CN114901413A - Laser reflow soldering device and laser reflow soldering method - Google Patents

Abstract

The laser reflow soldering device of the present invention includes: a laser pressure head module for pressing a welding object composed of a plurality of electronic components arranged on a substrate by a light-transmitting pressure member and welding the electronic components to the substrate by irradiating a laser beam through the pressure member; and a welding object transfer module for transferring the welding object, so that the welding object carried in from one side of the laser pressure head module is carried out towards the other side after the reflow soldering treatment of the laser pressure head module.

Description

Laser reflow soldering device and laser reflow soldering method

technical field

The present invention relates to a laser reflow soldering apparatus and a laser reflow soldering method, and more particularly, to a laser reflow soldering apparatus and a laser reflow soldering method using the pressurization method in which a translucent pressing member is pressed and arranged on a substrate. Solder the electronic components while irradiating the laser light on the state of the multiple electronic components.

Background technique

In industrial laser processing, applications with micron (μm)-level precision include micro-laser processing, which is widely used in the semiconductor industry, display industry, printed circuit board (PCB) industry, and smartphone industry. In memory chips used in all electronic devices, integration, performance, and ultra-high-speed communication speed have been achieved by technologies that minimize circuit pitches. The required technical level is at the level of stacking a plurality of memory chips in the vertical direction. TSMC has developed 128-layer stacking technology, and Samsung Electronics and SK Hynix have applied 72-layer stacking technology to mass production.

Moreover, it is actively researching and developing the technology of loading memory chips, microprocessor chips, graphics processor chips, wireless processor chips, sensor processor chips, etc. in one package, and a considerable level of technology has been applied in practice.

However, in the development process of the above technologies, as more and more electrons interfere with the signal processing flow inside the ultra-high-speed/large-capacity semiconductor chip, the problem of heat-generating cooling processing occurs due to the increase in power consumption. In addition, in order to achieve the requirements of ultra-high-speed signal processing and ultra-high-frequency signal processing for more signals, there is a technical problem that a large number of electrical signals need to be transmitted at high speed. In addition, with the increase of signal lines, the one-dimensional lead method cannot be used for the signal interface lines facing the outside of the semiconductor chip. Therefore, the ball grid array (BGA) method (BGA) method ( Fan-in Ball Grid Array (Fan-In BGA) or Fan-in Wafer-Level Package (FIWLP, Fan-in Wafer-Level-Package) and the formation of signal wiring redistribution under the ultra-fine BGA layer on the lower part of the chip Layer (Signal Layout Redistribution Layer) and form a second fine BGA layer below it (Fan-Out BGA) or Fan-Out Wafer Level Packaging (FOWLP, Fan-Out Wafer- Level-Package) or Fan-Out Panel-Level-Package), etc.

Recently, as a semiconductor chip, a product with a thickness of 200 μm or less including an epoxy molding compound (EMC, Epoxy-Mold Compound) layer has been developed. In order to attach such a micron-scale ultra-thin semiconductor chip with a thickness of only a few hundred microns to an ultra-thin printed circuit board, if a mass reflow (MR) process, which is a standard process of the existing surface mount technology (SMT), is applied, for example, thermal reflow Thermal Reflow Oven technology, as the semiconductor chip is exposed to the air temperature environment of 100 ℃ to 300 ℃ for hundreds of seconds, due to the difference in the coefficient of thermal expansion (CTE, Coefficient of Thermal Expansion) It is possible to produce a variety of Types of poor solder bonding, such as Chip-Boundary Warpage, PCB-Boundary Warpage, Random-Bonding Failure by Thermal Shock, etc.

Therefore, in the laser reflow soldering equipment that has recently attracted attention, the structure is such that the welding object (semiconductor chip or integrated circuit IC) is pressed by the laser head module for several seconds and the welding is carried out by irradiating the laser. Welding is performed with a laser in the form of a surface light source of the size of a semiconductor chip or an integrated circuit.

Reference is made to Korean Patent Application No. 0662820 (hereinafter, referred to as "Conventional Document 1") as a laser reflow soldering apparatus of such a pressurization method, which is structured to heat the flip chip by irradiating the back surface of the flip chip with laser light. On the other hand, a flip chip thermocompression bonding module for crimping the flip chip to the carrier substrate is disclosed.

However, in the conventional press-type laser reflow soldering apparatus disclosed in the above-mentioned prior art document 1, since the unit for sucking the chip and moving it to the bonding position and the laser heating the back surface of the chip and press-bonding the chip to the carrier substrate The units are separated from each other. Therefore, when a plurality of semiconductor chips such as semiconductor strips are welded, the operation of irradiating laser light while pressing one semiconductor chip needs to be repeated according to the number of semiconductor chips, resulting in a problem of increased work time.

On the other hand, refer to Korean Patent Laid-Open No. 2017-0077721 (hereinafter, referred to as "Conventional Document 2"), which discloses a structure of a laser reflow soldering apparatus by applying pressure to a plurality of flip chips at the same time by the pressing head. The bonding process is performed by moving the laser head in the horizontal direction and sequentially irradiating each flip chip with one laser or by irradiating a plurality of flip chips simultaneously with a single laser head.

However, the structure of the conventional laser reflow soldering apparatus of the above-mentioned prior art document 2 uses a single laser light source. Therefore, in the process of irradiating a plurality of flip chips arranged on a substrate with a laser beam at various angles, it is difficult to irradiate uniformly. In addition, from a technical point of view, there is a problem that the reflow process cannot be performed uniformly on a plurality of flip chips without causing defects.

Therefore, the conventional laser reflow soldering apparatuses disclosed in the above-mentioned prior art document 1 and the above-mentioned prior art document 2 sequentially pressurize and irradiate the individual flip-chips with laser light one by one, and therefore, the overall working time will inevitably increase, even in order to achieve multiple In fact, it is difficult to transmit uniform heat energy to each flip chip by irradiating a single laser beam to a plurality of flip chips arranged horizontally on various substrate sizes. Therefore, in order to improve the solder defect rate, a large number of research and development.

SUMMARY OF THE INVENTION

technical problem

In view of this, in order to solve the above-mentioned problems, an object of the present invention is to provide a laser pressure head module of a laser reflow soldering apparatus that can easily adjust the primary processing by replacing the translucent pressure member. The dimensions of the pressing and laser light-transmitting areas correspond to the dimensions of various substrates. As a result, it is possible to batch process a plurality of electronic components at the same time by pressurization and laser reflow soldering, and greatly improve the defect rate.

Furthermore, another object of the present invention is to provide a laser press head module of a laser reflow soldering apparatus that can simultaneously pressurize a plurality of electronic components and irradiate a homogenized laser beam to realize batch processing while significantly improving the defect rate.

In addition, another object of the present invention is to provide a laser pressure head module of a laser reflow soldering apparatus in which each edge and corner of a plate-shaped holder unit to which a translucent pressure member is attached can be independent of each other. to set and adjust the pressure. As a result, it is possible to greatly improve the defect rate while realizing batch processing by simultaneously applying pressure to a plurality of electronic components and irradiating a laser beam to perform a one-time reflow process.

In addition, another object of the present invention is to provide a laser pressure head module of a laser reflow soldering apparatus, that is, through a conveyor system, a soldering object with a plurality of electronic components placed on a substrate can be It is easy to carry in and out, regardless of the size. During the transfer process, the temperature during the laser reflow process can be stabilized without causing defects by continuously preheating the soldered object to a predetermined temperature. rise to the melting temperature of the solder. As a result, it is possible to greatly improve the defect rate while realizing batch processing by simultaneously applying pressure to a plurality of electronic components and irradiating a laser beam to perform a one-time reflow process.

Still another object of the present invention is to provide a multi-laser module of a laser reflow soldering apparatus that precisely detects and compensates for the substrate and electronic components constituting the soldering object by precisely detecting the area where the multi-laser beams are superimposed and irradiated by a plurality of temperature sensors. The temperature of the components is not uniform, thereby preventing poor soldering of specific electronic components. As a result, by simultaneously applying pressure to a plurality of electronic components and irradiating a laser beam to perform a one-time reflow process, batch processing can be achieved, and solder defects caused by uneven temperature can be greatly improved.

Furthermore, another object of the present invention is to provide a laser reflow soldering method for a laser reflow soldering apparatus that adjusts the arrangement shape of an electronic component located below so that it is located in the lower part before the translucent pressing member is pressed The pressing surface of the translucent pressing member is in the center, so that the pressure transmitted to the electronic element is uniformly pressed without being biased to one side during the pressing process of the above-mentioned translucent pressing member. As a result, it is possible to greatly improve the defect rate while realizing batch processing by simultaneously applying pressure to a plurality of electronic components and irradiating a laser beam to perform a one-time reflow process.

In addition, another object of the present invention is to provide a laser reflow soldering method for a laser reflow soldering device, that is, pressurizing a plurality of electronic components under preset conditions and sequentially controlling the irradiation process of the laser beam, thereby, Under the premise of no soldering defects, batch reflow soldering is performed on multiple power components at one time and the defect rate is greatly improved.

solution to the problem

In order to achieve the above object, the present invention includes a laser press head module, which pressurizes a welding object by a light-transmitting press member and irradiates a laser beam through the press member to weld electronic components to a substrate, and the welding target is arranged in a It is composed of a plurality of electronic components on the substrate; and a welding object transfer module is used to transfer the above-mentioned welding object, so that the welding object carried in from one side of the above-mentioned laser pressure head module is subjected to the reflow soldering process of the laser pressure head module and transport it out towards the other side.

In addition, the above-mentioned laser pressing head module includes: a bracket unit for attaching the above-mentioned translucent pressing member in a replaceable manner; and a probe unit, which is arranged above the bracket unit and is used for detecting the installation in the bracket unit. the flatness of the pressurized parts.

In addition, the above-mentioned laser beam is a square laser beam homogenized by a beam shaper.

In addition, the above-mentioned laser beams are laser beams irradiated by overlapping two or more laser modules.

Further, the holder unit includes a lower plate, and a through hole for inserting and locking the translucent pressing member is formed in the center portion thereof.

The above-mentioned translucent pressing member is made of one of quartz (Quartz), sapphire (sapphire), fused silica glass (Fused Silica Glass) or diamond.

In addition, the holder unit further includes a mask plate, and a through hole through which the laser beam can pass is formed in the center portion, so that the translucent pressing member is coupled to the upper part of the lower plate in a state of being placed on the lower plate.

In addition, the through hole of the mask plate has a square shape larger in area than the pressing surface of the translucent pressing member or the same as the pressing surface of the translucent pressing member.

Moreover, the bottom surface of the said lower board has a circular arc shape in the corner part of the left and right sides.

In addition, a flatness adjusting unit for adjusting the flatness of the translucent pressing member is further provided at each corner of the lower plate by finely moving the corners of the lower plate in the vertical direction.

In addition, the flatness adjustment unit includes: a punching bracket, which is arranged on each corner of the light-transmitting pressing member and the bracket unit; and a vertical driving part, which is arranged on one side of the punching bracket and is driven by a motor to drive Move the stamping carriage in the vertical direction.

Further, the vertical drive unit includes: a ball screw and a motor for vertically moving the press carriage; and a guide member for guiding the linear motion of the press carriage.

Also, the above-mentioned probe unit includes: a probe for measuring flatness by piercing at one or more positions on the upper surface of the penetrating light pressing member; a moving unit for horizontally or vertically moving the above-mentioned probe; and a probe The bracket is used to fix the probe and the moving unit.

In addition, the probe pierces four or more positions including each corner position of the square on the upper surface of the translucent pressing member.

In addition, the present invention further includes a protective film formed on the lower portion of the translucent pressurizing member for preventing fumes generated during laser welding from adhering to the bottom surface of the translucent pressurizing member.

Also, the above protective film is made of polytetrafluoroethylene resin (PTFE) or soluble polytetrafluoroethylene resin (PFA).

And the said protective film is supplied by the protective film transfer part, and the said protective film transfer part unrolls the protective film wound in a roll shape by a roll-to-roll (reel toreel) method, and transfers it to one side.

Further, the translucent pressing member includes: a base material whose entirety is in the shape of a square plate; and a pressing surface protruding from the bottom surface of the base material and forming a planar shape whose bottom surface corresponds to the plurality of electronic components.

In addition, one or more stepped portions recessed inwardly so that the area of the pressing surface is smaller than the area of the base material are further included between the base material and the pressing surface.

In addition, a laser light blocking layer is formed on the side surface of the base material and the bottom surface and side surface of the stepped portion.

And the said pressurization surface is divided|segmented into two or more by the groove|channel which has a predetermined depth.

In addition, a laser blocking layer is also formed on the inner side surface and the bottom surface of the above-mentioned grid grooves.

In addition, the above-mentioned laser blocking layer is a composite layer composed of one or more of an Inconel coating, a scattering treatment layer or a high reflection (HR, High Reflection) coating.

In addition, the said pressing surface is square.

In addition, both side corners of the pressing surface are chamfered or rounded.

In addition, an elastic damping layer is further provided on the pressing surface.

In addition, the elastic damping layer is made of silicon material.

In addition, the above-mentioned laser pressure head module further includes: a bracket unit, which is rectangular, for installing the above-mentioned light-transmitting pressure member in a replaceable manner; a pressure balancer, which supports the lower ends of the corners of the bracket unit and connects The weight of the bracket unit and the translucent pressing member is initialized to zero by applying pressure equivalent to the weight of the holder unit and the weight of the translucent pressing member in the opposite direction; Above each corner of the bracket unit, each corner of the bracket unit is independently pressed with a preset pressure.

Moreover, the said pressure balancer is an air cylinder.

Moreover, the said pressure balancer is a spring.

In addition, one of the punching units is disposed at each corner, so that the punching unit independently presses each corner of the bracket unit with a preset pressure.

Moreover, the punching unit includes: a punching bracket for fixing each corner of the bracket unit in a non-contact manner; and a pressurizing cylinder installed on the upper end of the punching bracket to press down the bracket unit with a preset pressure respectively.

In addition, the above-mentioned pressurizing cylinder is a precision air cylinder, which can realize fine setting and adjustment of the pressure in units of kgf.

In addition, the pressurizing cylinder is further provided with a pressure sensor that measures the pressure during pressurization and continuously provides feedback.

In addition, an ionizer unit for keeping the upper surface of the translucent pressurizing member clean from the influence of dust adsorption by static electricity is provided above the holder unit.

In addition, the above-mentioned welding object transfer module includes: an input conveyor for carrying in the welding object, and the above-mentioned welding object is composed of a plurality of electronic components arranged on the substrate; and a vacuum chuck unit, which is fixed by vacuum suction and transferred from the above-mentioned input conveyor. , and an output conveyor for carrying out laser-reflow soldered objects.

In addition, the above-mentioned input conveyor and the above-mentioned output conveyor include: a conveyor frame; a pair of wire rail units are provided on both sides of the upper part of the conveyor frame; and a horizontal transfer unit is provided on one side of the conveyor frame. To make the conveyor frame move linearly in the horizontal direction.

In addition, a width adjustment unit is also provided on one side of the conveyor frame of the input conveyor and the output conveyor to accommodate welding objects of different sizes by expanding or reducing the width of the conveyor frame.

In addition, the conveyor frame of the above-mentioned input conveyor is further provided with a preheating stage for preheating the welding object to a predetermined temperature.

In addition, a vision unit is also provided on one side of the vacuum suction cup unit to monitor whether the welding object is normally loaded.

In addition, a pick-up unit for transferring the welding object is further provided between the input conveyor and the vacuum chuck unit and between the output conveyor and the vacuum chuck unit, respectively.

Further, the pickup unit includes: a vacuum suction pad in the shape of a flat plate; and a vertical drive unit for transferring the vacuum suction pad in a vertical direction.

In addition, the vacuum suction cup unit includes: a porous suction plate for attracting and fixing the welding object; and a horizontal moving unit, so that the porous suction plate and the heating block are passed through the laser reflow processing area from the input area of the welding object to the output area. area to move back and forth.

In addition, the porous adsorption plate is composed of a center adsorption plate and an edge adsorption plate. The center adsorption plate is rectangular and is used for adsorbing the center part of the bottom surface of the welding object. The edge adsorption plate surrounds the center adsorption plate and is used for adsorbing the welding object. the bottom edge part.

In addition, the edge suction plate is further formed with suction holes for suctioning the edge portion of the bottom surface of the welding object.

And, the above-mentioned edge suction plate is made of aluminum material.

In addition, a heating block is also provided at the lower part of the porous adsorption plate.

In addition, the above-mentioned laser pressing head module includes: a multi-laser module for superimposing and irradiating a plurality of laser beams on the welding object in a state of being spaced apart from each other; The optical pressurizing member irradiates a light beam and detects the temperature of a plurality of positions of the welding object.

In addition, the above-mentioned multi-laser modules are one-to-many laser modules facing each other.

In addition, the temperature sensor is a single infrared temperature sensor, and the single infrared temperature sensor sequentially irradiates infrared rays to a plurality of positions of the welding object.

In addition, the single infrared temperature sensor described above sequentially irradiates infrared rays to a plurality of positions in a peripheral portion and a central portion of a region in which a plurality of laser beams are superimposed and irradiated.

In addition, the temperature sensor is a plurality of infrared temperature sensors, and the plurality of infrared temperature sensors simultaneously irradiate infrared rays to a plurality of positions of the welding object.

In addition, the plurality of infrared temperature sensors described above simultaneously irradiate infrared rays to a plurality of positions in the peripheral portion and the central portion of the region in which the plurality of laser beams are superimposed and irradiated.

In addition, the multi-laser module is further provided with a beam analyzer for measuring the power and intensity of each laser beam.

In addition, the laser reflow soldering method of the laser reflow soldering apparatus of the present invention presses a welding object on which a plurality of electronic components are arranged on a rectangular substrate by a translucent pressing member, and irradiates a laser beam through the pressing member to solder the electronic components to the substrate. , comprising: step a), before the above-mentioned translucent pressing member presses the welding object, photographing the configuration shapes of a plurality of electronic components located in a specified range directly below the pressing surface of the translucent pressing member by a visual unit; step b ), judging whether the photographed shape of the plurality of electronic components in the predetermined range corresponds to the pressing surface; step c), when judging that the plurality of electronic components corresponds to the pressing surface, the translucent pressing member moves downward and pressurizing the welding object, and irradiating the welding object with a laser beam through the light-transmitting pressing member; step d), stopping the irradiation of the above-mentioned laser beam and moving the light-transmitting pressing member upward to release the pressurized state; and In step e), a plurality of electronic components in a predetermined range in which the above-mentioned translucent pressing member is to be reflowed next are moved horizontally upward.

In addition, the above-mentioned step b) includes: step b1), judging whether the plurality of electronic components are based on the center line of the pressing surface of the light-transmitting pressing member when the plurality of electronic components are observed from the side in the shape of the plurality of electronic components in the predetermined range. Left and right symmetry; and step b2), when the above-mentioned multiple electronic component configuration shapes photographed are symmetrical with respect to the center line of the pressing surface of the light-transmitting pressing member, it is judged as corresponding to the pressing surface, and when not corresponding to the pressing surface. When pressing the surface, the horizontal position of the translucent pressing member is adjusted so that the arrangement shape of the plurality of electronic components is bilaterally symmetrical with respect to the center line of the pressing surface of the translucent pressing member.

In addition, the above-mentioned laser beams are laser beams irradiated by overlapping two or more laser modules.

In addition, each of the above-mentioned laser modules is arranged symmetrically with each other, and each of the above-mentioned laser beams has the same beam irradiation angle.

And, each of the above-mentioned laser modules simultaneously irradiates a laser beam.

And, each of the above-mentioned laser modules sequentially irradiates a laser beam.

Furthermore, the present invention further includes a step of preheating the object to be welded from below before performing the above step c).

In addition, in the step of preheating the above-mentioned welding object from below, the surface temperature of the welding object is maintained to be less than 200°C.

Furthermore, in the said step c), the surface temperature of a welding object is heated to 200 degreeC or more by irradiating a laser beam to a welding object by a translucent pressing member.

In addition, the laser reflow soldering method of the laser reflow soldering apparatus of the present invention presses a welding object on which a plurality of electronic components are arranged on a rectangular substrate by a translucent pressing member, and irradiates a laser beam through the pressing member to solder the electronic components to the substrate. , comprising: step a), making the pressing surface of the above-mentioned translucent pressing member move downward to contact the welding object in a state of not applying pressure; step b), irradiating the welding object with a laser beam through the above-mentioned translucent pressing member and step c), releasing the irradiation of the laser beam and moving the translucent pressing member upward.

In addition, the present invention further includes the step of fixing the vertical movement of the translucent pressing member after performing the above step a).

In addition, the present invention further includes the following steps: after performing the above step a), applying a preset predetermined pressure to the above-mentioned translucent pressing member, and after performing the step b), not fixing the translucent pressing member. Move vertically.

In addition, the present invention further includes the following steps: after performing the above step a), the vertical movement of the above-mentioned translucent pressing member is fixed, and after performing the above-mentioned step b), a preset pressure is applied to the above-mentioned translucent pressing member. specified pressure.

Furthermore, the present invention further includes the steps of fixing the vertical movement of the translucent pressing member after performing the step a), and not fixing the vertical movement of the translucent pressing member after performing the step b).

Moreover, in the above-mentioned step b), the above-mentioned laser beam is a laser beam irradiated by two or more laser modules overlappingly.

And, each of the above-mentioned laser modules simultaneously irradiates a laser beam.

And, each of the above-mentioned laser modules sequentially irradiates a laser beam.

Furthermore, the present invention further includes a step of preheating the welding object from the bottom before performing the above step b).

In addition, in the step of preheating the above-mentioned welding object from below, the surface temperature of the welding object is maintained to be less than 200°C.

effect of invention

The present invention as described above has the effect that, by pressing the plurality of electronic components simultaneously and irradiating the homogenized laser beam, uniform thermal energy is transmitted to the plurality of electronic components, and therefore, batch laser reflow processing can be performed. to significantly improve productivity.

In addition, since the mask plate and the translucent pressing member can be replaced according to the size of the substrate and the arrangement shape of the electronic components, a uniform reflow process can be performed for a variety of substrates, and the defect rate can be greatly reduced.

In addition, the defect rate can be greatly reduced by preventing the substrates and components from being accelerated due to thermal damage to the substrates surrounding the electronic components due to laser beams leaking from the edge portion of the quartz (Quartz) constituting the pressurizing member.

In addition, since the pressure for pressing the corners of the holder unit on which the translucent pressing member is mounted can be independently set and adjusted, it is possible to prevent insufficient pressure or damage caused by the pressure acting on the plurality of electronic components arranged on the substrate. Excessive pressure results in defective products.

In addition, it is possible to simplify and stabilize a soldering object having a predetermined area on which a plurality of electronic components are placed on the substrate to and from the reflow processing area.

Also, the defective welding rate can be greatly improved by detecting temperature unevenness in the overlapping irradiation area of multiple laser beams and immediately detecting compensation.

In addition, the pressure of the light-transmitting pressing member is uniformly dispersed and the electronic components are prevented from being pressed to one side, so that the position of the light-transmitting pressing member can be adjusted to greatly improve the pressure caused by the light-transmitting pressing member. The defect rate caused by the pressure of a plurality of electronic components being biased to one side.

In addition, the pressing of the translucent pressing member and the irradiation of the laser beam of the laser module can be precisely controlled in sequence based on the preset reference value, so as to greatly reduce the insufficient or excessive pressure acting on the plurality of electronic components arranged on the substrate. And there may be a variety of poor soldering problems, such as poor solder contact or overflow.

Description of drawings

FIG. 1 is a diagram showing an example of the overall structure of the laser reflow soldering apparatus of the present invention.

FIG. 2 is a structural block diagram of FIG. 1 .

3 is a conceptual diagram of a single laser beam module of a laser reflow soldering apparatus according to an embodiment of the present invention.

FIG. 4 is a conceptual diagram of a dual laser beam module of a laser reflow soldering apparatus according to still another embodiment of the present invention.

FIG. 5 is a structural diagram of a dual laser beam module of a laser reflow soldering apparatus according to still another embodiment of the present invention.

6 to 9 are structural diagrams of a laser optical system applicable to a dual laser beam module of a laser reflow soldering apparatus according to still another embodiment of the present invention.

10 is a perspective view of a main part schematically showing the structure of a bracket unit of the laser pressurization head module of the present invention.

FIG. 11 is a cross-sectional view of the main part schematically showing the structure and working state of the bracket unit of the laser pressing head module of the present invention.

12 is a perspective view of the main part schematically showing the structure and working state of the probe unit of the laser pressure head module of the present invention.

13 is a side view schematically showing the structure and working state of the vertical transfer portion of the laser pressure head module according to an embodiment of the present invention.

14 is a perspective view of the main part schematically showing the structure and working state of the vertical transfer part of the laser pressing head module according to still another embodiment of the present invention.

FIG. 15 is a side sectional view of the main part of FIG. 14 .

16a is a top view of the main part of the bracket unit of the laser compression head module formed in an octagon according to an embodiment of the present invention.

16b is a plan view of a main part of a bracket unit of a laser compression head module according to still another embodiment of the present invention formed in a circular shape.

17a and 17b are perspective views of main parts showing the translucent pressurizing member of the laser pressurization head module of the present invention, and FIG. 17a is the translucent pressurizing member having a single pressurizing surface according to an embodiment of the present invention Fig. 17b is a shape example diagram of a translucent pressing member having a pressing surface divided in a manner corresponding to each electronic element according to still another embodiment of the present invention.

FIG. 18 is an operating state diagram showing a state in which the translucent pressing member of the present invention is attached to the pressing head.

FIG. 19 is an enlarged view of the main part of FIG. 18 .

20a to 20c are schematic diagrams showing various embodiments of the light-transmitting pressing member of the present invention, and FIG. 20a shows the case where the corners of the pressing surface are not processed, and FIG. 20b shows the pressing surface that is chamfered In the case of corners, Fig. 20c shows the case where the corners of the pressurized surface are rounded.

FIG. 21 is a side sectional view of the main part schematically showing the overall device structure of the laser pressure head module according to the embodiment of FIG. 13 .

FIG. 22 is a plan view of the main part of FIG. 21 .

FIG. 23 is an enlarged perspective view showing a main part of a punching unit of the laser pressurization head module of the embodiment of FIG. 13 .

24 is a perspective view showing the structure and working relationship of the input area of the welding object transfer module according to an embodiment of the present invention.

25 is a perspective view showing the structure and working relationship of the output area of the welding object transfer module according to an embodiment of the present invention.

26a and 26b are exemplary diagrams showing the structure and working relationship of the vacuum suction cup unit of the welding object transfer module of the present invention, FIG. 26a shows the structure of the porous suction plate in one embodiment, and FIG. Adsorption plate structure.

FIG. 27 is a side view schematically showing the structure and working relationship of a multi-laser module according to still another embodiment of the present invention.

FIG. 28 is an enlarged perspective view of a main part showing the structure of the temperature sensor of FIG. 27 .

FIG. 29 is an enlarged plan view of a main part showing the structure of the welding target of FIG. 28 .

30a to 30e are state diagrams showing the working relationship according to the process of the laser reflow method of the present invention. The light-transmitting pressurizing member pressurizes on the center line Cn+1 and irradiates the laser light. Fig. 30c shows the state where the light-transmitting pressurizing member moves to the center line Cn+2. Fig. 30d shows the light-transmitting pressurizing member. The position of is based on the state where the center line Cn+2' is aligned, and Fig. 30e shows the state where the light-transmitting pressing member is pressurized on the center line Cn+2' and irradiated with laser light.

31a to 31d are state diagrams showing the working relationship according to the steps of the laser reflow soldering method of the present invention, and FIG. 31a shows the light-transmitting pressurizing member after the previous reflow soldering process is completed and the next reflow soldering process is performed. The step of moving the object to be welded upwards, FIG. 31b shows the step of moving the pressing surface of the translucent pressing member downward to contact the object to be welded in a state where no pressure is applied, and FIG. In the step of irradiating the object with the laser beam, FIG. 31d shows the step of releasing the irradiation of the laser beam and moving the translucent pressing member upward.

Detailed ways

The terms used in this specification are used to describe specific embodiments only, and do not limit the present invention. Unless the context clearly dictates otherwise, the expression of the singular includes the expression of the plural. It should be understood that the terms "comprising" or "having" and "provided with" in this specification are only used to designate features, numbers, steps, operations, structural elements, components or their combinations described in this specification. The presence does not preclude the presence or additional possibility of one or more other features, numbers, steps, acts, structural elements, components or combinations thereof.

In this specification, unless otherwise defined, all terms including technical or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms defined in commonly used dictionaries should be construed to have the same meanings as contextual meanings in the related art, and unless explicitly defined in this specification, they should not be interpreted in idealized or overly formalized meanings.

Hereinafter, the laser reflow soldering apparatus of the present invention will be described in detail with reference to FIGS. 1 and 2 .

FIG. 1 is an exemplary diagram showing the overall structure of the laser reflow soldering apparatus of the present invention, and FIG. 2 is a block diagram of the structure of FIG. 1 .

As shown in FIGS. 1 and 2 , the laser pressure head module 300 of the laser reflow soldering apparatus of the present invention includes: one or more multi-laser modules 310 and 320 for irradiating the surface of the welding object 11 supported and transferred by the stage 111 For the laser in the form of a light source, the stage 111 has a structure that can apply heat to the lower part and is formed with a porous material or a vacuum hole; the translucent pressing member 100 is provided independently from the laser modules 310 and 320 and is used for transmission A laser in the form of a surface light source; and a protective film 200 for protecting the above-mentioned translucent pressing member 100 from contamination.

First, the multi-laser modules 310 , 320 (eg, dual-laser modules according to an embodiment of the present invention) convert the laser light generated from the laser oscillator and transmitted through the optical fiber into a surface light source to illuminate the welding object 11 . The laser modules 310 and 320 may include: a beam shaper (refer to FIG. 5 ) for converting a laser beam in the form of a spot into a surface light source form; and an optical unit (refer to FIGS. 5 to 9 ) configured in the above-mentioned beam shaping The lower part of the device is positioned so that the surface light source emitted from the beam shaper irradiates the irradiation area of the welding object 11 , and a plurality of lens modules are installed inside the lens barrel with a proper distance from each other.

In order to achieve the alignment with the welding object 11, the laser modules 310 and 320 are moved up or down along the z-axis, or moved left and right along the x-axis, or can be moved along the y-axis.

The laser pressure head module 300 of the laser reflow soldering apparatus of the present invention includes: a translucent pressure member 100 for pressing the welding object 11 ; and laser modules 310 and 320 for irradiating the welding object 11 with a laser in the form of a surface light source Since the translucent pressing member 100 and the laser modules 310 and 320 are formed separately from each other, the laser modules 310 and 320 are moved to a state where the translucent pressing member 100 presses the welding object 11 . After irradiating a plurality of irradiation positions of the welding object 11 , the tact time for one welding object 11 is shortened by driving, and the overall welding work for a plurality of welding objects 11 is accelerated.

In this case, the translucent pressurizing member 100 is moved to an operating position or a standby position by a translucent pressurizing member transfer unit (not shown) of a predetermined form. As an example, the translucent pressurizing member transferring unit may The light-transmitting pressing member 100 is lowered or raised, or lowered or raised after moving left and right.

In addition, although not shown, the laser pressure head module 300 of the laser reflow soldering apparatus of the present invention further includes a control unit (not shown), using a slave pressure sensor (not shown) or a height sensor (not shown) The input data controls the operation of the translucent pressing member transfer unit.

The above-mentioned pressure sensor and height sensor may be provided in the translucent pressurizing member 100 and the stage 111 for supporting the translucent pressurizing member transfer portion and the welding object. For example, the control unit may receive data from the pressure sensor to control the translucent pressurizing member so that the pressure reaches a target value, and may receive data from the height sensor to control the translucent pressurizing member transfer unit to reach the target height value.

And the support part (not shown) supports the translucent pressure member transfer part (not shown) so that a movement is possible. As an example, the support portion may be a pair of vertical frames extending parallel to the table 111, and should be interpreted as including a structure that supports the translucent pressurizing member transfer portion so as to be movable along the x-axis, the y-axis, or the z-axis .

The laser pressure head module 300 of the laser reflow soldering apparatus of the present invention may include: one or more actuators for applying pressure to the light-transmitting pressure member 100; one or more pressure sensors for detecting pressure of the translucent pressurizing member 100; and one or more height sensors for detecting the height of the light-transmitting pressurizing member. For example, the pressure sensor can be more than one load sensor and the height sensor can be a linear encoder.

The pressure applied to the welding object is adjusted by the above-mentioned pressure sensor, and in the case of a large area, it can be controlled by multiple actuators and multiple pressure sensors to deliver the same pressure to the welding object, and, through one or more A height sensor provides technical data to confirm the height position value of the welding object when it is welded or to find a more accurate welding height position. When performing a process that requires maintaining a specified height interval, it performs a function that can control the precise height.

In addition, the translucent pressing member 100 may be made of a base material for outputting laser light from the transmissive laser modules 310 and 320 . The base material of the translucent pressing member 100 may be any light beam transmissive material.

For example, the base material of the translucent pressing member 100 may be one of quartz (Quartz), sapphire (sapphire), fused silica glass (Fused Silica Glass), or diamond. However, the physical properties of the light-transmitting pressing member made of quartz material are different from those of the light-transmitting pressing member made of sapphire. For example, when a 980 nm laser (Laser) is irradiated, the transmittance of the translucent pressing member made of a quartz material is 85% to 99%, and the temperature of the welding object is measured as 100°C. On the contrary, the transmittance of the translucent pressing member made of sapphire was 80% to 90%, and the temperature of the welding object was measured to be 60°C.

That is, quartz outperforms sapphire in terms of light transmittance and heat loss required for soldering. However, in the process of developing the laser reflow soldering device, the inventors of the present application found that the light-transmitting pressurizing member 100 made of quartz material existed during laser welding through repeated tests of the light-transmitting pressurizing member 100 . The problem of unqualified welding quality due to the occurrence of cracks or burning on the bottom surface. This is because, during laser welding, as the gas (fumes) adheres to the bottom surface of the translucent pressurizing member 100 , the heat source of the laser light concentrates on the gas-adhering portion, which increases thermal fatigue.

In order to prevent damage to the light-transmitting pressing member 100 made of quartz material and improve durability, a thin film coating may be formed on the bottom surface of the light-transmitting pressing member made of quartz material. The thin film coating formed on the bottom surface of the light-transmitting pressing member 100 may be a generally used optical coating, for example, a dielectric coating, a silicon carbide coating, or a metallic material coating.

As shown in FIG. 1 , the laser pressure head module 300 of the laser reflow soldering apparatus of the present invention may further include: a protective film 200 formed on the lower part of the above-mentioned translucent pressure member 100 for preventing the laser welding The gas adheres to the bottom surface of the translucent pressurizing member 100 , and the protective film transfer part 210 for transferring the above protective film 200 .

The protective film transfer part 210 described above can unwind the protective film 200 wound in a roll shape by a reel-to-reel method, and can transfer the protective film 200 to one side. As an example, the maximum continuous use temperature of the protective film 200 is 300° C. or more, and the minimum continuous use temperature is 260° C. or more, and it is preferable to use a material excellent in heat resistance. For example, the protective film 200 may be made of polytetrafluoroethylene resin (commonly referred to as "Teflon resin"; PTFE, Polytetrafluoroethylene) or soluble polytetrafluoroethylene resin. Soluble polytetrafluoroethylene resin (PFA, Per Fluoro Alkylvinyether copolymer), as a product to improve the heat resistance of fluorinated ethylene propylene resin, has a maximum continuous use temperature of 260°C, which is the same high-performance resin as polytetrafluoroethylene resin.

3 is a conceptual diagram of a single laser beam module of a laser reflow soldering apparatus according to an embodiment of the present invention, and FIG. 4 is a conceptual diagram of a dual laser beam module of a laser reflow soldering apparatus according to still another embodiment of the present invention.

3 , in an embodiment of the present invention, a single laser module 310 is provided, thereby irradiating a single laser beam to a printed circuit board (PCB, Printed Circuit Board). According to an embodiment, the above-mentioned printed circuit board may be a flexible printed circuit board (Flexible PCB).

3 , in this case, the laser beam irradiated by the first laser module 310 is irradiated on the substrate in a deformed state of a square beam shape, and the intensity of the laser beam is homogenized.

On the other hand, referring to FIG. 4 , in yet another embodiment of the present invention, the multi-laser module includes a first laser module 310 and a second laser module 320 . In the position where the electronic components of the welding object 11 are attached, the first laser module The homogenized overlapping laser beam is irradiated with the second laser module in an overlapping state.

In FIG. 4 , the first laser beam has a square shape and the second laser beam has a circular shape, but both laser beams may also be square shaped. In addition, the first laser beam and the second laser beam may be irradiated at the same time, and after the welding object 11 is preheated by the first laser beam, the second laser beam may be sequentially irradiated.

FIG. 5 is a structural diagram of a dual laser beam module of a laser reflow soldering apparatus according to still another embodiment of the present invention.

In FIG. 5, each laser module 310, 320, 330 includes: laser oscillators 311, 321, 331, respectively provided with cooling devices 316, 326, 336; beam shapers 312, 322, 332; optical lens modules 313, 323, 333; drive devices 314, 324, 334; control devices 315, 325, 335; and power supply units 317, 327, 337.

Hereinafter, in order to avoid repeating the description of each laser module having the same structure, the description will focus on the first laser module 310 unless necessary.

The laser oscillator 311 generates a laser beam having a predetermined range of wavelength and output power. As an example, the laser oscillator may be a laser diode (LD, Laser Diode) or a rare earth doped fiber laser ( Rare-Earth-Doped Fiber Laser) or Rare-Earth-Doped Crystal Laser (Rare-Earth-Doped Crystal Laser), in contrast, may also include a medium for emitting alexandrite laser with a wavelength of 755 nm or a medium for emitting alexandrite laser with a wavelength of 1064 nm Or 1320nm wavelength aluminum-doped yttrium aluminum garnet (Nd:YAG) laser medium.

A beam shaper 312 converts the laser light in a spot form, which is generated from a laser oscillator and transmitted through an optical fiber, into an area light source (Area Beam) form with a plane. The beam shaper 312 may include a Square Light Pipe (Square Light Pipe), a Diffractive Optical Element (DOE), or a Micro-Lens Array (MLA).

The optical lens module 313 adjusts the shape and size of the laser beam converted into the surface light source form by the beam shaper to irradiate the electronic components mounted on the printed circuit board and the irradiation area. The optical lens module forms an optical system by combining a plurality of lenses, and the specific structure of such an optical system will be described in detail below with reference to FIGS. 6 to 9 .

The driving device 314 is used to move the distance and position of the laser module to the irradiation surface. The control device 315 controls the driving device 314 to adjust the beam shape, beam area size, beam clarity and beam irradiation angle when the laser beam reaches the irradiation surface. In addition to the driving device 314 , the control device 315 can also comprehensively control various operations of the laser module 310 .

On the other hand, the laser output adjustment section 370 controls the amount of power supplied to the respective laser modules by the power supply sections 317 , 327 , 337 corresponding to the respective laser modules 310 , 320 , 330 based on a program received through the user interface or a preset program. The laser output adjustment unit 370 controls the respective power supply units 317 , 327 , and 337 based on the respective components, respective regions, or overall reflow state information on the irradiation surface received from the one or more camera modules 350 . In contrast to this, the control information of the laser output adjustment unit 370 is transmitted to the control devices 315, 325, 335 of the respective laser modules 310, 320, 330, and the respective control devices 315, 325, 335 can also provide for controlling the corresponding power supply Feedback signal from the supply unit 317 . In addition, unlike FIG. 6 , power is also distributed to each laser module by one power supply unit, and in this case, the laser output adjustment unit 370 should control the power supply unit.

In the case of realizing the laser overlapping mode, the laser output adjustment unit 370 controls each of the laser modules 310, 320, 330 and the power supply units 317, 327, 337 so that the laser beam of each of the laser modules 310, 320, 330 has a desired beam shape , beam area size, beam clarity and beam irradiation angle. In addition to the case where the first laser module 310 is used to preheat the area around the location of the welding destruction object and the second laser module 320 is used to additionally heat the narrower reflow target area, the laser overlap mode is also suitable for the case where the The preheating function and the additional heating function are appropriately distributed among the laser module 310 , the second laser module 320 , and the third laser module 330 to control each laser module to have a desired temperature profile.

On the other hand, in the case of allocating one laser light source to be input to each laser module, the laser output adjusting section 370 may have a function for simultaneously adjusting the power and phase of each of the allocated laser beams. In this case, beam flatness can be significantly improved by controlling the phase to induce destructive interference between the individual laser beams, thereby further improving energy efficiency.

On the other hand, in the case where the machining mode is simultaneously implemented at a plurality of positions, the laser output adjustment unit 370 controls one of the beam shape, beam area size, beam sharpness, beam irradiation angle, and beam wavelength of each laser beam so that the Some or all of the laser beams of the individual laser modules become different. At this time, when one laser light source is allocated and input to each laser module, the laser output adjustment unit 370 may have a function of simultaneously adjusting the power and phase of each of the allocated laser beams.

With this function, the laser beam size and output can be adjusted to perform bonding or debonding between a plurality of electronic components within the irradiated surface and the substrate. In particular, in the case of removing damaged electronic components on the substrate, the area of the laser beam is minimized to the corresponding electronic component area, which can minimize other adjacent electronic components and normal electronic components existing on the substrate due to the laser beam. The heat generated by the beam can thereby be removed, and only the damaged electronic components to be removed can be removed.

On the other hand, in the case where a plurality of laser modules respectively emit laser beams with different wavelengths, the laser module may be a single laser module with a plurality of material layers (eg, EMC layer, silicon layer, solder layer) included in electronic components ) can effectively absorb wavelengths. As a result, the laser welding destruction device of the present invention can selectively increase the temperature of the electronic component and the temperature of the printed circuit portion or the temperature of the intermediate bonding material such as solder (Solder), which is a connecting material between the electrodes of the electronic component, to realize an optimal bonding process ( Attaching or Bonding) and separation process (Detaching or Debonding). Specifically, the laser beam is made to transmit both the EMC mold layer and the silicon layer of the electronic component, thereby absorbing the full energy of each laser beam, or, in the case of not transmitting the EMC mold layer, heat can also be made by heating the surface of the electronic component. Pass to the soldered part of the lower part of the electronic components.

On the other hand, applying the above functions, after preheating by one or more first laser beams to bring a predetermined area of the substrate including the reflow target electronic component area and its surroundings to a predetermined temperature, one or more second laser beams The area of the electronic component to be reflowed is selectively heated to a reflow temperature at which the solder melts. For example, if this selective heating effect is utilized, the present invention can also be used as a rework device that effectively removes electronic components from a substrate.

6 to 9 are structural diagrams of a laser optical system applicable to a dual laser beam module of a laser reflow soldering apparatus according to still another embodiment of the present invention.

6 is an optical system with the simplest structure applicable to the present invention, if the laser beam released from the beam transmission fiber 410 is focused by the convex lens 420 and incident on the beam shaper 430, the beam shaper 430 converts the laser beam in the form of a point The flat-top surface light source A1 irradiates the imaging surface S with the square laser beam A1 output from the beam shaper 430 and is enlarged to a desired size by the concave lens 440 .

FIG. 7 is a structural diagram of a laser optical system according to still another embodiment of the present invention.

As the surface light source B1 of the beam shaper 430 is enlarged to a predetermined size by the concave lens 440 , it becomes the surface light source B2 that irradiates the first imaging surface S1 . When the surface light source B2 is further enlarged and used, the boundary of the edge portion of the surface light source B2 may become indistinct due to further enlargement. Therefore, in order to make the final irradiation surface on the second imaging surface S2 It is also possible to obtain illumination light with a clear edge, and a mask 450 is set on the first imaging surface S1 to trim the edge.

As the surface light source passing through the mask 450 is reduced (or enlarged) and adjusted to a desired size by passing through the zoom lens module 460 composed of more than one convex lens and a concave lens, the second imaging device configured with electronic components The surface S2 forms a square irradiation light B3.

FIG. 8 is a structural diagram of a laser optical system according to still another embodiment of the present invention.

After the square surface light source C1 of the beam shaper 430 is enlarged to a predetermined size by the concave lens 440, it passes through at least a pair of cylindrical lenses 470, for example, C2 is enlarged (or reduced) along the x-axis direction, and then passes through at least a pair of circular The cylindrical lens 480 is, for example, reduced (or enlarged) in the y-axis direction and converted into a rectangular surface light source C3.

Among them, the cylindrical lens is a form in which the cylindrical shape is cut along the longitudinal direction, and the laser beam is enlarged or reduced according to the form that each lens is arranged in the vertical direction. On the surface on which the cylindrical lens is arranged, the lens is arranged along the The laser beam is adjusted along the x-axis direction or the y-axis direction in such a manner that the x-axis direction and the y-axis direction are arranged.

Next, the surface light source C3 is enlarged (or reduced) and adjusted to a desired size by passing through the zoom lens module 460 composed of one or more convex lenses and concave lenses, and forms a rectangular irradiation on the second imaging surface S2 where the electronic components are arranged. Light C4.

FIG. 9 is a structural diagram of a laser optical system according to another embodiment of the present invention.

Compared with the optical system of FIG. 8 , the optical system of FIG. 9 includes a structure in which a mask is applied to trim the edge of the laser beam. Therefore, it should be understood that, compared with the case of FIG. 8 , the obtained final surface light source D5 has a clearer image. the edge of.

10 is a perspective view of a main part schematically showing the structure of a bracket unit of the laser pressurization head module of the present invention.

Referring to FIG. 10 , the stand unit 500 of the present invention includes: a lower plate 510 into which the lower part of the flat plate-shaped translucent pressing member 100 is inserted; upper.

In addition, square through-holes 510a and 520a are formed in the central portions of the lower plate 510 and the mask plate 520, respectively. Therefore, the translucent pressing member 100 is in the state of being inserted and placed on the lower plate 510. In this case, it should be It is understood that the bottom surface 102 of the pressing member 100 is exposed downward due to the through hole 510 a of the lower plate 510 .

On the other hand, in the above state, as the mask plate 520 is inserted and bonded to the upper surface of the translucent pressing member 100 , the central portion of the upper surface of the translucent pressing member 100 passes through the through hole of the above-mentioned mask plate 520 . 520a completes the installation in a state exposed upward.

FIG. 11 is a cross-sectional view of the main part schematically showing the structure and working state of the bracket unit of the laser pressing head module of the present invention.

Referring to FIG. 11 , if the translucent pressing member is installed between the lower plate and the mask plate to irradiate laser light through the multi-beam laser modules 310 and 320 located above, the laser beam can pass through the through holes of the mask plate 520 520a and the translucent pressing member 100 transmit downward.

In this case, the left and right side corners of the bottom surface of the lower plate 510 have shapes that gradually form circular arcs. When the pressing member moves downward and is pressed, the arc corners of the lower plate 510 are used to prevent the protective film 200 from being torn or scratched.

Furthermore, as described above, the protective film 200 is pulled and wound by the protective film transfer parts 210 disposed on the left and right sides of the protective film 200 . In this case, the left and right corners of the bottom surface of the lower plate 510 gradually form circular arcs. , and thus, the protective film 200 can be conveyed while being prevented from being damaged by the corners.

As described above, the translucent pressing member 100 irradiates the laser beam through the multi-laser modules 310 and 320 located above in a state where the plurality of electronic components arranged on the substrate to be welded 11 are simultaneously pressed at a predetermined depth, and Here, the solder located at the lower part of the electronic components of the soldering object 11 is melted by the above-mentioned laser beam and the laser reflow process is performed.

As a result, the laser beams overlap each other to form a homogenized laser beam, and the heat energy can be uniformly transmitted through the through holes 520 a of the mask plate 520 and the through holes 520 a of the translucent pressing member 100 and the lower plate 510 . to the solder located at the lower part of the electronic component of the soldering object 11 .

In this case, when the superimposed laser beam is irradiated on the surrounding substrate parts other than the electronic components, the surrounding parts of the substrate may be damaged by the thermal energy of the laser beams. Therefore, only the electronic components of the welding object 11 need to be irradiated. For this reason, in order to achieve precise pressing and laser reflow processing only for the electrode fittings of the above-mentioned welding object 11 , preferably, the area of the square through hole 520 a of the mask plate 520 and the pressing surface 102 of the translucent pressing member 100 are The area should be designed considering the transmission path of the laser beam and the overlapping area.

12 is a perspective view of the main part schematically showing the structure and working state of the probe unit of the laser pressure head module of the present invention.

The main feature of the present invention is that the mask plate 520 and the translucent pressing member 100 can be replaced according to various sizes of substrates. Therefore, the above-mentioned translucent pressing member 100 and the mask plate 520 can be replaced according to the shape and area of substrates of different sizes to be processed or electronic components arranged on the substrates. In this case, according to the needs of the operator, an appropriate size can be selected and replaced from the translucent pressing member 100 and the mask plate 520 prepared in advance to obtain pressing surfaces of different sizes, and then, as shown in FIG. 12 , by The probe unit 600 pierces each corner portion of the upper surface of the translucent pressing member 100 to measure the flatness.

The above-mentioned probe unit 600 may include: a probe 610 in the shape of a spray needle; a probe transfer part 620 for horizontally or vertically transferring the above-mentioned probe; and a probe holder 630 for supporting the above-mentioned probe and the transfer part .

Therefore, when the operator replaces the translucent pressing member 100 and the mask plate 520 of different sizes in order to process substrates of different sizes, as the probes 610 are moved in the horizontal direction or the vertical direction, the probes 610 can be punctured in sequence The flatness of the above-mentioned translucent pressing member 100 was measured through four or more corner positions (indicated as X) of the upper surface of the translucent pressing member 100 .

13 is a side view schematically showing the structure and working state of the vertical transfer portion of the laser pressure head module according to an embodiment of the present invention.

Hereinafter, referring to FIG. 13 , the structure and operation state of the vertical transfer portion of the laser pressurization head module will be described.

According to an embodiment, the above-mentioned vertical transfer part may include: a punching bracket 720 arranged on the four corners of the translucent pressing member 100 and the bracket unit 500; a pressing cylinder 730 arranged on the upper part of the above-mentioned punching bracket The vertical driving part is used to apply the driving force in the vertical direction to the punching bracket 720; the ball screw 750 and the motor 760;

Therefore, before the soldering object 11 composed of the substrate and the plurality of electronic components is placed under the translucent pressurizing member 100, the translucent pressurizing member 100 and the holder unit 500 are driven upward by the motor 760 of the vertical transfer portion. In the transfer, after the welding object 11 is put in, the translucent pressurizing member 100 and the holder unit 500 are transferred downward again by the driving of the motor 760 to wait for pressurization. Then, the translucent pressing member 100 presses the welding object 11 vacuum-adsorbed on the electrostatic chuck 940 by the operation of the above-described pressing cylinder 730 .

On the other hand, the lower part of the electrostatic chuck 940 is provided with a heating block 942 for preheating the workpiece welding object 11 to a predetermined temperature. Therefore, in a state where the welding object 11 is placed on the electrostatic chuck 940 , a heating block 942 is used for the laser reflow process. In the process of being transported, the above-mentioned welding object 11 will be continuously preheated. For example, the temperature for preheating the above-mentioned welding object 11 may be set to be less than 200° C., and preferably, the temperature should be set to such an extent that thermal damage to the substrate or the like cannot be caused by the preheating.

On the other hand, as shown in FIG. 12 , based on the measurement result of the flatness of the probe unit 600 with respect to the translucent pressing member 100 , when it is judged that the above-mentioned translucent pressing member 100 is inclined to either side, that is, when the translucent pressing member 100 is not In the case of being flat, the holder unit 500 is moved upward or downward in accordance with the fine driving of the vertical transfer unit, and the flatness of the translucent pressing member 100 is adjusted.

In more detail, based on the measurement result of the flatness of the translucent pressing member 100 by the probe unit 600 , when it is determined that any one of the four corners of the upper surface of the translucent pressing member 100 is due to a When the corners are more inclined to one side than the other corners and are located at a low position, the light transmission is adjusted by slightly lifting the corners of the bracket unit 500 upward as the motor 760 of the corner portion located at the low position operates. The overall flatness of the sexual pressing member 100.

In this case, regardless of the state of the power supply, the above-mentioned motor 760 can be provided with an absolute encoder to maintain the absolute position value of each corner portion of the bracket unit 500 at all times. Preferably, the above-mentioned translucent pressurization The flatness adjustment process of the part 100 should be automated through the setting of the control unit.

14 is a perspective view of the main part schematically showing the structure and working state of the vertical transfer part of the laser pressure head module according to still another embodiment of the present invention, and FIG. 15 is a side sectional view of the main part of FIG. 14 .

Hereinafter, with reference to the accompanying drawings, the partial structure of the laser pressurization head module according to an embodiment of the present invention, and the working relationship between pressurization and laser beam irradiation will be described in detail.

Referring to the above drawings, the pressing head of the present invention includes a translucent pressing member 100 for pressing the electronic component as the welding object 11 so that the laser beams irradiated from the laser sources 310, 320 are transmitted, in this case, The translucent pressing member 100 is replaceably inserted and hung in a through hole of the holder unit 500 , the holder unit 500 has a plate shape, and the through hole is formed in the center of the holder unit 500 .

The above-mentioned stand unit 500 may be circular or polygonal (see FIGS. 16 a and 16 b ), but in FIGS. 14 and 15 , an octagonal shape will be described.

According to an embodiment, the punching unit 700 is axially coupled to the three positions P1, P2, and P3 around the edge of the above-mentioned octagonal bracket unit 500. form a triangle.

In this case, the virtual triangle connecting the three positions of the bracket unit 500 may be an equilateral triangle. Preferably, the center of gravity G of the virtual triangle is the same as the center of gravity G of the translucent pressing member 100 .

The reason for designing the three shaft coupling positions P1, P2, P3 around the edge of the above-mentioned bracket unit 500 is that when the above-mentioned shaft coupling positions P1, P2, P3 are connected, it is difficult to form a stable triangular structure by coupling the two punching units by shafts (ie, a line segment formed by connecting two points cannot form an area), therefore, in order to minimize the number of shaft joint positions required to control the flatness and to construct a virtual triangular stable shaft joint position, it is necessary to construct precise symmetry in the bracket unit 500 The three axes combine positions P1, P2, and P3.

On the other hand, referring to FIG. 15 , the punching unit 700 includes: a punching bracket 720 having a predetermined height and shape; a pressurizing cylinder 730 mounted on the upper end of the punching bracket and pressing the bracket unit 500 downward with a preset pressure And the bearing joint 780, one end is combined with the cylinder rod 731 of the above-mentioned pressurizing cylinder 730, and the other end is combined with one of the three shaft combining positions P1, P2, P3 of the bracket unit 500 in a rotatable manner. In this case, as the pressurizing cylinder, a precision air cylinder (Seiko cylinder) capable of finely setting and adjusting the pressure in units of kgf can be used.

In this case, pressure sensors 740 are further provided at the ends of the cylinder rods 731 of the pressurizing cylinders 730, respectively.

As an example, the pressure sensor 740 may be a load sensor, and as the cylinder rod of each pressurizing cylinder 730 is pulled out, when each shaft coupling position of the holder unit 500 is respectively pressed, it is continuously measured to detect whether or not an appropriate pressure is consumed or not The pressure is fed back to the control unit (not shown).

On the other hand, joint fastening parts 510 are respectively provided at the three shaft coupling positions of the bracket unit 500 , and each joint fastening part 510 is pivotally coupled to the bearing joint 780 in a rotatable manner.

Therefore, as the cylinder rod 731 of the pressurizing cylinder 730 is pushed in or pulled out, the bearing joint 780 pivotally coupled to the end of the cylinder rod 731 moves in the vertical direction together, thereby rotatably connected to the The joint fastening portion 510 and the bracket unit 500 to which the bearing joints 780 are coupled are also moved together.

Therefore, the support unit 500 can be tilted and driven by adjusting the push-in length and the pull-out length of the cylinder rod 731 of each of the above-mentioned pressurizing cylinders 730 .

In addition, the end of the joint fastening portion 510 is locked by the stopper portion 790 provided at the lower end of the punch bracket 720, so the weight of the bracket unit 500 acting on the lower side is offset by the stopper portion 790. At the same time, when When the rack unit 500 is transported vertically, it plays a role of maintaining the flatness.

In addition, a vertical transfer portion is provided on one side of the punching bracket 720 for raising and lowering the punching bracket in the vertical direction.

Hereinafter, the structure of the vertical transfer portion will be described according to an embodiment. The vertical transfer portion may include: a punching bracket 720, which is respectively disposed at the three shaft joint positions of the translucent pressing member 100 and the bracket unit 500; a pressing cylinder 730, provided on the upper part of the above-mentioned punching bracket; a ball screw 750 and a motor 760 for applying a driving force in the vertical direction to the above-mentioned punching bracket 720; and a guide member 770 for guiding the above-mentioned punching bracket 720. Linear motion.

According to the above structure, it should be understood that, as the bracket unit 500 moves downward, the light-transmitting pressing member 100 installed on the bracket unit 500 also moves downward, and presses the lower part. Electronic component 11b.

In addition, since the flatness of the above-mentioned holder unit 500 may have errors due to vibrations generated during the reflow process or vibrations generated when the translucent pressurizing member 100 is replaced, it is preferable that after a predetermined period elapse or the translucent pressing member 100 is replaced After the compression member 100 is pressed, the flatness is initialized to zero to reset the flatness.

16a is a top view of the main part of the bracket unit of the laser compression head module formed in an octagon according to an embodiment of the present invention.

First, the shape of the support unit of the present invention may be a polygon, which is basically a triangle connecting the three shaft joint positions P1, P2, and P3. In more detail, in order to achieve geometric symmetry, the lengths of the imaginary lines connecting the above-mentioned three shaft joint positions P1 , P2 , P3 and the center of gravity G can be made the same to form an equilateral triangle.

In addition, in an embodiment shown in FIG. 16a, since the square light-transmitting pressing member should be placed and accommodated inside the above-mentioned polygonal bracket unit, the shape of the bracket unit can be octagonal to provide specific light-transmittance The larger area of the pressing member is sufficient to accommodate the square translucent pressing member.

Therefore, the support unit of the present invention is not limited to the octagon shown in FIG. 16a, but can be polygons of various shapes. Square or Octagon etc.

On the other hand, FIG. 16b is a plan view of the main part of the bracket unit of the laser compression head module according to still another embodiment of the present invention, which is formed in a circular shape.

In addition, the shape of the stand unit of the present invention may be a polygon, and according to still another embodiment, it may be a circle.

Therefore, as shown in Fig. 16b, when the stent unit is circular, since the dotted lines connecting the three axis joint positions P1, P2, and P3 around the edge of the stent unit to the center of gravity G are the same, the stent unit achieves geometrically the same length. Therefore, only at least three shaft joint positions P1, P2, P3 are used to maintain high flatness, and each shaft joint position can be precisely pressurized and controlled separately.

Thus, the pressing head of the present invention performs a one-time reflow process by simultaneously pressing the plurality of electronic components 11b with the translucent pressing member 100 having a predetermined area and irradiating the translucent laser beam. Compared with the conventional method in which a small translucent pressing member is placed on each electronic component and pressed by weight, it has the effect of greatly improving precision and productivity.

Furthermore, as the pressurizing cylinder 730, a Seiko cylinder that precisely adjusts the pressure in units of Kgf can be used to precisely adjust the pressure, so that the operator can adjust the pressure in different ways according to various variable factors such as the bending state of the flexible printed circuit board. Because of the set pressure of the pressurizing cylinder 730, the present invention can easily adjust the pressure balance applied to the plurality of electronic components 11b disposed below the large-area light-transmitting pressurizing member 100 compared to the prior art.

On the other hand, when a pressure higher than the set pressure different from the preset pressure is applied to each of the above-mentioned pressurizing cylinders 730, the pressure sensor 740 combined with the end of the cylinder rod 731 of the above-mentioned pressurizing cylinder 730 will detect it and feed back in the control unit (not shown).

Therefore, if the pressure above a predetermined level is detected, the control unit executes an automatic balancing process to adjust it to the set pressure value, or an alarm can be sent to allow the operator to easily manually adjust the setting of each of the above-mentioned pressurizing cylinders 730 as required. fixed pressure.

14 to 16a and 16b, the holder unit 500, the translucent pressurizing member 100, and the punching unit 700 may be installed in the translucent pressurizing member shown in FIG. 2 for transfer. part 140 and support part 150 . As an example, the above-mentioned translucent pressing member transfer part 140 may be vertically transferred in the vertical direction by a vertical transfer unit (eg, a motor and a ball screw device), and the support part 150 may be a vertical frame device as an example.

Therefore, when the electronic components and substrates as the welding object 11 are loaded, the above-mentioned bracket unit 500 , the translucent pressing member 100 , and the pressing unit 700 are vertically moved upward, so that the welding object 11 is loaded into the translucent pressing member 100 . After the welding object 11 is put into the position directly under the pressing member 100, the holder unit 500, the translucent pressing member 100, and the punching unit 700 are vertically moved downward again to a position close to the welding object 11, thereby in a pressurized standby state.

17a and 17b are perspective views of main parts showing the translucent pressurizing member of the laser pressurization head module of the present invention, and FIG. 17a is the translucent pressurizing member having a single pressurizing surface according to an embodiment of the present invention Fig. 17b is a shape example diagram of a translucent pressing member having a pressing surface divided in a manner corresponding to each electronic element according to still another embodiment of the present invention.

17a and 17b, in the structure of the translucent pressurizing member 100 according to an embodiment of the present invention, as shown in FIG. 17a, the translucent pressurizing member 100 of the present invention has the following structure: A pressing surface 102 having a predetermined area is formed to protrude from the square plate-shaped base material 101 . Preferably, the area of the pressing surface 102 is designed with the area of the welding object 11 processed by the one-time laser reflow soldering so as to correspond to the processing area of the welding object 11 .

In this case, the area of the pressing surface 102 is narrower than the area of the base material 101 , and one or more stepped portions 101 a are formed around the pressing surface 102 . In addition to the pressing surface 102 described above, a laser blocking layer 103 (shaded) for preventing leakage of the laser beam is formed on the side surface of the base material 101 and the bottom and side surfaces of the stepped portion 101a.

On the other hand, referring to FIG. 17b, in the structure of the translucent pressing member 100 of the laser pressing head module according to still another embodiment of the present invention, although a single pressing surface 102 is formed in FIG. 17a, in FIG. In 17b, in order to respectively contact and pressurize the plurality of electronic components included in the soldering object 11, the pressing surface 102 has a structure divided into a lattice shape so as to correspond to the area of each electronic component. For this reason, in the structure shown in FIG. 17b, the pressing surface 102 needs to be designed and processed so as to accurately correspond to the occupied area of each electronic component to be processed by laser reflow.

In this case, as shown in FIG. 17b , in addition to the plurality of pressing surfaces 102 divided into a lattice shape, a laser blocking layer 103 (shown by hatching) is formed on the side surface of the base material 101, the bottom surface and the side surface of the stepped portion 101a. .

Generally, the above-mentioned laser blocking layer 103 can be a special coating in various forms for absorbing or reflecting light, for example, it can be an Inconel coating, a scattering treatment layer in the form of frosted glass, or a reflection layer. A composite layer composed of one or more of the high reflection (HR, High Reflection) coatings of the laser beam. By applying the above-mentioned laser blocking layer 103, the laser beam passes through the pressing surface 102 of the translucent pressing member 100 to accurately irradiate only the electronic components of the welding object 11, thereby preventing the laser beam from being irradiated to the surrounding of the above-mentioned electronic components. The adjacent printed circuit board parts can cause heat damage to the substrate and the resulting damage.

FIG. 18 is an operating state diagram showing a state in which the translucent pressurizing member of the present invention is attached to the pressurizing head, and FIG. 19 is an enlarged view of a main part of FIG. 18 .

18 and 19 , in the structure of the translucent pressing member 100 of the present invention as described above, the pressing surface 102 is formed to protrude from the bottom surface of the square base 101 and has a smaller area than the base material. area. In this case, one or more stepped portions 131a are formed between the substrate 101 and the pressing surface 102. As shown in FIG. 15, the stepped portions 101a allow the translucent pressing member 100 to be hung on the surface of the reflow device. Stand unit 500.

On the other hand, a silicon damping layer 104 may be further formed on the pressing surface 102 . Generally, according to the characteristics of the above-mentioned flexible printed circuit board, the plurality of electronic components arranged on the printed circuit board constituting the soldering object 11 are not completely flat and have bends themselves. Therefore, it should be understood that the respective electronic components are arranged on the horizontal line at different heights along the curved surface of the above-mentioned flexible printed circuit board, but not at the same height.

In this case, if the pressing surface 102 of the translucent pressing member 100 simultaneously presses a plurality of electronic components located at different heights on the curved surface of the flexible printed circuit board in order to perform the soldering process, many electronic components located at the relative heights Each electronic component will be subjected to greater pressure than the plurality of electronic components located at the low position, and thus, the solder in the lower portion of the plurality of electronic components located at the above-mentioned height position cannot be properly reflowed due to excessive pressure, which may cause soldering bad.

Therefore, according to an embodiment of the present invention, a silicon damping layer 104 as a light-transmitting elastomer is additionally formed on the pressing surface 102, so that when the plurality of electronic components on the upper part are subjected to excessive pressure, the silicon The damping layer 104 performs a damping function to absorb a prescribed amount of excess pressure.

On the other hand, when the translucent pressurizing member 100 presses the electronic component, a laser beam is irradiated from the first laser module 310 or the second laser module 320 located above the translucent pressurizing member 100, and the laser beam passes through The light-transmitting pressurizing member 100 is irradiated to the electronic components, thereby transferring thermal energy for reflow.

19 , when the laser beam is irradiated through the translucent pressing member 100 , the laser blocking layer 103 (shown by hatching) is formed on the side surface of the base material 101 and the bottom and side surfaces of the stepped portion 101 a , and as a result, the laser light is blocked. The beam leaks to all but the pressing surface 102 .

Furthermore, in the present invention, in order to realize a uniform laser reflow process, when designing the translucent pressing member 100 , the shape and protruding height of the pressing surface 102 are mainly considered. For example, as shown in FIG. 17a , if the pressing surface 102 has a rectangular structure instead of a square structure, since the side area of the long side of the rectangle is larger than that of the short side, it can be predicted that the thermal energy of the laser beam will be faster toward the long side. loss.

If such a heat loss phenomenon occurs, heat energy cannot be uniformly transferred to the plurality of electronic components that are pressurized in a state of being arranged in the lower part of the pressurizing surface 102, resulting in a place where the soldering temperature is relatively lower or relatively higher than the proper soldering temperature. The possibility of poor soldering of electronic components further increases. Therefore, according to the preferred embodiment, the bottom surface shape of the pressing surface 102 can be designed to be a square structure, so that the heat loss through the side surface of the pressing surface 102 can be uniformly realized along the vertical and horizontal directions.

Furthermore, even if the protruding height h of the side surface of the pressing surface 102 is set too high, a large amount of heat loss may occur through the side surface of the step portion 101a. Therefore, it is most preferable to divide the protruding height h of the pressing surface 102 or the The depth of the recessed grooves 102a between the above-mentioned pressing surfaces 102 is minimized to within a few millimeters (mm).

On the other hand, Fig. 20a to Fig. 20c are schematic diagrams showing various embodiments of the translucent pressing member of the present invention, Fig. 20a shows a case where the edge of the pressing surface is not processed, and Fig. 20b shows a chamfering In the case of processing the corners of the pressing surface, Fig. 20c shows the situation of processing the corners of the pressing surface with arcs.

20a, 20b, and 20c, as shown in FIG. 2 above, a protective film 200 is provided below the translucent pressurizing member 100 of the present invention to prevent gas adsorption. In this case, as shown in FIG. 20a, as the translucent pressing member 100 moves downward, if the welding object 11 is pressurized, the protective film 200 is also pressed by the translucent pressing member 100. and pressing, at this time, it can be understood that the protective film 200 is combined with the corners on both sides of the pressing surface 132 .

However, as described above, when the protective film 200 is repeatedly contacted with the corners formed on both sides of the pressing surface 102 , the problem that the protective film 200 is eventually torn or damaged will occur.

Therefore, in order to avoid the above-mentioned problems, and to prevent the protective film from being damaged by the side corners of the pressing surface 102, when designing the light-transmitting pressing member 100, additional matters should be considered, that is, as shown in FIG. 20b As shown, chamfering is performed on both side corners of the pressing surface 102, or, as shown in FIG. 20c, arc processing is performed on both side corners.

21 is a side sectional view of the main part schematically showing the overall device structure of the laser pressure head module according to the embodiment of FIG. 13 , FIG. 22 is a plan view of the main part of FIG. 21 , and FIG. 23 is an enlarged view of an embodiment of FIG. 13 A perspective view of the main parts of the punching unit of the laser pressing head module of the example.

Hereinafter, with reference to the accompanying drawings, the partial structure of the laser pressurizing head module and the working relationship between pressurization and laser beam irradiation will be described in detail according to an embodiment of the present invention.

First, referring to FIGS. 21 and 22 , the translucent pressurizing member 100 of the pressurizing head napril sheet of the present invention is used to transmit the laser light sources 310 and 320 in a state of pressing the electronic component 11b to be welded. At this time, the irradiated laser beam is attached to the through hole formed in the center portion of the plate-shaped holder unit 500 in a hanging state. As a result, as the holder unit 500 moves downward, the translucent pressing member 100 attached to the holder unit is also moved downward to press the electronic component 11b located below it.

In addition, each punching unit 700 is adjacent to each corner portion of the above-mentioned bracket unit 500 in a non-contact state. First, the lower part of the stand unit 500 is supported by a pressure balancer 710, and the pressure balancer 710 acts as a buffer member to offset the weight of the translucent pressurizing member 100 and the stand unit 500 by pressing in the opposite direction. As an example, This can be done with air cylinders or springs.

Therefore, after the basic weight applied to the translucent pressurizing member 100 and the holder unit 500 is canceled by the pressure balancer 710 to a value of zero (0), the translucent pressurizing member 100 is in a pressurized standby state.

On the other hand, referring to FIG. 23 , the structure of other components of the punching unit 700 will be described in detail. The punching unit 700 includes: a punching bracket 720 , which is in the shape of a “匚” and surrounds each corner portion of the bracket unit 500 in a non-contact state. ; Pressurizing cylinders 730a, 730b, 730c, 730d, respectively, are fixedly arranged on the upper end of the above-mentioned punching bracket;

In this case, as an example, the pressure sensor 740 may be a load sensor. As the cylinder rods of the pressurizing cylinders 730a, 730b, 730c, and 730d are pulled out, when the corners of the bracket unit 500 are respectively pressed, By continuously measuring it, it is detected whether the pressure above the appropriate pressure is consumed and fed back.

Therefore, as described above, the pressing head of the present invention performs a one-time reflow process by simultaneously pressing the plurality of electronic components 11b with the translucent pressing member 100 having a predetermined area and irradiating the above-mentioned translucent laser beam, Therefore, compared to the conventional method in which a small translucent pressing member is placed on each electronic component and pressed by weight, there is an effect of greatly improving productivity.

For this reason, the present invention can realize large-area pressure regulation by arranging pressurizing cylinders 730a, 730b, 730c, 730d capable of independently setting pressure at each corner of the above-mentioned bracket unit 500 respectively. Furthermore, as an example, the above-mentioned pressurizing cylinders 730a, 730b, 730c, and 730d may be precision air cylinders (hereinafter, "Seiko cylinders") capable of finely setting and adjusting the pressure in units of kgf. Various variable factors, such as the bending state of the circuit board, adjust the set pressure of the pressurizing cylinders 730a, 730b, 730c, and 730d in different ways. Therefore, compared with the prior art, the present invention can easily adjust the light-transmitting pressurization. Pressure equalization on the plane of the component 100 .

On the other hand, when a pressure equal to or higher than the set pressure different from the preset pressure is applied to each of the above-mentioned pressurizing cylinders 730a, 730b, 730c, 730d, the cylinder rod 731 end of the above-mentioned pressurizing cylinders 730a, 730b, 730c, 730d The pressure sensor 740 combined with the unit will detect it and feed it back to the control unit (not shown). Therefore, when a pressure higher than a predetermined level is detected, the control unit executes an automatic balancing process for adjusting it to a set pressure value, or an operator can easily manually adjust each of the pressurizing cylinders 730a and 730b as required by sending an alarm. , 730c, 730d set pressure.

In addition, although not shown in FIGS. 21 to 23 , the above-mentioned holder unit 500 , the translucent pressurizing member 100 , and the pressing unit 700 may be provided in the translucent pressurizing member transfer part 140 and the translucent pressurizing member shown in FIG. 2 . Support part 150 . As an example, the above-mentioned translucent pressing member transfer part 140 may be vertically transferred in the vertical direction by a vertical transfer unit (eg, a motor and a ball screw device), and the support part 150 may be a vertical frame device as an example.

Therefore, when the electronic components and substrates as the welding object 11 are loaded, the above-mentioned bracket unit 500 , the translucent pressing member 100 , and the pressing unit 700 are vertically moved upward, so that the welding object 11 is loaded into the translucent pressing member 100 . After the welding object 11 is put into the position directly under the pressing member 100, the holder unit 500, the translucent pressing member 100, and the punching unit 700 are vertically moved downward again to a position close to the welding object 11, thereby in a pressurized standby state.

On the other hand, referring to FIGS. 21 and 22 , in order to remove particle contamination such as dust adhering to the upper surface of the translucent pressing member, an ionizer 800 is further provided above the holder unit 500 . As an example, the above-mentioned translucent pressing member 100 is made of a quartz material. Even if the process execution space of the present invention is a clean clean room environment, if more and more particles accumulate, there will be problems due to repeated laser beam irradiation. It may cause accidents such as particle burning.

Therefore, as the above-mentioned particle combustion occurs repeatedly for a long time, the upper surface of the translucent pressing member 100 will gradually change color, which may eventually cause damage such as cracks to the translucent pressing member 100. Therefore, it is necessary to pass the ionizer. 800 prevents static electricity from being generated on the upper surface of the translucent pressing member 100 to prevent adsorption of particles in advance.

24 is a perspective view showing the structure and working relationship of the input area of the welding object transfer module according to an embodiment of the present invention. Hereinafter, referring to FIG. 24 , the mechanical structure and operation of the input area (carrying-in area) of the welding object of the present invention will be described. relation.

First, the input area structure includes an input conveyor 910 for loading solder objects (for example, placing a plurality of electronic components on a printed circuit board) for performing a laser reflow process. The input conveyor 910 includes a conveyor frame 912 bent into a "┓" shape, and a pair of wire rail units 911 for inputting the welding object 11 into the conveyor are provided on both sides of the upper part of the conveyor frame 912. The rail unit 911 is combined with the rotation shaft of the rail drive motor 913 . In addition, a width adjusting motor 915 is provided on one side of the conveyor frame 912 for expanding or reducing the width of the input conveyor 910 so as to accommodate welding objects 11 of different sizes.

In addition, a horizontal transfer unit 920 is attached to one end of the conveyor frame 912, and the conveyor frame 912 also moves in the horizontal direction as the horizontal transfer unit 920 is transferred in the horizontal direction.

On the other hand, a preheating table 914 is provided on the upper part of the conveyor frame 912 , and the welding object 11 conveyed by the wire rail unit 911 is placed above the preheating table 914 during the period before it is put into the laser reflow processing area. Inside, the soldering object 11 is continuously preheated to a predetermined temperature (eg, 150° C.) so that the temperature is rapidly and stably raised to the melting temperature of the solder (eg, 250° C.) by laser beam irradiation during laser reflow.

On the other hand, in order to make the input conveyor 910 move horizontally in the state preheated on the preheating stage 914 and put it into the reflow process area, the above-mentioned welding object 11 needs to be accurately transferred to the vacuum chuck 940 . In this case, referring to FIG. 21 , a pickup unit 930 is further provided above the vacuum suction cup 940 , and the pickup unit 930 includes: a vacuum suction pad 931 for sucking the welding object; an air cylinder 932 for moving in the vertical direction the above-mentioned vacuum suction pad; and a support frame 933 for fixing the above-mentioned vacuum suction pad 931 and the cylinder 932 .

As a result, when the input conveyor 910 moves to the vacuum pad 940 side, the vacuum pad 931 of the pickup unit 930 is moved upward by the drive of the air cylinder 932, and then, if the welding object 11 is positioned below the vacuum pad 931, the As the vacuum suction pad 931 moves downward, the above-mentioned welding object 11 is suctioned and then transferred upward again. Then, as the input conveyor 910 moves horizontally to the original position again, if the vacuum suction pad 931 is detached from below the vacuum suction pad 931, the vacuum suction pad 931 will move downward again, so that the above-mentioned welding object 11 is repeatedly placed on the vacuum suction pad 940. work.

Next, a horizontal moving unit, for example, a linear motor 941 is provided at the lower part of the vacuum chuck 940, and the operation of the linear motor 941 moves the vacuum chuck 940 and the welding object 11 together to the laser reflow processing area. .

In addition, a vision unit 934 is also provided on one side of the above-mentioned vacuum suction cup 940, which is used to continuously detect whether the loading is normal in the input area, and whether the welding object 11 is accurately placed and arranged on the vacuum suction cup,

On the other hand, FIG. 25 is a perspective view showing the structure and working relationship of the output area of the welding object transfer module according to an embodiment of the present invention. Hereinafter, with reference to FIG. 25 , the mechanical structure and working relationship of the delivery area (carry-out area) of the welding object of the present invention will be described in detail.

The structure of the output conveyor 950 is substantially the same as the structure of the input conveyor 910 described above, and the difference from the structure of the input conveyor 910 is that the output conveyor 950 does not have a preheating stage 914 for preheating the welding object 11 .

Therefore, when the laser reflow process has been completed and the welding object 11 is transferred to the output area (carry-out area) in a state of being placed on the vacuum chuck 940 , the pickup unit 970 attracts the welding object 11 to the vacuum chuck in the reverse order of the carrying-in. 940 and transfer to the output conveyor 950, then, the output conveyor 950 will move horizontally to unload the welding object 11 to the outside of the device through the wire rail unit 951.

26a and 26b are exemplary diagrams showing the structure and working relationship of the vacuum chuck unit of the welding object transfer module of the present invention. A top view and a side cross-sectional view of the porous adsorption plate structure according to another embodiment are shown.

First, referring to FIG. 26a, in the structure of the vacuum suction cup 940 according to an embodiment of the present invention, a plurality of porous suction plates are formed on the upper surface, and the porous suction plates are composed of a center suction plate 943 and an edge suction plate 944. The plate 943 has a rectangular shape and is used for adsorbing the center portion of the bottom surface of the object to be welded 11 .

In this case, referring to the plan view, when the welding object 11 of a predetermined area is placed on the porous suction plates 943 and 944, the suction unit (not shown in the figure) such as an air compressor provided on the center suction plate 943 and the edge suction plate 944 is passed through. ) vacuum suctions the welding object 11 so that it is fixed on the upper surface of the vacuum chuck 940 in an expanded state.

In addition, referring to the side sectional view, the center suction plate 943 and the edge suction plate 944 are spaced apart from each other with a predetermined interval. The center suction plate 943 may have another embodiment structure in which the pickup units 930 and 970 are omitted when necessary, that is, in the structure of the embodiment described above. That is, the center suction plate 943 can directly receive the welding object 11 from the input conveyor 910 . In this case, even after the center suction plate 943 ascends upward in order to directly receive the welding object 11 from the input conveyor 910 , the welding object 11 is sent from the input conveyor 910 . The linear rail unit 911 directly receives the welding object 11 and descends downward again, and the central suction plate 943 can also fully achieve the purpose of the present invention.

In addition, a heating block 942 may be provided directly under the center suction plate 943. The heating block 942 is the same as the preheating stage 914 of the input conveyor 910, and is in the process of transporting the object to be welded in order to perform the laser reflow process. , which is used to preheat the above-mentioned welding object 11 to a predetermined temperature.

On the other hand, Fig. 26b shows the structure and working relationship of the porous adsorption plate according to still another embodiment of the present invention. The structural difference from the one embodiment illustrated in FIG. 26a is that, different from the porous material of the central adsorption plate, the edge adsorption plate 945 is made of aluminum material, and a plurality of adsorption holes 944a are also formed, so that the adsorption along the edge and the above-mentioned edge are different. The center suction plate 945 of the plate 945 more firmly absorbs the edge portion of the bottom surface of the welding object 11 in the peripheral direction adjacent to the plate 943 . The other structures and working relationships are the same as those of the embodiment described with reference to FIG. 26a, so detailed descriptions will be omitted.

Furthermore, as shown in FIGS. 26 a and 26 b , by adjusting the vacuum suction force of the center suction plate 943 and the edge suction plates 944 and 945 of the vacuum suction cup 940 , the printed circuit board or flexible printed circuit board (Flexible PCB) of the welding object 11 can be adjusted. The bending or wrinkling of itself is stretched to a certain extent, thereby not only improving the vertical height of the plurality of electronic components placed on the above-mentioned substrate, but also making the plurality of electronic components almost located in the same position, therefore, during the laser reflow soldering process In the process, it is possible to improve the problem of process failure caused by excessive pressure on specific electronic components.

27 is a side view schematically showing the structure and working relationship of a multi-laser module according to still another embodiment of the present invention, FIG. 28 is an enlarged perspective view of the main part showing the structure of the temperature sensor of FIG. 27 , and FIG. 29 is an enlarged view of FIG. 28 Top view of the main part of the structure of the welded object.

Hereinafter, referring to FIGS. 27 to 29 , the structure and working relationship of a multi-laser module according to still another embodiment of the present invention will be described in detail.

First, referring to FIG. 27 , a multi-laser module according to another embodiment of the present invention includes a pair of a first laser module 310 and a second laser module 320 , and an infrared ray is disposed between the first laser module 310 and the second laser module 320 The temperature sensor 810 is used to measure the temperature related to the laser beams irradiated from the first laser module 310 and the second laser module 320 in a superimposed manner.

On the other hand, the first laser module 310 and the second laser module 320 are respectively provided with beam analyzers 318 and 328 for continuously detecting the laser beam output and intensity of the first laser module 310 and the second laser module 320 . As an example, in the configuration of the beam analyzers 318 and 328 described above, a part of the laser beams outputted through the laser beam paths of the first laser module 310 and the second laser module 320 is irradiated or transmitted through the beam analyzer, so that the laser beam can be measured. beam power and intensity.

According to an embodiment, the infrared temperature sensor 810 may be a single infrared temperature sensor 810, and the single infrared sensor is used to measure the surface temperature value of the overlapping laser beam region 12 of the first laser module and the second laser module. In this case, the single infrared temperature sensor 810 measures the overall temperature distribution value of the overlapping irradiation laser beam region by sequentially measuring a plurality of positions in the overlapping irradiation laser beam region.

At this time, the measured temperature distribution value may not be uniform. As an example, if the temperature value measured at one position is higher than the melting temperature of the solder, there is a possibility that an overflow soldering defect may occur due to overheating of the solder, and vice versa. , when the temperature is lower than the melting temperature of the solder, there is a possibility that the solder cannot be sufficiently melted and the soldering failure of the contact occurs.

For this reason, the present invention adjusts the power or intensity of each laser beam output from the first laser module 310 or the second laser module 320, the shape of the beam, etc. by continuously measuring the temperature of the overlapping irradiation area by the infrared temperature sensor 810, so as to The temperature distribution value in the overlapping irradiation area 12 is compensated.

On the other hand, according to yet another embodiment of the present invention, a plurality of infrared temperature sensors 810 may also be included. 28, as an example, the plurality of infrared temperature sensors of the present invention may include five temperature sensors 810#1, 810#2, 810#3, 810#4, and 810#5. A temperature sensor 810#1, 810#2, 810#3, 810#4 is arranged at the corner parts, respectively, and a temperature sensor 810#5 is arranged at the middle part. As a result, the five temperature sensors 810#1, 810#2, 810#3, 810#4, and 810#5 are simultaneously irradiated with infrared beams, and in this case, as shown in FIG. A plurality of electronic components 11b#1, 11b#3, 11b#7, 11b#9 in each of the corners and the electronic component 11b#5 located in the middle portion are irradiated with an infrared beam to measure the temperature.

In this case, the above content does not limit the relative position and number of the electronic components 11b whose temperature is to be measured, and the surface temperature of the substrate on which the electronic components are not arranged may be measured. In order to obtain a more accurate temperature distribution value related to the overlapping irradiation laser beam area, it can be achieved by measuring the temperature values of a plurality of electronic components and substrates.

On the other hand, as a method of compensating the temperature distribution value, the temperature distribution value may be compensated during the adjustment of the irradiation angle and height of the first laser beam or the second laser beam.

30a to 30e are state diagrams showing the working relationship according to the process of the laser reflow method of the present invention. Hereinafter, each process step of the laser reflow method will be described in detail according to an embodiment.

First, FIG. 30a is a diagram showing a state in which the translucent pressing member 100 moves to the upper side of the center line Cn+1. If the pressing surface 102 of the translucent pressing member 100 is located at the center line Cn+1, the visual unit is 934 photographs the plurality of electronic components 11 b located below the pressing surface 102 of the above-mentioned translucent pressing member 100 . In this case, when viewed from the side as shown in FIG. 30a through the visual unit 934, it is determined whether or not the plurality of electronic components 11b are based on the center line Cn+1 of the pressing surface 102 of the translucent pressing member 100 Symmetrical configuration.

That is, it is determined whether or not the arrangement shape of the plurality of electronic components 11b located directly under the pressing surface 102 of the above-mentioned translucent pressing member 100 corresponds to the area of the pressing surface 102. For example, as shown in FIG. 10a, in the plurality of electronic components In a state in which 11 b is arranged in three rows, it is determined whether or not the plurality of electronic components 11 b are arranged in 1.5 rows symmetrically with respect to the center line Cn+1 of the pressing surface 102 . Accordingly, when the pressing surface 102 of the translucent pressing member 100 presses the range (area) in which the plurality of electronic components 11b are arranged in three rows, the pressing force can be uniformly pressed without deviating to any one side.

In addition, referring to the drawings, the plurality of electronic components 11b of the soldering object 11 are arranged in a position to be soldered together with the solder 11c in order to be soldered on the upper surface of the substrate 11a. At this time, the substrate 11a is vacuum sucked by the lower vacuum chuck 340. fixed state. In this case, since the heating block 942 is provided inside the vacuum chuck 940, the substrate 11a, the electronic component 11b, and the solder 11c as the soldering object 11 are continuously preheated to a predetermined temperature. For example, it is preferable to set the preheating temperature to be lower than the melting temperature of the solder.

In the case of not preheating the welding object 11 in the above-mentioned manner, it is necessary to rapidly heat the welding object 11 from the normal temperature to the melting temperature of the solder 11c by using only the heat energy of the laser beam generated during the laser reflow process. Rapid heating may cause soldering defects such as overflow in the solder 11c. Therefore, the temperature needs to be gradually increased, and the temperature can be gradually increased from the preheating temperature to the melting temperature of the solder 11c to stably melt the solder 11c and minimize poor soldering. For example, although the melting temperature of the above-mentioned solder 11c may vary depending on the material of the solder, generally, the melting temperature of the solder paste may be 200° C. or higher.

30b shows a state diagram of the translucent pressurizing member 100 being pressurized on the center line Cn+1 and irradiating laser light. As shown in FIG. 10a, when the visual unit 934 determines the pressurizing surface 102 of the translucent pressurizing member 100 When the center line Cn+1 is the same as the center line of the plurality of electronic components 11b to be soldered, the translucent pressing member 100 moves downward to press the electronic components 11b.

In this case, the laser beam may be sequentially irradiated while the above-mentioned translucent pressing member 100 is pressurized. For example, during the pressing process of the above-mentioned translucent pressing member 100, the laser beam may pass through a multi-laser located above. The module, the first laser module 310 and the second laser module 320 overlap and irradiate the plurality of electronic components 11b.

Thereby, the object 11 to be soldered is gradually heated from the preheating temperature to the melting temperature of the solder 11c by the laser beams irradiated superimposedly. As a result, as the solder 11c located at the lower part of the plurality of electronic components 11b is melted, the electronic component 11b and the substrate are completed. Welding of 11a (the difference in height before and after welding is represented by hc in Fig. 30a).

Fig. 30c is a state diagram showing the movement of the translucent pressing member to the upper side of the center line Cn+2, Fig. 30d is a state diagram showing the alignment of the position of the translucent pressing member based on the center line Cn+2', Fig. 30e This is a diagram showing a state in which the light-transmitting pressing member pressurizes and irradiates laser light on the center line Cn+2'.

30c, after the laser reflow process is completed, the translucent pressurizing member 100 is moved to the next predetermined range, that is, in order to perform pressurization and laser reflow processes on the plurality of electronic components 11b in three rows. It moves horizontally along the center line Cn+2' of the plurality of electronic components 11b in three columns. In this case, the vision unit 934 will again image the arrangement shape of the plurality of electronic components 11 b arranged below the pressing surface 102 of the translucent pressing member 100 .

However, in this case, as shown in FIG. 30c, when it is determined that the plurality of electronic components 11b arranged below the pressing surface 102 of the translucent pressing member 100 are not arranged symmetrically with respect to the center line Cn+2 , and does not directly perform pressurization and laser irradiation. This is because, in this state, when the translucent pressing member 100 is pressed, the plurality of electronic components 11 b are asymmetrically arranged with reference to the center line Cn+2 of the pressing surface 102 of the translucent pressing member 100 . , therefore, when pressurized, the problem of poor welding is caused due to the bias of the pressure to either side.

Therefore, as shown in FIG. 30d, in order to prevent the above problems, the present invention uses the control unit (not shown) to move the above-mentioned translucent pressurizing member 100 horizontally along the new center line Cn+2', and calibrates by this The horizontal position of the translucent pressing member 100 is calibrated. Therefore, as the horizontal position is calibrated, the plurality of electronic components 11b arranged below the translucent pressurizing member 100 will be symmetrically arranged on the basis of the calibrated center line Cn+2'. In this state, as shown in Fig. 30e As shown, the translucent pressing member 100 pressurizes the plurality of electronic components 11b by moving downward, and irradiates the laser beam.

On the other hand, referring to FIG. 30e, although the above-mentioned translucent pressing member 100 moves along the calibrated center line Cn+2' and performs pressing, in this case, the first laser module 310 and the second laser module 320 does not calibrate the horizontal position with the calibrated center line Cn+2', and irradiates the laser beam with the center line Cn+2 before calibration as the reference.

As described above, the reason why the laser modules 310 and 320 do not calibrate the horizontal position based on the translucent pressing member 100 is that when the laser beam is irradiated with the calibrated center line Cn+2' as a reference, there are many cases where the above welding has been completed. The electronic components 11b may be irradiated with the laser beam again, and if the laser beam is irradiated again to the solder 11c that has completed the reflow process, the solder 11c can be melted again, so there is a problem of causing poor soldering. Therefore, the present invention does not need to perform the position calibration of the first laser module 310 or the second laser module 320 when pressing and irradiating the electronic components 11b with an asymmetric configuration, by only moving to the calibrated centerline Cn+2' level. After the translucent pressing member 100 is moved to calibrate the position, the occurrence of various welding failure factors as described above can be minimized during the pressing and laser irradiation process.

FIGS. 31 a to 31 d are state diagrams showing the working relationship according to the steps of the laser reflow method of the present invention. Hereinafter, various welding modes that can be combined according to the respective steps will be described in detail according to the embodiments.

First, referring to FIG. 31a , the first welding mode of the present invention, as the most basic welding mode, may include the following steps: the pressing surface 102 of the above-mentioned translucent pressing member 100 is moved downward to make contact with no pressure applied The welding object 11 ; irradiating the welding object 11 with a laser beam through the translucent pressing member 100 ; and releasing the irradiation of the laser beam and moving the translucent pressing member 100 upward.

In this case, as shown in FIG. 13 above, in the step of bringing the above-mentioned translucent pressing member 100 into contact with the welding object 11 in a state where no pressure is applied, the above-mentioned motor 760 and the balls are driven by the above-mentioned motor 760 as the motor 760 is driven. The press bracket 720 connected to the lead screw 750 moves downward. Since the press bracket 720 is in a state in which the holder unit 500 and the translucent pressurizing member 100 are attached, the translucent pressurizing member 100 is driven by the motor to move downward. Move down.

Referring to FIG. 31 b , when the above-mentioned translucent pressing member 100 moves downward and comes into contact with the electronic component 11 b of the welding object 11 , along with the motor for providing the driving force for moving the above-mentioned translucent pressing member 100 downward 760 stops driving, and the above-mentioned translucent pressurizing member 100 will be in a state of being in contact with the upper surface of the electronic component 11b in a state where no pressure is applied. At this time, since the above-mentioned motor is in the locked state, the translucent pressing member 100 is also in a height-fixed state where it cannot move vertically.

Next, referring to FIG. 31c, in a state where the above-mentioned translucent pressing member 100 is in contact with the upper surface of the electronic component 11b, the multi-laser module provided above the above-mentioned translucent pressing member 100, that is, the first laser The module 310 and the second laser module 320 irradiate the welding object 11 with laser beams through the translucent pressing member 100 .

In this case, since the above-mentioned laser beams are overlapped and irradiated, the homogenized laser beams can be delivered to the above-mentioned plurality of electronic components 11b and the solder 11c. , the welding object 11 is in a state of being preheated to less than 200°C, therefore, even if the laser beam does not heat the welding object 11 to the melting temperature of the solder 11c, for example, rapidly heated to 250°C, it can be stably heated from the preheating temperature to The melting temperature of the solder 11c. Accordingly, when the laser reflow is started, the upper surface of the solder 11c is in a state of contact with the pressing surface 102 of the translucent pressing member 100. Therefore, when the solder 11c is melted, the solder 11c is prevented from being located in the solder 11c. The upper electronic component 11b is bent or floated upward.

Then, when the welding is completed, the irradiation of the above-mentioned laser beam is released, the translucent pressing member is moved upward by 100 degrees, and the first welding mode is completed.

On the other hand, other welding modes in which a plurality of additional steps are added to the above-mentioned first welding mode will be described in detail below according to the embodiments.

As in the first welding mode described above, in the second welding mode, after the light-transmitting pressurizing member 100 comes into contact with the electronic components 11b of the welding object 11, the pressurizing cylinder 730 provided above the light-transmitting pressurizing member 100 is The translucent pressing member 100 is pressed with a predetermined pressure.

Subsequently, as described above, when the laser beam is irradiated in a state where the translucent pressing member 100 pressurizes the welding object 11, the pressure is released as the solder 11c of the welding object 11 is melted. In this case , it is predicted that the height of the electronic component 11b is reduced by a predetermined height hc due to the compression of the solder 11c (see FIG. 31a ). In this state, when the lock of the motor 760 is released, the translucent pressurizing member 100 gradually moves downward due to its weight, and finally, the translucent pressurizing member 100 moves downward in accordance with the pressure applied by the pressurizing cylinder 730 described above. , thereby maintaining pressure.

Therefore, the difference between the second welding mode and the first welding mode is that, before the laser beam is irradiated, when the solder 11c is melted by the application of the laser beam, the translucent pressing member 100 is also And move down and maintain pressure. As a result, when the solder 11c is melted, a predetermined pressure applied to the solder 11c is maintained. Therefore, dense soldering can be obtained by reducing the floating of the electronic component 11b and the poor contact of the solder 11c.

In addition, the third welding mode is the same as the first welding mode. Like the first welding mode described above, after the light-transmitting pressing member 100 comes into contact with the electronic component 11b of the welding object 11, the irradiation is performed in a state where no pressure is applied. Laser beam.

After the laser beam is irradiated, a predetermined pressure is applied to the translucent pressurizing member 100 and the welding object 11 in accordance with the driving of the pressurizing cylinder 730 . In this case, the motor 760 is locked, the translucent pressurizing member 100 is fixed so as not to move vertically, and only the pressurizing cylinder 730 applies pressure. Unlike the first welding mode, in the third welding mode described above, pressure is applied after the laser beam is irradiated.

The fourth welding mode is the same as the third welding mode described above until the step of irradiating the laser beam, but there is a difference in that, instead of applying pressure, the height of the translucent pressing member 100 is changed after the laser beam is irradiated.

Therefore, when the laser beam is started to be irradiated, the above-mentioned light-transmitting pressing member 100 will gradually move downward as the lock of the motor is released. As a result, the electronic component 11b and the molten solder 11c can be gradually pressed against the laser beam. Soldering failure caused by the sudden pressure on the molten solder 11c.

As described above, the above-described soldering mode may have various embodiments in terms of preventing poor soldering by adjusting the pressure change caused by the melting of the solder.

Therefore, the present invention is not limited to the above-described embodiments, and the same effect can be achieved even if some steps are changed or additional steps are added by changing the detailed structure or the number and configuration of the devices. It should be understood that, Those skilled in the art to which the present invention pertains can add, delete, and modify various structures within the scope of the technical idea of the present invention.

Explanation of reference numerals

11: Welding object 11a: Substrate

11b: Electronic components 12: Laser overlapping irradiation area

100: Translucent pressing member 101: Base material

101a: Step portion 102: Pressurized surface

102a: Grid slot 103: Laser blocking layer

104: Silicon damping layer 200: Protective film

210: Protective film transfer unit 310: First laser module

318, 328: Beam Profiler 320: Second Laser Module

500: Bracket unit 510: Lower plate

520: Mask plate 600: Probe unit

610: Probe 620: Probe Transfer Section

630: Probe Holder 700: Stamping Unit

710: Pressure Balancer 720: Stamping Bracket

730: Pressurized cylinder 740: Pressure sensor

750: Ball screw 760: Motor

770: Guide part 780: Bearing joint

790: Stopper 800: Ionizer

810: Infrared temperature sensor 811: Infrared irradiation point

910: Input conveyor 920, 960: Horizontal transfer unit

930, 970: Pad 934: Vision Unit

940: Vacuum Cup 942: Heating Block

943: Porous suction plate 950: Output conveyor

980: Adsorption plate lift unit

Claims (81)

1. A laser reflow soldering device, characterized in that, comprising: The laser pressurization head module pressurizes the welding object through the light-transmitting pressurizing member and irradiates the laser beam through the pressurizing member to weld electronic components to the substrate, and the welding object is composed of a plurality of electronic components arranged on the substrate; as well as The welding object transfer module is used for transferring the welding object, so that the welding object brought in from one side of the laser pressing head module is subjected to the reflow process of the laser pressing head module and is transported out toward the other side. 2. The laser reflow soldering device according to claim 1, wherein the laser pressure head module comprises: a bracket unit for attaching the above-mentioned light-transmitting pressing member in a replaceable manner; and The probe unit is arranged above the bracket unit, and is used for detecting the flatness of the pressing member installed in the bracket unit. 3 . The laser reflow soldering apparatus according to claim 1 , wherein the laser beam is a square laser beam homogenized by a beam shaper. 4 . 4 . The laser reflow soldering apparatus according to claim 1 , wherein the laser beam is a laser beam irradiated by overlapping two or more laser modules. 5 . 5 . The laser reflow soldering apparatus according to claim 1 , wherein the holder unit includes a lower plate, and a through hole for inserting and locking the translucent pressing member is formed in the center portion. 6 . 6 . The laser reflow soldering apparatus according to claim 1 , wherein the translucent pressing member is made of one of quartz, sapphire, fused silica glass or diamond. 7 . 7 . The laser reflow soldering apparatus according to claim 5 , wherein the holder unit further comprises a mask plate, and a through hole through which the laser beam can pass is formed in the center portion, so that the translucent pressing member is The state placed on the lower plate is combined with the upper part of the lower plate. 8 . The laser reflow soldering apparatus according to claim 7 , wherein the through holes of the mask plate are larger in area than the pressing surface of the translucent pressing member or pressurized with the translucent pressing member. 9 . same square. 9 . The laser reflow soldering apparatus according to claim 5 , wherein the bottom surface of the lower plate has a circular arc shape at the corners of the left and right sides. 10 . 10 . The laser reflow soldering apparatus according to claim 5 , wherein each corner portion of the lower plate is further provided with a translucent pressing member that moves the corner of the lower plate finely in the vertical direction. 11 . The flatness adjustment unit that adjusts the flatness. 11. The laser reflow soldering device according to claim 10, wherein the flatness adjusting unit comprises: stamping brackets, arranged on each corner of the light-transmitting pressing member and the bracket unit; and The vertical drive unit is provided on one side of the above-mentioned press carriage, and is driven by the motor to move the press carriage in the vertical direction. 12. The laser reflow soldering device according to claim 11, wherein the vertical driving part comprises: Ball screws and motors for vertical transport of the press carriage; and The guide member is used for guiding the linear movement of the punching bracket. 13. The laser reflow soldering device according to claim 2, wherein the probe unit comprises: a probe that measures flatness by piercing through one or more locations on the upper surface of the optically pressurized member; a moving unit for moving the above probes horizontally or vertically; and The probe bracket is used to fix the above probe and the moving unit. 14 . The laser reflow soldering apparatus according to claim 13 , wherein the probe pierces four or more positions including each corner position of a square on the upper surface of the translucent pressing member. 15 . 15. The laser reflow soldering apparatus according to claim 2, further comprising a protective film formed on the lower part of the translucent pressurizing member for preventing gas generated during laser welding from adhering to the translucent pressurizing member. Press the bottom surface of the part. 16. The laser reflow soldering apparatus according to claim 15, wherein the protective film is made of polytetrafluoroethylene resin or soluble polytetrafluoroethylene resin. 17 . The laser reflow soldering apparatus according to claim 15 , wherein the protective film is supplied from a roll-to-roll protective film transfer unit that transfers the protective film wound in a roll shape to one side by unwinding the protective film. 18 . 18. The laser reflow soldering apparatus according to claim 1, wherein the translucent pressing member comprises: The substrate, which is in the shape of a square plate as a whole; and The pressing surface is formed to protrude from the bottom surface of the base material, and the bottom surface is formed in a planar shape corresponding to the plurality of electronic components. 19 . The laser reflow soldering apparatus according to claim 18 , wherein between the base material and the pressurizing surface, there is provided a structure that is recessed inward so that the area of the pressurizing surface is smaller than the area of the base material. 20 . one or more steps. 20 . The laser reflow soldering apparatus according to claim 18 , wherein a laser blocking layer is formed on the side surface of the base material and the bottom surface and side surface of the stepped portion. 21 . 21. The laser reflow soldering apparatus according to claim 18, wherein the pressing surface is divided into two or more by grooves having a predetermined depth. 22 . The laser reflow soldering apparatus according to claim 21 , wherein a laser blocking layer is further formed on the inner side surface and the bottom surface of the grid groove. 23 . 23. The laser reflow soldering device according to claim 20 or 22, wherein the laser blocking layer is one of an Inconel coating, a scattering treatment layer or a high reflection coating, or a combination of two or more. composite layer. 24. The laser reflow soldering apparatus according to claim 18, wherein the pressing surface has a square shape. 25 . The laser reflow soldering device according to claim 24 , wherein the two side corners of the pressing surface are formed by chamfering or arc processing. 26 . 26. The laser reflow soldering apparatus according to claim 18, wherein an elastic damping layer is further provided on the pressing surface. 27. The laser reflow soldering device according to claim 26, wherein the elastic damping layer is made of silicon material. 28. The laser reflow soldering device according to claim 1, wherein the laser pressure head module further comprises: a bracket unit, in the form of a rectangle, for installing the above-mentioned translucent pressing member in a replaceable manner; The pressure balancer makes the weight of the bracket unit and the light-transmitting pressing member equal to the weight of the bracket unit and the light-transmitting pressing member by supporting the lower ends of the corners of the above-mentioned bracket unit and applying pressure equivalent to the weight of the bracket unit and the light-transmitting pressing member in the opposite direction. is initialized to zero; and The punching unit is arranged above each corner of the bracket unit in a non-contact state, and independently presses each corner of the bracket unit with a preset pressure. 29. The laser reflow soldering apparatus according to claim 28, wherein the pressure balancer is an air cylinder. 30. The laser reflow soldering apparatus according to claim 28, wherein the pressure balancer is a spring. 31 . The laser reflow soldering device according to claim 28 , wherein the punching units are spaced apart from each other at each corner, so that the punching unit independently presses each corner of the bracket unit with a preset pressure. 32 . 32. The laser reflow soldering device according to claim 31, wherein the punching unit comprises: Stamped brackets to secure each corner portion of the bracket unit in a non-contact manner; and A pressurizing cylinder is installed on the upper end of the punching bracket, and presses down the bracket unit with a preset pressure respectively. 33. The laser reflow soldering device according to claim 1, wherein the laser pressure head module comprises: A bracket unit, in the form of a circle or a polygon, for installing the above-mentioned light-transmitting pressing member in a replaceable manner; and The punching unit is respectively combined with three positions around the edge of the above-mentioned bracket unit to realize the axis combination, and when the above-mentioned axis combination positions are connected by dotted lines, a triangle is formed. 34. The laser reflow soldering device according to claim 33, wherein the punching unit comprises: stamping bracket; a pressurizing cylinder, mounted on the upper end of the punching bracket, and pressing down the bracket unit with a preset pressure; and One end of the bearing joint is combined with the cylinder rod of the above-mentioned pressurizing cylinder, and the other end is combined with one of the three positions of the bracket unit in a rotatable manner. 35 . The laser reflow soldering apparatus according to claim 34 , wherein joint fastening parts are respectively provided at three positions of the bracket unit, and the joint fastening parts are respectively connected to the bearing joints in a rotatable manner. 36 . combine. 36 . The laser reflow soldering device according to claim 35 , wherein a stopper is further provided at the lower end of the stamping bracket, and one end of the joint fastening part is hung on the stopper. 37 . 37 . The laser reflow soldering apparatus according to claim 34 , wherein a vertical transfer portion is further provided on one side of the punching bracket for raising and lowering the punching bracket in a vertical direction. 38 . 38. The laser reflow soldering apparatus according to claim 37, wherein the vertical transfer portion includes a ball screw and a motor. 39. The laser reflow soldering apparatus according to claim 33, wherein the flatness of the bracket unit is initialized to zero to reset the flatness after a predetermined period or replacement of the translucent pressing member. 40. The laser reflow soldering apparatus according to claim 33, wherein the virtual triangle formed by connecting the three positions of the bracket unit is an equilateral triangle, and the center of gravity of the virtual triangle is the same as that of the translucent pressing member. 41. The laser reflow soldering apparatus according to claim 32 or 34, wherein the pressurizing cylinder is a precision air cylinder, and the pressure can be finely set and adjusted in units of kgf. 42. The laser reflow soldering apparatus according to claim 41, wherein the pressurizing cylinder is further provided with a pressure sensor that measures the pressure during pressurization and continuously provides feedback. 43. The laser reflow soldering apparatus according to claim 28 or 33, wherein a translucent pressing member is further provided above the holder unit from the influence of dust adsorption by static electricity The upper surface of the ionizer unit is cleaned. 44. The laser reflow soldering device according to claim 1, wherein the welding object transfer module comprises: an input conveyor for carrying in welding objects, the welding objects being composed of a plurality of electronic components arranged on a substrate; a vacuum chuck unit for fixing the welding object transferred from the above-mentioned input conveyor by vacuum suction; and The output conveyor is used to transport out the laser-reflowed soldered objects. 45. The laser reflow soldering apparatus of claim 44, wherein the input conveyor and the output conveyor comprise: conveyor frame; a pair of linear rail units arranged on both sides of the upper portion of the above-mentioned conveyor frame; and The horizontal transfer unit is arranged on one side of the above-mentioned conveyor frame, and is used for linearly moving the conveyor frame along the horizontal direction. 46. The laser reflow soldering device according to claim 45, wherein a width adjustment unit is further provided on one side of the conveyor frame of the input conveyor and the output conveyor, so as to expand or shrink the conveyor frame by expanding or shrinking the conveyor frame. width to accommodate welding objects of different sizes. 47. The laser reflow soldering apparatus according to claim 45, wherein a conveyor frame of the input conveyor is further provided with a preheating stage for preheating the welding object to a predetermined temperature. 48. The laser reflow soldering device according to claim 44, wherein a vision unit is further provided on one side of the vacuum chuck unit for monitoring whether the welding object is normally loaded. 49. The laser reflow soldering device according to claim 44, characterized in that, between the input conveyor and the vacuum chuck unit and between the output conveyor and the vacuum chuck unit, a pick-up for transferring the welding object is further provided. unit. 50. The laser reflow soldering device according to claim 49, wherein the pickup unit comprises: Vacuum pads, in the form of flat plates; and The vertical drive unit is used to move the vacuum suction pad in the vertical direction. 51. The laser reflow soldering device according to claim 44, wherein the vacuum chuck unit comprises: Porous suction plates for suction and fixation of welding objects; and The horizontal moving unit enables the porous adsorption plate and the heating block to reciprocate in the area from the input area of the welding object through the laser reflow processing area to the output area. 52. The laser reflow soldering device according to claim 51, wherein the porous adsorption plate comprises: a center suction plate, in the form of a rectangle, for suctioning the center portion of the bottom surface of the object to be welded; and The edge suction plate surrounds the center suction plate and is used for suctioning the edge portion of the bottom surface of the welding object. 53. The laser reflow soldering apparatus according to claim 52, wherein the edge suction plate is further formed with suction holes for suctioning the edge portion of the bottom surface of the welding object. 54. The laser reflow soldering device according to claim 52, wherein the edge suction plate is made of aluminum material. 55. The laser reflow soldering device according to claim 51, wherein a heating block is further provided at the lower part of the porous adsorption plate. 56. The laser reflow soldering device according to claim 1, wherein the laser pressure head module comprises: a multi-laser module for superimposing and irradiating a plurality of laser beams on the welding object in a state of being spaced apart from each other; and The temperature sensor is provided in the region between the multi-laser modules, and detects the temperature of a plurality of positions of the welding object by irradiating a light beam through the translucent pressing member. 57. The laser reflow soldering device according to claim 56, wherein the multi-laser modules are opposite one-to-many laser modules. 58. The laser reflow soldering device according to claim 56, characterized in that, The above temperature sensor is a single infrared temperature sensor, The single infrared temperature sensor described above sequentially irradiates infrared rays to a plurality of positions of the welding object. 59. The laser reflow soldering apparatus according to claim 58, wherein the single infrared temperature sensor sequentially irradiates infrared rays to a plurality of positions in a peripheral portion and a central portion of a region in which a plurality of laser beams are overlapped. 60 . The laser reflow soldering apparatus according to claim 56 , wherein the temperature sensor is a plurality of infrared temperature sensors, and the plurality of infrared temperature sensors simultaneously irradiate infrared rays to a plurality of positions of the welding object. 61 . 61. The laser reflow soldering apparatus according to claim 60, wherein the plurality of infrared temperature sensors simultaneously irradiate infrared rays to a plurality of positions in a peripheral portion and a central portion of a region where the plurality of laser beams are superimposed. 62. The laser reflow soldering apparatus according to claim 56, wherein the multi-laser module is further provided with a beam analyzer for measuring the power and intensity of each laser beam. 63. A laser reflow soldering method for a laser reflow soldering device, wherein a light-transmitting pressing member presses a welding object on which a plurality of electronic components are arranged on a rectangular substrate, and irradiates a laser beam through the pressing member to solder electronic components to the substrate , which is characterized in that it includes: Step a), before the above-mentioned light-transmitting pressing member presses the welding object, photographing the configuration shapes of a plurality of electronic components located in a predetermined range directly below the pressing surface of the light-transmitting pressing member by a visual unit; Step b), judging whether the configuration shapes of the multiple electronic components in the above-mentioned prescribed range that are photographed correspond to the pressing surface; Step c), when judging that the above-mentioned multiple electronic components correspond to the pressing surface, the light-transmitting pressing member moves downward and pressurizes the welding object, and irradiates the welding object with a laser beam through the light-transmitting pressing member; Step d), stop the irradiation of the laser beam and move the translucent pressing member upward to release the pressing state; and In step e), a plurality of electronic components in a predetermined range in which the above-mentioned translucent pressing member is to be reflowed next are moved horizontally upward. 64. The laser reflow soldering method of the laser reflow soldering device according to claim 63, wherein the step b) comprises: Step b1), judging whether a plurality of electronic components are left-right symmetrical on the basis of the center line of the pressing surface of the light-transmitting pressing member when observing from the side the configuration shape of a plurality of electronic components in a predetermined range; and Step b2), when the photographed configuration shapes of the above-mentioned multiple electronic components are symmetrical with respect to the center line of the pressing surface of the light-transmitting pressing member, it is judged to correspond to the pressing surface, and when not corresponding to the pressing surface, The horizontal position of the translucent pressing member is adjusted so that the arrangement shape of the plurality of electronic components is bilaterally symmetrical with respect to the center line of the pressing surface of the translucent pressing member. 65 . The laser reflow soldering method of the laser reflow soldering apparatus according to claim 63 , wherein the laser beam is a laser beam irradiated by two or more laser modules overlappingly. 66 . 66. The laser reflow soldering method of a laser reflow soldering apparatus according to claim 63, wherein each of the laser modules is arranged symmetrically with each other, and each of the laser beams has the same beam irradiation angle. 67. The laser reflow soldering method of the laser reflow soldering apparatus according to claim 66, wherein each of the laser modules is irradiated with a laser beam at the same time. 68. The laser reflow soldering method of the laser reflow soldering apparatus according to claim 66, wherein each of the laser modules is irradiated with a laser beam in sequence. 69. The laser reflow soldering method of the laser reflow soldering device according to claim 63, characterized in that, before performing the above step c), it further comprises a step of preheating the soldered object from the lower part. 70. The laser reflow soldering method of the laser reflow soldering apparatus according to claim 69, wherein in the step of preheating the soldering object from below, the surface temperature of the soldering object is maintained to be less than 200°C. 71. The laser reflow soldering method of the laser reflow soldering apparatus according to claim 63, wherein in the step c), the surface temperature of the soldering object is adjusted by irradiating a laser beam to the soldering object through the translucent pressing member. Heated to above 200°C. 72. A laser reflow soldering method for a laser reflow soldering device, wherein a light-transmitting pressing member presses a welding object on which a plurality of electronic components are arranged on a rectangular substrate, and irradiates a laser beam through the pressing member to solder electronic components to the substrate , which is characterized in that it includes: Step a), making the pressing surface of the above-mentioned translucent pressing member move downward to contact the welding object in a state of not applying pressure; Step b), irradiating the welding object with a laser beam through the above-mentioned light-transmitting pressing member; and In step c), the irradiation of the above-mentioned laser beam is released and the translucent pressing member is moved upward. 73. The laser reflow soldering method of the laser reflow soldering device according to claim 72, characterized in that, after performing the above step a), it further comprises the step of fixing the vertical movement of the translucent pressing member. 74. The laser reflow soldering method of a laser reflow soldering device according to claim 72, further comprising the step of: applying a preset prescribed pressure to the translucent pressing member after performing the step a) , and after performing step b), the vertical movement of the above-mentioned light-transmitting pressing member is not fixed. 75. The laser reflow soldering method of a laser reflow soldering device according to claim 72, further comprising the step of: after performing the above step a), fixing the vertical movement of the translucent pressing member, and After performing the above-mentioned step b), a predetermined predetermined pressure is applied to the above-mentioned translucent pressing member. 76. The laser reflow soldering method of a laser reflow soldering device according to claim 72, further comprising the step of: after performing the step a), fixing the vertical movement of the translucent pressing member, and After performing step b), the vertical movement of the above-mentioned translucent pressing member is not fixed. 77. The laser reflow soldering method of the laser reflow soldering apparatus according to claim 72, wherein in the step b), the laser beam is a laser beam irradiated by two or more laser modules overlappingly. 78. The laser reflow soldering method of the laser reflow soldering apparatus according to claim 77, wherein each of the laser modules is irradiated with a laser beam at the same time. 79. The laser reflow soldering method of the laser reflow soldering apparatus according to claim 77, wherein each of the laser modules is irradiated with a laser beam in sequence. 80. The laser reflow soldering method of the laser reflow soldering apparatus according to claim 72, characterized in that, before performing the above step b), it further comprises a step of preheating the soldered object from the lower part. 81. The laser reflow soldering method of the laser reflow soldering apparatus according to claim 80, wherein in the step of preheating the soldering object from below, the surface temperature of the soldering object is maintained to be less than 200°C.

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