CN114882917A - Solid state disk, server and computer system - Google Patents
Solid state disk, server and computer system Download PDFInfo
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- CN114882917A CN114882917A CN202210467278.4A CN202210467278A CN114882917A CN 114882917 A CN114882917 A CN 114882917A CN 202210467278 A CN202210467278 A CN 202210467278A CN 114882917 A CN114882917 A CN 114882917A
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
- G11C5/10—Arrangements for interconnecting storage elements electrically, e.g. by wiring for interconnecting capacitors
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F2213/0026—PCI express
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
本说明书实施例提供了一种固态硬盘、服务器及计算机系统，其中，所述固态硬盘包括有两种通信接口，分别为PCIe接口和线缆接口，固态硬盘的控制器通过所述PCIe接口与第一连接设备连接，通过所述线缆接口与第二连接设备连接，满足固态硬盘中存储单元对多设备的共享需求，从而使得所述固态硬盘可以应用于例如多服务器通过交换机对固态硬盘进行共享操作的应用场景，扩展了所述固态硬盘的可应用场景，提高了所述固态硬盘的适用性。
The embodiments of this specification provide a solid-state hard disk, a server, and a computer system, wherein the solid-state hard disk includes two communication interfaces, namely a PCIe interface and a cable interface, and the controller of the solid-state hard disk communicates with the first communication interface through the PCIe interface A connection device is connected, and is connected to a second connection device through the cable interface to meet the sharing requirements of the storage unit in the solid-state drive for multiple devices, so that the solid-state drive can be applied to, for example, multiple servers share the solid-state drive through a switch The application scenario of the operation expands the applicable scenarios of the solid-state hard disk and improves the applicability of the solid-state hard disk.
Description
Technical Field
The present disclosure relates to the field of computer technologies, and in particular, to a solid state disk, a server, and a computer system.
Background
Solid State Disks (SSD), also known as Solid State disks or Solid State drives, are Hard disks made of Solid State electronic memory chip arrays, which have the advantages of higher speed, lower power consumption and lower noise compared to the conventional Hard Disk Drives (HDDs). Therefore, solid state disks tend to replace mechanical disks.
With the emergence and continuous development of technologies such as data centers and cloud computing, application scenarios of the solid state disk are more and more abundant, and it is necessary to optimize the solid state disk to meet the use requirements of more application scenarios.
Disclosure of Invention
The embodiment of the specification provides a solid state disk, a server and a computer system, so as to achieve the purpose of enriching the applicable scenes of the solid state disk.
In order to achieve the technical purpose, the embodiments of the present specification provide the following technical solutions:
in a first aspect, an embodiment of the present specification provides a solid state disk, including:
a plurality of memory cells;
a PCIe interface;
a cable interface;
the controller is connected with the first connecting device through the PCIe interface and connected with the second connecting device through the cable interface, and is configured to perform data operation on the storage unit based on a first instruction and/or a second instruction, wherein the first instruction comprises a data operation instruction transmitted by the first connecting device, and the second instruction comprises a data operation instruction transmitted by the second connecting device.
Optionally, the solid state disk further includes: the power management system comprises a capacitor bank and a power management chip, wherein the capacitor bank comprises at least two capacitors; wherein,
the power management chip is connected with the PCIe interface and the capacitor bank, and is configured to receive a first working power supply provided by first connection equipment through the PCIe interface, provide a second working power supply for the capacitor bank and the controller based on the first working power supply, and send a power-fail protection instruction to the controller and provide the second working power supply for the controller based on a third working power supply provided by the capacitor bank when the first working power supply is disconnected;
the controller is further configured to perform cache data storage operation on the storage unit if the power down protection instruction is received.
Optionally, the solid state disk further includes:
the printed circuit board comprises at least two gaps, a first end and a second end, wherein the first end and the second end are arranged oppositely, and the number of the gaps is the same as that of the capacitors in the capacitor bank;
the printed circuit board is used for bearing a PCIe interface, a cable interface, a power management chip and a plurality of storage units;
the capacitor is arranged in the notch, the cable interface is arranged at the first end, the PCIe interface is arranged at the second end, and the storage unit is arranged close to the first end.
Optionally, the storage unit comprises solid particle units, and the storage space in a single solid particle unit is greater than or equal to 4 bits.
Optionally, the solid state disk further includes: the protective shell comprises a first through hole, a second through hole and an accommodating space, the first through hole and the second through hole are respectively used for setting a PCIe interface and a cable interface, and the accommodating space is used for setting the controller and the plurality of storage units;
the storage unit is in at least partial contact with the protective housing.
Optionally, the length of the protective housing is greater than 100mm, the width of the protective housing is greater than 15mm, and the height of the protective housing is greater than 70 mm.
Optionally, the cable interface comprises an optical cable interface and/or an electrical cable interface.
In a second aspect, an embodiment of the present specification further provides a solid state disk, including: at least two communication interfaces, wherein at least one communication interface is used for connecting the processor, and at least one communication interface is used for connecting the switch.
In a third aspect, an embodiment of the present specification further provides a computer system, including: the server comprises a processor and the solid state disk as described in any one of the above, and the solid state disk is in communication connection with both the processor and the switch.
Optionally, the number of the switches is greater than or equal to two, and the solid state disk and the switches are in communication connection.
Optionally, the at least two switches connected to the solid state disk include a master switch and at least one slave switch.
In a fourth aspect, an embodiment of the present specification further provides a solid state disk, including:
the large-size printed circuit board is longer than 100mm and wider than 15mm, and comprises a first surface and a second surface which are oppositely arranged;
the storage units are distributed on the first surface and/or the second surface.
Optionally, the solid state disk further includes: a capacitor bank comprising at least two capacitors;
the large-size printed circuit board further includes: at least two gaps, the capacitor sets up in the gap.
In a fifth aspect, an embodiment of the present specification further provides a server, including: the solid state hard drives are connected with the processor through the connecting wires.
It can be seen from the foregoing technical solutions that the solid state disk provided in the embodiments of the present specification includes two communication interfaces, which are a PCIe interface and a cable interface, where a controller of the solid state disk is connected to the first connection device through the PCIe interface and connected to the second connection device through the cable interface, and meets a sharing requirement of a storage unit in the solid state disk for multiple devices, so that the solid state disk can be applied to an application scenario in which multiple servers share the solid state disk through a switch, an application scenario of the solid state disk is expanded, and applicability of the solid state disk is improved.
Drawings
In order to more clearly illustrate the embodiments of the present specification or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only the embodiments of the present specification, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic diagram of an exemplary implementation environment provided by one embodiment of the present description;
fig. 2 is a schematic structural diagram of a solid state disk provided in an embodiment of the present specification;
fig. 3 is a schematic structural diagram of a solid state disk according to another embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a solid-state hard disk according to yet another embodiment of the present disclosure;
fig. 5 is a schematic perspective view of a solid-state hard disk provided in an embodiment of the present specification;
FIG. 6 is a block diagram of a computer system, according to an embodiment of the present disclosure;
FIG. 7 is a block diagram of a computer system according to another embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a solid state disk according to an alternative embodiment of the present disclosure.
Detailed Description
Unless otherwise defined, technical or scientific terms used in the embodiments of the present specification should have the ordinary meaning as understood by those having ordinary skill in the art to which the specification pertains. The terms "first," "second," and the like as used in the embodiments of the present specification do not denote any order, quantity, or importance, but rather are provided to avoid mixing of constituent elements.
Unless the context requires otherwise, throughout the specification, "a plurality" means "at least two" and "includes" are to be interpreted in an open, inclusive sense, i.e., as "including, but not limited to". In the description of the specification, the terms "one embodiment," "some embodiments," "an example embodiment," "an example," "a specific example" or "some examples" or the like are intended to indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the specification. The schematic representations of the above terms are not necessarily referring to the same embodiment or example.
Exemplary implementation Environment
Referring to fig. 1, fig. 1 is a schematic diagram of an implementation environment that may be involved in a solid state disk provided in an embodiment of the present disclosure. The implementation environment is a scene that a plurality of cloud servers share solid state disks which are respectively inserted inside, in the implementation environment, each cloud server internally comprises one or more solid state disks, and the solid state disks need to be connected with a host inside the cloud server on one hand and need to be in communication connection with other cloud servers through equipment such as a switch on the other hand, so that the solid state disks can be shared among the plurality of cloud servers under the support of the equipment such as a network card. Specifically, the solid state disk realizes connection with other servers (i.e., NVMe Over Fabric) through a network structure by using an NVMe (Non-Volatile Memory host controller interface specification) protocol, in such an environment, the server a may perform data operation on the solid state disk of the server B through the switch, and the server B may also perform data operation on the solid state disk of the server a through the switch, and of course, the server a may also perform data operation on the solid state disk of other servers (e.g., the server N) through the switch.
In order to meet the application requirements of the implementation environment, the embodiments of the present specification provide a solid state disk, and the technical solutions in the embodiments of the present specification will be clearly and completely described below with reference to the drawings in the embodiments of the present specification, and it is obvious that the described embodiments are only a part of the embodiments of the present specification, and not all of the embodiments of the present specification. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present specification without any creative effort belong to the protection scope of the present specification.
Exemplary solid State disk
In an exemplary embodiment of the present specification, a solid state disk is provided, as shown in fig. 2, where fig. 2 is a schematic frame diagram of the solid state disk, and the solid state disk includes: a PCIe (Peripheral Component Interconnect express) interface 10, a cable interface 40, a plurality of storage units 30, and a controller 20 connected to the PCIe interface 10, the cable interface 40, and the plurality of storage units 30.
The controller 20 is connected to the first connection device through the PCIe interface 10, and is connected to the second connection device through the cable interface 40, and the controller 20 is configured to perform a data operation on the storage unit 30 based on a first instruction and/or a second instruction, where the first instruction includes a data operation instruction transmitted by the first connection device, and the second instruction includes a data operation instruction transmitted by the second connection device.
In this embodiment, PCIe interface 10 refers to a hardware structure in a PCIe bus system, PCIe interface 10 may also be referred to as a gold Finger (Connecting Finger), the number of pins included in PCIe interface 10 may be determined according to the number of data lanes (Lane) included in PCIe interface 10, and the data lanes of PCIe interface 10 may be divided into a PCIe 1 interface, a PCIe 2 interface, a PCIe 4 interface, a PCIe 8 interface, a PCIe 12 interface, a PCIe 16 interface, and a PCIe 32 interface according to the number of included data lanes, where the PCIe xn interface indicates that the interface includes n data lanes, and n is 1, 2, 4, 8, 12, 16, 32.
The PCIe interface 10 may meet a requirement that the solid state disk and other devices of the host (server) establish a communication connection based on a PCIe protocol, for example, the solid state disk may establish a communication connection with a processor inside the host through the PCIe interface 10, so that the processor may implement interaction with the controller 20 through the PCIe interface 10, and further implement data operation on data stored in the storage unit 30. The data operation includes, but is not limited to, at least one of a write operation, a read operation, and an erase operation, and the corresponding data operation instruction includes, but is not limited to, at least one of a write operation instruction, a read operation instruction, and an erase operation instruction.
The storage unit 30 may be a solid-state memory chip, such as a Flash chip or a DRAM chip, and the solid-state particle units included in the solid-state memory chip include, but are not limited to, SLC (Single-Level Cell, i.e., 1bit/Cell), MLC (Multi-Level Cell, i.e., 2bit/Cell), TLC (triple-Level Cell, i.e., 3bit/Cell), QLC (Quad-Level Cell, i.e., 4 bit/Cell), and PLD (Penta-Level Cell, i.e., 5 bit/Cell). The number of storage units 30 characterizes the total storage capacity of the solid state disk.
The cable interface 40 may be connected with a cable-type communication medium (e.g., an optical cable, an electrical cable, etc.) to meet the requirement of connecting network devices such as a solid state disk and a switch, for example, in some embodiments of the present specification, the cable interface 40 may be an optical cable interface or an electrical cable interface.
When the solid state disk is applied in an exemplary implementation environment, the first connection device may be a processor included in a host, and the second connection device may be a switch, in this implementation environment, since the solid state disk provided in this specification embodiment includes a PCIe interface and a cable interface, such that a controller of the solid state disk may be connected to the host processor through the PCIe interface and connected to the switch through the cable interface, the switch may also be connected to another server outside the host, such that the other server may access the solid state disk of the host through the switch, and when the solid state disk provided in this specification embodiment is included in another server, the host may also access the solid state disk in another server through the switch, so as to meet a sharing requirement of a storage unit in the solid state disk for multiple devices, so that the solid state disk may be applied in an application scenario, for example, where multiple servers share the solid state disk through the switch, the applicable scenes of the solid state disk are expanded, and the applicability of the solid state disk is improved.
In addition, as described above, when the solid state disk provided in the embodiment of the present disclosure implements the NVMe Over Fabric function, the solid state disk can be shared with other servers on the host solid state disk without using a transfer function of a PCIe-ethernet transfer chip, constructing flash cluster structures such as JBOF or EBOF, and occupying an original PCIe interface of the solid state disk.
It should be noted that, in the solid state disk, in addition to the aforementioned storage unit, the controller, the PCIe Interface, and the cable Interface, according to actual needs, the solid state disk may further include at least one of structures such as a volatile Memory (Random Access Memory), a chip verification circuit, a temperature sensor, a clock generation circuit, a Serial Peripheral Interface (Serial Peripheral Interface), and a general IO Interface.
In an exemplary embodiment of the present specification, as shown in fig. 3, the solid state disk further includes: a capacitor bank and a power management chip 60, the capacitor bank including at least two capacitors 51; wherein,
the power management chip 60 is connected to the PCIe interface 10 and the capacitor bank, and the power management chip 60 is configured to receive a first working power provided by the first connection device through the PCIe interface 10, provide a second working power to the capacitor bank and the controller 20 based on the first working power, and send a power-down protection instruction to the controller 20 and provide the second working power to the controller 20 based on a third working power provided by the capacitor bank when the first working power is disconnected.
The controller 20 is further configured to perform a cache data storage operation on the storage unit 30 if the power down protection instruction is received.
In this embodiment, at least two capacitors 51 are configured for the solid state disk, and when the solid state disk can normally receive a first operating power through the PCIe interface 10, the power management chip 60 may provide a second operating power to the controller 20 and the capacitor bank based on the first operating power, so that the controller 20 supplies power to the storage unit 30 connected thereto, and charges the capacitor 51 when the charging of the capacitor 51 in the capacitor bank is not completed. When the first connection device is powered off due to an unexpected situation, the capacitor 51 in the capacitor bank may provide a third working power supply for the power management chip 60 to maintain the power-down protection operation of the power management chip 60, and at this time, the power management chip 60 may still provide a normal second working power supply for the controller 20 before the capacitor 51 is completely discharged, so that the controller 20 stores the cache data in the volatile storage in the solid state disk in the storage unit 30 based on the power-down protection instruction, thereby avoiding an unexpected loss of the data.
In addition, in this embodiment, a capacitor bank including at least two capacitors is configured for the solid state disk, so that a large amount of power-down protection electric power can be provided for the solid state disk, and a processor is supported to complete a large amount of processing operations when the processor is powered down, so that Firmware (FW) logic burned in the processor can be more flexible.
In an exemplary embodiment of the present specification, as shown in fig. 4, the solid state disk further includes:
a printed circuit board 70, the printed circuit board 70 comprising at least two indentations 71 and oppositely arranged first and second ends, the number of indentations 71 being the same as the number of capacitors 51 in the capacitor bank.
The printed circuit board 70 is used to carry the PCIe interface 10, the cable interface 40, the power management chip 60, and the plurality of storage units 30.
The capacitor 51 is disposed in the gap 71, the cable interface 40 is disposed at the first end, the PCIe interface 10 is disposed at the second end, and the storage unit 30 is disposed near the first end.
In the present embodiment, the capacitor 51 is disposed in the notch 71, so that the space occupied by the capacitor 51 in the longitudinal direction (i.e., the direction perpendicular to the paper surface) can be reduced, which is beneficial for reducing the size of the solid state disk in the longitudinal direction.
The first end and the second end are two ends of the printed circuit board 70, which are arranged oppositely, and are used for arranging the cable interface 40 and the PCIe interface 10 respectively, the second end for arranging the PCIe interface 10 is generally used for connecting devices such as a processor inside the host, and the first end for arranging the cable structure 40 is generally used for connecting external devices (such as a switch), so under this condition, the first end is generally used as an air inlet of the host, the storage unit 30 is arranged close to the air inlet, which is beneficial to improving the heat dissipation effect of the storage unit 30, and heat generated in the working process of the storage unit 30 can be dissipated in time, thereby ensuring the efficient work of the storage unit 30.
In one exemplary embodiment of the present description, the storage unit includes solid particle units, and a storage space in a single solid particle unit may be greater than or equal to 4 bits (bit). That is, the solid particle unit is a QLC solid particle or a PLC solid particle, in this case, the storage density of the storage unit is high, and the data to be cached is relatively more when the power is down.
In an exemplary embodiment of the present specification, the solid state disk further includes: the protective housing comprises a first through hole, a second through hole and an accommodating space, the first through hole and the second through hole are respectively used for setting a PCIe interface and a cable interface, and the accommodating space is used for setting the controller and the plurality of storage units.
The storage unit is in at least partial contact with the protective housing.
In this embodiment, the storage unit is at least partially in contact with the protective housing, so that the storage unit can directly dissipate heat through the protective housing in contact with the storage unit, which is beneficial to improving the heat dissipation effect of the storage unit.
More specifically, in one exemplary embodiment of the present description, the length of the protective housing is greater than 100mm, the width of the protective housing is greater than 15mm, and the height of the protective housing is greater than 70 mm.
In the embodiment, the size of the protective casing is larger than that of the casing defined by the U.2-shaped solid state disk, and the large size of the protective casing allows the size of the printed circuit board inside to be correspondingly larger, so that a single printed circuit board can hold a larger number of storage units, and in an application scenario requiring a large-capacity solid state disk, two printed circuit boards do not need to be connected through a Flexible Printed Circuit (FPC) and are arranged in the casing in a stacked manner like the U.2-shaped solid state disk. U.2, the solid state disk needs a flexible circuit board with high cost on one hand, and on the other hand, the heat generated when the storage units arranged on the opposite surfaces of the two printed circuit boards arranged in a stacked manner work is accumulated in a narrow space, which is not beneficial to the heat dissipation of the storage units.
And in this embodiment, because the size that the printed circuit board size can set up is bigger, the setting requirement of large capacity solid state hard drives can be satisfied to the individual layer board, has avoided above-mentioned problem, and the cost is reduced has improved the heat dissipation problem of memory cell.
In a specific embodiment of the present description, reference may be made to table 1 in combination with fig. 5 for optional dimensions of the solid state disk, where the dimensions at different specifications (single/double wide full/half high full/half 3/4 long) are shown in table 1.
TABLE 1 solid state disk size
In table 1 and fig. 5, a denotes a width of the solid state disk, B denotes a height of the solid state disk, and C denotes a length of the solid state disk. The solid state disk with the size of the solid state disk shown in table 1 can meet the requirement that some slots in a server (host) are compatible with the solid state disk and the intelligent network card in some application scenarios.
In some embodiments of the present description, the cable interface includes an optical cable interface and/or an electrical cable interface, optionally, the cable interface may include an optical cable interface, an electrical cable interface, and an optical cable interface and an electrical cable structure at the same time, so as to improve the applicability of the solid state disk and meet requirements of different application scenarios on the types of the cable interfaces, which is not limited in this description.
Correspondingly, an embodiment of the present specification further provides a solid state disk, including: at least two communication interfaces, wherein at least one communication interface is used for connecting the processor, and at least one communication interface is used for connecting the switch.
Optionally, the number of the at least two communication interfaces may be 2, 3, or more, so as to meet different requirements of the solid state disk for the connected device in different application scenarios. In a particular embodiment, at least one communication interface is used to connect to a processor within the host and at least another communication interface is used to connect to a switch to meet the requirements of the exemplary implementation environment.
Exemplary computer System
Accordingly, as shown in fig. 6, an exemplary embodiment of the present specification further provides a computer system including: the server 100 comprises a processor 101 and the solid state disk 103 according to any one of the embodiments, and the solid state disk 103 is in communication connection with both the processor 101 and the switch 200.
In this embodiment, since the solid state disk 103 includes at least two communication interfaces (e.g., a PCIe interface and a cable interface), the solid state disk 103 can meet the requirement of establishing communication connection with the processor 101 and the switch 200, respectively, so that at least two servers 100 in the computer system can share the solid state disk 103 inside the server 100 with the aid of the network card 102. With regard to the relevant definition of the solid state disk 103, reference may be made to the corresponding description in the above exemplary solid state disk.
Alternatively, referring to fig. 7, the number of the switches 200 is greater than or equal to two, and the solid state disk 103 is in communication connection with each of the switches 200.
In this embodiment, the solid state disk 103 is communicatively connected to at least two switches 200, so that the server 100 can select a switch 200 for communication, the communication freedom of the server 100 is improved, and reduction in communication efficiency, which may be caused by using a large number of servers 100 with the same switch 200, is avoided.
Optionally, the at least two switches 200 connected to the solid state disk 103 include a master switch and at least one slave switch.
In the embodiment, one slave switch is arranged in at least two switches 200 connected with the solid state disk 103 as a backup, and when the master switch fails, the slave switch can be enabled to communicate, so that the robustness of the system is improved.
Exemplary solid State disk
Correspondingly, an embodiment of the present specification further provides a solid state disk, as shown in fig. 8, the solid state disk includes:
the length C of the large-size printed circuit board 70' is greater than 100mm, the height B of the large-size printed circuit board is greater than 70mm, and the large-size printed circuit board comprises a first surface 701' and a second surface 702' which are oppositely arranged.
A plurality of memory cells 30, the plurality of memory cells 30 being distributed on the first surface 701 'and/or the second surface 702'.
In the present embodiment, the large-sized printed circuit board 70' refers to a printed circuit board having a length C greater than 100mm and a height B greater than 70 mm. In order to conform to the definition of length, width and height between the equipment modules in the server, the specific length and height refer to which side of the printed circuit board 70' please refer to fig. 8.
The size of the large-size printed circuit board 70 'is larger than the size of the housing defined by the U.2-shaped solid state disk, a single large-size printed circuit board 70' can hold a larger number of storage units 30, and in an application scenario requiring a large-capacity solid state disk, it is not necessary to connect two printed circuit boards through a Flexible Printed Circuit (FPC) and arrange the two printed circuit boards in a stacked manner in the housing like the U.2-shaped solid state disk. U.2, the solid state disk needs a flexible circuit board with high cost on one hand, and on the other hand, the heat generated when the storage units arranged on the opposite surfaces of the two printed circuit boards arranged in a stacked manner work is accumulated in a narrow space, which is not beneficial to the heat dissipation of the storage units.
In the embodiment, since the large-sized printed circuit board 70' has a larger size, a single layer of board can meet the setting requirement of the large-capacity solid state disk, thereby avoiding the above problems, reducing the cost, and improving the heat dissipation problem of the storage unit.
In an exemplary embodiment of the present specification, the solid state disk further includes: a capacitor bank comprising at least two capacitors. The large-size printed circuit board further includes: at least two gaps, the capacitor sets up in the gap.
In this embodiment, because the large-sized printed circuit board has a large size, two or more capacitors are prevented by a sufficient space, so as to provide more operation margins for power-down protection of the solid state disk, and ensure that the controller of the solid state disk can write the cache data into the storage unit within a sufficient time.
Exemplary Server
Accordingly, an exemplary embodiment of the present specification further provides a server, where the server includes a processor and the solid state disk as in any of the above embodiments, and the solid state disk is plugged into a slot of the processor.
For the relevant definitions of the solid state disk, reference may be made to the relevant descriptions in the above exemplary solid state disk, and this description is not repeated herein.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several implementation modes of the present specification, and the description thereof is specific and detailed, but not construed as limiting the scope of the solutions provided by the embodiments of the present specification. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present description, which falls within the scope of protection of the present description. Therefore, the protection scope of the patent in the specification shall be subject to the appended claims.
Claims (14)
1. A solid state disk, comprising:
a plurality of memory cells;
a PCIe interface;
a cable interface;
the controller is connected with the first connecting device through the PCIe interface, and is connected with the second connecting device through the cable interface, the controller is configured to perform data operation on the storage unit based on a first instruction and/or a second instruction, the first instruction comprises a data operation instruction transmitted by the first connecting device, and the second instruction comprises a data operation instruction transmitted by the second connecting device.
2. The solid state disk of claim 1, further comprising: the power management circuit comprises a capacitor bank and a power management chip, wherein the capacitor bank comprises at least two capacitors; wherein,
the power management chip is connected with the PCIe interface and the capacitor bank, and is configured to receive a first working power supply provided by the first connection device through the PCIe interface, provide a second working power supply to the capacitor bank and the controller based on the first working power supply, and send a power-down protection instruction to the controller and provide the second working power supply to the controller based on a third working power supply provided by the capacitor bank when the first working power supply is disconnected;
the controller is further configured to perform a cache data storage operation on the storage unit if the power down protection instruction is received.
3. The solid state disk of claim 2, further comprising:
the printed circuit board comprises at least two gaps, a first end and a second end which are arranged oppositely, and the number of the gaps is the same as that of the capacitors in the capacitor bank;
the printed circuit board is used for bearing the PCIe interface, the cable interface, the power management chip and the plurality of storage units;
the capacitor is arranged in the gap, the cable interface is arranged at the first end, the PCIe interface is arranged at the second end, and the storage unit is close to the first end.
4. The solid state disk of any one of claims 2 or 3, wherein the storage units comprise solid state particle units, and the storage space in a single solid state particle unit is greater than or equal to 4 bits.
5. The solid state disk of claim 1, further comprising: the protective shell comprises a first through hole, a second through hole and an accommodating space, the first through hole and the second through hole are respectively used for setting the PCIe interface and the cable interface, and the accommodating space is used for setting the controller and the plurality of storage units;
the storage unit is in at least partial contact with the protective housing.
6. The solid state disk of claim 5, wherein the length of the protective enclosure is greater than 100mm, the width of the protective enclosure is greater than 15mm, and the height of the protective enclosure is greater than 70 mm.
7. The solid state disk of any one of claims 1 to 6, wherein the cable interface comprises an optical cable interface and/or an electrical cable interface.
8. A solid state disk, comprising: at least two communication interfaces, wherein at least one communication interface is used for connecting with the processor, and at least one communication interface is used for connecting with the switch.
9. A solid state disk, comprising:
the length of the large-size printed circuit board is more than 100mm, the height of the large-size printed circuit board is more than 70mm, and the large-size printed circuit board comprises a first surface and a second surface which are oppositely arranged;
a plurality of memory cells distributed on the first surface and/or the second surface.
10. The solid state disk of claim 9, further comprising: a capacitor bank comprising at least two capacitors;
the large-size printed circuit board further comprises: at least two indentations, the capacitor is disposed in the indentations.
11. A server, comprising: a processor and the solid state disk of any of claims 1-10, the solid state disk plugged into a slot of the processor.
12. A computer system, comprising: a switch and at least two servers, the servers comprising a processor and the solid state disk of any one of claims 1-8, the solid state disk communicatively connected to both the processor and the switch.
13. The computer system of claim 12, wherein the number of switches is greater than or equal to two, and the solid state disk is communicatively coupled to each of the switches.
14. The computer system of claim 13, wherein the at least two switches connected to the solid state disk comprise a master switch and at least one slave switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210467278.4A CN114882917A (en) | 2022-04-29 | 2022-04-29 | Solid state disk, server and computer system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210467278.4A CN114882917A (en) | 2022-04-29 | 2022-04-29 | Solid state disk, server and computer system |
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| Publication Number | Publication Date |
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| CN114882917A true CN114882917A (en) | 2022-08-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210467278.4A Pending CN114882917A (en) | 2022-04-29 | 2022-04-29 | Solid state disk, server and computer system |
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