CN114839645A - Time of flight TOF module and electronic equipment of making a video recording - Google Patents

Abstract

The present application relates to a time-of-flight TOF camera module and electronic equipment. The camera module includes a circuit board, a transmitting module and a receiving module arranged on the surface of the circuit board, and the transmitting module includes a light source for emitting N beams of spot light. and a projection lens for collimating and projecting N beams of spot light, and a receiving module for receiving N returned depth light signals and converting them into electrical signals. The FOV of the projection lens satisfies 65°<FOV<80°, the F-number of the projection lens is less than 1.9, and the focal length is 1.2<f<1.4. Through the design of the projection lens, the N beams of spot light emitted by the light source pass through the projection lens and are directly projected onto the target object with a predetermined field of view and intensity, without the need to duplicate the optical signal or set up optical signal duplication components, saving cost, reduces the thickness of the entire camera module, and also reduces the assembly difficulty of the camera module. Since the N beam spot light directly reaches the target object after passing through the projection lens, the loss of light is reduced and the utilization rate of the light source is improved.

Description

A time-of-flight TOF camera module and electronic equipment

technical field

The present application relates to the technical field of electronic products, and in particular, to a time-of-flight TOF camera module and electronic equipment.

Background technique

Time of Flight (TOF) camera module is a commonly used depth camera module, which can be used to measure depth of field (depth) or distance information, and can realize three-dimensional imaging or distance detection of target objects by electronic equipment. The TOF camera module generally includes an optical signal transmitting (Tx) module and an optical signal receiving (Rx) module. The optical signal emission module of the existing TOF camera module usually includes a transmitter chip, a collimator lens and a diffractive projection lens (Diffractive Optical Elements, DOE). After the multiples of the optical fiber are copied, the speckle light signal is transmitted outward into multiple areas, so as to expand the measurement range of the TOF camera module and improve the measurement accuracy of the depth measurement. However, the structure of the existing TOF is relatively complex, the assembly is difficult and the cost is high.

SUMMARY OF THE INVENTION

The present application provides a time-of-flight TOF camera module and electronic equipment, which are used for simplifying the structure of the camera module, reducing processing difficulty and reducing costs.

The embodiment of the present application provides a time-of-flight TOF camera module, which is used to project a speckle light array composed of N specks to a target object with a target field of view angle, and the camera module includes:

a circuit board, the upper surface of which at least includes a first area and a second area that do not overlap each other;

The emission module is arranged in the first area of the circuit board, the emission module includes a light source and a projection lens, the light source is used to emit N beams of spot light, and the FOV of the projection lens satisfies: 65°< FOV<80°, the F-number of the projection lens is less than 1.9, the focal length is 1.2<f<1.4, the projection lens is used for collimating the N beams of spot light and projecting the N beams of spot light to the target object to generate a speckle light array consisting of the N specks on the target object; and

a receiving module, which is arranged in the second area of the circuit board, the receiving module is used for receiving the depth light signals returned after the N speckle arrays are irradiated on the target object and used for converting the depth Optical signals are converted into electrical signals.

In a possible implementation manner, the projection lens satisfies: 0.1<|Y/(f*TTL)|<0.4, where f is the focal length of the projection lens, and Y is the maximum object height of the projection lens , TTL is the distance from the diaphragm surface of the projection lens to the imaging surface.

In a possible implementation manner, the projection lens satisfies: 0.3<f/TTL<0.5, where f is the focal length of the projection lens, and TTL is the distance between the diaphragm surface of the projection lens and the imaging surface distance.

In a possible implementation manner, the projection lens satisfies: 0.2<Y/TTL<0.4, where Y is the maximum object height of the projection lens, and TTL is the distance between the diaphragm surface of the projection lens and the imaging surface distance between.

In a possible implementation manner, the FOV of the projection lens is FOV=71.9°.

In a possible implementation, the F-number of the projection lens is equal to 1.76.

In a possible implementation manner, the projection lens is provided with a diaphragm and a lens group in sequence from the imaging side to the light source side, and the lens group includes at least two lenses.

In a possible implementation manner, the lens group includes a first lens, a second lens and a third lens arranged in sequence from the imaging side to the light source side;

The first lens is a lens with positive refractive power, the first lens is concave on the paraxial imaging side, the first lens is convex on the paraxial light source side, and the two surfaces of the first lens are At least one face is aspheric;

The second lens is a lens with negative refractive power, the second lens is concave on the paraxial imaging side, and is convex on the paraxial light source side, and at least one of the two surfaces of the second lens is The surface is aspheric;

The third lens is a lens with positive refractive power, the third lens is convex on the paraxial imaging side, and at least one of the two surfaces of the third lens is an aspheric surface.

In a possible implementation manner, the camera module includes a first lens barrel and a second lens barrel, and the receiving module includes an image sensor chip, an imaging lens, and a filter;

the first lens barrel is mounted on the first area of the circuit board, the projection lens is fixed on the first lens barrel and is arranged above the light source;

The second lens barrel is installed in the second area of the circuit board, the image sensor chip is accommodated in the second lens barrel, and the imaging lens is fixed in the second lens barrel and arranged on the The upper part of the image sensor chip is used for imaging the depth light signal to the image sensor chip, and the filter is located between the imaging lens and the image sensor chip.

In a possible implementation manner, the camera module further includes a ceramic substrate, the light source is disposed on the prime number circuit board through the ceramic substrate, and the projected area of the ceramic substrate on the upper surface of the circuit board is less than the area of the upper surface.

In a possible implementation manner, the first lens barrel is mounted on the circuit board through the ceramic substrate.

In a possible implementation manner, the camera module further includes a driver, and the driver is mounted on the circuit board and used to drive the light source to emit light.

In a possible implementation manner, the driving member is mounted on the circuit board through a ceramic substrate, and the driving member and the light source are located on the same side of the ceramic substrate.

In a possible implementation, the circuit board has a lower surface opposite to the upper surface, the lower surface is provided with a concave portion concave toward the upper surface, and at least part of the driving member located in the depression.

In a possible implementation manner, a reinforcing plate is provided on the lower surface of the circuit board.

The application also provides an electronic device, comprising:

The time-of-flight TOF camera module as described in any one of the above, the time-of-flight TOF camera module is used to measure the depth information of the target object;

The control unit is configured to operate and control at least one function of the electronic device according to the depth information.

The present application relates to a time-of-flight TOF camera module and electronic equipment. The camera module includes a circuit board, a transmitting module and a receiving module arranged on the surface of the circuit board, and the transmitting module includes a light source for emitting N beams of spot light. and a projection lens for collimating and projecting N beams of spot light, and a receiving module for receiving N returned depth light signals and converting them into electrical signals. The FOV of the projection lens satisfies 65°<FOV<80°, the F-number of the projection lens is less than 1.9, and the focal length is 1.2<f<1.4. Through the design of the projection lens, the N beams of spot light emitted by the light source pass through the projection lens and are directly projected onto the target object with a predetermined field of view and intensity, without the need to duplicate the optical signal or set up optical signal duplication components, saving The cost is reduced, the thickness of the entire camera module is reduced, and the assembly difficulty of the camera module is also reduced. Further, since the N beams of spot light directly reach the target object after passing through the projection lens, the loss of light is reduced, and the utilization rate of the light source is greatly improved.

It should be understood that the foregoing general description and the following detailed description are exemplary only and do not limit the application.

Description of drawings

1 is a schematic structural diagram of a camera module provided by the application;

2 is a schematic diagram of the internal structure of the first embodiment of the camera module provided by the application;

3 is a schematic diagram of a projection lens provided by the application;

4 is a schematic diagram of the internal structure of the camera module according to the second embodiment of the present application;

5 is a schematic diagram of the internal structure of a camera module according to a third embodiment of the present application;

FIG. 6 is a schematic structural diagram of the circuit board and the reinforcement board provided by the application.

Reference number:

1- launch module;

11 - light source;

12 - Projection lens;

121 - diaphragm;

122 - the first lens;

123 - the second lens;

124 - the third lens;

13 - the first lens barrel;

2-Receive module;

21-Second lens barrel;

22 - image sensor chip;

23-imaging lens;

24 - filter;

3- circuit board;

31 - depression;

4-ceramic substrate;

5-Driver;

6- Reinforcing plate.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description serve to explain the principles of the application.

Detailed ways

In order to better understand the technical solutions of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

It should be clear that the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. As used in the embodiments of this application and the appended claims, the singular forms "a," "the," and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise.

It should be understood that the term "and/or" used in this document is only an association relationship to describe the associated objects, indicating that there may be three kinds of relationships, for example, A and/or B, which may indicate that A exists alone, and A and B exist at the same time. B, there are three cases of B alone. In addition, the character "/" in this document generally indicates that the related objects are an "or" relationship.

It should be noted that the directional words such as "up", "down", "left", and "right" described in the embodiments of the present application are described from the angles shown in the drawings, and should not be construed as implementing the present application. Example limitation. Also, in this context, it should also be understood that when an element is referred to as being "on" or "under" another element, it can not only be directly connected "on" or "under" the other element, but also Indirectly connected "on" or "under" another element through intervening elements.

As shown in FIG. 1 and FIG. 2 , an embodiment of the present application provides a time-of-flight TOF camera module. The camera module includes a circuit board 3 , a transmitter module 1 and a receiver module 2 , and the circuit board 3 has a thickness along the direction of its thickness. The upper surface and the lower surface are provided, wherein the upper surface is provided with a first area and a second area that do not overlap with each other, the emission module 1 is arranged in the first area, and the emission module 1 includes a light source 11 and a projection lens 12. 11 is used to emit N beams of spot light, and the specific value of N can be set according to actual needs. The projection lens 12 is used to process the light signal emitted by the light source 11 into a speckle light signal. The light source 11 may be a vertical cavity surface emitting laser (VCSEL), a light emitting diode (Light Emitting Diodes, LED) or other light sources 11 or an array composed of a plurality of the above-mentioned light sources 11, and the light source 11 may be a single chip with multiple For a point-emitting VCSEL chip, a plurality of light-emitting points are arranged in a two-dimensional matrix, and correspondingly emit multiple laser signals to form a matrix optical signal array. The projection lens 12 is used for collimating the N beams of spot light and transmitting the N beams of spot light to the target object, so as to generate a speckle light array composed of N speckles on the target object. The receiving module 2 is arranged in the second area of the circuit board 3 and is used for receiving the depth light signals returned after the N speckle light arrays irradiate the target object and for converting the depth light signals into electrical signals. The field of view (FOV) of the projection lens 12 satisfies: 65°<FOV<80°, the F number of the projection lens is less than 1.9, and the focal length is 1.2<f<1.4.

Field of View (FOV): It is used to characterize the field of view of the lens. In the case of the same lens size, the larger the FOV of the lens, the larger the projected field of view of the lens.

Distortion: It is used to measure the degree of visual distortion of the image. The smaller the distortion, the better the imaging effect.

Relative Illumination (RI): refers to the ratio of the illuminance of different coordinate points on the imaging surface to the illuminance of the center point. The problem of exposure affects the image quality; the greater the relative illumination, the higher the image quality.

Working F-number, or F-number (F-number, Fno): that is, the reciprocal of the relative aperture of the lens, which is used to characterize the amount of light entering the photosensitive chip through the lens. The lower the F-number, the greater the amount of light entering the lens.

Under normal circumstances, the existing TOF module can change the diameter and divergence angle of the beam in the dimming system through the collimating lens, so that the beam becomes a collimated parallel beam, so that the beam energy is more concentrated, so that small high power can be obtained. Density spot. When the speckle light signal needs to be obtained, an optical duplication element is further added above the collimating lens, so that the collimated light signal is duplicated to obtain the speckle light signal. Optionally, the optical signal replicating element can be at least one or more of diffractive optical elements (Diffractive Optical Elements, DOE), Micro Lens Array (MLA), grating or any other optical elements that can form spot light. combination of components. DOE is usually made of glass or plastic material, and is used to reproduce the light beam emitted by the light source at a certain multiple and then project it into a speckle light signal in multiple areas. Taking the DOE as an example, the optical signal is duplicated through the DOE to increase the number of optical signals, so as to meet the requirement of the receiving module 2 for the number of optical signals, so as to improve the accuracy of measurement. For example, the array optical signal sent by the transmitter chip includes n optical signals, and the replication multiple of the DOE is m. After the DOE is replicated, n*m optical signals are formed, and the receiving module 2 can receive n*m returned from the target object. m optical signals, thereby improving the accuracy of the measurement. However, when the light passes through the DOE, more than 10% energy loss will occur. The optical efficiency of the existing emission module 1 including the collimating lens and the diffractive optical element is usually 56% and the F number is 2.83. Therefore, the power of the TOF module needs to be increased. The single-hole optical power requirement is usually 100mW, and a boost circuit (boost circuit) is usually required. When the TOF module is damaged, the light emitted by the transmitter chip will easily cause harm to the human body. Therefore, an indium tin oxide (ITO) protection circuit needs to be set up, and the protection circuit needs to include metal shrapnel as positive and negative electrodes. The number of components in the TOF module increases, the structure is complex, the assembly is difficult, and the material cost is high.

Compared with the existing optical signal processing to be a collimated optical signal, the solution provided by the embodiment of the present application can process the optical signal emitted by the light source 11 through the projection lens 12 so that the optical signal forms a speckle light array. The illumination range of a single optical signal can be increased to a certain extent, so that the processed optical signal can meet the needs of use, so that the optical signal copying element can be omitted, therefore, the loss of the optical signal during propagation can be reduced, which is beneficial to improve the optical efficiency. , the optical efficiency can reach 80%. Due to the high optical efficiency, the single-hole optical power can be reduced, usually to 7mW, so the booster circuit can be omitted, and the structure of the TOF module can be simplified. , the safety of the TOF module has also been improved, and the protection circuit and related components of the protection circuit can be omitted. While simplifying the structure of the TOF module, it can also reduce the difficulty of assembly, and can reduce the cost of materials and more in line with the actual use needs.

Through the design of the projection lens 12, after the N beams of spot light emitted by the light source 11 pass through the projection lens 12, they are directly projected onto the target object with a predetermined angle of view and intensity, without duplicating the optical signal or setting up an optical signal duplicating element , the cost is saved, the thickness of the entire camera module is reduced, and the assembly difficulty of the camera module is also reduced. Since the N beams of spot light directly reach the target object after passing through the projection lens 12 , the loss of light is reduced and the utilization rate of the light source 11 is improved.

The transmitting module 1 and the receiving module 2 share a circuit board 3 and are arranged on the same surface. During installation, a common reference point or mutual reference can be referred to, which is beneficial to reduce the gap between the transmitting module 1 and the receiving module 2. The alignment tolerance can reduce the angle between the optical axis of the transmitting module 1 and the relative optical axis of the receiving module 2, which can improve the imaging function or distance detection function of the camera module, and can also reduce the cost of the circuit board 3. The transmitter module 1 and the receiver module 2 no longer need metal brackets during the assembly process, which not only helps to reduce the bracket cost of the camera module, but also saves the assembly process of additional metal brackets, which is conducive to reducing camera module costs. The assembly process cost of the module.

In a possible implementation, various parameters of the projection lens 12 can be designed so that the projection lens 12 can have a larger FOV and a smaller F-number. f is the focal length of the projection lens 12 , Y is the maximum image height on the image plane of the camera module, and TTL is the distance between the diaphragm 121 and the light source 11 . For example, f, Y and TTL can satisfy 0.1<|Y/(f*TTL)|<0.4.

The f, Y, and TTL of the projection lens 12 affect the FOV and F number of the projection lens, and f, Y, and TTL also restrict and influence each other. The projection lens 12 can obtain a larger wide-angle field of view, detect a larger range, and can make the projection lens 12 have a smaller F number so that the mobile phone has more light, so as to improve the performance of the lens.

When the relationship between f, Y, and TTL of the projection lens is 0.1<|Y/(f*TTL)|<0.4, the FOV of the projection lens 12 satisfies 60°<FOV<85°. The FOV of the lens 12 meets the requirements of 65°<FOV<85°, 65°<FOV≤80°, 65°<FOV≤75°, or 65°<FOV≤70°, etc., so as to meet the accuracy requirements and field of view requirements of depth detection. Balance, when the relationship between f, Y, and TTL of the projection lens 12 is 0.1<|Y/(f*TTL)|<0.4, the F number of the projection lens 12 is less than 1.9, and further, the projection lens 12 The F-number satisfies: the F-number is less than 1.8, etc., so that the projection lens 12 can collect more light.

It should be understood that the above-mentioned preset conditions are the conditions that f, Y, and TTL of the projection lens 12 should satisfy when designing the projection lens 12, so as to improve the projection performance of the projection lens 12 while ensuring the required FOV and F numbers , in some cases, in order to obtain better projection performance, the preset conditions can be adjusted appropriately, for example, the preset conditions can be adjusted to: 0.1<|Y/(f*TTL)|<0.30, 0.2<| Y/(f*TTL)|<0.30, 0.1<|Y/(f*TTL)|<0.25, 0.15<|Y/(f*TTL)|<0.30 or 0.15<|Y/(f*TTL)| <0.25 etc.

In a possible implementation, at least one of 0.3<f/TTL<0.5 and 0.2<Y/TTL<0.4 can also be satisfied between f, Y and TTL of the projection lens 12 .

By further limiting the parameters of the projection lens 12, the FOV of the projection lens 12 can be made as large as possible within the above-mentioned range, and the F-number of the projection lens can be made as small as possible within the above-mentioned range. The above preset conditions can be further adjusted to: 0.3<f/TTL<0.46, 0.4<f/TTL<0.46, 0.2<Y/TTL<0.35, 0.25<Y/TTL<0.35 or 0.2<Y/TTL<0.3, etc. .

In a possible implementation, the parameters of the projection lens 12 can be satisfied by limiting the above parameters: FOV=71.9°, and the F number is equal to 1.76.

The camera module provided by the embodiment of the present application has a smaller F-number and a larger FOV, which can improve the optical efficiency of the camera module and the transmittance of light. The transmittance of the existing TOF module (including DOE) is usually 56%, while the transmittance of the camera module provided by the embodiment of the present application can reach 80%.

In a possible implementation manner, the projection lens 12 includes a diaphragm 121 and a lens group, and the lens group includes at least two lenses. By adjusting the structure and parameters of the lens group, the parameters of the projection lens 12 meet the aforementioned conditions .

As shown in FIG. 3 , in a possible implementation manner, the projection lens 12 is sequentially provided with a diaphragm 121 , a first lens 122 , a second lens 123 and a third lens 124 from the imaging side (projection target side) to the light source side , the first lens 122 is a positive refractive power lens, the first lens 122 is a convex surface on the paraxial light source side, and at least one of the two surfaces of the first lens 122 is aspherical. The second lens 123 is a negative refractive power lens, the second lens 123 is concave on the paraxial imaging side, and convex on the paraxial light source side, and at least one of the two surfaces of the second lens 123 is aspherical . The third lens 124 is a positive refractive power lens, the third lens 124 is convex on the paraxial imaging side, and at least one of the two surfaces of the third lens 124 is aspheric.

The first lens 122 is a positive refractive power lens, and the focal length is f1. The positive refractive power distribution of the first lens 122 can expand the angle at which the light exits, and can increase the field of view FOV. The axis curvature radius is R1, the paraxial curvature radius of the side surface of the light source is R2, and the first lens 122 can satisfy the following conditions: -1<f1/R1<-0.2; -2.5<f1/R2<-1.5; 2<R1/ R2<4.5. Through the above conditions, the curvature radii of the two surfaces of the first lens 122 can be reasonably distributed, which is helpful for correcting aberrations when the light is deflected.

The second lens 123 is a negative power lens with a focal length of f2. The negative power distribution of the second lens 123 can effectively correct aberrations and improve the quality of projection. The paraxial curvature radius of the imaging side surface of the second lens 123 is R3, the paraxial radius of curvature of the side surface of the light source is R4, and the second lens 123 can satisfy the following conditions: 2<f2/R3<4.5; 0.4<f2/R4<2; 0.25<R3/R4<0.45. A reasonable distribution of the radii of curvature of the two surfaces of the second lens 123 helps the lens to better correct aberrations while contributing negative power.

The second lens 123 is a lens with positive refractive power, the focal length is f3, the paraxial radius of curvature of the imaging side surface of the third lens 124 is R5, the paraxial radius of curvature of the light source side surface is R6, and the third lens 124 satisfies the following conditions: 1.4<f3/R5<1.6; 0.2<f3/R6<0.1; -0.2<R5/R6<0.1.

The third lens 124 is the lens closest to the light source 11 . After the light is emitted from the light source 11 , it first passes through the third lens 124 with positive refractive power to deflect the light, which can effectively reduce the effective apertures of the first lens 122 and the second lens 123 , while ensuring that the projection lens 12 has a larger field of view FOV.

In addition, since 2<R1/R2<4.5, 0.2<R3/R4<0.45, -0.2<R5/R6<0.1, by designing the respective curvature radii of the three lenses in the lens 110, the FOV of the lens 110 and the While the F number meets the requirements, the sensitivity of the lens 110 can be reduced, and the yield of the product can be improved.

The number of lenses in the lens group can be adjusted, which can be two lenses or four or more lenses, and the parameters of each lens can be adjusted so that the projection lens 12 meets the aforementioned preset conditions.

When the number of lenses is too large, the volume of the transmitting module 1 increases, and the overall volume of the camera module increases. Moreover, the positions of the receiving module 2 and the transmitting module 1 need to be matched with each other. Normally, the receiving module 2 and the transmitting module 1 are approximately at the same height. When the volume and position of the transmitting module 1 change, the position of the receiving module 2 also needs to be adjusted accordingly, which makes the overall design of the camera module more difficult, and the cost of the projection lens 12 is relatively high due to the increase in the number of lenses. high. When the number of lenses is too small, the ability of the lenses to process light signals is relatively poor. Under normal circumstances, four lenses can be arranged inside the receiving module 2. Since the transmitting module 1 is provided with a light source 11, the light source 11 will occupy a certain space. In order to make the height of the transmitting module 1 and the receiving module 2 approximately the same , the volume of the projection lens 12 can be reduced by reducing the number of lenses of the projection lens 12 , thereby reducing the impact on the volume of the emission module 1 . Considering factors such as structure, processing difficulty, cost, etc., the projection lens 12 using three lenses is a more preferable solution.

In a possible implementation manner, the focal length of the projection lens 12 is f, the focal length of the first lens 122 is f1, the focal length of the second lens 123 is f2, the focal length of the third lens 124 is f3, and the focal length between the lenses is f3. The assignments satisfy the following conditions: 0.8<f1/f<1.3, -1.3<f2/f<-0.5, 0.4<f3/f<1.1, -1.3<f2/f1<-0.5, 0.3<f3/f1<1.

By designing the respective focal lengths of the three lenses, the focal lengths of the first lens 122, the second lens 123 and the third lens 124 are reasonably allocated, so that the projection lens 12 can have a larger FOV range and a smaller F number, At the same time, the aberrations are better corrected, and the projection quality of the projection lens 12 is effectively improved.

The radius of curvature satisfies the following conditions: 2<r1/r2<4.5, 0.25<r3/r4<0.45, -0.2<r5/r6<0.1.

Such a design can reduce the sensitivity of the lens group and improve the product yield.

The thickness of the first lens 122 on the optical axis is CT1, the thickness of the second lens 123 on the optical axis is CT2, and the thickness of the third lens 124 on the optical axis is CT3. The three lenses satisfy the following conditions: 0.5<CT1/CT2<1.5, 0.2<CT2/CT3<1.

By designing the central thickness of the lens, that is, the thickness of the lens along the optical axis direction, the lens can have a reasonable thickness, so that the projection lens 12 is relatively strong, which is beneficial to improve the service life of the projection lens 12 .

The first lens material has a refractive index of n1 and a dispersion coefficient of v1, the second lens has a refractive index of n2 and a dispersion coefficient of v2, and the third lens has a refractive index of n3 and a dispersion coefficient of v3. And the following conditions are met: n1>1.60, n2>1.60, n2>1.60, v1>22.0, v2>22.0 and v3>22.0.

By designing the refractive index and dispersion coefficient of the material of each lens, the production cost can be reduced, the dispersion can be reduced, and a suitable aberration balance can be provided.

In a possible implementation, the parameters of the projection lens 12 can be adjusted so that the projection lens 12 satisfies: f=1.35mm, F number=1.78, FOV=72°, TTL=3.29mm.

Specifically, in this embodiment, other parameters of the projection lens 12 satisfy:

Table 1

Table 3 is the aspheric high-order coefficients A4, A6, A8, A10, A12, A14, A16 of the aspheric lens:

Table 2

As shown in FIG. 2 , in a possible implementation manner, the camera module includes a first lens barrel 13 and a second lens barrel 21 , and the receiving module 2 further includes an image sensor chip 22 , an imaging lens 23 and a filter 24 , the first lens barrel 13 is mounted on the first area of the circuit board 3 , the projection lens 12 is fixed on the first lens barrel 13 , and is mounted above the light source 11 . The first lens barrel 13 is used to mount and protect the projection lens 12 . The second lens barrel 21 is installed in the second area of the circuit board 3 and can accommodate the image sensor chip 22 , and the imaging lens 23 is fixed in the second lens barrel 21 and is disposed above the image sensor chip 22 to transmit the depth light The signal is imaged to the image sensor chip 22, and the filter 24 is located between the imaging lens 23 and the image sensor chip 22, that is, along the direction away from the upper surface of the circuit board 3, the image sensor chip 22, the filter 24, and the imaging lens 23 are in sequence set up.

As shown in FIG. 2 , in a possible implementation manner, the camera module includes a ceramic substrate 4 , the light source 11 is mounted on the upper surface of the circuit board 3 through the ceramic substrate 4 , and the ceramic substrate 4 is on the upper surface of the circuit board 3 . The projected area is smaller than the area of the upper surface.

The light source 11 generates a large amount of heat during operation, and the VCSEL is usually a porous structure, which is prone to deformation and fragmentation. The ceramic material has the advantages of high heat dissipation efficiency and good thermal stability, which can improve the heat dissipation efficiency, thereby reducing the VCSEL chip. The occurrence of thermal deformation improves the working stability of the camera module and is more in line with the actual use requirements. Appropriately reducing the area of the ceramic substrate 4 can save the overall cost of the camera module.

As shown in FIG. 4 , in a possible implementation manner, the first lens barrel 13 is mounted on the circuit board 3 through the ceramic substrate 4 .

By connecting the first lens barrel 13 to the ceramic substrate 4 , the positioning of the first lens barrel 13 can be facilitated during installation, and the space occupied by the first lens barrel 13 on the circuit board 3 can also be saved, so that the camera module can be The structure is more compact, which is beneficial to the miniaturized design of the camera module.

As shown in FIG. 5 , in a possible implementation manner, the camera module further includes a driving member 5 , which is mounted on the circuit board 3 for driving the light source 11 to emit light.

As shown in FIG. 5 , in a possible implementation manner, the driver 5 is mounted on the circuit board through the ceramic substrate 4 , and the driver 5 and the light source 11 are located on the same side of the ceramic substrate 4 .

Through such a design, the ceramic substrate 4 can be used to dissipate heat to the driving member 5 , which is beneficial to improve the working stability of the driving member 5 . Being integrated inside the first lens barrel 13 can also reduce the space occupied by the driving member 5 on the circuit board 3 , which is beneficial to reducing the size of the circuit board 3 and reducing the cost.

In a possible implementation, the circuit board 3 has a lower surface opposite to the upper surface, and the driving member 5 can be mounted on the lower surface of the circuit board 3 .

By installing the driver 5 on the side of the circuit board where the transmitting module 1 and the receiving module 2 are located, the utilization rate of the circuit board 3 can be improved, and the volume of the circuit board 3 can be reduced, thereby saving costs.

As shown in FIG. 6 , in a possible implementation manner, a concave portion 31 is provided on the lower surface of the circuit board 3 , and the concave portion 31 may be a groove or a through hole or the like. The concave portion 31 is concave toward the direction close to the upper surface of the circuit board 3 , and at least part of the driving member 5 is located in the concave portion 31 .

By arranging the driver 5 on the side of the circuit board 3 away from the transmitting module 1 and the receiving module 2 , the utilization rate of the circuit board 3 can be improved, and the area of the circuit board 3 can be reduced, thereby helping to reduce the size of the circuit board 3 . size. The concave portion 31 can facilitate the positioning of the driving member 5 , and is also beneficial to reduce the size of the camera module in the thickness direction of the circuit board 3 .

As shown in FIG. 6 , in a possible implementation manner, a reinforcing plate 6 may be provided on the lower surface of the circuit board 3 .

In a possible implementation manner, the circuit board 3 may be a flexible circuit board 3 or a flex-rigid board or a printed circuit board 3 .

The reinforcing plate 6 can be, but not limited to, steel sheet reinforcement. When the circuit board 3 is a rigid-flex board, it can also include a reinforcing member to improve the flatness of the camera module. The reinforcing plate 6 may be provided with an avoidance structure at a position corresponding to the concave portion 31 .

Since the camera module provided by the embodiment of the present application can omit components such as DOE, protection circuit, photodiode (PD), etc., during assembly, the steps can be simplified, the assembly efficiency can be improved, and the cost can be reduced.

Based on the time-of-flight TOF camera module involved in the above embodiments, the embodiment of the present application also provides an electronic device, the electronic device includes a camera module and a control unit, the camera module is used to measure the depth information of the target object, control the The unit is used for operating and controlling at least one function of the electronic device according to the depth information. The camera module can be the TOF camera module involved in any of the above embodiments. Since the camera module has the above technical effects, the electronic equipment including the camera module also has corresponding technical effects. It is not repeated here.

The embodiment of the present application provides a time-of-flight TOF camera module and electronic equipment. The camera module includes a circuit board 3, a transmitter module 1 and a receiver module 2 disposed on the upper surface of the circuit board 3, and the transmitter module 1 includes a For the light source 11 for emitting N beams of spot light and the projection lens 12 for collimating and projecting the N beams of spot light, the receiving module 2 is used for receiving the N returned depth light signals and converting them into electrical signals. The FOV of the projection lens 12 satisfies 65°<FOV<80°, the F-number of the projection lens 12 is less than 1.9, and the focal length is 1.2<f<1.4. Through the design of the projection lens 12, after the N beams of spot light emitted by the light source 11 pass through the projection lens 12, they are directly projected onto the target object with a predetermined angle of view and intensity, without duplicating the optical signal or setting up an optical signal duplicating element , the cost is saved, the thickness of the entire camera module is reduced, and the assembly difficulty of the camera module is also reduced. Further, since the N beams of spot light directly reach the target object after passing through the projection lens, the loss of light is reduced, and the utilization rate of the light source is greatly improved.

The above descriptions are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the protection scope of this application.

Claims (17)

1. The utility model provides a time of flight TOF module of making a video recording, its speckle light array that is used for throwing N speckles to constitute with target field angle to target object, its characterized in that, the module of making a video recording includes:

the circuit board at least comprises a first area and a second area which are not overlapped on the upper surface of the circuit board;

the transmitting module is arranged in the first area of the circuit board and comprises a light source and a projection lens, the light source is used for transmitting N beam spots, and the field angle FOV of the projection lens meets the following requirements: 65 ° < FOV < 80 °, an F-number of the projection lens less than 1.9, a focal length 1.2 < F < 1.4, the projection lens for collimating and projecting the N beam spot lights to the target object to produce a speckle light array of the N speckles on the target object; and

and the receiving module is arranged in a second area of the circuit board and is used for receiving the depth optical signals returned after the N speckle arrays irradiate the target object and converting the depth optical signals into electric signals.

2. The time-of-flight TOF camera module according to claim 1, wherein the projection lens satisfies: 0.1< | Y/(f × TTL) | <0.4, wherein f is the focal length of the projection lens, Y is the maximum object height of the projection lens, and TTL is the distance between the diaphragm surface and the imaging surface of the projection lens.

3. The time-of-flight TOF camera module according to claim 1, wherein the projection lens satisfies: f/TTL is more than 0.3 and less than 0.5, wherein f is the focal length of the projection lens, and TTL is the distance between the diaphragm surface and the imaging surface of the projection lens.

4. The time-of-flight TOF camera module according to claim 1, wherein the projection lens satisfies: Y/TTL is more than 0.2 and less than 0.4, wherein Y is the maximum object height of the projection lens, and TTL is the distance between the diaphragm surface and the imaging surface of the projection lens.

5. The time-of-flight TOF camera module according to claim 1, wherein the field angle FOV of the projection lens is 71.9 °.

6. The time of flight TOF camera module of claim 1, wherein the F-number of the projection lens is equal to 1.76.

7. The time of flight TOF camera module of any of claims 1 to 6, wherein the projection lens is provided with a stop and a lens group in sequence from the imaging side to the light source side, the lens group comprising at least two lenses.

8. The time of flight TOF camera module of claim 7, wherein said lens group comprises a first lens, a second lens and a third lens arranged in sequence from an imaging side to a light source side;

the first lens is a lens with positive focal power, the imaging side of the first lens at the paraxial region is a concave surface, the light source side of the first lens at the paraxial region is a convex surface, and at least one surface of the two surfaces of the first lens is an aspheric surface;

the second lens is a lens with negative focal power, the second lens is a concave surface on the imaging side of a paraxial region, the second lens is a convex surface on the light source side of the paraxial region, and at least one of the two surfaces of the second lens is an aspheric surface;

the third lens is a lens with positive focal power, the image side of the third lens at the paraxial region is a convex surface, and at least one surface of the two surfaces of the third lens is an aspheric surface.

9. The time-of-flight TOF camera module of claim 1, wherein the camera module comprises a first barrel and a second barrel, the receiving module comprises an image sensor chip, an imaging lens and a filter;

the first lens barrel is arranged in a first area of the circuit board, and the projection lens is fixed on the first lens barrel and arranged above the light source;

the second lens cone is arranged in a second area of the circuit board, the image sensor chip is accommodated in the second lens cone, the imaging lens is fixed in the second lens cone and arranged above the image sensor chip and used for imaging the depth light signal to the image sensor chip, and the optical filter is positioned between the imaging lens and the image sensor chip.

10. The time of flight TOF camera module of claim 9, further comprising a ceramic substrate through which the light source is disposed on a prime circuit board, wherein a projected area of the ceramic substrate on an upper surface of the circuit board is smaller than an area of the upper surface.

11. The time-of-flight TOF camera module of claim 10, wherein the first barrel is mounted to the circuit board through the ceramic substrate.

12. The time of flight TOF camera module of claim 1, further comprising an actuator mounted to the circuit board for actuating the light source to emit light.

13. The time of flight TOF camera module of claim 12, wherein the driver is mounted to the circuit board through a ceramic substrate, and wherein the driver and the light source are located on a same side of the ceramic substrate.

14. The time of flight TOF camera module of claim 12, wherein the circuit board has a lower surface opposite the upper surface, the lower surface being provided with a recess recessed in the direction of the upper surface, at least a portion of the driver being located in the recess.

15. The time-of-flight TOF camera module of claim 1, wherein the circuit board is a flexible circuit board or a rigid-flex board or a printed circuit board.

16. The time of flight TOF camera module of claim 1, wherein a lower surface of the circuit board is provided with a stiffener.

17. An electronic device, comprising:

a time of flight TOF camera module according to any one of claims 1 to 16 for measuring depth information of a target object;

and the control unit is used for carrying out operation control on at least one function of the electronic equipment according to the depth information.

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