CN114839548A - Information collection device and battery module - Google Patents

Abstract

The invention provides an information acquisition device and a battery module, wherein the information acquisition device comprises: a circuit board; the acquisition chip is electrically connected with the circuit board and is suitable for contacting with the sampling carrier and used for acquiring the temperature of the sampling carrier. From this, when the sampling carrier is a plurality of, through set up information acquisition device on a plurality of sampling carriers respectively to with a plurality of information acquisition device series connection in proper order, compare with prior art, on the basis of the temperature of gathering a plurality of sampling carriers simultaneously, information acquisition device has higher commonality, and can make information acquisition device's design cost reduce, thereby can reduce the cost of setting up information acquisition device on the sampling carrier.

Description

Information collection device and battery module

technical field

The present invention relates to the technical field of batteries, in particular to an information collection device and a battery module having the information collection device.

Background technique

In the related art, the information collection device is used to collect the temperature of the sampling carrier. When there are multiple sampling carriers, the information collection device needs to collect the temperature of the multiple sampling carriers at the same time. Designing different styles of information collection devices for different sampling carriers not only results in low versatility of the information collection devices, but also causes the design cost of the information collection devices to be too large, thereby increasing the cost of arranging the information collection devices on the sampling carriers.

SUMMARY OF THE INVENTION

In view of this, the present invention aims to provide an information collection device, which can simultaneously collect the temperature of a plurality of sampling carriers, has higher versatility, and can reduce the design cost of the information collection device , so that the cost of arranging the information collection device on the sampling carrier can be reduced.

In order to achieve the above object, the technical scheme of the present invention is achieved in this way:

An information collection device includes: a circuit board; a collection chip, the collection chip is electrically connected to the circuit board, and the collection chip is adapted to be in contact with a sampling carrier and used to collect the temperature of the sampling carrier.

In some examples of the present invention, the collection chip has a temperature collection area adapted to be in contact with the sampling carrier.

In some examples of the present invention, the circuit board is provided with a mounting hole, and the acquisition chip is mounted in the mounting hole.

In some examples of the present invention, a heat conduction layer is provided on the side of the collection chip for contacting with the sampling carrier.

In some examples of the present invention, the thermally conductive layer is configured as a thermally conductive glue layer.

In some examples of the present invention, the information collection device further includes: a voltage collection part, the voltage collection part is electrically connected to the circuit board, and the voltage collection part is used for being electrically connected with the sampling carrier to collect the sampling carrier voltage.

In some examples of the present invention, the voltage collecting part is configured as a metal sheet.

In some examples of the present invention, a side of the circuit board for contacting with the sampling carrier is provided with an adhesive part.

In some examples of the present invention, the information collection device further includes a communication input end and a communication output end, and both the communication input end and the communication output end are electrically connected to the circuit board.

Compared with the prior art, the information collection device of the present invention has the following advantages:

According to the information collecting device of the present invention, when there are multiple sampling carriers, by disposing the information collecting devices on the multiple sampling carriers respectively, and connecting the multiple information collecting devices in series in sequence, compared with the prior art, the information collecting device Accurate temperature measurement of the sampling carrier can be achieved, and multiple information collection devices can simultaneously collect the temperature of multiple sampling carriers, thereby increasing the detection range of the information collection device. At the same time, by increasing or reducing the number of information collection devices, The number of information collection devices can be adapted to the number of sampling carriers, and the information collection devices can be used in conjunction with different types of sampling carriers, thereby improving the versatility of the information collection device, thereby reducing the production cost and design cost of the information collection device.

Another object of the present invention is to provide a battery module.

In order to achieve the above object, the technical scheme of the present invention is achieved in this way:

A battery module includes: a plurality of battery cells; an information collection device, wherein the information collection device is the above-mentioned information collection device, and the information collection device is assembled with the battery cells.

The advantages of the battery module and the above-mentioned information collection device compared to the prior art are the same, and are not repeated here.

Description of drawings

The accompanying drawings constituting a part of the present invention are used to provide further understanding of the present invention, and the exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the attached image:

1 is a schematic diagram of an information collection device according to an embodiment of the present invention;

2 is a schematic diagram of a communication input terminal according to an embodiment of the present invention;

3 is a schematic diagram of a communication output terminal according to an embodiment of the present invention;

4 is a schematic diagram of a plurality of information collection devices according to an embodiment of the present invention being sequentially connected in series through electrical connecting lines;

FIG. 5 is a schematic diagram of the first embodiment of the sampling circuit according to the embodiment of the present invention;

6 is a schematic diagram of a plurality of sampling circuits of the first embodiment connected in series according to an embodiment of the present invention;

7 is a schematic diagram of a plurality of sampling circuits of the second embodiment connected in series according to an embodiment of the present invention;

8 is a schematic diagram of two information collection devices connected by an electrical connection line according to an embodiment of the present invention;

FIG. 9 is a schematic diagram of a battery module according to an embodiment of the present invention.

Description of reference numbers:

battery module 1000;

Information collection device 100; battery cell 200; electrical connection line 300; noise reduction component 400;

circuit board 10; mounting hole 101;

Collection chip 20 ; voltage collection part 30 ; communication input end 40 ; communication output end 50 .

Detailed ways

It should be noted that the embodiments of the present invention and the features of the embodiments may be combined with each other under the condition of no conflict.

The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

As shown in FIGS. 1-9 , the information collection device 100 according to the embodiment of the present invention includes: a circuit board 10 and a collection chip 20 . The surface of the circuit board 10 can be etched with circuits. In some specific embodiments, the circuit board 10 can be a printed circuit board 10, but the invention is not limited thereto. For example, the circuit board 10 can also be a flexible circuit board. Preferably, the circuit board 10 can be configured as a flexible circuit board, and the flexible circuit board has higher plasticity, which can facilitate the installation of the information collection device 100 in the battery module 1000 .

In addition, the acquisition chip 20 is electrically connected to the circuit board 10 . Specifically, the acquisition chip 20 has a plurality of pins, and the circuit board 10 may be correspondingly provided with a plurality of soldering points, and the plurality of soldering points are all connected to the circuit on the surface of the circuit board 10 . . The plurality of pins of the acquisition chip 20 can be respectively welded and connected to the corresponding welding points, so that the circuit board 10 and the acquisition chip 20 can be connected together, and the acquisition chip 20 can be connected to the circuit on the surface of the circuit board 10 through the welding points. Further, the technical effect of the electrical connection between the acquisition chip 20 and the circuit board 10 can be achieved.

Meanwhile, the collection chip 20 is adapted to be in contact with the sampling carrier and used to collect the temperature of the sampling carrier. A temperature sensor can be integrated in the acquisition chip 20. By contacting the acquisition chip 20 with the sampling carrier, the temperature sensor can convert the temperature of the sampling carrier into an electrical signal, and the acquisition chip 20 can obtain the temperature of the sampling carrier according to the electrical signal sent by the temperature sensor. It should be noted that, in some embodiments, the collection chip 20 may be in direct contact with the surface of the sampling carrier to collect the temperature of the sampling carrier, for example, the collection chip 20 may be attached to the surface of the sampling carrier. In other embodiments, the collection chip 20 may be in indirect contact with the surface of the sampling carrier to collect the temperature of the sampling carrier. For example, a heat-conducting medium may be provided between the collection chip 20 and the surface of the sampling carrier, and the heat-conducting medium may be located between the collection chip 20 and the surface of the sampling carrier. Heat is transferred with the sampling carrier, and the collection chip 20 can acquire the temperature of the sampling carrier according to the temperature of the heat conducting medium.

Further, the circuit board 10 may also be provided with a plurality of component connection positions, and the plurality of component connection positions are all connected to circuits on the surface of the circuit board 10 . The component connection position can install electronic components, and the electronic components can include but are not limited to: resistors, capacitors, etc., through the cooperation of the acquisition chip 20, the circuit board 10 and the electronic components, the surface of the circuit board 10 can form a sampling circuit, such as the circuit board 10, The electronic components and the collection chip 20 cooperate to form the sampling circuit shown in FIG. 5 . By setting the sampling circuit on the information collection device 100 , the information collection device 100 can collect the temperature of the sampling carrier according to the sampling requirements.

Further, when there are multiple sampling carriers, the information collection device 100 may be provided with a plurality of corresponding ones, and the multiple information collection devices 100 are respectively used to detect the temperature of the corresponding sampling carrier, thereby realizing the modular design of the information collection device 100 . , the designer can set a corresponding number of information collection devices 100 according to the number of sampling carriers. When the designer sets the information collection device 100 to collect the temperature of the sampling carrier, the designer does not need to select different models according to the number and arrangement of the sampling carriers. The sampling carrier is additionally designed with an information collection device 100.

In addition, a plurality of information collection devices 100 can be connected in communication, preferably, a plurality of information collection devices 100 can be connected in series in sequence, and FIG. 7 shows two information collection devices 100 connected in series in some specific embodiments of the present invention after the sampling circuit. Further, the multiple information collection devices 100 can be electrically connected to the analysis device after being connected in series, and the analysis device can analyze the temperature data collected by the multiple information collection devices 100 at the same time, so as to determine whether the temperature of the sampling carrier is abnormal.

Therefore, when there are a plurality of sampling carriers, by disposing the information collection devices 100 on the plurality of sampling carriers respectively, and connecting the plurality of information collection devices 100 in series for communication in sequence, compared with the prior art, it is possible to collect a plurality of samples at the same time. Based on the temperature of the sampling carrier, the information collection device 100 has higher versatility, and can also reduce the design cost of the information collection device 100, thereby reducing the cost of arranging the information collection device 100 on the sampling carrier.

In some embodiments of the present invention, the collection chip 20 has a temperature collection area, and the temperature collection area is adapted to be in contact with the sampling carrier. The temperature collection area can be arranged on the side of the collection chip 20 facing the sampling carrier, and the temperature sensor can be integrated in the temperature collection area. By contacting the temperature collection area with the sampling carrier, the heat generated by the sampling carrier can be transferred to the temperature collection area. After the heat of the sampling carrier is transferred to the temperature collection area, the temperature sensor can generate a temperature signal, and the collection chip 20 can collect the temperature of the sampling carrier after receiving the temperature signal from the temperature sensor.

It should be noted that, in some embodiments of the present invention, without considering the production cost of the information collection device 100 , the temperature sensor can be separately installed on the circuit board 10 , and when the collection chip 20 is installed on the circuit board 10 , The temperature sensor and the collection chip 20 can be connected in communication. At this time, the temperature collection area can be located on the circuit board 10. By contacting the circuit board 10 with the sampling carrier, the collection chip 20 can collect samples through the temperature sensor disposed on the circuit board 10. carrier temperature.

In some embodiments of the present invention, as shown in FIG. 1 , the circuit board 10 may be provided with a mounting hole 101 , and the acquisition chip 20 may be mounted in the mounting hole 101 . The mounting hole 101 may penetrate through the circuit board 10 in the thickness direction of the circuit board 10 , and when the collecting chip 20 is mounted on the circuit board 10 , the temperature collecting area may be disposed opposite to the mounting hole 101 . When the collection chip 20 is adapted to be in direct contact with the sampling carrier, the temperature collection area can pass through the mounting hole 101 and then contact the sampling carrier, so that the collection chip 20 can collect the temperature of the sampling carrier.

When the collection chip 20 is suitable for indirect contact with the sampling carrier, the mounting hole 101 can be filled with a thermally conductive medium, which can be air or a substance with strong thermal conductivity, or a thermally conductive structure such as a heat pipe. When the heat-conducting medium is filled in the mounting hole 101, the heat-conducting medium can be in contact with the sampling carrier, and the heat-conducting medium can be in contact with the temperature collection area, and the heat on the surface of the sampling carrier can be conducted to the temperature collection area through the heat-conducting medium, so that the collection chip 20 can collect The temperature of the sampling carrier. Therefore, the mounting hole 101 can avoid the temperature collecting area or the heat conducting medium, so that the collecting chip 20 can be in contact with the sampling carrier, thereby improving the accuracy of the data collected by the information collecting device 100 .

In some embodiments of the present invention, the side of the collection chip 20 for contacting with the sampling carrier may be provided with a thermally conductive layer. That is to say, the collection chip 20 and the sampling carrier may be in indirect contact, and the heat conducting medium between the collection chip 20 and the sampling carrier may be a heat conducting layer. The thermally conductive layer can be filled in the mounting holes 101, and it can also be understood that the mounting holes 101 can be used to avoid the thermally conductive layer, so as to ensure that the thermally conductive layer can be in contact with the acquisition chip 20, the thermally conductive layer and the sampling carrier, so that the thermally conductive layer can be in contact with the sampling carrier. The heat of the sampling carrier is conducted to the temperature collection area so that the collection chip 20 collects the temperature of the sampling carrier.

Further, the thermally conductive layer can be configured as a thermally conductive adhesive layer, that is, the thermally conductive layer can be made of thermally conductive adhesive material. The thermally conductive adhesive has good thermal conductivity, and the thermally conductive adhesive has a certain fluidity. between the carriers, and between the thermally conductive adhesive and the collection chip 20, and between the thermally conductive adhesive and the sampling carrier are closely attached, and the contact area between the thermally conductive adhesive and the collection chip 20 and between the thermally conductive adhesive and the sampling carrier is larger, and the sampling The heat generated by the carrier is easily conducted to the collection chip 20 through the thermally conductive adhesive, so that the collection chip 20 can quickly and accurately acquire the temperature of the sample carrier.

In some embodiments of the present invention, as shown in FIG. 1 , FIG. 4 , and FIG. 8 , the information collection apparatus 100 may further include: a voltage collection part 30 , and the voltage collection part 30 may be used for electrically connecting with the sampling carrier to collect the sampling carrier Voltage. Wherein, when the sampling carrier is an electrical device or a power storage device, by disposing the voltage collecting part 30 on the information collecting device 100, the information collecting device 100 can collect the voltage of the sampling carrier, thereby increasing the functionality of the information collecting device 100 . It should be noted that the voltage collection part 30 may be connected to the current input terminal or the current output terminal of the electrical equipment, or the voltage collection part 30 may be connected to the current input terminal or the current output terminal of the power storage equipment.

In addition, the voltage collection part 30 can be electrically connected to the circuit board 10 . Specifically, the voltage collection part 30 can be electrically connected to the circuit on the circuit board 10 , and then the voltage collection part 30 can be connected to the collection chip mounted on the circuit board 10 . 20 is electrically connected, through the cooperation of the acquisition chip 20, the circuit board 10 and the electronic components, after the voltage acquisition part 30 collects the voltage of the sampling carrier, the acquisition chip 20 can generate the voltage signal of the sampling carrier, and the sampling circuit can send the collected voltage signal to the The analysis device can analyze whether the voltage of the sampling carrier is abnormal according to the voltage signal.

In addition, when the acquisition chip 20, the circuit board 10 and the electronic components cooperate to form the circuit shown in FIG. 5, the information acquisition device 100 can also be used to calculate the internal resistance of the sampling carrier, and the information acquisition device 100 can generate the internal resistance of the sampling carrier. After receiving the internal resistance signal of the sampling carrier, the analysis device can judge the aging condition of the sampling carrier according to the internal resistance of the sampling carrier.

Further, when the acquisition chip 20, the circuit board 10 and the electronic components cooperate to form a circuit as shown in FIG. 5, the information information acquisition device 100 can also be used to equalize the voltage of the sampling carrier, so as to ensure that the voltage of the sampling carrier is kept at a suitable level. within the working voltage range, which can effectively prolong the service life of the sampling carrier.

In some embodiments of the present invention, the voltage collection part 30 may be configured as a metal sheet, wherein the metal has good electrical conductivity, and the resistance of the metal sheet is relatively low. Using the metal sheet to collect the voltage of the sampling carrier can improve the information collection device 100 sampling accuracy. Specifically, the voltage collection part 30 can be configured as an aluminum sheet, a nickel sheet or a copper sheet, etc. The voltage collection part 30 can be connected to the circuit board 10 by welding, and the voltage collection part 30 can be connected to the current input end or the current output end of the sampling carrier Solder connection, so as to ensure that the voltage collecting part 30 is reliably connected between the circuit board 10 and the sampling carrier. Of course, in other embodiments of the present invention, the voltage collection part 30 and the circuit board 10 and between the voltage collection part 30 and the sampling carrier can also be connected by fasteners, and the fasteners can be bolts, etc. Likewise, it can be ensured that the voltage collecting part 30 is reliably connected between the circuit board 10 and the sampling carrier.

In some embodiments of the present invention, the side of the circuit board 10 for contacting the sampling carrier may be provided with an adhesive portion, that is, the side of the circuit board 10 away from the collection chip 20 may be provided with an adhesive portion, wherein , the surface of the bonding portion is flat, and the bonding portion is adapted to the surface shape of the sampling carrier, and the bonding portion can be bonded and matched with the surface of the sampling carrier. One side of the surface adhesive can be bonded with the circuit board 10, and the other side of the double-sided tape can be bonded with the sampling carrier, so that the information collection device 100 can be reliably installed on the sampling carrier.

However, the present invention is not limited to this, for example, in other embodiments, the adhesive part can be replaced with glue, by applying glue on the side of the circuit board 10 for contacting with the sampling carrier, and attaching the circuit board 10 to the sampling carrier The carrier press-fit can achieve the technical effect that the information collection device 100 is reliably installed on the sampling carrier. Of course, in some other embodiments, the adhesive part can also be replaced with a welding part, and the circuit board 10 can be mounted on the sampling carrier by means of welding.

In some embodiments of the present invention, as shown in FIGS. 1-3 and 8 , the information collection device 100 may further include a communication input end 40 and a communication output end 50, and both the communication input end 40 and the communication output end 50 are connected to the line The board 10 is electrically connected. Wherein, both the communication input end 40 and the communication output end 50 may include a plurality of electrical connection bits, each of which is electrically connected to one of the circuits in the circuit board 10 . And the number of electrical connection bits of the communication input end 40 is the same as the number of electrical connection bits of the communication output end 50 , for example, in the embodiment shown in FIG. The number of bits are all set to five.

Further, the electrical connection line 300 can be connected between the communication output end 50 of the nth information collection device 100 and the communication input end 40 of the n+1th information collection device 100. It should be noted that n is greater than 0. Integer. By using a plurality of electrical connection wires 300 to connect the plurality of information collection devices 100 in sequence, the technical effect of sequentially connecting the plurality of information collection devices 100 in series can be achieved. The electrical connection wires 300 can connect the sampling circuits of the plurality of information collection devices 100 in series. , so that the sampling circuits of the plurality of information collection devices 100 can transmit the sampled voltage signals, temperature signals, internal resistance signals, etc. to the analysis device through the series circuit.

Further, in some embodiments, the communication input end 40 and the electrical connection wire 300 can be connected together through a plug port and a plug terminal, and the communication output end 50 and the electrical connection wire 300 can be connected through a plug port It is connected with the plug terminal, that is, the communication input end 40 and the electrical connection wire 300, and the communication output end 50 and the electrical connection wire 300 are plugged and matched. In other embodiments, as shown in FIG. 8, the communication A welding portion may be provided between the input end 40 and the electrical connection line 300, and a welding portion may be provided between the communication output end 50 and the electrical connection line 300, and between the communication input end 40 and the electrical connection line 300, the communication output end 50 The connection with the electrical connection line 300 can be soldered. In this way, the connection between the communication input end 40 and the electrical connection line 300 and between the communication output end 50 and the electrical connection line 300 can be reliably connected.

Further, when a plurality of cells 200 are connected in series, the arrangement direction between any two adjacent cells 200 is opposite. When two adjacent information collection devices 100 are arranged in a staggered manner, by making the information collection devices 100 arranged on one side of the battery module 1000 adopt the A-type structure, the information collection devices 100 arranged on the other side of the battery module 1000 are all The B-type structure is adopted, and the A-type structure and the B-type structure are mirror images of each other. When the electrical connection line 300 is connected between the two information collection devices 100 , this arrangement can avoid crossover between multiple electrical connection lines 300 . , so that the signal interference between the electrical connection lines 300 can be reduced, and the sampling quality of the information collection device 100 can be improved.

According to some specific embodiments of the present invention, the length dimension of the circuit board 10 is set as L, which satisfies the relational formula: 10mm≤L≤30mm, and the width dimension of the circuit board 10 is set as W, which satisfies the relational formula: 10mm≤W≤30mm For example, as shown in the information collection device 100 shown in FIG. 8 , the length dimension of the information collection device 100 is 19.6 mm, and the width dimension of the information collection device 100 is 17.94 mm. By setting the length dimension of the circuit board 10 to 10mm˜30mm, and setting the width dimension of the circuit board 10 to 10mm˜30mm, while ensuring that the circuits etched in the circuit board 10 do not interfere with each other, the circuit board 10 can be effectively reduced in size. Therefore, the space occupied by the information collecting device 100 on the sampling carrier can be reduced, and the information collecting device 100 can be more easily arranged on the sampling carrier.

According to some specific embodiments of the present invention, a noise reduction component 400 such as a transformer may be provided between the first information collection device 100 and the analysis device and/or between the last information collection device 100 and the analysis device, and the noise reduction component 400 may The noise signal between the information collecting device 100 and the analyzing device is reduced, so that the data received by the analyzing device can be prevented from being abnormal due to the large deviation between the data received by the analyzing device and the actual data.

The battery module 1000 according to the embodiment of the present invention includes: a plurality of battery cells 200 and an information collection device 100 . The plurality of battery cells 200 may be arranged in sequence, and the battery cells 200 may be electrically connected through a bus bar. The information collection device 100 may be the information collection device 100 of the above-mentioned embodiment, that is, the battery cell 200 may be used as a sampling carrier, the information collection device 100 may collect the temperature and voltage of the battery cell 200, and the battery module 1000 may also include a BMS ( Battery Management System-battery management system), the analysis device in the above embodiment may be the BMS of the battery module 1000, after the temperature data and voltage data of the battery cells 200 collected by the information collection device 100 are transmitted to the BMS, the BMS can The temperature data and voltage data are analyzed to determine whether the temperature and voltage of the battery cell 200 are abnormal, thereby reducing the probability of overheating damage and overvoltage damage to the battery module 1000 .

In addition, when the acquisition chip 20 , the circuit board 10 and the electronic components cooperate to form the sampling circuit as shown in FIG. 5 , the BMS can also calculate the internal resistance of the cell 200 through the sampling circuit. Further, when the BMS analyzes the voltage of the cell 200 When abnormal, the BMS can also balance the voltage of the cell 200 through the sampling circuit of the information collection device 100 corresponding to the abnormal cell 200, so that the voltage of the cell 200 can be kept within a suitable working voltage range.

In addition, the information collection device 100 and the battery cell 200 are assembled together. Specifically, the circuit board 10 of the information collection device 100 may be provided with an adhesive part, and the adhesive part may be provided on a part of the circuit board 10 for contacting the sampling carrier. When the temperature of the battery cell 200 is the same or similar to the temperature of the battery cell 200, the bonding part can be bonded to the housing of the battery cell 200, that is, the information collection device 100 can be bonded to the battery cell 200. On the shell of the cell 200 , the information collection device 100 can acquire the temperature of the cell 200 by collecting the temperature of the shell of the cell 200 . In some other specific embodiments, when the temperature of the bus bar of the battery cell 200 remains the same or similar to the temperature of the battery cell 200, the bonding part can be bonded and matched with the bus bar of the battery cell 200, and the information collection device 100 can pass Collect the bus bar temperature of the cell 200 to obtain the temperature of the cell 200 .

Further, when the shell of the battery cell 200 is composed of an insulating outer shell and a metal inner shell, the insulating outer shell may be provided with an escape hole, the information collection device 100 may be installed in the installation hole 101, and the information collection device 100 may be connected to the metal inner shell. The inner casing is in contact, so that the information collection device 100 can collect the temperature of the battery cell 200 more accurately.

Further, when there are multiple battery cells 200 , the information collection device 100 may be provided with a plurality of corresponding ones, and the multiple information collection devices 100 are respectively used to detect the temperature of the corresponding battery cell 200 , thereby realizing the modules of the information collection device 100 . The designer can set a corresponding number of information collection devices 100 according to the number of cells 200. When the designer sets the information collection device 100 to collect the temperature of the cells 200, the designer does not need to set the number and arrangement of the cells 200 according to the number and arrangement of the cells 200. The information collection device 100 is additionally designed according to the layout method.

In addition, a plurality of information collection devices 100 may be connected in communication. Preferably, a plurality of information collection devices 100 may be connected in series in sequence. FIG. 7 is a diagram of two information collection devices 100 connected in series in some embodiments of the present invention. sampling circuit. Further, the multiple information collection devices 100 can be electrically connected to the BMS after being connected in series, and the BMS can analyze the temperature data collected by the multiple information collection devices 100 at the same time, so as to determine the temperature of the battery module 1000 and the temperature of each battery module 1000. Whether the temperature of each battery cell 200 is abnormal.

Further, when the circuit material etched on the circuit board 10 is copper material and the busbar material between the battery cells 200 is aluminum material, the voltage collecting part 30 can be configured as a nickel sheet, that is, the voltage collecting part 30 It can be made of nickel material, wherein the chemical properties of the nickel material are between the aluminum material and the copper material, and the electrical conductivity of the nickel sheet is better. Under the condition that the voltage collection part 30 can accurately collect the voltage of the battery cell 200, electrochemical corrosion is not easy to occur between the nickel sheet and the copper circuit, and between the nickel sheet and the aluminum busbar, so that the voltage collection part 30 can be effectively extended. service life.

According to the sampling circuit of the embodiment of the present invention, the sampling circuit includes a plurality of sub-sampling circuits, and the sampling circuit is provided with a collection chip 20. By cooperating with the plurality of sub-sampling circuits, the sampling circuit can have multiple functions. Specifically, the collection chip 20 may include a plurality of pins. In the embodiment shown in FIG. 5 , the collection chip 20 may include 20 pins, and the 20 pins of the collection chip 20 may be respectively connected with the internal pins of the collection chip 20 . circuit electrical connection. In the width direction of the acquisition chip 20, 10 pins may be provided on both sides of the acquisition chip 20 respectively, and the 10 pins may be spaced in sequence along the length direction of the acquisition chip 20.

Among them, in the sampling circuit, the first pin, the twentieth pin, the eleventh pin, and the twelfth pin can all be configured as VSS pins, and the first pin and the twentieth pin can pass through a sub-connector. The sampling circuit is connected, and the sub-sampling circuit connected with the first pin and the twentieth pin can be grounded, and the eleventh pin can be connected with the twelfth pin through the sub-sampling circuit, and is connected with the first pin and the sub-sampling circuit of the twentieth pin can be set to ground, the designer can connect the sub-sampling circuit with the first pin and the twentieth pin, the sub-sampling circuit with the first pin and the twentieth pin The circuit debugs the acquisition chip, so that the acquisition chip can acquire the voltage and/or temperature of the cell according to the preset instruction.

Further, in the sampling circuit, the second pin can be configured as a VDR pin, the third pin can be configured as a VSW pin, the second pin can be connected with the third pin through a sub-sampling circuit, and the cell 200, A MOS tube can be arranged between the second pin and the third pin, the G pole of the MOS tube is connected to the third pin, the S pole of the MOS tube is grounded, and the D pole of the MOS tube is connected to the third pin, and the MOS tube is connected to the third pin. The D pole of the tube is also connected to the resistor, and the other end of the resistor is connected to the sixteenth pin and the seventeenth pin. Through the cooperation of the second pin, the third pin and the MOS tube, the sampling circuit can have different gain effects. The internal resistance of the cell 200 is measured.

Further, in the sampling circuit, the fourth pin can be configured as a VCLg pin, the fifth pin can be configured as a VCLm pin, the sixteenth pin can be configured as a VCHm pin, and the seventeenth pin can be configured as The VCHg pin, the fourth pin and the fifth pin can be grounded, and the sixteenth pin and the seventeenth pin can also be connected to the positive pole of the battery cell 200 through the fifth pin and the sixteenth pin In cooperation, the sampling circuit can detect the voltage of the battery cell 200, and through the cooperation of the fourth pin and the seventeenth pin, the sub-sampling circuit connected with the fourth pin and the seventeenth pin can assist in detecting the voltage of the battery cell 200. Therefore, the collecting chip 20 can check the collected voltage of the battery cell 200, thereby further improving the sampling accuracy of the information collecting device 100.

Further, as shown in FIG. 5 , the sixth pin can be configured as a VSS pin, the fifteenth pin can be configured as a VBAT pin, the sixth pin can be connected with the negative pole of the battery cell 200, and the fifteenth pin can be configured as a VBAT pin. The pin can be connected with the positive pole of the battery cell 200, and through the cooperation of the sixth pin and the fifteenth pin, the sub-sampling circuit connected with the sixth pin and the fifteenth pin can supply power to the acquisition chip 20, which can ensure The acquisition chip 20 works normally.

Further, the seventh pin can be configured as a DIOBOTp/MOSI pin, the eighth pin can be configured as a DIOBOTn/SCK pin, the fourteenth pin can be configured as a DIOTOPp pin, and the thirteenth pin can be configured as a DIOTOPn pin As shown in FIG. 5 , the seventh pin can be connected with the fourteenth pin of the acquisition chip 20 in the upstream information acquisition device 100 , and the eighth pin can be connected with the acquisition chip 20 in the upstream information acquisition device 100 . The thirteenth pin is connected.

Correspondingly, the fourteenth pin can be connected with the seventh pin of the acquisition chip 20 in the downstream information acquisition device 100 , and the thirteenth pin can be connected with the eighth pin of the acquisition chip 20 in the downstream information acquisition device 100 . , through the seventh pin, the eighth pin, the thirteenth pin, and the fourteenth pin are respectively matched with the pins corresponding to the acquisition chip 20 in the adjacent information acquisition device 100, any two adjacent information acquisition The devices 100 can perform signal transmission through the sub-sampling circuit connected with the seventh pin and the fourteenth pin, and the sub-sampling circuit connected with the eighth pin and the thirteenth pin, so that a plurality of information collection can be performed. The device 100 transmits the collected temperature data and/or voltage data to the analysis device step by step along the serial path of the plurality of information collection devices 100 .

Further, as shown in FIG. 5, the ninth pin can be configured as the SPI_en pin, the ninth pin can be connected with the seventh pin, and the ninth pin can be connected with the eighth pin, and the ninth pin can be connected with the eighth pin. Diodes can be arranged between the pin and the seventh pin, and between the ninth pin and the eighth pin. The diode can protect the corresponding sub-sampling circuit, thereby preventing the corresponding sub-sampling circuit from overloading under high power conditions. damage. At the same time, when the information acquisition device 100 is connected to the analysis device, the ninth pin can be connected to a high level, and the working mode of the SPI can be adjusted. When the information collection device 100 is arranged between two information collection devices 100, the ninth pin can be set to ground.

Further, as shown in FIG. 5 , the tenth pin may be configured as a MISO pin, and the tenth pin may be set in the air. That is, the tenth pin is not connected with the sampling circuit. Further, the eighteenth pin can be configured as a VHP pin, the eighteenth pin can be connected to the positive pole of the battery core 200, and a capacitor can be connected between the eighteenth pin and the positive pole of the battery core 200, When the acquisition chip 20 detects the internal resistance of the cell 200 in the high gain mode, the eighteenth pin can filter the internal resistance signal, thereby improving the sampling accuracy of the acquisition chip 20 for the internal resistance of the cell.

Further, the thirteenth pin and the fourteenth pin can also be connected to a diode and then grounded, and the diode can be used to protect the corresponding sub-sampling circuit, thereby preventing the corresponding sub-sampling circuit from being overloaded and damaged under high power conditions. Further, the nineteenth pin can be configured as a VBAT_FIL pin, the nineteenth pin can be connected to the capacitor and then grounded, and the sub-sampling circuit connected with the nineteenth pin can be used to filter the power supply of the acquisition chip 20, thereby The working stability of the acquisition chip 20 can be improved.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the present invention. within the scope of protection.

Claims (10)

1. an information collection device, is characterized in that, comprises: circuit board (10); A collection chip (20), the collection chip (20) is electrically connected to the circuit board (10), and the collection chip (20) is adapted to be in contact with a sampling carrier and used for collecting the temperature of the sampling carrier. 2 . The information collection device according to claim 1 , wherein the collection chip ( 20 ) has a temperature collection area, and the temperature collection area is adapted to be in contact with the sampling carrier. 3 . 3 . The information collection device according to claim 1 , wherein the circuit board ( 10 ) is provided with a mounting hole ( 101 ), and the collecting chip ( 20 ) is mounted in the mounting hole ( 101 ). 4 . 4. The information collection device according to any one of claims 1-3, characterized in that, a heat conduction layer is provided on the side of the collection chip (20) that is used for contacting with the sampling carrier. 5 . The information collection device according to claim 4 , wherein the thermally conductive layer is configured as a thermally conductive adhesive layer. 6 . 6 . The information collection device according to claim 1 , further comprising: a voltage collection part (30), the voltage collection part (30) is electrically connected to the circuit board (10), and the voltage collection part (30) is electrically connected to the circuit board (10). The part (30) is used for electrically connecting with the sampling carrier to collect the voltage of the sampling carrier. 7. The information collection device according to claim 6, characterized in that, the voltage collection part (30) is configured as a metal sheet. 8 . The information collection device according to claim 1 , characterized in that, an adhesive portion is provided on the side of the circuit board ( 10 ) that is used for contacting with the sampling carrier. 9 . 9. The information collection device according to claim 1, characterized in that, further comprising a communication input end (40) and a communication output end (50), the communication input end (40) and the communication output end (50) All are electrically connected to the circuit board (10). 10. A battery module, comprising: a plurality of cells (200); An information collection device (100), wherein the information collection device (100) is the information collection device according to any one of claims 1-9, the information collection device (100) cooperates with the battery cell (200) assembly.

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