CN114878026B - High-precision electronic thermometer capable of realizing rapid temperature measurement - Google Patents

Abstract

The invention discloses a high-precision electronic thermometer capable of realizing rapid temperature measurement, which comprises a bottom shell, a temperature acquisition device and a flexible circuit board, wherein part of the temperature acquisition device passes through a transmission hole and is convexly arranged at the bottom of the bottom shell; the flexible circuit board is provided with an annular copper heat conduction area, the temperature sensor is arranged in the middle of the annular copper heat conduction area in a protruding mode, a first heat conduction material is filled between the annular copper heat conduction area and the inner wall of the temperature acquisition device, and the temperature sensor is embedded into the first heat conduction material; when in use, the convex part of the temperature sampling device is pressed and embedded into the pit of the skin, and the heat of the skin reaches the temperature sensor through at least three channels: the bottom shell and the peripheral side of the shell of the temperature collecting device are respectively connected to the bottom of the temperature sensor and the peripheral side of the temperature sensor; the shell of the temperature collecting device is arranged on the periphery of the annular copper heat conduction area and then arranged on the upper part and the periphery of the temperature sensor; therefore, the periphery of the temperature sensor can quickly form a uniform temperature field which is close to the body surface temperature of a human body, and quick and accurate temperature measurement is realized.

Description

A high-precision electronic thermometer capable of rapid temperature measurement

Technical Field

The present invention relates to the technical field of body temperature detection, and in particular to a high-precision electronic thermometer capable of realizing rapid temperature measurement.

Background Art

Temperature detection is a common problem in our daily life. Temperature monitoring is divided into routine detection, abnormal temperature detection or medical monitoring according to the detection accuracy.

There is no doubt that medical monitoring requires the highest precision and a faster detection speed. Affected by many factors, conventional temperature measurement is slow and has low detection accuracy.

Summary of the invention

In view of the above, the present invention provides a high-precision electronic thermometer with fast detection speed, high detection accuracy and rapid temperature measurement.

A high-precision electronic thermometer capable of rapid temperature measurement comprises a bottom shell, a temperature device and a flexible circuit board, wherein the bottom shell is provided with a through hole, and a part of the temperature collection device protrudes through the through hole and is arranged at the bottom of the bottom shell; the flexible circuit board is provided with an annular copper heat conduction area, and a temperature sensor protrudes in the middle of the annular copper heat conduction area, and a first heat conduction material is filled between the annular copper heat conduction area and the inner wall of the temperature collection device, and most or part of the temperature sensor is embedded in the first heat conduction material; the temperature sensor is embedded in the inner cavity of the temperature collection device, and the bottom of the temperature sensor is adjacent to or close to the inner wall of the temperature collection device; the area between the annular copper heat conduction area and the bottom wall of the temperature collection device is filled with the first heat conduction material, forming a closed space that can quickly obtain a uniform temperature field, and the temperature sensor is embedded in this closed space, and can quickly sense the temperature, thereby improving the temperature measurement speed and temperature measurement accuracy of the high-precision electronic thermometer capable of rapid temperature measurement. The temperature sensor is located in a rapid temperature gathering and constant temperature interval formed by the annular copper heat conduction area, the temperature collection device and the first heat conduction material.

When in use, the protruding part of the temperature sampling device is pressed and embedded into the pit of the skin, and the heat of the skin reaches the temperature sensor through at least three channels: 1. through the bottom shell of the temperature sampling device to the bottom of the temperature sensor; 2. from the outer shell of the temperature sampling device to the first heat-conducting material to the outer shell of the temperature sensor; 3. from the outer shell of the temperature sampling device to the outer shell of the annular copper heat-conducting area, and then to the upper part and outer shell of the temperature sensor; thereby, a uniform temperature field close to the human body surface temperature can be quickly formed on the outer shell of the temperature sensor, thereby achieving rapid and accurate temperature measurement.

The temperature sensor is located in a rapid temperature gathering and constant temperature interval formed by the annular copper heat conduction zone, the temperature collection device and the first heat conduction material.

Preferably, the circumference of the annular copper heat conduction zone is in contact with the inner circumferential wall of the temperature collection device, and the temperature collection device is made of stainless steel material with high thermal conductivity;

The annular copper heat conduction area is provided with a notch, and the temperature sensor transmits the collected parameters to the soldering pad on the other side of the flexible circuit board through the notch; or, the annular copper heat conduction area is not provided with a notch, and the temperature sensor transmits the collected parameters to the other side of the flexible circuit board opposite to the annular copper heat conduction area through the conductive via of the flexible circuit board, and then transmits them to the soldering pad on the other side.

Preferably, it also includes an upper cover and a hard circuit board, a main control chip is arranged on the hard circuit board, the temperature sensor is connected to the hard circuit board through a flexible circuit board, the upper cover is buckled on the upper part of the bottom shell, the flexible circuit board and the hard circuit board are arranged between the bottom shell and the upper cover, and an insulating space is arranged on the upper part of the flexible circuit board corresponding to the annular copper heat conduction area.

Preferably, the heat-insulating space is provided with heat-insulating material, or the heat-insulating space is insulated by an air layer.

Preferably, it also includes flexible conductive rubber particles and a thin connection auxiliary plate, the thin connection auxiliary plate is provided with a first fixing hole and a second fixing hole, and the hard circuit board is provided with a third fixing hole;

The thin connection auxiliary plate and the hard circuit board are fixed by the first fixing hole and the third fixing hole;

The flexible conductive rubber particles are arranged at the second fixing hole, and two ends of the flexible conductive rubber particles are respectively connected to the pad of the rigid circuit board and the pad of the flexible circuit board.

The number of flexible conductive particles is one, two or more than three. The height of the flexible conductive particles is relatively small, which can be as small as 0.1 mm, and can achieve short-distance connection. The cost is lower than that of the connector, and the manufacturing and processing difficulty are relatively small. The thickness of the thin connection auxiliary plate is adapted to the height of the flexible conductive particles, and is designed according to the height to which the flexible conductive particles can be compressed, for example, it is designed to be between 80% and 95% of the height of the flexible conductive particles. The aperture of the second fixing hole is adapted to the diameter of the flexible conductive particles, and is designed according to the size to which the flexible conductive particles can be squeezed, for example, it is designed to be between 90% and 98% of the diameter of the flexible conductive particles.

Preferably, it also includes a cover plate, which is provided with a blind hole column (playing a positioning role, also called a positioning column), and the bottom shell is provided with a short column, which passes through the first fixing hole and the third fixing hole in sequence, and the short column is sleeved on the inner side of the blind hole of the blind hole column.

Preferably, the annular copper heat conduction area is located around the temperature sensor, and a gap is provided between the annular copper heat conduction area and the temperature sensor. The annular copper heat conduction area is arranged in an annular shape, and the temperature sensor is arranged in the middle vacant area.

Preferably, the temperature sampling device includes an annular cavity and a blind hole cavity, the annular cavity and the blind hole cavity are arranged in a step shape, the diameter of the annular cavity is larger than the diameter of the blind hole cavity, and most or all of the temperature sensor is embedded in the blind hole cavity.

Preferably, the first thermally conductive material is in a paste form and is then fixed to encapsulate the temperature sensor.

Preferably, the bottom of the temperature sensor is larger than the area of the annular vacancy of the annular copper heat conduction zone, a sensor pad for connecting the signal output electrode of the temperature sensor is arranged in the middle of the annular vacancy, and the signal output electrode is arranged in the middle of the bottom of the temperature sensor, and the area of the signal output electrode is 30% to 80% of the top area of the temperature sensor.

Preferably, the outer side of the annular copper heat conduction zone and the joint part of the temperature collection device are fitted by folding, and the inner wall of the temperature collection device is provided with a ring clamping groove, and the folding edge is clamped in the ring clamping groove to improve the heat transfer speed of the joint and improve the stability and reliability of the joint.

Preferably, the flexible circuit board at the annular copper heat conduction area is circular as a whole, and since the annular copper heat conduction area and the temperature sensor are arranged on one side, an arch shape is formed, which is arched outwards;

Copper layers are arranged on both sides of the folded edge, and the thickness of the outer copper layer is greater than that of the inner copper layer, resulting in the formation of an arch shape, which arches inward. The inner wall of the ring clamp groove prevents the folded edge from arching inward, so that the folded edge and the ring clamp groove fit closely, and the heat collected by the temperature collection device can be quickly transferred inward; the copper layers on both sides are connected through the heat-conducting holes filled with the second heat-conducting material; the substrate layer is between the outer copper layer and the inner copper layer;

The folded edge is an inner arch, with copper layers on both sides, the thickness of the outer copper layer is greater than that of the inner copper layer, and the copper layers on both sides are connected through heat-conducting holes filled with the second heat-conducting material; the inner arched annular copper heat-conducting area and the inner arched folded edge are combined, so that the annular copper heat-conducting area can be well combined with the temperature collection device for heat transfer, so that the human body heat collected by the temperature collection device can be quickly transferred to the annular copper heat-conducting area and the first heat-conducting material, and then a near-constant temperature field close to the human body temperature is formed as soon as possible around the temperature sensor. Theoretically, a constant temperature field does not exist, but when the temperature collection device can be embedded deep enough in the skin, the device can be used to obtain a temperature field close to the human body surface temperature at a faster speed, which is called a near-constant temperature field.

Preferably, the second heat-conducting material is copper, and the hole copper is filled by hole-filling electroplating;

The junction of the folded edge and the annular copper heat conducting area adopts a sawtooth transition structure, which is provided with an elliptical transition connection hole. After the temperature collection device and the flexible circuit board are assembled, the transition connection hole is filled with a third heat conducting material. The third heat conducting material is formed by solidifying a paste material or a liquid material.

Using flexible circuit boards for connection can simplify the electrical connection method, reduce complex operations such as welding or clamping connectors, and achieve electrical connection through simple assembly.

The high-precision electronic thermometer that can achieve rapid temperature measurement can achieve rapid temperature measurement, improve the efficiency of temperature measurement, enhance temperature measurement stability, and reduce temperature measurement delay time.

Preferably, the circumference of the annular copper heat conduction zone fits the inner circumference of the temperature collection device, and the temperature collection device is made of stainless steel with high thermal conductivity. The thermal conductivity of copper is more than 5 times that of stainless steel, but copper metal is prone to rust and is not suitable for a temperature collection device that fits the human body.

Preferably, the outer side of the annular copper heat conduction area and the junction of the temperature collection device are folded to improve the heat transfer rate of the junction. The temperature collection device forms an outer slot to press against the turning point of the folded edge, and the connection is stable and reliable.

Preferably, the other side of the flexible circuit board in the annular copper heat conduction area is green oil with low thermal conductivity, thereby forming an effective heat insulation effect.

With the development of product technology, more and more products cannot meet the needs of users due to their large size and some welding or other complex production operations. At the same time, the production cost remains high. The use of flexible circuit boards can well realize the connection between temperature sensors and rigid circuit boards.

The beneficial effects of the present invention are as follows: a high-precision electronic thermometer capable of rapid temperature measurement comprises a bottom shell, a temperature device and a flexible circuit board, the bottom shell being provided with a through hole, a part of the temperature collection device protruding through the through hole and being arranged at the bottom of the bottom shell; the flexible circuit board being provided with an annular copper heat conduction area, a temperature sensor protruding and arranged in the middle of the annular copper heat conduction area, a first heat conduction material being filled between the annular copper heat conduction area and the inner wall of the temperature collection device, most or part of the temperature sensor being embedded in the first heat conduction material; the temperature sensor being embedded in the inner cavity of the temperature collection device, the bottom of the temperature sensor being adjacent to or close to the inner wall of the temperature collection device; the area between the annular copper heat conduction area and the bottom wall of the temperature collection device being filled with the first heat conduction material, forming a closed space capable of rapidly obtaining a uniform temperature field, the temperature sensor being embedded in this closed space, being able to rapidly sense the temperature, thereby improving the temperature measurement speed and temperature measurement accuracy of the high-precision electronic thermometer capable of rapid temperature measurement. The temperature sensor is located in a rapid temperature gathering and constant temperature interval formed by the annular copper heat conduction area, the temperature collection device and the first heat conduction material. When in use, the protruding part of the temperature sampling device is pressed and embedded into the pit of the skin, and the heat of the skin reaches the temperature sensor through at least three channels: 1. through the bottom shell of the temperature sampling device to the bottom of the temperature sensor; 2. from the outer shell of the temperature sampling device to the first heat-conducting material to the outer shell of the temperature sensor; 3. from the outer shell of the temperature sampling device to the outer shell of the annular copper heat-conducting area, and then to the upper part and outer shell of the temperature sensor; thereby, a uniform temperature field close to the human body surface temperature can be quickly formed on the outer shell of the temperature sensor, thereby achieving rapid and accurate temperature measurement.

A closed space is formed to quickly obtain a uniform temperature field. The temperature sensor is embedded in this closed space and can quickly sense the temperature, thereby improving the temperature measurement speed and accuracy of the high-precision electronic thermometer that can quickly measure temperature, with fast detection speed and high detection accuracy.

BRIEF DESCRIPTION OF THE DRAWINGS

The following is a further description of a high-precision electronic thermometer capable of quickly measuring temperature according to the present invention in conjunction with the accompanying drawings.

FIG. 1 is a cross-sectional view of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention.

FIG. 2 is a schematic diagram of the structural decomposition of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention.

FIG3 is a schematic structural diagram of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention from one viewing angle.

FIG. 4 is a schematic structural diagram of another perspective of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention.

FIG5 is a schematic structural diagram of a bottom shell of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention.

FIG6 is a schematic structural diagram from one perspective of a flexible circuit board and a temperature sensor of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention.

FIG. 7 is a schematic structural diagram from another perspective of a flexible circuit board and a temperature sensor of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention.

FIG8 is a schematic structural diagram of a temperature collection device of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention from one viewing angle.

FIG. 9 is a schematic structural diagram from another perspective of a temperature sampling device of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention.

FIG. 10 is a schematic structural diagram of a thin connection auxiliary plate, a hard circuit board and a cover plate of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention.

FIG. 11 is a schematic structural diagram of a flexible circuit board and a temperature sensor of another embodiment of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention from one perspective.

FIG. 12 is a schematic structural diagram from one perspective of a temperature sampling device of another embodiment of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention.

FIG13 is a cross-sectional view of the folded edge of another embodiment of a high-precision electronic thermometer capable of rapid temperature measurement according to the present invention.

14 is a cross-sectional view of the connection between the folded edge and the copper heat conduction area of another embodiment of the high-precision electronic thermometer capable of rapid temperature measurement of the present invention.

In the figure:

1- bottom shell; 11- through hole; 12- short column; 2- temperature collection device; 21- annular cavity; 22- blind hole cavity; 23- ring card groove; 25- heat insulation space; 3- flexible circuit board; 31- annular copper heat conduction area; 321- folded edge; 3210- outer copper layer; 3216- base material layer; 3218- inner copper layer; 33- sensor pad; 34- soldering pad; 35- heat conduction hole; 36- serrated transition structure; 361- transition connection hole; 4- upper cover; 5- hard circuit board; 51- third fixing hole; 52- soldering pad; 6- temperature sensor; 7- flexible conductive rubber particles; 8- thin connection auxiliary plate; 81- first fixing hole; 82- second fixing hole; 9- cover plate; 91- blind hole column; 01- first thermal conductive material; 02- second thermal conductive material; 06- third thermal conductive material.

DETAILED DESCRIPTION

The following is a further description of a high-precision electronic thermometer capable of quickly measuring temperature according to the present invention in conjunction with Figures 1 to 14.

Embodiment 1

A high-precision electronic thermometer capable of realizing rapid temperature measurement comprises a bottom shell 1, a temperature collection device 2 and a flexible circuit board 3. The bottom shell 1 is provided with a through hole 11, and a part of the temperature collection device 2 protrudes through the through hole 11 and is arranged at the bottom of the bottom shell 1;

The flexible circuit board 3 is provided with an annular copper heat conduction area 31, the temperature sensor 6 is protrudingly arranged in the middle of the annular copper heat conduction area 31, the annular copper heat conduction area 31 and the inner wall of the temperature collection device 2 are filled with a first heat conduction material 01, and the temperature sensor 6 is embedded in the first heat conduction material 01; the temperature sensor 6 is embedded in the inner cavity of the temperature collection device 2, and the bottom of the temperature sensor 6 is adjacent to or close to the inner wall of the temperature collection device 2;

When in use, the protruding part of the temperature collection device 2 is pressed and embedded into the pit of the skin, and the heat of the skin reaches the temperature sensor 6 through at least three channels: ① through the bottom shell of the temperature collection device 2 to the bottom of the temperature sensor 6; ② from the peripheral side of the outer shell of the temperature collection device 2 to the first heat-conducting material 01 to the peripheral side of the temperature sensor 6; ③ from the outer shell of the temperature collection device 2 to the peripheral side of the annular copper heat-conducting area 31, and then to the upper part and peripheral side of the temperature sensor 6; thereby, the peripheral side of the temperature sensor 6 can quickly form a uniform temperature field close to the human body surface temperature, thereby realizing rapid and accurate temperature measurement.

The temperature sensor 6 is located in the rapid temperature gathering and constant temperature interval formed by the annular copper heat conducting area 31 , the temperature collecting device 2 and the first heat conducting material 01 .

In this embodiment, the circumference of the annular copper heat conduction area 31 is in contact with the inner circumferential wall of the temperature collection device 2, and the temperature collection device 2 is made of stainless steel material with high thermal conductivity;

The annular copper heat conduction area 31 is provided with a notch, and the temperature sensor 6 transmits the collected parameters to the soldering pad 34 on the other side of the flexible circuit board 3 through the notch; or, the annular copper heat conduction area 31 is not provided with a notch, and the temperature sensor 6 transmits the collected parameters to the other side of the flexible circuit board 3 opposite to the annular copper heat conduction area 31 through the conductive via of the flexible circuit board 3, and then transmits them to the soldering pad 34 on the other side.

In this embodiment, an upper cover 4 and a hard circuit board 5 are also included. A main control chip is arranged on the hard circuit board 5. The temperature sensor 6 is connected to the hard circuit board 5 through the flexible circuit board 3. The upper cover 4 is buckled on the upper part of the bottom shell 1. The flexible circuit board 3 and the hard circuit board 5 are arranged between the bottom shell 1 and the upper cover 4. An insulating space 25 is arranged on the upper part of the flexible circuit board 3 corresponding to the annular copper heat conduction area 31.

In this embodiment, the heat-insulating space 25 is provided with a heat-insulating material, or the heat-insulating space 25 is insulated by an air layer.

In this embodiment, the flexible conductive rubber particles 7 and the thin connection auxiliary plate 8 are also included. The thin connection auxiliary plate 8 is provided with a first fixing hole 81 and a second fixing hole 82, and the hard circuit board 5 is provided with a third fixing hole 51;

The thin connection auxiliary board 8 and the hard circuit board 5 are fixed by the first fixing hole 81 and the third fixing hole 51;

The flexible conductive rubber particle 7 is disposed at the second fixing hole 82 , and two ends of the flexible conductive rubber particle 7 are respectively connected to the pad 52 of the rigid circuit board 5 and the pad 34 of the flexible circuit board 3 .

The number of the flexible conductive particles 7 is one, two or more than three. The height of the flexible conductive particles 7 is relatively small, which can be as small as 0.1 mm, and can achieve short-distance connection. The cost is lower than that of the connector, and the manufacturing and processing difficulty are relatively small. The thickness of the thin connection auxiliary plate 8 is adapted to the height of the flexible conductive particles 7, and is designed according to the height to which the flexible conductive particles 7 can be compressed, for example, it is designed to be between 80% and 95% of the height of the flexible conductive particles 7. The aperture of the second fixing hole 82 is adapted to the diameter of the flexible conductive particles 7, and is designed according to the size to which the flexible conductive particles 7 can be squeezed, for example, it is designed to be between 90% and 98% of the diameter of the flexible conductive particles 7.

In this embodiment, a cover plate 9 is also included. The cover plate 9 is provided with a blind hole column 91. The bottom shell 1 is provided with a short column 12. The short column 12 passes through the first fixing hole 81 and the third fixing hole 51 in sequence. The short column 12 is sleeved on the inner side of the blind hole of the blind hole column 91.

In this embodiment, the temperature sampling device 2 includes an annular cavity 21 and a blind hole cavity 22. The annular cavity 21 and the blind hole cavity 22 are arranged in a step shape. The diameter of the annular cavity 21 is larger than the diameter of the blind hole cavity 22. Most of the temperature sensor 6 is embedded in the blind hole cavity 22.

In this embodiment, the first heat-conducting material 01 is in a paste form and is then fixed to encapsulate the temperature sensor 6 .

In this embodiment, the bottom of the temperature sensor 6 is larger than the area of the annular vacancy of the annular copper heat conduction area 31, and a sensor pad 33 for connecting the signal output electrode of the temperature sensor 6 is arranged in the middle of the annular vacancy. The signal output electrode is arranged in the middle of the bottom of the temperature sensor 6, and the area of the signal output electrode is 30% to 80% of the top area of the temperature sensor 6.

In this embodiment, the outer side of the annular copper heat conduction area 31 and the joint part of the temperature collection device 2 are fitted with a folded edge 321. The inner wall of the temperature collection device 2 is provided with a ring clamping groove 23, and the folded edge 321 is clamped in the ring clamping groove 23 to improve the heat transfer speed at the joint and improve the stability and reliability of the joint.

In this embodiment, the flexible circuit board 3 at the annular copper heat conduction area 31 is circular in shape as a whole. Since the annular copper heat conduction area 31 and the temperature sensor 6 are arranged on one side, an arch shape is formed, which is arched outwards.

Copper layers are provided on both sides of the folded edge 321, and the thickness of the outer copper layer 3210 is greater than that of the inner copper layer 3218, resulting in the formation of an arch shape, which arches inward. The inner wall of the ring groove 23 prevents the folded edge 321 from arching inward, so that the folded edge 321 and the ring groove 23 fit closely, and the heat collected by the temperature collection device 2 can be quickly transferred inward; the copper layers on both sides are connected through the heat-conducting holes 35 filled with the second heat-conducting material 02; between the outer copper layer 3210 and the inner copper layer 3218 is the substrate layer 3216;

The folded edge 321 is an inner arch, with copper layers on both sides, the thickness of the outer copper layer is greater than that of the inner copper layer, and the copper layers on both sides are connected through the heat-conducting holes 35 filled with the second heat-conducting material 02; the inner arched annular copper heat-conducting area 31 and the inner arched folded edge 321 are combined, so that the annular copper heat-conducting area 31 can be well combined with the temperature collection device 2 for heat transfer, so that the human body heat collected by the temperature collection device 2 can be quickly transferred to the annular copper heat-conducting area 31 and the first heat-conducting material 01, and then a near-constant temperature field close to the human body temperature is formed as soon as possible around the temperature sensor 6. Theoretically, a constant temperature field does not exist, but when the temperature collection device 2 can be embedded deep enough in the skin, the present device can be used to obtain a temperature field close to the human body surface temperature at a faster speed, which is called a near-constant temperature field.

In this embodiment, the second thermally conductive material 02 is set to copper, and the hole copper is filled by hole filling electroplating;

The joint between the folded edge 321 and the annular copper heat conducting area 31 adopts a sawtooth transition structure 36, and the sawtooth transition structure 36 is provided with an elliptical transition connection hole 361. After the temperature collection device 2 and the flexible circuit board 3 are assembled, the transition connection hole 361 is filled with the third heat conducting material 06.

Embodiment 2

A high-precision electronic thermometer capable of rapid temperature measurement comprises a bottom shell 1, a temperature collection device 2 and a flexible circuit board 3. The bottom shell 1 is provided with a through hole 11, and a portion of the temperature collection device 2 protrudes through the through hole 11 and is disposed at the bottom of the bottom shell 1; the flexible circuit board 3 is provided with an annular copper heat conduction area 31, and a temperature sensor 6 protrudes near the annular copper heat conduction area 31, and a first heat conducting material 01 is filled between the annular copper heat conduction area 31 and the inner wall of the temperature collection device 2, and a portion of the temperature sensor 6 is embedded in the first heat conducting material 01.

In this embodiment, the temperature sensor 6 is embedded in the inner cavity of the temperature collection device 2 , and the bottom of the temperature sensor 6 is adjacent to or close to the inner wall of the temperature collection device 2 .

When in use, the protruding portion of the temperature collection device 2 is pressed and embedded into the concave part of the skin, and the area between the annular copper heat conduction area 31 and the bottom wall of the temperature collection device 2 is filled with the first heat conducting material 01, forming a closed space that can quickly obtain a uniform temperature field. The temperature sensor 6 is embedded in this closed space and can quickly sense the temperature, thereby improving the temperature measurement speed and temperature measurement accuracy of the high-precision electronic thermometer that can quickly measure temperature. The temperature sensor 6 is located in the rapid temperature gathering and constant temperature interval formed by the annular copper heat conduction area 31, the temperature collection device 2 and the first heat conducting material 01.

In this embodiment, the circumference of the annular copper heat conduction area 31 is in contact with the inner circumferential wall of the temperature collection device 2, and the temperature collection device 2 is made of stainless steel material with high thermal conductivity.

In this embodiment, an upper cover 4 and a hard circuit board 5 are also included. A main control chip is arranged on the hard circuit board 5. The temperature sensor 6 is connected to the hard circuit board 5 through the flexible circuit board 3. The upper cover 4 is buckled on the upper part of the bottom shell 1. The flexible circuit board 3 and the hard circuit board 5 are arranged between the bottom shell 1 and the upper cover 4. An insulating space 25 is arranged on the upper part of the flexible circuit board 3 corresponding to the annular copper heat conduction area 31.

In this embodiment, the heat-insulating space 25 is provided with a heat-insulating material, or the heat-insulating space 25 is insulated by an air layer.

In this embodiment, the flexible conductive rubber particles 7 and the thin connection auxiliary plate 8 are also included. The thin connection auxiliary plate 8 is provided with a first fixing hole 81 and a second fixing hole 82, and the hard circuit board 5 is provided with a third fixing hole 51;

The thin connection auxiliary board 8 and the hard circuit board 5 are fixed by the first fixing hole 81 and the third fixing hole 51;

The flexible conductive particles 7 are arranged at the second fixing hole 82, and the two ends of the flexible conductive particles 7 are respectively connected to the pads 52 of the rigid circuit board 5 and the pads 34 of the flexible circuit board 3. The pads 52 are also called electrical connection positions, and their area is larger than the diameter of the flexible conductive particles 7, so that stable electrical connection can be achieved without too high assembly precision. The area of the pads 52 is more than 1.05 times the cross-sectional area of the flexible conductive particles 7.

The other side of the flexible circuit board 3 opposite to the solder pad 34 is provided with a backing adhesive 32 , and the flexible circuit board 3 is bonded to the bottom shell 1 via the backing adhesive 32 .

In this embodiment, a cover plate 9 is also included. The cover plate 9 is provided with a blind hole column 91. The bottom shell 1 is provided with a short column 12. The short column 12 passes through the first fixing hole 81 and the third fixing hole 51 in sequence. The short column 12 is sleeved on the inner side of the blind hole of the blind hole column 91.

In this embodiment, the cover plate 9 is provided with a clamping block 92 , the rigid circuit board 5 is provided with a clamping slot 53 , and the clamping block 92 is clamped in the clamping slot 53 .

In this embodiment, the annular copper heat conduction area 31 is located around the temperature sensor 6 , and a gap is provided between the annular copper heat conduction area 31 and the temperature sensor 6 .

In this embodiment, the temperature sampling device 2 includes an annular cavity 21 and a blind hole cavity 22. The annular cavity 21 and the blind hole cavity 22 are arranged in a step shape. The diameter of the annular cavity 21 is larger than the diameter of the blind hole cavity 22. Most of the temperature sensor 6 is embedded in the blind hole cavity 22.

In this embodiment, the first heat-conducting material 01 is in a paste form and is then fixed to encapsulate the temperature sensor 6 .

In this embodiment, a battery 02 is also included. The battery 02 is fixed between the bottom shell 1 and the upper cover 4 . The battery 02 is connected to the hard circuit board 5 via a spring 03 .

Embodiment 3

In this embodiment, the temperature collection device 2 is made of metal or other high thermal conductivity materials, and the circumference of the annular copper heat conduction area 31 is closely attached to the inner side of the temperature collection device 2, so as to achieve the effect of rapid temperature transfer between the annular copper heat conduction area 31 and the temperature collection device 2. The annular copper heat conduction area 31 is set in an open or closed ring.

At the same time, the temperature sensor 6 is placed in the temperature collection device 2, and a small closed space is formed between the annular copper heat conduction area 31 and the temperature collection device 2, and the temperature sensor 6 is wrapped in the closed space. The gap area in the closed space is filled with the paste-like first heat conductive material 81, and the paste-like first heat conductive material 81 wraps the temperature sensor 6 inside it.

At the same time, the annular copper heat conduction area 31 of the flexible circuit board 3 is placed in the temperature collection device 2, and the upper surface of the annular copper heat conduction area 31 has a 0.2-1.5 mm insulation cavity (insulation space 25), and the insulation cavity is insulated by air or filled with insulation material.

The flexible circuit board 3 (FPC) is fixed to the bottom shell 1 by adhesive 32, the thin connection auxiliary board 8 (also called the fixing board) is fixed to the bottom shell 1, the hard circuit board 5 (PCB) is fixed on the thin connection auxiliary board 8, and the soldering pad 34 of the flexible circuit board 3 is directly connected to the soldering pad 52 of the hard circuit board 5, and the flexible conductive rubber particles 7 are placed in the second fixing holes 82 of the thin connection auxiliary board 8. The height of the flexible conductive rubber particles 7 is greater than the distance between the soldering pad 34 of the FPC and the soldering pad 52 of the hard circuit board 5, so that the flexible conductive rubber particles 7 form an elastic compression effect after being fixed, thereby ensuring the effectiveness of the conductive connection.

The other side of the flexible circuit board 3 opposite to the solder pad 34 is provided with adhesive 32, and the flexible circuit board 3 is bonded to the bottom shell 1 through the adhesive 32. The adhesive 32 and the sensor 6 are located on the same side of the flexible circuit board 3.

The thin connection auxiliary plate 8 is fitted onto the short column 12 of the bottom shell 1 through the first fixing hole 81, the flexible conductive rubber particles 7 are loaded into the second fixing hole 82 of the thin connection auxiliary plate 8, and the hard circuit board 5 is fixed onto the short column 12 (positioning column) of the bottom shell 1 through the third fixing hole 51.

During the assembly process, the accessories are fixed completely according to the physical positioning, and the deformability of the flexible conductive particles 7 is utilized to finally achieve a reliable electrical connection. The assembly operation is simple and the temperature measurement response speed is fast.

Embodiment 4

In this embodiment, the annular copper heat conduction area 31 is divided into different sub-blocks, and the temperature sensor 6 is also divided into different sub-blocks. The sub-blocks of the temperature sensor 6 and the sub-blocks of the annular copper heat conduction area 31 are respectively arranged correspondingly, which can greatly improve the detection accuracy and speed.

The above description is only a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements without departing from the principle of the present invention, and these improvements should also be regarded as within the protection scope of the present invention.

Claims (9)

1. A high-precision electronic thermometer capable of realizing rapid temperature measurement, comprising a bottom shell (1), characterized in that it also comprises a temperature sampling device (2) and a flexible circuit board (3), the bottom shell (1) being provided with a through hole (11), and a part of the temperature sampling device (2) passing through the through hole (11) and protruding from the bottom of the bottom shell (1); The flexible circuit board (3) is provided with an annular copper heat conduction area (31), the temperature sensor (6) is protrudingly arranged in the middle of the annular copper heat conduction area (31), the space between the annular copper heat conduction area (31) and the inner wall of the temperature collection device (2) is filled with a first heat conduction material (01), and the temperature sensor (6) is embedded in the first heat conduction material (01); the temperature sensor (6) is embedded in the inner cavity of the temperature collection device (2), and the bottom of the temperature sensor (6) is adjacent to or close to the inner wall of the temperature collection device (2); The bottom of the temperature sensor (6) is larger than the area of the annular vacancy of the annular copper heat conduction area (31); a sensor pad (33) for connecting the signal output electrode of the temperature sensor (6) is arranged in the middle of the annular vacancy; a signal output electrode is arranged in the middle of the bottom of the temperature sensor (6); the area of the signal output electrode is 30% to 80% of the area of the top of the temperature sensor (6); The flexible circuit board (3) at the annular copper heat conduction area (31) is circular in shape as a whole, and due to the single-sided arrangement of the annular copper heat conduction area (31) and the temperature sensor (6), a bow shape is formed, which arches outwards; Copper layers are provided on both sides of the folded edge (321), and the thickness of the outer copper layer (3210) is greater than the thickness of the inner copper layer (3218), resulting in the formation of an arch shape that arches inwards. The inner wall of the ring clamping groove (23) prevents the folded edge (321) from arching inwards, thereby making the folded edge (321) and the ring clamping groove (23) fit tightly together. The thick outer copper layer (3210) also allows the heat collected by the temperature collection device (2) to be quickly transferred inwards. The copper layers on both sides are connected via a heat-conducting hole (35) filled with a second heat-conducting material (02); and a substrate layer (3216) is located between the outer copper layer (3210) and the inner copper layer (3218). 2. The high-precision electronic thermometer capable of realizing rapid temperature measurement as claimed in claim 1, characterized in that the peripheral side of the annular copper heat-conducting area (31) is in contact with the inner peripheral wall of the temperature collection device (2), and the temperature collection device (2) is made of stainless steel material with high thermal conductivity; The annular copper heat-conducting area (31) is provided with a notch, and the temperature sensor (6) transmits the collected parameters to the soldering pad (34) on the other side of the flexible circuit board (3) through the notch; or, the annular copper heat-conducting area (31) is not provided with a notch, and the temperature sensor (6) transmits the collected parameters to the other side of the flexible circuit board (3) opposite to the side provided with the annular copper heat-conducting area (31) through the conductive via of the flexible circuit board (3), and then transmits the parameters to the soldering pad (34) on the other side. 3. The high-precision electronic thermometer capable of realizing rapid temperature measurement as claimed in claim 1, characterized in that it also comprises an upper cover (4) and a hard circuit board (5), wherein a main control chip is arranged on the hard circuit board (5), the temperature sensor (6) is connected to the hard circuit board (5) via the flexible circuit board (3), the upper cover (4) is buckled on the upper part of the bottom shell (1), the flexible circuit board (3) and the hard circuit board (5) are arranged between the bottom shell (1) and the upper cover (4), and a heat insulating space (25) is arranged on the upper part of the flexible circuit board (3) corresponding to the annular copper heat conduction area (31). 4. The high-precision electronic thermometer capable of realizing rapid temperature measurement as claimed in claim 3, characterized in that the heat-insulating space (25) is provided with a heat-insulating material, or the heat-insulating space (25) is insulated by an air layer. 5. The high-precision electronic thermometer capable of realizing rapid temperature measurement as claimed in claim 3, characterized in that it further comprises flexible conductive rubber particles (7) and a thin connection auxiliary plate (8), wherein the thin connection auxiliary plate (8) is provided with a first fixing hole (81) and a second fixing hole (82), and the hard circuit board (5) is provided with a third fixing hole (51); Fixing the thin connection auxiliary plate (8) and the hard circuit board (5) is achieved through the first fixing hole (81) and the third fixing hole (51); The flexible conductive rubber particles (7) are arranged at the second fixing hole (82), and two ends of the flexible conductive rubber particles (7) are respectively connected to the soldering pads (52) of the rigid circuit board (5) and the soldering pads (34) of the flexible circuit board (3). 6. The high-precision electronic thermometer capable of realizing rapid temperature measurement as claimed in claim 5, characterized in that it also comprises a cover plate (9), wherein the cover plate (9) is provided with a blind hole column (91), and the bottom shell (1) is provided with a short column (12), wherein the short column (12) passes through the first fixing hole (81) and the third fixing hole (51) in sequence, and the short column (12) is sleeved on the inner side of the blind hole of the blind hole column (91). 7. The high-precision electronic thermometer capable of realizing rapid temperature measurement as claimed in claim 1, characterized in that the temperature sampling device (2) comprises an annular cavity (21) and a blind hole cavity (22), the annular cavity (21) and the blind hole cavity (22) are arranged in a step-like manner, the diameter of the annular cavity (21) is larger than the diameter of the blind hole cavity (22), and most of the temperature sensor (6) is embedded in the blind hole cavity (22). 8. The high-precision electronic thermometer capable of rapid temperature measurement as claimed in claim 1, characterized in that the outer side of the annular copper heat conduction area (31) and the joint portion of the temperature collection device (2) are fitted with a folded edge (321), and the inner wall of the temperature collection device (2) is provided with a ring clamping groove (23), and the folded edge (321) is clamped in the ring clamping groove (23), thereby improving the heat transfer speed at the joint and improving the stability and reliability of the joint. 9. The high-precision electronic thermometer capable of realizing rapid temperature measurement as claimed in claim 1, characterized in that the second thermal conductive material (02) is set to copper, and the hole copper is filled by hole filling electroplating; The junction between the folded edge (321) and the annular copper heat conducting area (31) adopts a sawtooth transition structure (36), and the sawtooth transition structure (36) is provided with an elliptical transition connection hole (361). After the temperature collection device (2) and the flexible circuit board (3) are assembled, the transition connection hole (361) is filled with a third heat conducting material (06).