CN114883168A - Chuck device, semiconductor chamber and manufacturing method of chuck device - Google Patents

Abstract

The invention provides a chuck device which is used for semiconductor equipment and comprises a bearing disc, wherein at least one first electrode is arranged in the bearing disc and is used for being connected with a power supply assembly so as to receive a radio-frequency signal provided by the power supply assembly, the chuck device also comprises at least one electromagnetic sensing assembly, the electromagnetic sensing assembly and the first electrode are arranged in a one-to-one correspondence mode, and the electromagnetic sensing assembly can respond to a magnetic field generated by current between the power supply assembly and the first electrode and generate an electric signal corresponding to the radio-frequency signal. In the invention, the electromagnetic sensing component can respond to the magnetic field generated by the current on the connecting circuit between the power supply component and the first electrode to generate the corresponding electric signal, so that the size of the radio frequency current can be monitored in real time, and compared with the prior art, the electromagnetic sensing component is less interfered by a radio frequency loop, and the detection precision of the radio frequency current is improved. The invention also provides a semiconductor chamber, a manufacturing method of the chuck device and a manufacturing method of the chuck device.

Description

Chuck device, semiconductor chamber and manufacturing method of chuck device

Technical Field

The invention relates to the field of semiconductor process equipment, in particular to a chuck device, a semiconductor cavity, a manufacturing method of the chuck device and a manufacturing method of the chuck device.

Background

In the field of semiconductor processing equipment, electrostatic chucks are one of the most important tools used in vacuum chambers to achieve wafer chucking. Compared with other structures for fixing the wafer, the electrostatic chuck has the functions of heating, temperature control, loading radio frequency power and the like. Due to its good stability, low particle, good temperature control, electrostatic chucks find extremely wide application in the semiconductor field.

The electrostatic chuck can adsorb the wafer based on the electrostatic adsorption principle and simultaneously realize the function of loading radio frequency power, namely, the radio frequency power is fed into a radio frequency electrode in the electrostatic chuck through a lead and is coupled into a process chamber in a capacitive coupling mode, so that the function of radio frequency loading is realized.

The rf current directly reflects the plasma state and the loop state of the chamber, and is one of the important parameters in the Physical Vapor Deposition (PVD) process and the etching process. In the physical vapor deposition process and the etching process, the conventional electrostatic chuck structure can only control the power of radio frequency loading through a power supply, and simultaneously, the direct current bias voltage on the surface of a wafer can be tested through a detection structure in the electrostatic chuck, so that the current loaded by the radio frequency cannot be directly measured.

For example, in the current physical vapor deposition and etching processes, a current sensor is connected between a matcher and a process chamber to detect the current loaded by the chamber. However, the current sensors applied to semiconductor chambers are generally higher in price, which increases more material cost; in addition, the current inductor can only detect the radio frequency current output by the matcher, the current output by the matcher needs to be output to the radio frequency electrode inside the electrostatic chuck through a cable arranged inside the semiconductor cavity, and the current detected by the current inductor cannot truly reflect the current loaded on the radio frequency electrode due to the fact that radio frequency loop interference is large and differences exist between the cable and a hardware structure in the cavity. In addition, in order to eliminate the consistency problem caused by the hardware difference between different semiconductor chambers, the current sensor of each semiconductor chamber needs to be calibrated independently before detection, which affects the efficiency of the semiconductor process.

Therefore, how to provide a radio frequency current detection structure with higher precision becomes a technical problem to be solved in the field.

Disclosure of Invention

The invention aims to provide a chuck device, a semiconductor cavity, a manufacturing method of the chuck device and a manufacturing method of the chuck device.

In order to achieve the above object, according to an aspect of the present invention, there is provided a chuck apparatus for a semiconductor device, the chuck apparatus including a carrier plate, at least one first electrode disposed inside the carrier plate, the first electrode being configured to be connected to a power supply component to receive a radio frequency signal provided by the power supply component, the chuck apparatus further including at least one electromagnetic sensing component, the electromagnetic sensing component being disposed in one-to-one correspondence with the first electrode, and the electromagnetic sensing component being capable of generating an electrical signal corresponding to the radio frequency signal in response to a magnetic field generated by a current between the power supply component and the first electrode.

Optionally, the chuck device further includes rf terminal posts corresponding to the first electrodes one to one, top ends of the rf terminal posts are connected to the corresponding first electrodes, bottom ends of the rf terminal posts extend from the bottom surface of the carrier tray, and the first electrodes are connected to the power supply assembly through the corresponding rf terminal posts; the electromagnetic sensing assembly is capable of generating an electrical signal corresponding to the radio frequency signal in response to a magnetic field generated by a current in the radio frequency terminal post.

Optionally, the electromagnetic sensing assembly includes a spiral portion and a coil inner lead, the coil inner lead surrounds the corresponding rf terminal post, the spiral portion surrounds the corresponding coil inner lead and extends spirally along an extending direction of the coil inner lead, a first end of the spiral portion is connected to a first end of the coil inner lead, a second end of the spiral portion and a second end of the coil inner lead are both used for being connected to the detection circuit, so that the detection circuit can determine the current in the rf terminal post according to the electric signals generated on the spiral portion and the coil inner lead.

Optionally, the spiral portion includes a second connection column, a plurality of first conductive strips, a plurality of second conductive strips, and a plurality of first connection columns, the first conductive strips and the second conductive strips both extend along a horizontal direction and are respectively located at two sides of the inner conductor of the coil along a height direction, the plurality of first conductive strips are distributed in a first ring shape, projection positions on a horizontal plane of the plurality of first conductive strips correspond to the inner conductor of the coil, the plurality of second conductive strips are distributed in a second ring shape, projection positions on the horizontal plane of the plurality of second conductive strips correspond to the inner conductor of the coil, horizontal projections of the first conductive strips and the second conductive strips are both crossed with a horizontal projection of the inner conductor of the coil, and the first ring shape and the second ring shape are coaxially arranged;

the included angle direction between each first conductive strip and the radial direction of the first ring is the same as each other, the included angle direction between each second conductive strip and the radial direction of the second ring is the same as each other, the included angle direction between the first conductive strips and the radial direction of the first ring is opposite to the included angle direction between the second conductive strips and the radial direction of the second ring, the first connecting columns extend along the vertical direction, one end of each adjacent first conductive strip, which is inclined to each other, is connected with the two ends of the same second conductive strip through one first connecting column respectively, and one end of each adjacent second conductive strip, which is inclined to each other, is connected with the two ends of the same first conductive strip through one first connecting column respectively;

the end, corresponding to the first end of the spiral part, of the first conductive strip or the second conductive strip, which deviates from the adjacent conductive strip, is connected with the first end of the wire in the coil through the second connecting column, and the end, corresponding to the second end of the spiral part, of the first conductive strip or the second conductive strip, which deviates from the adjacent conductive strip, is used for being connected with the detection circuit.

Optionally, the electromagnetic sensing assembly further includes two detection terminal posts, the spiral portion and the coil inner lead are disposed inside the carrier tray, top ends of the two detection terminal posts are respectively connected to a second end of the corresponding spiral portion and a second end of the coil inner lead, and bottom ends of the two detection terminal posts extend out from a bottom surface of the carrier tray; the second end of the spiral part and the second end of the lead in the coil are respectively connected with the detection circuit through one detection terminal post.

Optionally, the coil and the in-coil conductor are located below the carrier platter.

Optionally, the surfaces of the helical portion and the coil inner conductor are coated with an insulating layer.

Optionally, the electromagnetic sensing assembly further includes two detection terminal posts, top ends of the two detection terminal posts are respectively connected to the second end of the spiral portion and the second end of the coil inner lead, and bottom ends of the two detection terminal posts are used for being connected to the detection circuit.

Optionally, the radio frequency terminal post is made of a non-magnetic metal material.

As a second aspect of the present invention, there is provided a semiconductor chamber comprising a chamber body and a power supply assembly, and further comprising the aforementioned chucking device, wherein the carrier plate is disposed in the chamber body.

As a third aspect of the present invention, there is provided a method of manufacturing a chuck apparatus for manufacturing the chuck apparatus described above, the method including:

preparing the spiral part and the coil inner lead by adopting a metal lead, wherein the spiral part surrounds the corresponding coil inner lead and extends spirally along the extending direction of the coil inner lead, and the first end of the spiral part is connected with the first end of the coil inner lead; fixedly connecting the top end of each detection terminal column with the second end of the corresponding spiral part and the second end of the lead in the coil respectively;

embedding a first electrode, a radio frequency terminal column and each corresponding electromagnetic sensing assembly into chuck slurry, enabling a lead in the coil to surround the corresponding radio frequency terminal column, and enabling the bottom end of each detection terminal column to extend out;

and sintering the chuck slurry to form the bearing disc, and enabling the bottom end of each detection terminal post to extend out of the bottom surface of the bearing disc to obtain the chuck device.

As a fourth aspect of the present invention, there is provided a method of manufacturing a chuck apparatus, the method including:

manufacturing a bearing plate base body, wherein at least one radio frequency terminal post and at least one pair of detection terminal posts are arranged in the bearing plate base body and correspond to the radio frequency terminal posts one by one, and the bottom end of each radio frequency terminal post and the bottom end of each detection terminal post extend out of the bottom surface of the bearing plate base body;

manufacturing at least one group of first conductive strips which correspond to the positions of the radio-frequency terminal posts one by one on the bearing disc base body, wherein each first conductive strip in each group extends along the horizontal direction, a plurality of first conductive strips in each group are distributed along the circumferential direction of the corresponding radio-frequency terminal posts in a surrounding mode, and the included angle directions between each first conductive strip and the radial direction of the corresponding radio-frequency terminal posts in the surrounding mode are the same; one end of one of the first conductive strips in each group serves as a second end of the spiral part, the second end of the spiral part is connected with the top end of the corresponding detection terminal column of the group, the other end of the first conductive strip is connected with a first connecting column, and the first connecting column extends in the vertical direction;

connecting one first connecting column to each end of the other first conductive strips;

filling chuck slurry on the bearing disc base body until the part of the chuck slurry is submerged in each first connecting column, and sintering to thicken the bearing disc base body;

manufacturing at least one coil inner lead corresponding to each group of first conductive strips one by one on the bearing disc base body, enabling second ends of the coil inner leads to be connected with the top end of the corresponding other detection terminal post, enabling horizontal projections of the first conductive strips to be crossed with the horizontal projection of the corresponding coil inner lead, connecting a second connecting post with the first end of the coil inner lead, extending the second connecting post along the vertical direction, and enabling the top end of the second connecting post to be flush with the top end of each first connecting post;

filling chuck slurry into the bearing disc base body until the top ends of the second connecting columns and the top end of each first connecting column are just exposed, and sintering to thicken the bearing disc base body;

at least one group of second conductive strips which are in one-to-one correspondence with each group of first conductive strips are manufactured on a base body of the bearing disc, each second conductive strip extends along the horizontal direction, a plurality of second conductive strips in each group are distributed along the circumferential direction around the corresponding radio frequency terminal post, the included angle directions between the radial directions of the second conductive strips and the corresponding radio frequency terminal post in the surrounding mode are the same, the horizontal projection of the second conductive strips is crossed with the horizontal projection of the wire in the coil, the included angle direction between the radial direction of the first conductive strips in each group is opposite to the included angle direction between the radial direction of the second conductive strips in the corresponding group, one end of one second conductive strip in each group is used as the first end of the spiral part, and the first end of the spiral part is connected with the first end of the wire in the coil through the corresponding second connecting post, the other end of the second conductive strip is connected with one first conductive strip through the first connecting column, and the two ends of the other second conductive strips are connected with the two first conductive strips through the two first connecting columns.

In the semiconductor chamber, the manufacturing method of the chuck device and the manufacturing method of the chuck device provided by the invention, the chuck device comprises the bearing disc and the electromagnetic sensing assembly, and the electromagnetic sensing assembly can respond to a magnetic field generated by current on a connecting circuit between the power supply assembly and the first electrode when the power supply assembly provides a radio-frequency signal to the first electrode to generate a corresponding electric signal, so that the corresponding detection circuit in the chamber can be used for monitoring the magnitude of the radio-frequency current in real time according to the electric signal. And, in the invention, the electromagnetic sensing assembly is integrated on the chuck device and detects the current based on the electromagnetic induction principle, compared with the scheme of detecting the current through the current inductor connected to the output end of the matcher in the prior art, the detection result of the electromagnetic sensing assembly is not influenced by the cable between the matcher and the first electrode, so that the interference of a radio frequency loop is less, and the detection precision of the radio frequency current is improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic structural diagram of a chuck assembly according to an embodiment of the present invention;

FIG. 2 is a schematic structural view of a chuck assembly according to another embodiment of the present invention;

FIG. 3 is a schematic structural view of a chuck assembly according to another embodiment of the present invention;

FIG. 4 is a schematic structural view of a chuck assembly according to another embodiment of the present invention;

FIG. 5 is a schematic structural view of a chuck assembly according to another embodiment of the present invention;

FIG. 6 is a schematic structural view of a chuck assembly according to another embodiment of the present invention;

FIG. 7 is a schematic structural view of a chuck assembly according to another embodiment of the present invention;

FIG. 8 is a schematic structural view of a chuck assembly according to another embodiment of the present invention;

FIG. 9 is a schematic diagram illustrating the position relationship between the Rogowski coil and other structures in the electromagnetic sensing assembly of the chuck apparatus according to an embodiment of the present invention;

FIG. 10 is a schematic diagram of the position relationship between the Rogowski coil and other structures in the electromagnetic sensing assembly of the chuck device according to another embodiment of the present invention;

fig. 11 is a schematic view of a positional relationship between an electromagnetic sensing element in a chuck apparatus according to an embodiment of the present invention and another structure;

FIG. 12 is a schematic diagram of a semiconductor chamber according to one embodiment of the present invention;

FIG. 13 is a schematic diagram of a semiconductor chamber according to another embodiment of the present invention;

FIG. 14 is a schematic structural diagram of an electromagnetic sensing assembly in a side view of a chucking device according to an embodiment of the present invention;

FIG. 15 is a schematic view of a step in a method of making a chuck assembly according to an embodiment of the present invention;

FIG. 16 is a schematic view of another step in the method of making a chuck assembly according to an embodiment of the present invention;

FIG. 17 is a schematic view of another step in the method of making a chuck assembly according to an embodiment of the present invention;

FIG. 18 is a schematic view of another step in the method of making a chuck assembly according to an embodiment of the present invention;

FIG. 19 is a schematic view of a step in a method of making a chuck assembly according to an embodiment of the present invention;

fig. 20 is a schematic view of another step of the method for manufacturing the chuck apparatus according to the embodiment of the present invention.

Detailed Description

The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.

In order to solve the above technical problem, as an aspect of the present invention, there is provided a chuck apparatus, as shown in fig. 1 to 8, the chuck apparatus includes a carrier plate 100, at least one first electrode 110 is disposed inside the carrier plate 100, and the first electrode 110 is configured to be connected to a power supply component of a semiconductor chamber to receive a radio frequency signal provided by the power supply component. The chuck device further comprises at least one electromagnetic sensing assembly 200, wherein the electromagnetic sensing assemblies 200 are arranged corresponding to the first electrodes 110 one by one, and the electromagnetic sensing assemblies 200 can respond to a magnetic field generated by current between the power supply assembly and the first electrodes 110 and generate an electric signal corresponding to a radio frequency signal.

In the present invention, the chuck apparatus includes a carrier plate 100 and an electromagnetic sensing assembly 200, and the electromagnetic sensing assembly 200 is capable of generating a corresponding electrical signal in response to a magnetic field generated by a current on a connection circuit between the power supply assembly and the first electrode 110 when the power supply assembly provides a radio frequency signal to the first electrode 110, so that the magnitude of the radio frequency current can be monitored in real time by a corresponding detection circuit (e.g., the detection circuit 300 shown in fig. 12 and 13) in the chamber according to the electrical signal. Moreover, in the present invention, the electromagnetic sensing assembly 200 is integrated on the chuck apparatus and detects current based on the electromagnetic induction principle, and compared with the scheme in the prior art that current is detected by a current inductor connected to the output end of the matcher, the detection result of the electromagnetic sensing assembly 200 is not affected by the cable between the matcher and the first electrode 110, so that the interference from the rf loop is less, and the detection accuracy of the rf current is improved.

As an alternative embodiment of the present invention, as shown in fig. 1 to 8, the chuck device further includes rf terminal posts 111 corresponding to the first electrodes 110 one to one, top ends of the rf terminal posts 111 are connected to the corresponding first electrodes 110, bottom ends of the rf terminal posts 111 extend from a bottom surface of the carrier tray 100, and the first electrodes 110 are connected to the power supply assembly through the corresponding rf terminal posts 111; the electromagnetic sensing assembly 200 is capable of generating an electrical signal corresponding to a radio frequency signal in response to a magnetic field generated by a current in the radio frequency terminal post 111.

That is, in the embodiment of the present invention, the electromagnetic sensing assembly 200 is used to detect the current on the rf terminal post 111 connected to the corresponding first electrode 110, so that the detection circuit 300 of the semiconductor chamber determines the current in the rf terminal post 111 (i.e. the rf current applied to the first electrode 110) according to the electrical signal generated by the electromagnetic sensing assembly 200 in response to the magnetic field generated by the connection line 440.

As an alternative embodiment of the present invention, the electromagnetic sensing assembly 200 includes a rogowski coil structure surrounding the corresponding rf terminal post 111, and senses the magnetic field variation around the rf terminal post 111 through the rogowski coil structure and generates an electrical signal, specifically:

as shown in fig. 9 and 10, the electromagnetic sensing assembly 200 includes a spiral portion 211 and an inner coil conductive wire 212, the inner coil conductive wire 212 surrounds the corresponding rf terminal post 111, the spiral portion 211 surrounds the corresponding inner coil conductive wire 212 and extends spirally (or extends approximately spirally) along the extending direction of the inner coil conductive wire 212, a first end of the spiral portion 211 is connected to a first end of the inner coil conductive wire 212, and a second end of the spiral portion 211 and a second end of the inner coil conductive wire 212 are used for connecting to the detection circuit 300, so that the detection circuit 300 can determine the current in the rf terminal post 111 according to the electrical signals generated on the spiral portion 211 and the inner coil conductive wire 212.

In the embodiment of the present invention, the electromagnetic sensing assembly 200 includes a spiral portion 211 and an inner coil conducting wire 212, and the spiral portion 211 and the inner coil conducting wire 212 form a rogowski coil 210, so that when a radio-frequency current flows through the radio-frequency terminal post 111, the rogowski coil 210 can respond to a change of a magnetic field in a volume surrounded by the rogowski coil 210 to generate a corresponding electrical signal, and further, a radio-frequency signal loaded onto the first electrode 110 through the radio-frequency terminal post 111 can be determined by the detection circuit 300 according to the electrical signal based on faraday electromagnetic induction principle and ampere loop law.

Specifically, when an alternating radio frequency current passes through the radio frequency terminal post 111, two poles of the rogowski coil 210 generate corresponding induced electromotive forces, so that a potential difference is generated between two ends of the rogowski coil 210 (i.e., the second end of the spiral part 211 and the second end of the coil inner lead 212), and the magnitude of the radio frequency current passing through the radio frequency terminal post 111 can be calculated through measurement and conversion of the detection circuit 300, thereby realizing real-time detection of the radio frequency current. The magnitude of the loaded radio frequency current value can be read out from the host machine through the digital signal processing in the detection circuit 300, and then the magnitude of the current value is acquired through the central control machine, so that the numerical value of the radio frequency current in the acquisition process can be monitored in real time.

In some embodiments of the present invention, the rogowski coil 210 is integrated inside the carrier tray 100, and specifically, as shown in fig. 1, 2 and 12, the electromagnetic sensing assembly 200 further includes two detection terminal posts 220, the spiral portion 211 and the coil inner lead 212 are disposed inside the carrier tray 100, top ends of the two detection terminal posts 220 are respectively connected to a second end of the corresponding spiral portion 211 and a second end of the coil inner lead 212, and bottom ends of the two detection terminal posts 220 extend out from a bottom surface of the carrier tray 100; the second end of the spiral portion 211 and the second end of the coil inner lead 212 are connected to the detection circuit 300 through one detection terminal post 220, respectively.

As an alternative embodiment of the present invention, as shown in fig. 14, the spiral portion 211 and the coil inner lead 212 are both metal leads, and the electromagnetic sensing assembly 200 may be pre-fabricated and then embedded in a slurry, and then sintered in one step to form the carrier tray 100 in the semiconductor chamber provided in the embodiment of the present invention.

Optionally, the material of the main body of the carrier tray 100 is a ceramic material, and the chuck slurry is a ceramic slurry.

Optionally, the material of the rf terminal post 111 is a non-magnetic metal material

Preferably, the rogowski coil 210 and the detection terminal post 220 are made of non-magnetic metal materials, so as to ensure the current detection accuracy.

As another alternative embodiment of the present invention, as shown in fig. 15 to fig. 20, the spiral portion 211 includes a second connection column 211c, a plurality of first conductive strips 211a, a plurality of second conductive strips 211d, and a plurality of first connection columns 211b, the first conductive strips 211a and the second conductive strips 211d both extend along the horizontal direction and are respectively located at two sides of the coil inner conductive line 212 along the height direction, the plurality of first conductive strips 211a are distributed in a first ring shape and have projection positions on the horizontal plane corresponding to the coil inner conductive line 212, the plurality of second conductive strips 211d are distributed in a second ring shape and have projection positions on the horizontal plane corresponding to the coil inner conductive line 212, horizontal projections of the first conductive strips 211a and the second conductive strips 211d both cross the horizontal projection of the coil inner conductive line 212, and the first ring shape and the second ring shape are coaxially arranged;

the included angle between each first conductive strip 211a and the radial direction of the first ring is the same as each other (for example, as shown in fig. 15, the included angle between the first conductive strip 211a and the radial direction of the first ring in a top view is a clockwise direction), the included angle between each second conductive strip 211d and the radial direction of the second ring is the same as each other (for example, as shown in fig. 18, the included angle between the second conductive strip 211d and the radial direction of the second ring in a top view is a counterclockwise direction), the included angle between the first conductive strip 211a and the radial direction of the first ring is opposite to the included angle between the second conductive strip 211d and the radial direction of the second ring (for example, as shown in fig. 18, the first conductive strips 211a are inclined in a clockwise direction, the second conductive strips 211d are inclined in a counterclockwise direction), the first connecting column 211b extends in a vertical direction, one end of each of two adjacent first conductive strips 211a, which is inclined to the other end, is connected to two ends of the same second conductive strip 211d through a first connecting post 211b, and one end of each of two adjacent second conductive strips 211d, which is inclined to the other end, is connected to two ends of the same first conductive strip 211a through a first connecting post 211 b;

the end of first conductive strip 211a or second conductive strip 211d that faces away from the adjacent conductive strip (i.e., first conductive strip 211a or second conductive strip 211d within the same group (within the same spiral 211)) corresponding to the first end of spiral 211 is connected to the first end of inner coil conductor 212 through second connection post 211c, and the end of first conductive strip 211a or second conductive strip 211d that faces away from the adjacent conductive strip corresponding to the second end of spiral 211 is used for connection to detection circuit 300.

That is, in the embodiment of the present invention, the spiral portion 211 of the rogowski coil 210 is formed by connecting a plurality of first conductive strips 211a and a plurality of second conductive strips 211d extending horizontally in a staggered manner through a plurality of first connecting columns 211b, and the height of the conductive wire 212 in the coil is located between the first conductive strips 211a and the second conductive strips 211d, so that when the rogowski coil 210 is integrated inside the carrier tray 100, the chuck apparatus provided in the embodiment of the present invention can be manufactured layer by layer in a continuous patterning manner, and at this time, one end of the first conductive strip 211a or the second conductive strip 211d, which is opposite to the second end of the spiral portion 211, in the carrier tray 100 is connected to the top end of the detecting terminal column 220 so as to be connected to the detecting circuit 300 through the detecting terminal column 220. The intra-coil wire 212 may be fabricated in the form of a conductive film layer during a layered fabrication process.

In the embodiment of the present invention, the spiral part 211 of the rogowski coil 210 is formed by connecting a plurality of first conductive strips 211a extending horizontally and a plurality of second conductive strips 211d in a staggered manner through a plurality of first connecting posts 211b, so that the structure of the rogowski coil 210 can be manufactured in a layered composition manner, the accuracy of the structure of the rogowski coil 210 is greatly improved, and the accuracy of detecting the radio frequency current is further ensured.

As an alternative embodiment of the present invention, the integrity of the structural function of the rogowski coil 210 can be judged by testing the electrical conduction between the two detection terminal posts 220.

In other embodiments of the present invention, the electromagnetic sensing assembly 200 may also be disposed outside the carrier platter 100, and specifically, as shown in fig. 3 to 8 and 13, the rogowski coil 210 (i.e., the spiral portion 211 and the coil inner lead 212) is located below the carrier platter 100.

Optionally, as shown in fig. 5, 6, and 8, the electromagnetic sensing assembly 200 further includes two detection terminal posts 220, top ends of the two detection terminal posts 220 are respectively connected to the second end of the corresponding spiral portion 211 and the second end of the coil inner lead 212, and bottom ends of the two detection terminal posts 220 are used for being connected to the detection circuit 300. Alternatively, as shown in fig. 3, 4 and 7, both ends of the rogowski coil 210 may be directly connected to the detection circuit 300 through the detection line 310, that is, both ends of the rogowski coil 210 may not be provided with the detection terminal posts 220.

In some embodiments of the present invention, the rogowski coil 210 having the spiral portion 211 comprising the first conductive strip 211a and the second conductive strip 211d may also be disposed under the carrier tray 100 after the fabrication process is completed. Alternatively, as another alternative embodiment of the present invention, the rogowski coil 210 (i.e., the spiral portion 211 and the coil inner wire 212) may be formed by wire winding.

In a preferred embodiment of the present invention, the surfaces of the spiral portion 211 and the coil inner lead 212 are coated with an insulating layer to prevent a short circuit from occurring inside the rogowski coil 210 or between the rogowski coil 210 and the rf terminal post 111. For example, the rogowski coil 210 may alternatively be wound from a wire having an insulating layer sheath.

Optionally, the insulating layer may be made of glass fiber.

In some embodiments of the present invention, as shown in fig. 2 to 5 and 12, at least one second electrode 120 is further disposed in the susceptor 100, and the second electrode 120 is used for being connected to a clamping power source 430 of the semiconductor chamber, so that the clamping power source 430 loads a dc voltage signal to the second electrode 120 to clamp the wafer on the susceptor 100 through electrostatic clamping.

As an alternative embodiment of the present invention, as shown in fig. 2 to 5 and 12, a pair of second electrodes 120 and two second terminal posts 121 corresponding to the second electrodes 120 are disposed in the carrier tray 100, the top ends of the second terminal posts 121 are connected to the corresponding second electrodes 120, the bottom ends of the second terminal posts 121 extend from the bottom surface of the carrier tray 100, and the two second electrodes 120 are respectively connected to the output end of the absorption power source 430 through one second terminal post 121 and one connection line 440, so that the absorption power source 430 can load dc voltage signals with the same absolute value and opposite polarities to each other to the two second electrodes 120, and the polarities of the voltages between the two electrodes are inverted each time a wafer is absorbed, thereby ensuring that charges are not accumulated on the electrostatic chuck due to the long-time voltage application.

In other embodiments of the present invention, the first electrodes 110 can be used as both the absorption electrode and the rf electrode, and specifically, as shown in fig. 1, 6 to 8, 12 and 13, a pair of first electrodes 110 is disposed in the carrier tray 100, and two first electrodes 110 can be designed as a double "D" structure, or as an inner and outer nested structure. The adsorption power source 430 loads the direct current voltage signals with the same absolute value and opposite positive and negative values to the two first electrodes 110 through the two radio frequency terminal columns 111 respectively, and when a wafer is adsorbed each time, the positive and negative voltages between the two electrodes are reversed, so that the electrostatic chuck is prevented from accumulating charges due to long-time voltage application.

It should be noted that the current generated when the absorption power source 430 applies the dc voltage signal to the first electrode 110 is usually in the microampere level, and the rf current can reach several tens of amperes, so that the current detection accuracy of the rf signal detected by the rogowski coil 210 is not affected when the first electrode 110 is used as both the absorption electrode and the rf electrode.

As an optional embodiment of the present invention, as shown in fig. 12 and 13, the power supply assembly includes a radio frequency power source 410, a coaxial cable 411, a matcher 420, a radio frequency connection line 421 and a pair of dc blocking capacitors 422, which are sequentially connected, a radio frequency signal of the radio frequency power source 410 is transmitted to the matcher 420 through the coaxial cable 411, is output through the radio frequency connection line 421 after being adjusted by the matcher 420, and the radio frequency connection line 421 is connected to one connection line 440 through each dc blocking capacitor 422, so that the common connection line 440 simultaneously transmits the radio frequency signal and a dc signal to the first electrode 110, and simultaneously prevents signal interference between dc signals of the two connection lines 440.

As an alternative embodiment of the present invention, as shown in fig. 4, 5, 7, 8, 12 and 13, the chuck apparatus further includes a routing flange 130, wherein the routing flange 130 has an inner cavity for accommodating the connecting wires 440, the inner cavity has openings formed at both the top end and the bottom end of the routing flange 130, and the top opening of the routing flange 130 is hermetically connected to the bottom of the carrier platter 100 for preventing the bottom wires of the carrier platter 100 from contacting the process gas inside the semiconductor chamber cavity 500.

Specifically, as shown in fig. 12 and 13, the bellows 140 of the semiconductor chamber is connected between the routing flange 130 and the bottom opening of the cavity 500 thereof, and can synchronously extend and contract with the lifting of the carrier tray 100, and the bottom end of the routing flange 130 can penetrate through the bottom opening of the cavity 500 and extend out of the cavity 500, so that the chuck device is connected with the external circuits such as the adsorption power source 430, the power supply assembly, and the detection circuit 300, and the like, and the sealing performance of the semiconductor chamber is maintained.

As an alternative embodiment of the present invention, a plurality of bumps 101 are formed on the surface of the carrier tray 100, and the bumps 101 are closely related to the electrostatic force of the carrier tray 100, that is, the height and the area ratio of the bumps 101 are adjusted to change the magnitude of the adsorption force of the carrier tray 100 under the process adsorption voltage, and the higher the bumps 101 are, the smaller the area ratio of the bumps 101 is, the lower the adsorption force of the electrostatic chuck 100 is. Meanwhile, the salient points 101 on the surface of the carrier tray 100 can also enable the gas in the back blowing holes 105 to be uniformly diffused to the surface of the carrier tray 100, so that the gas serving as a heat-conducting medium is uniformly distributed, and the wafer is heated more uniformly.

As a second aspect of the present invention, there is provided a semiconductor chamber including a chamber body 500, a chucking apparatus according to an embodiment of the present invention, and a power supply assembly for supplying a radio frequency signal to a first electrode 110 in the chucking apparatus. The semiconductor chamber further includes a detection circuit 300 for determining the magnitude of the rf current based on the electrical signal generated by the electromagnetic sensing assembly 200.

In the semiconductor chamber provided by the present invention, the chuck apparatus includes a carrier plate 100 and an electromagnetic sensing assembly 200, and the electromagnetic sensing assembly 200 is capable of generating a corresponding electrical signal in response to a magnetic field generated by a current on a connection circuit between the power supply assembly and the first electrode 110 when the power supply assembly provides a radio frequency signal to the first electrode 110, so that the detection circuit 300 can monitor the magnitude of the radio frequency current in real time according to the electrical signal. In addition, in the semiconductor chamber provided by the present invention, the electromagnetic sensing assembly 200 is integrated on the chuck device and detects current based on the electromagnetic induction principle, and compared with the scheme of detecting current through the current inductor connected to the output end of the matcher in the prior art, the detection result of the electromagnetic sensing assembly 200 is not affected by the cable between the matcher and the first electrode 110, so that the interference of the radio frequency loop is less, and the detection accuracy of the radio frequency current is improved.

As a third aspect of the present invention, there is provided a method of manufacturing a chuck apparatus for manufacturing an embodiment in which the base end of the rf terminal post 111 protrudes from the bottom surface of the carrier plate 100 and the electromagnetic sensor unit 200 is manufactured in advance, the method including:

step S01, preparing a spiral part 211 and an inner coil conductor 212 by using a metal conductor, wherein the spiral part 211 surrounds the corresponding inner coil conductor and extends spirally along the extending direction of the inner coil conductor 212, and a first end of the spiral part 211 is connected with a first end of the inner coil conductor 212; fixedly connecting the top end of each detection terminal post 220 with the second end of the corresponding spiral part 211 and the second end of the coil inner lead 212 (i.e. fixedly connecting with the two ends of the rogowski coil 210, for example, by welding (optionally soldering));

step S02, burying the first electrode 110, the rf terminal post 111 and each corresponding electromagnetic sensing component 200 in a chuck slurry, and making the coil inner lead 212 surround the corresponding rf terminal post 111, and the bottom end of each detecting terminal post 220 extends out;

step S03, sintering the chuck slurry to form the carrier tray 100, and extending the bottom end of each probe terminal post 220 out of the bottom surface of the carrier tray 100 to obtain the chuck assembly.

The chuck device manufactured by the manufacturing method of the chuck device provided by the invention comprises the carrier plate 100 and the electromagnetic sensing assembly 200, wherein the electromagnetic sensing assembly 200 can respond to a magnetic field generated by current on a connecting circuit between the power supply assembly and the first electrode 110 when the power supply assembly provides a radio-frequency signal to the first electrode 110, so that a corresponding detection circuit (for example, the detection circuit 300 shown in fig. 12 and 13) in the chamber can be used for monitoring the magnitude of the radio-frequency current in real time according to the electric signal. Moreover, in the present invention, the electromagnetic sensing assembly 200 is integrated on the chuck apparatus and detects current based on the electromagnetic induction principle, and compared with the scheme in the prior art that current is detected by a current inductor connected to the output end of the matcher, the detection result of the electromagnetic sensing assembly 200 is not affected by the cable between the matcher and the first electrode 110, so that the interference from the rf loop is less, and the detection accuracy of the rf current is improved.

As an alternative embodiment of the present invention, in the case that the second electrode 120 and the second terminal post 121 are further disposed inside the carrier tray 100, the manufacturing method further includes a step of sintering these structures in the carrier tray 100.

As a third aspect of the present invention, there is provided a method for manufacturing a chuck device in an embodiment in which the bottom end of the rf terminal post 111 protrudes from the bottom surface of the carrier tray 100, and the spiral portion 211 includes a second connection post 211c, a first conductive strip 211a, a second conductive strip 211d, and a first connection post 211b, the method comprising:

step S1, manufacturing a carrier tray base body, wherein the carrier tray base body is provided with a radio frequency terminal post 111 and at least one pair of detection terminal posts 220 corresponding to the radio frequency terminal post 111 one by one, and the bottom ends of each radio frequency terminal post 111 and each detection terminal post 220 extend out of the bottom surface of the carrier tray base body;

step S2, manufacturing at least one set of first conductive strips 211a (as shown in fig. 15) corresponding to the positions of the rf terminal posts 111 one by one on the carrier substrate, where each first conductive strip 211a extends along the horizontal direction, and the plurality of first conductive strips 211a in each set are distributed along the circumferential direction around the corresponding rf terminal post 111, the included angle directions between each first conductive strip 211a and the radial direction around the corresponding rf terminal post 111 are the same, one end of one first conductive strip 211a in the plurality of first conductive strips 211a in each set is used as the second end of the spiral part 211, the second end of the spiral part 211 is connected to the top end of a corresponding one of the detection terminal posts 220, the other end of the first conductive strip 211a is connected to the first connection post 211b, and the first connection post 211b extends along the vertical direction;

step S3, connecting a first connecting post 211b to each end of the other first conductive strips 211a (i.e. connecting a first connecting post 211b to the other end except for the end of the first conductive strip 211a corresponding to the first end of the spiral part 211, as shown in fig. 16);

step S4, filling the chuck slurry into the carrier tray substrate until the chuck slurry partially passes through each connecting post first connecting post 211b (for example, when the length of the second connecting post 211c is half of the length of the first connecting post 211b, the height of the chuck slurry filled in this step can be half of the height of the first connecting post 211 b), and sintering to thicken the carrier tray substrate;

step S5, fabricating at least one coil inner conductive line 212 corresponding to each group of first conductive bars 211a on the carrier substrate (as shown in fig. 19), connecting the second end of the coil inner conductive line 212 to the top end of another corresponding detecting terminal post 220, wherein the horizontal projection of the first conductive bar 211a intersects the horizontal projection of the coil inner conductive line 212, and connects a second connecting post 211c at the first end of the coil inner conductive line 212 (as shown in fig. 17 and 20), the second connecting post 211c extends along the vertical direction, and the top end of the second connecting post 211c is flush with the top end of each first connecting post 211 b;

step S6, filling the chuck slurry into the carrier substrate until the top ends of the second connection posts 211c and the top end of each first connection post 211b are just exposed, and sintering to thicken the carrier substrate;

step S7, manufacturing at least one set of second conductive strips 211d (as shown in fig. 18) corresponding to each set of first conductive strips 211a on the substrate of the carrier tray, where each second conductive strip 211d extends along the horizontal direction, and the plurality of second conductive strips 211d in each set are distributed along the circumferential direction around the corresponding rf terminal post 111, the included angle directions between the plurality of second conductive strips 211d in each set and the radial direction around the corresponding rf terminal post 111 are the same as each other, the horizontal projection of the second conductive strips 211d intersects the horizontal projection of the conductive wire 212 in the coil, the included angle direction between the first conductive strips 211a in each set and the radial direction is opposite to the included angle direction between the second conductive strips 211d in the corresponding set and the radial direction, one end of one of the second conductive strips 211d in each set is used as the first end of the spiral portion 211, and the first end of the spiral portion 211 passes through the corresponding second connection post 211c and the first end of the conductive wire 212 in the coil The first ends of the second conductive strips 211d are connected, the other end of each second conductive strip 211d is connected to one first conductive strip 211a through the first connecting column 211b, and the two ends of each of the other second conductive strips 211d are connected to two first conductive strips 211a through the two first connecting columns 211 b.

In the chuck device manufactured by the manufacturing method of the chuck device, the electromagnetic sensing assembly 200 detects current based on the electromagnetic induction principle, the interference of a radio frequency loop is small, the manufacturing cost is low, the detection precision of the radio frequency current is improved, and the material cost of a semiconductor cavity is reduced.

Moreover, the spiral part 211 of the rogowski coil 210 is formed by connecting a plurality of first conductive strips 211a extending horizontally with a plurality of second conductive strips 211d in a staggered manner through a plurality of first connecting columns 211b, and the structure of the rogowski coil 210 is manufactured in a layered composition manner, so that the accuracy of the structure of the rogowski coil 210 is greatly improved, and the accuracy of detecting the radio-frequency current is further ensured.

As an alternative embodiment of the present invention, first conductive strips 211a and second conductive strips 211d are manufactured by a screen printing method.

It should be noted that, in the case that the first electrode 110 is connected to the detection circuit 300 through the rf terminal post 111, the rf terminal post 111 is embedded in the base body of the carrier tray, and after step S7, the first electrode 110 and the rf terminal post 111 are connected and sintered to be thickened, so as to obtain a complete chuck device. As an alternative embodiment of the present invention, in the case that the second electrode 120 and the second terminal post 121 are further disposed inside the carrier tray 100, the manufacturing method further includes a step of sintering these structures in the carrier tray 100.

To ensure the structural and functional integrity of the rogowski coil 210, as a preferred embodiment of the present invention, the method further includes providing a potential difference between each pair of the detection terminal posts 220 after the fabrication is completed, and detecting the current flowing through the rogowski coil 210 to determine whether the two detection terminal posts 220 corresponding to each rogowski coil 210 are conducted.

It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (12)

1. The chuck device is characterized by further comprising at least one electromagnetic sensing assembly, wherein the electromagnetic sensing assembly is in one-to-one correspondence with the first electrodes, and can respond to a magnetic field generated by current between the power supply assembly and the first electrodes to generate an electric signal corresponding to the radio-frequency signal.

2. The chuck device according to any one of claims 1 to 1, further comprising rf terminal posts corresponding to the first electrodes one by one, wherein top ends of the rf terminal posts are connected to the corresponding first electrodes, bottom ends of the rf terminal posts extend from a bottom surface of the carrier plate, and the first electrodes are connected to the power supply assembly through the corresponding rf terminal posts; the electromagnetic sensing assembly is capable of generating an electrical signal corresponding to the radio frequency signal in response to a magnetic field generated by the current in the radio frequency terminal post.

3. The chuck device according to claim 2, wherein the electromagnetic sensing assembly includes a coil portion and an inner coil wire, the inner coil wire surrounds the corresponding rf terminal post, the coil portion surrounds the corresponding inner coil wire and extends spirally along the extending direction of the inner coil wire, a first end of the coil portion is connected to a first end of the inner coil wire, and a second end of the coil portion and a second end of the inner coil wire are both configured to be connected to a detection circuit, so that the detection circuit can determine the current in the rf terminal post according to the electrical signals generated on the coil portion and the inner coil wire.

4. The chuck device according to claim 3, wherein the spiral portion comprises a second connecting column, a plurality of first conductive strips, a plurality of second conductive strips and a plurality of first connecting columns, the first conductive strips and the second conductive strips extend along a horizontal direction and are respectively located at two sides of the wire in the coil along a height direction, the plurality of first conductive strips are distributed in a first ring shape, and a projection position on a horizontal plane corresponds to the wire in the coil, the plurality of second conductive strips are distributed in a second ring shape, and a projection position on the horizontal plane corresponds to the wire in the coil, the horizontal projections of the first conductive strips and the second conductive strips are intersected with a horizontal projection of the wire in the coil, and the first ring shape and the second ring shape are coaxially arranged;

the included angle direction between each first conductive strip and the radial direction of the first ring is the same as each other, the included angle direction between each second conductive strip and the radial direction of the second ring is the same as each other, the included angle direction between the first conductive strips and the radial direction of the first ring is opposite to the included angle direction between the second conductive strips and the radial direction of the second ring, the first connecting columns extend along the vertical direction, one end of each adjacent first conductive strip, which is inclined to each other, is connected with the two ends of the same second conductive strip through one first connecting column respectively, and one end of each adjacent second conductive strip, which is inclined to each other, is connected with the two ends of the same first conductive strip through one first connecting column respectively;

the end, corresponding to the first end of the spiral part, of the first conductive strip or the second conductive strip, which deviates from the adjacent conductive strip, is connected with the first end of the wire in the coil through the second connecting column, and the end, corresponding to the second end of the spiral part, of the first conductive strip or the second conductive strip, which deviates from the adjacent conductive strip, is used for being connected with the detection circuit.

5. The chuck device according to claim 3 or 4, wherein the electromagnetic sensing assembly further comprises two detecting terminal posts, the spiral portion and the coil inner conductor are disposed inside the carrier plate, top ends of the two detecting terminal posts are respectively connected to a second end of the spiral portion and a second end of the coil inner conductor, and bottom ends of the two detecting terminal posts protrude from a bottom surface of the carrier plate; the second end of the spiral part and the second end of the lead in the coil are respectively connected with the detection circuit through one detection terminal post.

6. The chuck assembly according to claim 3 or 4, wherein the helical portion and the coil inner wire are located below the carrier platter.

7. The chuck assembly according to claim 6, wherein the spiral portion and the surface of the wire in the coil are coated with an insulating layer.

8. The chuck assembly according to claim 6, wherein the electromagnetic sensing assembly further comprises two detecting terminal posts, top ends of the two detecting terminal posts are respectively connected to the second ends of the spiral portion and the second end of the wire in the coil, and bottom ends of the two detecting terminal posts are used for being connected to the detection circuit.

9. The chuck assembly as in claim 2, wherein said rf terminal posts are made of a non-magnetic metal material.

10. A semiconductor chamber comprising a chamber body and a power supply assembly, further comprising the chucking device of any of claims 1-9, wherein the carrier plate is disposed in the chamber body.

11. A method of manufacturing a chucking device, characterized in that the method of manufacturing a chucking device is used for manufacturing the chucking device of claim 5, and the method of manufacturing includes:

preparing the spiral part and the coil inner lead by adopting a metal lead, wherein the spiral part surrounds the corresponding coil inner lead and extends spirally along the extending direction of the coil inner lead, and the first end of the spiral part is connected with the first end of the coil inner lead; fixedly connecting the top end of each detection terminal post with the second end of the corresponding spiral part and the second end of the lead in the coil respectively;

embedding a first electrode, a radio frequency terminal column and each corresponding electromagnetic sensing assembly into chuck slurry, enabling a lead in the coil to surround the corresponding radio frequency terminal column, and enabling the bottom end of each detection terminal column to extend out;

and sintering the chuck slurry to form the bearing disc, and enabling the bottom end of each detection terminal post to extend out of the bottom surface of the bearing disc to obtain the chuck device.

12. A manufacturing method of a chuck device is characterized by comprising the following steps:

manufacturing a bearing disc base body, wherein at least one radio frequency terminal post and at least one pair of detection terminal posts which are in one-to-one correspondence with the positions of the radio frequency terminal posts are arranged in the bearing disc base body, and the bottom end of each radio frequency terminal post and the bottom end of each detection terminal post extend out of the bottom surface of the bearing disc base body;

manufacturing at least one group of first conductive strips which correspond to the positions of the radio-frequency terminal posts one by one on the bearing disc base body, wherein each first conductive strip in each group extends along the horizontal direction, a plurality of first conductive strips in each group are distributed along the circumferential direction of the corresponding radio-frequency terminal posts in a surrounding mode, and the included angle directions between each first conductive strip and the radial direction of the corresponding radio-frequency terminal posts in the surrounding mode are the same; one end of one of the first conductive strips in each group serves as a second end of the spiral part, the second end of the spiral part is connected with the top end of the corresponding one of the detection terminal columns in the group, the other end of the first conductive strip is connected with a first connecting column, and the first connecting column extends in the vertical direction;

connecting one first connecting column to each end of the other first conductive strips;

filling chuck slurry on the bearing disc base body until the part of the chuck slurry is submerged in each first connecting column, and sintering to thicken the bearing disc base body;

manufacturing at least one coil inner lead corresponding to each group of first conductive strips one by one on the bearing disc base body, enabling second ends of the coil inner leads to be connected with the top end of the corresponding other detection terminal post, enabling horizontal projections of the first conductive strips to be crossed with the horizontal projection of the corresponding coil inner lead, connecting a second connecting post with the first end of the coil inner lead, extending the second connecting post along the vertical direction, and enabling the top end of the second connecting post to be flush with the top end of each first connecting post;

filling chuck slurry into the bearing disc base body until the top ends of the second connecting columns and the top end of each first connecting column are just exposed, and sintering to thicken the bearing disc base body;

at least one group of second conductive strips which are in one-to-one correspondence with each group of first conductive strips are manufactured on a base body of the bearing disc, each second conductive strip extends along the horizontal direction, a plurality of second conductive strips in each group are distributed along the circumferential direction around the corresponding radio frequency terminal post, the included angle directions between the radial directions of the second conductive strips and the corresponding radio frequency terminal post in the surrounding mode are the same, the horizontal projection of the second conductive strips is crossed with the horizontal projection of the wire in the coil, the included angle direction between the radial direction of the first conductive strips in each group is opposite to the included angle direction between the radial direction of the second conductive strips in the corresponding group, one end of one second conductive strip in each group is used as the first end of the spiral part, and the first end of the spiral part is connected with the first end of the wire in the coil through the corresponding second connecting post, the other end of the second conductive strip is connected with one first conductive strip through the first connecting column, and the two ends of the other second conductive strips are connected with the two first conductive strips through the two first connecting columns.

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