is as follows: the utility model provides a cutting piece with protective layer, includes base abrasive layer and protective layer, the protective layer is the radial and both sides of U type cladding at the excircle blade of base abrasive layer, the protective layer is individual layer or multilayer, the protective layer metallurgically bond with the binder layer on base abrasive layer top layer to form the protection to base abrasive layer outside top layer abrasive.
In the above-mentioned cutting sheet with a protective layer, preferably, the protective layer is metallurgically bonded to the surface layer bonding agent outside the abrasive layer of the base blank by means of electroplating.
In the above-described cutting sheet having a protective layer, it is preferable that the protective layer is metallurgically bonded to the surface layer bonding agent on the outer side of the abrasive layer of the base material to form a relief groove.
In the above cutting sheet with a protective layer, preferably, the protective layer is metallurgically bonded to the surface layer bonding agent on the outer side of the abrasive layer of the base blank by a magnetron sputtering coating, and the thickness of the protective layer is 2-20 μm.
In the above cutting blade with a protective layer, preferably, the outer diameter edge of the base blank abrasive layer is uniformly provided with a plurality of junk slots, and cutting teeth are formed between two adjacent junk slots; the protective layer is in a U-shaped dispersion coating on the cutting teeth of the base blank abrasive layer.
The above cutting blade with the protective layer, preferably, the protective layer comprises a wear-resistant coating of a metal substrate or a wear-resistant coating of a nonmetallic compound, and the metal in the wear-resistant coating of the metal substrate comprises one or more of Ti, nb, f, V, ta, mo, zr, cr, al, si or W.
In the above-described cutting sheet with a protective layer, preferably, the base abrasive layer includes a binder and an abrasive, and the abrasive is uniformly fixed by the binder and forms the base abrasive layer.
A preparation method of a cutting sheet with a protective layer comprises the following steps;
1) Manufacturing a base blank abrasive layer;
2) Machining the inner and outer diameters of the base blank abrasive layer and the junk slots;
3) The concentricity of the outer diameter of the base blank abrasive layer is trimmed, the radial direction and two sides of the cutting edge area of the base blank abrasive layer are R arcs after trimming, and meanwhile the R arcs are controlled to be as follows: r is more than 0.5 and less than 2T, T is the thickness of the base blank abrasive layer;
4) And forming a protective layer on the base blank abrasive layer by adopting an electroplating coating or sputtering coating mode, wherein the height D=50-90% of the abrasive covered by the outermost layer of the protective layer when adopting the electroplating coating, and the thickness of the protective layer when adopting the magnetron sputtering coating is 2-20 mu m.
In the method for preparing a dicing sheet with a protective layer, preferably, in the 4), the step of using a sputter coating further includes:
the rear blade is arranged in the shaft sleeve, so that the part needing the coating is exposed, and the part needing no coating is shielded;
the method comprises the steps of performing corrosion cleaning, namely placing a shaft sleeve with a blade on a corrosion groove frame, immersing a part to be coated in corrosion liquid, mechanically rotating the shaft sleeve at a uniform speed, and removing part of nickel bonding agent covered by grinding materials on the outer surface layer of the part to be coated by corrosion, wherein the covering height D of the metal nickel bonding agent layer of the grinding materials on the outer surface layer is 10-50%;
cleaning the sleeve with pure water, and then using N rapidly 2 Blowing dry;
the shaft sleeve with the blades is arranged in a jig, and the jig is arranged in a front bin of a coating chamber of a magnetron sputtering furnace;
pushing the jig into a vacuum chamber, wherein the vacuum degree is 5.0X10 -4 Under Pa and below, introducing argon with purity of over 99.9%, air flow of 15-20sccm, starting pulse DC bias voltage of-350V to-400V, and controlling indoor air pressure to maintain for over 1 hr;
so that the air pressure in the film plating chamber is reduced to 2X 10 -1 Pa and below, starting a sputtering power supply to sputter, and then simultaneously introducing argon and nitrogen with the purity of more than 99.9 percent, wherein the flow rate of the argon is 15-20sccm, and the flow rate of the nitrogen is 30-40sccm, so that the pressure in a film plating chamber is 5 multiplied by 10 -1 Pa and below, depositing a 2-20 mu m thick protective layer on the bonding agent on the outer surface of the coating area of the cutting sheet, so that the coating on the abrasive bonding agent on the outer surface layer covers the abrasive with the height D of 50-90%; the temperature of the base abrasive layer is 200-250 ℃ when sputtering is carried out.
An excircle cutting machine comprises the cutting piece of the protective layer.
Compared with the prior art, the invention has the advantages that: according to the invention, the U-shaped coating protective layer is arranged on the radial direction and two side edge parts of the outer diameter edge cutting edge of the base blank abrasive layer, so that the performance of the cutting blade has a larger application range, and the use effect of the blade is improved.
When the cutting sheet with the protective layer is used, the protective layer has the following functions; 1. the protective layer can effectively relieve stress and mechanical damage generated on the blade processing part by mechanical processing. 2. The protective layer can effectively improve the holding force of the side binder on the diamond, so that the side binder is not easy to peel off, the central diamond layer is more effectively protected, the lip effect in the cutting process is greatly reduced, and the service life of the blade is prolonged. 3. The protective layer is formed into a tool withdrawal groove after being metallurgically combined with the bonding agent on the base blank abrasive layer through electroplating, so that ineffective grinding of the abrasive during cutting is avoided, the cutting inclined surface of a product can be effectively avoided when the cutting depth is too large, and the processing size of the product is effectively ensured. 4. The clearance groove and the chip groove formed on the cutting blade can form a more fluid chip removal loop, so that the chip removal and heat dissipation effects can be effectively improved.
Drawings
Fig. 1 is a schematic structural view of a dicing sheet having a protective layer in example 1.
Fig. 2 is a schematic cross-sectional structure of a dicing sheet having a protective layer in example 1.
Fig. 3 is a schematic cross-sectional structure of a cutting blade before trimming the cutting teeth on the base abrasive layer in example 1.
Fig. 4 is a schematic cross-sectional structure of a cutting blade after trimming cutting teeth on a base abrasive layer in example 1.
Fig. 5 is a schematic view showing the structure of the cutting blade of example 1 mounted on an outer circle cutter for repair.
Fig. 6 is a schematic view showing a structure of forming a relief groove in the base abrasive layer of the protective layer in example 2.
Description of the drawings
1. A base stock abrasive layer; 2. a protective layer; 3. a chip removal groove; 4. a tool retracting groove; 5. and (3) grinding materials.
Detailed Description
The present invention will be described more fully hereinafter with reference to the preferred embodiments for the purpose of facilitating understanding of the present invention, but the scope of protection of the present invention is not limited to the specific embodiments described below.
It will be understood that when an element is referred to as being "fixed, affixed, connected, or in communication with" another element, it can be directly fixed, affixed, connected, or in communication with the other element or intervening elements may be present.
Unless defined otherwise, all technical and scientific terms used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the scope of the present invention.
Example 1
The cutting blade with the protective layer shown in fig. 1 comprises a base abrasive layer and the protective layer, wherein the protective layer is coated on the radial direction and two sides of the outer circular cutting edge of the base abrasive layer in a U-shaped mode, the protective layer is metallurgically combined with a bonding agent layer on the outer surface of the base abrasive layer, and the surface abrasive on the outer surface of the base abrasive layer is protected. Meanwhile, the protective layer can effectively repair stress and mechanical damage generated on the blade machining part by machining.
In this embodiment, as shown in fig. 3 or 4, the thickness t=0.1 mm of the base abrasive layer. The abrasive is diamond particles, and the abrasive grain size is 10um. The outer diameter D= 60.04mm of the base stock grinding material layer and the inner diameter 40mm; the loop width B of the U protective layer=2 mm.
In the embodiment, the outer diameter edge of the base blank abrasive layer is uniformly provided with 16 chip grooves, and cutting teeth are formed between two adjacent chip grooves; the protective layer is in a U shape and is scattered and coated on the cutting teeth of the base blank abrasive layer. The depth of the chip groove is 5mm, the width is 1.5mm, and the radian of the tooth tip of the cutting groove is about 1rad (unit).
In this embodiment, as shown in fig. 2, the base abrasive layer includes a binder and an abrasive, the binder is metallic nickel, and the abrasive is uniformly fixed by the binder and forms the base abrasive layer. In this embodiment, the protective layer is a CrN coating, the covering height of the abrasive diamond particles by the binder is about 30%, the protective layer is metallurgically bonded with the binder layer on the outer surface layer of the base abrasive layer, and the covering height H of the abrasive diamond particles by the binder plus the protective layer is about 60%. The protective layer further covers the bonding agent nickel layer holding the abrasive diamond particles, so that the abrasion resistance of the side bonding agent can be effectively improved, the diamond is not easy to peel off, the central diamond layer is effectively protected, the lip effect in the cutting process is greatly reduced, and the service life of the blade is prolonged.
The present embodiment also provides a method of manufacturing a cut sheet having a protective layer, including the steps of;
1) And manufacturing the base blank abrasive layer by adopting an electroforming mode. The thickness T=0.1 mm of the base abrasive layer 1, the abrasive C is diamond particles, and the abrasive grain size is about 10um.
2) And (5) machining, namely forming chip grooves on the base blank abrasive layer.
After electroforming, the inner and outer diameters and the groove shape of the cut piece are precisely machined. Machining often produces more obvious product defects, especially a cutting piece with a plurality of chip grooves, and the cutting piece has large machining area and complex shape, and the machined part is easy to produce fine local defects and microcracks.
In the figure, the outer diameter d= 60.04mm of the machined base abrasive layer is about, the inner diameter d=40 mm of the base abrasive layer, the number of chip groove teeth is 16, the depth of the grooves is=5 mm, the chip groove teeth are uniformly distributed on the outer diameter edge of the cutting blade, the chip groove width l=1.5 mm, and the radian R of the chip groove tooth edge 1 =1rad (unit)
3) And (3) trimming the outer circle, wherein after trimming, the radial direction and two sides of the outer diameter cutting edge area of the base blank abrasive layer are R arcs, and meanwhile, the R arcs are controlled to be as follows: r is more than 0.5T and less than 1.5T, and T is the thickness of the base stock grinding layer. Schematic cross-sectional structures of the cutting flute teeth before and after trimming are shown in fig. 3 and 4.
And assembling the machined base blank abrasive layer with the flange, and then loading the base blank abrasive layer on an outer circle cutting machine. And in the process that the main shaft drives the cutting blade to rotate, the outer diameter and concentricity of the blade are polished by the trimming blade.
The process parameters are as follows:
in the grinding process, on the premise of ensuring the correct in-place of the size and concentricity, the radial direction and two sides of the cutting edge area of the outer diameter of the cutting blade are about R=0.055 mm after grinding, and the unilateral abrasion loss of the blade after grinding is about 20u.
4) As shown in fig. 6, the blade is installed in the shaft sleeve, and the position of the modified base abrasive layer, which does not need to be coated by sputtering, is effectively shielded by the insulating gasket, the shielding diameter is 56mm, and the outer diameter part of the base abrasive layer is exposed to the outside by about 2mm.
5) And (5) corrosion cleaning.
Wherein, the humic solution is selected: sulfuric acid: 30 wt.% hydrogen peroxide: 0.51 wt%, ammonium salt: 8.2 18.6wt% of aromatic amine and 0.052 wt% of nitro compound. The temperature of the etching solution was 28 degrees. The shaft sleeve with the blade is placed on an etching tank frame, the part needing to be coated is immersed in etching liquid, the shaft sleeve is rotated at a mechanical uniform speed, the nickel bonding agent covered by the grinding material on the outer surface layer of the part needing to be coated is partially etched and removed, the etching time is 50 seconds, the shaft sleeve is rotated for about 10 circles, and the metal nickel bonding agent layer of the grinding material on the outer surface layer covers most grinding materials by about D=30%.
6) And forming a protective layer on the bonding agent on the outer surface of the coating area of the base abrasive layer in a sputtering coating mode, wherein the height H of the protective layer for covering the diamond abrasive is about 60%.
The sputter coating comprises the steps of:
cleaning the blade after corrosion cleaning with pure water, and rapidly using N 2 Blowing dry;
the shaft sleeve with the blades is arranged in a coating jig, and the jig is arranged in a front bin of a coating chamber of a magnetron sputtering furnace;
jig for fixing a workpiecePushing into vacuum chamber, vacuum degree is 5.0X10 -4 Under Pa and below, introducing argon with purity of over 99.9%, air flow of 15-20sccm, starting pulse DC bias voltage of-350V to-400V, and controlling indoor air pressure to maintain for over 1 hr;
so that the air pressure in the film plating chamber is reduced to 2X 10 -1 Pa and below, starting a sputtering power supply to sputter, wherein the sputtered target is a chromium-palladium material with purity of 3N9, and then simultaneously introducing argon gas and nitrogen gas with purity of more than 99.9%, wherein the flow rate of the argon gas is 15-20sccm, and the flow rate of the nitrogen gas is 30-40sccm, so that the pressure in a film plating chamber is 5 multiplied by 10 -1 Pa and below, depositing a 3 μm thick CrN coating as a protective layer on the outer surface of the cutting sheet, controlling the height position D=60 of the coating on the bonding agent on the outer surface layer to cover the abrasive
% or so; the temperature of the base abrasive layer is 200-250 ℃ when sputtering is carried out.
6) And (5) packaging after cleaning. The outer diameter D= 60.005mm of the finished blade, the thickness T=0.1 mm of the blade, the annular width B=2 mm of the U protective layer and the thickness 3um of the CrN coating are coated on the outer surface layer bonding agent in a U shape.
In the embodiment, the U-shaped cladding protection layer is arranged on the radial direction and two side edge positions of the outer diameter edge cutting edge of the base blank abrasive layer, so that the performance of the cutting blade has a larger application range, and the use effect of the blade is improved.
Example 2
The difference between this example and example 1 is that in this example, the thickness t=0.2 mm of the base abrasive layer, the abrasive is diamond particles, and the abrasive grain size is about 50 um. The outer diameter D= 100.008mm of the base stock grinding material layer and the inner diameter is 70mm; the loop width B of the U protective layer=3 mm.
In this embodiment, a U-shaped protective layer is formed on the base abrasive layer by electroplating, where the ring width b=3mm of the U-shaped protective layer includes a binder and an abrasive, the binder is metallic nickel, the abrasive is a diamond abrasive, and the particle size of the diamond abrasive is about 5 μm. A layer of clearance groove of about 0.05mm is formed on the base stock grinding material layer.
Steps 1), 2), 3) and 4) of example 1, and then placing the sleeve with the blade in a diamond plating tank to electroplate the composite abrasive layer.
In this example, as shown in fig. 5, the relief groove is formed after the protective layer is metallurgically bonded to the base abrasive layer surface nickel layer. The outer diameter D of the finished blade is 100mm, the inner diameter is 70mm, the thickness T of the base blank is 0.2mm, the thickness T1 of the composite abrasive layer is 0.03mm, the thickness T of the base blank abrasive layer 1 and the thickness T of the composite abrasive layer 1 The thickness of the relief groove was 0.05mm. The protective layer forms a tool retracting groove on the base blank abrasive layer after being metallurgically combined with the nickel layer, so that ineffective grinding of the abrasive during cutting is avoided, the cutting inclined surface of a product can be effectively avoided when the cutting depth is too large, and the processing size of the product is effectively ensured.
Examples
The difference between this example and examples 1 and 2 is that in this example, the thickness t=0.135 mm of the base abrasive layer, the abrasive material is CBN particles, and the abrasive particle size is 30um. The outer diameter D= 78.01mm of the base stock grinding material layer and the inner diameter 40mm; the loop width B of the U protective layer=2.5 mm.
In this embodiment, a first U-shaped protection layer is formed on the base abrasive layer by electroplating, the protection layer is a composite abrasive layer, the bonding agent of the composite abrasive layer is metallic nickel, and the abrasive is diamond abrasive. And forming a composite coating on the outer surfaces of the diamond and the bonding agent on the outermost layer of the U-shaped protective layer by sputtering.
In example 1, 3), the outer diameter 78.06mm of the base abrasive layer after machining was set to about 40mm for the inner diameter of the base abrasive layer, and the thickness of the base abrasive layer was 0.135mm.
In this embodiment example 2, a first U-shaped protective layer is formed on the base abrasive layer by electroplating the coating: the loop width B of the U-shaped protective layer=2.5 mm. The protective layer is a composite abrasive layer, the composite abrasive layer comprises a bonding agent and an abrasive, the bonding agent is metallic nickel, the abrasive is diamond abrasive, the grain diameter of the diamond abrasive is about 6 mu m, and the thickness of the abrasive layer is about 0.03 mm.
In this embodiment, 4), 5), and 6) of example 1, a 2.5um thick CrN protective layer is formed on the bonding agent on the outer surface of the composite abrasive layer, and the height d=70 to 80% of the protective layer covered with the outer surface layer diamond abrasive. As shown in fig. 2 and 3, after the protective layer is metallurgically bonded to the surface nickel layer of the base abrasive layer by electroplating, a relief groove is formed in the base abrasive layer, and the thickness T of the base abrasive layer 1 and the thickness T1 of the composite abrasive layer form a relief groove with a single side of about 0.03 mm.
In this embodiment, the relief groove is formed after the protective layer is metallurgically bonded to the base abrasive layer surface nickel layer. The outer diameter D=78 mm and the inner diameter 40mm of the finished blade are finished, the thickness T=0.135 mm of the base blank is ground, the thickness T1=0.2 mm of the composite grinding material layer, and the thickness T1 of the base blank grinding material layer 1 and the thickness T1 of the composite grinding material layer form a tool withdrawal groove with the thickness of about 0.03 mm.
Example 4
This example is different from example 1 in that a U-shaped metallic titanium protective layer was formed on both sides and the radial direction of the outer circumferential edge of the base abrasive layer using an electroplating method.
The laminated outer diameter of the base abrasive of this embodiment is 57.98mm, the thickness of the base abrasive layer is 0.198mm, the abrasive is diamond abrasive, and the abrasive grain size is 20um. And forming a U-shaped protective layer on the base blank abrasive layer in an electroplating coating mode, wherein the ring width B=4mm of the U-shaped protective layer is titanium metal, and forming a metal titanium protective layer on the bonding agent of the U-shaped area on the radial direction and the two sides of the round edge of the outer round edge of the base blank abrasive layer.
The shaft sleeve with the blade is placed in a titanizing tank to electroplate a titanium layer as in 1), 2), 3) and 4) of example 1.
In the U-shaped protection area, the covering position D=30% of the bonding agent to the diamond, the covering position D70-90% of the titanium coating of the protection layer to the diamond, and a thick Ti protection layer with the thickness of about 10um is formed on the bonding agent on the outer surface of the base abrasive layer. Finished blade finished outer diameter d=60 mm, inner diameter 40mm, base stock ground at layer thickness t=0.2 mm.
Claims (4)
1. A method for preparing a cutting sheet with a protective layer, which is characterized in that: the method comprises the following steps:
1) Manufacturing a base blank abrasive layer;
2) Machining the inner and outer diameters of the base blank abrasive layer and the junk slots;
3) The concentricity of the outer diameter of the base blank abrasive layer is trimmed, the radial direction and two sides of the cutting edge area of the base blank abrasive layer are R arcs after trimming, and meanwhile the R arcs are controlled to be as follows: r is more than 0.5 and less than 2T, T is the thickness of the base blank abrasive layer;
4) Forming a protective layer on the base abrasive layer in a sputtering coating mode, wherein the protective layer is metallurgically bonded on a surface layer bonding agent outside the base abrasive layer through a magnetron sputtering coating; the thickness of the protective layer is 2-20 μm when the magnetron sputtering coating is adopted;
in the step 4), the method further comprises the following steps when sputtering coating is adopted:
(1) the cutting blade is arranged in the shaft sleeve, so that the part needing the coating is exposed, and the part needing no coating is shielded;
(2) the method comprises the steps of performing corrosion cleaning, namely placing a shaft sleeve provided with a cutting blade on a corrosion groove frame, immersing a part to be coated in corrosion liquid, mechanically rotating the shaft sleeve at a uniform speed, and performing partial corrosion removal on a nickel bonding agent covered by an abrasive material on the outer surface layer of the part to be coated, wherein the covering height D of the metal nickel bonding agent layer of the abrasive material on the outer surface layer is 10-50%;
(3) cleaning the sleeve with pure water, and then using N rapidly 2 Blowing dry;
(4) the shaft sleeve with the cutting piece is arranged in a jig, and the jig is arranged in a front bin of a coating chamber of a magnetron sputtering furnace;
pushing the jig into a vacuum chamber, wherein the vacuum degree is 5.0X10 -4 Under Pa and below, introducing argon with purity of over 99.9%, air flow of 15-20sccm, starting pulse DC bias voltage of-350V to-400V, and controlling air pressure in the film plating chamber to be kept for over 1 hour;
so that the air pressure in the film plating chamber is reduced to 2X 10 -1 Pa and below, starting a sputtering power supply to sputter, and then simultaneously introducing argon and nitrogen with the purity of more than 99.9 percent, wherein the flow rate of the argon is 15-20sccm, and the flow rate of the nitrogen is 30-40sccm, so that the pressure in a film plating chamber is 5 multiplied by 10 -1 Pa and below, depositing a protective layer with the thickness of 2-20 mu m on the bonding agent on the outer surface of the coating area of the cutting sheet,the coating on the surface layer abrasive bonding agent has the abrasive covering height D of 50-90%; the temperature of the base abrasive layer is 200-250 ℃ when sputtering is carried out.
2. A protective layer-equipped dicing sheet produced by the protective layer-equipped dicing sheet production method according to claim 1, characterized in that: the grinding machine comprises a base grinding material layer and a protective layer, wherein the protective layer is coated on the radial direction and two sides of the excircle cutting edge of the base grinding material layer in a U-shaped manner, the protective layer is single-layer or multi-layer, and is metallurgically combined with a bonding agent layer on the surface layer of the base grinding material layer and used for protecting surface grinding materials on the outer side of the base grinding material layer;
the protective layer is metallurgically bonded on the surface layer bonding agent outside the base blank abrasive layer through a magnetron sputtering coating; when the magnetron sputtering coating is adopted, the thickness of the protective layer is 2-20 mu m; the base abrasive layer comprises a bonding agent and an abrasive, wherein the abrasive is uniformly fixed through the bonding agent and forms the base abrasive layer.
3. The dicing sheet with protective layer according to claim 2, wherein: and the protective layer is metallurgically bonded to the surface bonding agent outside the base stock abrasive layer to form a tool retracting groove.
4. The dicing sheet with protective layer according to claim 2, wherein: the outer diameter edge of the base blank abrasive layer is uniformly provided with a plurality of chip grooves, and cutting teeth are formed between two adjacent chip grooves.
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| JP2002137168A (en) * | 2000-10-31 | 2002-05-14 | Sumitomo Electric Ind Ltd | Super abrasive tool |
| JP2009006407A (en) * | 2007-06-26 | 2009-01-15 | Mitsubishi Materials Corp | Thin edge grinding wheel |
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| CN114905419A (en) | 2022-08-16 |
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